ES2104200T3 - Suspension de material de soldadura para la aplicacion de delgadas capas del material de soldadura sobre substratos. - Google Patents
Suspension de material de soldadura para la aplicacion de delgadas capas del material de soldadura sobre substratos.Info
- Publication number
- ES2104200T3 ES2104200T3 ES94102130T ES94102130T ES2104200T3 ES 2104200 T3 ES2104200 T3 ES 2104200T3 ES 94102130 T ES94102130 T ES 94102130T ES 94102130 T ES94102130 T ES 94102130T ES 2104200 T3 ES2104200 T3 ES 2104200T3
- Authority
- ES
- Spain
- Prior art keywords
- welding material
- substrates
- suspension
- particle size
- application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Coating With Molten Metal (AREA)
- Paints Or Removers (AREA)
- Chemically Coating (AREA)
- Molten Solder (AREA)
- Powder Metallurgy (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
SE DESARROLLA UNA SUSPENSION DE SOLDADURA COMPUESTA DE UN POLVO DE SOLDADURA, AGLOMERANTE ORGANICO, DISOLVENTE ORGANICO Y EVENTUALMENTE FUNDENTE, CON LA CUAL PUEDEN APLICARSE CAPAS DE SOLDADURA LIBRES DE FISURA Y DE POROS SOBRE PLACAS DE ASIENTO MEDIANTE INMERSION O INYECCION. EL POLVO DE SOLDADURA DEBE TENER UN TAMAÑO DE PARTICULA DESDE 5 HASTA 50 MICRAS, CON LO CUAL DESDE EL 55 HASTA EL 70 % DE LAS PARTICULAS DEBEN SER DE UN TAMAÑO MENOR QUE EL TAMAÑO DE PARTICULAS EN EL MAXIMO DE LA CURVA DE DISTRIBUCION DEL TAMAÑO DE PARTICULA. ADEMAS LA RELACION ENTRE EL TAMAÑO DE PARTICULAS MEDIO DEL POLVO DE SOLDADURA Y LA DENSIDAD DEL POLVO DE SOLDADURA DEBE ENCONTRARSE ENTRE 0,1 Y 20.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4315475A DE4315475A1 (de) | 1993-05-10 | 1993-05-10 | Lotsuspension zum Aufbringen dünner Lotschichten auf Unterlagen |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2104200T3 true ES2104200T3 (es) | 1997-10-01 |
Family
ID=6487661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES94102130T Expired - Lifetime ES2104200T3 (es) | 1993-05-10 | 1994-02-11 | Suspension de material de soldadura para la aplicacion de delgadas capas del material de soldadura sobre substratos. |
Country Status (9)
Country | Link |
---|---|
US (1) | US5431745A (es) |
EP (1) | EP0625402B1 (es) |
JP (1) | JPH06315793A (es) |
AT (1) | ATE153894T1 (es) |
CZ (1) | CZ96894A3 (es) |
DE (2) | DE4315475A1 (es) |
DK (1) | DK0625402T3 (es) |
ES (1) | ES2104200T3 (es) |
GR (1) | GR3024288T3 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5888269A (en) * | 1993-10-05 | 1999-03-30 | Toyota Jidosha Kabushiki Kaisha | Nitriding agent |
DE19711562C2 (de) * | 1997-03-20 | 2002-08-01 | Federal Mogul Sealing Sys Spa | Lotpaste zur Erzeugung konturengenauer Strukturen, Verwendung der Lotpaste und Verfahren zur Herstellung konturengenauer geometrischer Metallstrukturen |
US6110808A (en) * | 1998-12-04 | 2000-08-29 | Trw Inc. | Hydrogen getter for integrated microelectronic assembly |
DE19859734A1 (de) * | 1998-12-23 | 2000-07-06 | Erbsloeh Ag | Verfahren zur partiellen oder vollständigen Beschichtung der Oberflächen von Bauteilen aus Aluminium und seinen Legierungen mit Lot, Fluß- und Bindemittel zur Hartverlötung |
