EP4129029A1 - Cooling circuit for an electronic housing, comprising a power module - Google Patents

Cooling circuit for an electronic housing, comprising a power module

Info

Publication number
EP4129029A1
EP4129029A1 EP21713034.3A EP21713034A EP4129029A1 EP 4129029 A1 EP4129029 A1 EP 4129029A1 EP 21713034 A EP21713034 A EP 21713034A EP 4129029 A1 EP4129029 A1 EP 4129029A1
Authority
EP
European Patent Office
Prior art keywords
cooling circuit
protuberances
turbulent
electronic assembly
power module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21713034.3A
Other languages
German (de)
French (fr)
Inventor
Gregory Hodebourg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Electrification
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Publication of EP4129029A1 publication Critical patent/EP4129029A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Definitions

  • the present invention relates to the cooling of the electronic assembly of the electric motor of an electric or hybrid motor vehicle.
  • the electronic assembly arranged in an electronic housing, comprises at least one power module the temperature of which rises during its operation, the value of the rise in this temperature being linked to the dimensioning of the power module.
  • the increase in temperature will create significant damage to the power module itself and to the other elements of the electronic assembly.
  • the cooling circuit is arranged under the power module and comprises on the internal surface in contact with the support of the power module bosses which make it possible to increase the exchange surface.
  • this solution creates turbulence in the flow of the coolant which increases the Reynolds coefficient and therefore increases the heat exchange with the coolant.
  • the object of the present invention is therefore to alleviate one or more of the drawbacks of the devices of the prior art by proposing a water circuit comprising additional internal protuberances, the configuration of which improves heat exchanges, and consequently limits the damage due to the effects. thermal by lowering the temperature.
  • the present invention proposes an electronic assembly comprising an electronic housing and a cooling circuit closed by a cover, in which a cooling fluid circulates, the cooling circuit comprising primary protuberances on its internal surface, the cooling circuit comprising at the same time. minus one secondary turbulent protuberance disposed on the internal face of the cover. This secondary turbulent outgrowth makes it possible to detach the cooling fluid from the surface of the cover and to disturb the turbulence created by the primary outgrowths. Which increases heat exchange.
  • the electronic assembly comprises a power module.
  • the cooling circuit comprises at least two secondary turbulent protuberances.
  • the cover is arranged in a plane parallel to a face of the cooling circuit in contact with the support surface of the housing.
  • the secondary turbulent protuberances are formed directly from the wall of the cooling circuit cover, either by stamping or by overmolding of the foundry.
  • the secondary turbulent protuberances are arranged in staggered rows.
  • the secondary turbulent protuberances are interposed with the primary protuberances
  • the secondary turbulent protuberances are arranged under the power module or all along the cooling circuit.
  • the number and the size of the secondary turbulent protuberances are defined as a function of the size of the cooling circuit.
  • the invention also relates to the use of the assembly according to the invention in an electric or hybrid vehicle.
  • FIG. 1 is a schematic representation of a cross-sectional view of an electronic housing with a cooling circuit according to the invention
  • FIG. 2 is a schematic representation of a longitudinal sectional view of part of a cooling circuit according to the invention.
  • the [Fig. 1] illustrates an electronic assembly 100 comprising an electronic housing 1 with a cooling circuit 2 according to the invention.
