Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
  • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
  • H05K7/2049—Pressing means used to urge contact, e.g. springs
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
  • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
  • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
  • F28F2280/02—Removable elements

Definitions

• the invention relates to a heat dissipation device, in particular for a control device arrangement in a vehicle.
• the invention relates to a control device arrangement, in particular for a vehicle, with such a heat dissipation device.
• control unit arrangement 100 shown in FIG. 7 with a control unit 3, which comprises a housing 4 and at least one heat source 7 arranged within the housing 4, such as an electrical assembly 7A arranged on a printed circuit board 6, and with a cooling device 9A executed heat sink 9, the control unit 3 is detachably connected to the cooling device 9A.
• the at least one heat source 7 is thermally coupled to the housing 4 of the control unit 3 via a first thermal interface 8 .
• the first thermal interface 8 can, for example, consist of thermally conductive materials 8A, which are also referred to as thermal interface materials (TIM).
• TIM thermal interface materials
• a so-called gap filler which is preferably made of a thermally conductive elastomer, can be arranged as a TIM 8A between the heat source 7 and a heat dissipation dome 5.1 formed on the bottom 4 of the housing 4 and form the first thermal interface 8 .
• a heat dissipation path WAP of the heat generated by the at least one heat source 7 is distributed to a first heat dissipation path WAP1, which dissipates part of the heat generated by the heat source via the bottom 5 of the housing 4 of the control unit 3 and the fastenings tion areas to the cooling device 9A derives.
• a second heat dissipation path WAP2 dissipates part of the heat generated by the at least one heat source 7 as radiant heat and as heat conduction via air molecules via the air gap LS into the cooling device 9A.
• thermally conductive materials such as thermally conductive pastes or gap fillers
• thermally conductive pastes or gap fillers to bridge the air gap LS in order to achieve better thermal conductivity between the control unit 3 and the cooling device 9A.
• such a solution prevents a simple replacement of the control unit 3, since when the control unit 3 is dismantled, residues of the thermally conductive material used remain on the cooling device 9A, which must first be removed in a laborious cleaning process.
• appropriate heat-conducting materials must be kept available and a bubble-free application that is difficult to check and difficult to implement.
• the heat dissipation device with the features of independent patent claim 1 and the control device arrangement with the features of independent patent claim 11 each have the advantage that unevenness between egg ner heat source and a heat sink can be compensated.
• the mosaic segments adapt to the unevenness of the surface due to the compressible, thermally conductive, elastic compensation element. This means that uneven joined surfaces can also come into contact over a large area and thus have good heat transfer. Furthermore, a high degree of robustness against contamination can result, since individual dirt particles in the air gap can only prevent individual mosaic segments from being in contact. With that is a good heat transfer of all other mosaic segments is still ensured. Interstices of the mosaic segments can serve as "volume buffers".
• these spaces can, for example, serve as volume compensation for an adhesive medium that holds the mosaic segments in the corresponding receiving space. Due to the improved heat transfer, the service life of the electrical components can be extended as heat sources. In addition, cheaper materials with poorer thermal conductivity properties can be used for the housing. Furthermore, more economical manufacturing processes can be used due to extended tolerance zones.
• the thermally conductive, low-adhesion contact areas of the individual mosaic segments allow them to be easily lifted off the corresponding surface of the heat sink or heat source.
• Embodiments of the heat dissipation device according to the invention make it possible to compensate for unevenness tolerances on a cooling surface and to record good heat transfer even with unevenness of the surfaces and with particles between the surfaces, without a permanent air gap between the heat source and the cooling device.
• Embodiments of the present invention provide a heat dissipation device, in particular for a control unit arrangement in a vehicle, with a receiving space open on at least one side and at least one mosaic segment arranged in the receiving space, which has a thermally conductive and elastic compensation element and a thermally conductive low-adhesion element includes contact area.
