EP4108811A1 - Terminal material for connector - Google Patents
Terminal material for connector Download PDFInfo
- Publication number
- EP4108811A1 EP4108811A1 EP21757568.7A EP21757568A EP4108811A1 EP 4108811 A1 EP4108811 A1 EP 4108811A1 EP 21757568 A EP21757568 A EP 21757568A EP 4108811 A1 EP4108811 A1 EP 4108811A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- silver
- plating layer
- nickel
- layer
- nickel alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 68
- 238000007747 plating Methods 0.000 claims abstract description 264
- 239000010410 layer Substances 0.000 claims abstract description 240
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 111
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 99
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 claims abstract description 88
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 53
- 229910052709 silver Inorganic materials 0.000 claims abstract description 37
- 239000004332 silver Substances 0.000 claims abstract description 36
- 239000010949 copper Substances 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 17
- 239000002344 surface layer Substances 0.000 claims abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 21
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 35
- 238000010438 heat treatment Methods 0.000 description 17
- 238000012360 testing method Methods 0.000 description 16
- 238000005299 abrasion Methods 0.000 description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 15
- 239000001301 oxygen Substances 0.000 description 15
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 14
- 239000000654 additive Substances 0.000 description 9
- 230000000996 additive effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
- 229940098221 silver cyanide Drugs 0.000 description 4
- 238000006467 substitution reaction Methods 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical group N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001336 glow discharge atomic emission spectroscopy Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- -1 nickel (II) potassium cyanide monohydrate Chemical compound 0.000 description 2
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 2
- NLEUXPOVZGDKJI-UHFFFAOYSA-N nickel(2+);dicyanide Chemical compound [Ni+2].N#[C-].N#[C-] NLEUXPOVZGDKJI-UHFFFAOYSA-N 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910017727 AgNi Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910017818 Cu—Mg Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- 229910052927 chalcanthite Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000000027 scanning ion microscopy Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/26—Connectors or connections adapted for particular applications for vehicles
Definitions
- the present invention relates to a terminal material for a connector in which a useful film is provided for connection of electric wiring in an automobile, a consumer apparatus, or the like.
- a useful film is provided for connection of electric wiring in an automobile, a consumer apparatus, or the like.
- a pair of terminals used for the on-vehicle connector (on-vehicle terminals) are designed to electrically connect by contacting a contact piece provided in a female terminal with a male terminal inserted into the female terminal at a predetermined contact pressure.
- a terminal with tin plating in which tin plating is carried on a copper or a copper alloy plate and reflowing treatment is subjected to has been largely used.
- purposes of a terminal are increased with larger electric current and higher voltage in which precious metal such as silver or the like is plated, more large current can be passed with excellent in heat resistance and abrasion resistance.
- a base-plating layer made of any one of or alloy of Ni, Co, and Fe is formed on a surface of a conductive base material, an intermediate plating layer made of Cu or Cu alloy is formed on the base-plating layer, and an alloy layer is formed on the intermediate plating layer. It is described that this alloy layer is made by alloying by selective thermal diffusion of an Sn plating layer and a metal-plating layer made of Ag or In.
- Patent Literature 2 discloses a material for a movable contact having a conductive base material, a base layer formed on the conductive base material, an intermediate layer formed on the base layer, and an outermost layer made of silver or silver alloy formed on the intermediate layer. It is described that the base layer is made of nickel or nickel alloy, or cobalt or cobalt alloy, and the intermediate layer is made of copper or copper alloy in this material.
- a silver layer provided on a surface of a terminal material is excellent in heat resistance and abrasion resistance since it is not oxidized even in high-temperature environment.
- a base layer has a function of preventing diffusion of copper from the base material. Since tin and nickel form an intermetallic compound, adhesiveness between a nickel base layer and tin plating is good.
- the adhesiveness is poor since nickel and silver do not form an intermetallic compound.
- silver is hard to be oxidized and the silver layer cannot obstruct oxygen from entering in, oxygen diffused into the silver layer and reaches the nickel layer becomes nickel oxide in the nickel layer, so that there is a risk of occurring peeling.
- the intermediate layer made of copper or copper alloy is formed between the silver layer and the nickel layer.
- Copper diffuses into the silver layer under the high-temperature environment but does not form an intermetallic compound with silver, so that oxygen is distributed to a grain boundary of the silver layer and prevented from entering in.
- copper is diffused up to the surface of the silver layer, it is oxidized on the surface and there is a defect of increase of the contact resistance.
- the present invention is achieved in consideration of the above circumstances, and has an object to provide a terminal material for a connector in which the heat resistance is further improved, the contact resistance is not increased even in the high-temperature environment, to have the high abrasion resistance.
- a terminal material for a connector of the present invention is provided with a base material in which at least a surface layer is made of copper or copper alloy; a nickel-plating layer made of nickel or nickel alloy and provided on a surface of the base material; a silver-nickel alloy plating layer made of silver-nickel alloy and provided on at least a part of the nickel-plating layer; and a silver-plating layer made of silver and provided on the silver-nickel alloy plating layer; and in this terminal material, the silver-nickel alloy plating layer has 0.05 ⁇ m or more and less than 0.50 ⁇ m of a film thickness and 0.03 at% or more and 1.00 at% or less of nickel content.
- the silver-plating layer which is relatively soft is provided on the surface and the silver-nickel alloy plating layer which is harder than the silver-plating layer is provided below it, the lubricant effect is excellent and the abrasion resistance is improved. Moreover, the surface of the silver-plating layer is not easily oxidized even in the high-temperature environment, and the contact resistance can be restrained from increasing. Furthermore, design of the surface is improved by the glossiness of silver.
- the silver-nickel alloy plating layer provided between the silver-plating layer on the surface and the nickel-plating layer which is the ground contains both components of silver and nickel, it can improve adhesiveness between these layers.
- nickel in the silver-nickel alloy plating layer is not easily diffused into the silver-plating layer even in the high-temperature environment, so the contact resistance can be restrained from increasing.
- the silver-nickel alloy plating layer reacts with oxygen, so that the silver-nickel alloy plating layer functions as a sacrificing layer to prevent the oxygen from coming up to the nickel-plating layer. Accordingly, the peeling by oxidizing of the nickel-plating layer can be restrained.
- nickel since nickel has the higher melting point than copper, it is not easily diffused by heat. Accordingly, unlike copper, nickel is not easily concentrated on the outermost surface even in the high-temperature environment, it is possible to restrain the increase of the contact resistance.
- the nickel content in the silver-nickel alloy plating layer is less than 0.03 at%, the heat resistance is deteriorated and it is easily peeled off. If the nickel content in the silver-nickel alloy plating layer exceeds 1.00 at%, the conductor resistance of the silver-nickel alloy plating layer increases, and the contact resistance in the high-temperature environment is also easily increased.
- the silver-nickel alloy plating layer functions as the sacrificing layer preventing oxygen from entering the nickel-plating layer as described above, an amount of nickel reacting with oxygen is small if the film thickness is less than 0.05 ⁇ m, and the heat resistance cannot be improved. On the other, if the film thickness of the silver-nickel alloy plating layer is 0.50 ⁇ m or more, the effect is saturated and it is useless in cost.
- a film thickness of the silver-plating layer is preferably 0.5 ⁇ m or more and 20.0 ⁇ m or less. If the film thickness of the silver-plating layer is less than 0.5 ⁇ m, it is worn in early times and easily disappeared, and the effect of improving the abrasion resistance is poor. If the thickness exceeds 20.0 ⁇ m, the soft silver-plating layer is thick, and the friction coefficient tends to be increased. In addition, the film thickness of the silver-plating layer is larger than the film thickness of the silver-nickel alloy plating layer.
