EP4122010A1 - Multimetall klettwelding - Google Patents

Multimetall klettwelding

Info

Publication number
EP4122010A1
EP4122010A1 EP21711503.9A EP21711503A EP4122010A1 EP 4122010 A1 EP4122010 A1 EP 4122010A1 EP 21711503 A EP21711503 A EP 21711503A EP 4122010 A1 EP4122010 A1 EP 4122010A1
Authority
EP
European Patent Office
Prior art keywords
connection
component
nanowires
connecting element
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21711503.9A
Other languages
German (de)
English (en)
French (fr)
Inventor
Olav Birlem
Florian DASSINGER
Sebastian Quednau
Farough ROUSTAIE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanowired GmbH
Original Assignee
Nanowired GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanowired GmbH filed Critical Nanowired GmbH
Publication of EP4122010A1 publication Critical patent/EP4122010A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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Definitions

  • the present invention relates to a method and a connecting element for connecting a first component to a second component and to an arrangement of two interconnected components, in particular with regard to components from electronics.
  • welding Due to its considerable temperature input of regularly up to 1400 ° C, welding has the disadvantage that, on the one hand, it heats the affected body to a considerable extent, so that there is a risk of igniting flammable materials. There may also be visual changes to the surface of the too connecting bodies come, which can be problematic in particular in the case of pretreated surfaces with paints, foils or coatings. In addition, many materials cannot be welded.
  • Brazing of copper can also cause the components involved in the connection to heat up considerably (in particular above 400 ° C.) due to its considerable thermal energy input. This can cause flammable materials to ignite.
  • Soft soldering of copper can have the disadvantage that, on the one hand, the shear strength of the connection is lower than necessary and, on the other hand, that with soft solders, alternating temperature loads lead to segregation of the metal and thus to embrittlement of the connection. This can lead to the connection failing. Furthermore, soft solders have the disadvantage that they have a significantly higher contact resistance of the connection than, for example, pure copper. Another disadvantage of soft solder connections is their low mechanical fatigue strength, which usually only exists up to around 120 ° C. The corrosion resistance of such a connection to acidic media is also often inadequate.
  • connection there is usually a residual gap between the components. Capillary action can lead to moisture entering the remaining gap and subsequent corrosion. Corrosion can damage the connection. An electrical and / or thermal contact resistance of the connection can also increase. Furthermore, a hole for a screw or rivet can cause leaks in the area of the connection. This can make the use of such a connection more difficult, for example for vessels or pressure systems, in particular by requiring additional sealing means.
  • a method and a connecting element for connecting a first component to a second component as well as an arrangement of two interconnected components are to be provided in which a particularly mechanically stable and particularly good electrically and / or thermally conductive connection between the components is particularly important safe and simple way is formed or is.
  • a method for connecting a first component to a second component comprises: a) providing a connecting element with a respective plurality of nanowires on a first connecting surface on a first side of the connecting element and on a second connecting surface on a second side of the connecting element opposite the first side, the nanowires on the first connecting surface and the Nanowires are formed from different materials on the second connecting surface, b) merging a contact surface of the first component with the first connecting surface of the connecting element, and c) merging a contact surface of the second component with the second connecting surface of the connecting element.
  • the first component and the second component are preferably electronic components such as semiconductor components, computer chips, microprocessors or circuit boards.
  • the first component and / or the second component are preferably at least partially electrically and / or thermally conductive.
  • An electrical and / or thermal conductivity in the sense used here is present in particular with metals such as copper, which are generally referred to as “electrically conductive” or equivalent as “electrically conductive” or “thermally conductive” or “thermally conductive”.
  • materials that are generally considered to be electrically or thermally insulating should not be viewed here as being electrically or thermally conductive.
  • the method described is not restricted to applications in the field of electronics. For example, it is also possible to mount a component such as a sensor (as a first component) on a wall or bracket (as a second component) according to the method described. Using the described method, a mechanically stable and electrically and / or thermally conductive connection can in particular be formed between the first component and the second component.
  • the method described can be used in all areas in which a corresponding connection between two components is required.
  • the method described is not limited to a certain size of the components.
  • the method described is suitable for use in (micro) electronics or for connecting significantly larger components on a macroscopic level.