• the at least one mosaic segment is arranged in the receiving space in such a way that the thermally conductive and elastic compensating element of the at least one mosaic segment rests against an inner surface of a floor of the receiving space and at least the thermally conductive, low-adhesion contact area of the at least one mosaic segment rests against an open side of the accommodating space, which faces the floor, partially protrudes from the accommodating space.
• an outer surface of the bottom of the receiving space forms a solid first contact surface for a heat source or for a heat sink
• the thermally conductive, low-adhesion contact area of the at least one Mosaic segment forms a flexible second contact surface for the heat sink or for the heat source.
• a control unit arrangement in particular for a vehicle, is proposed with a control unit which comprises a housing and at least one heat source arranged inside the housing, and with a heat sink designed as a cooling device.
• the control unit is detachably connected to the cooling device, with the at least one heat source being thermally coupled to the housing of the control unit via a first thermal interface.
• At least one heat dissipation device according to the invention is arranged between the control unit and the cooling device, which forms a second thermal interface between the housing and the cooling device and dissipates heat generated by the at least one heat source to the cooling device.
• the heat generated by at least one heat source is directly dissipated via the first thermal interface, via the housing of the control unit and via the at least one mosaic segment forming the second thermal interface into the cooling device.
• the at least one mosaic segment is permanently connected to the inner surface of the receiving space.
• the at least one mosaic segment can be connected to the inner surface of the receiving space, for example, by gluing, welding, soldering, clamping, or riveting.
• the at least one mosaic segment can be designed in multiple parts.
• the thermally conductive and elastic compensating element of the at least one mosaic segment can preferably be designed as a gap filler with a thickness of 1 to 5 mm, for example.
• the thermally conductive low-adhesion contact area of the at least one mosaic segment can preferably be used as a Be executed metal plate, which can be glued to the gap filler.
• the metal plates of the mosaic segments can be produced, for example, as stamped or laser-cut parts and have, for example, an edge length between 5 and 20 mm and a thickness in the range from 0.1 to 1.5 mm.
• the metal plates can, for example, be made of aluminum, copper, steel or another suitable metal. Since the gap filler is largely covered by the individual metal plates and no adhesion build-up occurs between metals, the thermally conductive low-adhesion contact area can be easily removed from a metal surface of a cooling device or a control unit housing. For example, a gap filler can be bonded over a large area to the inner surface of the receiving space for several metal plates. Then the individual metal plates of the mosaic segments can be glued with the applied gap filler. This means that several mosaic segments can have a common thermally conductive and elastic compensating element.
• the at least one mosaic segment can be made in one piece.
• the at least one mosaic segment can comprise at least one spring element, which forms the thermally conductive and elastic compensating element.
• a spring end of the at least one spring element can form the thermally conductive, low-adhesion contact area.
• the at least one spring element can be made of copper, steel or another suitable metal, for example, and welded or riveted to the inner surface of the receiving space. Since there is no build-up of adhesion between the at least one spring element and the metallic surface of the cooling device or the control unit housing, the thermally conductive, low-adhesion contact area can easily be removed from the corresponding surface again.
• At least one mosaic segment can be designed as a metal foam part, which forms the thermally conductive and elastic compensation element.
• a bearing surface of the metal foam part facing away from the bottom of the receiving space form the thermally conductive low-adhesion contact area.
• the metal foam part can, for example, be made of copper or another suitable metal and be glued, welded, soldered or clamped to the inner surface of the receiving space.
• the at least one mosaic segment can be designed as a metal wool part, which forms the thermally conductive and elastic compensation element. A bearing surface of the metal wool part that faces away from the bottom of the receiving space can form the thermally conductive, low-adhesion contact area.
• the metal wool part can, for example, be made of copper, steel or another suitable metal and be glued, welded or soldered to the inner surface of the receiving space. Since there is no build-up of adhesion between the metal foam part or the metal wool part and the metal surface of the cooling device or the control unit housing, the corresponding thermally conductive low-adhesion contact area can be easily removed from the corresponding surface again.
• the at least one mosaic segment can be designed as a metal lamellar structure, which is also referred to as “Skived Fins” and comprises a number of lamellas that protrude from a base plate and form the thermally conductive and elastic compensation element.