- the silver-plating layer is preferably made of silver with a purity 99.99% or more by mass except C, H, S, O, and N which are gas components. If a large amount of impurities are contained in the silver-plating layer, the contact resistance is high. "Except C, H, S, O, and N" means to exclude gas components.
- the heat resistance of the connector is improved, the contact resistance is not increased even in the high-temperature environment, and the peeling can be restrained.
- a terminal material 1 for a connector of the present embodiment is provided with, as schematically showing a cross section in FIG. 1 , a base material 2 having a plate shape in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer 3 provided on an upper surface of the base material 2 and made of nickel or nickel alloy, a silver-nickel alloy plating layer 4 provided on at least a part of the nickel-plating layer 3 and made of silver-nickel alloy, and a silver-plating layer 5 provided on an upper surface of the silver-nickel alloy plating layer 4 and made of silver.
- the base material 2 is not limited in the composition if the surface layer is copper or copper alloy.
- the base material 2 is a plate material made of copper or copper alloy; however, it may be a plated material in which copper plating or copper-alloy plating is made on a surface of a mother bacterial.
- copper or copper alloy such as oxygen-free copper (Cl 0200), Cu-Mg type copper alloy (C18665) and the like can be applied.
- the nickel-plating layer 3 is formed by performing nickel or nickel alloy plating on the base material 2 and covers the base material 2.
- the nickel-plating layer 3 has a function of restraining diffusion of Cu component from the base material 2 to the silver-plating layer 5.
- a film thickness of the nickel-plating layer 3 is not specifically limited: 0.2 ⁇ m or more and 5.0 ⁇ m or less is preferable; more preferably, 0.5 ⁇ m or more and 2.0 ⁇ m or less.
- the film thickness of the nickel-plating layer 3 is less than 0.2 ⁇ m, there is a possibility that the Cu component diffuses from the base material 2 into the silver-plating layer 5 in the high-temperature environment to increase the contact resistance value of the silver-plating layer 5 and the heat resistance is deteriorated. Conversely, if the thickness of the nickel-plating layer exceeds 5.0 ⁇ m, there is a risk of cracking by bending machining.
- the composition of the nickel-plating layer 3 is not specifically limited if it is made of nickel or nickel alloy.
- the silver-nickel alloy layer 4 is formed by carrying out a silver-strike plating on the nickel-plating layer 3 and then carrying out a silver-nickel alloy plating.
- the silver-nickel alloy layer 4 is alloy of silver and nickel: intermetallic compound is not generated between silver and nickel, so cracks when the bending machining are restrained.
- Nickel content in the silver-nickel alloy layer 4 is 0.03 at% or more and 1.00 at% or less; more preferably, 0.05 at% or more and 1.00 at% or less.
- Nickel has the higher melting point than that of copper: it is hardly diffused and hard to be concentrated in the outermost surface even in the high-temperature environment unlike copper. Accordingly, it is possible to restrain increase of the contact resistance in the high-temperature environment. If the nickel content in the silver-nickel alloy plating layer 4 is less than 0.03 at%, the heat resistance and the abrasion resistance are deteriorated; if it exceeds 1.00 at%, the conductor resistance of the silver-nickel alloy plating layer 4 increases, and moreover, the contact resistance is easily increased in the high-temperature environment.
- a film thickness of the silver-nickel alloy plating layer 4 is set to be 0.05 ⁇ m or more and less than 0.50 ⁇ m; more preferably, 0.10 ⁇ m or more and less than 0.50 ⁇ m.
- the silver-nickel alloy plating layer 4 has a function as a sacrificing layer obstructing the achievement of oxygen to the nickel-plating layer 3 which is the ground layer thereof by reacting oxygen entering from the surface with nickel; accordingly, it is enough to have a degree of the film thickness which can show the function.
- the film thickness of the silver-nickel alloy plating layer 4 is less than 0.05 ⁇ m, the effect of preventing from entering of oxygen to the nickel-plating layer 3 in the high-temperature environment is not sufficient, and it is easy to be peeled off when sliding and the abrasion resistance is deteriorated. If the film thickness of the silver-nickel alloy plating layer 4 is 0.50 ⁇ m or more, the effect is saturated and it is useless in cost.
- the silver-plating layer 5 is formed by carrying out silver plating on the silver-nickel alloy plating layer 4.
- the silver-plating layer 5 is relatively soft and the hard silver-nickel alloy plating layer 4 is formed therebelow, so it gives excellent lubrication effect and contributes to improvement of the abrasion resistance. Moreover, it is not easily oxidized even in the high-temperature environment and the contact resistance can be prevented from increasing. Furthermore, design of the surface is improved by gloss of silver.
- a film thickness of the silver-plating layer 5 is preferably 0.5 ⁇ m or more and 20.0 ⁇ m or less. If the film thickness of the silver-plating layer 5 is less than 0.5 ⁇ m, it is easily worn away and disappeared in early time, and the effect of the increase of the abrasion resistance is poor. If the thickness exceeds 20.0 ⁇ m, since the soft silver-plating layer 5 is thick, the friction coefficient increases. Note that the film thickness of the silver-plating layer 5 is larger than the film thickness of the silver-nickel alloy plating layer 4.
- the silver-plating layer 5 be made of silver with purity 99.99% by mass or more except C, H, S, O, and N which are gas components. If concentration of silver in the silver-plating layer 5 is less than 99.99% by mass, the contact resistance increases owing to impurities. "Except C, H, S, O, and N" means exception of gas components.
- This method of producing is provided with a pretreatment step cleaning a plate material to be the base material 2 in which at least a surface layer is made of copper or copper alloy, a nickel plating step forming the nickel-plating layer 3 on the base material 2, a silver-strike plating step carrying out the silver-strike plating on the nickel-plating layer 3, a silver-nickel alloy plating step forming the silver-nickel alloy plating layer 4 after the silver-strike plating, and a silver-plating step carrying out a silver plating on the silver-nickel alloy plating layer 4 to form the silver-plating layer 5.
- the plate material in which at least the surface layer is made of copper or copper alloy is prepared, and the plate material is subjected to the pretreatment cleaning the surface by performing alkaline electrolytic degreasing, etching, pickling and the like to form the base material 2.
- Nickel-Plating Step The surface of the base material 2 is subjected to plating made of nickel or nickel alloy to form the nickel-plating layer 3. For example, using a nickel-plating bath containing 300 g/L of nickel sulfamate, 30 g/L of nickel (II) chloride hexahydrate, and 30 g/L of boric acid, the nickel plating is performed under conditions of bath temperature 45°C and current density 5 A/dm 2 .
- the nickel-plating bath forming the nickel-plating layer 3 is not specifically limited if a dense film mainly composed of nickel is obtained. It is also applicable to perform electroplating using known Watt's bath.
- Composition of the silver-plating bath for performing the silver-strike plating is not specifically limited: for example, it contains 1 g/L to 5 g/L of silver cyanide (AgCN) and 80 g/L to 120 g/L of potassium cyanide (KCN).
- AgCN silver cyanide
- KCN potassium cyanide
- the silver-strike plating layer is formed by carrying out silver plating for about 30 seconds under conditions of bath temperature 25°C and current density 3 A/dm 2 .
- This silver-strike plating layer is hardly distinguished as a layer after the silver-nickel alloy plating is performed.
- the silver-nickel alloy plating is performed after the silver-strike plating to form the silver-nickel alloy plating layer 4.
