EP4185430A1 - Procédé de déplacement brusque d'un faisceau d'énergie continu et dispositif de fabrication - Google Patents

Procédé de déplacement brusque d'un faisceau d'énergie continu et dispositif de fabrication

Info

Publication number
EP4185430A1
EP4185430A1 EP21754725.6A EP21754725A EP4185430A1 EP 4185430 A1 EP4185430 A1 EP 4185430A1 EP 21754725 A EP21754725 A EP 21754725A EP 4185430 A1 EP4185430 A1 EP 4185430A1
Authority
EP
European Patent Office
Prior art keywords
energy beam
positions
irradiation
deflection
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21754725.6A
Other languages
German (de)
English (en)
Inventor
Wilhelm Meiners
Philipp Wagenblast
Valentin BLICKLE
Matthias Allenberg-Rabe
Jonas Grünewald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trumpf Laser und Systemtechnik GmbH
Original Assignee
Trumpf Laser und Systemtechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102020131033.1A external-priority patent/DE102020131033A1/de
Application filed by Trumpf Laser und Systemtechnik GmbH filed Critical Trumpf Laser und Systemtechnik GmbH
Publication of EP4185430A1 publication Critical patent/EP4185430A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/41—Radiation means characterised by the type, e.g. laser or electron beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/44—Radiation means characterised by the configuration of the radiation means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/49—Scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B29C64/273—Arrangements for irradiation using laser beams; using electron beams [EB] pulsed; frequency modulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present invention relates to methods of translating a continuous beam of energy along a radiation path defined by a succession of beam positions. Furthermore, the invention relates to a device for the additive manufacturing of components from a powder material.
  • the laser-based additive (also generative) manufacturing of, in particular metallic or ceramic, components is based on solidifying a starting material in powder form by irradiating it with laser light.
  • an energy beam such as a laser beam is typically displaced to predetermined irradiation positions of a work area—in particular along a predetermined irradiation path—in order to locally solidify powder material arranged in the work area.
  • this is repeated layer by layer in layers of powder material arranged one after the other in the working area in order finally to obtain a three-dimensional component made of solidified powder material.
  • Additive manufacturing processes are also known as powder bed-based processes for producing components in a powder bed, selective laser melting, selective laser sintering, laser metal fusion (laser metal fusion - LMF), direct metal laser melting (direct metal laser melting). - DMLM), Laser Net Shaping Manufacturing (LNSM), and Laser Engineered Net Shaping (LENS). Accordingly, the manufacturing equipment disclosed herein is set up in particular to carry out at least one of the aforementioned additive manufacturing processes.
  • the concepts disclosed herein can be used in machines for (metallic) 3D printing, among other things.
  • An exemplary machine for manufacturing three-dimensional products is disclosed in EP 2 732 890 A1.
  • the advantages of additive (generative) manufacturing are generally the simple manufacture of complex and individually producible components. In this way, in particular, defined structures in the interior and/or structures optimized for the flow of force can be realized.
  • parameters such as intensity/energy, beam diameter, scanning speed, dwell time at one location and, on the powder material type, parameters such as particle size distribution and chemical composition go into the energy beam.
  • thermal parameters are included that arise from the environment of the interaction zone, among other things.
  • One aspect of this disclosure is based on the task of enabling irradiation concepts and in particular irradiation paths that go beyond the limitations of a conventional scanner device.
  • overheating of the melted powder should be avoided, regardless of the course of the irradiation path, and this should also be ensured as far as possible when high energies are introduced.
  • Another object is to specify a method for the flexibly adjustable displacement of a continuous energy beam along a radiation path and a device for the additive manufacturing of components from a powder material for the implementation of such methods.
  • a method for displacing a continuous energy beam along an irradiation path formed by a sequence of beam positions, which is intended to solidify a powder material in a powder layer in a work area of a manufacturing facility has the following steps:
  • the mechanical deflection is designed to position the energy beam at a plurality of irradiation positions arranged in the work area, wherein the Irradiation positions essentially span the working area, and the optical deflection is designed to deflect the energy beam around each of the irradiation positions within a beam area of the deflection device to at least one beam position of the sequence of beam positions, with the optical deflection and the mechanical deflection changing simultaneously or consecutively be used to scan the sequence of beam positions with the energy beam.
  • the beam area is given here by a maximum extent of the optical deflection of the deflection device.
  • the method outlined can also include the step:
  • the outlined method can also include the step of abruptly displacing the energy beam to a plurality of discrete beam positions.
  • a manufacturing device for additively manufacturing a component from a powder material that is provided in a work area comprises: a beam generating device that is set up to generate a continuous energy beam for irradiating the powder material, a scanner device set up for mechanical deflection in order to position the energy beam at a plurality of irradiation positions, the irradiation positions essentially spanning the working area, a deflection device set up for optical deflection to deflect the energy beam around each of the irradiation positions within a beam area to at least one beam position of the sequence of beam positions, and a control device which is operatively connected to the scanner device and the deflection device and is set up to control the deflection device and the scanner device in such a way that the optical deflection and the mechanical deflection are simultaneous or sequential be changed in order to scan with the continuous energy beam an irradiation path formed by a sequence of the beam positions, the irradiation path being provided for the powder material in the working area
  • control device can also be set up in a further aspect to control the deflection device and the scanner device in such a way that the energy beam scans successively in sequences, each of which includes at least one beam position in the sequence of beam positions of the radiation path, with an abrupt Changing the optical deflection means that the energy beam skips a region between the spaced-apart sequences, so that spaced-apart, in particular thermally decoupled, sequences are successively occupied by the energy beam.
  • a spatial distance between successively taken sub-sequences taking into account/ensuring the discharge of the energy introduced into the sub-sequences with the energy beam, in particular a limitation of the energy or irradiation duration introduced into the sub-sequences with the energy beam, can be determined.
  • the deflection device and the scanner device can be controlled in such a way that adjacent beam positions of the irradiation path are not assumed to be consecutive in time.
  • the deflection device can comprise an optical, in particular transparent, material in a passage area provided for the energy beam, which material has optical properties that can be set to bring about the optical deflection.
  • the deflection device can in particular comprise a crystal in which an acoustic wave with an acoustic wavelength is formed or a refractive index or a refractive index gradient is set in order to effect the optical deflection.
  • the method can include the following additional steps:
  • the method can include the following additional steps:
  • an advantage of beam displacement with an AOD is that a region between the start position and the end position is not exposed to the laser beam by changing the acoustic wavelengths in discrete steps, since the periodic changes in the refractive index merge in time with essentially no formation of a diffractive transient behavior . Accordingly, the energy input is limited to the initial position and the end position; this corresponds to a sudden change in the acousto-optical deflection.
  • beam positions of the irradiation path that are not spatially adjacent to one another can be assumed in temporal succession.
  • the spaced sub-sequences may be spaced apart from each other in the work area by at least one diameter of the energy beam, or at least 50% of the diameter of the energy beam, or at least 1.5 to 2 times the diameter of the energy beam.
  • areas of the work area can be skipped, which are selected from the group of areas comprising an area of the work area that has not yet been irradiated, an area of the work area that is not to be irradiated, and an area of the work area that has already been irradiated.
  • the deflection device are controlled in such a way that the energy beam successively occupies the beam positions of sub-sequences that completely cover the beam area of the corresponding irradiation position, and in particular a predetermined beam shape of the beam area.
  • the deflection device can be controlled in such a way that the energy beam successively assumes the beam positions of subsequences that cover the beam area of the corresponding irradiation position, and in particular a predetermined beam shape of the beam area, partially or completely cover.
  • the deflection device can be controlled in such a way that the energy beam is shifted to a plurality of beam positions at one of the plurality of irradiation positions within a beam area in order to form a beam profile of the beam area during the production of a component, and the Energy beam is abruptly transferred to the plurality of discrete beam positions.
  • the energy beam can, in particular, jump over beam positions in the beam area that are spatially adjacent to one another and, in particular, only occupy beam positions in the beam area that are not spatially adjacent to one another in temporal succession.
  • the method can also include the following step: irradiation of the energy beam by controlling the scanner device in such a way that the energy beam is positioned along a sub-sequence of irradiation positions according to a scan path, and the deflection device is controlled at the same time in such a way that the energy beam is between Beam positions of a two-dimensional array of beam positions, in particular between beam positions arranged transversely to the scan path, jumps back and forth.