• the base plate can rest against the inner surface of the bottom of the receiving space and the edges of the lamellae facing away from the base plate can form the thermally conductive, low-adhesion contact area.
• the at least one mosaic segment can be designed as a metal knob foil, which can comprise a plurality of knobs protruding from a base area, which form the thermally conductive and elastic compensating element.
• the base of the metal studded foil can rest against the inner surface of the floor of the receiving space and be glued or welded to it. The knobs facing away from the base plate can form the thermally conductive, low-adhesion contact area.
• the at least one heat dissipation device can have a plurality of mosaic segments and be designed over a large area on the housing of the control unit or on the cooling device.
• a metallic base surface of a power module can be thermally connected over a large area to the corresponding surface of the cooling device.
• the cooling device can have a metal plate with water cooling, for example.
• several heat dissipating devices can be partially distributed on the housing of the control unit or on the cooling device.
• electrical assemblies arranged at so-called "hotspots" can be specifically cooled as heat sources.
• the receiving space for the at least one heat dissipation device can be formed in a depression in the region of the first thermal interface of the housing of the control unit.
• the receiving space of the at least one heat dissipation device can be formed in a recess in a surface of the cooling device facing the control unit, which is arranged in the mounted state of the control unit arrangement in the area of the first thermal interface on the housing of the control unit.
• Fig. 1 shows a schematic sectional view of a detail of a first embodiment of a control device arrangement according to the invention, in particular special in a vehicle, with a first embodiment of a heat dissipation device according to the inventions.
• Fig. 2 shows a schematic sectional view of a detail of a second embodiment of a control device arrangement according to the invention, in particular in a vehicle, with a second embodiment of a heat dissipation device according to the invention.
• Fig. 3 shows a schematic sectional view of a section of a third embodiment of a control device arrangement according to the invention, in particular special in a vehicle, with a third embodiment of a heat dissipation device according to the inventions.
• FIG. 4 shows a schematic sectional view of a section of a fourth exemplary embodiment of a control device arrangement according to the invention, in particular in a vehicle, with a fourth exemplary embodiment of a heat dissipation device according to the invention.
• FIG. 5 shows a schematic illustration of a bottom of a housing of a control unit for a control unit arrangement according to the invention.
• FIG. 6 shows a schematic sectional view of a section of a fifth exemplary embodiment of a control device arrangement according to the invention, in particular in a vehicle, with a fifth exemplary embodiment of a heat dissipation device according to the invention and the control device from FIG.
• FIG. 7 shows a schematic sectional illustration of a control unit arrangement, in particular in a vehicle, without a heat dissipation device according to the invention.
• the illustrated exemplary embodiments include a control unit arrangement according to the invention 1, 1A, 1B, IC, ID, IE, in particular for a vehicle, each having a control unit 3, 3A, 3B, which has a housing 4 and at least a heat source 7 arranged within the housing 4, and a heat sink 9 designed as a cooling device 9A.
• the control unit 3, 3A, 3B is detachably connected to the cooling device 9A.
• the at least one heat source 7 is thermally coupled to the housing 4 of the control unit 3 via a first thermal interface 8 .
• At least one inventive heat dissipation device 10, 10A, 10B, IOC, 10D, 10E is arranged between the control unit 3, 3A, 3B and the cooling device 9A, which has a second thermal interface 12 between the Housing 4 and the cooling device 9A forms and derives heat generated by the at least one heat source 7 to the cooling device 9A.
• the heat generated by the at least one heat source 7 is directly dissipated via the at least one heat dissipation device 10, 10A, 10B, IOC, 10D, 10E via the first thermal interface 8, via the housing 4 of the control unit 3 and via the second thermal interface 12 into the cooling device 9A.
• the cooling device 9A comprises a metal plate with a plurality of channels, not shown, through which water or another suitable coolant is conducted in order to dissipate the heat generated by the at least one heat source 7 .
