EP4368361A1 - Procédé de fabrication d'une plaque de particules de copeaux grossiers et dispositif de fabrication de plaque de copeaux de grand diamètre - Google Patents

Procédé de fabrication d'une plaque de particules de copeaux grossiers et dispositif de fabrication de plaque de copeaux de grand diamètre Download PDF

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Publication number
EP4368361A1
EP4368361A1 EP22206413.1A EP22206413A EP4368361A1 EP 4368361 A1 EP4368361 A1 EP 4368361A1 EP 22206413 A EP22206413 A EP 22206413A EP 4368361 A1 EP4368361 A1 EP 4368361A1
Authority
EP
European Patent Office
Prior art keywords
chipboard
liquid
raw
paraffin
wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22206413.1A
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German (de)
English (en)
Inventor
Joachim Hasch
Norbert Kalwa
Georg Seidack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swiss Krono Tec AG
Original Assignee
Swiss Krono Tec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Swiss Krono Tec AG filed Critical Swiss Krono Tec AG
Priority to EP22206413.1A priority Critical patent/EP4368361A1/fr
Priority to PCT/EP2023/080942 priority patent/WO2024100015A1/fr
Publication of EP4368361A1 publication Critical patent/EP4368361A1/fr
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • B27N1/006—Pretreatment of moulding material for increasing resistance to swelling by humidity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/18—Auxiliary operations, e.g. preheating, humidifying, cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/24—Moulding or pressing characterised by using continuously acting presses having endless belts or chains moved within the compression zone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
    • B27N7/005—Coating boards, e.g. with a finishing or decorating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material

Definitions

  • the invention relates to a method for producing a coarse chipboard.
  • a coarse chipboard manufacturing device with (a) a press, in particular a belt press, for pressing at least one pre-product layer to form a raw coarse chipboard, (b) a liquid application device for applying a liquid to the raw coarse chipboard, (c) a liquid source which is connected to the liquid application device and contains the liquid and (d) a suction device which is designed to apply a negative pressure to a side surface of the raw coarse chipboard and to automatically apply the negative pressure for such a suction time that the liquid is sucked into an edge zone of the raw coarse chipboard, and/or a pressure application device for applying an overpressure to the first side surface so that the liquid is pressed into an edge zone of the raw coarse chipboard.
  • Particleboards also known as OSBs (oriented strand boards) are wood-based panels made of long, slender chips that have increased mechanical strength compared to other wood-based panels.
  • OSBs oriented strand boards
  • the disadvantage of particleboards is that they are difficult to coat and/or finish on their surface.
  • particleboards emit more gas than other wood-based panels because they are made from softwoods with a high resin content.
  • particleboards are generally sensitive to water, as this quickly penetrates the surface of the particleboard and can cause chips to swell or detach.
  • the invention is based on the object of making it possible to produce chipboards with improved properties.
  • the invention solves the problem by a method for producing a coarse chipboard with the steps (a) producing a raw coarse chipboard which has a first side surface, a second side surface which runs parallel to the first side surface, and edge surfaces which connect the side surfaces to one another, (b) applying a liquid which contains paraffin and/or wax to at least the first side surface, (c) applying a negative pressure to the second side surface so that the liquid is sucked into an edge zone of the raw coarse chipboard and/or applying an overpressure to the first side surface so that the liquid is pressed into the raw coarse chipboard, and optionally (d) heating the first side surface so that the paraffin and/or the wax melts and penetrates into the surface of the coarse chipboard.
  • the invention further solves the problem by a method for treating a raw chipboard having a first side surface, a second side surface running parallel to the first side surface, and edge surfaces connecting the side surfaces to one another, with the steps (b), (c) and (d) of claim 1.
  • the invention solves the problem by means of a generic chipboard manufacturing device in which the liquid contains paraffin and/or wax. It is advantageous if the chipboard manufacturing device has a heating device arranged behind the liquid application device in the material flow direction, which heating device is designed and arranged to automatically heat a first side surface, which is opposite the second side surface, to a temperature at which the paraffin and/or the wax melts and is not decomposed.
