EP4200558A1 - Dispositif d'éclairage polychromatique, système et procédé de fabrication - Google Patents
Dispositif d'éclairage polychromatique, système et procédé de fabricationInfo
- Publication number
- EP4200558A1 EP4200558A1 EP21859274.9A EP21859274A EP4200558A1 EP 4200558 A1 EP4200558 A1 EP 4200558A1 EP 21859274 A EP21859274 A EP 21859274A EP 4200558 A1 EP4200558 A1 EP 4200558A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- light emitting
- emitting element
- color
- insulating layer
- lighting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 4
- 238000004519 manufacturing process Methods 0.000 title description 8
- 230000003287 optical effect Effects 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000000875 corresponding effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 230000009131 signaling function Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
- F21S41/24—Light guides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
Definitions
- Lighting devices based on Light Emitting Diodes may be advantageous in terms of light output and energy efficiency and may, therefore, be welcome replacements for conventional light sources, such as filament lamps in automotive applications.
- a lighting device includes an electrically insulating layer.
- the electrically insulating layer has a top surface and a metalized bottom surface and has a thermal conductivity of more than 10 W/(m*K).
- the lighting device also includes at least one first light emitting element on the top surface of the electrically insulating layer and configured to emit light of a first color and at least one second light emitting element on the top surface of the electrically insulating layer and configured to emit light of a second color.
- At least one electrical contact element is disposed at least in part on the top surface of the electrically insulating layer and is electrically coupled to at least one of the at least one first light emitting element or the at least one second light emitting element.
- FIG. 1 A is a perspective view of an example lighting device
- FIG. 1 B is a circuit diagram of an example circuit for electrically connecting the lighting device of FIG. 1A;
- FIG. 1 C is the circuit diagram of FIG. 1 B where a direction of an electrical current is reversed
- FIG. 2A is a perspective view of a lighting device
- FIG. 2B is a circuit diagram of an example circuit for electrically connecting the lighting device of FIG. 2A;
- FIG. 3 is a diagram of an example vehicle headlamp system that may incorporate the lighting device of FIG. 1 A or FIG. 2A;
- FIG. 4 is a diagram of another example vehicle headlamp system.
- FIG. 5 is a flow diagram of a method of manufacturing a lighting device, such as the lighting device of FIG. 1 A or 2A.
- Relative terms such as “below,” “above,” “upper,”, “lower,” “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the figures. It will be understood that these terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures.
- LEDs While providing such advantages in terms of light output energy and efficiency, there are many challenges associated with using LEDs as well. For example, LEDs may be difficult to accurately place with respect to complementary optical systems (such as reflectors or light guides) and thermal management may be difficult. In addition, LED based automotive lighting systems, such as daytime running lights or turn signal lights, may rely on customized and complex solutions hampering their provision by mass-production.
- Embodiments described herein provide for a lighting device that may allow for an improved thermal management, that allows the device to be used with existing complementary optical systems, and that supports reducing complexity of the overall system.
- Embodiments described herein may additionally or alternatively provide a corresponding automotive lighting system and a method for producing a lighting device.
- FIG. 1A is a perspective view of an example lighting device 100.
- the lighting device 100 includes an interface layer 101 and an electrically insulating layer 103 arranged on the interface layer 101.
- the lighting device 100 may further include a mounting portion 110 that includes respective portions of the interface layer 101 and the electrically insulating layer 103.
- a first light emitting element 111 and a second light emitting element 113 may be mounted to the mounting portion 110, thereby mechanically adjusting their respective positions within the lighting device 100.
- a gap 112 may be provided in between the first and second light emitting elements 111 , 113.
- the electrically insulating layer may serve as a support structure for the at least one first light emitting element and/or for the at least one second light emitting element and may thus be seen as a backbone of the lighting device. Further, by providing the at least one first light emitting element and the at least one second light emitting element on the electrically insulating layer, which in turn may be arranged on the interface layer, a path may be provided for directing heat generated by the light emitting elements away via the interface layer. The specific arrangement of these components may, thus, enable a beneficial heat management.
- the interface layer may be thermally conductive.
