CN115299190A - Cooling circuit for electronic receiving member with power module - Google Patents
Cooling circuit for electronic receiving member with power module Download PDFInfo
- Publication number
- CN115299190A CN115299190A CN202180021040.2A CN202180021040A CN115299190A CN 115299190 A CN115299190 A CN 115299190A CN 202180021040 A CN202180021040 A CN 202180021040A CN 115299190 A CN115299190 A CN 115299190A
- Authority
- CN
- China
- Prior art keywords
- cooling circuit
- protrusions
- power module
- electronic assembly
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Abstract
An electronic assembly (100) comprising an electronic container (1) and a cooling circuit (2) closed by a cover (5), a cooling fluid circulating in the cover (5), the cooling circuit (2) comprising primary protrusions (21) on an inner surface (22) thereof, the cooling circuit (2) comprising at least one secondary turbulence protrusion (24) arranged on an inner face of the cover (5).
Description
Technical Field
The present invention relates to cooling of electronic components of an electric motor of an electric or hybrid vehicle.
Background
The electronic assembly placed in the electronic housing comprises at least one power module, the temperature of which increases during its operation, the value of the increase in temperature being correlated to the size of the power module.
The temperature increase will cause severe damage to the power module itself and other components of the electronic assembly.
To limit these thermal effects, it is known to use cooling circuits for the electronic housings. The cooling circuit is arranged below the power module and comprises, on the inner surface in contact with the support of the power module, a boss allowing to increase the exchange area. Furthermore, this solution creates turbulence in the cooled flow, which increases the Reynolds coefficient (e coeffient de Reynolds), thus increasing the heat exchange with the coolant.
The problem with this type of cooling circuit comes from the fact that most of the cooling fluid minimizes the pressure drop by following the wall opposite to the wall where the boss is provided, and therefore the influence of the boss is minimized.
The object of the present invention is therefore to overcome one or more of the drawbacks of the prior art devices by proposing a water circuit comprising additional internal projections, the configuration of which improves the heat exchange and therefore limits the damage due to thermal effects by reducing the temperature.
To this end, the invention proposes an electronic assembly comprising an electronic container and a cooling circuit closed by a lid, in which a cooling fluid circulates, said cooling circuit comprising primary projections on its inner surface, said cooling circuit comprising at least one secondary turbulent projection arranged on the inner face of the lid.
The secondary turbulence protrusions make it possible to separate the cooling fluid from the surface of the cover and disturb the turbulence generated by the primary protrusions. This increases the heat exchange.
According to one embodiment of the invention, an electronic assembly includes a power module.
According to one embodiment of the invention, the cooling circuit comprises at least two secondary turbulence protrusions.
The increased number of protrusions increases interference and heat exchange.
According to one embodiment of the invention, the cover is arranged in a plane parallel to the face of the cooling circuit in contact with the support surface of the receptacle.
According to one embodiment of the invention, the secondary turbulence protrusions are formed directly by the wall of the cover of the cooling circuit, either by stamping or by casting over-molding.
According to one embodiment of the invention, the secondary turbulence protrusions are staggered.
According to one embodiment of the invention, the secondary turbulence protrusions are interposed with the primary protrusions.
According to one embodiment of the invention, the secondary turbulence protrusions are arranged below the power module or along the entire cooling circuit.
According to one embodiment of the invention, the number and size of the secondary turbulence protrusions are defined in terms of the size of the cooling circuit.
The invention also relates to the use of the assembly according to the invention in an electric or hybrid vehicle.
Drawings
FIG. 1 is a schematic cross-sectional view of an electronics pod with a cooling circuit according to the present invention;
fig. 2 is a schematic illustration of a longitudinal sectional view of a portion of a cooling circuit according to the present invention.
Detailed Description
Fig. 1 shows an electronic assembly 100 comprising an electronic housing 1, which electronic housing 1 has a cooling circuit 2 according to the invention.
The electronic container 1 comprises at least one power module 3 connected to a printed circuit. According to one embodiment of the invention, the electronic containing part 1 comprises power electronic components. According to another embodiment of the invention, the electronic containing part 1 comprises control electronics.
The power module 3 is arranged on a support surface 4 of the electronics housing 1, the support surface 4 being in contact with the cooling circuit 2.
The cooling circuit 2 is thus arranged to allow cooling of the electronic components and more specifically the power module 3.
According to one embodiment of the invention, the cooling circuit 2 is formed by a channel 21 formed in the body 22 of the circuit 2.
According to one embodiment of the invention, the cooling circuit 2 is formed by a circular channel 21.
According to one embodiment of the invention, the cooling circuit 2 is formed by channels 21 of parallelepiped shape or of any shape compatible with the operation of the cooling circuit 2.
According to one embodiment of the invention, the cooling circuit 2 is made of aluminium.
The cooling circuit 2 is traversed by a cooling fluid 6. According to one embodiment of the invention, the cooling fluid 6 is water. According to one embodiment of the invention, the cooling fluid 6 is a water-glycol mixture.
The cooling circuit 2 comprises on its inner surface 22 a primary projection 21, also called pin. The inner surface 22 is defined by the surface of the circuit 2 in contact with the cooling fluid 6.
The primary protrusions 21 are arranged to generate turbulence in the cooling fluid 6. The primary projection 21 is arranged on a face 25 in contact with the support surface 4 of the pod 1.
In the context of the present invention, the cooling circuit 2 is closed by a cover 5.
According to one embodiment of the invention, the cover 5 is arranged in a plane parallel to the plane of the support 4 of the power module 3, i.e. parallel to the plane of the face 25 in contact with the support surface 4 of the containing member 1.