  • the electronic housing 1 comprises at least one power module 3 connected to a printed circuit. According to one embodiment of the invention, the electronic housing 1 comprises components of the power electronics. According to another embodiment of the invention, the electronic housing 1 comprises components of the control electronics.
  • the power module 3 is arranged on a support surface 4, of the electronic housing 1, in contact with the cooling circuit 2.
  • the cooling circuit 2 is thus arranged so as to allow cooling of the electronic components and more particularly of the power module 3.
  • the cooling circuit 2 is formed by a channel 21 formed in the body 22 of the circuit 2.
  • the cooling circuit 2 is formed by a circular channel 21.
  • the cooling circuit 2 is formed by a channel 21 in the form of a parallelepiped or any form compatible with the operation of the cooling circuit 2.
  • the cooling circuit 2 is made of aluminum.
  • the cooling circuit 2 is traversed by a cooling fluid 6.
  • the cooling fluid 6 is water.
  • the cooling fluid 6 is a water-glycol mixture.
  • the cooling circuit 2 comprises on its internal surface 22 primary protuberances 21 also called spikes.
  • the internal surface 22 is defined by the surface of the circuit 2 in contact with the cooling fluid 6.
  • the primary growths 21 are arranged so as to generate turbulence within the cooling liquid 6.
  • the primary protuberances 21 are arranged on the face 25 in contact with the support surface 4 of the housing 1.
  • the cooling circuit 2 is closed by a cover 5.
  • the cover 5 is arranged in a plane parallel to that of the support 4 of the power module 3, that is to say a plane parallel to the face 25 in contact with the surface 4 housing bracket 1.
  • the cover 5 is arranged in a plane forming an angle between zero and less than 90 degrees with the plane of the support 4 of the power module 3.
  • the internal surface 23 of the cover 5 of the cooling circuit 2 comprises at least one secondary turbulent protuberance 24.
  • the circuit 2 comprises at least two turbulent protuberances 24.
  • the secondary turbulent protuberances 24 are formed directly from the wall of the cooling circuit 2 cover 5, either by stamping or by overmolding of the foundry.
  • the secondary turbulent outgrowths 24 are staggered.
  • the secondary turbulating protuberances 24 are interposed with the primary protuberances 21 in order to force the fluid to slalom between the secondary turbulent protuberances 24. Slaloming improves the rally.
  • the secondary turbulating growths 24 are thus placed on the outside of the path of the fluid in order to force the water to turbulate.
  • the secondary turbulating growths 24 make it possible to detach the cooling fluid from the internal surface 23 of the cover 5.
  • the projections secondary turbulators 24 disturb the turbulence created by the primary growths 21. This increases the heat exchange.
  • the secondary turbulent protuberances 24 are arranged on part of the circuit. More precisely, the growths Secondary turbulators 24 are arranged under the power module 3. According to one embodiment of the invention, the secondary turbulators 24 are arranged all along the cooling circuit 2.
  • the number and size of the secondary turbulent growths 24 are defined as a function of the size of the cooling circuit 2.
  • the number and size of the secondary turbulent outgrowths 24 are defined so as to allow optimum turbulence 20 of the cooling fluid.
  • the invention also relates to the use of the assembly 100 according to the invention in an electric or hybrid vehicle.
  • the scope of the present invention is not limited to the details given above and allows embodiments in many other specific forms. without departing from the scope of the invention. Therefore, the present embodiments should be considered by way of illustration, and may be modified without, however, departing from the scope defined by the claims.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The invention relates to an electronic assembly (100) comprising an electronic housing (1) and a cooling circuit (2), closed by a cover (5), in which a cooling fluid circulates, said cooling circuit (2) comprising primary protuberances (21) on its inner surface (22), and comprising at least one secondary turbulator protuberance (24) on the inner face of the cover (5).

