EP4528182A1 - Tempering module having peltier elements - Google Patents

Tempering module having peltier elements Download PDF

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Publication number
EP4528182A1
EP4528182A1 EP23198672.0A EP23198672A EP4528182A1 EP 4528182 A1 EP4528182 A1 EP 4528182A1 EP 23198672 A EP23198672 A EP 23198672A EP 4528182 A1 EP4528182 A1 EP 4528182A1
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EP
European Patent Office
Prior art keywords
heatsink
tempering
peltier element
tempering module
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP23198672.0A
Other languages
German (de)
French (fr)
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EP4528182C0 (en
EP4528182B1 (en
Inventor
Michal Foltýn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BMT Medical Technology sro
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BMT Medical Technology sro
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BMT Medical Technology sro filed Critical BMT Medical Technology sro
Priority to EP23198672.0A priority Critical patent/EP4528182B1/en
Priority to US18/890,489 priority patent/US20250093080A1/en
Publication of EP4528182A1 publication Critical patent/EP4528182A1/en
Application granted granted Critical
Publication of EP4528182C0 publication Critical patent/EP4528182C0/en
Publication of EP4528182B1 publication Critical patent/EP4528182B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00Self-contained movable devices, e.g. domestic refrigerators
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021Control thereof
    • F25B2321/0211Control thereof of fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023Mounting details thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025Removal of heat
    • F25B2321/0251Removal of heat by a gas

