Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
  • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
  • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
  • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
  • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

• TITLE Electronic system comprising a pre-existing access structure and method of manufacturing such a system
• the present invention relates to an electronic system comprising an initial electronic device connected by a lower connection terminal and an upper connection terminal.
• the invention also relates to a method of manufacturing such an electronic system.
• the luminous elements constituting the screen must be arranged in a matrix fashion.
• the precision necessary for the formation of such a matrix increases as the resolution expected for the screens increases.
• each light-emitting diode In the case where the light-emitting diodes are separated by a distance of less than about ten microns, the electrical connection of each light-emitting diode remains difficult to achieve without risk of unintentional short-circuit, due to the small distance which separates them.
• the light-emitting diodes are three-dimensional, typically of wire shape which is a very advantageous shape, obtaining an electrical connection of their upper part is difficult due to their micrometric or even nanometric dimensions.
• An additional problem encountered during the transfer of the luminous elements is that the precise positioning of the luminous elements at the level of the second support is not guaranteed with certainty due to the increasingly small dimensions of the luminous elements and the electrical connections to obtain the best possible resolution for the luminous display proposed by the optoelectronic device.
• the usual techniques for resuming electrical contacts on the luminous elements are not satisfactory because the positioning defects are random and according to an error range that is too high with respect to the dimensions of the luminous elements and of the electrical connections.
• luminous elements each in the form of a "smart-pixel" (which comprises at least one light-emitting diode having an active part capable of emitting light when a current passes through the active part and an electronic control device configured to modulate at least one emission parameter associated with at least one of the light-emitting diodes that the luminous element comprises) having a lower connection terminal intended to be electrically connected to a lower electrically conductive element and an upper connection terminal intended to be connected to an upper electrically conductive element.
• a “smart-pixel” which comprises at least one light-emitting diode having an active part capable of emitting light when a current passes through the active part and an electronic control device configured to modulate at least one emission parameter associated with at least one of the light-emitting diodes that the luminous element comprises
• the fact of then being able to arrange the upper and lower electrically conductive elements respectively on either side of an insulating encapsulation layer in which the smart pixels are embedded guarantees a reduction in the precision required of the positioning of the smart pixels by relative to the upper and lower electrically conductive elements.
• the purpose of the present invention is to propose a solution which responds to all or part of the aforementioned problems:
• an electronic system comprising: a support having an upper surface; at least one initial electronic device comprising a lower connection terminal and an upper connection terminal, said lower and upper connection terminals being located at opposite ends of the initial electronic device; a lower electrically conductive element formed on the upper surface of said support and configured to be electrically connected to the lower connection terminal of said at least one initial electronic device; - an intermediate electrical insulation layer having a lower face facing the upper surface of the support, so as to cover all or part of the lower electrically conductive element, said intermediate electrical insulation layer being configured to cooperate with the electronic device initial in a way providing electrical insulation between the lower electrically conductive element and the upper connection terminal; at least one upper electrically conductive element formed on an upper face of the intermediate electrical insulation layer, on the side opposite the lower electrically conductive element with respect to the intermediate electrical insulation layer, said at least one upper electrically conductive element being configured to be connected to the upper connection terminal of said at least one initial electronic device; a pre-existing structure providing access to the lower electrically conductive
• the pre-existing structure can confer electrical access by an electrical connection with the lower electrically conductive element from the upper face of the intermediate electrical insulation layer.
• Said electrical connection can for example be made with using solder bumps, solder paste, laser-welded nickel-gold pads, an ACF film (anisotropic conductive film), or indium balls.
• the electronic system may also have one or more of the following characteristics, taken alone or in combination.
• the pre-existing structure opens at the level of the upper face of the intermediate electrical insulation layer into an access zone, said access zone being separate from the upper electrically conductive element.
• the pre-existing structure is separate from the upper connection terminal and/or from the upper electrically conductive element.
• the lower and upper connection terminals of the initial electronic device are located on opposite faces of the initial electronic device.
• the at least one initial electronic device is encapsulated in the intermediate electrical insulation layer.
• the at least one initial electronic device is embedded in the intermediate electrical insulation layer.
• the intervening electrical insulation layer may be made of a planarizing material configured to encapsulate a plurality of initial electronic devices.
• the pre-existing structure comprises a transverse duct passing transversely through the intermediate electrical insulation layer, and defining a passage through the intermediate electrical insulation layer between the lower electrically conductive element and an upper orifice opening onto the upper face of the intermediate electrical insulation layer.
• the electronic system comprises an intermediate connector arranged inside a volume delimited by the transverse duct, said intermediate connector being in electrical connection with the lower electrically conductive element, and emerging through the orifice top of the transverse duct.
• the spacer connector comprises a metal deposited in the transverse duct so as to fill all or part of a volume defined by the transverse duct.
• At least a part of the upper face of the intermediate electrical insulation layer and at least a part of the at least one upper electrically conductive element define a reception location configured to receive an auxiliary electronic device which is capable of functionally replacing the initial electronic device.
• the electronic system comprises at least two reception slots, said reception slots being defined by two distinct zones each covering part of the at least one upper electrically conductive element and at least part of the upper face of the intermediate electrical insulation layer. In this way it is possible to proceed with the installation of several auxiliary electronic devices on each reception location.
• the transverse duct makes it possible to connect the auxiliary electronic device to the lower electrically conductive element.
• the auxiliary electronic device can be connected to the upper electrically conductive element.
• the auxiliary electronic device is an electronic device identical to the initial electronic device, or of the same nature as the initial electronic device.
• devices of the same nature electronic devices capable of performing the same function.
