EP4288903A1 - Procédé de production d'une carte à puce, corps de carte pour une carte à puce, et carte à puce - Google Patents

Procédé de production d'une carte à puce, corps de carte pour une carte à puce, et carte à puce

Info

Publication number
EP4288903A1
EP4288903A1 EP22709178.2A EP22709178A EP4288903A1 EP 4288903 A1 EP4288903 A1 EP 4288903A1 EP 22709178 A EP22709178 A EP 22709178A EP 4288903 A1 EP4288903 A1 EP 4288903A1
Authority
EP
European Patent Office
Prior art keywords
chip
chip module
card
cavity
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22709178.2A
Other languages
German (de)
English (en)
Inventor
Michael Baldischweiler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient ePayments GmbH
Original Assignee
Giesecke and Devrient ePayments GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient ePayments GmbH filed Critical Giesecke and Devrient ePayments GmbH
Publication of EP4288903A1 publication Critical patent/EP4288903A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the invention relates to a method for producing a chip card, a card body for a chip card and a chip card.
  • Card-shaped data carriers in particular chip cards, are used in many areas, for example for carrying out cashless payment transactions, as identification documents or as proof of access authorizations.
  • a chip card has a card body and an integrated circuit embedded in the card body, for example in the form of a chip module with a chip. The chip module is inserted into a cavity or module opening in the card body.
  • chip modules or chip cards with an integrated coil that enable contactless or non-contact communication are considered.
  • chip card controllers with RFID functionality can be used.
  • the coil forms an oscillating circuit on the chip module with an additional capacitor.
  • Card bodies with a metal core in the form of a metal core layer or a metal core element can also be considered, as well as cards with dual interface (DI) functionality, where the card body consists partly or entirely of metal.
  • DI dual interface
  • Such a card works by using a chip module that itself contains a coil (Coil On Module). This coil couples to the metallic card body.
  • Chip card controllers with a capacity of 78 pF are used in order to keep mismatching of the oscillating circuit as small as possible. Nevertheless, there is often a mismatch in the oscillating circuit.
  • the overall system is capacitive and generates apparent power. This means that the energy consumed by the field is not fully fed to the chip card controller.
  • the soldering process or the reflow method can be used as the standard process for the assembly of components.
  • the components for this production process are inexpensive.
  • the disadvantage of this method is that the production of a chip mode must take place in several stages. Either the tape is fitted with the components first and the chip and the potting compound are applied in a second step, or the process steps are carried out in reverse order.
  • a bonding method can also be used for the components.
  • these components are more expensive.
  • the bonding process is more expensive, but offers the advantage that everything can be carried out in one process step.
  • the components are placed from the chip module onto the module during the assembly process. Additional bonding wires are required and the actual production step takes longer.
  • Another problem is the bond wires themselves, which can snap when the mode is flexed. In this case, the oscillating circuit can fail completely if the wires tear off the component.
  • a method according to the invention for producing a chip card the chip card comprising a card body and a chip module arranged therein, provides for the following steps:
  • a basic idea of the present invention is that at least one additional electronic component, such as a discrete component such as a capacitor, is arranged in at least one component opening that is matched thereto.
  • This component can be used, for example, to adapt the power of the resonant circuit of the chip module or to optimize other signaling and/or supply technology.
  • the component opening is preferably formed separately from the cavity.
  • the component opening and the cavity can be produced in one work step, for example by means of a milling process or a laser processing step.
  • the overlapping area corresponds to the area of the layout of the card body or the chip card in which the chip module is arranged.
  • the at least one component opening is made in this area before the chip module is arranged there.
  • the overlapping area can also only comprise an outer edge of the area covered by the chip module, for example the area of the turns of the coil of the chip module.
  • the method proposed here has the advantage that the soldering method can also be carried out during chip embedding, ie the insertion of the chip module into the card body. This enables a single-stage production process, which means that the two-stage production process that would otherwise be required can be omitted.
  • the card body provided can comprise a metallic layer, for example made of a high-grade steel alloy, with the metallic layer being able to be covered on both main surfaces with a covering layer made of plastic such as PET, PC, PVC or PP. Furthermore, the card body provided can comprise a slot in the metallic layer running from the card edge to the cavity. This slot prevents short circuits and reduces eddy currents.
  • solder can be applied to two opposite walls of the at least one component opening. This can be done with a 2-needle injection, for example. The component is then inserted with its two electrical connections on the two walls.
  • a silicone for example, can be used as the adhesive.
  • solder is heated by one or more heat stamps and then cooled.
  • various work steps such as preheating, activating solder, activating adhesive and cooling down once or several times can be provided.
  • a method according to the invention for producing a chip card the chip card comprising a card body and a chip module arranged therein, provides for the following steps:
  • This method is also based on the basic idea that at least one additional electronic component, for example a discrete component such as a capacitor, is arranged in at least one component opening that is matched to it.