Description

Description Description
Titre de l'invention : Circuit de refroidissement pour logement électronique avec module de puissance Title of the invention: Cooling circuit for electronic housing with power module
La présente invention concerne le refroidissement de l'ensemble électronique du moteur électrique d'un véhicule automobile électrique ou hybride. The present invention relates to the cooling of the electronic assembly of the electric motor of an electric or hybrid motor vehicle.
L'ensemble électronique, disposé dans un logement électronique, comporte au moins un module de puissance dont la température s'élève lors de son fonctionnement, la valeur de l'élévation de cette température étant liée au dimensionnement du module de puissance. The electronic assembly, arranged in an electronic housing, comprises at least one power module the temperature of which rises during its operation, the value of the rise in this temperature being linked to the dimensioning of the power module.
L'augmentation de température va créer des dommages importants au niveau du module de puissance lui-même et au niveau des autres éléments de l'ensemble électronique.The increase in temperature will create significant damage to the power module itself and to the other elements of the electronic assembly.
Pour limiter ces effets thermiques, il est connu d'utiliser un circuit de refroidissement du logement électronique. Le circuit de refroidissement est disposé sous le module de puissance et comporte sur la surface interne en contact avec le support du module de puissance des bossages qui permettent d'augmenter la surface d'échange. De plus, cette solution crée de la turbulence dans l'écoulement du liquide de refroidissement ce qui augmente le coefficient de Reynolds et donc augmente l'échange thermique avec le liquide refroidissement. To limit these thermal effects, it is known practice to use a circuit for cooling the electronic housing. The cooling circuit is arranged under the power module and comprises on the internal surface in contact with the support of the power module bosses which make it possible to increase the exchange surface. In addition, this solution creates turbulence in the flow of the coolant which increases the Reynolds coefficient and therefore increases the heat exchange with the coolant.
Un problème avec ce type de circuit de refroidissement provient du fait qu'une grande partie du fluide de refroidissement minimise la perte de charge en suivant la paroi opposée à celle où sont disposés les bossages, l'effet de ces derniers est donc minimisé.A problem with this type of cooling circuit arises from the fact that a large part of the cooling fluid minimizes the pressure drop by following the wall opposite to that where the bosses are placed, the effect of the latter is therefore minimized.
La présente invention a donc pour objet de pallier un ou plusieurs des inconvénients des dispositifs de l'art antérieur en proposant un circuit d'eau comportant des excroissances supplémentaires internes dont la configuration améliore les échanges thermiques, et par conséquent limite les dommages dus aux effets thermiques en abaissant la température. Pour cela la présente invention propose un ensemble électronique comportant un logement électronique et un circuit de refroidissement fermé par un capot, dans lequel circule un fluide de refroidissement, le circuit de refroidissement comportant sur sa surface interne des excroissances primaires, le circuit de refroidissement comportant au moins une excroissance turbulatrice secondaire disposée sur la face interne du capot. Cette excroissance turbulatrice secondaire permet de décoller le fluide de refroidissement de la surface du capot et de perturber les turbulences crées par les excroissances primaires. Ce qui augmente l'échange thermique. The object of the present invention is therefore to alleviate one or more of the drawbacks of the devices of the prior art by proposing a water circuit comprising additional internal protuberances, the configuration of which improves heat exchanges, and consequently limits the damage due to the effects. thermal by lowering the temperature. For this, the present invention proposes an electronic assembly comprising an electronic housing and a cooling circuit closed by a cover, in which a cooling fluid circulates, the cooling circuit comprising primary protuberances on its internal surface, the cooling circuit comprising at the same time. minus one secondary turbulent protuberance disposed on the internal face of the cover. This secondary turbulent outgrowth makes it possible to detach the cooling fluid from the surface of the cover and to disturb the turbulence created by the primary outgrowths. Which increases heat exchange.