- Composition of a plating bath for forming the silver-nickel alloy plating layer 4 contains, for example, silver cyanide (AgCN) 40 g/L to 60 g/L, potassium cyanide (KCN) 130 g/L to 200 g/L, potassium carbonate (K 2 CO 3 ) 15 g/L to 35 g/L, nickel (II) potassium cyanide monohydrate (2KCN ⁇ Ni(CN) 2 ⁇ H 2 O) 100 g/L to 200 g/L, and an additive for smoothly depositing the silver-nickel alloy plating layer 4. If no antimony is contained, the additive may be a general additive.
- the silver-nickel alloy plating layer 4 is formed with a nickel content 0.03 at% to 1.00 at% and a film thickness 0.05 ⁇ m or more and less than 0.50 ⁇ m.
- the plating bath for forming the silver-nickel alloy plating layer 4 is not limited to the above-described composition: if it is a cyanide bath and no antimony is contained in the additive, the composition is not specifically limited.
- Composition of a silver-plating bath for forming the silver-plating layer 5 contains, for example, potassium silver cyanide (K[Ag(CN) 2 ]) 45 g/L to 60 g/L, potassium cyanide (KCN) 100 g/L to 150 g/L, potassium carbonate (K 2 CO 3 ) 10 g/L to 30 g/L, and an additive. If no antimony is contained, the additive may be a general additive.
- the silver-plating layer 5 is formed with a film thickness 0.5 ⁇ m or more and 20.0 ⁇ m or less.
- the plating bath for forming the silver-plating layer 5 is not limited to the above-described composition: if it is a cyanide bath and no antimony is contained in the additive, the composition is not specifically limited.
- the terminal material 1 for a connector in which the nickel-plating layer 3, the silver-nickel alloy plating layer 4, and the silver-plating layer 5 are formed on the surface of the base material 2 is formed. Furthermore, by performing press machining and the like on the terminal material 1 for a connector, a terminal for a connector in which the silver-plating layer 5 is positioned on the surface is formed.
- the above-described plating steps are carried out in order by soaking the base material 2 in the plating bath, so the plating layers 3, 4, and 5 are formed on both surfaces of the base material 2. Masking one surface of the base material 2, it is possible to form the plating layers 3, 4, and 5 only on the other surface.
- the lubricant effect improves the abrasion resistance.
- the surface is the silver-plating layer 5, the surface is not easily oxidized even in the high temperature environment, increase of the contact resistance can be restricted. Furthermore, silver glossiness improves the design of the surface.
- the silver-nickel alloy plating layer 4 has a high hardness since nickel is contained, but the hardness of the silver-nickel alloy plating layer 4 can be prevented from excessively increased since the intermetallic compound is not generated between silver and nickel.
- the silver-nickel alloy plating layer 4 formed between the silver-plating layer 5 and the nickel-plating layer 3 contains both silver and nickel components, the adhesiveness of these layers can be improved.
- the silver-nickel alloy plating layer 4 is formed on the silver-strike plating layer on the nickel-plating layer 3, so that it is prevented from peeling from the nickel-plating layer 3.
- the silver-plating layer 5 on the surface does not react with oxygen, the oxygen easily enters inside in the high-temperature environment; however, even if the oxygen enters through the silver-plating layer 5, it reacts with nickel in the silver-nickel alloy plating layer 4, so the oxygen is prevented from arriving in the nickel-plating layer 3 as the under layer. Accordingly, the silver-nickel alloy plating layer 4 functions as the sacrificing layer, so that the nickel-plating layer 3 is prevented from peeling by oxidizing.
- the nickel-plating layer 3, the silver-nickel alloy plating layer 4, and the silver-plating layer 5 are formed on a whole area of the upper surface of the base material 2. It is not limited to this: for example, the nickel-plating layer 3 may be formed on a part of the upper surface of the base material 2 and the silver-nickel alloy plating layer 4 and the silver-plating layer 5 may be formed on that nickel-plating layer 3.
- the silver-nickel alloy plating layer 4 and the silver-plating layer 5 may be formed on a part of the upper surface of the nickel-plating layer 3 formed on the whole area of the upper surface of the base material 2. That is to say, in a case in which the silver-nickel alloy plating layer 4 and the silver-plating layer 5 are not provided on the whole surface of the terminal material 1, it is preferable that at least a surface of a part to be a contact when it is formed into a terminal be the silver-plating layer 5.
- a copper alloy (CDA No. C18665) plate was used as the base material and the respective steps were carried out as below.
- Pretreatment Step The base material was subjected to alkaline electrolytic degreasing, etching, and pickling to clean the surface.
- Nickel-Plating Step Using a plating bath containing 300 g/L of nickel sulfamate, 30 g/L of nickel (II) chloride hexahydrate, and 30 g/L of boric acid, under conditions of bath temperature 45°C, current density 5 A/dm 2 , and an anode is a nickel plate, soaking the base material ion the plating bath and turning on electricity for 60 seconds, the nickel-plating layer 3 having the film thickness 1 ⁇ m.
- nickel content in the silver-nickel alloy plating layer 4 is proportional to the current density of the plating treatment, by controlling the current density within 5 A/dm 2 to 12 A/dm 2 , the nickel content in the silver-nickel alloy plating layer 4 was adjusted in 0.03 at% to 1.00 at%. Since the film thickness of the silver-nickel alloy plating layer 4 is proportional to plating time, the film thickness of the silver-nickel alloy plating layer 4 was adjusted by controlling the plating time in one second to 16 seconds.
- Sample 10 in which a copper-plating layer was formed was produced as below instead of the silver-nickel alloy plating layer 4. That is, after the nickel-plating step, a copper-plating step and an activation treatment were carried out as follows before the silver-strike plating step; and after carrying out the silver-strike plating step, the silver-nickel alloy plating step was not carried out but the silver-plating step was carried out.
- the copper-plating layer was formed by plating by using a plating bath containing copper sulfate pentahydrate (CuSO 4 ⁇ 5H 2 O) 200 g/L and sulfuric acid (H 2 SO 4 ) 50 g/L, on conditions that the bath temperature 40°C, the current density 5 A/dm 2 and an anode was copper containing phosphorus.
- a plating bath containing copper sulfate pentahydrate (CuSO 4 ⁇ 5H 2 O) 200 g/L and sulfuric acid (H 2 SO 4 ) 50 g/L
- This copper-plating layer was subjected to the activation treatment using 5 to 10% by mass of potassium cyanide aqueous solution, then the silver-strike plating and the silver-plating were carried out on the copper-plating layer as in Examples to form the silver-plating layer.
- the film thickness of the silver-nickel alloy plating layer, the nickel content in the silver-nickel alloy plating layer, and the film thickness of the silver-plating layer were measured.
- the silver-nickel alloy plating layer is indicated as "AgNi Layer”
- the silver-plating layer is indicated as “Ag Layer”
- the nickel content is indicated as "Ni Content”.
- sectional machining was performed by using a focused ion beam system (FIB: model No. SMI3050TB made by Seiko Instruments Inc.), film thicknesses of any three points were measured in a sectional SIM (Scanning Ion Microscopy) image on an inclined angle 60° and the average value thereof was converted into a real length to obtain a film thicknesses of the silver-nickel alloy plating layer and the silver-plating layer.
- FIB focused ion beam system
- SIM Sccanning Ion Microscopy
- the respective samples were cut out into 60 mm ⁇ 10 mm and an emboss with a radius of curvature 5 mm was formed in the center part to produce test pieces of female terminals (substitution of female terminals).
- the respective samples were also cut out into 60 mm ⁇ 30 mm to be test pieces of male terminals (substitution of male terminals) as is in a flat plate shape.
