EP4211989A1 - Commande compacte pour moyen d'éclairage de véhicule à moteur - Google Patents
Commande compacte pour moyen d'éclairage de véhicule à moteurInfo
- Publication number
- EP4211989A1 EP4211989A1 EP21777701.0A EP21777701A EP4211989A1 EP 4211989 A1 EP4211989 A1 EP 4211989A1 EP 21777701 A EP21777701 A EP 21777701A EP 4211989 A1 EP4211989 A1 EP 4211989A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- led driver
- circuit elements
- interface
- led
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 104
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000005516 engineering process Methods 0.000 claims description 69
- 238000012360 testing method Methods 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000004891 communication Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 5
- 101100245765 Arabidopsis thaliana PSI3 gene Proteins 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 8
- 230000011664 signaling Effects 0.000 abstract description 5
- 230000010354 integration Effects 0.000 description 11
- 239000013078 crystal Substances 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 4
- 230000005669 field effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/44—Details of LED load circuits with an active control inside an LED matrix
- H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/105—Controlling the light source in response to determined parameters
- H05B47/11—Controlling the light source in response to determined parameters by determining the brightness or colour temperature of ambient light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/175—Controlling the light source by remote control
- H05B47/18—Controlling the light source by remote control via data-bus transmission
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0922—Combination of complementary transistors having a different structure, e.g. stacked CMOS, high-voltage and low-voltage CMOS
Definitions
- the invention relates to a device for driving an LED lighting device, an LED lighting device with such a driving device and a method for producing such a driving device.
- the invention thus relates, for example, to a control device for a lighting device with a (e.g. CAN communication data bus interface), a computer core (microcontroller) and with a driver circuit for one or more LED light sources.
- a control device for a lighting device with a (e.g. CAN communication data bus interface), a computer core (microcontroller) and with a driver circuit for one or more LED light sources.
- the bus driver modules of actuators and microcontrollers in a satellite system/bus system for controlling consumers are designed as separate modules of a bus subscriber, which are typically arranged on a common circuit board.
- the reason for this is that very powerful computers are preferably required, which are then implemented in a semiconductor technology node with the smallest possible structural size.
- the so-called bus transceivers which represent the actual interface to the data buses, include power transistors whose structure sizes cannot be arbitrarily reduced for physical reasons, namely because of the required current-carrying capacity.
- typically two different components (IC chips) in two semiconductor technologies, namely the bus transceiver and the driver/LED (analogue part) are installed separately from the high-performance ken computers (digital part) and mounted on printed circuits.
- a lighting device with a control device with a DALI interface is known from DE 20 2004 006 292 U1.
- the known control device has a number of modules, which components the individual modules comprise remains open.
- a projection module is known from DE-A-10 2009 004 117.
- LED lamp control devices with circuit elements of interface, microcontroller and LED driver circuits integrated on a common chip is known from EP-A-3 478 031.
- the invention is therefore based on the object of creating an optimal solution for LED drivers in automobile systems, which avoids the above disadvantages of the prior art and has further advantages.
- the invention proposes a device for controlling an LED lighting device, the control device being provided with an input designed as a data interface for connection to a communication data bus, an output with at least one connection for at least an LED light source, which has an LED or a series connection of LEDs or a group of different colored LEDs or a series connection of groups of different colored LEDs, a microcontroller, one or more LED driver circuits, with each connection of the output for an LED light source being assigned an LED driver circuit, with the data interface, the microcontroller, the LED driver circuit or the LED driver circuits and the at least one connection of the output being electrically connected to one another are, wherein the data interface, the microcontroller and the LED driver circuit or the LED driver circuits have electronic and/or electrical circuit elements (also referred to as circuit components), and a semiconductor substrate in which the circuit elements of the data interface, the microcontroller and the LED driver circuit or the LED driver circuits are integrated using a semiconductor technology for the production of integrated circuits with the smallest possible structure size specified by the semiconductor technology
- the invention therefore proposes a control device for an LED lighting device, in which a plurality of electrical circuits are integrated in a common semiconductor substrate. These are the circuits for the data interface, the microcontroller and the at least one LED driver. It is essential for the invention that the semiconductor technology to be used (and thus the smallest possible structure size of the circuit components) is measured according to the minimum structure size for the circuit components of the data interface and the at least one LED driver to ensure their functionality is still permitted.