  • a chipboard coating device also has (a) a liquid application device for applying a liquid to the raw chipboard, (b) a liquid source which is connected to the liquid application device and contains the liquid, and (c) a suction device which is designed to apply a negative pressure to a second side surface of the raw chipboard and to automatically apply the negative pressure for such a suction time that the liquid is sucked into an edge zone of the raw chipboard and/or a pressure application device for applying an overpressure to the first side surface so that the liquid is pressed into an edge zone of the raw chipboard, wherein (d) the liquid contains paraffin and/or wax and (e) the chipboard manufacturing device has a heating device arranged behind the liquid application device in the material flow direction, which heating device is designed and arranged to automatically heat a first side surface which is opposite the second side surface to a temperature at which the paraffin and/or the wax melts and is not decomposed.
  • the chipboard coating device is also generally meant.
  • the advantage of the invention is that a chipboard with a higher resistance to water can be produced without the need to use organic solvents and/or post-crosslinking substances.
  • chip detachment can also be avoided if the chipboard comes into contact with water. This expands the range of applications for chipboard.
  • paraffin is understood to mean a mixture of acyclic alkanes. Paraffin is inert and non-toxic, which is advantageous.
  • Wax is a mixture of hydrocarbons that melt at over 40°C without decomposition and then form a liquid with low viscosity.
  • Waxes are preferably understood to be both natural waxes and industrially manufactured waxes. These include in particular animal waxes, vegetable waxes, mineral waxes, petroleum waxes and synthetic waxes. Waxes are malleable, particularly at 20°C, solid to brittle hard, coarse to fine crystalline, translucent to opaque, but not glassy. The wax is preferably selected so that it is not brittle at 20°.
  • the liquid contains paraffin and/or wax is understood to mean in particular that the liquid contains standard paraffin, intermediates, micro waxes, hard paraffin and/or mixtures thereof.
  • the liquid is preferably water-based and contains an emulsifier.
  • first side surface is heated so that the paraffin and/or the wax melts
  • the temperature of the side surface is heated, for example by infrared radiators or by means of warm air, to such an extent that the paraffin and/or the wax at least partially melts and forms a film at least in sections.
  • the liquid preferably contains an inorganic solvent.
  • the solvent is hydrophilic, in particular water-based.
  • the liquid is preferably a dispersion or an emulsion.
  • the negative pressure is applied such that the pressure on the side surface is at most 300 hPa, in particular at most 200 hPa.
  • the overpressure is applied such that the pressure on the side surface is at least 300 hPa, in particular at most 200 hPa.
  • the pressure difference between the two side surfaces is preferably at least 1000 hPa.
  • the chipboard preferably has a length of 2800 to 5600 mm and/or a width of 2000 ⁇ 100 mm.
  • the liquid is not post-crosslinking.
  • organic solvents usually have to be used, which is undesirable and can lead to environmental pollution.
  • a paraffin and/or wax layer is formed without the need for organic solvents.
  • the liquid is applied in such a quantity that the chipboard has a chipboard water vapor permeability that is at least 30%, in particular at least 40%, smaller than a raw chipboard water vapor permeability of the raw chipboard.
  • the quantity applied and/or the concentration of paraffin and/or wax in the liquid can be gradually increased until the specified criterion is met.
  • the measurement of water vapor permeability is preferably carried out in accordance with DIN 53122-1.
  • Phosphorus pentoxide can be used as a desiccant.
  • a test container filled with desiccant is sealed with a circular sample with a diameter of 9 cm. The sample runs horizontally.
  • a drop of 5 ml of water is placed centrally on the chipboard and the increase in water in the test container due to the water permeating through the sample is determined by weighing.
  • the edge of the chipboard can be sealed against moisture penetration with silicone.
  • the measurement is carried out on three independent samples.
  • the chipboard is coated with paraffin and/or wax on only one side - according to a preferred embodiment - the coated side faces away from the sample container.