- test pieces using a friction abrasion tester (UMT-TriboLab made by Bruker AXS GmbH), contact resistance (m ⁇ ) when the heat treatment was not performed and contact resistance (m ⁇ ) when the heat treatment at 150°C for 500 hours was performed were measured. Specifically, a protruded surface of the emboss of the test piece of the female terminal was in contact with the test piece of the male terminal which was horizontally disposed to apply a load 5 N on the test piece of the male terminal, the contact resistance value was measured by the four-terminal method.
- UAT-TriboLab made by Bruker AXS GmbH
- the respective samples were cut out into 60 mm ⁇ 10 mm and an emboss with a radius of curvature 5 mm was formed in the center part to produce test pieces of female terminals (substitution of female terminals).
- the respective samples were also cut out into 60 mm ⁇ 30 mm to be test pieces of male terminals (substitution of male terminals) as is in a flat plate shape.
- test pieces in which the heat treatment was not performed (before heating) and test pieces after the heat treatment at 150°C for 120 hours were produced and friction coefficient was measured respectively.
- the heat treatment was performed only on the test pieces of the female terminals; the respective test pieces of the male terminals were used for the measurement in a state before heating.
- the friction coefficient was measured by using the friction abrasion tester (UMT-TriboLab made by Bruker AXS GmbH). Specifically, the protruded surface of the emboss of the test piece of the female terminal was in contact with the test piece of the male terminal which was horizontally disposed to apply a load 5 N on the test piece of the male terminal with moving it at a sliding speed 1.33 mm/sec for a distance 20mm, continuous changes of the friction coefficient were measured, and average value in the movement distance from 10 mm to 15 mm was as the friction coefficient.
- UAT-TriboLab made by Bruker AXS GmbH
- Fluctuation coefficient (%) was obtained by ((friction coefficient after heating - friction coefficient before heating) / (friction coefficient before heating)) ⁇ 100.
- FIG. 2 is a sectional SIM image of Sample 4: the silver-nickel alloy plating layer 4 and the silver-plating layer 5 are formed on the nickel-plating layer 3 of the surface of the base material.
- a protective layer 10 on the silver-plating layer 5 is a layer formed for protection when the section machining was carried out using the focusing ion apparatus.
- the heat resistance of the connector is improved, the contact resistance is not increased even in the high-temperature environment, and also the peeling can be restricted.
Abstract
Description
- The present invention relates to a terminal material for a connector in which a useful film is provided for connection of electric wiring in an automobile, a consumer apparatus, or the like. Priority is claimed on
Japanese Patent Application No. 2020-027614, filed February 20, 2020 - Conventionally, an on-vehicle connector used for connection of electric wiring of automobile or the like has been known. A pair of terminals used for the on-vehicle connector (on-vehicle terminals) are designed to electrically connect by contacting a contact piece provided in a female terminal with a male terminal inserted into the female terminal at a predetermined contact pressure.
- As such a connector (terminal), generally, a terminal with tin plating in which tin plating is carried on a copper or a copper alloy plate and reflowing treatment is subjected to has been largely used. However, in recent years, purposes of a terminal are increased with larger electric current and higher voltage in which precious metal such as silver or the like is plated, more large current can be passed with excellent in heat resistance and abrasion resistance.
- As an on-vehicle terminal in which the heat resistance and the abrasion resistance are required, for example, in a plating material for an electric-electronic part disclosed in Patent Literature 1, a base-plating layer made of any one of or alloy of Ni, Co, and Fe is formed on a surface of a conductive base material, an intermediate plating layer made of Cu or Cu alloy is formed on the base-plating layer, and an alloy layer is formed on the intermediate plating layer. It is described that this alloy layer is made by alloying by selective thermal diffusion of an Sn plating layer and a metal-plating layer made of Ag or In.
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Patent Literature 2 discloses a material for a movable contact having a conductive base material, a base layer formed on the conductive base material, an intermediate layer formed on the base layer, and an outermost layer made of silver or silver alloy formed on the intermediate layer. It is described that the base layer is made of nickel or nickel alloy, or cobalt or cobalt alloy, and the intermediate layer is made of copper or copper alloy in this material. -
- Patent Literature 1:
Japanese Unexamined Patent Application First Publication No. 2007-177329 - Patent Literature 2:
Japanese Unexamined Patent Application First Publication No. 2015-117424 - A silver layer provided on a surface of a terminal material is excellent in heat resistance and abrasion resistance since it is not oxidized even in high-temperature environment. On the other, a base layer has a function of preventing diffusion of copper from the base material. Since tin and nickel form an intermetallic compound, adhesiveness between a nickel base layer and tin plating is good.
- However, in a case in which the silver layer on the surface is provided on the nickel base layer, the adhesiveness is poor since nickel and silver do not form an intermetallic compound. Moreover, since silver is hard to be oxidized and the silver layer cannot obstruct oxygen from entering in, oxygen diffused into the silver layer and reaches the nickel layer becomes nickel oxide in the nickel layer, so that there is a risk of occurring peeling.
- Accordingly, in the terminal materials of these patent literatures, the intermediate layer made of copper or copper alloy is formed between the silver layer and the nickel layer. Copper diffuses into the silver layer under the high-temperature environment but does not form an intermetallic compound with silver, so that oxygen is distributed to a grain boundary of the silver layer and prevented from entering in. However, if copper is diffused up to the surface of the silver layer, it is oxidized on the surface and there is a defect of increase of the contact resistance.
- The present invention is achieved in consideration of the above circumstances, and has an object to provide a terminal material for a connector in which the heat resistance is further improved, the contact resistance is not increased even in the high-temperature environment, to have the high abrasion resistance.
- A terminal material for a connector of the present invention is provided with a base material in which at least a surface layer is made of copper or copper alloy; a nickel-plating layer made of nickel or nickel alloy and provided on a surface of the base material; a silver-nickel alloy plating layer made of silver-nickel alloy and provided on at least a part of the nickel-plating layer; and a silver-plating layer made of silver and provided on the silver-nickel alloy plating layer; and in this terminal material, the silver-nickel alloy plating layer has 0.05 µm or more and less than 0.50 µm of a film thickness and 0.03 at% or more and 1.00 at% or less of nickel content.
- Since the silver-plating layer which is relatively soft is provided on the surface and the silver-nickel alloy plating layer which is harder than the silver-plating layer is provided below it, the lubricant effect is excellent and the abrasion resistance is improved. Moreover, the surface of the silver-plating layer is not easily oxidized even in the high-temperature environment, and the contact resistance can be restrained from increasing. Furthermore, design of the surface is improved by the glossiness of silver.
- In this terminal material for a connector, since the silver-nickel alloy plating layer provided between the silver-plating layer on the surface and the nickel-plating layer which is the ground contains both components of silver and nickel, it can improve adhesiveness between these layers.
- Unlike the intermediate layer made of copper or copper alloy described in Patent Literature, nickel in the silver-nickel alloy plating layer is not easily diffused into the silver-plating layer even in the high-temperature environment, so the contact resistance can be restrained from increasing.
- Moreover, even if oxygen enters through the silver-plating layer on the surface in the high-temperature environment, nickel in the silver-nickel alloy plating layer reacts with oxygen, so that the silver-nickel alloy plating layer functions as a sacrificing layer to prevent the oxygen from coming up to the nickel-plating layer. Accordingly, the peeling by oxidizing of the nickel-plating layer can be restrained.
- In this case, if nickel in the silver-nickel alloy plating layer is oxidized, since nickel is diffused on a boundary surface (grain boundary) of silver, the layer is not peeled off. Accordingly, deterioration of the performance in the high-temperature environment can be restrained and the excellent abrasion resistance can be maintained.