Selon un mode de réalisation de l'invention, l'ensemble électronique comporte un module de puissance. According to one embodiment of the invention, the electronic assembly comprises a power module.
Selon un mode de réalisation de l'invention, le circuit de refroidissement comporte au moins deux excroissances turbulatrices secondaires. According to one embodiment of the invention, the cooling circuit comprises at least two secondary turbulent protuberances.
L'augmentation du nombre d'excroissance augmente les perturbations et les échanges thermiques. Selon un mode de réalisation de l'invention, le capot est disposé dans un plan parallèle à une face du circuit de refroidissement en contact avec la surface support du logement. Selon un mode de réalisation de l'invention, les excroissances turbulatrices secondaires sont formées directement à partir de la paroi du capot circuit de refroidissement, soit par emboutissage, soit par surmoulage de la fonderie. Selon un mode de réalisation de l'invention, les excroissances turbulatrices secondaires sont disposées en quinconce. The increase in the number of outgrowths increases disturbances and heat exchanges. According to one embodiment of the invention, the cover is arranged in a plane parallel to a face of the cooling circuit in contact with the support surface of the housing. According to one embodiment of the invention, the secondary turbulent protuberances are formed directly from the wall of the cooling circuit cover, either by stamping or by overmolding of the foundry. According to one embodiment of the invention, the secondary turbulent protuberances are arranged in staggered rows.
Selon un mode de réalisation de l'invention, les excroissances turbulatrices secondaires sont intercalées avec les excroissances primaires According to one embodiment of the invention, the secondary turbulent protuberances are interposed with the primary protuberances
Selon un mode de réalisation de l'invention, les excroissances turbulatrices secondaires sont disposées sous le module de puissance ou tout le long du circuit de refroidissement. Selon un mode de réalisation de l'invention, le nombre et la taille des excroissances turbulatrices secondaires sont définis en fonction de la taille du circuit de refroidissement. According to one embodiment of the invention, the secondary turbulent protuberances are arranged under the power module or all along the cooling circuit. According to one embodiment of the invention, the number and the size of the secondary turbulent protuberances are defined as a function of the size of the cooling circuit.
L'invention concerne également l'utilisation de l'ensemble selon l'invention dans un véhicule électrique ou hybride. The invention also relates to the use of the assembly according to the invention in an electric or hybrid vehicle.
- la [Fig. 1] est une représentation schématique d'une vue en coupe transversale d'un logement électronique avec circuit de refroidissement selon l'invention, - the [Fig. 1] is a schematic representation of a cross-sectional view of an electronic housing with a cooling circuit according to the invention,
- la [Fig. 2] est une représentation schématique d'une vue en coupe longitudinale d'une partie d'un circuit de refroidissement selon l'invention. La [Fig. 1] illustre un ensemble 100 électronique comportant un logement 1 électronique avec un circuit 2 de refroidissement selon l'invention. - [Fig. 2] is a schematic representation of a longitudinal sectional view of part of a cooling circuit according to the invention. The [Fig. 1] illustrates an electronic assembly 100 comprising an electronic housing 1 with a cooling circuit 2 according to the invention.
Le logement 1 électronique comprend au moins un module 3 de puissance connecté à un circuit imprimé. Selon un mode de réalisation de l'invention, le logement 1 électronique comprend des composants de l'électronique de puissance. Selon un autre mode de réalisation de l'invention, le logement 1 électronique comprend des composants de l'électronique de commande. The electronic housing 1 comprises at least one power module 3 connected to a printed circuit. According to one embodiment of the invention, the electronic housing 1 comprises components of the power electronics. According to another embodiment of the invention, the electronic housing 1 comprises components of the control electronics.
