ES2008931A6 - Aparato y metodo de medicion de espesores de soldadura. - Google Patents
Aparato y metodo de medicion de espesores de soldadura.Info
- Publication number
- ES2008931A6 ES2008931A6 ES8703596A ES8703596A ES2008931A6 ES 2008931 A6 ES2008931 A6 ES 2008931A6 ES 8703596 A ES8703596 A ES 8703596A ES 8703596 A ES8703596 A ES 8703596A ES 2008931 A6 ES2008931 A6 ES 2008931A6
- Authority
- ES
- Spain
- Prior art keywords
- solder
- measurement method
- thickness measurement
- solder thickness
- taken
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 6
- 238000000691 measurement method Methods 0.000 title 1
- 238000005259 measurement Methods 0.000 abstract 3
- 239000000523 sample Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
- G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
- G01B5/066—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness of coating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/944,051 US4745684A (en) | 1986-12-17 | 1986-12-17 | Solder thickness measurement method and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2008931A6 true ES2008931A6 (es) | 1989-08-16 |
Family
ID=25480706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8703596A Expired ES2008931A6 (es) | 1986-12-17 | 1987-12-16 | Aparato y metodo de medicion de espesores de soldadura. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4745684A (enrdf_load_stackoverflow) |
JP (1) | JPH01501732A (enrdf_load_stackoverflow) |
DK (1) | DK458288A (enrdf_load_stackoverflow) |
ES (1) | ES2008931A6 (enrdf_load_stackoverflow) |
GR (1) | GR871758B (enrdf_load_stackoverflow) |
IL (1) | IL84417A (enrdf_load_stackoverflow) |
WO (1) | WO1988004881A1 (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5604831A (en) * | 1992-11-16 | 1997-02-18 | International Business Machines Corporation | Optical module with fluxless laser reflow soldered joints |
JP2973832B2 (ja) * | 1994-10-07 | 1999-11-08 | 株式会社デンソー | 半導体バンプ電極の試験方法および試験装置 |
JP3156606B2 (ja) * | 1996-11-19 | 2001-04-16 | 株式会社デンソー | 電極接合強度の検査方法及び検査装置 |
DE102007026700A1 (de) * | 2007-05-31 | 2008-12-11 | Solarwatt Ag | Schichtdickenmessgerät und Verfahren zur Schichtdickenmessung für verzinnte Metallbänder als elektrische Verbinder |
CN110455158A (zh) * | 2019-09-18 | 2019-11-15 | 中国科学院长春光学精密机械与物理研究所 | 一种印制电路板插装件焊点高度检测工装 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1209014A (en) * | 1969-04-18 | 1970-10-14 | Rolls Royce | A method of measuring the thickness of a layer, and apparatus for use in the method |
JPS60123714A (ja) * | 1983-12-08 | 1985-07-02 | Aichi Steel Works Ltd | スラグ厚さ検出装置 |
US4479980A (en) * | 1983-12-16 | 1984-10-30 | International Business Machines Corporation | Plating rate monitor |
-
1986
- 1986-12-17 US US06/944,051 patent/US4745684A/en not_active Expired - Fee Related
-
1987
- 1987-11-06 JP JP62507146A patent/JPH01501732A/ja active Granted
- 1987-11-06 WO PCT/US1987/002906 patent/WO1988004881A1/en unknown
- 1987-11-10 IL IL84417A patent/IL84417A/xx not_active IP Right Cessation
- 1987-11-18 GR GR871758A patent/GR871758B/el unknown
- 1987-12-16 ES ES8703596A patent/ES2008931A6/es not_active Expired
-
1988
- 1988-08-16 DK DK458288A patent/DK458288A/da not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DK458288D0 (da) | 1988-08-16 |
US4745684A (en) | 1988-05-24 |
GR871758B (en) | 1988-03-31 |
JPH01501732A (ja) | 1989-06-15 |
IL84417A0 (en) | 1988-04-29 |
JPH0557521B2 (enrdf_load_stackoverflow) | 1993-08-24 |
DK458288A (da) | 1988-08-16 |
WO1988004881A1 (en) | 1988-06-30 |
IL84417A (en) | 1990-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
SA6 | Expiration date (snapshot 920101) |
Free format text: 2007-12-16 |