CN219716858U - Packaging structure for vehicle-mounted processor and vehicle-mounted processor system - Google Patents

Abstract

The utility model provides a packaging structure for a vehicle-mounted processor and a vehicle-mounted processor system. The package structure includes: the first cover plate, base plate and second cover plate, the base plate has liquid cooling cavity, along the relative first cavity of base plate thickness direction and second cavity, and first cavity and second cavity are used for holding first vehicle-mounted treater and second vehicle-mounted treater respectively, and first cover plate covers first cavity, and the second cover plate covers the second cavity. The packaging structure in the embodiment of the utility model is connected with the adjacent vehicle-mounted processor and the adjacent vehicle-mounted processor through the plug hole to share one liquid cooling cavity, so that the size of the packaging structure is reduced; the vehicle-mounted processor can be effectively radiated through the liquid cooling cavity.

Description

Packaging structure for vehicle-mounted processor and vehicle-mounted processor system

Technical Field

The utility model relates to a vehicle-mounted processor, in particular to a packaging structure for the vehicle-mounted processor and a vehicle-mounted processor system.

Background

The on-board processor is an important electrical unit of the vehicle. It performs a wide range of functions such as high-speed computing, signal processing, signal transmission and reception, controlling electronics in a vehicle. In order to avoid the damage to the vehicle-mounted processor from the outside and maintain the stability of the vehicle-mounted processing operation, the vehicle-mounted processor needs to be packaged, the damage to the vehicle-mounted processor from the outside is avoided, and meanwhile, the heat generated by the vehicle-mounted processor needs to be timely dissipated, so that the stable operation of the vehicle-mounted processor is ensured. In the conventional technology, the package structure of the vehicle-mounted processor has the problems that the package structure is large in size and the vehicle-mounted processor cannot be effectively cooled.

Therefore, how to reduce the size of the package structure of the on-board processor and effectively dissipate heat of the on-board processor is a problem to be solved.

Disclosure of Invention

The utility model aims to solve the technical problem of providing a packaging structure for a vehicle-mounted processor and a vehicle-mounted processor system, wherein the packaging structure and the packaging structure in the vehicle-mounted processor system have the advantages of small size and capability of effectively radiating heat of the vehicle-mounted processor.

The technical scheme adopted by the utility model for solving the technical problems is that the packaging structure for the vehicle-mounted processor comprises: the substrate is provided with a liquid cooling cavity, a first cavity and a second cavity which are opposite in the thickness direction of the substrate, the first cavity and the second cavity are respectively used for accommodating a first vehicle-mounted processor and a second vehicle-mounted processor, the first cavity is covered by the first cover plate, and the second cavity is covered by the second cover plate.

In an embodiment, the substrate has a liquid inlet and a liquid outlet, the liquid inlet is communicated with the liquid cooling cavity, the liquid outlet is communicated with the liquid cooling cavity, wherein the liquid inlet is used for providing cooling liquid for the liquid cooling cavity, and the liquid outlet is used for discharging the cooling liquid in the liquid cooling cavity.

In one embodiment, the method further comprises: and the cooling flow passage is arranged in the cooling cavity.

In one embodiment, the flow rate of the liquid inlet is less than 6L/min.

In one embodiment, the method further comprises: the first heat dissipation platform and/or the second heat dissipation platform, the first heat dissipation platform set up in the bottom surface of first cavity, the second heat dissipation platform set up in the bottom surface of second cavity.

In one embodiment, the method further comprises: and the plug hole is connected with the first cavity and the second cavity along the thickness direction of the substrate.

In one embodiment, the method further comprises: the first cover plate is provided with a plurality of first connecting holes, and the base plate is provided with a plurality of second connecting holes, wherein the plurality of fasteners are respectively connected with the corresponding first connecting holes and the corresponding second connecting holes.

In one embodiment, the material of the substrate is an aluminum alloy.

Another aspect of the present utility model also proposes a vehicle-mounted processor system, including: a first vehicle processor and a second vehicle processor; the package structure according to the preceding claim, wherein the first and second vehicle processors are disposed in the first and second chambers, respectively.

In one embodiment, the first vehicle processor and the second vehicle processor are interconnected by a socket.

The packaging structure and the vehicle-mounted processor system are connected with the adjacent vehicle-mounted processors through the plug holes and share one liquid cooling cavity, so that the size of the packaging structure is reduced; the vehicle-mounted processor can be effectively radiated through the liquid cooling cavity.

Drawings

In order to make the above objects, features and advantages of the present utility model more comprehensible, embodiments accompanied with figures are described in detail below, wherein:

FIG. 1 is a schematic perspective view of a package structure for a vehicle-mounted processor according to an embodiment of the present utility model;

FIG. 2 is a schematic perspective view of an in-vehicle processor system according to an embodiment of the present utility model;

fig. 3 is a schematic front view of a first vehicle processor and a second vehicle processor according to an embodiment of the utility model after being connected.

Reference numerals

The first cover plate 110 and the substrate 120 are arranged on a first vehicle-mounted processor 140

First plug 141 of first cavity 121 of first ear structure 111

Second ear structure 112 second chamber 122 second vehicle processor 150

Third ear-shaped structure 113 second connection hole 123 second plug 151

Fourth ear-like structure 114 liquid cooling cavity 124 first heat sink 160

The liquid inlet 125 of the first side 115 is inserted into the hole 170

Second side 116 outlet 126

First connection hole 117 and second cover plate 130

Detailed Description

In order to make the above objects, features and advantages of the present utility model more comprehensible, embodiments accompanied with figures are described in detail below.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced in other ways than as described herein, and therefore the present utility model is not limited to the specific embodiments disclosed below.

As used in the specification and in the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present utility model. Furthermore, although terms used in the present utility model are selected from publicly known and commonly used terms, some terms mentioned in the present specification may be selected by the applicant at his or her discretion, the detailed meanings of which are described in relevant parts of the description herein. Furthermore, it is required that the present utility model is understood, not simply by the actual terms used but by the meaning of each term lying within.

The package structure for an in-vehicle processor and the in-vehicle processor system of the present utility model will be described below with reference to specific embodiments.

Fig. 1 is a schematic perspective view of a package structure for an in-vehicle processor according to an embodiment, and fig. 2 is a schematic perspective view of an in-vehicle processor system according to an embodiment. Referring to fig. 1 and 2, the package structure includes a first cover plate 110, a substrate 120, and a second cover plate 130. The substrate 120 has a first chamber 121 and a second chamber 122; the first and second chambers 121 and 122 are for housing the first and second vehicle processors 140 and 150, respectively; the first cover plate 110 covers the opening of the first chamber 121 to encapsulate the first onboard processor 140 located within the first chamber 121, and similarly, the second cover plate 130 covers the second chamber 122 to encapsulate the second onboard processor 150 located within the second chamber 122.

Packaging the first and second onboard processors 140, 150 in the first and second chambers 121, 122, respectively, facilitates improving EMC (electromagnetic compatibility ) of the processors.

Specifically, referring to fig. 1, the first cover plate 110 has a plate-like structure, and the dimensions of the plate-like structure in the second direction D2 and the third direction D3 are related to the dimension of the in-vehicle processor encapsulated by the encapsulation structure, which is not limited in the present utility model. The first cover plate 110 has a first ear structure 111, a second ear structure 112, a third ear structure 113, and a fourth ear structure 114. The first ear structure 111 and the second ear structure 112 are located on a first side 115 of the first cover plate 110, the third ear structure 113 and the fourth ear structure 114 are located on a second side 116 of the first cover plate 110, and the first side 115 and the second side 116 are opposite along the second direction D2.

The first ear structures 111, the second ear structures 112, the third ear structures 113 and the fourth ear structures 114 are respectively distributed with first connection holes 117, and the first connection holes 117 penetrate through the ear structures along the thickness direction D1 of the substrate. Note that, fig. 1 only shows the first connection hole 117 on the first ear structure 111, and the first connection holes on the other ear structures are the same as the first connection hole 117 located on the first ear structure 111.