• the illustrated exemplary embodiments of the heat dissipation device according to the invention 10, 10A, 10B, IOC, 10D, 10E each include a receiving space 11, 11A, 11B, 11C open on at least one side and at least one in the Mosaic segment 14, 14A, 14B, 14C, 14D arranged in the receiving space 11, 11A, 11B, 11C, which comprises a thermally conductive and elastic compensation element 16 and a thermally conductive, low-adhesion contact area 18.
• the at least one mosaic segment 14, 14A, 14B, 14C, 14D is arranged in the receiving space 11, 11A, 11B, 11C that the thermally conductive and elastic compensation element 16 of the at least one mosaic segment 14, 14A, 14B, 14C, 14D an inner surface of a floor 11.1 of the receiving space 11, 11A, 11B, 11C and at least the thermally conductive low-adhesion contact area 18 of the at least one mosaic segment 14, 14A, 14B, 14C, 14D on an open side of the receiving space 11, 11A, 11B, 11C , which is opposite the bottom 11.1, partially protrudes from the receiving space 11, 11A, 11B, 11C.
• the thermally conductive and elastic compensation element 16 of the at least one mosaic segment 14, 14A, 14B, 14C, 14D an inner surface of a floor 11.1 of the receiving space 11, 11A, 11B, 11C and at least the thermally conductive low-adhesion contact area 18 of the at least one mosaic segment 14, 14A, 14B, 14C, 14
• 11A, 11B, 11C form a fixed first contact surface for a heat source 7 or for a heat sink 9, and the thermally conductive, low-adhesion contact area 18 of the at least one mosaic segment 14, 14A, 14B, 14C, 14D forms a flexible second contact surface for the heat sink 9 or for the heat source 7 off.
• the at least one heat source 7 is thermally coupled to the housing 4 of the control unit 3 via a first thermal interface 8 .
• the first thermal interface 8 can consist, for example, of thermally conductive materials 8A, which are also referred to as thermal interface materials (TIM).
• TIM thermal interface materials
• a so-called gap filler which is preferably made of a thermally conductive elastomer, is arranged as a TIM 8A between the heat source 7 and a recess 5.2 formed on the bottom 4 of the housing 4 and forms the first thermal cal Interface 8 off.
• the receiving space 11, 11A, 11B, 11C of the at least one heat dissipation device 10, 10A, 10B, IOC, 10D, 10E in the illustrated exemplary embodiments is in this recess 5.2 in the base 5 of the housing 4 of the respective control unit 3, 3A, 3B.
• the receiving space 11 of the at least one heat dissipation device 10 is formed in a recess which is formed in a surface of the cooling device 9A that faces the control device 3 .
• the recess is placed on the cooling device 9A in such a way that it is arranged on the housing 4 of the control device 3 in the area of the first thermal interface 8 when the control device arrangement 1 is in the assembled state.
• a second heat dissipation path WAP2 derives part of the heat generated by the at least one heat source 7 as radiant heat and as heat conduction via air molecules via the air gap LS into the cooling device 9A.
• the heat dissipation device 10, 10A, 10B, 10C, 10D, 10E forms a third heat dissipation path WAP3, which dissipates part of the heat generated by the at least one heat source 7 directly into the cooling device 9A.
• the various embodiments of the heat dissipation device 10, 10A, 10B, IOC, 10D, 10E bridge the air gap LS between the control unit 3, 3A, 3B and the cooling device 9A in order to achieve better thermal conductivity.
• the heat dissipation devices 10, 10A, 10B, IOC, 10D, 10E leave no residues on the cooling device 9A when the control unit 3, 3A, 3B is dismantled, which residues first have to be removed by laborious cleaning processes.
• no heat-conducting materials have to be kept available when installing the replacement control unit.
• the individual mosaic segments 14, 14A, 14B, 14C, 14D are permanently connected to the inner surface of the respective receiving space 11, 11A, 11B, 11C by a thermally conductive adhesive connection.
• a thermally conductive adhesive connection This means that the thermally conductive and elastic compensating elements 16 are glued to the respective receiving space 11, 11A, 11B, 11C.