• devices of the same nature can be devices capable of emitting light, and/or devices capable of capturing light, and/or devices capable of emitting light at a given wavelength. It is therefore well understood that devices of the same nature may have different dimensions and/or a different structure as long as they perform the same function.
• the auxiliary electronic device comprises a primary connection terminal configured to be electrically connected to the lower electrically conductive element, and a secondary connection terminal configured to be electrically connected to the upper electrically conductive element.
• the auxiliary electronic device is contained in a volume greater than that in which the initial electronic device is contained.
• the auxiliary electronic device can have a micrometric dimension. In this way, it is easier to handle the auxiliary electronic device in order to position it on the reception location.
• the auxiliary electronic device comprises the spacer connector.
• the auxiliary electronic device comprises a primary connection terminal configured to be electrically connected to the lower electrically conductive element, and a secondary connection terminal configured to be electrically connected to the upper electrically conductive element, said terminal primary connection and secondary connection terminal being arranged on a connection face of the auxiliary electronic device arranged facing the upper face of the intermediate electrical insulation layer.
• the primary and secondary connection terminals of the auxiliary electronic device can be arranged on the same connection face of the auxiliary electronic device, said face connection being oriented towards the upper face of the intermediate electrical insulation layer.
• the auxiliary electronic device defines a volume strictly greater than a volume defined by the at least one initial electronic device.
• each auxiliary electronic device is larger than the initial electronic device that it is intended to replace.
• the largest dimension of the auxiliary electronic device is strictly greater than the largest dimension of the at least one initial electronic device.
• the spacer connector can be provided on the auxiliary electronic device so as to be able to be inserted into the transverse duct.
• the electronic system comprises an electrical connection member configured to ensure an electrical connection between the auxiliary electronic device and the spacer connector.
• the connection member can be included on the primary connection terminal of the auxiliary electronic device.
• the electrical connection member can be included on the intermediate connector, or deposited on the upper face of the intermediate electrical insulation layer so as to be electrically connected to the intermediate connector.
• the electronic system comprises an auxiliary electronic device, said auxiliary electronic device comprising a primary connection terminal, and being configured to be able to be inserted into the transverse conduit in a way ensuring an electrical connection between the primary connection and the lower electrically conductive element.
• electrical connection is meant a connection made by solder bumps, solder paste, laser-welded nickel-gold pads, an ACF film (anisotropic conductive film), or indium balls.
• the primary and secondary connection terminals are located at opposite ends of the auxiliary electronic device.
• the auxiliary electronic device is identical or of the same type as the initial electronic device.
• the auxiliary electronic device is provided to have an external contour dimension strictly less than an internal dimension of the transverse duct, in order to be able to be inserted into the transverse duct.
• the transverse duct passes through the upper electrically conductive element.
• the auxiliary electronic device can be inserted into the transverse duct in a way providing an electrical connection between the primary connection terminal and the lower electrically conductive element.
• the electronic system comprises: a first initial electronic device comprising a first upper connection terminal and a first lower connection terminal, and a second initial electronic device distinct from the first initial electronic device, and comprising a second upper connection terminal and a second lower connection terminal; said first and second lower connection terminals being electrically connected to each other via the lower electrically conductive element.
• the electronic system comprises: a first upper electrically conductive element in electrical connection with the first upper connection terminal; and a second upper electrically conductive element, distinct from the first upper electrically conductive element, in electrical connection with the second upper connection terminal; the pre-existing structure emerging on the upper face of the intermediate electrical insulation layer in a zone located between the first upper electrically conductive element and the second upper electrically conductive element.
• the initial electronic device is an optoelectronic device comprising an electroluminescent element.
• the light-emitting element can comprise at least one light-emitting diode able to emit and/or pick up light, and optionally an electronic control component associated with said at least one light-emitting diode, such as for example a transistor.
• the electronic system can comprise a number of lower electrically conductive elements which is greater than or equal to two.
• each lower electrically conductive element comprises several electrically conductive tracks extending substantially parallel to each other
• each upper electrically conductive element comprises several electrically conductive tracks extending substantially parallel to each other
• the electrically conductive tracks conductors of the lower electrically conductive element extend substantially perpendicular to the electrically conductive tracks of the upper electrically conductive element.
• the electronic system is made in accordance with one of the embodiments described in the document WO2019008262, the content of which is incorporated by reference within the limits permitted by law.
• a first upper electrically conductive element can be placed in electrical connection with the first upper connection terminal of a first initial electronic device, and a second upper electrically conductive element can be placed in electrical connection with the second terminal of upper connection of a second initial electronic device.
• the initial electronic devices arranged on the same line will be connected to the same electrically conductive track of the lower electrically conductive element, and connected to two different electrically conductive tracks of the upper electrically conductive element; and the initial electronic devices arranged on the same column will be connected to the same electrically conductive track of the upper electrically conductive element, and connected to two different electrically conductive tracks of the lower electrically conductive element.
• the object of the invention can also be achieved through the implementation of a method for manufacturing an electronic system comprising the following steps: a step of providing an electronic system comprising a support having an initial surface , at least one initial electronic device, and an intermediate electrical insulation layer, said initial electronic device comprising a lower connection terminal and an upper connection terminal, said lower and upper connection terminals being located at opposite ends of the electronic device initial, said intermediate electrical insulation layer having a lower face turned towards the initial surface of the support, so as to cover all or part of a lower electrically conductive element which is in electrical connection with the lower connection terminal of the initial electronic device; a step of depositing at least one upper electrically conductive element on an upper face of the intermediate electrical insulation layer, on the side opposite the lower electrically conductive element with respect to the intermediate electrical insulation layer, with a manner ensuring an electrical connection between the upper connection terminal of said at least one initial electronic device and said upper electrically conductive element, a step of forming a pre-existing structure giving access to the lower electrically conductive element from the upper face of the intermediate electrical
• connection terminals are located at opposite ends of the initial electronic device, opposite in a transverse direction oriented orthogonally to the initial surface of the support.