- the smallest "feature size” that can be realized in the manufacture of an integrated circuit using semiconductor technology refers, as is known to those skilled in the art, to the shortest edge length of a part (ie a feature size of a part) of a circuit component, with typically the shortest possible length of the gate of a field effect transistor is meant.
- the shortest edge length of a part of a circuit component of the data interface and/or the LED driver circuit(s) is therefore equal to the shortest edge length of a part of a circuit component of the microcontroller, namely the shortest gate length of a field effect transistor or of the field effect transistors of the micro - controllers.
- the semiconductor technology used according to the invention is not that which could determine the minimum permissible structure sizes for the circuit components of the microcontroller.
- circuit components such as transistors and gates of microcontrollers do not need to have the same current carrying capacity as is the case, for example, with data interfaces and LED drivers. Therefore, the circuit components of the microcontroller can be made smaller than is the case for the analog part of the overall circuit integrated in the semiconductor substrate.
- This semiconductor technology which is tailored to the microcontroller, would now typically be used in order to then use it to produce larger-format circuit components for the data interface and the at least one LED driver. However, this is more expensive overall, because the semiconductor technology that allows a higher density of circuit components is more complex to implement.
- the invention thus departs from the hitherto known concept of IC chip design, which, as will be described further below, is associated with significant technical and economic advantages.
- Particularly suitable as semiconductor technology are those whose smallest possible structural size is greater than, in particular, 85 nm and smaller than, in particular, 200 nm. All values in the aforementioned range for the smallest possible structure size of the semiconductor technology to be used are hereby covered by the application.
- the device can be provided with a voltage regulator that has circuit elements that are integrated in the semiconductor substrate, the semiconductor technology used being determined by the minimum structure size for the circuit elements of the data interface and the LED driver circuit or the LED driver circuits and the voltage regulator to ensure their functionality is permitted.
- the semiconductor substrate thus has a further component which is in the form of an analog circuit and consequently also includes power transistors and wide conductor tracks, for example.
- the device is provided with an electronic and/or electrical circuit elements having a test interface integrated in the semiconductor substrate for testing the functionality of the data interface and/or the microcontroller and/or the LED driver circuit the LED driver circuits and/or the voltage regulator, if present, whereby the semiconductor technology used is determined by the minimum structure size for the circuit elements of the data interface, the LED driver circuit or the LED driver circuits, the voltage regulator and the test interface to ensure their functionality is still permissible.
- This can be a boundary scan test, for example, or tests that specifically address and test certain components of the semiconductor IC.
- the device has a sensor interface having electrical and/or electronic circuit elements integrated in the semiconductor substrate.
- a sensor interface having electrical and/or electronic circuit elements integrated in the semiconductor substrate.
- at least one sensor such as a light brightness and/or a light color sensor and/or a sun sensor, which is or can be connected to a data communication bus that can be connected to the sensor interface, with the The semiconductor technology used is determined according to which minimum structure size is still permissible for the circuit elements of the data interface, the LED driver circuit or the LED driver circuits, the voltage regulator, the test interface and the sensor interface to ensure their functionality.
- Such a sensor interface can be, for example, one based on the PSI5 or PSI3 protocol.
- the microcontroller only has a functionality that is used to control the LED driver circuit or the LED driver circuits according to signals received from the data interface and/or from the sensor interface, if present. received signals and is required for processing signals received from the test interface, if any.
- the circuit elements whose functionality must be ensured when they are manufactured using the semiconductor technology used can be transistors and/or conductor tracks.
- an LED lighting device can now also be realized that is provided with an LED light source that has an LED or a series connection of LEDs or a group of different-colored LEDs or a series connection of groups of different-colored LEDs in each case, wherein the LED lighting means is electrically connected to the output of a device according to one of the preceding claims.