  • the irradiation path can have at least one irradiation zone in which a plurality of sub-sequences of irradiation positions in the form of adjacent, at least partially parallel scan vectors gates, in particular of the same length, is defined, wherein the method can further comprise the following step:
  • Irradiation of the energy beam by controlling the scanner device in such a way that the irradiation position is displaced along a first scan vector of the scan vectors, and the deflection device is controlled at the same time in such a way that the energy beam moves back and forth between the first scan vector of the scan vectors and at least one further scan vector of the scan vectors jump here.
  • the method can also include the following step: irradiating the energy beam by controlling the scanner device in such a way that the irradiation position is displaced along a sub-sequence of irradiation positions according to a scanning direction, and the deflection device is controlled at the same time in such a way that the energy beam is moved between along the beam positions arranged in the sub-sequence jumps in and against the scanning direction.
  • the irradiation path can have at least two irradiation zones, in each of which a plurality of subsequences of irradiation positions are defined in the form of adjacent, at least partially parallel scan vectors of the same length, with the scanner device being used in the method for shifting the energy beam is controlled in such a way that the energy beam is positioned along a first scan vector of the scan vectors in a first of the irradiation zones, and the deflection device is controlled at the same time in such a way that the energy beam is positioned between the first of the scan vectors in the first of the irradiation zones and at least one other scan vector of the scan vectors another of the irradiation zones jumps back and forth.
  • the irradiation path can have at least one irradiation zone or filigree structure in which a plurality of sub-sequences of irradiation positions are defined in the form of adjacent, at least partially parallel scan vectors of the same or different lengths, with the Deflection device is controlled in such a way that the energy beam is positioned along a first scan vector of the scan vectors in the irradiation zone or filigree structure.
  • the deflection device can be controlled in such a way that the energy beam jumps back and forth between the first scan vector and at least one other scan vector of the scan vectors and that the energy beam is positioned along the at least one other scan vector.
  • an energy beam can be used whose energy input is above a limit value (e.g. the power of a laser beam), as is usually the case for a powder material type (particle size distribution, chemical composition of the powder material) in continuous scanning with a beam diameter is predetermined at a given scanning speed.
  • a limit value e.g. the power of a laser beam
  • the deflection device can be set up to suddenly shift the energy beam to a plurality of discrete beam positions.
  • control device can be set up to control the scanner device and the deflection device according to the methods disclosed herein.
  • the scanner device can have at least one scanner, in particular a galvanometer scanner, piezo scanner, polygon scanner, MEMS scanner, and/or a working head that can be displaced relative to the work area.
  • the deflection device can see at least one electro-optical deflector and/or acousto-optical deflector, preferably two not in parallel, in particular electro-optical or acousto-optical deflectors oriented perpendicularly to one another.
  • the deflection device can have at least one acousto-optical deflector with an optical material, such as a crystal, and an exciter for generating acoustic waves in the optical material and/or the beam generating device can be designed as a continuous wave laser.
  • an optical material such as a crystal
  • an exciter for generating acoustic waves in the optical material and/or the beam generating device can be designed as a continuous wave laser.
  • the deflection device can comprise an optical, in particular transparent, material such as a crystal in a passage region provided for the energy beam, which material has optical properties that can be set to bring about the optical deflection.
  • the method can also include:
  • changing the acoustic wavelength can change the diffraction angle of the first diffraction order in such a way that the diffracted energy beam is guided to a second of the beam positions.
  • the acoustic wavelength can be changed in steps by a wavelength change, so that the energy beam successively introduces energy into beam positions of the irradiation path, with energy being introduced into two beam positions simultaneously in a transitional period in which two acoustic wavelengths are present in the penetration area.
  • the change in wavelength can cause a change in the diffraction angle such that spatially adjacent beam positions of the radiation path or spatially spaced, in particular thermally decoupled, beam positions are scanned sequentially in time by the energy beam.
  • the deflection device can be controlled in such a way that at least one beam position is skipped when scanning the sequence of beam positions, with the skipped beam position being scanned at a subsequent point in time.
  • the method can also include:
  • an optical deflection means a deflection optically induced with a deflection device.
  • An example of an optical deflection is a variation in an optical parameter of an optical medium in the beam path, which causes a change in the beam path.
  • Optical deflection is distinct from mechanical deflection, which is understood to be deflection mechanically induced with a scanner device.
  • An example of a mechanical deflection is a mechanically-controlled reflective deflection of a laser beam.
  • FIG. 1 shows a schematic three-dimensional representation of a manufacturing device for additive manufacturing
  • Fig. 2 is a schematic representation of an exemplary beam path
  • FIG. 3 A - 3C sketches to explain an acousto-opti see deflection in generative manufacturing
  • 4 shows a sketch to explain an electro-optical deflection in additive manufacturing
  • FIGS. 5A-5C sketches of linear scanning processes based on optical deflections
  • FIG. 6 a sketch to clarify the simultaneous exposure of scan vectors in irradiation zones
  • aspects described herein are based in part on the recognition that positioning of the energy beam on a powder bed of an additive manufacturing facility can be divided into a) mechanical deflection by means of one or more inertial axes exhibiting low acceleration with a typically large range of motion, and b) an optical deflection using one or more dynamic axes that have a higher acceleration with a usually smaller range of motion.
  • Deflection about inertial axes is commonly accomplished in additive manufacturing by positioning mirrors in a scanner assembly and is referred to herein as mechanical deflection.
  • Scanner devices are operated, for example, with in-process scanning speeds of a few hundred millimeters per second, with maximum scanning speeds of the order of m/s (e.g. up to 30 m/s).
  • Galvo scanners have scanning speeds of e.g. 1 m/s up to 30 m/s.
  • a deflection about dynamic fast axes can take place by influencing the optical properties of optical elements/materials in the beam path of the energy beam in the production facility. This is referred to herein as optical deflection. It can be brought about, for example, by acousto-optical or electro-optical effects in an optical crystal.
  • the optical crystal interacts with the energy beam and influences the beam path very quickly, resulting in switching times between beam positions of the order of 1 ps and corresponding switching speeds of up to a few, depending on the jump distance 1,000 m/s (e.g. 10,000 m/s and more possible).
  • a deflection angle of the energy beam for example, with an acousto-opti see deflector (AOD) or an electro-optical De deflector (EOD) - as examples of an optical solid state deflector (“optical solid state deflector”) - can by varying the acoustic Excitation frequency or an applied voltage can be set in a deflection range around a central value.
  • Ma ximum scanner accelerations at AODs and EODs can be at 160,000 rad / s 2.
  • scanner accelerations of 80,000 m/s 2 result, for example (depending on the respective working distance from the AOD/EOD).
  • the inventors have recognized that the dynamic (fast) axis can also be used to step the position of the energy beam. This makes it possible, for example, to always scan segments of the irradiation path in the direction of the taper when manufacturing tapering structures. See, inter alia, the exemplary explanations of an angular radiation path in connection with FIG. 7B.
  • the inventors have recognized that the possibility of an instantaneous, erratic optical deflection can generally make it possible to use an energy input with the energy beam (e.g. a power value of a laser beam) that is above a limit value, as is usually the case for a powder material type (determined by Among other things, a grain size distribution and a chemical composition of the powder material) given a continuous scanning with a beam diameter at a given scanning speed and the component geometry to be generated.
  • the energy beam e.g. a power value of a laser beam
  • a powder material type determined by Among other things, a grain size distribution and a chemical composition of the powder material
  • the dynamic (fast) axis provided by the optical deflection can be used for “spatially local” exposure in a kind of pulse mode.
  • filigree components and sections with poor heat dissipation line e.g. in the area of overhangs or pointed structures
  • Such a “spatially locally pulsed” irradiation with a continuous energy beam e.g. a cw laser beam
  • two or more sections to be pulsed can be processed that are within the (small) movement range of the optical deflection (e.g. with an acousto-optical deflector up to a few millimeters or even centimeters depending on the position of the same in the beam path).
  • a spot can be exposed in a first section; then a jump can be made to a second (another) section and a point can be exposed there; subsequently, after a jump back into the (original) first section, another point, adjacent to or at a distance from the first point, can be exposed.
  • the beam positions of an irradiation path that are not spatially adjacent to one another are occupied consecutively in time.