  • a discrete component such as a capacitor
  • the solder material such as solder paste and the soldering process are eliminated. Otherwise, the same advantages and modifications as previously described apply.
  • a chip of the chip module which is cast in a casting compound, can be introduced into the blind hole.
  • a blind hole can be dispensed with.
  • a card body according to the invention for a chip card comprises a cavity set up to accommodate a chip module and at least one component opening in a main surface of the card body, each set up to accommodate one or more electronic components, the at least one component opening being arranged in an overlapping area that is designed such that it is covered by the chip module that can be arranged later on the card body.
  • the overlapping area and the cavity can have identical dimensions.
  • the at least one component opening is formed in the cavity.
  • a blind hole designed to accommodate a part of the chip module is cut out in the cavity and that the overlapping area is arranged between the blind hole and an edge of the cavity.
  • a chip of the chip module which is cast in a casting compound, can be introduced into a blind hole. With a flip-chip assembly of the chip module, a blind hole can be dispensed with.
  • each component opening can be precisely matched to the respective component or component.
  • the depth of the component opening can be dimensioned in such a way that the component used comes into electrical contact with a conductor of the chip module.
  • a chip card according to the invention comprises a card body as described above, a chip module arranged on the chip card and at least one electronic component which is arranged in the at least one component opening.
  • FIG. 2 shows a sectional view of a chip card with card body and chip module
  • FIG. 5 a flowchart of a second method for producing a chip card.
  • 1 shows a card body 10 for a chip card.
  • the card body 10 has a metallic layer 11 whose main surfaces are each covered with a plastic layer 12 and 13 (FIG. 2).
  • the card body 10 has two opposite major faces, one major face 14 of which is visible in FIG.
  • the main surface 14 is delimited by an encircling peripheral surface 15 or a rim.
  • the metallic layer 11 can be present, for example, in the form of a core or a layer made of a high-grade steel alloy, for example with a thickness of 400 ⁇ m.
  • the thickness of the card body 10 can be between 50 ⁇ m and 920 ⁇ m, for example.
  • a module opening or cavity 16 for a chip module is made in the main surface 14 of the card body 10 .
  • the cavity 16 comprises a central blind hole 16a and a peripheral edge area or overlapping area 16b.
  • the overlapping area 16b corresponds to the area of the layout of the card body 10 or the chip card in which the chip module is arranged
  • a slot 17 is provided in the metallic layer 11 and extends from the peripheral surface 15 or, in other words, from an outer edge of the card body 10 to the cavity 16 .
  • the slot 17 thus connects the cavity 16 with the peripheral surface 15.
  • Fig. 1 the slot 17 is shown on a left-hand side.
  • the slot 17 can also be arranged on a right, upper or lower side of the card body 10 .
  • the slot 17 serves to avoid short-circuit currents or eddy currents.
  • At least one component opening 18 in the main surface 14 of the card body 10 is made in the overlapping region 16b.
  • there are two Component openings 18 are provided, but more, for example 3 to 5 component openings 18 are also possible.
  • the component opening 18 is specially designed to accommodate one or more electronic components.
  • This component can be used, for example, to adapt the power of the resonant circuit of the chip module or to optimize other signaling and/or supply technology.
  • the component can be a capacitor, for example.
  • components with the size 0402 (0.6 x 0.3 mm) can be used.
  • the component opening 18 is formed independently of the blind hole 16a both in the spatial arrangement and in the function.
  • the at least one component opening 18 is formed in a bottom surface of the cavity 16, here in the overlapping area 16b.
  • the overlapping area and the cavity can have identical dimensions.
  • Fig. 2 shows a sectional view of a chip card 20 with a chip module 21 and a card body 10.
  • the cavity 16 is only a part of the depth of the plastic layer 12 excepted.
  • the overlapping area 16b is formed in the plastic layer 12 .
  • the blind hole 16a extends through the entire plastic layer 12, the entire metallic layer 11 and part of the plastic layer 13.
  • the cavity 16 and the blind hole 16a are created, for example, by means of a laser operation or a milling operation.
  • the component opening, not shown here, can also be created in this operation.
  • the chip module 21 is arranged in the cavity 16 and the blind hole 16a and glued there, for example.
  • the chip module 21 includes a contact surface structure 22, carrying a coil 23.
  • the coil 23 can be arranged on a module tape, not shown here.
  • the contact surface structure 22 rests on the plastic layer 12 in the overlapping area 16b of the cavity 16 .
  • the coil 23 can have approximately 12 to 16 turns, which run concentrically around the chip 24 here.
  • the width of a turn can be 50 pm to 70 pm and the distance between two turns can be 100 pm.
  • the windings can have a copper thickness of up to about 30 ⁇ m. A maximum of 2.5 pH can be reached with such a coil.
  • a multi-layer coil can be provided for a higher inductance. This can be implemented with additional windings on the top of the chip module or with a multilayer circuit board. In the case of the multilayer board, a further coil or further turns of a coil is placed in an intermediate layer of the multilayer board.
  • the limitation of the limited space in the chip module can be lifted and a higher inductance can be made available.
  • the chip module 21 also includes a chip 24, for example in the form of an integrated circuit, which is attached to an underside of the contact surface structure 22 in a potting compound, for example.
  • the chip 24 is supplied with energy and/or signals via the coil 23 .