• the upper orifice opens onto the upper face of the intermediate electrical insulation layer on the side of the at least one upper electrically conductive element.
• the steps previously described make it possible to propose a method of manufacturing an electronic system comprising means for allowing the repair of a defective initial electronic device.
• the step of forming the transverse duct for example by etching the intermediate electrical insulation layer, makes it possible to achieve access to the lower electrically conductive element, in particular after a step of depositing the insulation layer spacer electric.
• the manufacturing method may also have one or more of the following characteristics, taken alone or in combination.
• the step of forming a pre-existing structure comprises a step of forming a transverse conduit, made in the intermediate electrical insulation layer, so as to define a passage through the insulation layer electrical spacer between the lower electrically conductive element and an upper orifice opening onto the upper face of the spacer electrical insulation layer.
• the step of forming the transverse duct is also implemented through the upper electrically conductive element.
• the manufacturing method comprises a step of checking the initial electronic device implemented after the step of forming the transverse duct, in which the initial electronic device is supplied with electrical energy so as to determine whether said device initial electronics is faulty.
• the step of checking the initial electronic device can comprise the measurement of a current flowing through the initial electronic device, or can comprise the measurement of a voltage at the connection terminals of the initial electronic device.
• the step of controlling the initial electronic device may comprise placing the initial electronic device in a mode where it emits light radiation, then detecting said light radiation by through an optical sensor.
• the manufacturing method further comprises a repair phase comprising the following steps: a step of providing an auxiliary electronic device capable of functionally replacing the initial electronic device; a step of positioning said auxiliary electronic device on a reception location, said reception location covering at least part of the upper electrically conductive element, and at least part of the upper face of the insulation layer electric spacer, said step of positioning the auxiliary electronic device being implemented in a way ensuring electrical contact between a primary connection terminal of the auxiliary electronic device and the upper electrically conductive element; a connection step, in which a primary connection terminal of the auxiliary electronic device is electrically connected with the lower electrically conductive element via an intermediate connector which is able to pass through a volume delimited by the transverse duct.
• the "electrical contact" ensured during the step of positioning the auxiliary electronic device on the reception location, or the “electrical connection” of the primary connection terminal of the auxiliary electronic device with the lower electrically conductive member is made by connecting with solder bumps, solder paste, laser-welded nickel-gold pads, anisotropic conductive film (ACF), or indium balls.
• the arrangements previously described make it possible to propose a manufacturing method comprising a repair phase during which a defective initial electronic device can be functionally replaced by an auxiliary electronic device.
• the reception location can be provided to have a sufficiently wide reception surface to accommodate the auxiliary electronic device.
• the installation of the auxiliary electronic device can be carried out individually and easily, and in particular after having encapsulated all the initial electronic devices.
• the auxiliary electronic device comprises the spacer connector in electrical connection with the primary connection terminal of the auxiliary electronic device in a way allowing the implementation of the connection step.
• the manufacturing method further comprises a step of depositing the spacer connector, in which a conductive material is deposited in the transverse duct so as to create an electrical connection between said spacer connector and the lower electrically conductive element , and so that the spacer connector opens through the upper orifice of the transverse duct.
• the step of depositing the spacer connector comprises the formation of an electrical connection member configured to ensure an electrical connection between the auxiliary electronic device and the spacer connector.
• the electrical connection member can be deposited on the upper face of the intermediate electrical insulation layer during the step of depositing the intermediate connector so as to be electrically connected to the intermediate connector.
• the step of depositing at least one upper electrically conductive element is implemented at the same time as the step of depositing the intermediate connector.
• the connection step is implemented by placing the secondary connection terminal in electrical connection with the upper electrically conductive element, and by placing the primary connection terminal in electrical connection with the intermediate connector opening out through the upper orifice of the transverse duct.
• the connection step can be simply implemented by the electrical connection of the secondary connection terminal with the upper electrically conductive element, and by the electrical connection of the primary connection terminal with the connection member.
• the connection step is implemented by the electrical connection of the primary and secondary terminals of the auxiliary electronic device on existing electronic tracks. In this way, it is not necessary to deposit additional metal when the auxiliary electronic device is put in place to replace the initial electronic device. The repair of the initial electronic device is therefore carried out by placing the auxiliary electronic device in the right place, that is to say by electrically connecting the secondary connection terminal with the upper electrically conductive element, and by electrically connecting the primary connection terminal with the connection member.
• the manufacturing method comprises a step of depositing a transparent conductive electrode implemented before the step of depositing at least one upper electrically conductive element, in which a transparent conductive electrode is deposited at the level of the upper connection terminal of the initial electronic device.
• the manufacturing method comprises a disconnection step, in which the electrical connection between the upper connection terminal of the initial electronic device and the upper electrically conductive element is broken, in particular by laser etching.
• the step of providing the electronic system comprises the following steps: a step of providing the support having the upper surface; a step of depositing the lower electrically conductive element on the upper surface of the support; a step of positioning the initial electronic device on the upper surface in a way ensuring an electrical connection between the lower connection terminal of the initial electronic device and the lower electrically conductive element; a step of depositing the intermediate electrical insulation layer on all or part of the upper surface of the support so as to cover the initial electronic device and the lower electrically conductive element; a step of selective etching of the intermediate electrical insulation layer in which the intermediate electrical insulation layer is etched so as to provide access to the upper connection terminal of the initial electronic device.
