EP4126778A1 - Object with active anti-adhesive surface - Google Patents
Object with active anti-adhesive surfaceInfo
- Publication number
- EP4126778A1 EP4126778A1 EP21716381.5A EP21716381A EP4126778A1 EP 4126778 A1 EP4126778 A1 EP 4126778A1 EP 21716381 A EP21716381 A EP 21716381A EP 4126778 A1 EP4126778 A1 EP 4126778A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- cover layer
- interdigital structure
- transparent
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000181 anti-adherent effect Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000000463 material Substances 0.000 claims description 52
- 238000000576 coating method Methods 0.000 claims description 40
- 239000011248 coating agent Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 30
- 229910052760 oxygen Inorganic materials 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 18
- 230000009467 reduction Effects 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 15
- 230000006870 function Effects 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 238000005240 physical vapour deposition Methods 0.000 claims description 11
- 238000005229 chemical vapour deposition Methods 0.000 claims description 10
- 230000006872 improvement Effects 0.000 claims description 10
- 244000005700 microbiome Species 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 238000010292 electrical insulation Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 238000002310 reflectometry Methods 0.000 claims description 6
- 238000002679 ablation Methods 0.000 claims description 5
- 230000006978 adaptation Effects 0.000 claims description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000001699 photocatalysis Effects 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000000356 contaminant Substances 0.000 claims description 3
- 239000004922 lacquer Substances 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- NPNMHHNXCILFEF-UHFFFAOYSA-N [F].[Sn]=O Chemical compound [F].[Sn]=O NPNMHHNXCILFEF-UHFFFAOYSA-N 0.000 claims description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 135
- 230000000694 effects Effects 0.000 description 21
- 239000002245 particle Substances 0.000 description 16
- 238000004720 dielectrophoresis Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 230000008901 benefit Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000010936 titanium Substances 0.000 description 9
- 230000005684 electric field Effects 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 238000011109 contamination Methods 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000000608 laser ablation Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 241000195493 Cryptophyta Species 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 241001270131 Agaricus moelleri Species 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 230000003373 anti-fouling effect Effects 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 235000010215 titanium dioxide Nutrition 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241000238586 Cirripedia Species 0.000 description 2
- 229910003087 TiOx Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000002156 adsorbate Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical class [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101100346656 Drosophila melanogaster strat gene Proteins 0.000 description 1
- 101000801643 Homo sapiens Retinal-specific phospholipid-transporting ATPase ABCA4 Proteins 0.000 description 1
- 102100033617 Retinal-specific phospholipid-transporting ATPase ABCA4 Human genes 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000845 anti-microbial effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000003115 biocidal effect Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007146 photocatalysis Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000004936 stimulating effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3417—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials all coatings being oxide coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/42—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating of an organic material and at least one non-metal coating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3429—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating
- C03C17/3441—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating comprising carbon, a carbide or oxycarbide
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/70—Properties of coatings
- C03C2217/73—Anti-reflective coatings with specific characteristics
- C03C2217/732—Anti-reflective coatings with specific characteristics made of a single layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/90—Other aspects of coatings
- C03C2217/94—Transparent conductive oxide layers [TCO] being part of a multilayer coating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/90—Other aspects of coatings
- C03C2217/94—Transparent conductive oxide layers [TCO] being part of a multilayer coating
- C03C2217/944—Layers comprising zinc oxide
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/90—Other aspects of coatings
- C03C2217/94—Transparent conductive oxide layers [TCO] being part of a multilayer coating
- C03C2217/948—Layers comprising indium tin oxide [ITO]
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/152—Deposition methods from the vapour phase by cvd
- C03C2218/153—Deposition methods from the vapour phase by cvd by plasma-enhanced cvd
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
Definitions
- the invention relates to a substrate with a transparent cover layer, a transparent interdigital structure being arranged between the substrate and the cover layer. It also relates to the use of a corresponding transparent cover layer in combination with a transparent interdigital structure to improve cleanability and / or to reduce the adhesion of contaminants and to remove snow and ice and to impart anti-fog properties.
