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Una placa electrofotográfica, que comprende: a)un substrato conductor b)revestida sobre el mismo una primera capa que comprende una resina aislante orgánica y que posee un grueso aproximado de 0.5 a 50 micras y c)cubriendo dicha capa aislante, una capa fotoconductora con espesor aproximado de 0.02 a 4 micras.
Metodo de fabricacion de un circuito integrado, por corrosion selectiva, de un sustrato recubierto de capas multiples de pelicula delgada perfeccionado.