• the step of making the electronic system available includes a step of depositing a securing means, for example an adhesive.
• the securing means being configured to secure the initial electronic device to the upper surface of the support.
• the step of positioning the initial electronic device comprises the distribution of a plurality of initial electronic devices on the upper surface of the support according to a predetermined spacing.
• the predetermined spacing can be defined as the spacing separating two electronic devices on the support.
• the predetermined spacing can be between 50 ⁇ m and 2 mm, and more particularly substantially equal to 100 ⁇ m.
• the step of forming the transverse duct is carried out during the step of selective etching of the intermediate electrical insulation layer.
• the conductive transparent electrode allows both to ensure the electrical contact of the upper connection terminal with the upper electrically conductive element, and to allow the transmission of the light radiation emitted by the optoelectronic device.
• the step of selective etching of the intermediate electrical insulation layer comprises the following steps: a step of depositing a layer of photoresist on the intermediate electrical insulation layer; a step of irradiating the layer of photoresist with light radiation through a lithography mask, said lithography mask defining primary zones intended to be irradiated by the light radiation, and secondary zones intended to be protected by the lithography mask against the irradiation of said light radiation; a step of developing the layer of photoresist in which the photoresist is removed at the level of the primary zones or at the level of the secondary zones, so that the intermediate electrical insulation layer is no longer covered with photoresist at the level of said zones where the layer resin has been removed, and so that the intermediate electrical insulation layer is covered with the layer of photoresist on the other areas; an etching step in which an etching of the intermediate electrical insulation layer is carried out at the level of the zones not covered by the photoresist layer, and in which an etching of the photore
• the manufacturing method further comprises a protection step comprising the deposition of an insulating protective layer on the auxiliary electronic device.
• said protection step can comprise the encapsulation of the auxiliary electronic device by an insulating protective layer whose surface corresponds, to within 10%, to a surface occupied by the auxiliary electronic device.
• the insulating protective layer can be deposited punctually at the level of each auxiliary electronic device to be protected.
• said protection step can comprise the encapsulation of the whole of the upper face of the intermediate electrical insulation layer, or of the whole of the electronic system.
• the protection step is implemented after the connection step.
• the protective insulating layer makes it possible both to encapsulate the auxiliary electronic devices, but also to block access to the lower electrically conductive element from the upper face of the intermediate electrical insulation layer.
• Figure 1 is a schematic sectional view of an electronic system according to a particular embodiment of the invention.
• Figure 2 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, sectional views and top views.
• Figure 3 is a schematic view of the step of setting up the initial electronic device according to one embodiment of the invention, seen in section and from above.
• Figure 4 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, seen in section.
• Figure 5 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, seen in section.
• Figure 6 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, sectional views and top views.
• Figure 7 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, sectional views and top views.
• Figure 8 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, seen in section.
• FIG. 9 is a schematic view of the initial electronic device control step according to one embodiment of the invention, seen in section.
• Figure 10 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, seen in section.
• Figure 11 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, seen in section.
• Figure 12 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, seen in section.
• Figure 13 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, seen in section.
• Figure 14 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, seen from above.
• Figure 15 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, seen in section.
• Figure 16 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, sectional views and top views.
• Figure 17 is a schematic view of certain steps of the manufacturing process according to one embodiment of the invention, sectional views and top views.
• the invention first relates to an electronic system 10 comprising a support 1 having an upper surface SI and at least one initial electronic device 7.
• the initial electronic device 7 may be an optoelectronic device comprising a light-emitting element.
• Said light-emitting element may comprise at least one light-emitting diode LED able to emit and/or pick up light, and optionally an electronic control component associated with said at least one light-emitting diode, such as for example a transistor.
• the at least one initial electronic device 7 comprises a lower connection terminal 9 and an upper connection terminal 11.
• the lower 9 and upper 11 connection terminals are located at opposite ends of the initial electronic device 7, and in particular on faces opposites of initial electronic device 7.
• Said lower 9 and upper 11 connection terminals are generally configured to make it possible to supply electrical energy to the initial electronic device 7.
• the lower and upper connection terminals 9, 11 are located at opposite ends of the initial electronic device 7, opposite in a transverse direction denoted "Z", oriented orthogonally to the upper surface SI of the support 1.
• the electronic system 10 can comprise a plurality of initial electronic devices 7a, 7b.
• the electronic system 10 can comprise a first initial electronic device 7a comprising a first upper connection terminal 11a and a first lower connection terminal 9a, and a second initial electronic device 7b distinct from the first initial electronic device 7a, and comprising a second upper connection terminal 11b and a second lower connection terminal 9b.
• the predetermined spacing D can be defined as the spacing separating two initial electronic devices 7 on the support 1 at the end of a manufacturing process.
• the predetermined spacing D can be between 50 ⁇ m and 2 mm, and more particularly substantially equal to 100 ⁇ m.
• the electronic system 10 also comprises a lower electrically conductive element 3 formed on the upper surface SI of the support 1. Said lower electrically conductive element 3 is configured to be electrically connected to the lower connection terminal 9 of said at least one initial electronic device 7
• the first and second lower connection terminals 9a, 9b can be electrically connected to each other via the element electrically conductive lower 3.
• each lower electrically conductive element 3 can comprise several electrically conductive tracks extending substantially parallel to each other, on which can be connected the lower connection terminals 9a, 9b of the initial electronic devices 7a, 7b .
• the electronic system 10 further comprises an intermediate electrical insulation layer 5 having a lower face facing the upper surface SI of the support 1, so as to cover all or part of the lower electrically conductive element 3.