  • the components can be connected to the connecting element via respective contact surfaces.
  • a contact area is, in particular, a spatially distinctive area of a surface of the respective component.
  • the contact surfaces are distinguished by the formation of the connection. This means that the contact surface does not initially differ from the rest of the surface of the component and only emerges when the connection is formed in such a way that the contact surface is the surface on which the connection is formed. In this case, the contact area is initially only conceptually delimited from the rest of the surface of the component. In the area of the contact surfaces, the nanowires of the connecting element can come into contact with the respective component.
  • the contact surfaces are preferably each simply connected areas of the surface of the respective component.
  • the respective contact surface of the first component and / or of the second component is divided into several subregions of the surface of the respective component that are separate from one another are divided.
  • a contact surface can comprise two or more separate sections of the surface of the respective component.
  • the contact surfaces can be electrically and / or thermally conductive or insulating. It is preferred that the contact surfaces are electrically and / or thermally conductive, so that an electrically and / or thermally conductive connection can be formed.
  • the components are preferably designed to be rigid or have at least one rigid surface on which the respective contact surface is provided. This means in particular that the components (or at least the contact surfaces) are preferably not flexible.
  • a connection can be formed particularly well using the method described. If, for example, one of the components were designed to be flexible, it could be possible that the connection breaks due to stress on the nanowires. Depending on the precise circumstances, the method described can also be used advantageously with flexible components or contact surfaces.
  • connections between the first components and the connecting element are formed via a multiplicity of nanowires.
  • a nanowire is understood here to mean any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers.
  • a nanowire can, for example, have a circular, oval or polygonal base. In particular, a nanowire can have a hexagonal base area.
  • the nanowires on the first connection surface and the nanowires on the second connection surface are formed from different materials.
  • the ability of the nanowires to form a connection between the connecting element and a component is determined in particular by the material of the Affected nanowires.
  • the connection can have different properties.
  • the mechanical strength and the electrical and / or thermal conductivity of the connection are influenced by the material of the nanowires.
  • the connecting element can also be viewed as an intermediary between the two components to be connected to the extent that two components that are otherwise not or only poorly connectable to one another can be connected to one another via the connecting element.
  • a first connection between the first component and the connec tion element and a second connection between the second component and the connection element can be formed.
  • the first connection and the second connection can be formed better than the direct connection between the first component and the second component.
  • all of the nanowires involved in a connection are formed from the same material.
  • the connecting element is also preferably electrically and / or thermally conductive. If the nanowires on both connection surfaces and the connection element are electrically and / or thermally conductive, the connection between the first component and the second component is electrically and / or thermally conductive throughout.
  • the nanowires preferably have a length in the range from 100 nm [nanometers] to 100 gm [micrometers], in particular in the range from 500 nm to 30 gm. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 ⁇ m, in particular in the range from 30 nm to 2 ⁇ m.
  • the term diameter refers to a circular base area, with a comparable definition of a diameter being used for a base area that differs therefrom. It is particularly preferred that all of the nanowires used have the same length and the same diameter.
  • the components are connected to one another indirectly via the connecting element.
  • This has the advantage that nanowires do not have to be provided on any of the components. It is sufficient that the nanowires are present on the connecting element. In particular, it is preferred that no nanowires are provided on the contact surfaces of the components, but only on the connection surfaces of the connecting element. This can make it easier to carry out the method and, in particular, also expand the application range of the method to those components which are not or only poorly accessible to the growth of the nanowires. Furthermore, the growth of the nanowires can take place locally separately from the components. Nevertheless, it is alternatively preferred that a respective multiplicity of nanowires is also provided on the contact surface of the first component and / or on the contact surface of the second component.
  • the connecting element is preferably designed to be flexible. Alternatively, it is preferred that the connecting element is rigid.
  • the connecting element can be designed as a solid metal plate.
  • the connecting element is formed from a plastic.
  • the connecting element can be formed from a polymer, in particular made of polycarbonate, PVC, polyester, polyethylene, polyamide and / or PET.
  • the connecting element can also be formed, for example, from a ceramic material, silicon, aluminum oxide or glass.