Le module de puissance 3 est disposé sur une surface de support 4, du logement 1 électronique, en contact avec le circuit 2 de refroidissement. The power module 3 is arranged on a support surface 4, of the electronic housing 1, in contact with the cooling circuit 2.
Le circuit 2 de refroidissement est ainsi disposé de façon à permettre le refroidissement des composants électroniques et plus particulièrement du module 3 de puissance. The cooling circuit 2 is thus arranged so as to allow cooling of the electronic components and more particularly of the power module 3.
Selon un mode de réalisation de l'invention, le circuit 2 de refroidissement est formé par un canal 21 formé dans le corps 22 du circuit 2. According to one embodiment of the invention, the cooling circuit 2 is formed by a channel 21 formed in the body 22 of the circuit 2.
Selon un mode de réalisation de l'invention, le circuit 2 de refroidissement est formé par un canal 21 circulaire. According to one embodiment of the invention, the cooling circuit 2 is formed by a circular channel 21.
Selon un mode de réalisation de l'invention, le circuit 2 de refroidissement est formé par un canal 21 en forme de parallélépipède ou toutes formes compatibles avec le fonctionnement du circuit 2 de refroidissement. According to one embodiment of the invention, the cooling circuit 2 is formed by a channel 21 in the form of a parallelepiped or any form compatible with the operation of the cooling circuit 2.
Selon un mode de réalisation de l'invention, le circuit 2 de refroidissement est en aluminium. According to one embodiment of the invention, the cooling circuit 2 is made of aluminum.
Le circuit 2 de refroidissement est parcouru par un fluide 6 de refroidissement. Selon un mode de réalisation de l'invention, le fluide 6 de refroidissement est de l'eau. Selon un mode de réalisation de l'invention, le fluide 6 de refroidissement est un mélange eau- glycol. The cooling circuit 2 is traversed by a cooling fluid 6. According to one embodiment of the invention, the cooling fluid 6 is water. According to one embodiment of the invention, the cooling fluid 6 is a water-glycol mixture.
Le circuit 2 de refroidissement comporte sur sa surface 22 interne des excroissances 21 primaires également appelés picots. La surface 22 interne est définie par la surface du circuit 2 en contact avec le fluide 6 de refroidissement. The cooling circuit 2 comprises on its internal surface 22 primary protuberances 21 also called spikes. The internal surface 22 is defined by the surface of the circuit 2 in contact with the cooling fluid 6.
Les excroissances 21 primaires sont disposées de façon à générer des turbulences au sein du liquide 6 de refroidissement. Les excroissances 21 primaires sont disposées sur la face 25 en contact avec la surface 4 support du logement 1. Dans le cadre de l'invention, le circuit 2 de refroidissement est fermé par un capot 5.The primary growths 21 are arranged so as to generate turbulence within the cooling liquid 6. The primary protuberances 21 are arranged on the face 25 in contact with the support surface 4 of the housing 1. In the context of the invention, the cooling circuit 2 is closed by a cover 5.
Selon un mode de réalisation de l'invention, le capot 5 est disposé dans un plan parallèle à celui du support 4 du module de puissance 3, c'est-à-dire un plan parallèle à la face 25 en contact avec la surface 4 support du logement 1. According to one embodiment of the invention, the cover 5 is arranged in a plane parallel to that of the support 4 of the power module 3, that is to say a plane parallel to the face 25 in contact with the surface 4 housing bracket 1.
Selon un mode de réalisation de l'invention, le capot 5 est disposé dans un plan formant un angle compris entre zéro et moins de 90 degrés avec le plan du support 4 du module de puissance 3. According to one embodiment of the invention, the cover 5 is arranged in a plane forming an angle between zero and less than 90 degrees with the plane of the support 4 of the power module 3.
La surface interne 23 du capot 5 du circuit 2 de refroidissement comporte au moins une excroissance turbulatrice 24 secondaire. Selon un mode de réalisation de l'invention, le circuit 2 comporte au moins deux excroissances turbulatrices 24. The internal surface 23 of the cover 5 of the cooling circuit 2 comprises at least one secondary turbulent protuberance 24. According to one embodiment of the invention, the circuit 2 comprises at least two turbulent protuberances 24.