According to one embodiment of the invention, the cover 5 is arranged in a plane forming an angle of zero to less than 90 degrees with said plane of the support 4 of the power module 3.
The inner surface 23 of the cover 5 of the cooling circuit 2 comprises at least one secondary turbulence protrusion 24. According to one embodiment of the invention, the circuit 2 comprises at least two turbulence protrusions 24.
According to one embodiment of the invention, the secondary turbulence protrusions 24 are formed directly by the walls of the cover 5 of the cooling circuit 2, either by stamping or by casting over-molding.
According to the embodiment of the invention shown in fig. 2, the secondary turbulence protrusions 24 are staggered.
According to one embodiment, the secondary turbulence protrusions 24 are interposed with the primary protrusions 21 to force the fluid to swirl between the secondary turbulence protrusions 24. The convolution improves the exchange.
The secondary turbulence protrusions 24 are thus arranged outside the fluid path to force water turbulence. The secondary turbulence protrusions 24 make it possible to separate the cooling fluid from the inner surface 23 of the cover 5. In addition, the secondary turbulence protrusions 24 interfere with the turbulence generated by the primary protrusions 21. This increases the heat exchange.
In effect, these secondary turbulence protrusions 24 disrupt the flow to increase the reynolds coefficient and then optimize the heat exchange of the protrusions under the power module.
According to one embodiment of the invention, the secondary turbulence protrusions 24 are arranged on a part of the circuit. More specifically, the secondary turbulence protrusions 24 are arranged below the power module 3. According to one embodiment of the invention, the secondary turbulence protrusions 24 are arranged along the cooling circuit 2.
The number and size of the secondary turbulence protrusions 24 are defined according to the size of the cooling circuit 2.
The number and size of the secondary turbulence protrusions 24 is defined to allow for optimal turbulence 20 of the cooling fluid.
The invention also relates to the use of the assembly 100 according to the invention in an electric or hybrid vehicle.
The scope of the invention is not limited to the details given above, and many other specific forms of embodiments are possible without departing from the scope of the invention. Accordingly, the present embodiments should be considered illustrative, and modifications can be made without departing from the scope as defined in the claims.
Claims (10)
1. Electronic assembly (100) comprising an electronic housing (1) and a cooling circuit (2) closed by a cover (5) in which a cooling fluid circulates, the cooling circuit (2) comprising primary protrusions (21) on an inner surface (22),
characterized in that said cooling circuit (2) comprises at least one secondary turbulence protrusion (24) provided on an inner face (23) of said cover (5).
2. The electronic assembly (100) according to claim 1, comprising a power module (3).
3. The electronic assembly (100) according to claim 1 or 2, wherein the cooling circuit (2) comprises at least two secondary turbulence protrusions (24).
4. The electronic assembly (100) according to any of claims 1 to 3, wherein the cover (5) is arranged in a plane parallel to a face (25) of the cooling circuit (2) in contact with the support surface (4) of the receptacle (1).
5. The electronic assembly (100) according to any of claims 1 to 4, wherein the secondary turbulence protrusions (24) are formed directly from the wall of the cover (5) of the cooling circuit (2) by stamping or cast overmoulding.
6. The electronic assembly (100) according to any of claims 1 to 5, wherein the secondary turbulence protrusions (24) are staggered.
7. The electronic assembly (100) according to any of claims 1 to 6, wherein the secondary turbulence protrusions (24) are interposed with the primary protrusions (21).
8. The electronic assembly (100) according to any of claims 2 to 7, wherein the secondary turbulence protrusions (24) are arranged below the power module (3) or along the cooling circuit (2).
9. The electronic assembly (100) according to any of claims 1 to 8, wherein the number and size of the secondary turbulence protrusions (24) are defined according to the size of the cooling circuit (2).
10. Use of an assembly (100) according to any one of claims 1 to 9 in an electric or hybrid vehicle.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FRFR2002944 | 2020-03-26 | ||
| FR2002944A FR3108823B1 (en) | 2020-03-26 | 2020-03-26 | Cooling circuit for electronics housing with power module |
| PCT/EP2021/057398 WO2021191193A1 (en) | 2020-03-26 | 2021-03-23 | Cooling circuit for an electronic housing, comprising a power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115299190A true CN115299190A (en) | 2022-11-04 |
Family
ID=74553859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180021040.2A Pending CN115299190A (en) | 2020-03-26 | 2021-03-23 | Cooling circuit for electronic receiving member with power module |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4129029A1 (en) |
| CN (1) | CN115299190A (en) |
| FR (1) | FR3108823B1 (en) |
| WO (1) | WO2021191193A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3129267A1 (en) * | 2021-11-16 | 2023-05-19 | Valeo Systemes De Controle Moteur | Electronic assembly with improved heat dissipation element |
| FR3129266A1 (en) * | 2021-11-16 | 2023-05-19 | Valeo Systemes De Controle Moteur | Electronic assembly featuring an improved cooling system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2536051A (en) * | 2015-03-06 | 2016-09-07 | Hiflux Ltd | Heatsink |
-
2020
- 2020-03-26 FR FR2002944A patent/FR3108823B1/en active Active
-
2021
- 2021-03-23 CN CN202180021040.2A patent/CN115299190A/en active Pending
- 2021-03-23 EP EP21713034.3A patent/EP4129029A1/en active Pending
- 2021-03-23 WO PCT/EP2021/057398 patent/WO2021191193A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP4129029A1 (en) | 2023-02-08 |
| WO2021191193A1 (en) | 2021-09-30 |
| FR3108823B1 (en) | 2022-08-05 |
| FR3108823A1 (en) | 2021-10-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |