EP4061643B1 - Method for producing banknotes having at least one integrated circuit - Google Patents
Method for producing banknotes having at least one integrated circuit Download PDFInfo
- Publication number
- EP4061643B1 EP4061643B1 EP20797063.3A EP20797063A EP4061643B1 EP 4061643 B1 EP4061643 B1 EP 4061643B1 EP 20797063 A EP20797063 A EP 20797063A EP 4061643 B1 EP4061643 B1 EP 4061643B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- banknotes
- band
- relevant
- integrated circuits
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000000034 method Methods 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 33
- 239000011888 foil Substances 0.000 claims description 23
- 238000007639 printing Methods 0.000 claims description 22
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 7
- 238000003698 laser cutting Methods 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 7
- 238000007641 inkjet printing Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 59
- 238000004049 embossing Methods 0.000 description 23
- 230000008901 benefit Effects 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 238000004080 punching Methods 0.000 description 6
- 239000013039 cover film Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 239000011104 metalized film Substances 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000012432 intermediate storage Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/305—Associated digital information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
- B42D25/29—Securities; Bank notes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/351—Translucent or partly translucent parts, e.g. windows
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/378—Special inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/43—Marking by removal of material
- B42D25/435—Marking by removal of material using electromagnetic radiation, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/43—Marking by removal of material
- B42D25/44—Marking by removal of material using mechanical means, e.g. engraving
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/455—Associating two or more layers using heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/46—Associating two or more layers using pressure
Definitions
- the invention relates to a method for producing banknotes, each with at least one integrated circuit according to claim 1.
- a standard paper banknote comprising a paper-based substrate having at least one integrated circuit attached to or embedded in the paper-based substrate as an active identification and / or authentication element of the banknote, the integrated circuit carrying out the storage and the exchanging information regarding the banknote in a secure manner, wherein the integrated circuit is inserted into an opening of the paper-based substrate, the thickness of the integrated circuit corresponding to the thickness of the paper-based substrate and being less than 100 ⁇ m.
- a method for hot embossing at least part of at least one band-shaped embossing foil onto a band-shaped substrate wherein the substrate to be embossed is brought together with an embossing film of the at least one embossing film, the substrate and the embossing film resting on it are guided along the circumference of a first heated embossing roller, wherein in a first embossing the substrate and the embossing film resting on it are guided through at least one on the circumference of the first pressure roller arranged on the first embossing roller are pressed against each other and against the heated surface of the first embossing roller and a first embossing layer is embossed on the substrate, the simply embossed substrate is moved away from the first embossing roller and, based on the running direction of the substrate after the first embossing roller, in turn with the same or a further embossing foil of at
- a method for producing a security paper comprising the steps: a) forming a paper web on a paper screen, and b) embedding a plastic film with antenna structures in the paper web during sheet formation, the plastic film being a net-like structured plastic film network.
- the sheet material has at least one circuit, energy and/or data being transmitted from the device to the circuit and/or from the circuit to the device, and at least some of the transmitted data being used for processing the sheet material.
- the invention is based on the object of creating a method for producing banknotes, each with at least one integrated circuit, which can be carried out economically in an industrial process.
- banknotes each with at least one integrated circuit
- a further advantage of the solution found is that banknotes with an integrated circuit inserted in a breakthrough are more durable and hard-wearing in use than banknotes with an integrated circuit applied to the surface, especially if the height of the integrated circuit is lower as the thickness or material thickness of the substrate of the banknote in question.
- an integrated circuit designed as a capacitively coupled RFID tag does not require a separate antenna.
- Fig. 1 illustrates by way of example that security documents required in large quantities, in particular banknotes 02, are usually produced in an industrial process for production use.
- the use of the benefit technology means that in the manufacturing process on a printed sheet 01 or on a material web several banknotes 02 are arranged in a composite consisting of rows R and columns S and these banknotes 02 are only removed from this composite and thereby separated at the end of their production .
- Each of these banknotes 02 produced in production form an independent product at the end of the manufacturing process after separation, but a large number of these mostly identical products are manufactured together on the printed sheet 01 or on the material web in order to optimally use the area of the printed sheet 01 or the material web and thereby enable cost-effective mass production.