- the invention also relates to a method for producing a coated substrate according to the invention.
- a contamination of surfaces is not only undesirable in many areas for aesthetic reasons, but this contamination often reduces or prevents the function of the actual object.
- the type of soiling or deposits on surfaces is diverse: In areas of building surfaces, these are often particles from natural materials such as dust, but also deposits that arise from environmental pollution such as soot.
- photocatalytically active coatings are used.
- the photocatalytic effect breaks down organic adsorbates and / or impurities and thus cleans them off. Inorganic substances or particles cannot be cleaned off with this method.
- Anti-fouling paints are used in shipping to prevent barnacles and other (micro) organisms from growing on the hulls (consumption of pollutants). The effect is often based on the fact that antifouling material is continuously released from the paint and thus released into the environment. Often these lacquers are (tin or) copper-based and therefore have a high environmental impact. In addition, the low transparency of these coatings prevents their use on transparent surfaces such as those found in optical instruments or windows or portholes.
- the alternating current electrokinetics enables through dielectrophoresis (DEP) and alternating current electrothermal energy via generally conductive interdigital structures to keep surfaces free or to remove particles.
- DEP dielectrophoresis
- the particles are repelled from the substrate surfaces in an inhomogeneous electric field by a negative DEP effect and transported away by a fluid flow due to the alternating current electrothermal energy.
- the generation of the electric field takes place through a coordinated arrangement of electrodes (e.g. interdigital structures) [Hawari, A.H. [et al.]: A fouling suppression system in submerged membrane bioreactors using dielectrophoretic forces. In: Journal of environmental Sciences (China) Vol. 29, 2015, pp. 139-145.
- the object of the present invention to provide surfaces which, taking into account the optical requirements of the respective substrate, have the possibility of improved adhesion prevention or improved detachability of adhesions, with improved stability of the desired Function should be present.
- the preferred task was that the surface even has an improved adhesion prevention / cleanability than would be possible on the basis of dielectrophoresis alone and / or to enable a reduced use of energy for dielectrophoresis without having to accept any losses in the desired effect .
- a substrate with a transparent cover layer a transparent interdigital structure being arranged between the substrate and the cover layer.
- “Transparent” in the context of the present invention means, in its broadest definition, that the transmission of at least one when the light is perpendicular to the surface Wavelength in the range between 250 nm to 11 gm is> 30%. If in doubt, check in whole-number nanometer increments, starting at 250 nm.
- transparency preferably means that the transmission of at least 10, more preferably at least 100, wavelengths in the range from 250 nm to 11 ⁇ m, to be checked in the steps described above, is> 30%. It is even more preferred that the transmission of two thirds of the wavelengths (in each case in 1 nm steps) in a block 100 of adjacent wavelengths in the range from 250 nm to 11 pm is> 30%. It is particularly preferred that the transmission of two thirds of the wavelengths (in each case in 1 nm steps) in a block 100 of adjacent wavelengths in the range from 380 nm to 780 nm is> 30%.
- “Transparent” in the context of the present invention means, in its broadest definition, that the absorption coefficient of at least one wavelength in the range between 250 nm to 11 ⁇ m is ⁇ 10 ⁇ cm. If in doubt, check in whole-number nanometer increments, starting at 250 nm.
- transparency preferably means that the absorption coefficient of at least 10, more preferably at least 100 wavelengths in the range from 250 nm to 11 ⁇ m, to be checked in the steps described above, is ⁇ 10 ⁇ cm. It is even more preferred that the absorption coefficient of two thirds of the wavelengths (in each case in 1 nm steps) in a block 100 of adjacent wavelengths in the range from 250 nm to 11 pm ⁇ 10 ⁇ -. cm
- the absorption coefficient of two thirds of the wavelengths (in each case in 1 nm steps) in a block 100 of adjacent wavelengths in the range from 380 nm to 780 nm is ⁇ 10 ⁇ -. cm
- FIG. 1 An example of an interdigital structure in the sense of the present text is FIG. 1. With reference to FIG. 1, the term "interdigital structure" is defined below for this text:
- An interdigital structure consists of at least two interdigitated non-touching electrodes (1a, 1b). These electrodes each have at least two Conductors that are only electrically connected at one end of the conductor (3) and that have a sufficient spacing area (2) from one another to give at least one conductor of the or one of the other electrodes (1a, 1b) sufficient space between the two conductors so that there is no electrical contact between the at least two electrodes.
