ES2001301A6 - Soporte para cirucuitos impresos - Google Patents

Soporte para cirucuitos impresos

Info

Publication number
ES2001301A6
ES2001301A6 ES8602040A ES8602040A ES2001301A6 ES 2001301 A6 ES2001301 A6 ES 2001301A6 ES 8602040 A ES8602040 A ES 8602040A ES 8602040 A ES8602040 A ES 8602040A ES 2001301 A6 ES2001301 A6 ES 2001301A6
Authority
ES
Spain
Prior art keywords
base material
printed circuits
thermosetting resin
cured
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8602040A
Other languages
English (en)
Inventor
Helmut Hartmann
Kurt Borchard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISOLA WERKE AG
Original Assignee
ISOLA WERKE AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISOLA WERKE AG filed Critical ISOLA WERKE AG
Publication of ES2001301A6 publication Critical patent/ES2001301A6/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

SE DESCRIBE UN SOPORTE PARA CIRCUITOS IMPRESOS OBTENIDO CON CAPAS DE TEJIDO DE FIBRA DE VIDRIO Y UNA RESINA DUROPLASTICA ENDURECIDA , POSEYENDO UN COEFICIENTE DE DILATACION TERMICA SEMEJANTE AL DE LOS MATERIALES CERAMICOS GENERALMENTE APLICADOS Y CONTENIENDO UNA RESINA DUROPLASTICA, LA CUAL EN CONDICION ENDURECIDA TIENE UNA TEMPERATURA DE TRANSICION DEL ESTADO VITREO MENOR DE 90 C.
ES8602040A 1985-10-16 1986-09-19 Soporte para cirucuitos impresos Expired ES2001301A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853536883 DE3536883A1 (de) 1985-10-16 1985-10-16 Basismaterial fuer gedruckte schaltungen

Publications (1)

Publication Number Publication Date
ES2001301A6 true ES2001301A6 (es) 1988-05-01

Family

ID=6283721

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8602040A Expired ES2001301A6 (es) 1985-10-16 1986-09-19 Soporte para cirucuitos impresos

Country Status (4)

Country Link
EP (1) EP0218977A2 (es)
JP (1) JPS62181486A (es)
DE (1) DE3536883A1 (es)
ES (1) ES2001301A6 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3718267A1 (de) * 1987-05-30 1988-12-08 Akzo Gmbh Elektrischer verbundwerkstoff
US5350621A (en) * 1992-11-30 1994-09-27 Allied-Signal Inc. System of electronic laminates with improved registration properties
WO2016007718A1 (en) * 2014-07-10 2016-01-14 Isola Usa Corp. Thin resin films and their use in layups

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2739494B2 (de) * 1977-08-30 1980-10-16 Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen Verfahren zum Herstellen elektrischer Leiterplatten
US4364100A (en) * 1980-04-24 1982-12-14 International Business Machines Corporation Multi-layered metallized silicon matrix substrate
GB2080729A (en) * 1980-06-25 1982-02-10 Gen Electric A multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion and method for making same.
GB2097998B (en) * 1981-05-06 1985-05-30 Standard Telephones Cables Ltd Mounting of integrated circuits
JPS60217232A (ja) * 1984-04-11 1985-10-30 Matsushita Electric Works Ltd 熱硬化性樹脂組成物

Also Published As

Publication number Publication date
DE3536883A1 (de) 1987-04-16
DE3536883C2 (es) 1993-03-18
JPS62181486A (ja) 1987-08-08
EP0218977A2 (de) 1987-04-22

Similar Documents

Publication Publication Date Title
EP0133533A3 (en) Low thermal expansion resin material and composite shaped article
IL88200A0 (en) Epoxy resin compositions for use in low temperature curing applications
EP0335337A3 (en) Flexible base materials for printed circuits
EP0687712A3 (en) Resin composition and process for hardening them
EP0487164A3 (en) Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix
DE3560821D1 (en) Inorganic fiber-reinforced ceramic composite material
EP0336044A3 (en) A high temperature low thermal expansion ceramic and method for the production thereof
GB2136818B (en) Adhesive and heat-recoverable article having a layer of the adhesive
EP0195846A3 (en) Photo-curable epoxy resin type composition and curing process
DE3563203D1 (en) Inorganic fiber-reinforced ceramic composite material
GB8629267D0 (en) Laying pre-impregnated fibre reinforced material on surface
NO173008C (no) Komposittmateriale i form av en hulplate samt fremgangsmaate for dets fremstilling
GB2155480B (en) Heat curable epoxy resin compositions and epoxy resin curing agents
NO173879C (no) Lavtemperaturherdende belegningsmateriale
DE3681566D1 (de) Keramiksinter mit hohem waermeausdehnungskoeffizient und ein verbundkoerper aus demselben und metall.
KR890700627A (ko) 섬유강화 열경화성 수지 성형재료 및 그의 제조 방법
ZA816101B (en) Simultaneous expansion and cure of polyester resin composition
ES2001301A6 (es) Soporte para cirucuitos impresos
DE3587965D1 (de) Thermohärtende harzzusammensetzung.
GB2212507B (en) Curable resin and resin composition curable at low temperature
GB2108038B (en) Moulding and curing prepregs at reduced temperature
ATA219585A (de) Verbundwerkstoff und mehrschichtmaterial fuer dekorative anwendungen
DE3584968D1 (de) Formkoerper in stuetzkernbauweise und verfahren zur herstellung desselben.
EP0291455A3 (en) Heat foamable and curable epoxy resin mixture
IT1200418B (it) Metodo per il rivestimento di ceramiche e di crogioli di quarzo con materiali portati elettricamente in fase vapore