  • the optical deflection can take place laterally with respect to a main scanning direction of the energy beam on the powder bed, the main scanning direction being given by the mechanical deflection.
  • the lateral deflection can also take into account thermal aspects of overheating, as explained in connection with FIGS. 9A and 9B.
  • filigree structures in particular closed structure sections, can be generated at a fixed irradiation position simply by controlling the deflection device and generating a local beam profile - formed by means of an almost simultaneous illumination of several beam positions in the beam area of the optical deflection - without the scanner device being controlled is, in particular in which a beam profile is generated in the form of the structure section to be formed by suitable control of the deflection device.
  • the scanning of filigree structures with an energy beam is explained in connection with FIGS. 10A to 10D.
  • an optical deflector can be installed in the beam path of the energy beam for the implementation of the concepts discussed above and explained below by way of example in connection with the figures.
  • a beam deflection with the optical deflector can be integrated into the machine control of the manufacturing facility as a further parameter for additive manufacturing.
  • a mechanical deflection e.g. galvo scanner
  • an optical deflection e.g. acousto-optical deflector
  • a flexible control of the spatial and temporal energy input can be realized without loss of time between several interaction zones.
  • switching beam positions with an optical deflector enables a higher energy of the energy beam/power of the cw laser beam to be introduced into the powder material.
  • the manufacturing device 1 shows a manufacturing device 1 for the additive manufacturing of components from a powder material 2.
  • the manufacturing device 1 comprises a beam generating device 3, which is set up to generate an energy beam 5, a scanner device 7, which is set up to scan the energy beam 5 within a working area 9, usually given by the dimensions of a powder bed of the production device, to a plurality of irradiation positions 11 (mechanical see deflection) in order to produce a component 4 from the powder material 2 arranged in the working area 9 by means of the energy beam 5, a deflection device 13 which is set up to direct the energy beam 5 starting from an irradiation position 11 of the plurality of irradiation positions 11 within a beam area 15 - in particular abruptly - to be shifted to a plurality of beam positions 17 in the beam region 15 (optical deflection), and a control device 19, which is operatively connected to the deflection device 13, and optionally to the beam generating device 3 and the scanner device 7, and is set up to control the deflection device 13 to
  • the production facility 1 is preferably set up for selective laser sintering and/or for selective laser melting as part of the additive manufacturing of components.
  • Fig. 1 the already partially manufactured component 4 is indicated, already solidified layers of powder material 2 are covered in the powder bed.
  • the production facility 1 usually provides a work surface in a closed housing (not shown), which includes the work area 9 and optionally a powder storage area.
  • the powder material 2 is applied sequentially/layered in the work area 9 .
  • the energy beam 5 is applied locally to the powder material 2 in the work area 9 in order to produce the component 4 layer by layer.
  • a layer of the component 4 is formed by displacing the (continuous) energy beam 5 along an irradiation path 101 formed by a sequence of beam positions 17 .
  • the irradiation path 101 is designed in such a way that the powder material 2 of a powder layer is solidified in accordance with the geometry of the component 4 in the work area 9 of the production facility 1 .
  • the position of a beam position 17 at which the energy beam 5 hits the work area 9 results from the settings made for the mechanical deflection and the optical deflection.
  • An irradiation position 11 can be assigned to the mechanical deflection, from which the optical deflection can be observed.
  • the irradiation positions 11 usually span the working area 9 (essentially).
  • the beam area 15 has a surface area that is larger than a cross section of the energy beam 5 projected onto the work area 9.
  • the beam area 15 is very much smaller than the work area 9.
  • the beam area 15 preferably has a length scale in the range of a few (ie, less than ten) millimeters up to a few centimeters, and preferably an areal extent in the range from a few square millimeters to few square centimeters.
  • the working area 9, on the other hand can have a length scale in the range from a few decimeters to a few meters, and preferably an areal extent in the range from a few square decimeters to a few square meters.
  • an irradiation position 11 is understood to mean, in particular, a location within the working area 9 at which energy can be deposited locally by means of the energy beam 5 in the working area 9, in particular in the powder material 2 arranged there.
  • the energy input determines the respective interaction zone and thus a melting area of the powder material 2.
  • the scanner device 7 is set up to move the energy beam 5 within the working area 9 - assuming there is no superimposition of an optical deflection - along a "mechanical" scan path 103 , wherein the mechanical scanning path 103 consists of a temporal sequence of irradiation positions 11 swept over one after the other with the energy beam 5 .
  • the individual irradiation positions 11 can be arranged at a distance from one another, but they can also overlap and merge with one another.
  • the irradiation path 101 is formed by the sequence of the beam positions 17 set with the scanner device 7 and the optical deflection device 13.
  • the resulting irradiation path 101 may be a path that is continuously scanned with the energy beam 5 .
  • the resulting irradiation path 101 can have path segments that each include at least one beam position 17 .
  • the scanning of the path segments with the energy beam 5 can include jumps between spatially spaced path segments, the jumps being controlled with the optical deflection device 13 .
  • cw continuous wave
  • An energy beam is generally understood to be directed radiation that can transport energy. This can generally involve particle radiation or wave radiation.
  • the energy beam propagates along a propagation direction through the physical space and transports energy along its propagation direction.
  • the energy beam 5 is here generally an optical working beam, which can thus be deflected by means of the optical deflection device 13 .
  • An optical working beam is to be understood in particular as directed electromagnetic radiation, continuous or pulsed, which is suitable in terms of its wavelength or a wavelength range for the additive (generative) manufacturing of the component 4 from the powder material 2, in particular for sintering or melting the powder material 2.
  • an optical working beam is understood as a laser beam, which is radiated onto the work area 9, preferably continuously.
  • the optical working beam preferably has a wavelength or a wavelength range in the visible electromagnetic spectrum or in the infrared electromagnetic spectrum or in the overlap region between the infrared range and the visible range of the electromagnetic spectrum.
  • a beam guidance system of the production device 1 for guiding the energy beam 5 to the powder bed thus for a mechanically-induced deflection of the energy beam 5 comprises the scanner device 7.
  • a rotation of mirrors by means of a galvo scanner, for example
  • the mechanical deflection can be used alone (scan path 103) or in combination with an optical deflection for scanning an irradiation path 101 for the exposure of a powder layer.
  • the scanner device 7 preferably has at least one scanner, in particular a galvanometer scanner, piezo scanner, polygon scanner, MEMS scanner and/or a working head or processing head that can be displaced relative to the work area.
  • Such scanner devices are known and particularly suitable for shifting the energy beam 5 within the working area 9 between a plurality of irradiation positions 11 . Due to the mass inertia of an optical element to be moved mechanically (eg a deflection mirror), a spatial distribution of the energy input, which is controlled only by means of a mechanical deflection, takes place sluggishly.
  • irradiation paths that are to be scanned solely by mechanical deflection can expose the additive manufacturing process to the risk of local overheating of the powder melt. It should be noted that local overheating is avoidable in the case of a purely mechanical deflection with a loss of productivity due to idle times (delays introduced in the irradiation process). The concepts proposed herein can prevent or at least reduce this productivity loss.
  • the beam guidance system of the production device 1 for guiding the energy beam 5 to the powder bed also includes the deflection device 13 for an optically induced deflection.
  • the deflection device 13 is set up to displace the energy beam 5 within the beam area 15 - assuming a fixed irradiation position 11 - and thus to be able to apply the energy beam to a specific area - the beam area 15 - within the working area 9 at the fixed irradiation position 11.
  • Beam area 15 is larger than the cross section of energy beam 5 projected onto work area 9.
  • the scanner device 7 Since the scanner device 7 is set up to move the energy beam between irradiation positions 11, it enables the deflection device 13 to sweep over a new beam area 15 by another irradiation position, ie at a different location in the work area 9, with the energy beam 5 .
  • the deflection device 13 is therefore used for local deflection of the energy beam 5 starting from an irradiation position 11, while the scanner device 7 is used for the global displacement of the energy beam 5 on the work area 9.
  • the deflection device 13 is set up in particular to shift the energy beam 5 abruptly to the plurality of beam positions 17 in the beam region 15, it being possible for the beam positions 17 to be discrete beam positions.
  • beam positions 17 processed in succession are arranged at a distance from one another.
  • beam positions 17 processed in succession to overlap and merge with one another, at least in certain areas.
