EP4339339A8 - Liaison de morceaux de diamant sur des substrats de silicium à l'aide d'un agent de liaison fluide - Google Patents

Liaison de morceaux de diamant sur des substrats de silicium à l'aide d'un agent de liaison fluide Download PDF

Info

Publication number
EP4339339A8
EP4339339A8 EP22195693.1A EP22195693A EP4339339A8 EP 4339339 A8 EP4339339 A8 EP 4339339A8 EP 22195693 A EP22195693 A EP 22195693A EP 4339339 A8 EP4339339 A8 EP 4339339A8
Authority
EP
European Patent Office
Prior art keywords
bonding
flowable
silicon substrates
bonding agent
diamond pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22195693.1A
Other languages
German (de)
English (en)
Other versions
EP4339339A1 (fr
Inventor
Eftychia TSAPANOU-KATRANARA
Nikolaos Papadopoulos
René VOLLMER
Nicky DE JONG
Timo Jean Jozef WILLIGERS
Jacub-Adam DALLE
David Jason MICHALAK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO filed Critical Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Priority to EP22195693.1A priority Critical patent/EP4339339A1/fr
Priority to PCT/NL2023/050474 priority patent/WO2024058664A1/fr
Publication of EP4339339A1 publication Critical patent/EP4339339A1/fr
Publication of EP4339339A8 publication Critical patent/EP4339339A8/fr
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/06Joining of crystals
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/04Diamond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
EP22195693.1A 2022-09-14 2022-09-14 Liaison de morceaux de diamant sur des substrats de silicium à l'aide d'un agent de liaison fluide Pending EP4339339A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP22195693.1A EP4339339A1 (fr) 2022-09-14 2022-09-14 Liaison de morceaux de diamant sur des substrats de silicium à l'aide d'un agent de liaison fluide
PCT/NL2023/050474 WO2024058664A1 (fr) 2022-09-14 2023-09-14 Liaison de pièces de diamant à des substrats de silicium à l'aide d'un agent de liaison fluide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP22195693.1A EP4339339A1 (fr) 2022-09-14 2022-09-14 Liaison de morceaux de diamant sur des substrats de silicium à l'aide d'un agent de liaison fluide

Publications (2)

Publication Number Publication Date
EP4339339A1 EP4339339A1 (fr) 2024-03-20
EP4339339A8 true EP4339339A8 (fr) 2024-05-01

Family

ID=83594092

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22195693.1A Pending EP4339339A1 (fr) 2022-09-14 2022-09-14 Liaison de morceaux de diamant sur des substrats de silicium à l'aide d'un agent de liaison fluide

Country Status (2)

Country Link
EP (1) EP4339339A1 (fr)
WO (1) WO2024058664A1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6696352B1 (en) * 2001-09-11 2004-02-24 Silicon Wafer Technologies, Inc. Method of manufacture of a multi-layered substrate with a thin single crystalline layer and a versatile sacrificial layer
JP5297219B2 (ja) * 2008-02-29 2013-09-25 信越化学工業株式会社 単結晶薄膜を有する基板の製造方法
CN109913954B (zh) * 2019-03-13 2021-08-06 电子科技大学 具有隔离层的单晶薄膜的制备方法、单晶薄膜及谐振器

Also Published As

Publication number Publication date
WO2024058664A1 (fr) 2024-03-21
EP4339339A1 (fr) 2024-03-20

Similar Documents

Publication Publication Date Title
DE50010186D1 (de) Verfahren und einrichtung zum vereinzeln von scheibenförmigen substraten
EP1248291A3 (fr) Feuille conductrice avec des corps conducteurs pour montage de puces tête-bêche (dit "flip-chip")
SG111946A1 (en) Die bonding sheet sticking apparatus and method of sticking die bonding sheet
EP1152464A3 (fr) Dispositif semi-conducteur ayant la taille d'une puce et son procédé de fabrication
TWI319591B (en) Method to produce semiconductor components and thin-film semiconductor components
TW200705579A (en) Hot-melt underfill composition and method of application
WO2007139765A3 (fr) Dispositifs semi-conducteurs sur diamant et procédés associés
TWI266674B (en) Substrate holding device and polishing apparatus
ATE496104T1 (de) B-zustandsklebstoff für die chipverklebung
WO2005079198A3 (fr) Substrat virtuel lie a une plaquette et procede de formation associe
MY125340A (en) Process for producing semiconductor device
KR20050054933A (ko) 웨이퍼 코팅 및 싱귤레이션 방법
WO2006081315A3 (fr) Procede d'elimination de l'enroulement pour des dispositifs sur des substrats flexibles minces et dispositifs produits selon ce procede
TW200745200A (en) Underfill encapsulant for wafer packaging and method for its application
TW200604309A (en) Heat-peelable adhesive sheet and processing method for an adherend using the heat-peelable adhesive sheet
SG129280A1 (en) Method of dividing a semiconductor wafer
WO2006131843A3 (fr) Procede d'elimination de substrat de croissance d'un dispositif electroluminescent semi-conducteur
MY147216A (en) Method of producing a semiconductor device, and wafer-processing tape
WO2008133104A1 (fr) Feuille adhésive sensible à la pression pour découpage en dés au laser sous jet d'eau
WO2009050786A1 (fr) Adhésif autocollant, feuille adhésive autocollante, feuille adhésive autocollante à couches multiples, et procédé de fabrication d'un composant électronique
TWI267168B (en) Manufacturing method of IC chip
TWI231534B (en) Method for dicing a wafer
PH12020550712A1 (en) Silicone-based adhesive sheet, multilayer structure including same, and method for producing semiconductor device
ATE513664T1 (de) Vorrichtung und verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften
TW200725818A (en) Wafer-level chip package process

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: MICHALAK, DAVID JASON

Inventor name: DALLE, JACUB-ADAM

Inventor name: WILLIGERS, TIMO JEAN JOZEF

Inventor name: DE JONG, NICKY

Inventor name: VOLLMER, RENE

Inventor name: PAPADOPOULOS, NIKOLAOS

Inventor name: TSAPANOU-KATRANARA, EFTYCHIA