ES2050157T3 - Medio de interconexion electrica compuesto. - Google Patents

Medio de interconexion electrica compuesto.

Info

Publication number
ES2050157T3
ES2050157T3 ES88306687T ES88306687T ES2050157T3 ES 2050157 T3 ES2050157 T3 ES 2050157T3 ES 88306687 T ES88306687 T ES 88306687T ES 88306687 T ES88306687 T ES 88306687T ES 2050157 T3 ES2050157 T3 ES 2050157T3
Authority
ES
Spain
Prior art keywords
particles
medium
electrical interconnection
columns
network
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES88306687T
Other languages
English (en)
Inventor
Sungho Jin
William Roger Lambert
Robert Clark Moore
John Joseph Mottine Jr
Richard Curry Sherwood
Thomas Henry Tiefel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of ES2050157T3 publication Critical patent/ES2050157T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/90—Magnetic feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

MEDIO DE CONEXION ELECTRICA FORMADO COMO UN COMPUESTO DE PARTICULAS (11) MAGNETICAS ELECTRICAMENTE CONDUCTORAS EN UN MATERIAL MATRIZ NO CONDUCTOR (12). LAS PARTICULAS SE ALINEAN MAGNETICAMENTE EN UNA RED QUE SE EXTIENDE AL MENOS EN TRES DIMENSIONES, COMO, POR EJEMPLO, EN UNA LAMINA O CAPA. LA CAPA PUEDE INCLUIR ADEMAS PARTICULAS ADICIONALES CONDUCTORAS MAYORES (21) QUE SE ALINEAN MAGNETICAMENTE EN COLUMNAS, EXTENDIENDO EL GROSOR DEL MEDIO. EN ESTE CASO, EL MEDIO SIRVE COMO MEDIO CONDUCTOR ANISOTROPICAMENTE EN LA DIRECCION DE LAS COLUMNAS, AYUDANDO A LA DISIPACION DE LAS CARGAS ELECTROSTATICAS LA LIGERA CONDUCTIVIDAD PLANAR DE LA RED.
ES88306687T 1987-07-30 1988-07-21 Medio de interconexion electrica compuesto. Expired - Lifetime ES2050157T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/079,374 US4923739A (en) 1987-07-30 1987-07-30 Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method

Publications (1)

Publication Number Publication Date
ES2050157T3 true ES2050157T3 (es) 1994-05-16

Family

ID=22150138

Family Applications (1)

Application Number Title Priority Date Filing Date
ES88306687T Expired - Lifetime ES2050157T3 (es) 1987-07-30 1988-07-21 Medio de interconexion electrica compuesto.

Country Status (7)

Country Link
US (1) US4923739A (es)
EP (1) EP0302631B1 (es)
JP (1) JPS6443986A (es)
KR (1) KR920001721B1 (es)
CA (1) CA1307565C (es)
DE (1) DE3888595T2 (es)
ES (1) ES2050157T3 (es)