- the invention also proposes a method for producing a device for controlling an LED lighting device, the control device being provided with: an input designed as a data interface for connection to a communication data bus, an output with at least one Connection for at least one LED light source, which has an LED or a series connection of LEDs or a group of different-colored LEDs or a series connection of groups of different-colored LEDs, a microcontroller, one or more LED driver circuits, each connection of the output for an LED Illuminant is assigned an LED driver circuit, the data interface, the microcontroller, the LED driver circuit or the LED driver circuits and the at least one connection of the output being electrically connected to one another, the data interface, the microcontroller and the LED driver circuit or the LED driver circuits have electronic and/or electrical circuit elements, and a semiconductor substrate, the circuit elements of the data interface, the microcontroller and the LED driver circuit or the LED driver circuits using semiconductor technology for the production of integrated circuits integrated into the semiconductor substrate with the smallest possible structure size, which is determined by the
- the device has a voltage regulator with circuit elements that are integrated in the semiconductor substrate, the semiconductor technology used being determined by the minimum structure size for the circuit elements of the data interface, the LED driver circuit or the LED driver circuits and the voltage regulator to ensure their functionality is still permissible.
- a further advantageous embodiment of the method according to the invention can provide that the device has a test interface integrated in the semiconductor substrate and/or electrical circuit elements for testing the functionality of the data interface and/or the microcontroller and/or the LED driver circuit or the LED Has driver circuits and/or the voltage regulator, if present, with the semiconductor technology used being determined by the minimum structure size for the circuit elements of the data interface, the LED driver circuit or the LED driver circuits, the voltage regulator and the test interface for Ensuring their functionality is still permissible.
- a further advantageous embodiment of the method can include that the control device has an integrated in the semiconductor substrate electrical and / or electronic circuit elements having sensor interface for the connection of at least one sensor such as a light brightness and / or a light color sensor and / or a sun sensor that is or can be connected to a data communication bus that can be connected to the sensor interface, the semiconductor technology used being determined by the minimum structure size for the circuit elements of the data interface and the LED driver circuit or the LED driver circuits, the voltage regulator lers, the test interface and the sensor interface (PSI5, PSI3) to ensure their functionality is still permissible.
- the semiconductor technology used being determined by the minimum structure size for the circuit elements of the data interface and the LED driver circuit or the LED driver circuits, the voltage regulator lers, the test interface and the sensor interface (PSI5, PSI3) to ensure their functionality is still permissible.
- the microcontroller is only provided with a functionality that is required to control the LED driver circuit or the LED driver circuits in accordance with signals received from the data interface and/or signals received from the sensor interface, if present and is required to process signals received from the test interface, if any.
- a semiconductor technology with the smallest possible structure size is used as the semiconductor technology, which is larger than 85 nm or larger than 90 nm or larger than 100 nm or larger than 100 nm or larger than 120 nm or larger than 130 nm or larger than 140 nm or larger than 150 nm or greater than 160nm, or greater than 170nm, or greater than 180nm, or greater than 190nm.
- the semiconductor technology used is a semiconductor technology with the smallest possible structure size, which is less than 200 nm or less than 190 nm or less than 180 nm or less than 170 nm or less than 160 nm or less than 150 nm or less than 140 nm or less than 130nm or smaller than 120nm or smaller than 110nm or smaller than 100nm or smaller than 90nm or smaller than 85nm.
- the invention is a departure from previously technically typical established ways and the previous technical development, namely by co-integration of LED drivers, transceivers and microcontrollers without loss of the computing power required for the application on a semiconductor substrate is operated.
- control device The usefulness of the control device is increased by the suggestion according to the invention since, on the one hand, the chip area is reduced and, on the other hand, the outlay on assembly when implementing the control device is lowered.
- the computing power of the microphone rocontrollers in favor of the co-integration according to the invention since this reduces the possibilities for the software design of the control device, which is contrary to the efforts of those skilled in the art to want to give new systems better computing performance.
- the inventive idea clearly runs counter to this aim, namely the semiconductor technology using the smallest possible structure size of the circuit components of the data interface (transceiver) and the LED driver as well as any other analog parts of the circuit and so on should not be selected based on the smallest possible structure sizes for the digital part (microcontroller).
- the aim is to use the semiconductor technology for manufacturing the semiconductor IC whose smallest possible structure size is tailored to the needs and requirements as well as the circumstances of the digital part .
- the transistors and gates of the digital part of a semiconductor IC are much smaller than the transistors of analog parts, which usually have to be designed as power transistors with the corresponding current carrying capacity.
- semiconductor technology you are always on the safe side if you choose this technology based on the fact that it can provide the smallest possible structure sizes for the digital part. This means that the larger-area circuit elements of the analog part can then also be produced using this semiconductor technology.