Correspondingly, the substrate 120 has four second connection holes 123. Four second connection holes 123 are distributed at four opposite corners of the substrate 120. In an embodiment, the package structure further includes a plurality of fasteners (not shown), and in fig. 1, the first connection hole 117 and the second connection hole 123 may be connected by four fasteners to achieve sealing of the first cover plate 110 from the first chamber 121. It should be understood that the number of first coupling holes 117, the number of second coupling holes 123, and the number of fasteners are identical.

With continued reference to FIG. 1, the substrate 120 has a liquid-cooled cavity 124. The first chamber 121 and the second chamber 122 are disposed on both sides of the liquid cooling chamber 124 in the thickness direction D1 of the substrate. The substrate 120 has a liquid inlet 125 and a liquid outlet 126. Both the liquid inlet 125 and the liquid outlet 126 are in communication with the liquid cooling cavity 124. The liquid inlet 125 is used for providing cooling liquid to the liquid cooling cavity 124, and the liquid outlet 126 is used for discharging the cooling liquid in the liquid cooling cavity 124. In this way, the cooling liquid with lower temperature enters the liquid cooling cavity 124 through the liquid inlet 125, the temperature of the cooling liquid rises after the cooling liquid absorbs the heat generated by the first vehicle processor and the second vehicle processor, and the cooling liquid with higher temperature is discharged out of the liquid cooling cavity 124 through the liquid outlet 126. In some embodiments, the flow rate of the inlet 125 is less than 6L/min, and the temperature of the inlet 125 is controlled to be within 65 ℃. In this way, leakage of the cooling fluid due to excessive pressure in the cooling chamber 124 can be avoided. The cooling fluid may be a mixture of water and glycol, for example 50% by volume water and 50% by volume glycol.

In some embodiments, the package structure further has a cooling flow channel. The cooling flow channel is arranged in the cooling cavity 124, one end of the cooling flow channel is connected with the liquid inlet 125, and the other end is connected with the liquid outlet 126, so that the circulation of cooling liquid is realized. The cooling flow path is arranged to cover the first vehicle processor and the second vehicle processor. Therefore, local overheating of the vehicle-mounted processor caused by incapability of radiating can be avoided, and reliable and stable operation of the vehicle-mounted processor is ensured. The first and second onboard processors of the present utility model share the same cooling cavity 124, which reduces the size of the package structure in the substrate thickness direction D1.

In one embodiment, the material of the substrate 120 is an aluminum alloy. The process of manufacturing the liquid-cooled cavity 124 may be: machining the massive aluminum alloy into a groove by CNC (computer numerical control) machine tool, computer numerical control; the grooves are then sealed using a friction welding process to form the liquid-cooled cavity 124.

In an embodiment, the package structure further includes a first heat dissipation stage and/or a second heat dissipation stage, the first heat dissipation stage is disposed on the bottom surface of the first chamber, and the second heat dissipation stage is disposed on the bottom surface of the second chamber. The first heat sink is described as an example. Referring to fig. 2, the first heat sink 160 is disposed on the bottom 121a of the first chamber 121. The position of the first heat dissipating platform 160 at the bottom 121a corresponds to the electronic unit with the large heat generation amount in the first vehicle processor 140, so that the heat dissipation of the electronic unit with the large heat generation amount in the first vehicle processor 140 can be performed pertinently, which can improve the operation stability of the first vehicle processor 140. Similarly, the second heat dissipation platform is disposed on the bottom surface of the second chamber, and the position of the second heat dissipation platform corresponds to the electronic unit with large heat dissipation in the second vehicle processor, so as to dissipate heat of the electronic unit with large heat dissipation in a targeted manner.

In some embodiments, to improve the heat dissipation efficiency of the first heat dissipation stage and the second heat dissipation stage on the electronic unit, a heat conductive material is disposed between the heat dissipation stage and the corresponding electronic unit to reduce the contact thermal resistance.