- the banknotes 02 generally have a substrate 18 ( Fig. 4 ) e.g. B. made of paper or plastic, in particular made of a polymer material, this substrate 18 preferably being printed using several different printing methods in one or more printing machines.
- the printing process used is e.g. B. an offset printing process and / or a gravure printing process, in particular the intaglio printing process, and / or a screen printing process and / or an inkjet printing process is used.
- the banknotes 02 arranged in columns S on the printed sheet 01 or on the material web are usually longitudinal to the transport direction of the respective banknotes through the respective banknotes Printing machine guided printing sheet 01 or the material web is arranged, whereas the banknotes 02 arranged in rows R are usually arranged transversely to this transport direction.
- a breakthrough 03 is first formed in at least several or preferably in each of these banknotes 02, breaking through the substrate 18 of the relevant printed sheet 01 or the relevant material web, with such a breakthrough 03 often also called a window or opening.
- the breakthrough 03 is formed z. B. by punching or cutting, in particular by laser cutting, whereby the contour of the relevant opening 03 can be of any design, but is usually in the form of a circle or a rectangle.
- Fig. 2 shows an example of a single copy of such a banknote 02.
- each of the integrated circuits 04 to be embedded in one of the banknotes 02 is each encapsulated in its own housing and is therefore designed as an independent component.
- each of the integrated circuits 04 to be embedded in one of the banknotes 02 is designed as a microchip.
- Each of these integrated circuits 04 has a generally rectangular format, in particular a square area with an edge length l04 of a maximum of 1 mm ⁇ 1 mm, preferably 0.5 mm ⁇ 0.5 mm, with the overall height or thickness of these integrated circuits to be embedded Circuits 04 is a maximum of 90 ⁇ m and is preferably in a range between 25 ⁇ m and 50 ⁇ m and is therefore less than that Material thickness from the substrate 18 of the relevant banknote 02.
- the breakthrough 03 to be formed in the relevant banknote 02 is adapted to the format of the relevant integrated circuit 04 to be embedded and its respective extent is z. B. between 10% and 100% larger than the respective edge length l04 of the integrated circuit to be embedded.
- a center of the relevant opening 03 and thus its position in the relevant banknote 02 is with reference z. B. on at least one boundary line, e.g. B. an edge or a side edge of the relevant printed sheet 01 or the material web z. B. each by corresponding coordinates x; y set.
- These coordinates x; y are z. B. stored in a control computer, this control computer having the relevant coordinates x; y for each of the banknotes 02 produced in the relevant production panel at least z. B. on the one hand, a cutting device 09 or punching device 28 which forms the respective opening 03 ( Fig. 4 ) and on the other hand a device providing the respective integrated circuits 04.
- the required amount of integrated circuits 04 is arranged in register on a band-shaped film 06 by the device providing the respective integrated circuits 04.
- a register-containing arrangement means that one of the integrated circuits 04 is arranged at exactly those positions on the band-shaped film 06 that correspond to the corresponding coordinates x; y correspond to defined positions for the arrangement of the respective integrated circuit 04.
- the arrangement of the integrated circuits 04 on the band-shaped film 06 in the side register and in the circumferential register corresponds exactly to the arrangement that is intended on the relevant printed sheet 01 or the material web.
- the band-shaped film 06 is preferably provided in the form of a material roll 07 and unwound from the material roll 07, the supplied integrated circuits 04 then being in the correct position on the unwound part of the material roll 07, ie on the band-shaped film 06 and thus be arranged in register.
- the supply of the integrated circuits 04 to the band-shaped film 06 can z. B. supported by blown air.
- the integrated circuits 04 are fixed on the band-shaped film 06, for example. B. electrostatically and/or adhesively. After the integrated circuits 04 have been adhesively arranged on the band-shaped film 06, this can be used again, for example. B. be wound on a spool 08.
- the band-shaped film 06 wound on the reel 08 is unwound again from the reel 08, the integrated circuits 04 arranged in register on the band-shaped film 06 being moved from the band-shaped film 06 to the respective ones on the relevant printed sheet 01 or banknotes 02 formed on the material web in question are transferred, one of the integrated circuits 04 being arranged in the openings 03 formed in the banknotes 02 through this transfer carried out in the second method step.