- a thermal conductivity of the interface layer may be, in embodiments, larger than 100 W/(m*K). Suitable thermal conductivity may be achieved by appropriately selecting a material or materials for the interface layer.
- the interface layer may include or be metal, such as aluminum (Al), copper (Cu) and/or gold (Au). In some embodiments, the interface layer includes or is gold-coated copper.
- the interface layer may be in direct mechanical contact with the electrically insulating layer. In this way, a thermal coupling between the interface layer and the electrically insulating layer may be achieved, which may enable an improved thermal management of the lighting device as heat generated by the at least one first and the at least one second light emitting element arranged on the insulating layer may be advantageously guided away via the interface layer.
- a thickness of the electrically insulating layer may be less than or equal to 0.5 mm, less than or equal to 0.4 mm, and/or less than or equal to 0.3 mm. Such a thin electrically insulating layer may be particularly beneficial for an improved heat transport through the electrically insulating layer.
- the interface layer may correspond to or include a plate or substrate that allows an improved coupling between this structure and the electrically insulating layer.
- the interface layer may be further coupled with a heatsink for further guiding heat away from the lighting device.
- the interface layer may be an interface plate, such as including or essentially consisting of a metal.
- the metal may have a thermal conductivity of equal to or more than 100 W/(m*K), such as more than 300 W/(m*K).
- the electrically insulating layer may be in direct mechanical contact with the interface plate.
- direct mechanical contact between the electrical insulating layer and the interface layer may enable advantageous thermal coupling of these components and, in turn, allow for heat generated by the at least one first and the at least one second light emitting element to be advantageously guided away.
- the electrically insulating layer may be formed of any suitable material, such as a suitable plastic material. However, ceramic materials may be of particular advantage.
- the electrically insulating layer may include or be a ceramic material and/or a material with a thermal conductivity of more than 10 W/(m*K) or more than 100 W/(m*K).
- the electrically insulating layer may include or be aluminum nitride (AIN). In this way, suitable mechanical stiffness and reliability can be achieved using a material with high thermal conductivity.
- the electrically insulating layer and/or the lighting device may not include an Insulated Metal Substrate (IMS).
- IMS Insulated Metal Substrate
- electrically insulating layer 103 may include a supporting portion 103a and a covering portion 103b. While supporting portion 103a may advantageously provide the overall mechanical stability of lighting device 100, the covering portion 103b may protect the first light emitting element 111 and second light emitting element 1 13 against environmental conditions, such as dust or humidity, and enhance heat dissipation by increasing the contact area of the first and second light emitting element 11 1 , 113 with electrically insulating layer 103.
- the at least one first light emitting element and/or the at least one second light emitting element may correspond to or include a light emitting diode (LED).
- the at least one first light emitting element and/or the at least one second light emitting element may correspond to or include one or more LED dies.
- the light emitting elements may include further components, the light emitted by the light emitting elements may be generated by LEDs. LEDs may be in particular advantageous in terms of energy efficiency and in that LEDs may allow for realizing different shapes and colors in accordance with desired applications.
- the at least one first light emitting element and the at least one second light emitting element may be configured to emit light of a first and a second color, respectively.
- at least one of the at least one first and the at least one second light emitting element may further include a respective phosphor layer arranged on a corresponding light output surface of the respective at least one of the at least one first light emitting element and the at least one second light emitting element.
- a phosphor coating a color of light emitted from a corresponding light emitting element may be suitably adjusted.
- at least one of the at least one first and the at least one second light emitting element may be configured as a light emitting element for directly emitting light of the first and/or the second color.
- the first color may be different from the second color.
- the first and/or the second color may be, for example, selected from: a white color, an amber color, or a cyan color.
- the first color may be a white color such that the at least one first light emitting element is configured to emit white light.
- light of the white color may be light comprising a superposition of at least two, or more than two, optical wavelength spectra (e.g., spectral colors).
- a white color may be realized by a light emitting diode configured for emitting light of blue color provided with a phosphor coating that converts part of the blue light into yellow light, the mixture of blue and yellow light generating a white appearance.
- Different white colors may be characterized by a respective color temperature.
- the first color may be a white color having a correlated color temperature (CCT) between 4000K and 6700K.