• Said insulation layer electrical spacer 5 is also configured to cooperate with the initial electronic device 7 in a way ensuring electrical insulation between the lower electrically conductive element 3 and the upper connection terminal 11.
• the intermediate electrical insulation layer 5 consists of an electrically insulating material.
• the intermediate electrical insulation layer 5 may consist of a planarization material configured to encapsulate a plurality of initial electronic devices 7a, 7b.
• the electronic system also comprises at least one upper electrically conductive element 13 formed on an upper face of the intermediate electrical insulation layer 5, on the side opposite the lower electrically conductive element 3 with respect to the intermediate electrical insulation layer 5.
• Said at least one upper electrically conductive element 13 is configured to be connected to the upper connection terminal 11 of said at least one initial electronic device 7.
• each upper electrically conductive element 13 comprises several electrically conductive tracks extending substantially parallel to each other. These electrically conductive tracks of the lower electrically conductive element 3 can for example extend substantially perpendicular to the electrically conductive tracks of the upper electrically conductive element 13. In this way, it is possible to connect the initial electronic devices 7 individually and to matrix manner via the lower and upper electrically conductive elements 3, 13.
• a first upper electrically conductive element 13a can be placed in electrical connection with the first upper connection terminal 11a of a first initial electronic device 7a
• a second upper electrically conductive element 13b separate from the first upper electrically conductive element 13a, can be placed in electrical connection with the second upper connection terminal 11b of a second initial electronic device 7b.
• the initial electronic devices 7 arranged on the same line will be connected to the same electrically conductive track of the lower electrically conductive element 3, and connected to two different electrically conductive tracks of the upper electrically conductive element 13; and the initial electronic devices 7 arranged on the same column will be connected to the same electrically conductive track of the upper electrically conductive element 13, and connected to two different electrically conductive tracks of the lower electrically conductive element 3.
• the electronic system 10 also comprises a pre-existing structure giving access to the lower electrically conductive element 3 from the upper face of the intermediate electrical insulation layer 5.
• the pre-existing structure emerges at the level of the face upper part of the intermediate electrical insulation layer 5 in an access zone, said access zone being separated from the upper electrically conductive element 13.
• the pre-existing structure is separate from the upper connection terminal 11 and/or from the upper electrically conductive element 13.
• the pre-existing structure comprises a transverse conduit 15 passing transversely through the intermediate electrical insulation layer 5, and defining a passage through the intermediate electrical insulation layer 5 between the electrically conductive element lower 3 and an upper orifice opening onto the upper face of the intermediate electrical insulation layer 5.
• the electronic system comprises several upper electrically conductive element 13a, 13b, or an electrically conductive element upper 13 having several electrically conductive tracks
• the pre-existing structure and in particular the transverse duct 15 can lead to the upper face of the intermediate electrical insulation layer 5 in a zone located between the first upper electrically conductive element 13a and the second electrically conductive elementupper 13b, or between two electrically conductive tracks of the upper electrically conductive element 13.
• the auxiliary electronic device 17 can be an electronic device identical to the initial electronic device 7, or of the same nature as the initial electronic device 7, and can comprise a primary connection terminal 19 configured to be electrically connected to the electrically conductive element lower 3, and a secondary connection terminal 21 configured to be electrically connected to the upper electrically conductive element 13.
• devices of the same nature electronic devices capable of performing the same function. For example devices capable of emitting light, and/or devices capable of capturing light, and/or devices capable of emitting light at a given wavelength. It is therefore well understood that devices of the same nature can have different dimensions and/or a different structure as long as they fulfill the same function.
• said primary 19 and secondary 21 connection terminals are arranged on a connection face of the auxiliary electronic device 17 arranged opposite the upper face of the intermediate electrical insulation layer 5.
• the primary 19 and secondary 21 connection terminals are arranged on the same connection face of the auxiliary electronic device 17, which is oriented towards the upper face of the intermediate electrical insulation layer 5.
• the auxiliary electronic device 17 can define a volume strictly greater than a volume defined by at least one initial electronic device 7.
• each auxiliary electronic device 17 is larger than the initial electronic device 7 which it is intended to replace.
• the largest dimension of the auxiliary electronic device is strictly greater than the largest dimension of the at least one initial electronic device.
• the electronic system 10 can comprise at least two reception slots, said reception slots being defined by two distinct zones each covering part of the at least one upper electrically conductive element 13 and at least one part of the face of the intermediate electrical insulation layer 5.
• the principle of the provisions described above makes it possible to replace the initial electronic device 7 when it is defective by the installation of the auxiliary electronic device 17 at the level of the reception location.
• the transverse conduit 15 makes it possible to connect the auxiliary electronic device 17 to the lower electrically conductive element 3.
• the auxiliary electronic device 17 can be connected to the upper electrically conductive element 13.
• a device auxiliary electronics 17 it is possible to selectively substitute either the first initial electronic device 7a, or the second initial electronic device 7b, by a device auxiliary electronics 17, and this by the intermediary ire of a single transverse duct 15.
• the electronic system 10 can comprise an intermediate connector 23 arranged inside a volume delimited by the transverse duct 15.
• the intermediate connector 23 is configured to be placed in electrical connection with the lower electrically conductive element 3, and emerging through the upper orifice of the transverse duct 15.
• the electronic system 10 may further comprise an electrical connection member 22 configured to ensure an electrical connection between the auxiliary electronic device 17 and the intermediate connector 23 .
• the auxiliary electronic device 17 comprises the intermediate connector 23.
• the electrical connection member 22 can be included on the intermediate connector 23.