  • the connection element can be made of stainless steel, aluminum or non-ferrous metal. It is also preferred that the connecting element is formed from a composite material comprising several of the materials mentioned.
  • a connecting element which has two connecting surfaces. Both connection surfaces each have a large number of nanowires.
  • the first connecting surface is arranged on the first side of the connecting element, the second connecting surface on the second side of the connecting element.
  • the first side and the second side of the connecting element are arranged opposite one another.
  • the first side of the connec tion element is the side of the connection element which faces the first component after the connection has been formed.
  • the second side of the connecting element is the side of the connecting element that faces the second component after the connection has been formed.
  • the connecting element is provided.
  • a connecting element designed as described is created as part of the method.
  • the nanowires can be applied to the connection surfaces as part of the method, in particular by galvanic growth.
  • the provision also includes that a connection Connection element is used on which the nanowires are already present at the connection surfaces.
  • a suitably prepared connecting element can be obtained from a supplier and used for the method described. Obtaining a prepared connecting element in this way is also providing a connecting element in the sense used here.
  • the nanowires are preferably provided on the connection surfaces in such a way that they are essentially perpendicular (preferably perpendicular) to the respective connection surface.
  • the entirety of the nanowires on a connection surface can in particular be referred to as a lawn of nanowires.
  • the nanowires can also be provided in any orientation on the connection surfaces.
  • a connection surface it is also possible for a connection surface to be subdivided into a plurality of subregions (connected to one another or separated from one another), the nanowires being oriented differently in the various subregions. In this way, a particularly stable connection can be realized which, in particular, can also withstand shear forces particularly well.
  • the nanowires it is possible for the nanowires to be designed differently at different points on the connection areas, in particular with regard to their length, diameter, material and density (the density of the nanowires indicating how many nanowires are provided per area).
  • the connecting element can in particular be understood as a mediator of the connection between the first component and the second component.
  • any physical object that is suitable for connecting the components between the contact surfaces of the components can be considered as a connecting element.
  • connection surface is in particular a spatially drawn area of a surface of the connection element on the respective gen side of the fastener.
  • connection surfaces are distinguished by forming the connection. This means that the connection surfaces do not initially differ from the remaining surface of the connection element and only emerge when the connection is formed in such a way that the connection surfaces are the surface on which the connection is formed.
  • the connecting surface is only conceptually delimited from the remaining part of the surface of the connecting element before the connection is formed.
  • a connection surface of a planar connection element can be characterized in that a planar connection to the respective component is formed over a limited area of the connection element (ie over the connection surface).
  • the connecting surface is preferably as large as the corresponding contact surface and in particular preferably has its shape.
  • the contact areas are larger or smaller than the corresponding connection area and / or that the contact areas and the corresponding connection area have different shapes.
  • the connecting surfaces are preferably each simply connected areas of the surface of the connecting element.
  • the first connection surface and / or the second connection surface can be subdivided into a plurality of mutually separate sub-areas of the surface of the connection element.
  • a connecting surface can comprise two or more sections of the surface of the connecting element that are separated from one another.
  • steps b) and c) the contact surfaces are brought together with the connecting surfaces, that is to say moved towards one another.
  • the nanowires on the connection surfaces come into contact with the respective contact surface.
  • the nanowires connect to the corresponding contact surface, whereby the corresponding connection between the components and the connec tion element is formed.
  • connection is formed in that the nanowires, in particular their ends facing the respective contact surface, connect to the contact surface.
  • This connection is formed at the atomic level.
  • the atomic process is similar to that during sintering.
  • the connection obtained can in particular be so tight for gases and / or liquids that corrosion of the connection and / or the interconnected components in the area of the connection can be prevented or at least restricted.
  • the connection formed can be viewed as being fully metallic.
  • the process described can also be referred to as "Velcro welding". This expresses the fact that the connection is obtained by a large number of nanowires and thus by a large number of elongated, hair-like structures and by heating. Due to the large number of nanowires, the flatness and roughness of the contact surfaces can be compensated for.
  • the surface area of the connection ie the area over which forces such as the van der Waals force act at the atomic level
  • the connection can thus be particularly good electrically and / or thermally conductive and / or mechanically stable.
  • the nanowires are formed from an electrically and / or thermally conductive material.
