Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
  • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/50—Fixed connections
  • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
  • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/36—Assembling printed circuits with other printed circuits
  • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/14—Structural association of two or more printed circuits
  • H05K1/144—Stacked arrangements of planar printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0137—Materials
  • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0137—Materials
  • H05K2201/0154—Polyimide
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0302—Properties and characteristics in general
  • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10189—Non-printed connector
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
  • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Definitions

• the present invention generally relates to the field of electronic devices comprising a connection between two printed circuits. More specifically, the present invention relates to an electronic device, an associated housing and a method of assembling an electronic device.
• a printed circuit sometimes called a PCB (acronym for "Printed Circuit Board”), is a support arranged to position electronic components at the level of conductive elements, often electronic tracks, which electrically connect electronic components and electronic elements external to said printed circuit board.
• PCB acronym for "Printed Circuit Board”
• an electronic device comprising:
• main printed circuit comprising at least a first location
• connection member positioned on the at least one first location and comprising support means designed to urge at least a connection element of the at least one connection member resting on at least one conductive element of the flexible printed circuit;
• stiffening element secured to the flexible printed circuit and arranged to stiffen the flexible printed circuit at the level of at least one conductive element on which the connection element is supported.
• the electronic device comprises a second stiffening element arranged to stiffen the flexible printed circuit at the at least one second location.
• the at least one switch comprises a membrane and an electrical contact element arranged to close the electrical circuit when a force is exerted on said membrane.
• the at least one switch is held relative to the flexible printed circuit without soldering.
• the stiffening element comprises an FR4 or CEM3 composite material.
• the stiffening element comprises metal or, as a variant, plastic.
• the stiffening element comprises a thickness of between 0.5 millimeters and 1.6 millimeters.
• the at least one connection member comprises at least one spring connector.
• the support means are arranged to move the connection element over a range of between 0 and 2 millimeters.
• the at least one conductive element comprises copper tracks covered with a surface layer, for example obtained by electrolytic or chemical treatment.
• the surface layer comprises an Ni-Au treatment with a thickness of between 0.05 micrometer and 15 micrometer.
• the surface layer comprises a layer of nickel with a thickness of between 4 micrometers and 10 micrometers and a layer of gold with a thickness of between 0.5 micrometers and 2 micrometers.
• the flexible printed circuit comprises a support film comprising polyimide or polyethylene terephthalate.
• the flexible printed circuit comprises a part devoid of a stiffening element arranged to separate the at least one switch from said conductive elements, said part extending over at least 10 millimeters.
• the invention also proposes a box comprising an electronic device as defined above, and:
• a first set comprising fixing means for fixing the main printed circuit to the first set;
• a second set comprising fixing means for fixing the flexible printed circuit to the second set and a button arranged to exert a force on the at least one switch causing closure of the at least one switch, said second set and said first assembly being arranged to be fixed to each other so as to cause a stress on the at least one connection element resting on the at least one conductive element of the flexible printed circuit.
• the invention also proposes a method for assembling an electronic device comprising:
• main printed circuit comprising at least a first location
• connection member positioned on the at least one first location and comprising at least one connection element
• At least one switch positioned on the at least one second location and arranged to selectively close an electrical circuit of the flexible printed circuit
• the electronic device further comprises a box comprising:
• a first set comprising fixing means for fixing the main printed circuit to the first set;
• a second set comprising fixing means for fixing the flexible printed circuit to the second set and a button arranged to exert a force on the at least one switch.
• the method as described above can then further comprise a step of assembling the second set to the first set, said assembling step enabling the bringing together step.
• said method further comprises a step of closing the at least one switch when an actuation force is exerted on said button, said switch being configured to close said electrical circuit of said flexible printed circuit .
• FIG. 1 is a schematic representation of a first embodiment of a device according to the invention
• FIG. 2 is a schematic representation of a second embodiment of a device according to the invention.
• FIG. 3 is a schematic representation of a third embodiment of a device according to the invention.
• FIG. 4 is a schematic representation of a fourth embodiment of a device according to the invention
• FIG. 5 is a schematic representation of an arrangement of a flexible printed circuit coupled to a stiffening element used in a device according to the invention
• FIG. 6 is a schematic representation of a first example of a connection member used in a device according to the invention.
• FIG. 7 is a schematic representation of a second example of a connection member used in a device according to the invention.
• FIG. 8 is a schematic representation of a box according to the invention.