- FIG. 4 The application of the integrated circuits 04 in the banknotes 02 is illustrated Fig. 4 , where in the Fig. 4
- the application in particular the arrangement of integrated circuits 04 in the respective openings 03 of printed sheets 01 conveyed in the transport direction T, is shown, each of these printed sheets 01 having a length l01 in the transport direction T.
- several of these printed sheets 01 are fed from a first stack 24 at a distance a sequentially in the transport direction T to a device 12 for applying the integrated circuits 04 and then stored again in a second stack 26 after application has been completed.
- at least some processing steps are combined locally, ie carried out in the same machine arrangement, in order to avoid intermediate storage of the printed sheets 01.
- the printed sheets 01 or the material web are preferably fed continuously from the first stack 24 to a cutting device 09 or a punching device 28, with this cutting device 09 or punching device 28 being used to form the openings 03 in the relevant printed sheet 01 or the material web.
- the printed sheets 01 provided with the openings 03 or the material web are preferably in the same machine arrangement of the z.
- a device 12 having a pair of rollers for applying the integrated circuits 04 which transfers the integrated circuits 04 arranged on the band-shaped film 06 from the band-shaped film 06 to the relevant banknote 02 in a nip of the interacting rollers 13, with this transfer in each case one of the integrated circuits 04 is arranged in the openings 03 formed in the banknotes 02.
- This application is preferably carried out simultaneously for all integrated circuits 04 arranged in the same row R. Because the banknotes 02 are included in the manufacturing benefit several columns S arranged next to one another are produced and so that several banknotes 02 are arranged in each row R, which extends over several columns S, a very high mass throughput can be achieved here in comparison to serial processing of individual banknotes 02. At least at the transfer point 11 located in the nip, the transport speed of the z. B. band-shaped film 06 to be unwound from the reel 08 is synchronized with the transport speed of the printed sheets 01 or the material web.
- the band-shaped film 06 is connected to the substrate 18 of the banknotes 02 of the relevant printed sheet 01 or the relevant material web.
- the band-shaped film 06, on which the integrated circuits 04 are arranged in register in the first process step is designed as a double-layer film, with one being formed when the second process step is carried out or immediately after the second process step is carried out first layer 16 of the band-shaped film 06 is connected to the substrate 18 of the banknotes 02 of the relevant printed sheet 01 or the relevant material web.
- the band-shaped film 06 or its first layer 16 is connected to the substrate 18 of the banknotes 02 of the relevant printed sheet 01 or the relevant material web, for example.
- the band-shaped film 06 or the first layer 16 of the double-layered band-shaped film 06 is preferably each designed as a film having a hologram and / or a kinegram, with a second layer 17 of the double-layered band-shaped film 06 z.
- B. is made of paper or a plastic.
- a kinegram is a security element with a tilting effect, which means that a defined film-like sequence takes place depending on the angle at which the kinegram is viewed.
- a usually shiny silver kinegram represents a two-dimensional movement sequence.
- a metallic film or a metallized film or a security film to be arranged on the substrate 18 of the banknotes 02 is used.
- the second layer 17 forms z. B. for reasons of tear strength and / or stability and / or processability a carrier for the first layer 16.
- this film consists, for. B. made of aluminum or another metallic material or this film has a carrier z. B. made of a plastic, the surface of which z. B. has been metallized by vapor deposition of a metal.
- the integrated circuits 04 to be applied adhere to the band-shaped film 06 or to the first layer 16 of the double-layered band-shaped film 06.
- the connection of the band-shaped film 06 or its first layer 16 with the substrate 18 of the banknotes 02 of the relevant printed sheet 01 or the relevant material web is z. B. produced by rolling or hot stamping.
- the band-shaped film 06 or its first layer 16 is applied to the substrate 18 of the relevant printed sheet 01 or the relevant material web under the influence of pressure and heat.
- the two layers 16; 17 of the double-layered band-shaped film 06 are preferably separated from one another at the transfer point 11 or immediately afterwards, with the second layer 17 again z. B. is wound on another spool 14.
- the integrated circuits 04 applied or arranged in the respective openings 03 are fixed there.
- This fixation takes place e.g. B. using a printing process, in particular an inkjet printing process or a screen printing process, and / or by rolling or hot stamping a cover film onto the substrate 18 of the banknotes 02 in question.