  • the use of copper, silver, nickel and gold is particularly preferred here.
  • the contact surfaces are also preferably formed from an electrically and / or thermally conductive material, in particular with copper, silver, nickel or gold. As described above, the use of copper is not possible, especially for welded joints.
  • an electrical and / or thermal conductivity of the connection can be particularly high.
  • a particularly good thermal conductivity of the connection can, for example, improve the cooling of the components involved in the connection.
  • the use of copper, silver, nickel and gold for the nanowires and / or for the contact surfaces is particularly preferred for this purpose.
  • connection described can also be formed particularly easily and without tools. Only the components to be connected need to be guided to one another. Warming up and exertion of pressure can optionally take place, but are not absolutely necessary.
  • steps a) to c) are preferably carried out in the specified order, in particular one after the other.
  • step a) is carried out preferably before the beginning of steps b) and c).
  • the contact surface of the first component can first be brought together with the first connection surface, that is to say the first component with the connection element (step b)). Subsequently, the connecting element merged with the first component according to step b) can be merged with the second component in such a way that the contact surface of the second component and the second connecting surface are merged (step c)).
  • Steps b) and c) can alternatively be carried out at the same time, overlapping in time, or one after the other. This is possible, for example, in that the connecting element is held between the two components and these are moved towards the connecting element from both sides at the same time.
  • the nanowires on the first connection surface and / or the nanowires on the second connection surface are formed from a respective metal.
  • the nanowires on the first connection surface and the nanowires on the second connection surface are formed from a respective metal.
  • the nanowires on the first connection area are preferably all formed from a first metal.
  • the nanowires on the second connection area are preferably all formed from a second metal.
  • nanowires made of metal In particular with nanowires made of metal, a mechanically stable and electrically and / or thermally conductive connection can be formed.
  • the nanowires on the first connection surface are formed from the material of the contact surface of the first component and / or the nanowires on the second connection surface are formed from the material of the contact surface of the second component.
  • the nanowires on the first connection surface are preferably formed from the material of the contact surface of the first component and the nanowires on the second connection surface are formed from the material of the contact surface of the second component.
  • connection between the nanowires and the respective contact surface can be formed particularly well if the nanowires are made of the same material as the contact surface. This is because the connection is formed at the atomic level. Connections between bodies made of different materials can be made by different lattice structures of the ma- materials are made more difficult. Even a different lattice constant can make the formation of a connection more difficult or have a disadvantageous effect on the properties of a connection that is formed.
  • connection element avoids this problem in the present method.
  • the connection between the nanowires and the connecting element is not made by simply being brought together. Instead, the nanowires are grown onto the connector. This enables a very close bond to be established. It is therefore possible for the connecting element to be formed from a uniform material. Alternatively, it is preferred that the connection surfaces of the connection element are formed from different materials, preferably each from the material of the corresponding nanowires.
  • the first connection surface is preferably formed from a first material which preferably corresponds to the material of the nanowires on the first connection surface.
  • the second connection surface is preferably formed from a second material, which preferably corresponds to the material of the nanowires on the second connection surface.
  • the connecting element is preferably formed from a third material and coated with the first material in the region of the first connecting surface and coated with the second material in the region of the second connecting surface.
  • the connection surfaces are formed by the coatings.
  • the third material is preferably electrically and / or thermally conductive. Alternatively, it is preferred that the third material is electrically and / or thermally insulating. In that case it is preferred that the connection dungsei em ent respective local electrically conductive connections between partial areas of the first connecting surface and partial areas of the second connecting surface.
  • the connecting element can also have several different materials that are arranged in layers, for example.
  • the connecting element can also be referred to as a hybrid tape.
  • the connecting element is formed from the first material and is coated with the second material in the region of the second connecting surface.
  • the connecting element is formed from the second material and is coated with the first material in the region of the first connecting surface.
  • the first construction part is a circuit board, wherein the contact surface of the first component is made of copper.
  • the second component is an electronic component, the contact surface of the second component being formed from silver, nickel and / or gold.
  • electronic components such as MOSFETS or IGBT modules in particular can be attached as a second component with connections made of silver as a contact surface on a circuit board as the first component with copper contacts as a contact surface.
  • step b) and / or step c) are carried out at room temperature.