  • the water vapor permeability of the chipboard is no more than 20 grams of water per square meter per day.
  • the liquid contains solid particles, for example made of a hard material.
  • the hard material preferably has a hardness of at least 530 HV 10, in particular at least 790 HV 10, in particular at least 1100 HV 10, in particular at least 1400 HV 10, in particular at least 1900 HV 10.
  • the chipboard manufacturing device prefferably has a heating device which is designed and arranged to melt the paraffin and/or the wax.
  • the grain size is between F120 and F80 (FEPA standard) and/or grain size, measured as sieve size, of 70-110 ⁇ m.
  • Slip resistance is a measure of the coefficient of static friction. For example, slip resistance is measured as the angle of inclination at which a steel block with a support surface of 40 cm x 10 cm and a mass of 500 g begins to slip.
  • the liquid contains elemental carbon, in particular soot and/or graphite.
  • the chipboard manufacturing device prefferably has a heating device that is designed and arranged to melt the paraffin and/or wax.
  • Known chipboards have a comparatively low absorption capacity for infrared radiation. By applying the liquid with elemental carbon, the absorption capacity for infrared radiation is significantly increased in a simple manner.
  • a concentration of elemental carbon in the liquid and an application amount of liquid are selected such that a coarse chipboard reflectivity of the coarse chipboard in the direction of a normal to the side surface of the coarse chipboard to which the liquid was applied at 23°C with light with a wavelength of 350 nm is at least 0.05, in particular at least 0.075, particularly preferably at least 0.1, in particular at least 0.15, smaller than a raw coarse chipboard reflectivity of the raw coarse chipboard.
  • the greater the concentration of elemental carbon and the application amount the greater the difference between the emissivity of the raw coarse chipboard and the coarse chipboard.
  • the reflectivity is determined by irradiating light of the specified wavelength, measuring the intensity of the reflected light of the same wavelength and forming the quotient of the stronger irradiated light and the reflected light intensity.
  • the liquid contains a salt.
  • the conductivity of the chipboard increases in its edge zone.
  • a concentration of the at least one salt in the liquid and an application amount of the liquid to the raw chipboard are selected such that an electrical chipboard conductivity of the chipboard is at least 50%, in particular at least 100%, greater than an electrical raw chipboard conductivity of the raw chipboard.
  • the conductivity increases with the concentration of the salt in the liquid and the application amount.
  • the concentration and the amount applied are chosen so that the conductivity of the chipboard is at least five times, or at least ten times, the conductivity of the raw chipboard.
  • the conductivity is measured by pressing two copper electrodes with a round contact surface with a diameter of 1 cm with a force of 10 Newtons in the normal direction onto the side surface to which the liquid was applied. Measurements are carried out at five different locations on the chipboard and the arithmetic mean is calculated.
  • the liquid contains a dye. This means that the chipboard can be colored with little effort.
  • the liquid is preferably applied by means of nozzles and/or rollers, for example from above or below.
  • the liquid prefferably be applied to the side surface from below.
  • the liquid preferably has contact with the side surface with its at least essentially horizontal liquid surface.
  • the overpressure is built up by means of the liquid. This is particularly advantageous if the liquid is applied to the side surface from below. However, it is often advantageous to apply the liquid from above in order to more easily detect any errors when applying the liquid.
  • the method preferably comprises the steps of (a) pressing an applicator of the pressure application device onto the raw chipboard so that an introduction space is formed between the applicator and the raw chipboard, which is sealed by a seal of the applicator, (b) pressing liquid into the introduction space and (c) then reducing an introduction pressure in the introduction space, in particular to ambient pressure.
  • the applicator is pressed against the raw chipboard from below or from above. In this way, liquid can be introduced into the raw chipboard in a process-safe manner.
  • the method comprises the steps (a) after reducing an introduction pressure, moving the applicator relative to the raw chipboard, (b) pressing the applicator again onto the raw chipboard, (c) pressing liquid into the introduction space, (d) reducing an introduction pressure (p e ) in the introduction space, in particular to ambient pressure, and (e) repeating the aforementioned steps until the raw chipboard is provided with the liquid.