- Fig. 5 shows that with an inkjet printing device 19 there is no electrical conductive pressure fluid 21, e.g. B. an ink or a varnish, is applied to the integrated circuit 04 arranged in one of the openings 03, the integrated circuit 04 being fixed in the relevant opening 03 by drying and / or curing of the printing fluid 21.
- FIG. 6 illustrates by way of example that an electrically non-conductive printing fluid 21 is applied to the integrated circuit 04 arranged in one of the openings 03 and thus into these openings 03 using a screen printing device 22, whereby here too the integrated circuit is formed by drying and/or hardening of the printing fluid 21 04 is fixed in the relevant opening 03.
- the integrated circuits 04 arranged in the openings 03 can be fixed by applying an electrically non-conductive cover film 23 to the relevant banknotes 02, in particular with a rolling device 27, optionally additionally rolled under the influence of heat, which in the Fig. 7 shown schematically and in a very simplified manner.
- the integrated circuits 04 After the integrated circuits 04 have been applied or arranged and fixed in the relevant openings 03 of the banknotes 02, several of the printed sheets 01 or the material web, which each have the copies of the banknotes 02 to be produced in the production unit, are usually used in at least one printing press or using printed by at least one printing process and then with a punching device or with a cutting device, e.g. B. with a plan cutter, separated from their assembly and thereby isolated.
- a punching device or with a cutting device e.g. B. with a plan cutter
- At least two, preferably all, of the aforementioned method steps can be carried out inline, ie the first method step of arranging the integrated circuits 04 in the correct position or in register on the band-shaped film 06 and/or the second method step of applying or arranging the integrated circuits Circuits 04 in the openings 03 of the banknotes 02 and/or the third method step of fixing the banknotes in the openings 03 arranged integrated circuits 04 and / or the printing of the printed sheets 01 containing the banknotes 02 or the printing of the material web containing the banknotes 02 and / or the separation of the copies of the banknotes 02 produced in the production panel are preferably carried out in the same production machine, in particular in one used in value printing Rotary printing machine.
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Business, Economics & Management (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
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Description
Die Erfindung betrifft ein Verfahren zur Herstellung von Banknoten mit jeweils mindestens einer integrierten Schaltung gemäß Anspruch 1.The invention relates to a method for producing banknotes, each with at least one integrated circuit according to claim 1.
Durch die
Durch die
- bei dem eine Trägerfolie mit mehreren darauf angeordneten und einander zugeordneten elektronischen Bauelementen einer Bilderfassungseinrichtung zugeführt wird, durch welche zumindest die Position von einem elektronischen Bauelement als Nutzen erfasst wird,
- bei dem eine auf der Trägerfolie aufzubringende lasersensitive Ausgleichsfolie zunächst einer Laserschneideinrichtung zugeführt wird,
- bei dem die durch die Bilderfassungseinrichtung erfassten Daten über die Position des jeweiligen elektronischen Bauelementes auf der Trägerfolie an die Laserschneideinrichtung übermittelt werden und die Laserschneideinrichtung zur Herstellung von Aussparungen, die an die jeweilige Position der elektronischen Bauelemente angepasst sind, angesteuert wird,
- bei dem die Ausgleichsfolie mit den daran eingebrachten Aussparungen und das Trägermaterial in einer Zusammenführstation zusammengeführt und passergenau zueinander ausgerichtet zu einem Inlay fixiert werden,
- bei dem mit der Laserschneideinrichtung zur Herstellung der Aussparungen, mit einer weiteren Laserschneideinrichtung oder mit einer Markierungseinrichtung für jeden Nutzen oder eine Gruppe von Nutzen eine Steuermarke auf die Ausgleichsfolie in Abhängigkeit von der jeweiligen erfassten Position des elektronischen Bauelementes auf der Trägerfolie aufgebracht wird.
- in which a carrier film with several electronic components arranged thereon and assigned to one another is fed to an image capture device, through which at least the position of one electronic component is recorded as a benefit,
- in which a laser-sensitive compensation film to be applied to the carrier film is first fed to a laser cutting device,
- in which the data recorded by the image capture device about the position of the respective electronic component on the carrier film is transmitted to the laser cutting device and the laser cutting device is used Production of recesses that are adapted to the respective position of the electronic components is controlled,
- in which the compensation film with the recesses made on it and the carrier material are brought together in a merging station and aligned with each other to form an inlay,
- in which a control mark is applied to the compensation film for each benefit or a group of benefits using the laser cutting device for producing the recesses, with a further laser cutting device or with a marking device, depending on the respective detected position of the electronic component on the carrier film.