  • An electromagnetic field emerging from the metallic layer 11 can thus be coupled into the coil 23 .
  • the chip 24 can be or contain a chip card controller with RFID functionality.
  • FIG. 3 shows an equivalent circuit diagram of the chip module 21 of the chip card 20.
  • the chip module 21 of the chip card 20.
  • the 21 comprises the chip 24 in the form of an integrated circuit, for example.
  • the chips 24 can, for example, be soldered onto the chip module 21 or applied to the chip module 21 by flip-chip assembly.
  • the chip 24 contains a card controller for the chip card 20.
  • the chip 24 usually contains a processor for executing control functions for the chip card 20 and for communication and for executing arithmetic operations, for example for security functions.
  • the chip 24 contains a memory area for storing and/or making data available.
  • the chip 24 also contains a capacitor 25 with a capacitance of 78 pF, for example.
  • the coil 23 is connected in parallel to the chip 24 and has a maximum inductance of 3.5 pH in the case of the coil 23 shown in FIG. 2 in one plane. With a two-level coil, the inductance can be greater than 3.5 pH.
  • the coil 23 and the internal capacitor 25 of the chip 24 form an oscillating circuit.
  • the chip module 21 can communicate with a reader that is external to the chip card 20 .
  • the power of the chip module 21 has been adapted to an external reading device.
  • the aim is to adapt the coil 23 to the chip 24 in such a way that the quality of the oscillating circuit is increased and that apparent and reactive power are minimized.
  • the resonance frequency of the oscillating circuit is adapted to the resonance frequency of the reader.
  • This example assumes an RFID reader with a resonant frequency of 13.56 MHz.
  • the inductance can be designed as large as possible, even beyond 2.6 pH. This is important for the energy input into the chip module 21 or the chip 24 as well as for the quality.
  • the coil 23 is connected between two contact points or terminals 26 and 27 .
  • the connections 26 and 27 can be connections of the chip 24, contact points on a circuit board or theoretical nodes.
  • the coil 23 is connected in parallel to the terminals 26 and 27.
  • a component 28 external to the chip 24 is provided here in the form of a first power adjustment capacitor, which is arranged in series with the coil 23 .
  • the first and further power adjustment capacitors can compensate for the apparent power. For example, one to five, in particular two to three, power adjustment capacitors can be provided.
  • a capacitor value between 10 pF and 200 pF is provided.
  • the power adjustment capacitor 28 can be connected to the module tape as an external component either via a soldering process or a bonding process. If the required capacitor value is less than 20 pF, this can also be formed on the chip module 21 via unused module pads, for example C4, C5 and/or C7. Above all, this is possible when a multilayer tape is used.
  • the chip module 21 or the oscillating circuit can be adapted together with the power adjustment capacitor 28 to a resonant frequency of the oscillating circuit between 13 MHz and 14 MHz and preferably 13.56 MHz, so that the resonant frequency of the oscillating circuit matches the resonant frequency of the reading device.
  • the effects of the metallic layer 11 on the resonant circuit, in particular the coil 23, are taken into account.
  • the two power adjustment capacitors or devices 28 and 29 allow fine tuning or tuning of the tank circuit.
  • the target frequency is set and, on the other hand, the reactive or apparent power is set as low as possible via the power adjustment capacitors or components 28 and 29 inserted in the resonant circuit.
  • the two capacitances should be selected in such a way that the Q factor is as high as possible, so that the resonant circuit only has weak damping. This can be done using a Smith chart, for example.
  • the two power matching capacitors or devices 28 and 29 are located in the device openings 18 .
  • the two components 28 and 29 can each be arranged in their own component opening 18, as shown in FIG. It is also possible for the two components 28 and 29 to be arranged in a common component opening 18 .
  • the component openings 18 are positioned in the card body 10 such that these positions are congruent with the positions on the module tape where the external components are soldered or electrically connected.
  • Fig. 4 shows a flow chart of a first method for producing a chip card 20.
  • the card body 10 is provided.
  • the card body can comprise a central metallic layer 11, the main sides of which are each laminated with a plastic layer 12, 13.
  • the slot 17 can already be removed in the metallic layer 11 .
  • cavity 16 is removed to accommodate chip module 21.
  • Cavity 16 can include a blind hole 16a.
  • the cavity 16 can be removed or created using a milling device or a laser cutting machine.
  • a third step 120 at least one component opening 18 is cut out for one or more electronic components 28 and 29 in a covering area 16b.
  • the overlapping area 16b can lie in the cavity 16, so that the component opening 18 is formed in a bottom surface of the cavity 16.
  • FIG. The overlapping area 16b is covered by the chip module 21 arranged later.
  • the second and third step 110, 120 can be carried out in one work step, also called the production step milling.
  • the component openings 18, are milled into the card body 10 in the region of the cavity 16. This position is congruent with the position on the module tape where the external components 28 and 29 are to be soldered.
  • solder is applied to the electronic component(s) 28, 29, into the at least one component opening 18 and/or an underside of the chip module 21. All options allow an electrically conductive connection between the electronic components 28, 29 and the chip module 21.
  • a reflow soldering process such as the T-Connect process with a solder paste can be used to achieve a soldering between two elements.
  • the external component 28, 29 can now be provided with the soldering paste before placement.