- the length of the ladder is many times greater than the width of the ladder (> factor 2, more preferably> factor 10).
- the width of the ladder is many times greater than the height of the ladder (> factor 2, more preferably> factor 5).
- the height of the ladder is essentially the same.
- the distance between the non-touching conductors is preferably essentially the same or, in order to generate a directed fluid flow as a result of the electrohydothermal excitation of conductive fluids, the electrode distance and the electrode width alternate with a wide electrode, a wide distance from the adjacent narrow electrode with a narrow distance to the next wide electrode, etc.
- the base areas of all electrodes are preferably in the same area. This surface can be flat or curved.
- the conductors can be linear or curved.
- “That there is no electrical contact between adjacent electrodes” means in the context of the present invention that the electrodes are not connected to one another in a conductive manner.
- the cover layer takes on the function of an electrical insulator on the electrodes, so that an exchange of charge between the electrodes and the surrounding media, such as liquids, is hindered.
- a material that performs an insulator function is also arranged between the electrodes.
- the specific resistance of insulators is greater than 10 8 Ohm cm. This definition also applies to this text.
- top layer in the sense of the present application is always a layer that is applied in such a way that it represents the outermost layer of the coated substrate; the person skilled in the art also understands that a top layer in the sense of the present application is always a flat structure , that is to say in particular a structure that not only covers the conductor tracks of the interdigital structure. It has surprisingly been found that it is possible to produce transparent interdigital structures in the sense of the present invention in combination with transparent cover layers.
- a method has proven to be particularly suitable in which the area of the (future) interdigital structure on the surface of the substrate is coated flat with a material suitable for the interdigital structure and subsequently the conductor tracks of the interdigital structure are generated by the spacing areas between the conductor structures are processed chemically or physically, in particular by means of a laser, in such a way that there is electrical insulation between the conductors.
- This can be done by possibly including material from the substrate in the spacing areas by chemical or physical modification of the material for the interdigital structure and / or with local removal or thickness reduction of the material present in the (future) spacing areas, in particular by means of a laser or by a chemical process. Please also refer to below.
- the combination according to the invention of transparent cover layer and transparent interdigital structure thus enables the advantages of the interdigital structure to be used for all applications in which the permeability of one or more wavelengths in the area of the coating of the substrate is important.
- Optical instruments in particular, but also any substrate surface for which “shining through” at least one wavelength range is desirable, can be effectively protected from undesired buildup with the coating system to be used according to the invention or can be designed in such a way that they are easier to clean. It is not necessary to permanently apply voltage to the interdigital structure.
- the interdigital structure is provided with voltage, preferably alternating voltage, so that alternating fields arise that repel particles and dirt that are on the surface of the have deposited a transparent cover layer.
- voltage preferably alternating voltage
- the force effect of dielectrophoresis results from the interaction between the induced dipole moment of a particle and an inhomogeneous electric field.
- the inhomogeneous field is caused by the electrodes and influenced by the geometric arrangement of the electrodes, the electrode properties themselves and the cover layer, as well as by the permittivity of the surrounding medium.
- a force will act in the direction of areas with a low electric field (negative DEP).
- the DEP force on particles decreases with the gradient of the field.
- the resulting particle velocities are inversely proportional to the cube of the distance. Therefore, only thin insulation layers are suitable for encapsulating the electrodes.
- Alternating current electrothermal energy results from the interaction of an inhomogeneous electric field with a temperature gradient in the bulk of the fluid.
- the temperature gradient within the liquid causes local differences in the electrical properties of the liquid, ie conductivity and permittivity, which induce a free charge density.
- the source of the temperature gradient can be internal (e.g. Joule heating) or external (e.g. strong lighting, microheater, etc.).