US6530514B2 (en) * | 2001-06-28 | 2003-03-11 | Outokumpu Oyj | Method of manufacturing heat transfer tubes |
JP4826630B2 (ja) * | 2006-04-26 | 2011-11-30 | 千住金属工業株式会社 | ソルダペースト |
US7569164B2 (en) * | 2007-01-29 | 2009-08-04 | Harima Chemicals, Inc. | Solder precoating method |
US10730150B2 (en) * | 2017-08-07 | 2020-08-04 | Honeywell International Inc. | Flowable brazing compositions and methods of brazing metal articles together using the same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3832242A (en) * | 1970-07-23 | 1974-08-27 | Scm Corp | Brazing and solder compositions comprising a chelating agent |
US3762965A (en) * | 1971-07-27 | 1973-10-02 | Du Pont | Solder compositions of improved active solder vehicles |
US3971501A (en) * | 1975-04-09 | 1976-07-27 | Alcan Research And Development Limited | Method of brazing aluminum |
US4218248A (en) * | 1978-04-21 | 1980-08-19 | Scm Corporation | Process for the manufacture of metal joining paste |
US4273593A (en) * | 1979-06-25 | 1981-06-16 | Scm Corporation | Metal-joining paste and vehicle therefor |
US4231815A (en) * | 1979-08-09 | 1980-11-04 | Smc Corporation | Copper alloy brazing paste |
US4475959A (en) * | 1983-07-13 | 1984-10-09 | Gte Products Corporation | Non-aqueous brazing alloy paste |
US4509994A (en) * | 1984-09-04 | 1985-04-09 | Mcdonnell Douglas Corporation | Solder composition for high-density circuits |
US4661173A (en) * | 1986-07-25 | 1987-04-28 | Mcdonnell Douglas Corporation | Alloy-enriched solder cream |
US4981526A (en) * | 1988-11-29 | 1991-01-01 | Mitsubishi Aluminum Co., Ltd. | Composition for brazing aluminum or aluminum alloy and an aluminum or aluminum alloy product |
JPH04333390A (ja) * | 1991-05-07 | 1992-11-20 | Nippon Genma:Kk | アルミニウムろうペースト |
DE4131871C1 (es) * | 1991-06-13 | 1992-05-27 | Degussa Ag, 6000 Frankfurt, De | |
US5328521A (en) * | 1993-03-08 | 1994-07-12 | E. I. Du Pont De Nemours And Company | Kinetic solder paste composition |
-
1993
- 1993-05-10 DE DE4315475A patent/DE4315475A1/de not_active Ceased
-
1994
- 1994-02-11 DE DE59402978T patent/DE59402978D1/de not_active Expired - Lifetime
- 1994-02-11 DK DK94102130.5T patent/DK0625402T3/da active
- 1994-02-11 EP EP94102130A patent/EP0625402B1/de not_active Expired - Lifetime
- 1994-02-11 ES ES94102130T patent/ES2104200T3/es not_active Expired - Lifetime
- 1994-02-11 AT AT94102130T patent/ATE153894T1/de not_active IP Right Cessation
- 1994-04-11 US US08/226,048 patent/US5431745A/en not_active Expired - Lifetime
- 1994-04-21 CZ CZ94968A patent/CZ96894A3/cs unknown
- 1994-05-10 JP JP6096333A patent/JPH06315793A/ja active Pending
-
1997
- 1997-07-30 GR GR970401937T patent/GR3024288T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
DK0625402T3 (da) | 1997-12-22 |
EP0625402A1 (de) | 1994-11-23 |
JPH06315793A (ja) | 1994-11-15 |
EP0625402B1 (de) | 1997-06-04 |
DE59402978D1 (de) | 1997-07-10 |
ATE153894T1 (de) | 1997-06-15 |
US5431745A (en) | 1995-07-11 |
GR3024288T3 (en) | 1997-10-31 |
CZ96894A3 (en) | 1994-11-16 |
DE4315475A1 (de) | 1994-11-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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