  • the negative pressure is applied to a suction surface by means of a suction hood. It is advantageous if the suction surface corresponds to a pressure surface onto which the liquid is pressed.
  • the suction surface is that part of the corresponding side surface onto which the negative pressure (compared to the ambient pressure) is applied.
  • the pressure surface is correspondingly that surface of the (opposite) side surface onto which the pressure (compared to the ambient pressure) is applied.
  • suction surface corresponds to the pressure surface
  • the projection of the suction surface onto the plane in which the pressure surface extends forms an intersection with the pressure surface, the surface area of which corresponds to at least 0.75 times, in particular 0.8 times, preferably 0.85 times, particularly preferably 0.95 times, the surface area of the pressure surface.
  • the applicator is moved relative to the raw chipboard at least temporarily when the liquid is pressed in.
  • the raw chipboard is moved at least temporarily and the applicator is moved along with it. In this way, the liquid can be applied with a locally increased concentration.
  • a concentration of paraffin and/or wax and the amount applied as well as the negative pressure and the suction time are selected such that an internal concentration of paraffin and/or wax in an inner thickness quintile of a thickness extension from the first side surface to the second side surface is at most 0.8 times, in particular at most 0.6 times, preferably at most 0.4 times, particularly preferably at most 0.1 times, an external concentration in an outermost thickness quintile that extends to the first side surface.
  • an internal concentration of paraffin and/or wax in an inner thickness quintile of a thickness extension from the first side surface to the second side surface is at most 0.8 times, in particular at most 0.6 times, preferably at most 0.4 times, particularly preferably at most 0.1 times, an external concentration in an outermost thickness quintile that extends to the first side surface.
  • the liquid is preferably applied in such a way that the edge zone of at least 90% of the side surface area of the chipboard contains paraffin and/or wax. As a rule, the areas that do not have a sufficiently high paraffin and/or wax content must be removed. By applying the liquid to at least 90% of the corresponding side surface, waste is reduced.
  • the application of the liquid includes or is, for example, spraying, applying, pouring and/or flooding.
  • the application quantity is selected such that at least 75 g/m 2 , in particular at least 85 g/m 2 , particularly preferably at least 90 g/m 2 , of paraffin and/or wax is applied to the side surface. It has been shown that a good reduction in water vapor permeability can be achieved in this way.
  • a concentration of wax and/or paraffin in the liquid corresponds to at least 25 percent by weight, in particular at least 30 percent by weight, particularly preferably at least 35 percent by weight, in particular at least 40 percent by weight.
  • little solvent, in particular water is introduced into the raw chipboard, which facilitates an optional subsequent drying.
  • the liquid contains a dye.
  • This dye is preferably not elemental carbon.
  • the temperature of the liquid when applied to the side surface is below the melting temperature of the paraffin and/or wax. This prevents premature formation of large paraffin and/or wax particles.
  • the first side surface is heated to a temperature of at least 50°C. This way, the paraffin melts sufficiently quickly.
  • the method comprises the steps of (a) rotating the raw chipboard after introducing the liquid into the edge zone of the first side surface, (b) applying the liquid to the second side surface and (c) applying a negative pressure to the first side surface so that the liquid is sucked into an edge zone of the second side surface of the raw chipboard so that the chipboard is formed.
  • the suction device is designed to automatically apply the negative pressure for such a suction time that the liquid is not sucked through the raw, coarse chipboard.
  • the pressure application device is designed to automatically apply the positive pressure for such a positive pressure time that the liquid is not forced through the raw, coarse chipboard.
  • the pressure application device is designed to apply the overpressure to a pressure surface which is at least 50%, preferably at least 80%, particularly preferably at least 90%, of an area of the chipboard. In this way, the liquid can be quickly introduced into the raw chipboard.