- the first and/or second color may be a cyan color, (e.g., a color in between blue and green), the at least one first and/or second light emitting element thus being respectively configured to emit light of a cyan color.
- light of a cyan color can be characterized by a spectrum of optical wavelengths with a dominant wavelength between 490 nm and 510 nm.
- the second color may be chosen from a red/magenta, green, blue/cyan, orange and/or yellow color or any combination thereof.
- the at least one second light emitting element may be configured to emit red/magenta, green, blue/cyan, orange, yellow and/or amber light.
- the second color may be an amber color (e.g. , in between yellow and orange), the at least one second light emitting element thus being configured to emit light of an amber color.
- light of an amber color can be characterized by a spectrum of optical wavelengths with a dominant wavelength between 585 nm and 600 nm.
- the at least one second light emitting element may be a light emitting diode (LED) provided with a suitable phosphor coating and thus configured to emit light of an amber color, such as light with a spectrum of optical wavelength with a dominant wavelength between 585 nm and 600 nm.
- LED light emitting diode
- a white light generated by the lighting device may be used to allow for an illumination function
- a cyan light may be used to allow for an autonomous driving mode
- an amber light may be used to allow for a signaling function. This may allow for sharing electrical connection and heat management by at least two light emitting elements, thus advantageously enabling a lighting device architecture offering reduced complexity.
- the at least one first light emitting element may be in particular suitable to be employed in a daytime running light mode or an autonomous driving mode, while the at least one second light emitting element, being configured for amber or cyan light emission, may be suitable to be employed in a turn signal mode or an autonomous driving mode.
- the at least one first light emitting element and the at least one second light emitting element may be arranged on and in direct mechanical contact with the electrically insulating layer.
- the at least one first light emitting element and the at least one second light emitting element may be in direct thermal coupling with the electrically insulating layer such that heat generated by the light emitting elements can be efficiently dissipated away by the described combined effect of the electrically insulating layer and the interface layer.
- the at least one first light emitting element and the at least one second light emitting element may be arranged adjacent to each other, such that respective light emission surfaces of the at least one first and the at least one second light emitting element are arranged in a common plane. Being arranged adjacent, the at least one first light emitting element and the at least one second light emitting element may be mutually arranged in close proximity (e.g. , in direct contact or with only a thin gap provided in between the at least one first light emitting element and the at least one second light emitting element).
- the gap between the at least one first light emitting element and the at least one second light emitting element may have a width equal to or less than 25% of a width of the at least one first light emitting element and/or of the at least one second light emitting element, less than 10%, and/or less than 5%.
- the gap may be filled with air or a different material.
- the lighting device 100 may further include a connection portion 120 also including respective portions of the interface layer 101 and the electrically insulating layer 103.
- Connection portion 120 may further include electrical contact elements 121 , 123, 125, thereby allowing for electrically connecting the lighting device 100 to a power supply (not shown).
- the electrical contact elements 121 , 123, 125 may be respectively in electrical contact with the first and second light emitting elements 111 , 113 via a lead frame, which may be embedded in interface layer 101 and electrically insulating layer 103 and therefore not visible in the figures.
- connection portion may include respective portions of the interface layer and the electrically insulating layer and at least one electrical contact element.
- the different thicknesses of the connection portion and the mounting portion may allow for electrically connecting the at least one electrical contact element to a power supply without hampering light emission and/or propagation, such as without having electrical contact means, such as bonding wires, blocking an optical path of light emitted by the at least one first light emitting element and the at least one second light emitting element.
- the mounting portion may include respective portions of the interface layer and the electrically insulating layer.
- the portions of the interface layer and the electrically insulating layer of the connection portion may be different from the portions of the interface layer and the electrically insulating layer comprised by the mounting portion.
- the at least one first light emitting element and the at least one second light emitting element may be at least in part received inside of at least one corresponding portion of the mounting portion.
- the mounting portion may thus support a secure mechanical adjustment of respective positions of the light emitting elements with respect to the lighting device, which may enable a precise placement of the light emitting elements with respect to corresponding (e.g., external) optical systems.