  • the energy beam 5 is not shifted continuously from beam position to beam position by the deflection device 13 in some embodiments, but in discrete steps.
  • Optical deflectors include acousto-optical (AOD) deflectors, which rely on the generation of a periodic change in refractive index as sound waves propagate in an optically transparent material of the AOD (usually an optically transparent crystal).
  • AOD acousto-optical
  • An optical deflection with an AOD 111 shown schematically and a change in the acoustic excitation is illustrated in FIGS. 3A to 3C.
  • FIGS. 3A to 3C With regard to the diffraction behavior present at the AOD, reference is also made to FIG. 3 in Rö mer et al. referred.
  • FIG. 3A shows schematically how an incident laser beam 113—preferably at an angle of incidence in the Brewster angle—is incident on the AOD 111, in particular on a passage region of the AOD 111. Due to an acoustic excitation on the upper side of the AOD 111 (e.g. with an exciter 112 for generating acoustic waves in the material), a grid-like structure 115A (refractive index modulation, acousto-optical) is formed diffraction grating) in the AOD 111. This is characterized by an excitation wavelength l ⁇ marked.
  • the incident laser beam 113 is diffracted at the lattice-like structure 115A, so that in addition to a (possibly low-intensity) undiffracted zero-order beam 117, a (possibly high-intensity) diffracted first-order laser beam 119A deflects the AOD 111 at a wavelength l ⁇ associated deflection angle al the AOD, in particular the Transit area of the AOD 111, leaves.
  • the laser beam 119A of the first order would be fed to the arrangement of FIG. 1 of the scanner device 7 and would impinge on the powder bed at a location xl coming from above, where the deflection in the AOD (ie the set deflection angle al of the first order) is the final Position on the powder bed also determined. Accordingly, the energy input takes place at location xl, as a schematic intensity distribution I(x) 121 A shows.
  • the angle of the first diffraction order changes and thus the position of the laser beam 119A.
  • a controllable deflection of the diffracted beam can be made; i.e. a desired target position of the energy input can be set on the powder bed.
  • acoustic wavelength results in replacing the first acoustic wave with a second acoustic wave in the AOD.
  • Speeds of sound in solids are, for example, of the order of 1000 m/s or several 1000 m/s (depending on the hardness of the crystal, among other things). If a first acoustic wave (with a first wavelength) in e.g. a crystal of the AOD is to be completely replaced by a second acoustic wave (with a second wavelength), the first acoustic wave must first run out of the crystal so that it (if possible at the same time) can be replaced by the second acoustic wave.
  • the acoustic wave travels this distance in a few microseconds, eg about 3 ps. After this period of time, the interaction with the second acoustic wave takes place. In general, this time increases the larger and softer the crystal is and the smaller the smaller and harder the material of the AOD.
  • energy the laser beam
  • a switching between acoustic waves and thus, deflection of the energy beam to different locations can generally occur in the megahertz time scale range.
  • Figures 3B and 3C illustrate a sudden change in position using the AOD 111.
  • the exciting sound wave is changed to a wavelength l2 (lattice-like structure 115B, deflection angle a2 of the laser beam 119B of the first order, location x2 of the energy input on the powder bed).
  • the change in the exciting sound wave causes a corresponding change in position of the diffracted laser beam 119B by a discrete distance Dc (“x2-xl”).
  • a transition 123 between the refractive index modulations in the AOD can be seen in FIG. 3B, the transition 123 having already migrated from the upper side to the middle of the AOD 111 .
  • one half of the incident laser beam 113 hits the refractive index modulation with wavelength l ⁇ and the other half hits the refractive index modulation with wavelength l2.
  • a schematic intensity distribution I(x) 121B shows the same intensities/energy inputs for the diffracted laser beams 119A and 119B at the respective locations x1 and x2.
  • the maximum intensity of the laser beam 119B will hit the powder bed at location x2 (see intensity distribution I(x) 121C).
  • the advantage of beam displacement with an AOD can be seen from the intensity distribution I(x) 121A to 121C;
  • the beam displacement realizes the case already mentioned, that an area between the starting position (here the location xl) and the end position (here the location x2) is not exposed to the laser beam, since the periodic changes in the refractive index essentially without the formation of a diffractive transient behavior merge in time. Accordingly, the energy input is limited to the initial position and the end position; this corresponds to a sudden change in the optical deflection.
  • Optical deflectors also include electro-optical deflectors (EOD) whose deflection is based on refraction upon passage of an optically transparent material.
  • EOD electro-optical deflectors
  • 4 shows Schematically an adjustable optical deflection with an EOD 131, the optically transparent material of the EOD 131 being adjustable in terms of the refractive index or in a refractive index gradient by applying a voltage.
  • the deflection of a laser beam 133 varies, which preferably falls back on the EOD 131 at the Brewster angle and exits from it at a correspondingly adjustable deflection angle.
  • a laser beam 133A deflected in this way could be supplied to the scanner device 7 in the arrangement of FIG.
  • a voltage source 135 enables precise adjustment of the voltage which is present between the top and bottom of the prism-shaped crystal forming the EOD 131 in FIG. 4, for example.
  • the refractive index or the refractive index gradient and thus the optical deflection can be set.
  • Fig. 2 in Römer et al. reference is also made to Fig. 2 in Römer et al. referred.
  • Both AODs and EODs can provide the deflection of a laser beam, referred to herein as optical deflection, which can be adjusted quickly, i.e., in near real-time relative to the powder fusion process in additive manufacturing.
  • the scanner device 7 and the optical deflection device 13 differ not only in the extent of the deflection that can be carried out, but also with regard to the time scale on which the energy beam 5 is deflected:
  • the energy beam 5 is deflected by the optical deflection device within the Beam area 15 preferably on a shorter, in particular much shorter, time scale than the deflection within the working area 9 by the scanner device 7, that is, much faster than changing from one irradiation position to the next irradiation position.
  • the time scale on which the energy beam can be deflected by the deflection device e.g. jumping over a maximum extent of the beam area, ie from e.g.
  • the control device 19 is set up to implement the movement of the impact point of the energy beam 5 on the powder bed according to a predetermined irradiation strategy.
  • the control device 19 is preferably selected from a group consisting of a computer, in particular a personal computer (PC), a plug-in card or control card, and an FPGA board.
  • the control device 19 is an RTC6 control card from SCANLAB GmbH, in particular in the version currently available on the date determining the seniority of the present property right.
  • the control device 19 is preferably set up to synchronize the scanner device 7 with the deflection device 13 by means of a digital RF synthesizer.
  • the RF synthesizer can be controlled via a programmable FPGA board of the control device 19 .
  • Position values and default values for the movement of the impact point are preferably calculated, which can then be converted in the FPGA board into time-synchronous frequency defaults for the RF synthesizer.
  • the optical deflection can be spatially assigned to irradiation positions 11 in the respective powder material layer. The latter can preferably already be carried out in a build processor when creating the irradiation strategy.
  • the build processor can write the corresponding data, for example, to a control file that can preferably be read in and converted by the control device 19 .
  • the scanner device 7/the mechanical deflection on the one hand and the deflection device 13/the optical deflection on the other hand allow a separation of the time and length scales relevant for the production of the component 4 being produced.
  • the scanner device 7 is set up to shift the energy beam on a larger time scale compared to the deflection device 13 along the plurality of irradiation positions 11, in particular along a predetermined scan path 103, quasi-globally over the entire working area 9, the deflection device 13 set up to shift the energy beam on a time scale that is shorter relative to the time scale of the scanner device 7 quasi locally at an irradiation position 11 specified by the scanner device 7 and quasi fixed due to the time scale separation to the plurality of beam positions 17 within the beam region 15.
  • a local scanning sequence of beam positions 17 in the respective beam area 15 can be carried out quasi-statically at each irradiation position 11 of the plurality of irradiation positions 11 and/or a specific beam profile can arise as a geometric shape and as an intensity profile of the beam area 15.
  • the scanner device 7 can move the beam profile generated in this way and generally the beam area 15, ie the optically controllable beam positions 17, along the plurality of irradiation positions 11, in particular along the scan path 103.
  • the beam profile of the beam area in particular the shape of the beam area and/or the intensity profile in the beam area, can now advantageously be changed as desired, if necessary even from irradiation position to irradiation position. Furthermore, a scanning sequence when shifting the beam positions 17 can take thermal effects into account.