  • the coarse chipboard manufacturing device has (a) an applicator which is designed to press against the raw coarse chipboard so that an introduction space is formed between the applicator and the raw coarse chipboard, which is sealed by a seal of the applicator, and (b) a control unit which is designed to automatically carry out a method with the steps of controlling the applicator (i) so that it presses liquid into the introduction space, and (ii) then reducing an introduction pressure in the introduction space, in particular to ambient pressure.
  • the applicator has an actuator for pressing the applicator against the raw chipboard.
  • the suction device is preferably arranged to apply a negative pressure to a suction surface which corresponds to the pressure surface.
  • a chipboard which has an internal concentration of paraffin and/or wax in an inner thickness quintile of a thickness extension from the first side surface to the second side surface which corresponds to at most 0.5 times, in particular at most 0.25 times, particularly preferably at most 0.1 times, an external concentration in a first outermost thickness quintile which extends to the first side surface.
  • a second decile concentration of paraffin and/or wax in the second thickness decile of the thickness extension which lies in the direction of a center of the thickness extension next to the first, outermost thickness decile (D1), is at most 0.5 times, in particular at most 0.25 times, and preferably at most 0.1 times, the outer concentration.
  • Such a coarse chipboard has a low water vapor permeability with a comparatively low content of paraffin and/or wax.
  • elemental carbon in particular carbon black or graphite, is applied to at least 50% of the side surface.
  • the chipboard preferably has at least 30 g per square meter of hard material particles having a grain size between 70 and 150 ⁇ m, wherein the hard material particles are bound to coarse chips by paraffin and/or wax.
  • the area-specific application rate of elemental carbon is at least 10 g/m 2 and/or at most 100 g/m 2 .
  • the thickness of the chipboard is preferably between 8 and 35 mm.
  • Figure 1 shows schematically a coarse chipboard manufacturing device 10, which has a press 12 in the form of a continuous belt press for pressing at least one pre-product layer 14, in the present case 3 pre-product layers 14.1, 14.2, 14.3, into a raw coarse chipboard 16.
  • the at least one pre-product layer 14 is produced by a spreading device 18.
  • the spreading device 18 comprises a first spreader 20.1 for spreading the first pre-product layer 14.1 in the form of a first cover chip layer, a second spreader 20.2 for spreading a second pre-product layer 14.2 in the form of a middle chip layer and a third spreader 20.3 for spreading a third pre-product layer 14.3 in the form of a second cover chip layer.
  • the resulting raw chipboard has a first cover layer 22.1, a middle layer 22.2 and a second cover layer 22.3.
  • a liquid application device 32 is arranged in a material flow direction behind the press 12, by means of which a liquid 34 is applied to a first side surface S1 of the raw chipboard 16.
  • the liquid application device 32 comprises a liquid reservoir 38 and a pump 40, by means of which the liquid 34 is fed under a liquid pressure p 34 to at least one nozzle 41.
  • the nozzle 41 generates a spray mist 42, which settles on the first side surface S1.
  • the nozzle 41 can be part of a nozzle bar 43 (see Figure 2 ) having 2, 3 or more nozzles.
  • the liquid application device 32 may have a tempering device 45 which keeps the liquid 34 at a predetermined temperature T34.
  • the liquid 34 is a suspension or emulsion and contains paraffin and/or wax as well as solid particles.
  • the solid particles are made of corundum and have a particle size F 120 according to the FEPA standard.
  • a heating device 37 is arranged behind the liquid application device 32 in the material flow direction M, which has, for example, at least one infrared radiator 37a, 37b.
  • a liquid layer 39 which is formed by the liquid on the raw chipboard 18, is dried by means of the heating device 37.
  • the paraffin and/or the wax in the liquid layer 38 is heated to such an extent that it melts. In this way, a thin paraffin/wax layer 39' is formed.
  • the negative pressure sucks the liquid 34 into a first edge zone 50.1 of the raw chipboard 16.
  • FIG. 2 shows an enlarged view of the suction device 36.