- corresponding enhanced contact surfaces may advantageously contribute to a beneficial heat transport by the mounting portion away from the light emitting elements.
- a thickness of the connection portion 120 may be smaller than a thickness of the mounting portion 1 10, and the connection portion 120 and the mounting portion 110 may be arranged mutually adjacent, thereby forming a step 130 at a transition from the connection portion 120 to the mounting portion 110.
- a height of the step may correspond to at least 10% of a maximum thickness of the lighting device, at least 20% of a maximum thickness of the lighting device, and/or at least 40% of a maximum thickness of the lighting device.
- a lighting device comprising a step may allow for a less complex manufacturing process while protecting the at least one first and/or at least one second light emitting element against environmental conditions such as dust or humidity.
- the at least one electrical contact element may be arranged on, or in direct mechanical contact with, the electrically insulating layer, and may be configured for electrically connecting the at least one first light emitting element and/or the at least one second light emitting element to a power source. Placing the at least one electrical contact element on top of the electrically insulating layer instead of contacting the lighting device from, for example, its bottom side, may advantageously enable use of a large, metallic, thermal pad as the interface layer, thus reducing the thermal resistance of the lighting device.
- the interface layer may correspond to or include a thermal pad, such as a thermal pad including or being metal.
- the thermal pad may cover essentially an entire bottom face of the lighting device. The bottom face may be opposite a face of the lighting device at which the at least one first and the at least one second light emitting elements are arranged.
- the at least one electrical contact element includes an essentially planar contact portion and may be arranged on the electrically insulating layer within the connection portion.
- Essentially planar may be understood such that, in some embodiments, a height of the essentially planar contact portion is significantly smaller than a length and/or width of the essentially planar contact portion. In embodiments, the height of the essentially planar contact portion may amount to less than or equal to 10% of the length and/or width of the essentially planar contact portion or, in some embodiments, less than or equal to 5%.
- the essentially planar contact portion may be arranged essentially parallel to a bottom surface of the lighting device and/or to respective light emitting surfaces of the at least one first light emitting element and/or the at least one second light emitting element. Being arranged essentially parallel may be understood such that, in some embodiments, an angle formed by the essentially planar contact portion and respective light emitting surfaces may be smaller than 10°, smaller than 5°, and/or smaller than 3°. Arranging the essentially planar contact portion essentially parallel to a bottom surface of the lighting device and/or to respective light emitting surfaces may advantageously result in a uniform shape of the lighting device, thereby offering reduced complexity in terms of an overall shape of the lighting device and simplifying the electrical connection of the lighting device.
- the at least one essentially planar electrical contact element may correspond to or comprise at least one contact pad and/or bond pad.
- essentially planar electrical contact elements may be advantageous as it may support enhancing robustness of the lighting device and contribute to achieving a particularly reliable electrical connection. Using such contact elements may avoid, for example, that portions of the contact element stick out and help the lighting device be less prone to damage (e.g. , during manufacturing and/or upon mounting).
- the at least one electrical contact element may be located on a topside of the lighting device, where the topside of the lighting device may correspond to a light emitting side of the lighting device.
- the at least one electrical contact element may be configured to be electrically contacted from the top.
- the lighting device may include at least three electrical contact elements, two of which may be respectively electrically connected with a corresponding one of the at least one first and the at least one second light emitting element.
- One of the at least three electrical contact elements may be electrically connected to both of the at least one first light emitting element and the at least one second light emitting element.
- Three or more electrical contact elements may enable independently contacting the at least one first light emitting element and the at least one second light emitting element.
- the electrical contact elements may serve as anode and/or cathode for the at least one first light emitting element and/or for the at least one second light emitting element, respectively.
- Independently contacting the light emitting elements may advantageously enable independently turning the light emitting elements ON or OFF and thus enable use of the light emitting elements in accordance with one or more predetermined modes of operation.
- a mode of operation may, for example, correspond to a daytime running light mode, an autonomous driving mode and/or a mode of using, for example, the at least one second light emitting element as turn signal light.
- the at least one electrical contact element may be electrically connected with the at least one first light emitting element and/or the at least one second light emitting element by means of a lead frame.