Durch die
- Transportieren einzelner Blätter nacheinander entlang eines Blatttransportweges,
- Aufbringen mindestens eines durchgehenden Bandes aus Folienmaterial auf die einzelnen Blätter entlang einer Richtung, die im Wesentlichen parallel zu einer Bewegungsrichtung der einzelnen Blätter ist, wodurch ein kontinuierlicher Strom von Blättern gebildet wird, die miteinander durch das mindestens eine kontinuierliche Band aus Folienmaterial verbunden sind,
- Schneiden des mindestens einen kontinuierlichen Bandes aus Folienmaterial, so dass der kontinuierliche Strom von Bögen in einzelne Bögen getrennt wird, wobei Teile des Folienmaterials auf den Bögen verbleiben, wobei das Schneiden an Positionen durchgeführt wird, die sich auf den Bögen befinden, so dass sich die auf den Bögen verbleibenden Abschnitte des Folienmaterials nicht über die vordere und hintere Kante der Bögen erstrecken.
- Transporting individual sheets one after the other along a sheet transport path,
- applying at least one continuous band of film material to the individual sheets along a direction that is substantially parallel to a direction of movement of the individual sheets, thereby forming a continuous stream of sheets connected together by the at least one continuous band of film material,
- Cutting the at least one continuous band of film material so that the continuous stream of sheets is separated into individual sheets, with portions of the film material remaining on the sheets, the cutting being performed at positions located on the sheets so that the portions of film material remaining on the sheets do not extend beyond the leading and trailing edges of the sheets.
Durch die
Durch die
Durch die
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zur Herstellung von Banknoten mit jeweils mindestens einer integrierten Schaltung zu schaffen, welches in einem industriellen Prozess wirtschaftlich ausführbar ist.The invention is based on the object of creating a method for producing banknotes, each with at least one integrated circuit, which can be carried out economically in an industrial process.
Die Aufgabe wird erfindungsgemäß durch die Merkmale des Anspruches 1 gelöst. Die abhängigen Ansprüche betreffen vorteilhafte Weiterbildungen und/oder Ausgestaltungen der gefundenen Lösung.The object is achieved according to the invention by the features of claim 1. The dependent claims relate to advantageous developments and/or refinements of the solution found.
Die mit der Erfindung erzielbaren Vorteile bestehen insbesondere darin, dass Banknoten mit jeweils mindestens einer integrierten Schaltung in einem industriellen Prozess wirtschaftlich hergestellt werden können. Ein weiterer Vorteil der gefundenen Lösung besteht darin, dass Banknoten jeweils mit einer in einem Durchbruch eingesetzter integrierten Schaltung im Gebrauch haltbarer und strapazierfähiger sind als Banknoten mit einer auf der Oberfläche aufgebrachten integrierten Schaltung, und zwar insbesondere dann, wenn eine Bauhöhe der integrierten Schaltung geringer ist als die Dicke bzw. Materialstärke vom Substrat der betreffenden Banknote. Des Weiteren ist vorteilhaft, dass eine als ein kapazitiv gekoppeltes RFID-tag ausgebildete integrierte Schaltung keine separate Antenne benötigt. Weitere Vorteile sind aus der nachfolgenden Beschreibung ersichtlich.The advantages that can be achieved with the invention are, in particular, that banknotes, each with at least one integrated circuit, can be produced economically in an industrial process. A further advantage of the solution found is that banknotes with an integrated circuit inserted in a breakthrough are more durable and hard-wearing in use than banknotes with an integrated circuit applied to the surface, especially if the height of the integrated circuit is lower as the thickness or material thickness of the substrate of the banknote in question. Furthermore, it is advantageous that an integrated circuit designed as a capacitively coupled RFID tag does not require a separate antenna. Further advantages can be seen from the following description.
Ein Ausführungsbeispiel der Erfindung ist in den Zeichnungen dargestellt und wird im Folgenden näher beschrieben.An exemplary embodiment of the invention is shown in the drawings and is described in more detail below.