- the effect of alternating current electrothermal energy is based on a temperature gradient in the bulk of the liquid and not from the liquid-electrode interface. With alternating current electrothermal energy, strong micro-currents can be generated, especially in liquids with high conductivities above 0.7 S / m.
- symmetrical electrode pairs in the context of the present invention results in induced symmetrical micro-vortices over the electrodes, so that no net flow is generated.
- a directed net flow it is preferred according to the invention to break the symmetry of the electrodes. Since the electrothermal force is a function of the electric field and the temperature gradient, the asymmetry can be achieved by manipulating one or both of the factors. In this sense, it is preferred that the effects of the substrate according to the invention in the sense of the task described above do not arise primarily from heat generation within the structure (that is, below the surface layer level) or from acoustic effects.
- the transparent cover layer being a layer deposited from the gas phase or a sol-gel layer, preferably a layer produced by means of physical or chemical vapor deposition, more preferably a layer produced by means of plasma-assisted physical or chemical vapor deposition.
- a substrate according to the invention with a transparent cover layer, the transparent cover layer or intermediate layer being a silicone layer, preferably a layer with surface-modified silicone, particularly preferably with radiation-modified silicone, very particularly preferably as in WO 2016/030 183 A1 disclosed.
- the transparent cover layers to be used according to the invention can be produced well with this preferred coating process. When selecting the suitable deposition method, the person skilled in the art will also take into account the desired properties of the transparent cover layer, in particular with regard to the intended use of the coated substrate.
- the following methods are preferably suitable for generating the respective property of the top layer, without seeing this as a restriction:
- Photo catalysis physical vapor deposition, chemical vapor deposition, if necessary with subsequent tempering for the deposition of photocatalytically active titanium dioxide, especially in the anatase modification,
- Anti-stick effect plasma-assisted chemical vapor deposition for the deposition of plasma polymeric silicon-containing coatings with low surface energy, preferably ⁇ 22 mN / m
- sol-gel coating (advantage: formation of coatings with few defects) / silicon-containing coatings or aluminum-containing coatings deposited by means of plasma-assisted chemical vapor deposition
- Enhancement of the dielectrophoretic effect physical vapor deposition, chemical vapor deposition for the deposition of titanium-containing coatings.
- a substrate according to the invention with a transparent cover layer is preferred, the transparent cover layer adding up to> 85 at% Si, C, F and O, preferably> 90 at% Si, C, F and O, more preferably> 95 at -% Si, C, F and O or totaled> 85 at% Ti and O, preferably> 90 at% Ti and O, more preferably> 95 at% Ti and O or> 85 at% Al and O, preferably> 90 at% Al and O, more preferably> 90 at% Al and O, measured by means of XPS and based on the atoms detected by means of XPS.
- the preferred layer compositions for the transparent cover layer are organosilicon or organic transparent cover layers, in particular plasma polymeric transparent cover layers, it being further preferred that the proportion of silicon in these layers is at least 5 at .-% in the sense of the above definition .
- Organosilicon layers are preferably fluorine-free.
- An alternative preferred cover layer is one which is based on titanium oxides, in particular on titanium dioxide.
- Another alternative is such a transparent cover layer based on aluminum oxides.
- a layer is “based” on a certain material in the sense of the present text that the corresponding material comprises at least 50% of said compound (or group of compounds), more preferably at least 70%, more preferably at least 90% , it may even be preferred that the corresponding material consists of the compound or the connecting group.
- a “group of compounds” in the sense of the above definition consists of those compounds that fall under the general definition.
- An example of this are "titanium oxides", which include the group of all titanium dioxides and suboxides of titanium in all crystal structures. It has been found that the preferred materials mentioned for the cover layers are particularly suitable for producing cover layers which, on the one hand, are transparent and, on the other hand, also have other desirable properties, which are described further below.
- a substrate according to the invention with a transparent cover layer is preferred, the interdigital structure consisting of a material based on a composition selected from the group consisting of indium tin oxide, zinc oxide, fluorine tin oxide, aluminum zinc oxide, antimony Tin oxide, electrically conductive transparent lacquer and graphene, with indium tin oxide being preferred.