- Moreover, since nickel has the higher melting point than copper, it is not easily diffused by heat. Accordingly, unlike copper, nickel is not easily concentrated on the outermost surface even in the high-temperature environment, it is possible to restrain the increase of the contact resistance.
- If the nickel content in the silver-nickel alloy plating layer is less than 0.03 at%, the heat resistance is deteriorated and it is easily peeled off. If the nickel content in the silver-nickel alloy plating layer exceeds 1.00 at%, the conductor resistance of the silver-nickel alloy plating layer increases, and the contact resistance in the high-temperature environment is also easily increased.
- Since the silver-nickel alloy plating layer functions as the sacrificing layer preventing oxygen from entering the nickel-plating layer as described above, an amount of nickel reacting with oxygen is small if the film thickness is less than 0.05 µm, and the heat resistance cannot be improved. On the other, if the film thickness of the silver-nickel alloy plating layer is 0.50 µm or more, the effect is saturated and it is useless in cost.
- As one aspect of the terminal material for a connector according to the present invention, a film thickness of the silver-plating layer is preferably 0.5 µm or more and 20.0 µm or less. If the film thickness of the silver-plating layer is less than 0.5 µm, it is worn in early times and easily disappeared, and the effect of improving the abrasion resistance is poor. If the thickness exceeds 20.0 µm, the soft silver-plating layer is thick, and the friction coefficient tends to be increased. In addition, the film thickness of the silver-plating layer is larger than the film thickness of the silver-nickel alloy plating layer.
- As another aspect of the terminal material for a connector according to the present invention, the silver-plating layer is preferably made of silver with a purity 99.99% or more by mass except C, H, S, O, and N which are gas components. If a large amount of impurities are contained in the silver-plating layer, the contact resistance is high. "Except C, H, S, O, and N" means to exclude gas components.
- According to the present invention, the heat resistance of the connector is improved, the contact resistance is not increased even in the high-temperature environment, and the peeling can be restrained.
-
- [
FIG. 1 ] It is a cross sectional view schematically showing a terminal material for a connector according to an embodiment of the present invention. - [
FIG. 2 ] It is an SIM (Scanning Ion Microscope) image of a cross section of a terminal material for a connector ofSample 4 before heating. - An embodiment of the present invention will be explained referring the drawings below.
- A terminal material 1 for a connector of the present embodiment is provided with, as schematically showing a cross section in
FIG. 1 , abase material 2 having a plate shape in which at least a surface layer is made of copper or copper alloy, a nickel-platinglayer 3 provided on an upper surface of thebase material 2 and made of nickel or nickel alloy, a silver-nickelalloy plating layer 4 provided on at least a part of the nickel-platinglayer 3 and made of silver-nickel alloy, and a silver-platinglayer 5 provided on an upper surface of the silver-nickelalloy plating layer 4 and made of silver. - The
base material 2 is not limited in the composition if the surface layer is copper or copper alloy. In the present embodiment, as shown inFIG. 1 , thebase material 2 is a plate material made of copper or copper alloy; however, it may be a plated material in which copper plating or copper-alloy plating is made on a surface of a mother bacterial. In this case, as the mother material, copper or copper alloy such as oxygen-free copper (Cl 0200), Cu-Mg type copper alloy (C18665) and the like can be applied. - The nickel-plating
layer 3 is formed by performing nickel or nickel alloy plating on thebase material 2 and covers thebase material 2. The nickel-plating layer 3 has a function of restraining diffusion of Cu component from thebase material 2 to the silver-platinglayer 5. A film thickness of the nickel-platinglayer 3 is not specifically limited: 0.2 µm or more and 5.0 µm or less is preferable; more preferably, 0.5 µm or more and 2.0 µm or less. - If the film thickness of the nickel-plating
layer 3 is less than 0.2 µm, there is a possibility that the Cu component diffuses from thebase material 2 into the silver-platinglayer 5 in the high-temperature environment to increase the contact resistance value of the silver-platinglayer 5 and the heat resistance is deteriorated. Conversely, if the thickness of the nickel-plating layer exceeds 5.0 µm, there is a risk of cracking by bending machining. Incidentally, the composition of the nickel-plating layer 3 is not specifically limited if it is made of nickel or nickel alloy. - The silver-
nickel alloy layer 4 is formed by carrying out a silver-strike plating on the nickel-plating layer 3 and then carrying out a silver-nickel alloy plating. The silver-nickel alloy layer 4 is alloy of silver and nickel: intermetallic compound is not generated between silver and nickel, so cracks when the bending machining are restrained. - Nickel content in the silver-
nickel alloy layer 4 is 0.03 at% or more and 1.00 at% or less; more preferably, 0.05 at% or more and 1.00 at% or less. - Nickel has the higher melting point than that of copper: it is hardly diffused and hard to be concentrated in the outermost surface even in the high-temperature environment unlike copper. Accordingly, it is possible to restrain increase of the contact resistance in the high-temperature environment. If the nickel content in the silver-nickel
alloy plating layer 4 is less than 0.03 at%, the heat resistance and the abrasion resistance are deteriorated; if it exceeds 1.00 at%, the conductor resistance of the silver-nickelalloy plating layer 4 increases, and moreover, the contact resistance is easily increased in the high-temperature environment. - A film thickness of the silver-nickel
alloy plating layer 4 is set to be 0.05 µm or more and less than 0.50 µm; more preferably, 0.10 µm or more and less than 0.50 µm. The silver-nickelalloy plating layer 4 has a function as a sacrificing layer obstructing the achievement of oxygen to the nickel-plating layer 3 which is the ground layer thereof by reacting oxygen entering from the surface with nickel; accordingly, it is enough to have a degree of the film thickness which can show the function. - If the film thickness of the silver-nickel
alloy plating layer 4 is less than 0.05 µm, the effect of preventing from entering of oxygen to the nickel-plating layer 3 in the high-temperature environment is not sufficient, and it is easy to be peeled off when sliding and the abrasion resistance is deteriorated. If the film thickness of the silver-nickelalloy plating layer 4 is 0.50 µm or more, the effect is saturated and it is useless in cost. - The silver-
plating layer 5 is formed by carrying out silver plating on the silver-nickelalloy plating layer 4. The silver-plating layer 5 is relatively soft and the hard silver-nickelalloy plating layer 4 is formed therebelow, so it gives excellent lubrication effect and contributes to improvement of the abrasion resistance. Moreover, it is not easily oxidized even in the high-temperature environment and the contact resistance can be prevented from increasing. Furthermore, design of the surface is improved by gloss of silver. - A film thickness of the silver-
plating layer 5 is preferably 0.5 µm or more and 20.0 µm or less. If the film thickness of the silver-plating layer 5 is less than 0.5 µm, it is easily worn away and disappeared in early time, and the effect of the increase of the abrasion resistance is poor. If the thickness exceeds 20.0 µm, since the soft silver-plating layer 5 is thick, the friction coefficient increases. Note that the film thickness of the silver-plating layer 5 is larger than the film thickness of the silver-nickelalloy plating layer 4. - It is preferable that the silver-
plating layer 5 be made of silver with purity 99.99% by mass or more except C, H, S, O, and N which are gas components. If concentration of silver in the silver-plating layer 5 is less than 99.99% by mass, the contact resistance increases owing to impurities. "Except C, H, S, O, and N" means exception of gas components. - Next, a method of producing the terminal material 1 for a connector will be explained. This method of producing is provided with a pretreatment step cleaning a plate material to be the
base material 2 in which at least a surface layer is made of copper or copper alloy, a nickel plating step forming the nickel-plating layer 3 on thebase material 2, a silver-strike plating step carrying out the silver-strike plating on the nickel-plating layer 3, a silver-nickel alloy plating step forming the silver-nickelalloy plating layer 4 after the silver-strike plating, and a silver-plating step carrying out a silver plating on the silver-nickelalloy plating layer 4 to form the silver-plating layer 5. - [Pretreatment Step] First, the plate material in which at least the surface layer is made of copper or copper alloy is prepared, and the plate material is subjected to the pretreatment cleaning the surface by performing alkaline electrolytic degreasing, etching, pickling and the like to form the
base material 2. - [Nickel-Plating Step] The surface of the
base material 2 is subjected to plating made of nickel or nickel alloy to form the nickel-plating layer 3. For example, using a nickel-plating bath containing 300 g/L of nickel sulfamate, 30 g/L of nickel (II) chloride hexahydrate, and 30 g/L of boric acid, the nickel plating is performed under conditions of bath temperature 45°C and current density 5 A/dm2. - The nickel-plating bath forming the nickel-
plating layer 3 is not specifically limited if a dense film mainly composed of nickel is obtained. It is also applicable to perform electroplating using known Watt's bath. - [Silver-strike Plating Step] An activation treatment is carried out on the nickel-
plating layer 3 using 5 to 10% by mass of potassium cyanide aqueous, and then the silver-strike plating is carried out on the nickel-plating layer 3 for a short time, so that the thin silver-plating layer (the silver-strike plating layer) is formed. - Composition of the silver-plating bath for performing the silver-strike plating is not specifically limited: for example, it contains 1 g/L to 5 g/L of silver cyanide (AgCN) and 80 g/L to 120 g/L of potassium cyanide (KCN).