Definitions

  • the present invention relates to tempering modules and tempering chambers with Peltier elements.
  • a Peltier element is an electronic component that, when an electric current passes through it, develops different temperatures at the contact surfaces of two conductors (the so-called Peltier effect).
  • the Peltier element behaves like a heat pump, with one side of the element heating up at the expense of the other side, which cools down.
  • the side that heats up is called the hot side and the side that cools down is called the cold side.
  • the sides are swapped and the side that was originally heated cools and the side that was originally cooled heats.
  • these sides are referred to as a first side and a second side, and depending on the polarity of the electric current, this means the hot side and the cold side, or the cold side and the hot side.
  • heatsinks are mounted on the cold and hot sides of the Peltier elements.
  • the simplest design of a heat pump based on Peltier elements is one where one Peltier element is clamped by screws between a heated heatsink and a cooled heatsink by a force defined by the Peltier element manufacturer.
  • these heatsinks are referred to as a first heatsink and a second heatsink, and depending on the polarity of the electric current, this means the heated heatsink and cooled heatsink, or the cooled heatsink and heated heatsink.
  • a heat pump based on a Peltier element means a tempering module.
  • a spacer made of a thermally conductive material is inserted between the Peltier element and the cooled heatsink or heated heatsink.
  • the spacer increases the distance between the cooled heatsink and the heated heatsink and allows the gap to be filled with a larger layer of thermal insulation, thereby reducing unwanted heat exchange between the cooled and heated heatsink.
  • a thermally conductive paste is applied to their contact surfaces.
  • both heatsinks are flushed with a liquid medium, usually air.
  • the tempering module contains more than one Peltier element, and at the same time contains only one heated heatsink and only one cooled heatsink.
  • the heated heatsink starts to lengthen, and the cooled heatsink shortens due to thermal expansion.
  • the tempering module starts to bend, and this changes the flatness of some of the contact surfaces that are in contact with the Peltier elements. This can result in failure of the Peltier elements over time.
  • the object of the invention is to provide a tempering module with Peltier elements that maintains the flatness of the contact surfaces resulting from thermal expansion, thereby extending its lifetime and reducing failure rate.
  • a tempering module comprising at least two Peltier elements, wherein each Peltier element has a first side and a second side, and wherein said at least two Peltier elements are oriented with their first side so as to be in thermal contact with a common shared first heatsink.
  • each Peltier element is oriented with its second side so as to be in thermal contact with a separate second heatsink.
  • the first side is the hot side
  • the second side is the cold side
  • the first heatsink is the heated heatsink
  • the second heatsink is the cooled heatsink
  • the tempering module according to the present invention comprises just as many cooled heatsinks as it comprises Peltier elements. Owing to this structure, the passage of electric current due to heating of the heated heatsink results only in its linear extension, whereby the desired flatness of the surfaces in contact with the Peltier elements is not affected. Even in the case of reversal of the polarity of the electric current, when the originally heated heatsink starts to cool and the originally cooled heatsinks start to heat, there is no bending of the tempering module, but only its linear shortening.
  • This structure also allows easy removal of the cooled heatsinks. This makes it possible, e.g. in the event of a tempering module failure, to replace only the tempering module without the cooled heatsinks, to which the original cooled heatsinks from the failed tempering module are fitted, saving production costs.
  • a further advantage of this invention is that other cooled heatsinks with different cooling fin direction can be mounted on the tempering module with unmounted cooled heatsinks, as it is the most advantageous for the air flow and positioning of the tempering module.
  • a spacer may be arranged between the second side of the Peltier element and the second heatsink to allow thermal contact between the Peltier element and the second heatsink in order to increase the distance between the cooled heatsink and the heated heatsink and to create a gap to be filled with a larger layer of thermal insulation, thereby reducing unwanted thermal exchange between the cooled and heated heatsink.
  • the first heatsink and the second heatsink can be attached to the spacer.
  • the first heatsink may be secured to the spacer by means of first screws, preferably provided with a resilient member (e.g. a disc spring), a steel washer and a thermal insulating member (e.g. a thermal insulating pad) to limit heat transfer between the first heatsink and the spacer.