  • the connection described between the contact surfaces and the connec tion surfaces can be formed at room temperature. It is preferred that the two components are pressed against one another to form the connection.
  • the pressure used here is preferably in the range of 5 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.
  • the method further comprises: d) heating at least the contact surfaces to a temperature of at least 90.degree.
  • the contact surfaces are heated to a temperature of at least 90 ° C (as minimum temperature), preferably to a temperature of at least 150 ° C (as minimum temperature).
  • the temperature is preferably 200 ° C.
  • the heating is preferably carried out to a temperature of a maximum of 270 ° C, in particular a maximum of 240 ° C.
  • steps b) and / or c) are carried out at room temperature. This means that the heating takes place only after the connection according to steps b) and c) has been formed. The connection thus formed is strengthened by the heating.
  • the nanowires connect particularly well to the contact surfaces. Accordingly, it is sufficient that only the contact surfaces are heated. In practice, with this kind of heating there is usually no distinction between whether the contact surfaces, the nanowires, the connection element, the first component partially or entirely and / or the second component partially or entirely heated. This is particularly the case when thermally conductive materials are used.
  • the heating according to step d) can in particular take place in that the first component, the second component and the connecting element are heated as a whole, for example in an oven. Alternatively, however, it is also possible to introduce heat locally into the area of the connection, in particular into the area of the contact surfaces.
  • the minimum temperature described is reached once, at least for a short time. It is not necessary to maintain the minimum temperature. However, it is preferred that the temperature to which it is heated in accordance with step d) is held for at least ten seconds, preferably at least 30 seconds. It can thus be ensured that the connection is formed as desired. Keeping the temperature for a longer period of time is generally not harmful.
  • Steps b) and c) as well as step d) can be carried out at least partially in a temporally overlapping manner.
  • preheating can take place before or during steps b) and c), which can be regarded as part of step d).
  • step d) can also begin before step b) or c).
  • step d) is carried out to the extent that the temperature required according to step d) is present at least temporarily even after step b) or c) has been completed.
  • a connection between two components can be obtained without a temperature occurring at the same level as, for example, during welding or brazing.
  • this advantage can be used in that heating is dispensed with to an extent that is not required. In this way, damage to the components, for example, can be avoided. Inflammation of combustible materials can also be excluded due to the low temperatures described. Accordingly, it is particularly preferred that at no point in time of the described method does a temperature of the first component and / or the second component exceed 270 ° C., in particular 240 ° C.
  • the first component and the second component are at least during part of the heating with a pressure of at least 5 MPa, in particular at least 15 MPa, and / or of at most 200 MPa, in particular 70 MPa, on the connecting element pressed. This can in particular take place in that the two components are pressed towards one another while the connecting element is arranged between the two components.
  • the pressure used is preferably in the range of 5 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.
  • the pressure is preferably above the specified lower limit at least in a time segment in which the temperature exceeds the lower limit specified for this.
  • the nanowires and the contact surface are exposed to both a corresponding pressure and a corresponding temperature, at least in this time segment.
  • the connection can be formed by the action of pressure and temperature.
  • the first connection surface and the second connection surface are formed opposite one another.
  • the first connection surface and the second connection surface are preferably arranged parallel to one another.
  • the connecting element can be arranged between two components to be connected.
  • the connec tion element (apart from the formation of the connection) only has the effect that the contact surfaces are not directly adjacent to one another, but rather are arranged at a distance from one another by the material thickness of the connecting element in particular. An orientation of the contact surfaces relative to one another remains unaffected by the connecting element.
  • first connection surface and the second connection surface can also be provided, for example, at different points on the respective, in particular planar, surface of the connection element.
  • first component can be connected to the connecting element at a first of these locations and the second component at a second of these locations.
  • the first component and the second component are semiconductor components which are fastened to one another.
  • connection element is formed from an electrically insulating third material, is coated with an electrically conductive first material in the area of the first connection surface and is coated with an electrically conductive second material in the area of the second connection surface.
  • the connection surfaces are formed by the coatings.
  • the first connection surface and the second connection surface are preferably structured in such a way that subregions of the respective connection surfaces that are electrically isolated from one another result.