  • the suction chamber 46 is connected to a vacuum pump 52 by means of a vacuum line 49.
  • the liquid 34 can be applied to the first side surface S1 by means of an application roller 53 or another device as an alternative or in addition to the at least one nozzle 41.
  • Figure 3 a shows schematically a cross section through a chipboard 54 according to the invention, which has a first edge surface K1 and a second edge surface K2.
  • the course of a concentration c PW of paraffin and/or wax in the chipboard 54 is given as a function of the distance z from the respective closest side surface S1, S2. It can be seen that the concentration c PW,Q1 in the first, i.e. outermost quintile Q1 is significantly greater, in particular by a factor of 10 or more, than in an inner thickness quintile Q3, i.e. the quintile with the greatest distance to both side surfaces S1, S2. It is possible that - as in Figure 3b shown - paraffin and/or wax is applied to only one side of the chipboard 54. If, as provided according to a preferred embodiment, the raw chipboard 16 is turned over after the application of the liquid 34 and the liquid 34 is applied to the opposite side, the course of the concentration c FP shown with a dashed line, for example, results.
  • Figure 3 c shows a division into deciles. It can be seen that a second decile concentration c PW,D2 of paraffin and/or wax in the second decile D2, which lies in the direction of a center of the thickness extension next to the first, outermost thickness decile D1, can be smaller than a third of a first decile concentration c PW,D1 .
  • Figure 4 shows a liquid application device 32 of a chipboard manufacturing device 10 according to the invention, which has a pressure application device 56, which uses the pump 40 to force liquid 34 from the liquid reservoir 38 into an introduction chamber 58 under an introduction pressure p E.
  • the introduction chamber 58 is delimited by a seal 60 of the pressure application device 56.
  • the pressure application device 56 can be used to apply the liquid 34 as in Figure 4 shown can be formed from below or from above.
  • FIG. 5 shows schematically that the suction device 36 can be designed to apply a local negative pressure.
  • a suction surface Fs is smaller than the surface of the raw chipboard 16.
  • the suction surface Fs is smaller than a tenth of the surface of the raw chipboard 16.
  • the wood-based panel manufacturing device can also have a second suction device 36', which is preferably structurally identical to the first suction device 36.
  • a pressure surface F D on which the pressure application device 56 is applied to the introduction pressure p e , corresponds essentially, for example with a deviation of at most a factor of 2, in particular at most a factor of 1.1, in particular at most a factor of 1.25, to the suction surface Fs.
  • Figure 6a shows a positioning device 62, for example a robot, for positioning an applicator 64 and for pressing the applicator 64 against the raw chipboard 16.
  • the positioning device 62 has, for example, an arm 66.
  • the arm 66 can have 2 or more partial arms 68.1, 68.2, which can be connected to one another in an articulated manner.
  • a drive 70 By means of a drive 70, the applicator 64 can be automatically positioned at a predeterminable position relative to the raw chipboard 16.
  • the applicator 64 is supplied with pressurized liquid 34, which is sprayed onto the raw chipboard 16 and/or pressed into the raw chipboard 16 under pressure.
  • the wood-based panel manufacturing device 10 can have a suction device 36, which has a suction hood 47 that can be positioned at a predeterminable location.
  • the suction device 36 is designed such that the suction hood 47 is always arranged opposite the applicator 64.
  • the drive 70 is driven by a Control unit 76 of the wood-based panel manufacturing device 10 is controlled accordingly.
  • the suction hood 47 is connected to the vacuum pump 52 by means of a flexible vacuum line.
  • Figure 6c shows a further embodiment of a pressure application device 56, in which the liquid 34 containing flame retardant is introduced into the introduction chamber 58 by means of a nozzle 78.
  • the introduction pressure p e can be adjusted by means of a pressure source 80, which is connected to the introduction chamber 58 via a pressure line 82.
  • the control unit 76 is used in all embodiments of the particle board manufacturing device 10 to control the suction device 36 and/or the pressure application device 56 such that a predetermined negative pressure for a predetermined suction time t suction and/or a predetermined positive pressure for a predetermined positive pressure time t pressure is applied to the raw particle board 16.