- By this silver-plating bath, using stainless steel (SUS316) as an anode, the silver-strike plating layer is formed by carrying out silver plating for about 30 seconds under conditions of bath temperature 25°C and current density 3 A/dm2. This silver-strike plating layer is hardly distinguished as a layer after the silver-nickel alloy plating is performed.
- [Silver-Nickel Alloy Plating Step] The silver-nickel alloy plating is performed after the silver-strike plating to form the silver-nickel
alloy plating layer 4. Composition of a plating bath for forming the silver-nickelalloy plating layer 4 contains, for example, silver cyanide (AgCN) 40 g/L to 60 g/L, potassium cyanide (KCN) 130 g/L to 200 g/L, potassium carbonate (K2CO3) 15 g/L to 35 g/L, nickel (II) potassium cyanide monohydrate (2KCN·Ni(CN)2·H2O) 100 g/L to 200 g/L, and an additive for smoothly depositing the silver-nickelalloy plating layer 4. If no antimony is contained, the additive may be a general additive. - By using a pure silver plate as an anode in this plating bath and performing the silver-nickel alloy plating under conditions of bath temperature 20°C to 30°C and current density 5 A/dm2 to 12 A/dm2, the silver-nickel
alloy plating layer 4 is formed with a nickel content 0.03 at% to 1.00 at% and a film thickness 0.05 µm or more and less than 0.50 µm. The plating bath for forming the silver-nickelalloy plating layer 4 is not limited to the above-described composition: if it is a cyanide bath and no antimony is contained in the additive, the composition is not specifically limited. - [Silver Plating Step] Composition of a silver-plating bath for forming the silver-
plating layer 5 contains, for example, potassium silver cyanide (K[Ag(CN)2]) 45 g/L to 60 g/L, potassium cyanide (KCN) 100 g/L to 150 g/L, potassium carbonate (K2CO3) 10 g/L to 30 g/L, and an additive. If no antimony is contained, the additive may be a general additive. - By using a pure silver plate as an anode in this plating bath and performing the silver plating under conditions of bath temperature 23 °C and current density 2 A/dm2 to 5 A/dm2, the silver-
plating layer 5 is formed with a film thickness 0.5 µm or more and 20.0 µm or less. The plating bath for forming the silver-plating layer 5 is not limited to the above-described composition: if it is a cyanide bath and no antimony is contained in the additive, the composition is not specifically limited. - As described above, the terminal material 1 for a connector in which the nickel-
plating layer 3, the silver-nickelalloy plating layer 4, and the silver-plating layer 5 are formed on the surface of thebase material 2 is formed. Furthermore, by performing press machining and the like on the terminal material 1 for a connector, a terminal for a connector in which the silver-plating layer 5 is positioned on the surface is formed. - In addition, the above-described plating steps are carried out in order by soaking the
base material 2 in the plating bath, so the plating layers 3, 4, and 5 are formed on both surfaces of thebase material 2. Masking one surface of thebase material 2, it is possible to form the plating layers 3, 4, and 5 only on the other surface. - In the terminal material 1 for a connector of the present embodiment, since the silver-
plating layer 5 formed on the outermost surface is relatively soft and supported by the hard silver-nickelalloy plating layer 4 underneath, the lubricant effect improves the abrasion resistance. Moreover, since the surface is the silver-plating layer 5, the surface is not easily oxidized even in the high temperature environment, increase of the contact resistance can be restricted. Furthermore, silver glossiness improves the design of the surface. - The silver-nickel
alloy plating layer 4 has a high hardness since nickel is contained, but the hardness of the silver-nickelalloy plating layer 4 can be prevented from excessively increased since the intermetallic compound is not generated between silver and nickel. - Moreover, since the silver-nickel
alloy plating layer 4 formed between the silver-plating layer 5 and the nickel-plating layer 3 contains both silver and nickel components, the adhesiveness of these layers can be improved. - Since nickel has the higher melting point than that of copper, it is not easily diffused by heat and the concentration to the outermost surface does not easily occur unlikely copper. Accordingly, the heat resistance can be improved and increase of the contact resistance can be restrained. Moreover, the silver-nickel
alloy plating layer 4 is formed on the silver-strike plating layer on the nickel-plating layer 3, so that it is prevented from peeling from the nickel-plating layer 3. - Since the silver-
plating layer 5 on the surface does not react with oxygen, the oxygen easily enters inside in the high-temperature environment; however, even if the oxygen enters through the silver-plating layer 5, it reacts with nickel in the silver-nickelalloy plating layer 4, so the oxygen is prevented from arriving in the nickel-plating layer 3 as the under layer. Accordingly, the silver-nickelalloy plating layer 4 functions as the sacrificing layer, so that the nickel-plating layer 3 is prevented from peeling by oxidizing. - In this case, even if the nickel in the silver-nickel
alloy plating layer 4 is oxidized, it does not come to be peeled off since the nickel in the silver-nickelalloy plating layer 4 is diffused. Accordingly, deterioration of the performance in the high-temperature environment can be restrained and the excellent abrasion resistance can be maintained. - In addition, the detailed structure of the present invention is not limited to the present embodiment and various modifications may be made without departing from the scope of the present invention. For example, in the above-described embodiment, the nickel-
plating layer 3, the silver-nickelalloy plating layer 4, and the silver-plating layer 5 are formed on a whole area of the upper surface of thebase material 2. It is not limited to this: for example, the nickel-plating layer 3 may be formed on a part of the upper surface of thebase material 2 and the silver-nickelalloy plating layer 4 and the silver-plating layer 5 may be formed on that nickel-plating layer 3. - Alternatively, the silver-nickel
alloy plating layer 4 and the silver-plating layer 5 may be formed on a part of the upper surface of the nickel-plating layer 3 formed on the whole area of the upper surface of thebase material 2. That is to say, in a case in which the silver-nickelalloy plating layer 4 and the silver-plating layer 5 are not provided on the whole surface of the terminal material 1, it is preferable that at least a surface of a part to be a contact when it is formed into a terminal be the silver-plating layer 5. - A copper alloy (CDA No. C18665) plate was used as the base material and the respective steps were carried out as below.