- the lead frame may be or comprise a metal structure, such as a metal structure embedded in the lighting device, configured for carrying electrical power from a power source to the at least one first light emitting element and/or the at least one second light emitting element via the at least one electrical contact element.
- the lead frame may serve for electrically connecting the lighting device to a power source.
- FIG. 1 B is a circuit diagram of an example circuit for electrically connecting the lighting device 100 of FIG. 1A.
- Reference numerals 211 and 213 denote the first light emitting element 111 and the second light emitting element 113 of FIG. 1A.
- the light emitting elements may be electrically connected to a power source (not shown) by electrical contact elements 221 , 223, 225, thereby allowing for carrying electrical power from the power source to the first light emitting element 211 and the second light emitting element 213.
- FIG. 1 C is the circuit diagram of FIG. 1 B where a direction of an electrical current is reversed as indicated by the direction arrows direction by light emitting elements 211 , 213.
- FIG. 2A is a perspective view of a lighting device 100’.
- the lighting device 100’ includes an interface layer 101 ’ and an electrically insulating layer 103’ arranged thereon.
- the lighting device 100’ may further include a mounting portion 110’ including respective portions of the interface layer 101’ and the electrically insulating layer 103’.
- First and second light emitting elements 111 ’ and 113’ may be mounted to the mounting portion 110’, and a gap 112’ may be formed in between the first and second light emitting elements 11 T, 113’.
- Electrically insulating layer 103’ may include a supporting portion 103a’ and a covering portion 103b’ offering the same advantages as described above for FIG. 1 A.
- the lighting device 100’ may further include a connection portion 120’ including respective portions of the interface layer 101 ’ and the electrically insulating layer 103’.
- Connection portion 120’ may include electrical contact elements 121’, 123’, 124’, 125’, thereby allowing for electrically connecting the lighting device 100’ to a power supply.
- a thickness of the connection portion 120’ may be smaller than a thickness of the mounting portion 110’, and the connection portion 120’ and the mounting portion 110’ may be arranged mutually adjacent, thereby forming a step 130’ at a transition from the connection portion 120’ to the mounting portion 110’.
- the lighting device may include at least a first, a second, a third and a fourth electrical contact element.
- the last at least one first light emitting element may be electrically connected to the first and the second contact element, and the at least one second light emitting element may be electrically connected to the third and the fourth contact element.
- FIG. 2B is a circuit diagram of an example circuit for electrically connecting the lighting device 100’ of FIG. 2A.
- a first light emitting element 211 ’ and a second light emitting element 213’ may be electrically connected to a power source (not shown) by electrical contact elements 221 ’, 223’, 224’, 225’, thereby allowing for carrying electrical power from the power source to the first light emitting element 21 1 ’ and the second light emitting element 213’.
- a lighting device such as described above, may be included in an automotive lighting system.
- the automotive lighting system may correspond to or include an automotive daylight running system, an automotive autonomous driving indication system, an automotive turn signal lighting system and/or an automotive headlight lighting system.
- automotive lighting system may include the necessary components including, for example, a controller for controlling power supply to the at least one first and/or the at least one second light emitting element.
- the controller may be a separate component and/or integrated in an automotive control system for controlling further functions.
- the automotive lighting system may further include at least one optical element configured for shaping a beam of light emitted from the at least one first light emitting element and the at least one second light emitting element.
- Shaping a beam of light may be understood as adjusting, for example, a direction, intensity, shape or pattern of a beam of light emitted from the at least one first and/or the at least one second light emitting element.
- Shaping a beam of light emitted from each of the at least one first light emitting element and the at least one second light emitting element with at least one common optical element may advantageously support use of the at least one first light emitting element and the at least one second light emitting element in the automotive lighting system in the at least two predetermined modes of operation.
- the at least one optical element may include one or more reflectors and/or lens elements.
- one or more lens elements may be incorporated in an outer glass portion through which the beam of light is outwards.
- the automotive lighting system may further include a controller configured to respectively control the at least one first and/or the at least one second light emitting element to be turned ON and/or OFF in accordance with at least one predetermined mode of operation.
- the controller may be a separate controller or may be a subcomponent of a control system.