- undoped zinc oxide is the least preferred material for those in the interdigital structure and, in case of doubt, can preferably be excluded from the aforementioned group. It has been found that transparent interdigital structures can be produced particularly effectively from the materials mentioned. This is particularly true when the preferred method according to the invention, which is described below, is used.
- a substrate according to the invention with a transparent cover layer is preferred, the thickness of the interdigital structure being 10 nm - 10 pm, preferably 20 nm - 1 pm and more preferably 30 nm - 500 nm and / or the thickness of the cover layer being 50 nm - 10 pm, preferably 100 nm - 5 pm and more preferably 200 nm - 3 pm. “Thickness” is to be understood as the mean thickness of the interdigital structure or the (flat) cover layer.
- a substrate according to the invention with a transparent cover layer is preferred, the spaces between the conductors of the interdigitated electrodes of the interdigital structure being at least partially filled with material that has arisen from the material of the interdigital structure.
- Material that has arisen from the material of the interdigital structure means that it is a material that was converted and / or chemically changed during the creation of the actual interdigital structure. With reference to FIG. 1, this material then at least partially occupies the space (2) between the interdigital structures.
- the interdigital structure to be preferably used according to the invention was not produced from a purely ablative process, but rather a process that (also) converts the material from which the interdigital structure is made, preferably in such a way that insulation between the conductor tracks of the individual electrodes the interdigital structure exists. It is of course possible that the generation of the interdigital structure can take place partly with ablation and partly with corresponding conversion. Such conversions are in particular chemical changes, such as, for example, oxidations and enrichment or depletion of individual elements or physical changes, such as, for example, recrystallizations the subsequent coating by means of the top layer is more homogeneous.
- the elevations that the electrodes of the interdigital structure represent with respect to the space between them are thereby at least partially leveled.
- PVD process physical gas deposition process
- CVD process chemical gas deposition process
- PE-CVD process plasma-assisted chemical gas deposition process
- a substrate according to the invention with a transparent cover layer is preferred, the cover layer being completely closed in the area of the interdigital structure.
- the cover layer can in particular fulfill a protective function well; it leads to the interdigital structure being electrically isolated from the outside with a suitable design of the cover layer, which is particularly important when it is used in contact with water, and it can fulfill its preferred additional functions in a particularly suitable manner (cf. . also below).
- a substrate according to the invention with a transparent cover layer is preferred, the interdigital structure being arranged between the substrate and the cover layer in exactly one plane.
- “exactly in one plane” means that the base areas of all electrodes of the interdigital structure lie in the same area. This surface can be flat or curved.
- the advantage of arranging the interdigital structure exactly in one plane is that it enables particularly homogeneous (alternating) fields to be generated. It is thus possible to provide the surface of the coated substrate with a uniform repulsion force for undesired deposits. Furthermore, the arrangement in one plane enables a simpler production of the anti-stick surface according to the invention. Furthermore, the interdigital structure itself can be produced particularly effectively in this way. Several levels for building one or more interdigital structures would lead to a significantly more complicated layer structure, which would require a multiplication of process steps.
- a substrate according to the invention with a transparent cover layer is preferred, the cover layer having one or more of the following functions:
- the transparent cover layer has 2, 3, 4 or more of the functions mentioned.
- Mechanical protection for the interdigital structure means that the cover layer has a structure that is more resistant to abrasion and preferably further mechanical stress than the interdigital structure.
- Chemical protection for the interdigital structure means analogously that the cover layer has a configuration that makes it more resistant to the usual chemical attacks on the interdigital structure, preferably by water, acids, bases and / or oxygen, solvents, compared to the interdigital structure itself.
- Electrical insulation of the interdigital structure means that the coating is designed in such a way that when a direct voltage is applied to an electrode of the interdigital structure, preferably no direct current, but at most a direct current less by a factor of 10, from the interdigital structure through the cover layer to the surrounding medium, preferably water flows.