  • the soldering paste can be introduced into the existing cavity 16 on the sides with a 2-needle injection. It is also possible to order the external component 28, 29 with the soldering paste already applied.
  • the chip module can also be applied with the soldering paste, for example using a stamp (standard procedure for scraping).
  • a fifth step 140 the electronic component(s) 28, 29 is/are placed in the at least one component opening 18.
  • the electronic components 28, 29 in the form of the additional capacitors can be delivered on a roll. This means that a gripper or vacuum sucker gets the components individually and can place them anywhere, for example directly in the component openings 18. This can also be done with vacuum tweezers.
  • the one or more electronic components 28, 29 can be pre-fixed to the chip module 21 with an elastic adhesive such as silicone. Then the electronic components 28, 29 are used together with the chip module 21, so that the steps of placing 140 and introducing 150 are carried out simultaneously.
  • the chip module 21 is introduced into the cavity 16. This can be done with a stamp, for example.
  • the chip module 21 is now located in the overlapping area 16b and covers the electronic components 28, 29 which are located in the component opening or openings 18.
  • FIG. in a seventh step 160 the solder is heated.
  • the solder can be heated by one or more heat stamps and then cooled.
  • the component 28, 29 is now soldered to the chip module 21 with the heat stamp by means of the soldering paste. Since the soldering paste contracts during the melting process, the component 28, 29 is pulled against the printed circuit board.
  • various work steps such as preheating, activating solder, activating adhesive and cooling down once or several times can be provided.
  • FIG. 5 shows a flow chart of a second method for producing a chip card 20.
  • an electrically conductive adhesive is used instead of solder.
  • the soldering paste and the soldering process are omitted.
  • the card body 10 is provided.
  • the card body can comprise a central metallic layer 11, the main sides of which are each laminated with a plastic layer 12, 13.
  • the slot 17 can already be removed in the metallic layer 11 .
  • cavity 16 is removed to accommodate chip module 21.
  • Cavity 16 can include a blind hole 16a.
  • the cavity 16 can be removed or created using a milling device or a laser cutting machine.
  • a third step 220 at least one component opening 18 is cut out for one or more electronic components 28 and 29 in a covering area 16b.
  • the overlapping area 16b can lie in the cavity 16, so that the component opening 18 is formed in a bottom area of the cavity 16.
  • FIG. The overlapping area 16b is covered by the chip module 21 arranged later.
  • the second and third step 110, 120 can be carried out in one work step, also called the production step milling. In order to obtain the placement at the correct position under the chip module 21, two additional indentations, the component openings 18, are milled into the card body 10 in the area of the cavity 16. This position is congruent with the position on the module tape where the external components 28 and 29 are to be soldered.
  • electrically conductive adhesive is applied to the electronic component(s) 28, 29, into the at least one component opening 18 and/or an underside of the chip module 21. All options allow an electrically conductive connection between the electronic components - elements 28, 29 and the chip module 21.
  • a connection with a conductive adhesive in particular with silicone adhesives, is elastic and therefore more mechanically resilient.
  • Conductive adhesives consist of an adhesive such as a resin and electrically conductive fillers.
  • Well-suited fillers include, for example, silver (conductive silver adhesive), gold, palladium, nickel and platinum.
  • a fifth step 240 the electronic component(s) 28, 29 is/are placed in the at least one component opening 18.
  • the electronic components 28, 29 in the form of the additional capacitors can be delivered on a roll. This means that a gripper or vacuum sucker gets the components individually and can place them anywhere, for example directly in the component openings 18. This can also be done with vacuum tweezers.
  • the one or more electronic components 28, 29 can be pre-fixed to the chip module 21 with an elastic adhesive such as silicone. Then the electronic components 28, 29 are used together with the chip module 21, so that the steps of placing 240 and bringing in 250 are performed simultaneously.
  • a sixth step 250 the chip module 21 is introduced into the cavity 16. This can be done with a stamp, for example.
  • the chip module 21 is now located in the overlapping area 16b and covers the electronic components 28, 29 which are located in the component opening or openings 18.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un procédé de production d'une carte à puce (20), ladite carte à puce (20) comprenant un corps de carte (10) et un module de puce (21) disposé sur celui-ci. Le procédé comprend les étapes consistant à utiliser (100) un corps de carte (10) ; former (110) une cavité (16) destinée à recevoir le module de puce (21) ; former (120) au moins une ouverture pour composant (18) pour chacun d'un ou plusieurs composants électroniques (28, 29) dans une région de chevauchement (16b), qui est recouverte par le module de puce (20) disposé ultérieurement ; appliquer (130) un matériau de brasage sur le ou les composants électroniques (28, 29), dans la ou les ouvertures pour composant (18) et/ou sur une face inférieure du module de puce (21) ; placer (140) le ou les composants électroniques (28, 29) dans la ou les ouvertures pour composant (18) ; introduire (150) le module de puce (21) dans la cavité (16) ; et chauffer (160) le matériau de brasage.
EP22709178.2A 2021-02-03 2022-02-02 Procédé de production d'une carte à puce, corps de carte pour une carte à puce, et carte à puce Pending EP4288903A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021000556.2A DE102021000556A1 (de) 2021-02-03 2021-02-03 Verfahren zur Herstellung einer Chipkarte, Kartenkörper für eine Chipkarte und Chipkarte
PCT/EP2022/025034 WO2022167150A1 (fr) 2021-02-03 2022-02-02 Procédé de production d'une carte à puce, corps de carte pour une carte à puce, et carte à puce