- the controller may correspond to a suitable dedicated controller or may correspond to or include a microprocessor.
- the predetermined mode of operation may be at least one of: a daytime running mode wherein the first color is a white color and according to which the at least one first light emitting element is turned ON and the at least one second light emitting element is turned OFF; a turn-signal mode wherein the second color is an amber color and according to which the at least one second light emitting element is, in particular periodically, turned ON and OFF and the at least one first light emitting element is turned OFF; a first autonomous driving mode wherein the first color is a cyan color and according to which the at least one first light emitting element is turned ON and the at least one second light emitting element is turned OFF; a second autonomous driving mode wherein the second color is a cyan color and according to which the at least one first light emitting element is turned OFF and the at least one second light emitting element is turned ON.
- the lighting device may include at least one first light emitting element configured to emit either light of a white color (e.g . , for use in the daytime running mode) and/or light of a cyan color (e.g., for use in the first autonomous driving mode) and at least one second light emitting element configured to emit either light of an amber color (e.g. for use in the turn signal mode) or light of a cyan color (e.g. for use in the second autonomous driving mode).
- a white color e.g . , for use in the daytime running mode
- a cyan color e.g., for use in the first autonomous driving mode
- second light emitting element configured to emit either light of an amber color (e.g. for use in the turn signal mode) or light of a cyan color (e.g. for use in the second autonomous driving mode).
- the at least one first light emitting element when used as a daytime running light or when used in the first autonomous driving mode, the at least one first light emitting element may be turned ON, whereby the at least one second light emitting element may be turned OFF.
- the at least one first light emitting element in turn signal mode, the at least one first light emitting element may be turned OFF, and the at least one second light emitting element may be (e.g., periodically) turned ON and OFF to indicate a turn of a vehicle.
- the at least one first light emitting element in the second autonomous driving mode, the at least one first light emitting element may be turned OFF, and the at least one second light emitting element may be turned ON to indicate that the vehicle is driving autonomously.
- the automotive lighting system further includes a heatsink, whereby the interface layer may be arranged in contact, such as in direct mechanical contact, with the heat sink for guiding heat generated by the at least one first light emitting element and/or the at least one second light emitting element to the heatsink.
- the interface layer may be arranged in contact, such as in direct mechanical contact, with the heat sink for guiding heat generated by the at least one first light emitting element and/or the at least one second light emitting element to the heatsink.
- FIG. 5 is a flow diagram of a method of manufacturing a lighting device, such as the lighting device 100 or 100’ of FIGs. 1A and 2A.
- the method includes providing an electrically insulating layer (502).
- a first light emitting element and a second light emitting element may be provided (504) and may be arranged on the electrically insulating layer (506).
- An electrical contact element may be provided (508) and may be arranged on the electrically insulating layer (510). The electrical contact may be electrically coupled to at least one of the first light emitting element and the second light emitting element (512).
- FIG. 3 is a diagram of an example vehicle headlamp system 300 that may incorporate the lighting device 100 or 100’ of FIG. 1A or FIG. 2A.
- the example vehicle headlamp system 300 illustrated in FIG. 3 includes power lines 302, a data bus 304, an input filter and protection module 306, a bus transceiver 308, a sensor module 310, an LED direct current to direct current (DC/DC) module 312, a logic low-dropout (LDO) module 314, a micro-controller 316 and an active head lamp 318.
- the active head lamp 318 may include all or part of the lighting device, such as the lighting device 100 or FIG. 1 A or the lighting device 100’ of FIG. 2A.
- the power lines 302 may have inputs that receive power from a vehicle, and the data bus 304 may have inputs/outputs over which data may be exchanged between the vehicle and the vehicle headlamp system 300.
- the vehicle headlamp system 300 may receive instructions from other locations in the vehicle, such as instructions to turn on turn signaling or turn on headlamps, and may send feedback to other locations in the vehicle if desired.
- the sensor module 310 may be communicatively coupled to the data bus 304 and may provide additional data to the vehicle headlamp system 300 or other locations in the vehicle related to, for example, environmental conditions (e.g., time of day, rain, fog, or ambient light levels), vehicle state (e.g., parked, in-motion, speed of motion, or direction of motion), and presence/position of other objects (e.g., vehicles or pedestrians).