- interdigital structure with such a coating can also be operated safely in water with a higher salt content and thus a higher conductivity of the surrounding medium.
- Increasing the dielectric constant of the coating on the substrate means that the covering layer increases the dielectric constant of the overall coating of the substrate. This has the advantage that the desired repulsion effects are higher due to an increased dielectric constant for the same voltage, which leads to energy savings.
- Adaptation of the transmission or reflectivity of interdigital structures and the material in the spaces of the interdigital structure for at least one wavelength means that the differences between the transmission and / or reflectivity of the material of the interdigital structure and the material in the spaces of the interdigital structure, from the outside, through the cover layer the top layer measured, can be reduced.
- the interdigital structure In the area of visible light in particular, the interdigital structure often leads to color and / or transmission differences between the interdigital structure and the spaces. This is possible through the selection of a suitable transparent cover layer both with regard to the material composition and the layer thickness in the preferred coated substrate according to the invention.
- a reduction in the reflection means that the transmission of the layer system on the substrate is improved (increased).
- a reduction in the reflection here preferably does not mean that a reflection occurring on the substrate is reduced.
- the advantage of reducing the reflection can be seen in particular in the fact that a higher light yield or an increased yield in the range of the desired wavelength is possible.
- a reduction in the adhesion of microorganisms means that microorganisms (here, as an exception, higher organisms are also included) are more strongly prevented from accumulation by the cover layer, even if the interdigital structure is not subjected to voltage. Reduction of the adhesion of soiling is to be understood analogously to the definition of the reduction of adhesion of microorganisms.
- Photocatalytic action in the context of the present invention means that under the influence of radiation in the wavelength range as defined above for transparency, catalytic reactions can take place on the surface of the cover layer. This is particularly advantageous if it preferably decomposes organic adsorbates, filmic impurities and / or adhering particles.
- Layers according to WO 2019/121 887 A1 or WO 2009/121 970 A2 can preferably be used in order to achieve antimicrobial and / or biocidal properties.
- Layers according to WO 2019/121 518 A1 can preferably be used in order to achieve corrosion protection, protection from chemical attack, improvement in cleanability, improvement in cleanability, as a separating layer and / or as scratch protection.
- Layers according to WO 2018/010987 A1 can preferably be used in order to achieve corrosion protection and / or protection against chemical attack.
- Layers according to WO 2015/044247 A1 can preferably be used in order to achieve corrosion protection, protection from chemical attack, improvement in cleanability, improvement in cleanability and / or scratch protection or to act as a separating layer.
- Layers according to WO 2011/061 339 A1 or WO 2009/153 306 A1 can preferably be used in order to reduce the sliding friction coefficient, the surface energy and / or to improve the abrasion resistance and / or feel.
- Layers according to WO 2010/125 178 A1 can preferably be used in order to achieve corrosion protection and / or protection against chemical attack.
- Layers according to WO 2010/089 333 A1 can preferably be used in order to improve the cleanability and / or scratch protection or to function as a separating layer and / or to reduce the surface energy.
- a substrate according to the invention with a transparent cover layer is preferred, a transparent intermediate layer being arranged between the cover layer and the substrate, which has one or one or more of the following functions:
- FIG. 2 shows schematically a substrate according to the invention with a transparent cover layer and an intermediate layer.
- the interdigital structure (both electrodes (1 a, 1 b) are included).
- the intermediate layer here also comprising the material (2) in spaces in the interdigital structure (1 a, 1 b).
- the material (2) in the spaces in the interdigital structure can be the same material as that of the intermediate layer on the electrodes in the interdigital structure, or it can be a different material.
- an intermediate layer to be used with preference according to the invention lies, in addition to the additional functional improvements, in particular also in the fact that through a suitable intermediate layer, functional improvements can be achieved which could possibly not or at least not additionally be achieved by a suitable cover layer. It can be the case, for example, that the cover layer is primarily used for mechanical protection, while the intermediate layer provides insulation for the interdigital structure or ensures an improvement in the adhesion between the cover layer and the interdigital structure.
- a substrate with a transparent cover layer is preferred, the substrate being transparent or reflective on its surface.