• other suitable connection techniques can also be used to connect the individual mosaic segments 14, 14A, 14B, 14C,
• the at least one mosaic segment 14A in the illustrated exemplary embodiments of the control device arrangements 1A, IE is designed in several parts.
• the heat dissipation device 10A shown in FIG. 1 has only a single mosaic segment 14A
• the heat dissipation device 10E shown in FIG. 6 has a plurality of mosaic segments 14A arranged next to one another.
• the thermally conductive and elastic compensating element 16 of the illustrated mosaic segments 14A is designed as a gap filler 16A.
• the thermally conductive low-adhesion contact area 18 of the illustrated mosaic segments 14A is designed as a small metal plate 18A which is bonded to the gap filler 16A.
• the at least one mosaic segment 14B, 14C, 14D is designed in one piece in the illustrated exemplary embodiments of the control device arrangements 1B, IC, ID.
• the in Fig. 2 to 4 shown heat dissipation devices 10B, IOC, 10D in each case only a single mosaic segment 14B, 14C, 14D.
• the mosaic segment 14B shown comprises a plurality of spring elements 16B, which form the thermally conductive and elastic compensation element 16.
• flattened spring ends 18B of the two spring elements 16B form the thermally conductive, low-adhesion contact area 18 .
• the mosaic segment 14C shown is designed as a compressible, elastic metal foam part 16C, which forms the thermally conductive and elastic compensation element 16.
• a contact surface 18C of the metal foam part 16C facing away from the bottom 11 of the receiving space 11 forms the thermally conductive, low-adhesion contact region 18 .
• the illustrated mosaic segment 14D is designed as a compressible, elastic metal wool part 16D, which forms the thermally conductive and elastic compensation element 16.
• a bearing surface 18C of the metal wool part 16D facing away from the bottom 11.1 of the receiving space 11 forms the thermally conductive contact region 18.
• the at least one mosaic segment 14 is designed as a lamellar structure, which includes a plurality of lamellae protruding from a base plate, which form the thermally conductive and elastic compensation element 16.
• the base plate rests against the inner surface of the bottom 11 of the receiving space 11 and is preferably bonded to the bottom 11.1 of the receiving space 11 via a thermally conductive adhesive connection.
• the edges of the lamellae facing away from the base plate form the thermally conductive contact area 18 with low adhesion.
• the at least one mosaic segment 14 is designed as a metal knob foil, which comprises a plurality of knobs protruding from a base area, which form the thermally conductive and elastic compensation element 16 .
• the base of the Metal knob foil on the inner surface of the bottom 11.1 of the receiving space 11 and is preferably glued to the bottom 11.1 of the receiving space 11 via a thermally conductive adhesive bond.
• the knobs facing away from the base plate form the thermally conductive, low-adhesion contact area 18 .
• a first heat dissipation device 10E comprises twelve mosaic segments 14A, which are arranged in a first receiving space 11B and are used to dissipate the heat generated by a first electrical assembly 7B.
• a second heat dissipation device 10F comprises six mosaic segments 14A, which are arranged in a second receiving space 11C and are used to dissipate the heat generated by a second electrical assembly 7C.
• the heat dissipation device 10 is designed with a large number of mosaic segments 14 .
• the mosaic segments 14 are distributed over the entire base 5 of the control unit 3, so that the control unit 3 is thermally connected to the cooling device 9A over a large area for heat dissipation.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

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• 2021
  • 2021-03-18 DE DE102021202654.0A patent/DE102021202654A1/de active Pending
• 2022
  • 2022-03-11 CN CN202280021544.9A patent/CN116998232A/zh active Pending
  • 2022-03-11 US US18/260,587 patent/US20230422451A1/en active Pending
  • 2022-03-11 EP EP22714163.7A patent/EP4309474A1/de active Pending
  • 2022-03-11 WO PCT/EP2022/056346 patent/WO2022194705A1/de active Application Filing
  • 2022-03-11 JP JP2023557149A patent/JP2024511758A/ja active Pending

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