Es zeigen:
- Fig. 1
- einen Druckbogen mit mehreren Banknoten;
- Fig. 2
- eine Banknote mit einer in einem Durchbruch angeordneten integrierten Schaltung;
- Fig. 3
- eine Anordnung zum positionsrichtigen Aufbringen von integrierten Schaltungen auf einer bandförmigen Folie;
- Fig. 4
- eine Vorrichtung zum Anordnen der integrierten Schaltungen in den betreffenden Durchbrüchen der Banknoten;
- Fig. 5
- eine Vorrichtung zum Fixieren der integrierten Schaltung in einem der Durchbrüche unter Verwendung eines Tintenstrahldruckverfahrens;
- Fig. 6
- eine Vorrichtung zum Fixieren der integrierten Schaltung in einem der Durchbrüche unter Verwendung eines Siebdruckverfahrens;
- Fig. 7
- eine Vorrichtung zum Fixieren der integrierten Schaltung in einem der Durchbrüche durch Aufwalzen einer Deckfolie.
- Fig. 1
- a printed sheet with several banknotes;
- Fig. 2
- a banknote with an integrated circuit arranged in an aperture;
- Fig. 3
- an arrangement for applying integrated circuits in the correct position on a strip-shaped film;
- Fig. 4
- a device for arranging the integrated circuits in the relevant openings of the banknotes;
- Fig. 5
- a device for fixing the integrated circuit in one of the breakthroughs using an inkjet printing process;
- Fig. 6
- a device for fixing the integrated circuit in one of the openings using a screen printing process;
- Fig. 7
- a device for fixing the integrated circuit in one of the openings by rolling on a cover film.
Die Banknoten 02 weisen i.d.R. ein Substrat 18 (
Zur Herstellung von Banknoten 02 mit jeweils mindestens einer integrierten elektronischen Schaltung 04 wird zunächst zumindest in mehreren oder vorzugsweise in jeder dieser Banknoten 02 jeweils ein das Substrat 18 des betreffenden Druckbogens 01 oder der betreffenden Materialbahn jeweils durchbrechender Durchbruch 03 ausgebildet, wobei ein solcher Durchbruch 03 oft auch als Fenster oder Öffnung bezeichnet wird. Die Ausbildung des Durchbruches 03 erfolgt z. B. durch Stanzen oder Schneiden, insbesondere durch Laserschneiden, wobei die Kontur des betreffenden Durchbruches 03 beliebig ausgebildet sein kann, jedoch zumeist in Form eines Kreises oder eines Rechteckes ausgebildet ist.
Jede der in einer der Banknoten 02 einzubettenden integrierten Schaltungen 04 ist jeweils in einem eigenen Gehäuse gekapselt und somit jeweils als ein eigenständiges Bauteil ausgebildet. Somit ist jede der in einer der Banknoten 02 einzubettenden integrierten Schaltungen 04 jeweils als ein Mikrochip ausgebildet. In der hier bevorzugten Ausführung ist die in der betreffenden Banknote 02 einzubettende integrierte Schaltung 04 als ein RFID-tag (englisch: "radio-frequency identification" und englisch: "tag" = Etikett; deutsch: Funketikett), insbesondere als ein kapazitiv gekoppeltes RFID-tag ausgebildet, wobei ein Datenaustausch zwischen der betreffenden integrierten Schaltung 04 und einer nicht dargestellten externen Sende- und/oder Empfangseinrichtung berührungslos erfolgt. Jede dieser integrierten Schaltungen 04 weist jeweils ein i.d.R. rechteckiges Format, insbesondere eine quadratische Fläche mit einer Kantenlänge l04 von maximal 1 mm × 1 mm, vorzugsweise von 0,5 mm × 0,5 mm auf, wobei die Bauhöhe bzw. Dicke dieser einzubettenden integrierten Schaltungen 04 maximal 90 µm beträgt und vorzugsweise in einem Bereich zwischen 25 µm und 50 µm liegt und damit geringer ist als die Materialstärke vom Substrat 18 der betreffenden Banknote 02. Der in der betreffenden Banknote 02 auszubildende Durchbruch 03 ist dem Format der betreffenden einzubettenden integrierten Schaltung 04 angepasst und in seiner jeweiligen Ausdehnung z. B. zwischen 10% und 100% größer als die jeweilige Kantenlänge l04 der einzubettenden integrierten Schaltung