- a headlamp controller that is separate from any vehicle controller communicatively coupled to the vehicle data bus may also be included in the vehicle headlamp system 300.
- the headlamp controller may be a micro-controller, such as micro-controller (pc) 316.
- the microcontroller 316 may be communicatively coupled to the data bus 304.
- the input filter and protection module 306 may be electrically coupled to the power lines 302 and may, for example, support various filters to reduce conducted emissions and provide power immunity. Additionally, the input filter and protection module 306 may provide electrostatic discharge (ESD) protection, load-dump protection, alternator field decay protection, and/or reverse polarity protection.
- ESD electrostatic discharge
- the LED DC/DC module 312 may be coupled between the filter and protection module 306 and the active headlamp 318 to receive filtered power and provide a drive current to power LEDs in the LED array in the active headlamp 318.
- the LED DC/DC module 312 may have an input voltage between 7 and 18 volts with a nominal voltage of approximately 13.2 volts and an output voltage that may be slightly higher (e.g., 0.3 volts) than a maximum voltage for the LED array (e.g., as determined by factor or local calibration and operating condition adjustments due to load, temperature or other factors).
- the logic LDO module 314 may be coupled to the input filter and protection module 306 to receive the filtered power.
- the logic LDO module 314 may also be coupled to the microcontroller 316 and the active headlamp 318 to provide power to the micro-controller 316 and/or the silicon backplane (e.g., CMOS logic) in the active headlamp 318.
- the bus transceiver 308 may have, for example, a universal asynchronous receiver transmitter (UART) or serial peripheral interface (SPI) and may be coupled to the micro-controller 316.
- the micro-controller 316 may translate vehicle input based on, or including, data from the sensor module 310.
- the translated vehicle input may include a video signal that is transferrable to an image buffer in the active headlamp module 318.
- the micro-controller 316 may load default image frames and test for open/short pixels during startup.
- an SPI interface may load an image buffer in CMOS. Image frames may be full frame, differential or partial frames.
- micro-controller 316 may include control interface monitoring of CMOS status, including die temperature, as well as logic LDO output.
- LED DC/DC output may be dynamically controlled to minimize headroom.
- other headlamp functions such as complementary use in conjunction with side marker or turn signal lights, and/or activation of daytime running lights, may also be controlled.
- FIG. 4 is a diagram of another example vehicle headlamp system 400.
- the example vehicle headlamp system 400 illustrated in FIG. 4 includes an application platform 402, two lighting devices 406 and 408, and optics 410 and 412.
- the lighting devices 406 and 408 may be LED lighting systems, such as the lighting device 100 or 100’ of FIG. 1A or FIG. 2A, or may include the lighting device 100 or 100’ plus some of all of the other modules in the vehicle headlamp system 300 of FIG. 3. In the latter embodiment, the lighting devices 406 and 408 may be vehicle headlamp sub-systems.
- the lighting device 406 may emit light beams 416 (shown between arrows 416a and 816b in FIG. 4). In the embodiment shown in FIG.
- a secondary optic 410 is adjacent the lighting device 408, and the light emitted from the lighting device 408 passes through the secondary optic 410.
- a secondary optic 412 is adjacent the lighting device 406, and the light emitted from the lighting device 406 passes through the secondary optic 412.
- no secondary optics 410/412 are provided in the vehicle headlamp system.
- the secondary optics 410/412 may be or include one or more light guides.
- the one or more light guides may be edge lit or may have an interior opening that defines an interior edge of the light guide.
- Lighting devices 408 and 406 (or the active headlamp of a vehicle headlamp sub-system) may be inserted in the interior openings of the one or more light guides such that they inject light into the interior edge (interior opening light guide) or exterior edge (edge lit light guide) of the one or more light guides.
- the one or more light guides may shape the light emitted by the lighting devices 408 and 406 in a desired manner, such as, for example, with a gradient, a chamfered distribution, a narrow distribution, a wide distribution, or an angular distribution.
- the application platform 402 may provide power and/or data to the lighting devices 406 and/or 408 via lines 404, which may include one or more or a portion of the power lines 302 and the data bus 304 of FIG. 3.