• FIG. 9 is a schematic representation of a method according to the invention.
• Figure 1, Figure 2, Figure 3 and Figure 4 each illustrate an example of a schematic representation of a device according to the present disclosure.
• FIG. 1 illustrates an electronic device 100.
• the electronic device 100 comprises a printed circuit 10, called the main printed circuit 10.
• the main printed circuit 10 comprises a first slot 11 arranged to receive a connection member 20.
• main printed circuit 10 is meant a printed circuit of the “Printed Circuit Board” (PCB) type.
• the main printed circuit can thus correspond to a motherboard.
• the device 100 further comprises the connection member 20 already mentioned.
• the connection member 20 is positioned on the first location 11 of the main printed circuit 10.
• the device 100 further comprises a flexible printed circuit 30.
• the flexible printed circuit 30 includes a second location 31 arranged to receive a switch 40.
• flexible printed circuit is meant a printed circuit known by the English name “Flexible Printed Circuit” (FPC).
• FPC Flexible Printed Circuit
• a flexible printed circuit is a printed circuit comprising at least one layer having a certain level of flexibility, that is to say a layer which can deform, unlike the printed circuits known under the English name "Printed Circuit Board (PCB) which are known to be rigid, i.e. non-deformable, in common use.
• the flexible printed circuit 30 comprises a much smaller thickness than the main printed circuit 10.
• a factor of ten separates the thickness of the flexible printed circuit 30 from the thickness of the main printed circuit 10, this which gives it its flexibility with respect to the main printed circuit 10.
• the flexible printed circuit comprises a support film made of polyimide or polyethylene terephthalate and/or having a thickness of between 20 microns and 50 microns.
• the device 100 then comprises the switch 40 already mentioned, positioned on the second location 31 .
• the switch 40 illustrated in FIG. 1 comprises a first operating state, called open, and a second operating state, called closed.
• Switch 40 is thus arranged to selectively close an electric circuit of flexible printed circuit 30. The electric circuit is thus closed when switch 40 is in its second operating state.
• electrical circuit we mean an electrical circuit of the device 100, for example an electrical circuit which can run in particular through the main printed circuit 10, the connection member 20, the flexible printed circuit 30, the switch 40.
• the switch 40 illustrated in FIG. 1 is held to the flexible printed circuit by connecting means 44.
• the connecting means 44 of the switch 40 can be mechanical hooks 44 which are inserted, for example, into the flexible printed circuit 30, or glue dots.
• the switch 40 is held in the flexible printed circuit 30 by a particular arrangement of the flexible printed circuit 30, possibly relative to other parts of the flexible printed circuit 30 or other parts positioned on said printed circuit. flexible 30.
• the switch 40 is maintained relative to the flexible printed circuit 30 without soldering, which allows the electronic device 100 to be less expensive than devices of the state of the art requiring electric soldering for each electronic component . In addition, this makes it possible to improve the ease of implementation of the device 100.
• connection member 20 comprises bearing means designed to urge a connection element 21 of the connection member 20 to rest on a conductive element of the flexible printed circuit 30.
• the member connection 20 is held to the main printed circuit 10 by connecting means 12.
• the connecting means 12 of the connection member 20 can preferably be welds 12 or mechanical hooks 12.
• the device 100 further comprises a stiffening element 50 secured to the flexible printed circuit 30.
• the stiffening element 50 is arranged to stiffen the flexible printed circuit 30 at the level of the conductive element on which the connection element 21 rests.
• the stiffening element 50 is positioned below the flexible printed circuit 30.
• the stiffening element 50 carries or supports the flexible printed circuit 30.
• a portion 39 of the flexible printed circuit 30 located above of the stiffening element 50 is stiffened locally, i.e. over the entire portion 39 of the flexible printed circuit 30 supported by said stiffening element 50.
• the portion 39 of the flexible printed circuit 30 is therefore less flexible, even rigid, compared to the other parts of the circuit flexible printed circuit 30 devoid of stiffening element 50.
• Such an arrangement confers local rigidity to the flexible printed circuit 30.
• This local rigidity can be similar to that obtained by a PCB.
• it improves the support of the connection means 21 of the connection member 20 on the flexible printed circuit 30. The support is more effective.
• the stiffening element 50 comprises an FR4 or CEM composite material. In another embodiment, the stiffening element comprises metal or plastic. The stiffening element 50 also includes a thickness denoted e1.