Publications (1)

Publication Number Publication Date
EP4288903A1 true EP4288903A1 (fr) 2023-12-13

Family

ID=80684994

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22709178.2A Pending EP4288903A1 (fr) 2021-02-03 2022-02-02 Procédé de production d'une carte à puce, corps de carte pour une carte à puce, et carte à puce

Country Status (4)

Country Link
US (1) US20240127023A1 (fr)
EP (1) EP4288903A1 (fr)
DE (1) DE102021000556A1 (fr)
WO (1) WO2022167150A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997005569A1 (fr) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Support de donnees comportant un module pourvu d'un composant et d'une bobine, et procede de fabrication dudit support de donnees
DE19749650C2 (de) 1997-11-10 2000-01-13 Meinen Ziegel & Co Gmbh Verfahren zum Herstellen einer elektrischen Verbindung eines in einer Kavität eines Kartenkörpers einer Chipkarte eingesetzten, elektronische Komponenten aufweisenden Moduls
JP3916407B2 (ja) 2001-03-21 2007-05-16 松下電器産業株式会社 積層型電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び電子部品実装済完成品
EP3474639B1 (fr) * 2017-10-20 2021-07-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Incorporation d'un composant dans un support de composant en transférant le composant dans une cavité déjà remplie de matériau de remplissage

Also Published As

Publication number Publication date
US20240127023A1 (en) 2024-04-18
WO2022167150A1 (fr) 2022-08-11
DE102021000556A1 (de) 2022-08-04

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