  • the connecting element preferably has local electrically conductive connections between an upper side and a lower side of the connecting element.
  • a partial area of the first connection surface can be connected in an electrically conductive manner to a partial area of the second connection surface via a local connection. This can be used to make contact with the contacts of the semiconductor components.
  • the subregions can be designed as conductor tracks via which the signals can be distributed.
  • a first DRAM can be connected as a first component to a base of a housing, for example via a simple nanowire connection.
  • a second DRAM can be attached as a second component on the first DRAM.
  • the connecting element located between the DRAMs is preferably dimensioned such that it can also be attached to the bottom of the housing next to the first DRMA.
  • the connecting element is preferably also used for signal distribution, in particular for the second DRAM.
  • contacts of the second DRAM can be connected to subregions of the first connection surface that are electrically isolated from one another.
  • the conductor tracks formed in this way on the top of the connection element can be connected to contacts on the bottom of the housing, optionally via conductor tracks that are electrically isolated from one another on the underside of the connection element.
  • Contacts of the second DRMA can also be connected directly to contacts of the first DRAM via a respective local electrically conductive connection.
  • Further DRAMs can be attached to the second DRAM in an analogous manner. For example, 10 DRAMs can be stacked and contacted.
  • a connecting element for connecting a first component to a second component is presented as a further aspect.
  • the connecting element has a plurality of nanowires in each case on a first connecting surface on a first side of the connecting element and on a second connecting surface on a second side of the connecting element opposite the first side.
  • the nanowires on the first connection surface and the nanowires on the second connection surface are made of different materials.
  • the connecting element is designed like a film.
  • a film-like design is to be understood as meaning that the connecting element has a thickness which is very much smaller than the extent of the connecting element in the other directions.
  • the connecting element has a thickness of at most 5 mm.
  • the thickness of the connecting element is preferably in the range of 0.05 mm and 5 mm [millimeters], in particular in the range of 0.1 mm and 1 mm.
  • the connecting element is designed in the form of a band.
  • the first side and the opposite second side of the connecting element in this embodiment are the two surfaces of the belt which have a considerably larger surface area than all other surfaces (which result from the material strength of the belt).
  • the tape material can be provided as a roll, for example.
  • the nanowires can already be provided on the strip material and protected, for example, by a protective varnish. Before using the connecting element, the protective varnish can be removed and the nanowires exposed. A part of the strip material required in each case can be separated from the roll for use.
  • the connecting element can also be referred to as a “connecting tape” and in particular as a “Velcro welding tape”.
  • the connecting element is at least partially electrically and / or thermally conductive.
  • connection formed can be particularly good electrically and / or thermally conductive.
  • first connection area and the second connection area are electrically insulated from one another.
  • the first connection surface and the second connection surface should in any case be regarded as electrically isolated from one another if an electrical resistance between the first connection surface and the second connection surface is measured to be at least 100 k ⁇ under the following conditions with a four-point measurement: room temperature, humidity 20%, measurement at constant voltage (i.e. not with alternating voltage), measurement with a respective electrode on the first connection surface and on the second connection surface, the electrodes touching the respective connection surface with an area of 1 cm 2.
  • an electrically insulating, but mechanically stable and optionally also thermally conductive connection can be formed between the contact surfaces.
  • a specific electrical resistance of the material of the connecting element in the area between the first connecting surface and the second connecting surface is preferably at least 10 5 ⁇ m, preferably at least 10 8 ⁇ m, at room temperature.
  • the specification described for the specific electrical resistance of the material of the connecting element relates to a measurement at constant voltage.
  • different results can be obtained, which can depend in particular on the frequency of the alternating voltage.
  • the stated value of at least 10 5 ⁇ m, preferably at least 10 8 ⁇ m, relates to the material of the connecting element.
  • the specific resistance of various materials is available in the specialist literature, for example in tables. Reference is made here to such information. If the connecting element is formed continuously from a specific material, the specific resistance of the material of the connecting element to be used here is the value that is indicated in the specialist literature for this specific material. This definition excludes all effects that do not result from the material but, for example, from the shape of the connecting element. If the connecting element is composed of different materials, the specific contradiction of the individual materials is to be determined from the specialist literature and the total specific resistance of the material of the connecting element, i.e. the composition of the materials, is to be determined.