• device 100 may include at least two of either of these elements.
• FIG. 30 illustrates a second example of a device 200 according to the present disclosure.
• Device 200 comprises all the elements of device 100. Thus only the differences with FIG. 1 will be described.
• the device 200 further comprises a second stiffening element 60.
• the second stiffening element 60 is arranged to stiffen the flexible printed circuit 30 at the second location 31.
• the second stiffening element 60 is positioned below the circuit flexible printed circuit 30 and completely covers the second location 31.
• the second stiffening element 60 carries or supports the flexible printed circuit 30 on which the switch 40 is positioned.
• the second stiffening element 60 comprises a thickness denoted e2.
• another portion 392 of the flexible printed circuit 30 located above the second stiffener 60 is stiffened locally, i.e. over the entire portion 392 of the flexible printed circuit 30 supported by the second stiffening element 60.
• such an arrangement confers a local rigidity to the flexible printed circuit 30.
• This local rigidity can be similar to that obtained by a PCB.
• the second stiffening element 60 is identical or similar to the numbered stiffening element 50.
• the stiffening element 50 and the second stiffening element 60 can comprise an identical thickness e1 or e2 comprised between 0.5 millimeter and 1.6 millimeters.
• the stiffening element 50 and the second stiffening element 60 can be of the same composition, for example they can be made of aluminum.
• the stiffening element 50 and the second stiffening element 60 can be different in terms of thickness and/or composition.
• the second stiffening element 60 can be made of FR4 while the stiffening element 50 is made of metal.
• the thickness e2 of the second stiffening element 60 is different from the thickness e1 of the stiffening element 50.
• the thickness e1 of the stiffening element 50 can be 0 .5 millimeters while the thickness e2 of the second stiffening element is 1.5 millimeters.
• composition and the thickness of the stiffening element 50 and of the second stiffening element 60 are adapted or chosen according to the type of switch 40 and the type of connection member 20 so that the flexible printed circuit 30 reaches a level of rigidity sufficient to replace or come into contact with these electrical components on the flexible printed circuit 30.
• the flexible printed circuit 30 of the device 300 illustrated in FIG. 2 comprises a part 38 which is not stiffened by any stiffening element 50, 60.
• the part 38 devoid of a stiffening element 50, 60 is arranged to separate the switch 40 from the conductive element on which the connection member 20 bears.
• the part 38 of the flexible printed circuit 30 devoid of stiffening element 50, 60 is arranged to extend along a distance denoted X of at least 10 millimeters.
• X a distance denoted X of at least 10 millimeters.
• Figure 3 illustrates a third example of a device 300 according to the present disclosure.
• Device 300 comprises all the elements of device 200. Thus only the differences with FIG. 2 will be described.
• the flexible printed circuit 30 of the device 300 of FIG. 3 comprises two adhesive layers 32.
• One of the adhesive layers 32 is positioned between the flexible printed circuit 30 and the stiffening element 50 while the second adhesive layer 32 is positioned between the printed circuit flexible 30 and the second stiffening element 60.
• the adhesive layers are arranged to fix the flexible printed circuit 30, in particular to glue the flexible printed circuit 30, to the stiffening element 50 or to the second stiffening element 60.
• the switch 40 of Figure 3 comprises a membrane 41 and an electrical contact element 42.
• the electrical contact element 42 is arranged to close the flexible printed circuit when a force, denoted F, is exerted on the membrane 41 .
• the electrical contact element 42 illustrated in FIG. 4 is in the form of a conductive pad, that is to say a small thin plate fixed to the membrane 41. To close the electrical circuit, the electrical contact 42 touches conductive elements of flexible printed circuit 30. In this case, switch 40 goes into the closed operating state.
• the membrane 41 is, by way of example, made of silicone. Of course, in other embodiments, the membrane 41 can comprise other materials such as plastic, polymer, etc.
• switch 40 comprises a single electrical contact element 42 per membrane 41. In other embodiments, the membrane 41 can be associated with several electrical contact elements 42, each electrical contact element 42 being able to be positioned on a conductive element of the printed circuit flexible 30.
• the electrical contact element 42 may comprise a mixture of silicone and carbon powder, or of another compound that provides good electrical conductivity.
• the electrical contact element 42 comprises a metal fabric, or even a metal plate, and with a coating adapted to the durability of said electrical contact element 42.
• the silicone membrane 41 can be designed to achieve a touch function.