- the starting point for the selection of the semiconductor technology to be used is no longer the smallest possible structural size for the digital part of the circuit, but the minimum structural size that ensures the functionality of the analog part.
- This means that the gates and transistors of the digital part now take up larger chip areas. At least part of this additional chip area can be compensated for by reducing the computer performance to what is needed for the application.
- the chip area required for the digital part may therefore be larger compared to using a semiconductor technology with a higher integration density, but this leads overall to a result that is advantageous in terms of economy, since a simpler and less complex semiconductor technology is used whose integration density is lower because it is designed for analog parts.
- a further advantage of the invention is that the control of light sources, in particular light-emitting diodes, requires only a limited amount of computing power of the computer system, so that a special performance of the computer system can be dispensed with here.
- compromises can also be made with the bit width of the ALU (and/or CPU) of the computer system and with the computing power of the computer system, such that by implementing the computer system in the same technology as that for the data bus interface and the lamp driver, the chip area required by the computer system increases and the computing power that can be achieved by the computer system as a result of the increased area requirement for the conductor tracks within the computer system (with the same chip area available for the computer system area) decreases, but on the other hand the computing power associated with the otherwise increasing chip area of the computer system for the same number of gates is not required at all for controlling the lamps and for operating the data bus interface, which is surprising for experts.
- K gd K TDB * ( K DBDB + K DB + K GDBRS ) + K TRS * ( K GRSDB + K RS + K GRSLEDD ) + n LED * K TLEDD * ( K GLEDDRS + K LEDD + K GLEDDLED )
- K DBDB Technical hardware complexity of the interface to the data bus in the data bus interface, including eg bond pads, housing connections, etc.;
- K GDBRS Technical hardware complexity of the interface between data bus interface and computer system on the side of the data bus interface, including eg bond pads, housing connections of the data bus interface, etc.;
- K TDB Semiconductor technology-specific, monetary cost factor for realizing the hardware expense of the data bus interface
- K GLEDDRS Technical hardware complexity of the interface between the computer system and a driver for a light source on the side of the driver for the light source, including eg bond pads, housing connections of the driver for the light source, etc.; K LEDD technical hardware effort of the driver for the illuminant, which is independent of the form of integration;
- K GLEDLEDD Technical hardware complexity of the interface between the driver for the light source and the light source that the relevant driver for the light source supplies with electrical energy, on the side of the driver for the light source, including e.g. bond pads, housing connections the driver for the lamp etc.;
- K TDB Semiconductor technology-specific, monetary cost factor for realizing the hardware expense of the driver for the illuminant; n LED number of light sources or light source groups and thus of drivers for light sources in the overall system;
- K gLEDDDS K TDB * ( K DBDB + K DB + K GDBRS +n LED *(K GLEDDRS + K LEDD + K GLEDDLED )) + K TRS * ( K GRSDB + K RS + K GRSLEDD ) .
- K TDB * ( K DBDB + K DB + K GDBRS ) + K TRS * ( K GRSDB + K RS + K GRSLEDD ) +n LED * KTLEDD*(KGLEDDRS+KLEDD+ K GLEDDLED )
- K GLEDDLED K GLEDDLED
- K TRS * K GRSDB +K RS + K GRSLEDD
- K GLEDDLED ⁇ K TDB * (K DBDB +K DB +K GDBRS +n LED *( K GLEDDRS +K LEDD + K GLEDDLED ))
- the integration proposed with the invention refers to the fact that all overall system parts are manufactured in a common semiconductor technology on and in a common semiconductor substrate (IC chip), this semiconductor technology being determined primarily by that used to implement the lamp driver.
- Computer system and the data bus interface and the drivers is realized for the lamps on a common semiconductor crystal
- K GDBRS , K GLEDDRS , K GRSDB and K GLEDDLED are now eliminated as costs for the overall system-internal interfaces:
- K gV K TDB *(K DBDB +K DB +K RS +n LED *K LEDD + n LED * K GLEDDLED )
- K TDB * ( K DBDB + K DB + K RS +n LED * K LEDD + n LED * K GLEDDLED ) ⁇ K TDB *(K DBDB +K DB +K GDBRS +n LED *(K GLEDDRS +K LEDD + K GLEDDLED )) + K TRS *(K GRSDB +K RS + K GRSLEDD )
- a CAN transceiver for example, as an exemplary data bus interface together with a microcontroller
- a control device for a lighting device with a CAN bus data bus interface for example, and with a computer system and with a driver circuit as a driver for one or more LED light sources is therefore proposed here, which typically can include one or more light emitting diodes.
