ES196000U - Un dispositivo de elemento de circuito electrico. - Google Patents
Un dispositivo de elemento de circuito electrico.Info
- Publication number
- ES196000U ES196000U ES0196000U ES196000U ES196000U ES 196000 U ES196000 U ES 196000U ES 0196000 U ES0196000 U ES 0196000U ES 196000 U ES196000 U ES 196000U ES 196000 U ES196000 U ES 196000U
- Authority
- ES
- Spain
- Prior art keywords
- circuit element
- translation
- insulating material
- machine
- legally binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10454—Vertically mounted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Un dispositivo de elemento de circuito eléctrico cubierto por una capa de material aislante a través de la cual salen al menos dos hilos de conexión del elemento de circuito al menos parcialmente paralelos, extendiéndose entre dichos hilos de conexión un miembro de apoyo compuesto de material aislante, caracterizado porque el miembro de apoyo consiste en una tira de material aislante que se extiende diagonalmente entre la parte paralela de los hilos de conexión, ajustándose con sus lados planos a los hilos de conexión y más o menos contigua al elemento de circuito en la zona de la superficie del elemento de circuito situada entre los hilos de conexión, estando embebida dicha tira en el material aislante sustancialmente hasta el lado apartado del elemento de circuito.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7007403A NL7007403A (es) | 1970-05-22 | 1970-05-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES196000U true ES196000U (es) | 1975-02-16 |
| ES196000Y ES196000Y (es) | 1975-07-01 |
Family
ID=19810132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES1973196000U Expired ES196000Y (es) | 1970-05-22 | 1973-09-11 | Un dispositivo de elemento de circuito electrico. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3691436A (es) |
| BE (1) | BE767500A (es) |
| ES (1) | ES196000Y (es) |
| FR (1) | FR2091815A5 (es) |
| GB (1) | GB1330776A (es) |
| NL (1) | NL7007403A (es) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES468041A1 (es) * | 1977-03-22 | 1978-11-16 | Novi Pb Sa | Unos perfeccionamientos en la fabricacion de condensadores electricos. |
| US4664458A (en) * | 1985-09-19 | 1987-05-12 | C W Industries | Printed circuit board connector |
| US5203143A (en) * | 1992-03-28 | 1993-04-20 | Tempo G | Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system |
| US5524765A (en) * | 1994-11-15 | 1996-06-11 | Tempo G | Carrier tape packaging system utilizing a layer of gel for retaining small components |
| US5833073A (en) * | 1997-06-02 | 1998-11-10 | Fluoroware, Inc. | Tacky film frame for electronic device |
| US6357594B1 (en) | 1998-06-30 | 2002-03-19 | Tempo G | Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes |
| US5960961A (en) * | 1998-08-03 | 1999-10-05 | Tempo G | Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes |
-
1970
- 1970-05-22 NL NL7007403A patent/NL7007403A/xx unknown
-
1971
- 1971-05-11 US US142240A patent/US3691436A/en not_active Expired - Lifetime
- 1971-05-19 FR FR7118260A patent/FR2091815A5/fr not_active Expired
- 1971-05-19 GB GB1577271*[A patent/GB1330776A/en not_active Expired
- 1971-05-21 BE BE767500A patent/BE767500A/xx unknown
-
1973
- 1973-09-11 ES ES1973196000U patent/ES196000Y/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2114624A1 (de) | 1973-06-14 |
| FR2091815A5 (es) | 1972-01-14 |
| BE767500A (fr) | 1971-11-22 |
| NL7007403A (es) | 1971-11-24 |
| DE2114624B2 (de) | 1976-01-15 |
| GB1330776A (en) | 1973-09-19 |
| US3691436A (en) | 1972-09-12 |
| ES196000Y (es) | 1975-07-01 |
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