  • the second heatsink may be attached to the spacer by second bolts, preferably provided with a resilient element (e.g. a resilient washer).
  • the first and second sides of the Peltier element, as well as both sides of the first and second heatsinks in thermal contact with the Peltier element, may be coated with a layer of thermally conductive paste for as efficient heat transfer as possible.
  • the first and/or second heatsink may be formed as a finned air heatsink.
  • the fins of the first heatsink may be oriented parallel to the fins of the second heatsink or perpendicular to the fins of the second heatsink.
  • Thermal insulation can be placed between the heated heatsink and the cooled heatsinks.
  • a tempering chamber comprising a wall with a mounted tempering module as described above.
  • the first heatsink is arranged on which a first fan is arranged for pushing air into the first heatsink in a substantially perpendicular direction to the plane of the first side of the Peltier element.
  • At least two second heatsinks are arranged on the inner side of said wall.
  • a second fan is further arranged on the inner side of said wall for pushing air into the second heatsinks in a direction substantially parallel to the plane of the second side of the Peltier element, preferably drawing air through an opening in a cover plate.
  • At least one flow rectifier may be arranged on the inside of said wall to increase the efficiency of flushing of the cooled heatsinks.
  • the cooled heatsinks and the second fan can be located in the space between the tempering chamber and a cover plate.
  • a first example embodiment is a tempering module according to Figure 1 .
  • the tempering module comprises three Peltier elements 2 , each Peltier element 2 having a first side (typically a hot side) and a second side (typically a cold side) and said three Peltier elements 2 are oriented with their first side so as to be in thermal contact with a common shared first heatsink 1 (typically a heated heatsink).
  • Each Peltier element 2 is oriented with its second side so as to be in thermal contact with a separate second heatsink 4 (typically a cooled heatsink).
  • a spacer 3 (e.g., a spacer cube) is arranged between the second side of the Peltier element 2 and the second heatsink 4 to allow thermal contact between the Peltier element 2 and the second heatsink 4 .
  • the first heatsink 1 is fixed to the spacer 3 by means of first screws 5 provided with a disc spring 6 , a steel washer 7 and a thermal insulating pad 8 to limit the thermal contact between the first heatsink 1 and the spacer 3 .
  • the second heatsink 4 is fixed to the spacer 3 by means of second screws 10 provided with a resilient washer 9 .
  • the first and second sides of the Peltier element 2 and both sides of the first and second heatsinks 1 , 4 in thermal contact with the Peltier element 2 are provided with a layer of thermally conductive paste 1 1.
  • a thermal insulation 12 is provided between the first heatsink 1 and the second heatsink 4 .
  • the first and second heatsinks 1, 4 are formed as finned air heatsinks, wherein the fins of the first heatsink 1 (not shown in Figure 1 ) are oriented perpendicular to the fins of the second heatsink 4 .
  • a second example embodiment is a tempering chamber 13 according to Figures 2A, 2B , 3A and 3B .
  • the tempering chamber 13 comprises a wall with two mounted tempering modules 17 according to Example 1.
  • a first heatsink 1 is arranged at each tempering module 17 , on which a first fan 18 is arranged for pushing air into the first heatsink 1 in a substantially perpendicular direction to the plane of the first side of the Peltier element 2 .
  • On the inner side of said wall typically the inner side of the back wall, three second heatsinks 4 are arranged at each tempering module 17 .
  • a second fan 15 is arranged for pushing air into the second heatsinks 4 sucked through an opening in the cover plate 14 , from the tempering chamber 13, in a direction substantially parallel to the plane of the second side of the Peltier element 2 .
  • two flow rectifiers 16 are arranged on the inner side of the rear wall of the tempering chamber 13 for directing the air pushed in by the second fan 15 .
  • the second heatsinks 4 and the second fan 15 are arranged in the space between the inner side of the rear wall of the tempering chamber 13 and the cover plate 14 .
  • tempering module can be used for cooling and/or heating various instrument chambers, e.g. laboratory incubators or storage and test cabinets.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a tempering module comprising at least two Peltier elements (2), wherein each Peltier element (2) has a first side and a second side, and wherein said at least two Peltier elements (2) are oriented with their first side so as to be in thermal contact with a common shared first heatsink (1). Each Peltier element (2) is oriented with its second side so as to be in thermal contact with a separate second heatsink (4). The invention further relates to a tempering chamber comprising said tempering module.