- [Pretreatment Step] The base material was subjected to alkaline electrolytic degreasing, etching, and pickling to clean the surface.
- [Nickel-Plating Step] Using a plating bath containing 300 g/L of nickel sulfamate, 30 g/L of nickel (II) chloride hexahydrate, and 30 g/L of boric acid, under conditions of bath temperature 45°C, current density 5 A/dm2, and an anode is a nickel plate, soaking the base material ion the plating bath and turning on electricity for 60 seconds, the nickel-
plating layer 3 having the film thickness 1 µm. - [Silver-Strike Plating Step] Using a plating bath containing 2 g/L of silver cyanide (AgCN) and 100 g/L of potassium cyanide (KCN), under conditions of an anode is stainless steel (SUS316), the bath temperature 25°C, and the current density 3A/dm2, turning on electricity for 30 seconds to performing the silver-strike plating on the nickel-
plating layer 3 to form the silver-strike plating layer. - [Silver-Nickel Alloy Plating Step] Using a plating bath containing silver cyanide (AgCN) 40 g/L, potassium cyanide (KCN) 150 g/L, potassium carbonate (K2CO3) 20 g/L, nickel (II) potassium cyanide monohydrate (2KCN·Ni(CN)2·H2O) 140 g/L, and an additive 20 ml//L, and an anode was a pure silver plate, bath temperature was 25°C, the silver-nickel
alloy plating layer 4 was formed on the silver-strike plating layer. - Since nickel content in the silver-nickel
alloy plating layer 4 is proportional to the current density of the plating treatment, by controlling the current density within 5 A/dm2 to 12 A/dm2, the nickel content in the silver-nickelalloy plating layer 4 was adjusted in 0.03 at% to 1.00 at%. Since the film thickness of the silver-nickelalloy plating layer 4 is proportional to plating time, the film thickness of the silver-nickelalloy plating layer 4 was adjusted by controlling the plating time in one second to 16 seconds. - [Silver Plating Step] Using a plating bath containing potassium silver cyanide (K[Ag(CN)2]) 45 g/L, potassium cyanide (KCN) 100 g/L, potassium carbonate (K2CO3) 20 g/L, and a brightener (AgO-56 made by Atotech Japan K.K.) 4 ml, under conditions of bath temperature 23°C and current density 4 A/dm2, the silver-
plating layer 5 is formed on the silver-nickelalloy plating layer 4. - As Comparative Examples, Sample 7 in which the silver-nickel alloy plating layer was not formed on the nickel-plating layer but the silver-plating layer was formed, and Samples 8 and 9 in which the nickel content in the silver-nickel alloy plating layer was out of a range of 0.03 at% to 1.00 at% were also produced.
-
Sample 10 in which a copper-plating layer was formed was produced as below instead of the silver-nickelalloy plating layer 4. That is, after the nickel-plating step, a copper-plating step and an activation treatment were carried out as follows before the silver-strike plating step; and after carrying out the silver-strike plating step, the silver-nickel alloy plating step was not carried out but the silver-plating step was carried out. - The copper-plating layer was formed by plating by using a plating bath containing copper sulfate pentahydrate (CuSO4·5H2O) 200 g/L and sulfuric acid (H2SO4) 50 g/L, on conditions that the bath temperature 40°C, the current density 5 A/dm2 and an anode was copper containing phosphorus.
- This copper-plating layer was subjected to the activation treatment using 5 to 10% by mass of potassium cyanide aqueous solution, then the silver-strike plating and the silver-plating were carried out on the copper-plating layer as in Examples to form the silver-plating layer.
- Regarding Samples 1 to 11 in which these plating layers were formed, the film thickness of the silver-nickel alloy plating layer, the nickel content in the silver-nickel alloy plating layer, and the film thickness of the silver-plating layer were measured. In Table 1, the silver-nickel alloy plating layer is indicated as "AgNi Layer", the silver-plating layer is indicated as "Ag Layer", and the nickel content is indicated as "Ni Content".
- Regarding the respective samples, sectional machining was performed by using a focused ion beam system (FIB: model No. SMI3050TB made by Seiko Instruments Inc.), film thicknesses of any three points were measured in a sectional SIM (Scanning Ion Microscopy) image on an inclined angle 60° and the average value thereof was converted into a real length to obtain a film thicknesses of the silver-nickel alloy plating layer and the silver-plating layer.
- Regarding the respective samples, using a high-frequency glow discharge-optical emission spectroscopy (rf-GD-OES (Radio Frequency Glow Discharge-Optical Emission Spectroscopy), elemental analysis was performed in a depth direction from the surface of the silver-plating layer on the following conditions, and the obtained value was converted into a quantitative value (at%) using a half quantity kit.
- Measurement area: Circle with a
diameter 4 mm - Used gas: Ultra-high purity Ar gas
- Gas pressure: 600 Pa
- High-frequency output: 35 W
- Pulse frequency: 1000 Hz
- Duty ratio (or Duty cycle): 0.25 (25% electric discharge)
- Loading interval: 0.01 second
- The respective samples were cut out into 60 mm × 10 mm and an emboss with a radius of
curvature 5 mm was formed in the center part to produce test pieces of female terminals (substitution of female terminals). The respective samples were also cut out into 60 mm × 30 mm to be test pieces of male terminals (substitution of male terminals) as is in a flat plate shape. - Regarding these test pieces, using a friction abrasion tester (UMT-TriboLab made by Bruker AXS GmbH), contact resistance (mΩ) when the heat treatment was not performed and contact resistance (mΩ) when the heat treatment at 150°C for 500 hours was performed were measured. Specifically, a protruded surface of the emboss of the test piece of the female terminal was in contact with the test piece of the male terminal which was horizontally disposed to apply a load 5 N on the test piece of the male terminal, the contact resistance value was measured by the four-terminal method.
- The respective samples were cut out into 60 mm × 10 mm and an emboss with a radius of
curvature 5 mm was formed in the center part to produce test pieces of female terminals (substitution of female terminals). The respective samples were also cut out into 60 mm × 30 mm to be test pieces of male terminals (substitution of male terminals) as is in a flat plate shape. - Regarding the test pieces of the female terminals, test pieces in which the heat treatment was not performed (before heating) and test pieces after the heat treatment at 150°C for 120 hours were produced and friction coefficient was measured respectively. The heat treatment was performed only on the test pieces of the female terminals; the respective test pieces of the male terminals were used for the measurement in a state before heating.
- The friction coefficient was measured by using the friction abrasion tester (UMT-TriboLab made by Bruker AXS GmbH). Specifically, the protruded surface of the emboss of the test piece of the female terminal was in contact with the test piece of the male terminal which was horizontally disposed to apply a load 5 N on the test piece of the male terminal with moving it at a sliding speed 1.33 mm/sec for a distance 20mm, continuous changes of the friction coefficient were measured, and average value in the movement distance from 10 mm to 15 mm was as the friction coefficient.
- Fluctuation coefficient (%) was obtained by ((friction coefficient after heating - friction coefficient before heating) / (friction coefficient before heating)) × 100.
-
- As shown from Table 1, in Samples 1 to 6 in which the film thickness of the silver-nickel alloy plating layer is 0.05 µm or more and less than 0.50 µm and the nickel content is 0.03 at% or more and 1.00 at% or less, the contact resistance is small, and the fluctuation before and after heating is small in the contact resistance and the friction coefficient, excellent heat resistance is shown. Note that even if the film thickness of the silver-nickel alloy plating layer is large as in Sample 11, the contact resistance and the friction coefficient are not further improved.