- the CAN bus transceiver and the computer system and the driver circuit for one or more lamps are accommodated on a common semiconductor crystal or substrate such as a p-doped silicon substrate.
- the device according to the invention can also be used to control lighting devices with other light sources, or to control an optical and/or acoustic and/or tactile signaling device or to control a measuring device, in particular an optical, electrical , inductive or capacitive measuring devices can be used.
- the at least one driver circuit is then a driver for a signaling device (lamp, loudspeaker, buzzer, vibration element) or for a measuring device (measurement sensor).
- Control device for a lighting or optical signaling device or an optical measuring device in vehicles with a data bus interface, which can be a CAN bus data bus interface, and with a computer core and with a number n L ED of several driver circuits, where n L ED is a positive integer greater than 1, each driver circuit being intended to be able to supply at least one lighting device group with electrical energy, and the n LED driver circuits thus being intended to have at least n L ED -To be able to supply light source groups with electrical energy, and wherein each light source group comprises one or more light sources, which can include one or more light emitting diodes, and the data bus interface and the computer core and the n LED driver circuit are housed on a common semiconductor crystal .
- Control device for a lighting or optical signaling device or an optical measuring device in vehicles with a data bus interface in the form of a CAN bus transceiver and with a computer core and with a number n L ED of several driver circuits, where n LED is a positive integer greater than 1 is, each driver circuit is intended to be able to supply at least one lamp group with electrical energy, and the n LED driver circuits are thus intended to be able to supply at least n LED lamp groups with electrical energy, and each Lamp group comprises one or more lamps, which can include one or more light-emitting diodes, with the entire system consisting of data bus interface and computer system and drivers for the lamps being accommodated on a semiconductor crystal, and with the CAN bus transceiver and the computer core and the n L ED driver circuits of the light center l are accommodated on a common semiconductor crystal.
- a semiconducting substrate in which the circuit elements of the data bus interface (transceiver), the microcontroller and the at least one LED driver circuit and possibly also the voltage regulator are integrated, with the semiconductor substrate typically being a p-type semiconducting substrate substrate.
- a metallization stack which is common to the above-mentioned three or four components and to the components that may have additional circuit elements.
- the metallization stack can comprise insulating layers which are common to the three or four components mentioned above and to the components which have further circuit elements and which may be present.
- the metallization stack can comprise metal layers which are common to the previously mentioned three or four components and to the components which may have further circuit elements and which are present.
- the metal layers of the metallization stack have electrical lines structured by means of a microstructure technique. At least one of these lines connects two of the above-mentioned components or components of the semiconducting substrate that have further circuit elements.
- a lighting device according to the invention may have one or more features from the following list of features:
- a data bus 4. one or more LED groups, each LED group comprising one or more LEDs,
- the control IC can have the following components:
- test interface for performing a production test and/or a boundary scan test, it being possible for the test interface to be multiplexed with connections of the control IC,
- processing unit comprises a memory in the form of a RAM and/or ROM or flash memory or a one-time programmable (OTP) memory or another non-volatile memory and/or
- a memory in the form of a RAM and/or ROM or flash memory or a one-time programmable (OTP) memory or another non-volatile memory and/or
- processing unit comprises a CPU or ALU and/or
- the arithmetic unit comprises an interrupt logic and/or
- control registers or control signal generators that generate control signals for controlling the PWM units and/or
- the computing unit being connected to the CAN data bus interface via a data bus and/or
- the LED driver supplying the LEDs with a PWM-modulated or otherwise pulse-modulated current depending on P WM signals from the PWM units and depending on signals from the reference voltage source and/or reference current source and depending on a signal from the clock generator energize and/or 14.
- the PWM units generating the PWM signals as a function of states of the control signals and/or
- the device performs an auto-addressing method and/or
- the computing unit being connected to the ADC via a data bus and/or
- the voltage regulator supplies the components of the control IC with electrical energy from the supply voltage line and the ground line.
