EP4580326A4 - Wärmeableitungsvorrichtung, leistungsmodul, stromversorgungssystem, fahrzeug und fotovoltaisches system - Google Patents

Wärmeableitungsvorrichtung, leistungsmodul, stromversorgungssystem, fahrzeug und fotovoltaisches system

Info

Publication number
EP4580326A4
EP4580326A4 EP23905587.4A EP23905587A EP4580326A4 EP 4580326 A4 EP4580326 A4 EP 4580326A4 EP 23905587 A EP23905587 A EP 23905587A EP 4580326 A4 EP4580326 A4 EP 4580326A4
Authority
EP
European Patent Office
Prior art keywords
vehicle
dispensing device
power supply
supply system
power module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23905587.4A
Other languages
English (en)
French (fr)
Other versions
EP4580326A1 (de
Inventor
Tingting Tang
Jiyang Li
Weilong Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Digital Power Technologies Co Ltd
Original Assignee
Huawei Digital Power Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Digital Power Technologies Co Ltd filed Critical Huawei Digital Power Technologies Co Ltd
Publication of EP4580326A1 publication Critical patent/EP4580326A1/de
Publication of EP4580326A4 publication Critical patent/EP4580326A4/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/32—Electrical components comprising DC/AC inverter means associated with the PV module itself, e.g. AC modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP23905587.4A 2022-12-22 2023-11-21 Wärmeableitungsvorrichtung, leistungsmodul, stromversorgungssystem, fahrzeug und fotovoltaisches system Pending EP4580326A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202223453727.4U CN220274101U (zh) 2022-12-22 2022-12-22 散热装置、功率模组、电源系统、车辆及光伏系统
PCT/CN2023/132920 WO2024131418A1 (zh) 2022-12-22 2023-11-21 散热装置、功率模组、电源系统、车辆及光伏系统

Publications (2)

Publication Number Publication Date
EP4580326A1 EP4580326A1 (de) 2025-07-02
EP4580326A4 true EP4580326A4 (de) 2026-01-21

Family

ID=89310869

Family Applications (1)

Application Number Title Priority Date Filing Date
EP23905587.4A Pending EP4580326A4 (de) 2022-12-22 2023-11-21 Wärmeableitungsvorrichtung, leistungsmodul, stromversorgungssystem, fahrzeug und fotovoltaisches system

Country Status (3)

Country Link
EP (1) EP4580326A4 (de)
CN (1) CN220274101U (de)
WO (1) WO2024131418A1 (de)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011089886A1 (de) * 2011-12-23 2013-02-07 Continental Automotive Gmbh Schaltungsträger und Verfahren zur Herstellung von einem Schaltungsträger
EP2840604B1 (de) * 2012-04-16 2017-07-19 Fuji Electric Co., Ltd. Halbleiterbauelement und kühler für ein halbleiterbauelement
US20190360764A1 (en) * 2018-05-28 2019-11-28 Coretronic Corporation Liquid cooled heat dissipation device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206136542U (zh) * 2016-09-05 2017-04-26 北京能高自动化技术股份有限公司 一种均温式水冷散热器
KR20210088329A (ko) * 2020-01-06 2021-07-14 엘지전자 주식회사 전력 모듈
CN113316370B (zh) * 2021-06-03 2026-01-02 苏州汇川联合动力系统股份有限公司 换热组件、散热结构及电机控制器
CN215008207U (zh) * 2021-06-24 2021-12-03 比亚迪半导体股份有限公司 一种散热板、半导体功率模块及车辆
CN217606806U (zh) * 2021-12-23 2022-10-18 比亚迪股份有限公司 功率模块及车辆
CN114093832A (zh) * 2021-12-27 2022-02-25 广东芯聚能半导体有限公司 散热底板及功率模块
CN217444376U (zh) * 2022-03-18 2022-09-16 比亚迪半导体股份有限公司 一种散热底板、功率模块、电子设备以及车辆
CN115101498B (zh) * 2022-05-18 2025-03-14 华为数字能源技术有限公司 功率模块、电源系统、车辆及光伏系统

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011089886A1 (de) * 2011-12-23 2013-02-07 Continental Automotive Gmbh Schaltungsträger und Verfahren zur Herstellung von einem Schaltungsträger
EP2840604B1 (de) * 2012-04-16 2017-07-19 Fuji Electric Co., Ltd. Halbleiterbauelement und kühler für ein halbleiterbauelement
US20190360764A1 (en) * 2018-05-28 2019-11-28 Coretronic Corporation Liquid cooled heat dissipation device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2024131418A1 *

Also Published As

Publication number Publication date
WO2024131418A1 (zh) 2024-06-27
CN220274101U (zh) 2023-12-29
EP4580326A1 (de) 2025-07-02

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