Referring to fig. 2, in an embodiment, the package structure further includes a socket 170. The plug hole 170 connects the first chamber 121 and the second chamber 122 in the thickness direction D1 of the substrate. A schematic front view of the first vehicle processor 140 and the second vehicle processor 150 coupled together in accordance with an embodiment of fig. 3 is shown. The first plug 141 of the first vehicle processor 140 is plugged into the second plug 151 of the second vehicle processor 150 through the plug hole 170. The above-described plugging manner between the first and second onboard processors 140 and 150 reduces the size of the package structure in the substrate thickness direction D1. In addition, the first connector 141 and the second connector 151 are floating board-to-board connectors, so that when the first onboard processor 140 and the second onboard processor 150 are connected, the first onboard processor 140 and the second onboard processor 150 can adaptively displace in the thickness direction of the substrate, the second direction D2 and the third direction D3, and blind insertion is facilitated during assembly. Furthermore, board-to-board blind mating eliminates the need to use cables to transmit board-level signals.

The packaging structure in the embodiment of the utility model is connected with the adjacent vehicle-mounted processor and the adjacent vehicle-mounted processor through the plug hole to share one liquid cooling cavity, so that the size of the packaging structure is reduced; the vehicle-mounted processor can be effectively radiated through the liquid cooling cavity.

The utility model further provides a vehicle-mounted processor system. Referring to fig. 2, the in-vehicle processor system includes: the first vehicle processor 140, the second vehicle processor 150, and the package structure as previously described. The first and second vehicle processors 140 and 150 are disposed in the first and second chambers 121 and 150, respectively. In some embodiments, the first vehicle processor 140 and the second vehicle processor 150 are connected to each other by a socket 170.

The packaging structure in the vehicle-mounted processor system is connected with the adjacent vehicle-mounted processor and the adjacent vehicle-mounted processor through the plug hole to share one liquid cooling cavity, so that the size of the packaging structure is reduced; the vehicle-mounted processor can be effectively radiated through the liquid cooling cavity.

While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing application disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements and adaptations of the utility model may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within the present disclosure, and therefore, such modifications, improvements, and adaptations are intended to be within the spirit and scope of the exemplary embodiments of the present disclosure.

Meanwhile, the present utility model uses specific words to describe embodiments of the present utility model. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the utility model. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the utility model may be combined as suitable.

In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments are modified in some examples by the modifier "about," approximately, "or" substantially. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for a 20% variation. Accordingly, in some embodiments, numerical parameters set forth in the specification and claims are approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and parameters set forth herein are approximations in some embodiments for use in determining the breadth of the range, in particular embodiments, the numerical values set forth herein are as precisely as possible.

Claims (10)

1. A package structure for a vehicle-mounted processor, comprising: the substrate is provided with a liquid cooling cavity, a first cavity and a second cavity which are opposite in the thickness direction of the substrate, the first cavity and the second cavity are respectively used for accommodating a first vehicle-mounted processor and a second vehicle-mounted processor, the first cavity is covered by the first cover plate, and the second cavity is covered by the second cover plate.

2. The package structure of claim 1, wherein the substrate has a liquid inlet in communication with the liquid cooling cavity and a liquid outlet in communication with the liquid cooling cavity, wherein the liquid inlet is for providing cooling liquid to the liquid cooling cavity and the liquid outlet is for discharging cooling liquid in the liquid cooling cavity.

3. The package structure of claim 2, further comprising: and the cooling flow passage is arranged in the liquid cooling cavity.

4. The packaging structure of claim 2, wherein the flow rate of the liquid inlet is less than 6L/min.

5. The package structure of claim 1, further comprising: the first heat dissipation platform and/or the second heat dissipation platform, the first heat dissipation platform set up in the bottom surface of first cavity, the second heat dissipation platform set up in the bottom surface of second cavity.

6. The package structure of claim 1, further comprising: and the plug hole is connected with the first cavity and the second cavity along the thickness direction of the substrate.

7. The package structure of claim 1, further comprising: the first cover plate is provided with a plurality of first connecting holes, and the base plate is provided with a plurality of second connecting holes, wherein the plurality of fasteners are respectively connected with the corresponding first connecting holes and the corresponding second connecting holes.

8. The package structure of claim 1, wherein the material of the substrate is an aluminum alloy.

9. An in-vehicle processor system, comprising:

a first vehicle processor and a second vehicle processor;

the package structure of any one of claims 1-8, wherein the first and second onboard processors are disposed in first and second chambers, respectively.

10. The on-board processor system of claim 9, wherein the first on-board processor and the second on-board processor are connected to each other by a socket.