• Figure 4 illustrates a fourth example of a device 400 according to the present disclosure.
• Device 400 comprises all the elements of device 300. Thus only the differences with FIG. 3 will be described.
• the circuit shown in Figure 4 includes another type of switch 40.
• Switch 40 in Figure 4 includes a membrane 41 and an electrical contact element 42.
• the electrical contact element 42 in Figure 4 is made of metal.
• the electrical contact element 42 of the switch 40 comprises a hemispherical shape, for example in the form of a convex dome in a direction going from the membrane 41 towards the flexible printed circuit 30.
• the element of metallic electrical contact 42 illustrated in FIG. 5 is also known under the name of “metallic blister”.
• the electrical contact element 42 of FIG. 5 comprises edges, numbered 43, arranged to come into contact with the conductive elements 34 of the flexible printed circuit 30.
• edges 43 of the electrical contact element 42 of the Figure 4 are in contact with a first conductor of the flexible printed circuit 30, while the center of the electrical contact element 42 is located opposite a second conductor of the flexible printed circuit 30.
• the center of the electrical contact element 42 comes into contact with the second conductor, which makes it possible to close the electrical circuit between the first conductor and the second driver.
• the electrical contact element 42 resumes its initial shape and the circuit is again open.
• the tactile function is directly ensured by the electrical contact element 42 (ie the metal foil 42), and by an electrical switching of the switch 40, for example by the closing of the switch 40.
• the membrane 41 is preferably silicone. It can be associated with a plurality of electrical contact elements 42 (ie metal blisters).
• Figure 5 illustrates a possible arrangement of the flexible printed circuit 30 used in a device 100, 200, 300 or 400 according to the present disclosure.
• the flexible printed circuit 30 illustrated in FIG. 5 comprises a support film 37.
• the support film 37 comprises polyimide denoted PI or polyethylene terephthalate denoted PET. In particular, as no welding is performed on the flexible printed circuit 30, PET is often preferred to reduce the costs of the flexible printed circuit 30.
• the flexible printed circuit 30 also comprises conductive elements 34 positioned on the support film 37.
• the conductive elements 34 comprise copper tracks 34 fixed to the flexible printed circuit 30 via an adhesive layer 33.
• the conductive elements 34 comprise a thickness of 35 micrometers.
• the conductive elements 34 of the flexible printed circuit 30 are covered with a protective film 36 (apart from the conductive tracks 34). The protective film 36 is attached above the conductive elements 34 via an adhesive layer numbered 35.
• the surface layer comprises a thickness of nickel comprised between 3 and 10 micrometers and a thickness of gold comprised between 0.5 micrometer and 2 micrometers.
• the surface layer makes it possible to prevent the oxidation of the conductive components 34, for example the copper tracks 34, which makes it possible to preserve the conductive elements 34.
• the thicknesses chosen for the Ni-Au treatment further improve the electrical resistance of the conductive elements 34 over time and also reduce the risk of friction corrosion.
• the second stiffening element 60 comprises a composite material of the FR4 or CEM type.
• the thickness of the second stiffening element 60 is preferably between 1 and 1.6 millimeters.
• the second stiffening element 60 is made of aluminum and has a thickness e2 between 0.5 and 1 millimeter.
• the local rigidity of the flexible printed circuit 30 is achieved for a minimum thickness of 0.5 millimeter.
• such an arrangement makes it possible to cut the flexible printed circuit 30 and to arrange the flexible printed circuit in a single step. The arrangement of the flexible printed circuit 30 is therefore easier to implement and is faster.
• the flexible printed circuit 30 illustrated in Figure 5 comprises a single layer of support film 37
• the flexible printed circuit 30 may include other layers of support film 37 in order to carry other layers of conductive elements 34, as long as the thickness of the flexible printed circuit 30 does not exceed a limit thickness which depends on the material considered, which in this example is 130 micrometers, so that a certain level of flexibility of the flexible printed circuit 30 in the part 38 is retained.
• Figure 6 is a schematic representation of a first example of connection member 20 used in a device 100, 200, 300 or 400 according to the present disclosure.
• connection member 20 illustrated in Figure 6 preferably comprises a spring connector 20.
• the spring connector 20 comprises a spring 22 coupled to a piston 23.
• connection element 21 corresponds to the piston 23 which comes into contact with one of the conductive elements 34 of the flexible printed circuit 30.
• the support means correspond to the spring 22 which is arranged to undergo an elastic deformation depending on the intensity of the support between the piston 23 and the flexible printed circuit 30. The elastic deformation reduces or compresses the spring 22 with respect to an initial position of the spring 22. The elastic deformation undergone by the spring 22 moves the piston 23 along a connection pad denoted C.
• connection pad C is between 0 millimeters when the spring 22 is in an initial position (ie when it is not subjected to any elastic deformation) and a predetermined value, for example between 1 millimeter and 2 millimeters, when the spring 22 is compressed (ie when the spring 22 is subjected to an elastic deformation).
• a predetermined value for example between 1 millimeter and 2 millimeters, when the spring 22 is compressed (ie when the spring 22 is subjected to an elastic deformation).
• the elastic deformation of the spring 22 in the form of compression is given along a direction 24 starting from the flexible printed circuit 30 towards the main printed circuit 10.
• the arrangement of the connection member 20 allows, for example, to mount the device 100, 200, 300 or 400 more easily in a case, in particular when this mounting is carried out “blindly”.
• blind assembly it is meant that the electrical connection made between the flexible printed circuit 30 and the main printed circuit 10 is made without specific action, for example, via an assembly of a box as explained in Figure 9
• the width of the connection pad C makes it possible in particular to take into account the different dimensional dispersions of all the elements of the device, which facilitates and improves the assembly operation.
• connection device 20 illustrated in FIG. 6 is welded to the main printed circuit 10 via welds 12.
• Figure 7 is a schematic representation of a second example of connection member 20 used in a device 100, 200, 300 or 400 according to the present disclosure.
• the connection member 20 illustrated in FIG. 7 comprises a leaf spring 25.
• the leaf spring 25 corresponds to the connection means 21 in contact with one of the conductive elements 34 of the flexible printed circuit 30.
• the leaf spring 25 is also arranged to undergo an elastic deformation depending on the intensity of the pressure between one end of the leaf spring 25 in contact with one of the conductive elements 34 of the flexible printed circuit 30.
• This means that the leaf spring 25 of FIG. 7 also corresponds to the means of support.
• the leaf spring 25 combines two functions in a single element, which makes it possible to limit the number of components to be used in the connection member 20.
• the leaf spring 25, in the example of FIG. 7, is of the shape of a dome of convex shape defined in a direction going from the flexible printed circuit 30 towards the main printed circuit 10.
• the leaf spring 25 further comprises a rigid part 26, that is to say a part which is not not arranged to undergo elastic deformation.
• the leaf spring 25 is arranged to move over a connection range C comprised between 0 millimeters when the leaf spring is in an initial position (ie when it is not subjected to any elastic deformation) and a predetermined value comprised for example between 1 millimeter and 2 millimeters when the leaf spring 25 is compressed (ie when the leaf spring 25 is subjected to an elastic deformation).
• the connection member 20 illustrated in Figure 7 is also soldered to the main printed circuit 10.
• Figure 8 illustrates a box 800.
• the box 800 includes a device 100, 200, 300, or 400 according to the present disclosure.
• the box 800 illustrated in FIG. 8 comprises a first assembly 810 comprising fastening means 81 1 for fastening the main printed circuit 10 to the first assembly 810.
• the box 800 illustrated in FIG. 8 also comprises a second assembly 820 comprising fixing means 821 for fixing the flexible printed circuit 30 to the second assembly 820.
• the second assembly 820 also comprises a button 822 arranged to exert the force F on the au at least one switch 40 causing the at least one switch 40 to close.
• the force F is produced by an actuation of the button 822 by a user, for example, by a user pressing the button 822 which by engaging will cause the closure of switch 40. Actuation of button 822 results in an actuation force denoted A in FIG. 8.
• the first set 810 and the second set 820 are fixed to each other, for example, by interlocking.
• the connection element 21 of the connection member 20 bears against one of the conductive elements 34 of the flexible printed circuit 30.
• Figure 8 describes the example of a touch screen comprising buttons, remote from a technical area in which the main printed circuit 10 is located.
• the touch screen constitutes the first assembly 810, on which the main printed circuit 10 is assembled at the bottom, in order to ensure all the electrical connections with the touch screen.
• the connection member 20 comprising spring contacts is soldered.
• the second set 820 corresponds to a rear cover of the touch screen carrying, for example, a mounting interface in a vehicle, but also buttons 822 positioned at the top of the box 800, in an upper wall of the second set 820.
• Each button 822 is associated with a switch 40.
• the switch 40 comprises the membrane 41 with an electrical contact element 42 of the metallic blister type (see FIG. 4). Switch 40 will close following actuation A of button 822.
• the case 800 is made with a flexible printed circuit 30 comprising the portion 392 of the flexible printed circuit 30 stiffened by the second aluminum stiffening element 60 and of thickness e2 of 0.5 millimeter, corresponding to the area of action of the switch 40.
• the flexible printed circuit 30, conductive elements 34 are positioned vis-à-vis each metal blister of the switch 40.
• the conductive elements 34 are for example covered with a surface layer of the Ni-Au type.
• the flexible printed circuit 30 extends along an internal wall of the second assembly 820 as far as the other portion 39 stiffened by the stiffening element 50.
• the stiffening element 50 is similar to the second stiffening element 60.
• 39 covering the stiffening element 50 comprises a part positioned vis-à-vis the connection member 20.
• the connection member 20 is of the spring contact type (see Figure 6) and is located on the main printed circuit 10.
• This portion 39 of the flexible printed circuit 30 also comprises connection pads defined by the positions of the connection element 21 of the connection member 20 on the conductive elements 34 of the flexible printed circuit 30.
• the conductive elements 34 are coated with a surface layer of Ni-Au type similar to that used in the portion 392 on which the switch 40 is positioned.
• Figure 9 is a schematic representation of a method 1000 according to the present disclosure.
• Method 1000 is a method of assembling an electronic device according to the present disclosure, for example a method of assembling a device 100, 200, 300 or 400.
• the flexible printed circuit 30 is attached to the second assembly 820 and the main printed circuit 10 is attached to the first assembly 810 of the housing 800.
• the method 1000 illustrated in FIG. 9 comprises a step 1002 of assembling the second set 820 to the first set 810 or vice versa.
• step assembly 1002 is made by bringing the second set 820 closer to the first set 810 (or vice versa) in a direction denoted M and then by fixing the second set 820 to the first set 810 (or vice versa).
• the method 1000 comprises, due to the assembly step 1002, a step 1004 of bringing said flexible printed circuit 30 closer to the main printed circuit 10 so as to obtain a connection by pressing the connection element 21 on one conductive elements 34 of the flexible printed circuit 30 supported by the stiffening element 50.
• the assembly step 1002 enabled the connection of the connection member 20 to the flexible printed circuit 30 by the support of the connection element 21 of the connection member 20 on one of the conductive elements 34 of the flexible printed circuit 30. There has therefore been a rimpedement between the flexible printed circuit 30 and the main printed circuit 10.
• the method 1000 further comprises a step 1006 of closing the switch 40 when the actuation force, denoted A, is exerted on the button 822 of the second set 820.
• the actuation of the button induces the force F on the switch 40 In this case, the switch 40 goes into its second operating state, it closes, which causes the electrical circuit to close.
• the electric circuit defined according to the present disclosure is opened again when no actuating force A is exerted on the button 822, that is to say when a user removes, for example, his finger of the button 822.
• the switch 40 then passes into its second operating state, it is open, by an internal restoring force which is activated when no actuation force A is exerted on the button 822.
• the force internal return is typically in the opposite direction to the force F mentioned above.
• the method 1000 can therefore be carried out blind, that is to say that the connection between the flexible printed circuit 30 and the main printed circuit 10 is only made by assembling the box 800 via the assembly steps 1002 and reconciliation 1004. No other specific action is necessary to make the electrical connection between the flexible printed circuit 30 and the main printed circuit 10.
• the assembly is therefore easier to implement and consequently less expensive.
• steps 1002 and 1004 have been described separately for understanding, they may in practice be performed concomitant manner.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Push-Button Switches (AREA)
• Telephone Set Structure (AREA)
• Combinations Of Printed Boards (AREA)
• Mounting Of Printed Circuit Boards And The Like (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=80736112

Family Applications (1)

Country Status (3)

Family Cites Families (3)

• 2021
  • 2021-12-21 FR FR2114162A patent/FR3131175A1/fr active Pending
• 2022
  • 2022-12-16 EP EP22835448.6A patent/EP4454425A1/de active Pending
  • 2022-12-16 WO PCT/EP2022/086481 patent/WO2023117804A1/fr not_active Ceased

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