• the electrical connection 22 and the spacer connector 23 form a single piece connected to the primary connection terminal 19 of the auxiliary electronic device 17.
• the connection member 22 can be included on the primary connection terminal 19 of the device auxiliary electronics 17.
• the spacer connector 23 can be provided on the auxiliary electronic device 17 so that it can be inserted into the transverse duct 15.
• the spacer connector 23 may comprise a metal deposited in the transverse duct 15 so as to fill all or part of a volume defined by the transverse duct 15.
• the device auxiliary electronics 17 can be connected to the lower electrically conductive element 3 via the intermediate connector 23, and possibly by an electrical connection member 22 connected to the primary connection terminal 19.
• the intermediate connector 23, and the electrical connection member 22 may be provided respectively in the transverse conduit 15 and on the intermediate electrical insulation layer 5 to allow the connection of the auxiliary electronic device 17.
• the auxiliary electronic device 17 can comprise a primary connection terminal 19 and a secondary connection terminal 21.
• the primary 19 and secondary 21 connection terminals can be arranged on the same connection face of the auxiliary electronic device 17.
• the secondary connection terminal 21 can be electrically connected with the upper electrically conductive element 13
• the primary connection terminal 19 can be electrically connected with the intermediate connector 23 opening out through the upper orifice of the transverse duct 15, or with the electrical connection member 22.
• connection face of the auxiliary electronic device 17 can simply be placed on the upper electrically conductive element 13, and on the connection member 22 to replace the initial electronic device 7.
• the repair of the initial electronic device 7 is therefore produced by placing the auxiliary electronic device 17 in the right place, that is to say by electrically connecting the secondary connection terminal 21 with the upper electrically conductive element 13, and by electrically connecting the primary connection terminal 19 with the connection member 22.
• the auxiliary electronic device 17 can comprise a primary connection terminal 19, and can be configured to be able to be inserted into the transverse conduit 15 in a way ensuring an electrical connection between the connection terminal primary 19, and the lower electrically conductive element 3.
• the auxiliary electronic device 17 can be provided to have an external contour dimension strictly less than an internal dimension of the transverse duct 15, in order to be able to be inserted into the transverse duct 15.
• the transverse conduit 15 crosses the upper electrically conductive element 13.
• the device auxiliary electronics 17 can be inserted in the transverse duct 15 in a way ensuring an electrical connection between the primary connection terminal 19, and the lower electrically conductive element 3.
• the electronic system 1 can comprise at least one initial electronic device 7 comprising a lower connection terminal 9 directed towards the lower electrically conductive element 3, and an upper connection terminal 11 opposite the terminal lower connection terminal 9.
• the electronic system 1 may further comprise an auxiliary electronic device 17 comprising a primary connection terminal 19, and a secondary connection terminal 21 arranged on the same side of the auxiliary electronic device 17, and directed towards the upper face of the intermediate electrical insulation layer 5.
• the primary connection terminal 19 of the auxiliary electronic device 17 being electrically connected to the lower electrically conductive element 3 via the intermediate connector 23, crossing the intermediate electrical insulation layer 5, and the secondary connection terminal 21 being electrically connected to the upper electrically conductive element 13.
• the invention also relates to a method of manufacturing an electronic system 10.
• the manufacturing method firstly comprises a step E0 of providing an electronic system 10 comprising a support 1 having an initial surface SI, at least one initial electronic device 7, and an intermediate electrical insulation layer 5.
• the initial electronic device 7 comprises a lower connection terminal 9 and an upper connection terminal 11, said lower 9 and upper connection terminals 11 being located at opposite ends of the initial electronic device 7.
• the intermediate electrical insulation layer 5 has a lower face facing the initial surface SI of the support 1, so as to cover all or part of a lower electrically conductive element 3 which is in electrical connection with the lower connection terminal 9 of the initial electronic device 7.
• the step E0 of providing the electronic system 10 firstly comprises a step E01 of providing the support 1 having the upper surface SI.
• a step E03 of depositing the lower electrically conductive element 3 on the upper surface SI of the support 1 can then be implemented.
• the lower electrically conductive element 3 can be deposited so as to form electrically conductive tracks extending substantially parallel to one another.
• the step E0 of making the electronic system 10 available may further comprise a step E05 of depositing a securing means 4, for example an adhesive.
• the securing means 4 can be configured to secure the initial electronic device 7 to the upper surface SI of the support 1.
• a step E07 of positioning the initial electronic device 7 on the upper surface SI can be implemented, in a way ensuring an electrical connection between the lower connection terminal 9 of the initial electronic device 7 and the lower electrically conductive element 3.
• the step E07 of positioning the initial electronic device 7 comprises the distribution of a plurality of initial electronic devices 7a, 7b on the surface upper SI of the support 1 according to a predetermined spacing D.
• the predetermined spacing D can be defined as the spacing separating two electronic devices 7a, 7b on the support 1.
• the predetermined spacing D can be between 50 pm and 2 mm, and more particularly substantially equal to 100 pm.
• the step E0 of making the electronic system 10 available may comprise a step E09 of depositing the intermediate electrical insulation layer 5 on all or part of the upper surface SI of the support. 1 so as to cover the initial electronic device 7 and the lower electrically conductive element 3. It is therefore clearly understood that during this step E09 of depositing the intermediate electrical insulation layer 5, each initial electronic device 7 is encapsulated in the intermediate electrical insulation layer 5.
• step E0 of making the electronic system 10 available may comprise a step E2 of selective etching of the intermediate electrical insulation layer 5 in which the intermediate electrical insulation layer 5 is etched so as to provide access to the upper connection terminal 11 of the device initial electronics 7.