Description

    Field of technology
  • The present invention relates to tempering modules and tempering chambers with Peltier elements.
  • Prior art
  • A Peltier element is an electronic component that, when an electric current passes through it, develops different temperatures at the contact surfaces of two conductors (the so-called Peltier effect). Thus, when an electric current passes through the element, the Peltier element behaves like a heat pump, with one side of the element heating up at the expense of the other side, which cools down. The side that heats up is called the hot side and the side that cools down is called the cold side. When the polarity of the electric current is reversed, the sides are swapped and the side that was originally heated cools and the side that was originally cooled heats. For the purposes of this description, these sides are referred to as a first side and a second side, and depending on the polarity of the electric current, this means the hot side and the cold side, or the cold side and the hot side.
  • For efficient heat transfer, heatsinks are mounted on the cold and hot sides of the Peltier elements. The simplest design of a heat pump based on Peltier elements is one where one Peltier element is clamped by screws between a heated heatsink and a cooled heatsink by a force defined by the Peltier element manufacturer. For the purposes of this description, these heatsinks are referred to as a first heatsink and a second heatsink, and depending on the polarity of the electric current, this means the heated heatsink and cooled heatsink, or the cooled heatsink and heated heatsink. For the purposes of this description, a heat pump based on a Peltier element means a tempering module.
  • Sometimes a spacer made of a thermally conductive material is inserted between the Peltier element and the cooled heatsink or heated heatsink. The spacer increases the distance between the cooled heatsink and the heated heatsink and allows the gap to be filled with a larger layer of thermal insulation, thereby reducing unwanted heat exchange between the cooled and heated heatsink. In order to maximize the heat transfer between the Peltier element, the heated heatsink, the spacer and the cooled heatsink, a thermally conductive paste is applied to their contact surfaces. To increase the efficiency of heat transfer, both heatsinks are flushed with a liquid medium, usually air.
  • For a proper function and long life of the Peltier element, all surfaces in contact with the Peltier element must be manufactured to the required flatness tolerance specified by the Peltier element manufacturer.
  • The problem arises when the tempering module contains more than one Peltier element, and at the same time contains only one heated heatsink and only one cooled heatsink. As the electric current passes through the Peltier elements, the heated heatsink starts to lengthen, and the cooled heatsink shortens due to thermal expansion. As a result, the tempering module starts to bend, and this changes the flatness of some of the contact surfaces that are in contact with the Peltier elements. This can result in failure of the Peltier elements over time.
  • Consequently, there is a need in the prior art to provide a tempering module with Peltier elements with longer lifetime and lower failure rate.
  • Summary of the invention
  • The object of the invention is to provide a tempering module with Peltier elements that maintains the flatness of the contact surfaces resulting from thermal expansion, thereby extending its lifetime and reducing failure rate.
  • The object is achieved in a first aspect of the present invention by a tempering module comprising at least two Peltier elements, wherein each Peltier element has a first side and a second side, and wherein said at least two Peltier elements are oriented with their first side so as to be in thermal contact with a common shared first heatsink.
  • The underlying idea of the tempering module according to the present invention is that each Peltier element is oriented with its second side so as to be in thermal contact with a separate second heatsink.
  • In a typical embodiment, the first side is the hot side, the second side is the cold side, the first heatsink is the heated heatsink, and the second heatsink is the cooled heatsink, and these terms are used interchangeably below, although one skilled in the art understands that when the polarity of the electric current is reversed, opposite definitions apply.
  • Thus, the tempering module according to the present invention comprises just as many cooled heatsinks as it comprises Peltier elements. Owing to this structure, the passage of electric current due to heating of the heated heatsink results only in its linear extension, whereby the desired flatness of the surfaces in contact with the Peltier elements is not affected. Even in the case of reversal of the polarity of the electric current, when the originally heated heatsink starts to cool and the originally cooled heatsinks start to heat, there is no bending of the tempering module, but only its linear shortening.
  • This structure also allows easy removal of the cooled heatsinks. This makes it possible, e.g. in the event of a tempering module failure, to replace only the tempering module without the cooled heatsinks, to which the original cooled heatsinks from the failed tempering module are fitted, saving production costs.
  • A further advantage of this invention is that other cooled heatsinks with different cooling fin direction can be mounted on the tempering module with unmounted cooled heatsinks, as it is the most advantageous for the air flow and positioning of the tempering module.
  • A spacer may be arranged between the second side of the Peltier element and the second heatsink to allow thermal contact between the Peltier element and the second heatsink in order to increase the distance between the cooled heatsink and the heated heatsink and to create a gap to be filled with a larger layer of thermal insulation, thereby reducing unwanted thermal exchange between the cooled and heated heatsink.