  • a plurality of adjacent irradiation positions 11, in particular in each case a contiguous section of the scan path 103, can be swept over with the same beam profile and/or the same scanning sequence.
  • different portions of the scan path 103 can be swept with different beam profiles and/or different scanning orders.
  • the generated beam profile and/or the scanning sequence can be regarded as quasi-static with regard to the melting process in the powder material 2, with the time scale for the deflection of the energy beam 5 by the optical deflection device 13 being significantly shorter than the characteristic interaction time of the energy beam 5 with the powder material 2.
  • the dynamically generated beam profile can then, averaged over time, interact with the powder material like a statically generated profile. The same applies to sampling the dynamically generated sampling order.
  • FIG. 2 illustrates an exemplary beam path as it can be implemented in the production device 1 of FIG. 1 .
  • the deflection device 13 is located in the direction of propagation of the energy beam 5 in front of the scanner device 7.
  • the deflection device 13 has in particular at least one acousto-optical deflector 21, here in particular two acousto-optical deflectors 21 oriented not parallel, in particular perpendicular to one another, namely one first acousto-opti see deflector 21.1 and a second acousto-opti see deflector 21.2, on.
  • the mutually perpendicularly oriented acousto-opti see deflectors 21 allow a deflection of the energy beam 5 in two mutually perpendicular directions and thus, in particular, a flat scanning of the beam area 15.
  • the acousto-optical deflectors 21.1 and 21.2, which are not parallel to one another, are preferably arranged one behind the other in the direction of propagation of the energy beam 5.
  • An acousto-optical deflector is understood in particular to mean an element which has a solid body which is transparent to the energy beam and to which sound waves, in particular ultrasonic waves, can be applied, with the energy beam depending on the frequency of the sound waves as it passes through the transparent solid body. with which the transparent solid is applied, is deflected. In this case, in particular an optical lattice is generated in the transparent solid by the sound waves.
  • Such acousto-optical deflectors are advantageously able to deflect the energy beam very quickly by an angular range predetermined by the frequency of the sound waves generated in the transparent solid. In particular, switching speeds of up to 1 MHz can be achieved.
  • the switching times for such an acousto-optical deflector are significantly faster than typical switching times for conventional scanner devices, in particular galvanometer scanners, which are generally used to move an energy beam within a work area of a manufacturing facility of the type discussed here. Therefore, such an acousto-optical deflector can be used in a particularly appro priate manner for generating a quasi-static beam profile in the beam area.
  • Modern acousto-optical deflectors can deflect the energy beam with an efficiency of at least 90% (particularly at least 80%) into a predetermined angular range of the first diffraction order, so that they are excellently suited as a deflection device for the production facility proposed here.
  • the material used, which is transparent to the energy beam, and a suitably high intensity of the coupled ultrasonic waves are particularly decisive for the high efficiency.
  • the AODs generate an undiffracted partial beam of the zeroth order and a diffracted or deflected partial beam of the first order due to their configuration analogous to an optical grating. In most cases, however, only the first-order partial beam should be used to irradiate the working area.
  • the manufacturing device 1 also points in the direction of propagation of the energy beam 5 behind the deflection device 13 and in front of the scanner device 7 a separating mirror 23 which is set up to separate the zero-order partial beam from the first-order partial beam of the energy beam 5 .
  • the separation mirror 23 has in particular a through hole 25 which is provided in a surface 27 of the separation mirror 23 which reflects the energy beam 5 and which penetrates the separation mirror 23 completely.
  • the first-order partial beam which is to be forwarded in the desired manner to the scanner device 7, is guided through the through hole 25 and thus finally reaches the scanner device 7.
  • the separation mirror 23 is arranged in particular in the vicinity of an intermediate focus 31 of a telescope 33, in particular not exactly in a plane of the intermediate focus 31, particularly preferably offset at a distance of one-fifth of the focal length of the telescope 33 along the propagation direction, in particular in front of the intermediate focus 31. This advantageously avoids the reflective surface 27 being exposed to an excessively high power density of the energy beam 5 .
  • the telescope 33 preferably has a first lens 35 and a second lens 37 . It is preferably designed as a 1:1 telescope.
  • the telescope 33 preferably has a focal length of 500 mm.
  • the mode of operation of the telescope 33 is preferably twofold: on the one hand, the telescope 33 enables a particularly advantageous and clean separation of the different orders of the energy beam 5 deflected by the deflection device 13, particularly with the arrangement of the separation mirror 23 chosen here; on the other hand, the telescope 33 preferably forms an imaginary common beam pivot point 39 of the deflection device 13 onto a pivot point 41 of the scanner device 7 . Alternatively, the telescope 33 preferably maps the beam pivot point 39 to a point of smallest aperture.
  • the energy beam 5 is preferably deflected several times by deflection mirrors 43.
  • the energy beam 5 can be displaced preferably within the working area 9 to a plurality of beam positions 17 in order to using the energy beam 5 to produce the component 4 in layers from the working area 9 arranged in the powder material 2.
  • the energy beam 5 is shifted to a plurality of beam positions 17 with respect to an irradiation position 11 within a beam region 15 .
  • a continuous energy beam is continuously displaced at least in sections along a radiation path.
  • a cw laser beam can be continuously moved along scan vectors of a radiation path defined as part of the radiation strategy, with the scan vectors in radiation zones (hatches) running parallel to one another.
  • the scan vectors of an irradiation zone can be traversed evenly in the same direction or alternately in opposite directions. This corresponds to continuous exposure of the scan vectors.
  • FIG. 5A shows a linear scanning process as an example of a continuous method, in which spaced beam positions A1, A2, .
  • adjacent beam positions of a sub-sequence can be spaced apart from each other by at least one diameter of the energy beam or at least 50% of the diameter of the energy beam in the work area.
  • the distance DC1 was selected in such a way that adjacent melting regions partially overlap, so that the powder material can be melted continuously.
  • the melting takes place along a line, for example along a scan vector in an irradiation zone.
  • the linear scanning process can be performed from a fixed irradiation position or with a changing mechanical deflection, in which case the optical deflection (the distance DC1) has to be adjusted according to the mechanically-induced movement of the irradiation position in the irradiation strategy.
  • a discontinuous shifting of the energy beam can be carried out, with positions being jumped to and illuminated along the irradiation path.
  • Such discontinuous exposure may be performed, for example, within a scan vector of an exposure zone, when changing to non-adjacent scan vectors of an exposure zone, or when changing between exposure zones.
  • a cw laser beam can, for example, scan discrete beam positions along the irradiation path in a sequence specified in the irradiation strategy.
  • Discontinuous exposure differentiates between a geometry of the irradiation path and an adjustability of a point in time of the irradiation.
  • the geometry of the radiation path is thus assigned a sequence of times at which the respective beam positions of the radiation path are exposed.
  • the geometry of the irradiation path is essentially given by the layer-specific cross-section of the component 4, with technically required segments of the irradiation path being able to be introduced; these are, for example, the (in particular parallel, linear) scan vectors running next to one another in the irradiation zones, in which case neighboring irradiation zones can have different orientations of the scan vectors.
  • the adjustability of the timing of the irradiation determines the parameters of the interaction of the energy beam with the powder material at a beam position. For example, a duration of the irradiation is predetermined by setting periods of time between changing between beam positions. Furthermore, the choice of the distance between beam positions can influence thermal aspects, such as a dissipation of introduced heat into the powder material/powder melt.
  • FIG. 5B shows a first example for a discontinuous displacement of the energy beam in the context of a linear scanning process.
  • a scanning sequence in FIG. 5B includes a group 61 of, for example, seven beam positions B1, B2, B3, B4, B5, B6, B7, which are scanned abruptly according to a predetermined sequence.
  • the optical deflection brings about changes in the position of the energy beam 5, which consist of a number of possible discrete paths; two paths DC1 and DC2 are shown in FIG. 5B by way of example.
  • the dis- Concrete distances are selected in such a way that the discrete distance DC2 jumps over one beam position.
  • the scanning sequence can be performed from a fixed irradiation position (ie temporarily the mechanical deflection is held stationary or can be considered stationary).
  • Scanning sequences can also follow each other spatially (as indicated in FIG. 5B with a group 6G, eg starting from a correspondingly further moved irradiation position) and/or they can be repeated at the same location and/or spatially offset.