-
FIG. 2 is a sectional SIM image of Sample 4: the silver-nickelalloy plating layer 4 and the silver-plating layer 5 are formed on the nickel-plating layer 3 of the surface of the base material. Aprotective layer 10 on the silver-plating layer 5 is a layer formed for protection when the section machining was carried out using the focusing ion apparatus. - In Sample 7, since the silver-nickel alloy plating layer was not formed, the fluctuation of the friction coefficient was large; in Sample 8, since the Ni content in the silver-nickel alloy plating layer was small, the fluctuation of the friction coefficient was large.
- Reason why the fluctuation of the friction coefficient was large before and after the heating treatment was considered that the surface of the nickel-plating layer was oxidized after the heat treatment, so that nickel-plating layer was peeled off from the silver-nickel alloy plating layer or the silver-plating layer by sliding while measuring the friction coefficient and the nickel-plating layer was even worn out. The friction coefficient was decreased by exposing of the hard nickel-plating layer, so that the friction coefficient was largely decreased comparing with that before the heating.
- In Sample 9, since the Nickel content is large in the silver-nickel alloy plating layer, the contact resistance after the heating was large and the fluctuation of the friction coefficient owing to the peeling while sliding was also large. In
Sample 10, since the copper layer was formed rather than the silver-nickel alloy layer, the contact resistance is large after heating. - The heat resistance of the connector is improved, the contact resistance is not increased even in the high-temperature environment, and also the peeling can be restricted.
-
- 1
- Terminal material for connector
- 2
- Base material
- 3
- Nickel-plating layer
- 4
- Silver-nickel alloy plating layer
- 5
- Silver-plating layer
- 10
- Protective layer
Claims (4)
- A terminal material for a connector comprisinga base material in which at least a surface layer is made of copper or copper alloy;a nickel-plating layer made of nickel or nickel alloy and provided on a surface of the base material;a silver-nickel alloy plating layer made of silver-nickel alloy and provided on at least a part of the nickel-plating layer; anda silver-plating layer made of silver and provided on the silver-nickel alloy plating layer, whereinthe silver-nickel alloy plating layer has 0.05 µm or more and less than 0.50 µm of a film thickness and 0.03 at% or more and 1.00 at% or less of nickel content.
- The terminal material for a connector according to claim 1, wherein a film thickness of the silver-plating layer is 0.5 µm or more and 20.0 µm or less.
- The terminal material for a connector according to claim 1, wherein the silver-plating layer is made of silver with purity 99.99% or more by mass except C, H, S, O, and N which are gas components.
- The terminal material for a connector according to claim 2, wherein the silver-plating layer is made of silver with purity 99.99% or more by mass except C, H, S, O, and N which are gas components.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2020027614A JP7040544B2 (en) | 2020-02-20 | 2020-02-20 | Terminal material for connectors |
PCT/JP2021/003053 WO2021166581A1 (en) | 2020-02-20 | 2021-01-28 | Terminal material for connector |
Publications (2)
Publication Number | Publication Date |
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EP4108811A1 true EP4108811A1 (en) | 2022-12-28 |
EP4108811A4 EP4108811A4 (en) | 2024-03-06 |
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EP21757568.7A Pending EP4108811A4 (en) | 2020-02-20 | 2021-01-28 | Terminal material for connector |
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US (1) | US11761109B2 (en) |
EP (1) | EP4108811A4 (en) |
JP (1) | JP7040544B2 (en) |
KR (1) | KR20220142450A (en) |
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WO (1) | WO2021166581A1 (en) |
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JP2023079476A (en) * | 2021-11-29 | 2023-06-08 | 矢崎総業株式会社 | Plated material for terminal, terminal using the same, and electric wire with terminal |
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JP2001003194A (en) * | 1999-06-21 | 2001-01-09 | Nippon Mining & Metals Co Ltd | Heat resistant and corrosion resistant silver plating material |
US20050037229A1 (en) | 2001-01-19 | 2005-02-17 | Hitoshi Tanaka | Plated material, method of producing same, and electrical / electronic part using same |
JP4514061B2 (en) | 2001-01-19 | 2010-07-28 | 古河電気工業株式会社 | Plating material, manufacturing method thereof, and electric / electronic parts using the same |
JP4162246B2 (en) * | 2005-08-12 | 2008-10-08 | 石原薬品株式会社 | Cyanide-free silver-based plating bath, plated body and plating method |
JP4834022B2 (en) * | 2007-03-27 | 2011-12-07 | 古河電気工業株式会社 | Silver coating material for movable contact parts and manufacturing method thereof |
JP6046406B2 (en) * | 2011-07-26 | 2016-12-14 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | High temperature resistant silver coated substrate |
JP5387742B2 (en) * | 2012-04-06 | 2014-01-15 | 株式会社オートネットワーク技術研究所 | Plating member, plating terminal for connector, method for manufacturing plating member, and method for manufacturing plating terminal for connector |
JP5275504B1 (en) * | 2012-06-15 | 2013-08-28 | Jx日鉱日石金属株式会社 | METAL MATERIAL FOR ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD, CONNECTOR TERMINAL USING THE SAME, CONNECTOR AND ELECTRONIC COMPONENT |
WO2014017238A1 (en) * | 2012-07-25 | 2014-01-30 | Jx日鉱日石金属株式会社 | Metal material for electronic components, method for producing same, connector terminal using same, connector and electronic component |
WO2014199547A1 (en) * | 2013-06-10 | 2014-12-18 | オリエンタル鍍金株式会社 | Method for producing plated laminate, and plated laminate |
US20150079421A1 (en) * | 2013-09-19 | 2015-03-19 | Tyco Electronics Amp Gmbh | Electrical component and method for fabricating same |
JP6247926B2 (en) | 2013-12-19 | 2017-12-13 | 古河電気工業株式会社 | MATERIAL FOR MOVEABLE CONTACT PARTS AND METHOD FOR MANUFACTURING THE SAME |
JP6380174B2 (en) * | 2015-03-10 | 2018-08-29 | 三菱マテリアル株式会社 | Silver plated copper terminal material and terminal |
JP6484844B2 (en) * | 2015-03-27 | 2019-03-20 | オリエンタル鍍金株式会社 | Silver plating material and method for producing the same |
JP6825360B2 (en) * | 2016-12-27 | 2021-02-03 | 三菱マテリアル株式会社 | Plated copper terminal material and terminals |
WO2018138928A1 (en) * | 2017-01-30 | 2018-08-02 | Jx金属株式会社 | Surface-treated plated material, connector terminal, connector, ffc terminal, ffc, fpc and electronic component |
JP7121881B2 (en) * | 2017-08-08 | 2022-08-19 | 三菱マテリアル株式会社 | Terminal material with silver film and terminal with silver film |
CN110825439B (en) | 2018-08-10 | 2021-03-09 | 北京百度网讯科技有限公司 | Information processing method and processor |
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- 2021-01-28 EP EP21757568.7A patent/EP4108811A4/en active Pending
- 2021-01-28 KR KR1020227028716A patent/KR20220142450A/en unknown
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- 2021-01-28 CN CN202180014686.8A patent/CN115103932A/en active Pending
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EP4108811A4 (en) | 2024-03-06 |
US20230111976A1 (en) | 2023-04-13 |
KR20220142450A (en) | 2022-10-21 |
WO2021166581A1 (en) | 2021-08-26 |
JP2021130856A (en) | 2021-09-09 |
US11761109B2 (en) | 2023-09-19 |
CN115103932A (en) | 2022-09-23 |
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