  • The first heatsink and the second heatsink can be attached to the spacer. The first heatsink may be secured to the spacer by means of first screws, preferably provided with a resilient member (e.g. a disc spring), a steel washer and a thermal insulating member (e.g. a thermal insulating pad) to limit heat transfer between the first heatsink and the spacer. The second heatsink may be attached to the spacer by second bolts, preferably provided with a resilient element (e.g. a resilient washer).
  • The first and second sides of the Peltier element, as well as both sides of the first and second heatsinks in thermal contact with the Peltier element, may be coated with a layer of thermally conductive paste for as efficient heat transfer as possible.
  • The first and/or second heatsink may be formed as a finned air heatsink. The fins of the first heatsink may be oriented parallel to the fins of the second heatsink or perpendicular to the fins of the second heatsink.
  • Thermal insulation can be placed between the heated heatsink and the cooled heatsinks.
  • The object is achieved in the second aspect of the present invention by a tempering chamber comprising a wall with a mounted tempering module as described above. On the outer side of said wall, the first heatsink is arranged on which a first fan is arranged for pushing air into the first heatsink in a substantially perpendicular direction to the plane of the first side of the Peltier element. At least two second heatsinks are arranged on the inner side of said wall. A second fan is further arranged on the inner side of said wall for pushing air into the second heatsinks in a direction substantially parallel to the plane of the second side of the Peltier element, preferably drawing air through an opening in a cover plate.
  • In this arrangement, the cooled heatsinks are flushed with air from the side of the cooled heatsink through the gaps between the fins. In this way, one second fan arranged in this way can provide air flushing to one or more cooled heatsinks which are arranged on one or more tempering modules. A further advantage of the second fan positioned in this way is its height space saving compared to a second fan positioned from above on the cooled heatsink.
  • At least one flow rectifier may be arranged on the inside of said wall to increase the efficiency of flushing of the cooled heatsinks.
  • The cooled heatsinks and the second fan can be located in the space between the tempering chamber and a cover plate.
  • Brief description of the drawings
    • Figure 1 shows a side sectional view of a tempering module according to the present invention.
    • Figure 2 shows a front view of a tempering chamber according to the present invention with a cover plate (A) and without a cover plate (B).
    • Figure 3 shows a rear view (A) and a sectional view along A-A (B) of a tempering chamber according to the present invention.
    Examples Example 1
  • A first example embodiment is a tempering module according to Figure 1. The tempering module comprises three Peltier elements 2, each Peltier element 2 having a first side (typically a hot side) and a second side (typically a cold side) and said three Peltier elements 2 are oriented with their first side so as to be in thermal contact with a common shared first heatsink 1 (typically a heated heatsink). Each Peltier element 2 is oriented with its second side so as to be in thermal contact with a separate second heatsink 4 (typically a cooled heatsink). A spacer 3 (e.g., a spacer cube) is arranged between the second side of the Peltier element 2 and the second heatsink 4 to allow thermal contact between the Peltier element 2 and the second heatsink 4. The first heatsink 1 is fixed to the spacer 3 by means of first screws 5 provided with a disc spring 6, a steel washer 7 and a thermal insulating pad 8 to limit the thermal contact between the first heatsink 1 and the spacer 3. The second heatsink 4 is fixed to the spacer 3 by means of second screws 10 provided with a resilient washer 9. The first and second sides of the Peltier element 2 and both sides of the first and second heatsinks 1, 4 in thermal contact with the Peltier element 2 are provided with a layer of thermally conductive paste 11. A thermal insulation 12 is provided between the first heatsink 1 and the second heatsink 4. The first and second heatsinks 1, 4 are formed as finned air heatsinks, wherein the fins of the first heatsink 1 (not shown in Figure 1) are oriented perpendicular to the fins of the second heatsink 4.
  • Example 2
  • A second example embodiment is a tempering chamber 13 according to Figures 2A, 2B, 3A and 3B. The tempering chamber 13 comprises a wall with two mounted tempering modules 17 according to Example 1. On the outer side of said wall, a first heatsink 1 is arranged at each tempering module 17, on which a first fan 18 is arranged for pushing air into the first heatsink 1 in a substantially perpendicular direction to the plane of the first side of the Peltier element 2. On the inner side of said wall (typically the inner side of the back wall), three second heatsinks 4 are arranged at each tempering module 17. Further, on the inner side of said wall, a second fan 15 is arranged for pushing air into the second heatsinks 4 sucked through an opening in the cover plate 14, from the tempering chamber 13, in a direction substantially parallel to the plane of the second side of the Peltier element 2. Further, two flow rectifiers 16 are arranged on the inner side of the rear wall of the tempering chamber 13 for directing the air pushed in by the second fan 15. The second heatsinks 4 and the second fan 15 are arranged in the space between the inner side of the rear wall of the tempering chamber 13 and the cover plate 14.
  • Industrial applicability
  • The above-described tempering module can be used for cooling and/or heating various instrument chambers, e.g. laboratory incubators or storage and test cabinets.
  • List of reference signs
  • 1
    first heatsink
    2
    Peltier element
    3
    spacer
    4
    second heatsink
    5
    first screws
    6
    disc spring
    7
    steel washer
    8
    thermal insulating pad
    9
    resilient washer
    10
    second screws
    11
    thermally conductive paste
    12
    thermal insulation
    13
    tempering chamber
    14
    cover plate
    15
    second fan
    16
    flow rectifier
    17
    tempering module
    18
    first fan