  • the optical deflection can be superimposed with a continuous mechanical deflection, whereby the optical deflections (the distances DC1 and DC2) have to be adapted according to the movement of the irradiation position in the irradiation strategy.
  • FIG. 5B Schematically, circles around the beam positions 317A, 317B, 317G are again indicated in FIG. 5B to clarify melting regions. Due to the scanning sequence 61, not only adjacent beam positions are successively exposed, so that new thermal interaction parameters arise that differ from those of the irradiation strategy illustrated in FIG. 5A. The result is again melting along a line, for example along a section of a scan vector in an irradiation zone. However, in some embodiments, the new thermal interaction parameters may allow the energy input with the energy beam to be increased while reducing the exposure time at a beam location. Accordingly, the manufacturing process can be carried out more efficiently in terms of time.
  • 5C shows another example of a discontinuous displacement of the energy beam.
  • an underlying scanning sequence is chosen such that adjacent groups 71A, 71B are irradiated from four beam positions CI, C3, C5, C7 or C2, C4, C6, C8 quasi-simultaneously.
  • the optical deflection causes position changes of the energy beam 5, in which two or three beam positions are skipped; Two possible discrete paths DC3 and DC4 are indicated in FIG. 5C by way of example.
  • the beam positions Bl can be extended to two or more adjacent beam positions as long as the energy input stays within the given limits.
  • the irradiation strategies of Figures 5B and 5C thus represent examples of ter sequences that are scanned in such a way that a sudden change in the optical deflection causes the energy beam to skip a region between the spaced sub-sequences, so that successive spatially spaced, in particular thermally decoupled, sub-sequences of the energy beam (in the examples in Figures 5B and 5C) are located example, a distance from a beam position before) can be taken.
  • beam positions of a subsequence may be spaced at least 1.5 to 2 times or more the diameter of the energy beam apart in the work area.
  • areas of the work area selected from the group of areas comprising an area of the work area not yet irradiated, an area of the work area not to be irradiated and an area of the work area already irradiated can also be skipped.
  • at least one beam position skipped in scanning the sequence of beam positions may be scanned at a subsequent time.
  • FIG. 6 shows how two or more scan vectors can be exposed simultaneously in one or more irradiation zones using optical deflection.
  • a line-up of irradiation zones HAI, HB1, HA2, HB2, HA3 can be seen, with each of the Radiation zones parallel to each other scan vectors S1 to S6 are to be exposed according to the irradiation strategy, the scanner device 7 deflecting the energy beam in the direction of the scan vectors S1 to S6 of the respective irradiation zone.
  • a continuously irradiated scan vector of a treatment zone represents a sub-sequence of beam positions that includes multiple beam positions.
  • An irradiation zone can, for example, have an edge length in the range from a few millimeters to a few centimeters. These dimensions are in the range of the jump distance that can be implemented with an optical deflection device (AOD/EOD), for example in the range of a few millimeters, eg ⁇ 10 mm, usually at least ⁇ 5 mm).
  • AOD/EOD optical deflection device
  • the scan vectors S1 to S6 are primarily traversed with the scanner device 7, the scan vectors have been shown as dashed lines. There are different orientations of the scan vectors S1 to S6 in neighboring irradiation zones, so that the scan vectors S1 to S6 each run parallel in the irradiation zones HAI, HA2, HA3, just like in the irradiation zones HB1, HB2.
  • a corresponding arrangement in two dimensions results in what is known as a chessboard array of irradiation zones, where the concepts can be used analogously in strip arrangements of irradiation zones.
  • the optical deflector causes a hopping between the scan vectors.
  • the energy beam jumps, for example, between the scan vectors S1-S4 or S2-S5 or S3-S6; In this case, there are always two scan widths (the size of the melting areas) between the locations of the energy input (distance DC3 to be jumped).
  • the optically-induced jumps can occur, for example, in the direction of the mechanical deflection (indicated simultaneous exposure of scan vectors S1 in the irradiation zones HB1 and HB2, distance DCC) or perpendicular to the mechanical deflection (indicated simultaneous exposure of scan vectors S2 in the Irradiation zones HA2 and HA3, stretch DCC).
  • the scanner device 7 could be positioned at a fixed irradiation position 11 in the middle of the irradiation zone HAI in the irradiation zone HAI.
  • the scan vectors S1 to S6 can then be traversed as described above, with the deflection device 13 not only causing a jump between the respective two scan vectors, but also a traversing of the scan vectors.
  • the scanner device 7 could be deflected from left to right, while the deflection device 13 causes the jumping between the scan vectors and the traversing of the scan vectors, as in the example above.
  • This alternative is particularly suitable for strip arrangements of irradiation zones in which so many scan vectors are arranged parallel to one another that they extend beyond the beam area 15 of the optical deflection device 13 .
  • Such an irradiation strategy can advantageously also be used with filigree structures, as shown in FIGS. 10A to 10D.
  • productivity can be increased compared to drawing a melt track in the powder bed with a (circular/Gaussian) laser beam.
  • the energy input can be controlled in one aspect of the invention using a temporal and local control.
  • This can be used in particular in additive manufacturing in an overhang area or in a filigree component structure. This can also make it possible to reduce or avoid local overheating even when exposed to continuous laser radiation, in that the energy is introduced at discrete, spaced-apart locations and/or for a limited time.
  • a continuous laser beam is terminated at this location after a period of irradiation of the powder material that depends on the type of powder material, with the aid of optical deflection in order to give the melted material the opportunity to dissipate heat and to avoid local overheating with unwanted expansion of the melt pool.
  • overheating can be avoided by directing the laser beam to another second location (e.g. B2 in Fig. 5B or C2 in Fig. 5C) which is far enough away from the first position so that no relevant heat input occurs at the first position as a result of the exposure at the second position.
  • another second location e.g. B2 in Fig. 5B or C2 in Fig. 5C
  • local overheating can also be achieved with a temporally continuous irradiation (if possible duty cycle of 1) and thus without loss of time.
  • a corresponding abrupt displacement can be carried out using optical deflection, as explained here. Since the optical deflection distances that can be realized, e.g. using AOD, are small, a scanner device such as a galvo scanner is also required for positioning the laser beam over larger areas (in particular the working area 9).
  • Path segments 201A, 201B meet perpendicularly.
  • a scanning movement of an optical component (e.g. a deflection mirror) of the scanner device is temporarily brought to a complete standstill before another or the same optical component is moved into a new direction, eg at a 90° angle, is accelerated.
  • an optical component e.g. a deflection mirror
  • this can lead to overheating of the powder melt in the area of the formed corner. Overheating can occur in particular when the heat cannot dissipate with difficulty due to the non-melted (and correspondingly insulating) powder which, for example, surrounds a pointed structure formed in layers.
  • the inertial axis can now follow a rounded curve near the corner (see the exemplary scan path 203 in the form of a quadrant in Fig. 7A).
  • a change in the optical deflection of the energy beam can at least partially compensate for a change in the mechanical deflection of the energy beam in a direction transverse to the irradiation path 201, so that the irradiation path 201 deviates from a sequence of irradiation positions (scan path 203) set with the scanner device 7.
  • the optical deflection of the energy beam (5) can have a component in the direction of the radiation path 201, so that in particular a speed at which the sequence of beam positions 217 in a segment (path segments 201A, 201B) of the radiation path 201 is scanned is constant is or remains in a target speed range around a specified speed.
  • a change in the optical deflection of the energy beam and a change in the mechanical deflection of the energy beam can at least partially compensate for one another in at least a first direction.
  • a change in the optical deflection of the energy beam and a change in the mechanical deflection of the energy beam can add up in at least a second direction.
  • the dynamic axis performs a compensating movement such that the energy beam remains on the angular contour, in Figure 7A the linear path segments 201A, 201B. Braking and re-accelerating in the area of the corner E is limited by the acceleration of the dynamic axis, which is greater than that of the mechanical deflection, so that the risk of overheating can be at least significantly reduced.
  • care must be taken to ensure that deviations in the position of the irradiation positions set by the inertial axis from the beam positions required for the target contour can be compensated for by the dynamic axes.
  • the positional deviations to be compensated for are in the area of a beam area 215, which is shown schematically for an irradiation position 211 in FIG. 7A.