- Reflective in the sense of this text means that the degree of reflection for at least one wavelength in the perpendicular incidence of light to the surface in the wavelength range from 250 nm to 11 pm is> 70%.
- a layer structure is particularly preferred in which the intermediate layer is a layer with a high dielectric constant, preferably titanium oxides, and the cover layer is a hydrophobic silicon-containing coating with a water contact angle> 90 °, preferably a plasma polymeric silicon-containing coating.
- the layer thickness of the intermediate layer is a layer with a high dielectric constant, preferably titanium oxides
- the cover layer is a hydrophobic silicon-containing coating with a water contact angle> 90 °, preferably a plasma polymeric silicon-containing coating.
- the intermediate layer of dioxide is preferably between 100 nm and 1 ⁇ m.
- the layer thickness of the hydrophobic top layer is preferably between 10 nm and 500 nm.
- a substrate that is transparent on its surface can be, for example, an optical device; a substrate that is reflective on its surface can, for example, be an optically appealing surface, for example of a component.
- preferred substrates according to the invention with a transparent cover layer are those which are selected from the group consisting of optical components, preferably windows, lenses, mirrors, displays, in particular for the maritime sector, building outer skin or part thereof, vehicle part, preferably headlights, indicators, sensors, Disc or mirror, crockery, (street) signs, lamps, sensors, sensor housings, medical instruments, transparent surfaces for photovoltaics, aquariums, camera lenses, bioreactors, greenhouses, in particular the inside of greenhouses.
- a building outer skin can also be the outer surface of other structures such as bridges, quay walls, etc.
- Part of the invention is also the use of a transparent cover layer in combination with a transparent interdigital structure in each case as defined above, preferably in the respective preferred forms, to improve cleanability and / or to reduce the adhesion of contaminants, in particular microorganisms.
- the use of the coated interdigital structure by applying a preferably high frequency alternating field represents an essential core of the invention
- Substrate in the actual sense on the surface of the cover layer adhere and / or adhesions are loosened and washed away and / or adhesions can be removed more easily.
- the dielectophoretic effect can be combined or supplemented by the effect of alternating current electrothermal energy, whereby undesired adhesions either do not adhere to the surface of the substrate (in the actual sense on the surface of the cover layer) and / or adhesions are loosened and washed away by stimulating the flow of the surrounding fluid and / or adhesions can be removed more easily.
- the interdigital structure can be subjected to voltage both permanently and only temporarily. So it offers In the case of building envelopes, for example, a voltage should only be applied if the cleaning effect is already given, for example by natural rain. Of course, the voltage can also be switched on during an active cleaning process.
- Part of the invention is also the use of a transparent cover layer in combination with a transparent interdigital structure in each case as defined above, preferably in the respective preferred forms, for removing snow and ice and / or for imparting anti-fog properties
- anti-fog properties means that when super-saturated water vapor condenses on a surface, the formation of water droplets is reduced or, in the best case, avoided. As a rule, this is effectively achieved by improving (increasing) the hydrophilic properties of the surface, in particular by increasing the surface energy. In the case of the surface according to the invention, the wettability of the surface by water can be increased by means of the generated electric fields.
- heat is required to prevent / remove materials such as snow and ice from accumulation, this can also be generated by applying electrical power to the interdigital structure (in addition to the other effects).
- Part of the invention is a method for producing a coated substrate according to the invention, comprising the steps: a) providing a substrate, preferably as defined above as preferred, b) producing a transparent interdigital structure, preferably as defined above as preferred and c) coating the substrate and the interdigital structure with a transparent cover layer, preferably as defined above as being preferred.
- step b) is carried out at least partially by means of an ablation method and / or by means of material conversion, preferably by means of a laser method, a laser with a wavelength in the near-IR range being more preferred an NdYAG laser, particularly preferably an NdYAG laser with a flat-top profile, is used.
- a substrate which is at least partially coated with a closed layer of a material suitable for a digital structure.
- the desired interdigital structure can subsequently be produced in this material.