  • the connecting element is formed from a third material and coated with a first material in the area of the first connecting surface and coated with a second material in the area of the second connecting surface, the electrical insulation between the connecting surfaces can be achieved by electrically using the third material is insulating.
  • the first material and the second material can be electrically conductive.
  • metallic nanowires can be grown on connecting surfaces of the same material in each case, with electrical insulation being nevertheless achieved through the third material.
  • the connecting element is formed from a ceramic material in the area between the first connecting surface and the second connecting surface.
  • an arrangement which comprises:
  • a first component which is connected to the connecting element by means of a multiplicity of nanowires via a first connecting surface on a first side of a connecting element
  • a second component which is connected to the connecting element by means of a multiplicity of nanowires via a second connecting surface on a second side of the connecting element opposite the first side.
  • the nanowires on the first connection surface and the nanowires on the second connection surface are formed from different materials.
  • FIG. 1 an illustration of a method according to the invention for connecting two components
  • FIG. 2 an illustration of an arrangement according to the invention of two components connected to one another according to the method from FIG. 1,
  • Fig. 3 a first embodiment of the connecting element from the arrangement from Fig. 2, and
  • FIG. 4 a second embodiment of the connecting element from the arrangement from FIG. 2.
  • the reference symbols used relate to FIG first connection surface 7 on a first side 10 of the connection element 6 and on a second connection surface 8 on a second side 11 of the connection element 6 opposite the first side 10, b) merging a contact surface 4 of the first component 2 with the first connection surface 7 of the Connecting element 6, and c) bringing together a contact surface 5 of the second component 3 with the second connecting surface 8 of the connecting element 6.
  • the nanowires 1 are formed from different materials. In the example described here, the nanowires 1 are formed on the first connecting surface 7 from copper, and the nanowires 1 on the second connecting surface 8 are made from silver.
  • the first component 2 is a circuit board and the second component 3 is an electronic component such as a MOSFET or an IGBT module.
  • Steps b) and / or c) are preferably carried out at room temperature.
  • the method can furthermore comprise the following optional step indicated in FIG. 1 by a dashed box: d) heating at least the contact surfaces 4, 5 to a temperature of at least 150.degree.
  • FIG. 2 shows an arrangement 9 which can be obtained with the method from FIG. 1.
  • the arrangement 9 comprises a first component 2, which is connected to the connecting element 6 by means of a multiplicity of nanowires 1 via a first connecting surface 7 on a first side 10 of a connecting element 6.
  • the arrangement 9 further comprises a second component 3, which is connected to the connecting element 6 by means of a plurality of nanowires 1 via a second connecting surface 8 on a second side 11 of the connecting element 6 opposite the first side 10.
  • the first component 2 and the second component 3 have a respective contact surface 4, 5.
  • the nanowires 1 are formed from different materials.
  • the connecting element 6 is formed like a film.
  • a thickness of the connec tion element 6 is at most 5 mm.
  • the thickness of the connecting element 6 can be seen in Fig. 2 as the extension of the connecting element 6 in a vertical direction Rich.
  • 3 shows a first embodiment of the connecting element 6 from the arrangement 9 from FIG. 2.
  • the first connecting surface 7 is formed from a first material 12 which corresponds to the material of the nanowires 1 on the first connecting surface 7.
  • the second connection surface 8 is formed from a second material 13 which corresponds to the material of the nanowires 1 on the second connection surface 8.
  • the connecting element 6 is formed from a third material 14 and coated with the first material 12 in the area of the first connecting surface 7 and coated with the second material 13 in the area of the second connecting surface 8.
  • FIG. 4 shows a second embodiment of the connecting element 6 from the arrangement 9 from FIG. 2.
  • the connecting element 6 is formed from the first material 12 and coated with the second material 13 in the area of the second connecting surface 8.
  • the first connection surface 7 is not formed by a coating, but rather by the side of the first material 12 that is at the bottom in FIG. 4.
  • Connection element first connection surface second connection surface

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
EP21711503.9A 2020-03-18 2021-03-08 Multimetall klettwelding Pending EP4122010A1 (de)

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WO2021185616A1 (de) 2021-09-23

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