  • the positional deviation at the time when the scanner device assumes the irradiation position 211 corresponds to a distance DCE if the energy beam is to strike the corner E at this time. Due to the path length differences between the Radiation path 201 and the scanning path 203 can be reduced in speed in order to achieve a constant scanning speed. Leading of the beam position was indicated by a line AXV as an example.
  • a scan speed along the irradiation path 201 can be chosen by matching the speeds of the mechanical deflection and the optical deflection. In this way, the energy input of the energy beam along the irradiation path 201 can also be influenced.
  • the aspects described herein can make it possible, in particular, to reduce or even avoid braking phases, acceleration phases and adjustments in the energy of the energy beam that are required as a result. This also reduces the effort involved in developing the process, since the energy in the energy beam in particular has to be adjusted for each type of powder material (particle size distribution, chemical composition).
  • the corner E can be part of an overhang structure.
  • the exposure can be further modified using the optical deflector, as explained below in connection with FIG. 7B.
  • the angular contour can again be created with linear path segments 201A and 201B′ of the irradiation path 201 .
  • the mechanical deflection can bring about, for example, a sequence of irradiation positions set with the scanner device, which is arranged on a curved scan path 203 .
  • each of the path segments 201A and 201B' is now continuously scanned in the direction of the corner E of the irradiation path (generally towards a taper/tip of a component to be formed), optionally with a varying scanning speed.
  • Path segments 201A and 201B' are also examples of sub-sequences of ray positions, each comprising a plurality of ray positions.
  • the arrowhead of path segment 201B' was also drawn at corner E. For example, first a scan can be made along the path segment 201A, with deviations in the mechanical deflection being compensated again by the optical deflection. Once corner E has been reached, the optical deflection device is used to jump to the start of the path segment. ments 20 IB' and, starting from there, again scanning in the direction of the corner E of the radiation path 201.
  • FIG. 7C further illustrates how the manufacture of an angular structure can be accelerated by increasing the radiated energy if the possibility of an instantaneous abrupt optical deflection is also used.
  • an energy input with the energy beam e.g. the power of a laser beam
  • an energy input with the energy beam can be used that is above a limit value, as is usually the case for a powder material type (particle size distribution, chemical composition of the powder material 2) in continuous scanning with a beam diameter at a specified Scanning speed is predetermined and must be observed, for example, during irradiation according to the irradiation strategies explained in connection with FIGS. 7A and 7B.
  • two path segments 201A" and 201B" are shown as examples of subsequences of beam positions 217.
  • the sub-sequences are exposed point by point, ie at beam positions 217, and at the same time from the inside out, ie towards corner E.
  • the energy beam can be shifted alternately to at least one beam position of the subsequence of a first of the radiation path segments, e.g. path segment 201A", and at least one beam position of the subsequence of a second of the radiation path segments, e.g. path segment 201B".
  • an exemplary sequence 1 to 10 in exemplary ten beam positions (with overlapping melting areas indicated in a circle) along the path segments 201A'' and 201B'' is given in FIG. 7C.
  • the optical deflection must at least make it possible to jump from beam position 1 to beam position 2.
  • shifting with the optical deflection between the subsequences gene occur in leaps and bounds.
  • the mechanical deflection can be changed continuously, optionally with a varying scanning speed.
  • the mechanical deflection can bring about a sequence of irradiation positions 211 set with the scanner device, which are arranged on a curved scan path 203 .
  • FIG. 8 shows a further example of a possible interaction of mechanical deflection and optical deflection when forming an irradiation path 301.
  • the irradiation path 301 includes an area of abrupt curvature K up to which the energy beam can be guided purely mechanically at a constant speed the scanning path 303 of the mechanical deflection of the scanner device moves sluggishly beyond the point of curvature before it is accelerated back to the irradiation path 301 in order to take over the sole management of the energy beam again.
  • the mechanical deflection causes a sequence of irradiation positions set with the scanner device, which is arranged on a curved scan path 303 and scanned continuously, optionally at a varying scan speed, with the curvature of the scan path 303 being less than the curvature of the curved segment.
  • a radiation position 311, an associated beam area 315 and optical correction paths DC are shown in FIG. 8 as an example.
  • FIGS. 9A and 9B explain the formation of radiation paths in which a “mechanical” scan vector (scan path) is broadened beyond a diameter of the energy beam with the aid of a lateral optical deflection.
  • the widening is indicated in Figures 9A and 9B as strips 403' and 503', respectively.
  • the strip 403' or 503' represents a region of a layer to be exposed, for example a section which forms an overhang region of the component during manufacture.
  • the irradiation path comprises a sub-sequence of beam positions, the positions of which, with mechanical deflection fixed at an irradiation position in the working area, within an associated beam exposure are rich of the deflection device.
  • a scanner device positions the energy beam at an irradiation position 411A, which corresponds, for example, to a center position of a partial area T to be exposed of a scan vector. With an optical deflector of the optical deflection device, the energy beam is then successively directed to different beam positions 417 of the partial area T in order to expose them in a predetermined sequence for a predetermined period.
  • FIG. 9A An exemplary sequence 1-2-3-4-5-6-7...n when taking the beam positions 417 to be taken is indicated in FIG. 9A.
  • the partial area T is limited in terms of dimensions by the beam region 415 with respect to the irradiation position 411A.
  • the partial area T is smaller than the beam area 415.
  • the subsequence of the beam positions on the partial area T is scanned only by changing the optical deflection with a fixed mechanical deflection.
  • the energy beam will only expose non-adjacent beam positions 417 directly one after the other.
  • the irradiation position 411 i.e. no movement of the scanner device.
  • a static exposure situation is therefore temporarily present with regard to the mechanical deflection. If the entire partial area T has been exposed, the scanner device is activated and a new irradiation position 411B is set, so that a subsequent partial area of the strip 403′ can be exposed.
  • the scanner device guides the energy beam along a defined path, the scan path 503.
  • the scan path 503 can—as in the example in FIG. 9B—be a linear scan vector or it can follow a given contour.
  • the energy beam jumps to beam positions 517 by means of optical deflection, which can lie, for example, on the right and left, ie laterally, and on the scan path 503 .
  • the energy beam will only expose non-adjacent beam positions 517 directly one after the other, if possible.
  • FIG. 9B An exemplary order 1-2-3-4-5 for taking the beam positions 517 to be taken is indicated in FIG. 9B.
  • the scanner device can be controlled in such a way that the mechanical deflection positions the energy beam continuously/incrementally at a sequence of irradiation positions.
  • the deflection device is controlled in such a way that the energy beam successively assumes the beam positions of sub-sequences that define the beam area of the corresponding irradiation position 411, and in particular a predetermined beam shape of the beam area (see, for example, the beam area 415 and the partial area T in FIG. 9A). cover partially or completely.
  • the deflection device can be controlled in such a way that the energy beam at one irradiation position of the plurality of irradiation positions within a beam area is displaced to a plurality of beam positions in order to a to be irradiated To shape the beam profile of the beam area during the manufacture of a part.
  • the energy beam can be shifted abruptly to the plurality of discrete beam positions of the beam profile to be irradiated.
  • the energy beam can, in particular, leap over beam positions in the beam area that are spatially adjacent to one another and, in particular, can only occupy beam positions in the beam area that are not spatially adjacent to one another in temporal succession.
  • FIGS. 10A to 10D explain irradiation strategies for an additive manufacturing of filigree structures, in which a detailed exposure of partial areas is carried out only by means of optical deflection.
  • a sub-sequence of beam positions can form a series of parallel, in particular linear, scan vectors and a length of each of the scan vectors can be less than or equal to an extent of the beam area of the deflection device in the direction of the respective scan vector being.
  • the irradiation path can include a plurality of sub-sequences of beam positions whose positions in the work area at one of fixed mechanical deflection belonging to a sub-sequence within a beam range of the deflection device.
  • the exposure requires a large proportion of acceleration and braking distances (skywriting, scanner delay) between the individual short vectors. This therefore causes a high proportion of non-productive time during the exposure if the exposure is carried out solely with the scanner device 7 in FIG. 1, for example.
  • successive exposure of short vectors can lead to local overheating or (in order to avoid local overheating) process pauses can be forced instead, which are to be provided for when mechanical deflection is used for filigree structures.
  • the process pauses should be chosen to ensure that sufficient heat can dissipate along the irradiation path.