Selon un mode de réalisation de l'invention, les excroissances turbulatrices 24 secondaires sont formées directement à partir de la paroi du capot 5 circuit 2 de refroidissement, soit par emboutissage, soit par surmoulage de la fonderie. According to one embodiment of the invention, the secondary turbulent protuberances 24 are formed directly from the wall of the cooling circuit 2 cover 5, either by stamping or by overmolding of the foundry.
Selon un mode de réalisation de l'invention illustré [Fig. 2], les excroissances turbulatrices 24 secondaires sont disposées en quinconce. According to one embodiment of the invention illustrated [Fig. 2], the secondary turbulent outgrowths 24 are staggered.
Selon un mode de réalisation, les excroissances turbulatrices 24 secondaires sont intercalées avec les excroissances 21 primaires afin de forcer le fluide à slalomer entre les excroissances turbulatrices 24 secondaires. Le fait de slalomer permet d'améliorer l'échange. According to one embodiment, the secondary turbulating protuberances 24 are interposed with the primary protuberances 21 in order to force the fluid to slalom between the secondary turbulent protuberances 24. Slaloming improves the rally.
Les excroissances turbulatrices 24 secondaires sont ainsi disposées sur l'extérieur de la trajectoire du fluide afin de forcer l'eau à turbuler Les excroissances turbulatrices 24 secondaires permettent de décoller le fluide de refroidissement de la surface interne 23 du capot 5. De plus les excroissances turbulatrices 24 secondaires perturbent les turbulences crées par les excroissances 21 primaires. Cela augmente l'échange thermique. The secondary turbulating growths 24 are thus placed on the outside of the path of the fluid in order to force the water to turbulate. The secondary turbulating growths 24 make it possible to detach the cooling fluid from the internal surface 23 of the cover 5. In addition, the projections secondary turbulators 24 disturb the turbulence created by the primary growths 21. This increases the heat exchange.
En effet, ces excroissances turbulatrices 24 secondaires perturbent l'écoulement afin d'augmenter le coefficient de Reynolds et optimisent alors l'échange de chaleur des excroissances qui sont sous le module de puissance. In fact, these secondary turbulent growths 24 disturb the flow in order to increase the Reynolds coefficient and then optimize the heat exchange of the growths which are under the power modulus.
Selon un mode de réalisation de l'invention, les excroissances turbulatrices 24 secondaires sont disposées sur une partie du circuit. Plus précisément, les excroissances turbulatrices 24 secondaires sont disposées sous le module de puissance 3. Selon un mode de réalisation de l'invention, les excroissances turbulatrices 24 secondaires sont disposées tout le long du circuit 2 de refroidissement. According to one embodiment of the invention, the secondary turbulent protuberances 24 are arranged on part of the circuit. More precisely, the growths Secondary turbulators 24 are arranged under the power module 3. According to one embodiment of the invention, the secondary turbulators 24 are arranged all along the cooling circuit 2.
Le nombre et la taille des excroissances turbulatrices 24 secondaires sont définis en fonction de la taille du circuit 2 de refroidissement. The number and size of the secondary turbulent growths 24 are defined as a function of the size of the cooling circuit 2.
Le nombre et la taille des excroissances turbulatrices 24 secondaires sont définies de façon à permettre une turbulence 20 optimale du fluide de refroidissement. The number and size of the secondary turbulent outgrowths 24 are defined so as to allow optimum turbulence 20 of the cooling fluid.
L'invention concerne également l'utilisation l'ensemble 100 selon l'invention dans un véhicule électrique ou hybride La portée de la présente invention ne se limite pas aux détails donnés ci-dessus et permet des modes de réalisation sous de nombreuses autres formes spécifiques sans s'éloigner du domaine d'application de l'invention. Par conséquent, les présents modes de réalisation doivent être considérés à titre d'illustration, et peuvent être modifiés sans toutefois sortir de la portée définie par les revendications. The invention also relates to the use of the assembly 100 according to the invention in an electric or hybrid vehicle. The scope of the present invention is not limited to the details given above and allows embodiments in many other specific forms. without departing from the scope of the invention. Therefore, the present embodiments should be considered by way of illustration, and may be modified without, however, departing from the scope defined by the claims.