• step E2 of selective etching of the intermediate electrical insulation layer 5 comprises the following steps: a step of depositing a layer of photoresist on the intermediate electrical insulation layer 5; a step of irradiating the layer of photoresist with light radiation through a lithography mask, said lithography mask defining primary zones intended to be irradiated by the light radiation, and secondary zones intended to be protected by the lithography mask against the irradiation of said light radiation; a step of developing the layer of photoresist in which the photoresist is removed at the level of the primary zones or at the level of the secondary zones, so that the intermediate electrical insulation layer 5 is no longer covered with photoresist at the level of said zones where the resin layer has been removed, and so that the intermediate electrical insulation layer
• the manufacturing method may comprise a step E3 of depositing a transparent conductive electrode 25, in which a transparent conductive electrode 25 is deposited at the level of the upper connection terminal 11 of the initial electronic device 7.
• a transparent conductive electrode 25 is deposited at the level of the upper connection terminal 11 of the initial electronic device 7.
• Step E3 of depositing a transparent conductive electrode 25 is generally implemented before a step E4 of depositing at least one upper electrically conductive element 13.
• step E4 of depositing at least one upper electrically conductive element 13 is carried out on an upper face of the intermediate electrical insulation layer 5, on the side opposite to the lower electrically conductive element 3 with respect to the insulation layer electric divider 5, in a way ensuring an electrical connection between the upper connection terminal 11 of said at least one initial electronic device 7 and said upper electrically conductive element 13.
• said deposition of the upper electrically conductive element 13 is made partly on a part of the transparent conductive electrode 25.
• the transparent conductive electrode 25 makes it possible both to ensure the electrical contact of the upper connection terminal 11 with the upper electrically conductive element 13, and to allow the transmission of the light radiation emitted by the initial electronic device 7, which may be an optoelectronic device.
• the manufacturing method comprises a step E5 of forming a pre-existing structure giving access to the lower electrically conductive element 3 from the upper face of the intermediate electrical insulation layer 5
• step E5 of forming a pre-existing structure comprises a step E6 of forming a transverse duct 15, formed in the intermediate electrical insulation layer 5, of so as to define a passage through the intermediate electrical insulation layer 5 between the lower electrically conductive element 3 and an upper orifice opening onto the upper face of the intermediate electrical insulation layer 5.
• the upper orifice opens onto the upper face of the intermediate electrical insulation layer 5 on the side of the at least one upper electrically conductive element 13. According to a variant rep shown in FIG.
• FIG. 7 illustrates a variant in which the step E6 of forming the transverse duct 15 is carried out between a first upper electrically conductive element 13a electrically connected to a first initial electronic device 7a, and a second upper electrically conductive element 13b connected to a second initial electronic device 7b. In this way, it is possible to access the lower electrically conductive element 3 common to the two initial electronic devices 7a, 7b between which the transverse duct 15 is formed.
• step E6 of formation of the transverse duct 15 is carried out during step E2 of selective etching of the intermediate electrical insulation layer 5.
• the manufacturing process can then include a step E7 of checking the initial electronic device 7 implemented after the step E6 of forming of the transverse duct 15 and represented in FIG. 9.
• the initial electronic device 7 is supplied with electrical energy so as to determine whether said initial electronic device 7 is defective.
• the step E7 of checking the initial electronic device 7 can comprise the measurement of a current passing through the initial electronic device 7, or can comprise the measurement of a voltage at the connection terminals of the initial electronic device 7, for example via a multimeter 8.
• the step E7 of checking the initial electronic device 7 can comprise placing the initial electronic device 7 in a mode where it emits light radiation, then to detect said light radiation via an optical sensor.
• the manufacturing method further comprises a repair phase, illustrated in FIGS. 10 to 15.
• Said repair phase may comprise a step E8 of providing an auxiliary electronic device 17 capable of functionally replacing the initial electronic device 7.
• the auxiliary electronic device 17 may be an electronic device identical to the initial electronic device 7, or of the same nature as the initial electronic device 7, and may comprise a primary connection terminal 19 configured to be electrically connected to the element electrically conductive lower 3, and a secondary connection terminal 21 configured to be electrically connected to the electrically conductive upper element 13.
• devices of the same nature we mean electronic devices capable of fulfilling the same function. For example devices capable of emitting light, and/or devices capable of capturing light, and/or devices capable of emitting light at a given wavelength. It is therefore well understood that devices of the same nature can have different dimensions and/or a different structure as long as they fulfill the same function.
• the repair phase can then comprise a step E10 of positioning said auxiliary electronic device 17 on a reception location, said reception location covering at least a part of the upper electrically conductive element 13, and at least a of the upper face of the intermediate electrical insulation layer 5, said step E10 of positioning the auxiliary electronic device 17 being implemented in a way ensuring electrical contact between the primary connection terminal 19 of the auxiliary electronic device 17 and the upper electrically conductive element 13.
• the repair phase may include a connection step Eli, in which a terminal of primary connection 19 of the auxiliary electronic device 17 is electrically connected with the lower electrically conductive element 3 via an intermediate connector 23 which is able to pass through a volume delimited by the transverse duct 15.
• the auxiliary electronic device 17 comprises the spacer connector 23 in electrical connection with the primary connection terminal 19 of the auxiliary electronic device 17 in a way allowing the implementation of step Eli of connection.
• the spacer connector 23 may comprise an electrical connection member 22.
• the electrical connection member 22 and the spacer connector 23 form a single part connected to the primary connection terminal 19 of the auxiliary electronic device 17.
• the spacer connector 23 can then be provided so as to be able to be inserted into the transverse duct 15 to implement step Eli of connection.
• a step E9 of depositing the spacer connector 23 is implemented.