  • each of the plurality of subsequences can be sampled only by changing the optical deflection with the mechanical deflection fixed. Between the scanning of two subsequences of the plurality of subsequences, the mechanical deflection can be changed from one irradiation position to another irradiation position. This can reduce or avoid waiting times and/or overheating.
  • FIGS. 10A to 10D show sketches for explaining irradiation strategies for additive manufacturing of filigree structures.
  • FIG. 10A shows an irradiation strategy for a filigree structure F tapering to a point in a component layer.
  • the filigree structure is assigned a sub-area T M , in which the exposure is carried out exclusively along a group of long scan vectors S_M represented by dashed lines.
  • the long scan vectors S_M can, for example, be exposed/scanned solely by means of mechanical deflection of the laser beam and then represent radiation paths of the scanner device.
  • the filigree structure in the component layer also forms a narrow, tapering partial area TO.
  • the filigree structure is tapered to a width that is smaller than the extent of a possible beam area 615 of the optical deflection device.
  • Exemplary beam regions 615 are indicated around irradiation positions 611 in FIG. 10A.
  • FIGS. 10A to 10D show short scan vectors S O for the narrow partial areas T O of the component layer of the filigree structure F.
  • the short scan vectors S O are scanned only by means of optical deflection of the laser beam, namely at
  • Fig. 10C illustrates vector orders 1-2-3-4-5, G-2'-3'-4'-5', 1"-2"-3" for the case of a transiently stationary mechanical deflection. So for example, at least one short scan vector SO is always skipped in the three beam regions 815, which can be optically scanned around the radiation positions 811.
  • the optical fast deflection can be used to scan non-adjacent short scan vectors S O that always have a minimum distance, so that—without stopping the optical deflection—the short scan vectors S O of the filigree structure F can be processed efficiently.
  • Figure 10D shows another advantage of flexibility in optical deflection.
  • the use of optical deflection means that scanning can always be done in one direction. Due to the rapid deflection within the beam area 915, maneuverable empty trips are not significant in terms of time. For example, the scanning of the short scan vectors SO of the filigree structure F can be directed in the scan direction against a gas flow G guided over the work area 9, which means that a higher process quality can be achieved in the area of the filigree structure F.
  • the short scan vectors S O are also examples of sub-sequences of beam positions, each of which comprises a plurality of beam positions.
  • a number of subsequences along the irradiation path and/or a number of Beam positions in one of the subsequences and/or a spatial distance between successively occupied subsequences can be determined.
  • the energy or irradiation duration entered with the energy beam into the sub-sequences can be limited.
  • the selection of energy and irradiation duration at a beam position depends, among other things, on whether one jumps, for example, between two, three or even more sub-sequences: If one skips, for example, only one beam position, so that there may still be a thermal interaction, albeit a reduced one, between -both sub-sequences, and only jumps back and forth between two sub-sequences, one can possibly put twice as much energy into each of the sub-sequences per unit of time (compared to continuous irradiation); analogously if one jumps between four sub-sequences, for example (assuming the same irradiation time per beam position).
  • thermally relevant whether the energy/power input during production is so much higher than the heat/power dissipated at one point that the peak temperature is too high, which could lead to discolouration, an unstable production process or other problems, for example.
  • the irradiation strategies disclosed herein may generally also include irradiation paths with a sub-sequence of beam positions taken by changing the mechanical deflection while the optical deflection is fixed or varied.
  • a speed at which a sequence of spatially adjacent beam positions is continuously scanned can also be selected independently of whether one of the beam positions of the sequence of spatially adjacent beam positions is occupied by changing the optical deflection and/or changing the mechanical deflection will.
  • preferred speeds for such a continuously performed scanning movement similar to a purely mechanical scanner device—are in the range from one meter per second to a few meters per second. The speed can be selected specifically for the powder material type and the energy beam/laser beam type.
  • a target speed range is, for example, in the range of a few percent (possibly up to ⁇ 10% and more) around a speed specified for an irradiation situation (powder material type, energy beam/laser beam), which is e.g Laser beam parameters and powder material parameters were determined.

Abstract

Selon un procédé de déplacement d'un faisceau d'énergie (5) continu le long d'un chemin d'exposition à un rayonnement (101) composé d'une succession de positions de faisceau (17), le chemin d'exposition à un rayonnement (101) est destiné à solidifier une matière pulvérulente (2) en une couche de poudre dans une zone de travail (9) d'un dispositif de fabrication (1). Selon le procédé, le faisceau d'énergie (5) continu est injecté sur la matière pulvérulente (2), de manière à former une couche d'un élément (4) dans le cadre d'un procédé de fabrication additive. En outre, un déplacement du faisceau d'énergie (5) intervient à l'intérieur de la zone de travail (9) par superposition d'une déviation optique du faisceau d'énergie (5) avec un dispositif de déviation (13) et d'une déviation mécanique du faisceau d'énergie (5) avec un dispositif de balayage (7). La déviation mécanique est conçue de sorte à positionner le faisceau d'énergie (5) en une pluralité de positions d'exposition au rayonnement (11) disposées dans la zone de travail (9), les positions d'exposition au rayonnement (11) définissant sensiblement la zone de travail (9). La déviation optique est conçue de sorte à dévier le faisceau d'énergie (5) autour de chacune des positions d'exposition au rayonnement (11) à l'intérieur d'une zone de faisceau (15) du dispositif de déviation (13) sur au moins une position de faisceau de la succession de positions de faisceau (17). La déviation optique et la déviation mécanique sont modifiées simultanément ou l'une après l'autre, de sorte à balayer la succession de positions de faisceau (17) avec le faisceau d'énergie (5). En outre, le procédé comprend une activation du dispositif de déviation (13) et du dispositif de balayage (7) de sorte que le faisceau d'énergie (5) balaye des séquences secondaires qui comprennent chacune au moins une position de faisceau de la succession de positions de faisceau (17) du chemin d'exposition au rayonnement (101), une zone située entre les séquences secondaires du faisceau d'énergie (5) éloignées étant omise par une modification brusque de la déviation optique, de sorte que des séquences secondaires situées successivement à distance les unes des autres sont occupées par le faisceau d'énergie .
EP21754725.6A 2020-07-21 2021-07-21 Procédé de déplacement brusque d'un faisceau d'énergie continu et dispositif de fabrication Pending EP4185430A1 (fr)

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US20230001639A1 (en) * 2021-06-30 2023-01-05 General Electric Company Additive manufacturing using solid state optical deflectors
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US11977316B1 (en) 2023-06-10 2024-05-07 IntraAction Corp. Thin film acousto-optic device and methods of fabrication
US11828846B1 (en) 2023-06-10 2023-11-28 IntraAction Corp. Lidar acousto-optic device and methods of fabrication
US11953668B1 (en) 2023-06-10 2024-04-09 IntraAction Corp. Tunable filter for microscope
US11788953B1 (en) 2023-06-10 2023-10-17 IntraAction Corp. Isotope isolation
US11829011B1 (en) 2023-06-10 2023-11-28 IntraAction Corp. Robotic system for acousto-optic transducer bonding
US11949207B1 (en) 2023-06-10 2024-04-02 IntraAction Inc. AOD device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
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EP0429196B1 (fr) * 1989-10-30 1996-03-27 3D Systems, Inc. Techniques de moulage stéréolithographiques améliorées
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DE19840926B4 (de) * 1998-09-08 2013-07-11 Hell Gravure Systems Gmbh & Co. Kg Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung
DE10355614B4 (de) 2003-11-28 2006-11-23 Siemens Ag Einrichtung und Verfahren zur Bewegungsaufteilung einer Bewegung eines Maschinenteils entlang einer Antriebsachse einer Werkzeug- oder Produktionsmaschine
ITVR20120231A1 (it) 2012-11-20 2014-05-21 Sisma Spa Macchina per produrre oggetti tridimensionali a partire da materiali in polvere
JP6847865B2 (ja) * 2015-06-22 2021-03-24 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 多軸工作機械及びこれを制御する方法
DE102018202506A1 (de) * 2018-02-19 2019-08-22 Eos Gmbh Electro Optical Systems Additives Herstellverfahren mit kontrollierter Verfestigung und zugehörige Vorrichtung
DE102018125731A1 (de) * 2018-10-17 2020-04-23 SLM Solutions Group AG Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Werkstücks

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