  • the chipboard is tested using a water application test. 5 ml of water is placed on the surface and covered with a watch glass. An untreated chipboard was also tested. While the water was absorbed into the untreated chipboard after one hour, the water could be recovered from the treated OSB after two days.
  • a water vapor permeability test based on DIN 53122-1 was also carried out.
  • the outside climate was 90% relative humidity, 23°C.
  • the flask on which the sample was placed contained phosphorus pentoxide as a drying agent.
  • the values were 16 g/m2 ⁇ d (paraffin coating) and 29 g/(m 2 ⁇ d) (zero sample).
  • the water vapor permeability could therefore be almost halved with this coating.
  • the water permeability can be controlled by varying the amount of paraffin applied.
  • the solid content of the emulsion/dispersion is 50 percent by weight.
  • the board is dried using a heating device 37 in the form of an infrared radiator and the wax is melted so that it is better distributed over the surface and the solid particles are well integrated into the paraffin film.
  • a soft paraffin, a micro wax or a hard paraffin can be used.
  • a second chipboard is equipped with the same amount of glass beads instead of corundum. Their grain size is between 70 and 110 ⁇ m.
  • Another chipboard was made without hard particles and only with paraffin. A chipboard without surface treatment was also tested. The slip resistance of all chipboards was then determined using a small metal block (500 g). The metal block was placed on one end of a 40 cm long and 10 cm wide test specimen and then the chipboard was slowly moved upwards at this end. The angle of inclination at which the piece of metal begins to slip is the measure of the slip resistance. This was tested both in dry and wet conditions. For the wet measurement, 100 g of water per square meter was applied.
  • Table 1 Slip test Height [cm] Angle [°] dry wet Blind tasting Emulsion 50 g paraffin solid / m 2 Emulsion (50 g paraffin solid/m 2 ) + glass (70-100 ⁇ m) Emulsion (50g solid/m 2 ) + Corundum (F 120, FEPA standard) Emulsion (50g solid /m 2 ) + Corundum (F 80, FEPA standard) 13 15 dry + + + + + + wet + + + + 15 17 dry - + + + + + + + + + 15 17 dry - + + + + wet + + + + 17 20 dry - - - + + wet + + + - + 19 23 dry - - - + + wet + - - + + 20 24 dry - - - + + wet - - - + 22 27 dry - - - - + wet

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
EP22206413.1A 2022-11-09 2022-11-09 Procédé de fabrication d'une plaque de particules de copeaux grossiers et dispositif de fabrication de plaque de copeaux de grand diamètre Pending EP4368361A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP22206413.1A EP4368361A1 (fr) 2022-11-09 2022-11-09 Procédé de fabrication d'une plaque de particules de copeaux grossiers et dispositif de fabrication de plaque de copeaux de grand diamètre
PCT/EP2023/080942 WO2024100015A1 (fr) 2022-11-09 2023-11-07 Procédé de production d'un panneau de copeaux orientés et dispositif de production de panneaux de copeaux orientés

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EP22206413.1A EP4368361A1 (fr) 2022-11-09 2022-11-09 Procédé de fabrication d'une plaque de particules de copeaux grossiers et dispositif de fabrication de plaque de copeaux de grand diamètre

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070122644A1 (en) * 2005-11-29 2007-05-31 Timtek Australia Pty, Ltd. System and Method For The Preservative Treatment of Engineered Wood Products
EP3127670A2 (fr) * 2012-01-31 2017-02-08 Flooring Technologies Ltd. Procédé d'imprégnation de plaques de matière première

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070122644A1 (en) * 2005-11-29 2007-05-31 Timtek Australia Pty, Ltd. System and Method For The Preservative Treatment of Engineered Wood Products
EP3127670A2 (fr) * 2012-01-31 2017-02-08 Flooring Technologies Ltd. Procédé d'imprégnation de plaques de matière première

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