• a conductive material is deposited in the transverse duct 15 so as to create an electrical connection between said intermediate connector 23 and the lower electrically conductive element 3, and so that the intermediate connector 23 emerges through the orifice top of the transverse duct 15.
• a metal is deposited in the transverse duct 15 so as to fill all or part of a volume defined by the transverse duct 15, and so as to form the intermediate connector 23.
• the auxiliary electronic device 17 can be connected to the lower electrically conductive element 3 via the intermediate connector 23, and possibly by an electrical connection member 22 connected to the primary connection terminal 19, and configured to ensure an electrical connection between the auxiliary electronic device 17 and the spacer connector 23
• step E9 of depositing the intermediate connector 23 also comprises the formation of an electrical connection member 22 configured to ensure an electrical connection between the auxiliary electronic device 17 and the intermediate connector 23.
• the electrical connection member 22 can be deposited on the upper face of the intermediate electrical insulation layer 5.
• the step E4 of depositing at least one upper electrically conductive element 13 can be implemented at the same time as step E9 of depositing the spacer connector 23.
• the auxiliary electronic device 17 can comprise a primary connection terminal 19 and a secondary connection terminal 21 arranged on the same connection face of the auxiliary electronic device 17.
• step E10 of installation can be carried out by placing the auxiliary electronic device 17 on the spacer connector 23 opening out through the upper orifice of the transverse duct 15 or on the electrical connection member 22, and on the upper electrically conductive element 13 at the connection face.
• the connection step Eli can then be implemented by the electrical connection of the secondary connection terminal 21 with the upper electrically conductive element 13, and by the electrical connection of the primary connection terminal 19 with the intermediate connector 23 opening out through the upper orifice of the transverse duct 15 or with the electrical connection member 22.
• the step Eli of connection can be simply implemented by the electrical connection of the secondary connection terminal 21 with the upper electrically conductive element 13, and by the electrical connection of the primary connection terminal 19 with the connection member 22.
• the connection step Eli is implemented by the electrical connection of the primary 19 and secondary 21 terminals of the auxiliary electronic device 17 on existing electronic tracks. In this way, it is not necessary to carry out an additional metal deposit when the auxiliary electronic device 17 is put in place to replace the initial electronic device 7. The repair of the initial electronic device 7 illustrated in FIG. , is therefore achieved by placing the auxiliary electronic device 17 in the right place.
• the auxiliary electronic device 17 can be deposited directly in the transverse duct 15 in a way allowing the implementation of the steps E10 of setting up the auxiliary electronic device 17, and connecting Eli .
• the primary 19 and secondary 21 connection terminals are located at opposite ends of the auxiliary electronic device 17.
• the auxiliary electronic device 17 is identical or of the same type as the initial electronic device 7.
• a second step of depositing a transparent conductive electrode 25 can be implemented, in which an electrode conductive transparent 25 is deposited at the level of the secondary terminal 21 of the auxiliary electronic device 17 so as to electrically connect the auxiliary electronic device 17 to the at least one upper electrically conductive element 13.
• step E6 of forming the transverse duct 15 is carried out through the upper electrically conductive element 13.
• the upper electrically conductive element 13 can be used as a mask to produce the step E6 of forming the transverse duct 15.
• the auxiliary electronic device 17 can be deposited directly in the transverse duct 15 in a way allowing the implementation of the steps E10 of positioning the auxiliary electronic device 17, and Connection Eli.
• the manufacturing method may then comprise a second step of depositing a transparent conductive electrode 25, in which a transparent conductive electrode 25 is deposited at the level of the secondary terminal 21 of the auxiliary electronic device 17 so as to electrically connect the auxiliary electronic device 17 to at least one upper electrically conductive element 13.
• the manufacturing method comprises a disconnection step E12, in which the electrical connection between the upper connection terminal 11 of the initial electronic device 7 and the upper electrically conductive element 13 is broken, in particular by laser engraving. In this way, it is possible to cut the electrical connection between the upper electrically conductive element 13 and the upper connection terminal 11 of the initial electronic device 7 so that it does not cause a short circuit or interference with the electronic device. auxiliary 17.
• the manufacturing method further comprises a protection step comprising the deposition of an insulating protective layer on the auxiliary electronic device 17.
• said protection step can comprise the encapsulation of the auxiliary electronic device 17 by an insulating protective layer whose surface corresponds, to within 10%, to a surface occupied by the auxiliary electronic device 17.
• the layer insulating protection is deposited punctually at each auxiliary electronic device 17 to be protected.
• said protection step may comprise the encapsulation of the entire upper face of the intermediate electrical insulation layer 5, or of the entire electronic system 10.
• the protection step is implemented after the Eli connection step.
• the protective insulating layer makes it possible both to encapsulate the auxiliary electronic devices 17, but also to block access to the lower electrically conductive element 3 from the upper face of the electrically insulating layer. spacer 5.
• step E6 of forming the transverse duct 15 carried out for example by etching the intermediate electrical insulation layer 5, makes it possible to provide access to the lower electrically conductive element 3, in particular after a step E09 of depositing the intermediate electrical insulation layer 5.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Electroluminescent Light Sources (AREA)
• Semiconductor Integrated Circuits (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

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• 2021
  • 2021-06-14 FR FR2106255A patent/FR3124021B1/fr active Active
• 2022
  • 2022-06-09 WO PCT/FR2022/051102 patent/WO2022263749A1/fr active Application Filing
  • 2022-06-09 EP EP22735017.0A patent/EP4356440A1/de active Pending
  • 2022-06-13 TW TW111121859A patent/TW202304002A/zh unknown

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