- the device according to the invention enables a more compact construction and a cost-effective production of lighting devices for e.g. vehicle applications as interior lighting or for ambient light applications in vehicles.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Led Devices (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102020123818 | 2020-09-14 | ||
PCT/EP2021/075229 WO2022053714A1 (fr) | 2020-09-14 | 2021-09-14 | Commande compacte pour moyen d'éclairage de véhicule à moteur |
Publications (1)
Publication Number | Publication Date |
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EP4211989A1 true EP4211989A1 (fr) | 2023-07-19 |
Family
ID=77914328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21777701.0A Pending EP4211989A1 (fr) | 2020-09-14 | 2021-09-14 | Commande compacte pour moyen d'éclairage de véhicule à moteur |
Country Status (7)
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US (1) | US12010773B2 (fr) |
EP (1) | EP4211989A1 (fr) |
JP (1) | JP7515014B2 (fr) |
KR (1) | KR20230069110A (fr) |
CN (1) | CN116057704B (fr) |
DE (1) | DE112021004830A5 (fr) |
WO (1) | WO2022053714A1 (fr) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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DE202004006292U1 (de) | 2004-04-21 | 2004-07-22 | Knobel Ag Lichttechnische Komponenten | Kennung für LED-Module |
DE102009004117A1 (de) | 2009-01-08 | 2010-07-15 | Osram Gesellschaft mit beschränkter Haftung | Projektionsmodul |
JP5636241B2 (ja) * | 2010-09-29 | 2014-12-03 | ローム株式会社 | Led駆動装置 |
DE102010050747A1 (de) * | 2010-11-08 | 2012-05-10 | Vishay Electronic Gmbh | Schaltungsanordnung zum Betreiben einer Leuchtdiode |
US9232587B2 (en) * | 2011-09-30 | 2016-01-05 | Advanced Analogic Technologies, Inc. | Low cost LED driver with integral dimming capability |
US8779696B2 (en) | 2011-10-24 | 2014-07-15 | Advanced Analogic Technologies, Inc. | Low cost LED driver with improved serial bus |
CN104924977A (zh) | 2015-07-17 | 2015-09-23 | 北京汽车研究总院有限公司 | 一种led驱动器、led驱动系统及led驱动装置 |
US9936552B1 (en) | 2017-02-08 | 2018-04-03 | Infineon Technologies Austria Ag | System having a driver with voltage supply using an auxiliary winding of a transformer |
US10437279B2 (en) | 2017-10-11 | 2019-10-08 | Integrated Device Technology, Inc. | Open loop solution in data buffer and RCD |
US10082823B1 (en) * | 2017-10-11 | 2018-09-25 | Integrated Device Technology, Inc. | Open loop solution in data buffer and RCD |
EP3478031B1 (fr) | 2017-10-30 | 2020-06-24 | Melexis Technologies NV | Protocole de bus pour application d'éclairage dynamique |
CN209870229U (zh) | 2018-08-01 | 2019-12-31 | 杨志超 | 一种汽车尾灯驱动系统 |
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- 2021-09-14 KR KR1020237008470A patent/KR20230069110A/ko active IP Right Grant
- 2021-09-14 US US18/044,739 patent/US12010773B2/en active Active
- 2021-09-14 DE DE112021004830.9T patent/DE112021004830A5/de active Pending
- 2021-09-14 CN CN202180062743.XA patent/CN116057704B/zh active Active
- 2021-09-14 WO PCT/EP2021/075229 patent/WO2022053714A1/fr active Application Filing
- 2021-09-14 JP JP2023516477A patent/JP7515014B2/ja active Active
- 2021-09-14 EP EP21777701.0A patent/EP4211989A1/fr active Pending
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US12010773B2 (en) | 2024-06-11 |
JP2023542502A (ja) | 2023-10-10 |
US20230380030A1 (en) | 2023-11-23 |
CN116057704A (zh) | 2023-05-02 |
DE112021004830A5 (de) | 2023-06-29 |
WO2022053714A1 (fr) | 2022-03-17 |
JP7515014B2 (ja) | 2024-07-11 |
KR20230069110A (ko) | 2023-05-18 |
CN116057704B (zh) | 2024-06-25 |
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