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US5186662A (en) * 1990-05-30 1993-02-16 Amp Incorporated Double locking-type electrical connector
US5624741A (en) * 1990-05-31 1997-04-29 E. I. Du Pont De Nemours And Company Interconnect structure having electrical conduction paths formable therein
US5203722A (en) * 1990-09-28 1993-04-20 Amp Incorporated Double-lock electrical connector
JP2500134B2 (ja) * 1991-03-14 1996-05-29 矢崎総業株式会社 電気コネクタ
US5171937A (en) * 1991-07-22 1992-12-15 Champlain Cable Corporation Metal-coated shielding materials and articles fabricated therefrom
US5221417A (en) * 1992-02-20 1993-06-22 At&T Bell Laboratories Conductive adhesive film techniques
JP2574771Y2 (ja) * 1992-10-07 1998-06-18 住友電装株式会社 コネクタ
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
JP2915816B2 (ja) * 1995-01-12 1999-07-05 日本碍子株式会社 導通補助材及びそれを用いたコネクタ
US6537498B1 (en) 1995-03-27 2003-03-25 California Institute Of Technology Colloidal particles used in sensing arrays
US5571401A (en) * 1995-03-27 1996-11-05 California Institute Of Technology Sensor arrays for detecting analytes in fluids
JP3347554B2 (ja) * 1995-09-27 2002-11-20 日本圧着端子製造株式会社 ジャンパコネクタ
US5843567A (en) * 1997-06-03 1998-12-01 Xerox Corporation Electrical component containing magnetic particles
US6011307A (en) * 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
US6174449B1 (en) 1998-05-14 2001-01-16 Micron Technology, Inc. Magnetically patterned etch mask
US7955561B2 (en) 1998-06-09 2011-06-07 The California Institute Of Technology Colloidal particles used in sensing array
EP1084390A4 (en) * 1998-06-09 2005-07-27 California Inst Of Techn COLLOIDAL PARTICLES USED IN A SENSOR MOSAIC
US6277740B1 (en) 1998-08-14 2001-08-21 Avery N. Goldstein Integrated circuit trenched features and method of producing same
US6780765B2 (en) 1998-08-14 2004-08-24 Avery N. Goldstein Integrated circuit trenched features and method of producing same
US8394330B1 (en) 1998-10-02 2013-03-12 The California Institute Of Technology Conductive organic sensors, arrays and methods of use
WO2000033062A1 (en) * 1998-12-01 2000-06-08 Cyrano Sciences, Inc. Aligned particle based sensor elements
US7113069B1 (en) 1999-11-30 2006-09-26 Smiths Detection Inc. Aligned particle based sensor elements
US6351392B1 (en) * 1999-10-05 2002-02-26 Ironwood Electronics, Inc, Offset array adapter
US6394820B1 (en) 1999-10-14 2002-05-28 Ironwood Electronics, Inc. Packaged device adapter assembly and mounting apparatus
US6533589B1 (en) 1999-10-14 2003-03-18 Ironwood Electronics, Inc. Packaged device adapter assembly
EP1315241A4 (en) 2000-08-09 2008-03-19 Jsr Corp ANISOTROPIC CONDUCTIVE FILM
US6773926B1 (en) 2000-09-25 2004-08-10 California Institute Of Technology Nanoparticle-based sensors for detecting analytes in fluids
CN1290120C (zh) * 2001-08-22 2006-12-13 住友电气工业株式会社 导电胶、导电薄膜、电镀方法和精细金属元件的制造方法
WO2003075409A1 (fr) * 2002-03-04 2003-09-12 Sumitomo Electric Industries, Ltd. Film conducteur anisotrope et procede de production
US6838195B2 (en) * 2002-06-28 2005-01-04 Seagate Technology Llc Increased packing density in self-organized magnetic tray
US7034677B2 (en) * 2002-07-19 2006-04-25 Smiths Detection Inc. Non-specific sensor array detectors
JP2004162096A (ja) * 2002-11-11 2004-06-10 Sumitomo Electric Ind Ltd 無電解めっき用ペーストと、これを用いた金属構造体および微細金属部品の製造方法
FR2847391A1 (fr) * 2002-11-20 2004-05-21 A M C Dispositif de contact pour ameliorer la duree de vie des connexions electriques
US6877993B2 (en) * 2003-05-30 2005-04-12 Ironwood Electronics, Inc. Packaged device adapter assembly with alignment structure and methods regarding same
US6955094B1 (en) 2003-07-18 2005-10-18 Cleveland Medical Devices Inc. Sensor for measuring shear forces
US6915701B1 (en) 2003-07-18 2005-07-12 Cleveland Medical Devices Inc. Composite material for a sensor for measuring shear forces
JP2005322492A (ja) * 2004-05-07 2005-11-17 Polymatech Co Ltd 導電弾性体及びその製造方法
KR100608533B1 (ko) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
JP4947687B2 (ja) * 2006-01-19 2012-06-06 三井金属鉱業株式会社 異方導電性ゴム用導電性粉末
JP5620110B2 (ja) * 2007-02-06 2014-11-05 ワールド プラパティーズ、インコーポレイテッドＷｏｒｌｄ Ｐｒｏｐｅｒｔｉｅｓ， Ｉｎｃ． 導電性ポリマー発泡体、その作製方法、およびその使用
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
JP5346700B2 (ja) * 2009-06-11 2013-11-20 亮 若桑 樹脂材料内に金属粒子立体網目構造を構築する方法及びその金属粒子立体網目構造が構築された樹脂成形品
KR20120125614A (ko) * 2009-12-29 2012-11-16 로저스코포레이션 전도성 중합체 발포체, 그의 제조 방법 및 용도
FR2962856B1 (fr) 2010-07-16 2012-08-17 Amc Holding Dispositif de connexion electrique a conductance amelioree
NO20120740A1 (no) * 2012-06-25 2013-12-26 Inst Energiteknik En metode for forming av et legeme med en partikkelstruktur fiksert i et matrisemateriale
FR2996348B1 (fr) 2012-10-03 2015-05-15 Amc Holding Poudre et pate pour ameliorer la conductance des connexions electriques
FR2997788B1 (fr) 2012-11-05 2016-01-22 Amc Etec Dispositif de sectionnement d'une ligne d'alimentation electrique a courant de haute intensite
US9048565B2 (en) 2013-06-12 2015-06-02 Ironwood Electronics, Inc. Adapter apparatus with deflectable element socket contacts
US9263817B2 (en) 2013-06-12 2016-02-16 Ironwood Electronics, Inc. Adapter apparatus with suspended conductive elastomer interconnect
EP2947662A1 (en) * 2014-05-21 2015-11-25 Condalign AS A method for arranging particles at an interface
US9889860B2 (en) 2015-12-15 2018-02-13 Universal City Studios Llc Multi-passenger ride vehicle
US9877404B1 (en) 2017-01-27 2018-01-23 Ironwood Electronics, Inc. Adapter apparatus with socket contacts held in openings by holding structures
KR20200017869A (ko) 2018-08-09 2020-02-19 쓰리엠 이노베이티브 프로퍼티즈 캄파니 도전성 접착 필름 및 이의 제조 방법

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US4546037A (en) * 1984-09-04 1985-10-08 Minnesota Mining And Manufacturing Company Flexible tape having stripes of electrically conductive particles for making multiple connections
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US4554033A (en) * 1984-10-04 1985-11-19 Amp Incorporated Method of forming an electrical interconnection means
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium

Also Published As

Publication number Publication date
KR920001721B1 (ko) 1992-02-24
CA1307565C (en) 1992-09-15
JPS6443986A (en) 1989-02-16
EP0302631A1 (en) 1989-02-08
EP0302631B1 (en) 1994-03-23
US4923739A (en) 1990-05-08
KR890002902A (ko) 1989-04-11
DE3888595D1 (de) 1994-04-28
DE3888595T2 (de) 1994-06-30
JPH0237066B2 (es) 1990-08-22

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