Claims (11)

  1. A tempering module comprising at least two Peltier elements (2), wherein each Peltier element (2) has a first side and a second side, and wherein said at least two Peltier elements (2) are oriented with their first side so as to be in thermal contact with a common shared first heatsink (1), characterized in that each Peltier element (2) is oriented with its second side so as to be in thermal contact with a separate second heatsink (4).
  2. The tempering module according to claim 1, characterized in that a spacer (3) is arranged between the second side of the Peltier element (2) and the second heatsink (4) to allow thermal contact between the Peltier element (2) and the second heatsink (4).
  3. The tempering module according to claim 2, characterized in that the first heatsink (1) and the second heatsink (4) are attached to the spacer (3).
  4. The tempering module according to any one of the preceding claims, characterized in that the first heatsink (1) is attached to the spacer (3) by means of first screws (5), preferably provided with a thermal insulating element (8) to limit the thermal contact between the first heatsink (1) and the spacer (3).
  5. The tempering module according to any one of the preceding claims, characterized in that the second heatsink (4) is attached to the spacer (3) by means of second screws (10).
  6. The tempering module according to any one of the preceding claims, characterized in that the screw connection by means of the first and/or second screws (5, 10) comprises a resilient element (6, 9).
  7. The tempering module according to any one of the preceding claims, characterized in that the first and second sides of the Peltier element (2) as well as both sides of the first and second heatsink (1, 4) in thermal contact with the Peltier element (2) are coated with a layer of thermally conductive paste (11).
  8. The tempering module according to any one of the preceding claims, characterized in that the first and/or second heatsink (1, 4) is formed as a finned air heatsink.
  9. The tempering module according to claim 8, characterized in that the fins of the first heatsink (1) are oriented parallel to the fins of the second heatsink (4) or perpendicular to the fins of the second heatsink (4).
  10. A tempering chamber (13) characterized in that it comprises a wall with the tempering module (17) mounted according to any one of the preceding claims, wherein the first heatsink (1) is arranged on an outer side of said wall, on which a first fan (18) is arranged for pushing air into the first heatsink (1) in a substantially perpendicular direction to the plane of the first side of the Peltier element (2), wherein at least two second heatsinks (4) and a second fan (15) for pushing air into the second heatsinks (4) in a direction substantially parallel to the plane of the second side of the Peltier element (2) are arranged on an inner side of said wall.
  11. The tempering chamber (13) according to claim 10, characterized in that at least one flow rectifier (16) is arranged on the inner side of said wall.
EP23198672.0A 2023-09-20 2023-09-20 Tempering chamber having peltier elements Active EP4528182B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP23198672.0A EP4528182B1 (en) 2023-09-20 2023-09-20 Tempering chamber having peltier elements
US18/890,489 US20250093080A1 (en) 2023-09-20 2024-09-19 Tempering module with peltier elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP23198672.0A EP4528182B1 (en) 2023-09-20 2023-09-20 Tempering chamber having peltier elements

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EP4528182A1 true EP4528182A1 (en) 2025-03-26
EP4528182C0 EP4528182C0 (en) 2025-11-19
EP4528182B1 EP4528182B1 (en) 2025-11-19

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EP (1) EP4528182B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5315830A (en) * 1993-04-14 1994-05-31 Marlow Industries, Inc. Modular thermoelectric assembly
US6463743B1 (en) * 2000-04-20 2002-10-15 Laliberte; Jacques Modular thermoelectric unit and cooling system using same
US20050126184A1 (en) * 2003-12-12 2005-06-16 Cauchy Matt J. Thermoelectric heat pump with direct cold sink support
EP2891176B1 (en) * 2012-11-09 2016-06-15 Laird Technologies, Inc. Thermoelectric assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5315830A (en) * 1993-04-14 1994-05-31 Marlow Industries, Inc. Modular thermoelectric assembly
US5315830B1 (en) * 1993-04-14 1998-04-07 Marlow Ind Inc Modular thermoelectric assembly
US6463743B1 (en) * 2000-04-20 2002-10-15 Laliberte; Jacques Modular thermoelectric unit and cooling system using same
US20050126184A1 (en) * 2003-12-12 2005-06-16 Cauchy Matt J. Thermoelectric heat pump with direct cold sink support
EP2891176B1 (en) * 2012-11-09 2016-06-15 Laird Technologies, Inc. Thermoelectric assembly

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EP4528182C0 (en) 2025-11-19
EP4528182B1 (en) 2025-11-19
US20250093080A1 (en) 2025-03-20

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