- One or more sensors (which may be the sensors in the example vehicle headlamp system 300 or other additional sensors) may be internal or external to the housing of the application platform 402.
- each lighting device 408 and 406 may include its own sensor module, connectivity and control module, power module, and/or LED array.
- the vehicle headlamp system 400 may represent an automobile with steerable light beams where LEDs may be selectively activated to provide steerable light.
- an array of LEDs may be used to define or project a shape or pattern or illuminate only selected sections of a roadway.
- infrared cameras or detector pixels within lighting device 406 and 408 may be sensors (e.g., similar to sensors in the sensor module 310 of FIG. 3) that identify portions of a scene (e.g., roadway or pedestrian crossing) that require illumination.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Un dispositif d'éclairage comprend une couche électriquement isolante. La couche électriquement isolante a une surface supérieure et une surface inférieure métallisée et a une conductivité thermique supérieure à 10 W/ (m * K). Le dispositif d'éclairage comprend également au moins un premier élément électroluminescent sur la surface supérieure de la couche électriquement isolante et configuré pour émettre de la lumière d'une première couleur et au moins un second élément électroluminescent sur la surface supérieure de la couche électriquement isolante et configuré pour émettre de la lumière d'une seconde couleur. Au moins un élément de contact électrique est disposé au moins en partie sur la surface supérieure de la couche électriquement isolante et est électriquement couplé au ou aux premiers éléments électroluminescents et/ou au ou aux seconds éléments électroluminescents.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/999,577 US20220057060A1 (en) | 2020-08-21 | 2020-08-21 | Multi-color lighting device |
EP20193561.6A EP3961705A1 (fr) | 2020-08-31 | 2020-08-31 | Dispositif d'éclairage multicolore |
PCT/US2021/047162 WO2022040632A1 (fr) | 2020-08-21 | 2021-08-23 | Dispositif d'éclairage polychromatique, système et procédé de fabrication |
Publications (1)
Publication Number | Publication Date |
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EP4200558A1 true EP4200558A1 (fr) | 2023-06-28 |
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ID=80323274
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EP21859274.9A Pending EP4200558A1 (fr) | 2020-08-21 | 2021-08-23 | Dispositif d'éclairage polychromatique, système et procédé de fabrication |
Country Status (5)
Country | Link |
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EP (1) | EP4200558A1 (fr) |
JP (1) | JP2023538102A (fr) |
KR (1) | KR20230057399A (fr) |
CN (1) | CN116420046A (fr) |
WO (1) | WO2022040632A1 (fr) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006080383A (ja) * | 2004-09-10 | 2006-03-23 | Matsushita Electric Ind Co Ltd | 発光装置及びその温度検出方法 |
KR102310797B1 (ko) * | 2013-12-17 | 2021-10-15 | 루미리즈 홀딩 비.브이. | 로우 및 하이 빔 led 램프 |
JP6414141B2 (ja) * | 2016-05-31 | 2018-10-31 | 日亜化学工業株式会社 | 発光装置 |
US20190049090A1 (en) * | 2017-08-10 | 2019-02-14 | Ford Global Technologies, Llc | Vehicle lamp assembly |
CN113545171A (zh) * | 2018-12-05 | 2021-10-22 | 亮锐有限责任公司 | 照明模块的载体基座模块 |
-
2021
- 2021-08-23 WO PCT/US2021/047162 patent/WO2022040632A1/fr unknown
- 2021-08-23 CN CN202180071932.3A patent/CN116420046A/zh active Pending
- 2021-08-23 EP EP21859274.9A patent/EP4200558A1/fr active Pending
- 2021-08-23 KR KR1020237009705A patent/KR20230057399A/ko active Search and Examination
- 2021-08-23 JP JP2023512296A patent/JP2023538102A/ja active Pending
Also Published As
Publication number | Publication date |
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KR20230057399A (ko) | 2023-04-28 |
WO2022040632A1 (fr) | 2022-02-24 |
CN116420046A (zh) | 2023-07-11 |
JP2023538102A (ja) | 2023-09-06 |
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