Claims

Revendications Claims
1. Ensemble (100) électronique comportant un logement (1) électronique et un circuit (2) de refroidissement fermé par un capot (5), dans lequel circule un fluide de refroidissement, le circuit (2) de refroidissement comportant sur sa surface (22) interne des excroissances (21) primaires, caractérisé en ce que le circuit de refroidissement (2) comporte au moins une excroissance turbulatrice (24) secondaire disposée sur la face interne (23) du capot (5). 1. Electronic assembly (100) comprising an electronic housing (1) and a cooling circuit (2) closed by a cover (5), in which a cooling fluid circulates, the cooling circuit (2) comprising on its surface ( 22) internal protuberances (21) primary, characterized in that the cooling circuit (2) comprises at least one turbulent protuberance (24) secondary disposed on the internal face (23) of the cover (5).
2. Ensemble (100) électronique selon la revendication 1 comportant un module de puissance (3). 2. Electronic assembly (100) according to claim 1 comprising a power module (3).
3. Ensemble (100) électronique selon une des revendications 1 ou 2, dans lequel le circuit (2) de refroidissement comporte au moins deux excroissances turbulatrices (24) secondaires. 3. Electronic assembly (100) according to one of claims 1 or 2, wherein the cooling circuit (2) comprises at least two turbulent protuberances (24) secondary.
4. Ensemble (100) électronique selon une des revendications 1 à 3, dans lequel le capot (5) est disposé dans un plan parallèle à une face (25) du circuit (2) de refroidissement en contact avec la surface (4) support du logement (1). 4. Electronic assembly (100) according to one of claims 1 to 3, wherein the cover (5) is arranged in a plane parallel to one face (25) of the cooling circuit (2) in contact with the support surface (4). housing (1).
5. Ensemble (100) électronique selon une des revendications 1 à 4, dans lequel les excroissances turbulatrices (24) secondaires sont formées directement à partir de la paroi du capot (5) du circuit (2) de refroidissement, soit par emboutissage, soit par surmoulage de la fonderie. 5. Electronic assembly (100) according to one of claims 1 to 4, wherein the secondary turbulent protuberances (24) are formed directly from the wall of the cover (5) of the cooling circuit (2), either by stamping, or by overmolding of the foundry.
6. Ensemble (100) électronique selon une des revendications 1 à 5, dans lequel les excroissances turbulatrices (24) secondaires sont disposées en quinconce. 6. Electronic assembly (100) according to one of claims 1 to 5, wherein the secondary turbulent protuberances (24) are staggered.
7. Ensemble (100) électronique selon une des revendications 1 à 6, dans lequel les excroissances turbulatrices (24) secondaires sont intercalées avec les excroissances (21) primaires 7. Electronic assembly (100) according to one of claims 1 to 6, wherein the turbulent protuberances (24) secondary are interposed with the protuberances (21) primary.
8. Ensemble (100) électronique selon une des revendication 2 à 7, dans lequel les excroissances turbulatrices (24) secondaires sont disposées sous le module (3) de puissance ou tout le long du circuit (2) de refroidissement. 8. Electronic assembly (100) according to one of claims 2 to 7, wherein the secondary turbulent protuberances (24) are arranged under the power module (3) or all along the cooling circuit (2).
9. Ensemble (100) électronique selon une des revendications 1 à 8, dans lequel le nombre et la taille des excroissances turbulatrices (24) secondaires sont définis en fonction de la taille du circuit (2) de refroidissement. 9. Electronic assembly (100) according to one of claims 1 to 8, in which the number and size of the secondary turbulent protuberances (24) are defined as a function of the size of the cooling circuit (2).
10. Utilisation de l'ensemble (100) selon une des revendications 1 à 9 dans un véhicule électrique ou hybride. 10. Use of the assembly (100) according to one of claims 1 to 9 in an electric or hybrid vehicle.
EP21713034.3A 2020-03-26 2021-03-23 Cooling circuit for an electronic housing, comprising a power module Pending EP4129029A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2002944A FR3108823B1 (en) 2020-03-26 2020-03-26 Cooling circuit for electronics housing with power module
PCT/EP2021/057398 WO2021191193A1 (en) 2020-03-26 2021-03-23 Cooling circuit for an electronic housing, comprising a power module

Publications (1)

Publication Number Publication Date
EP4129029A1 true EP4129029A1 (en) 2023-02-08

Family

ID=74553859

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21713034.3A Pending EP4129029A1 (en) 2020-03-26 2021-03-23 Cooling circuit for an electronic housing, comprising a power module

Country Status (4)

Country Link
EP (1) EP4129029A1 (en)
CN (1) CN115299190A (en)
FR (1) FR3108823B1 (en)
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FR3129267A1 (en) * 2021-11-16 2023-05-19 Valeo Systemes De Controle Moteur Electronic assembly with improved heat dissipation element
FR3129266A1 (en) * 2021-11-16 2023-05-19 Valeo Systemes De Controle Moteur Electronic assembly featuring an improved cooling system

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FR3108823B1 (en) 2022-08-05
FR3108823A1 (en) 2021-10-01
CN115299190A (en) 2022-11-04
WO2021191193A1 (en) 2021-09-30

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