- different methods are conceivable here, for example irradiation analogous to photolithography, with the areas that are not to be removed or not to be changed, that is to say the areas of the actual interdigital structure, being covered by masking.
- a simple and particularly effective method is that the intermediate spaces between the electrode tracks of the interdigital structure are generated by means of irradiation by means of a laser. It is crucial for these interspaces that they are designed in such a way that there is sufficient insulation between the individual electrodes of the interdigital structure.
- the laser radiation it is basically possible to use the laser radiation to remove the material located in the intermediate spaces (ablation) or to convert it in such a way that the desired insulation property is given.
- a mixture of the two effects is used.
- this has the advantage that the topographical differences on the surface between the conductor track and the gap do not become too great.
- a laser in the near-IR range in particular an Nd: YAG laser, in particular an Nd: YAG laser with a flat-top profile, is particularly suitable for the corresponding method.
- a method according to the invention is preferred, an intermediate layer being applied after step a) and / or before step c), preferably one as defined above as preferred.
- step c) being carried out by a spray, immersion, PVD, CVD or PE-CVD method, preferably by a PVD, CVD or PE-CVD method.
- the interdigital structure must consist of a material that is conductive.
- the sheet resistance of the conductive coating is preferably ⁇ 200 Ohm, more preferably ⁇ 100 Ohm, more preferably ⁇ 50 Ohm, particularly preferably ⁇ 20 Ohm. This leads to a transport of electrons, preferably without changing the material.
- the interdigital structure can, for example, be made from conductor material or semiconductor material, in particular doped semiconductor material, or from a combination of these two materials.
- the person skilled in the art defines the web widths and web spacings according to the size, geometry and composition (dielectric constant) of the expected particle contamination or organisms (biofouling) and the field distribution resulting from the electrode geometry.
- the number of webs in the interdigital structure ultimately determines the area that is to be protected from contamination.
- the areas of the substrate that do not have any interdigital structures are preferably positioned at the edge of the substrate and can serve to supply voltage to the interdigital structure.
- the interdigital structure is preferably coated flat, preferably with a TiOx coating. In this case, only suitable contacting points are not provided with the TiOx coating (e.g. using masks) or the coating is subsequently removed again at these points.
- the laser treatment was carried out with a Nd: YAG laser as follows:
- the width of the individual conductors of the two electrodes is 375 ⁇ 18 ⁇ m.
- the distance between the conductors of the individual electrodes is also 375 + - 18 pm.
- the surface obtained in this way shows the following element compositions measured by means of XPS:
- the laser treatment leads to a partial laser ablation with a depletion of the tin with the simultaneous presence of the elements from the substrate.
- Titanium precursor titanium isopropoxide (CAS: 546-68-9; manufacturer: ABCR; degree of purity: 97%)
- Sample grid meander-shaped (movement of the sample under the fixed nozzle) - Line spacing of the sample grid: 4 mm
- the coated substrate was transparent to visible light.
- the structure produced was operated with a voltage of 30 VRMS and a frequency of 1 kHz to 1000 kHz with a linear increase in a cycle of 1 hour. After 10 days, the surfaces according to the invention exhibited 50% less adhesion
- Algae compared to an uncoated substrate and a 20% lower adhesion of algae compared to a substrate with coated interdigital structures without power supply.
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Abstract
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DE102009000699A1 (en) | 2009-02-06 | 2010-08-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Plastic substrate comprising a flexible, transparent protective layer and method for producing such a plastic substrate |
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DE102009046947B4 (en) | 2009-11-20 | 2015-04-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Substrate with nitrogen-containing plasma polymer coating, its use and process for its preparation |
JP5742395B2 (en) * | 2010-06-14 | 2015-07-01 | ソニー株式会社 | Fine particles for image display, method for producing the same, electrophoretic dispersion, and image display device |
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JP6441907B2 (en) | 2013-09-25 | 2018-12-19 | フラウンホファー ゲゼルシャフト ツール フェルドルンク デル アンゲヴァントテン フォルシュンク エー ファウ | Solid plasma polymer body (especially plasma polymer layer) |
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