ausgebildet. In der jeweiligen integrierten Schaltung 04 sind bzw. wird eine Information z. B. über die Währung und/oder den Wert der betreffenden Banknote 02 und/oder eine Information über die ausgebende Bank dieser Banknote 02 z. B. durch eine entsprechende Programmierung gespeichert, die andernorts mittels der nicht dargestellten externen Sende- und/oder Empfangseinrichtung berührungslos auslesbar ist. Auch kann in der integrierten Schaltung 04 eine Information darüber gespeichert werden, ob diese Banknote 02 bereits in den Verkehr gebracht worden ist oder wann dies erfolgte.Each of the
Im Folgenden wird lediglich der Einfachheit halber und ohne Einschränkung der Erfindung davon ausgegangen, dass im Fertigungsnutzen gleichartige Banknoten 02 hergestellt werden, so dass der jeweilige Durchbruch 03 in jeder dieser Banknoten 02 jeweils mit Bezug auf die betreffende Banknote 02 jeweils an einer gleichen Position ausgebildet ist. Ein Zentrum des betreffenden Durchbruches 03 und damit seine Position in der betreffenden Banknote 02 ist mit Bezug z. B. auf mindestens eine Begrenzungslinie, z. B. eine Kante oder einen Seitenrand des betreffenden Druckbogens 01 oder der Materialbahn z. B. jeweils durch entsprechende Koordinaten x; y festgelegt. Diese Koordinaten x; y sind z. B. in einem Steuerrechner gespeichert, wobei dieser Steuerrechner die betreffenden Koordinaten x; y für jede der in dem betreffenden Fertigungsnutzen hergestellten Banknoten 02 zumindest z. B. einerseits einer jeweils den betreffenden Durchbruch 03 ausbildenden Schneideeinrichtung 09 oder Stanzeinrichtung 28 (
Um in einem industriellen Prozess jeweils eine integrierte Schaltung 04 in den betreffenden Durchbrüchen 03 der gemeinsam herzustellenden Banknoten 02 anzuordnen, wird in einem ersten Verfahrensschritt die erforderliche Menge an integrierten Schaltungen 04 durch die die jeweiligen integrierten Schaltungen 04 bereitstellende Vorrichtung auf einer bandförmigen Folie 06 registerhaltig angeordnet. Eine registerhaltige Anordnung bedeutet, dass jeweils eine der integrierten Schaltungen 04 jeweils genau an solchen Positionen auf der bandförmigen Folie 06 angeordnet wird, die den auf dem betreffenden Druckbogen 01 oder der Materialbahn jeweils durch die entsprechenden Koordinaten x; y festgelegten Positionen für die Anordnung der jeweiligen integrierten Schaltung 04 entsprechen. Damit entspricht die Anordnung der integrierten Schaltungen 04 auf der bandförmigen Folie 06 im Seitenregister und im Umfangsregister genau derjenigen Anordnung, die auf dem betreffenden Druckbogen 01 oder der Materialbahn beabsichtigt ist.In order to have an integrated
Wie in der
In einem zweiten Verfahrensschritt wird die gemäß dem genannten Beispiel auf der Spule 08 aufgewickelte bandförmige Folie 06 wieder von der Spule 08 abgewickelt, wobei die auf der bandförmigen Folie 06 registerhaltig angeordneten integrierten Schaltungen 04 von der bandförmigen Folie 06 auf die jeweiligen auf dem betreffenden Druckbogen 01 oder der betreffenden Materialbahn ausgebildeten Banknoten 02 übertragen werden, wobei durch diese im zweiten Verfahrensschritt ausgeführte Übertragung jeweils eine der integrierten Schaltungen 04 in den in den Banknoten 02 ausgebildeten Durchbrüchen 03 angeordnet wird.In a second process step, the band-shaped
Die Applizierung der integrierten Schaltungen 04 in den Banknoten 02 veranschaulicht
Mit dem Ausführen des zweiten Verfahrensschrittes oder unmittelbar nach dem Ausführen des zweiten Verfahrensschrittes wird die bandförmige Folie 06 mit dem Substrat 18 der Banknoten 02 des betreffenden Druckbogens 01 oder der betreffenden Materialbahn verbunden. In einer bevorzugten Ausführungsform zur Herstellung von Banknoten 02 ist die bandförmige Folie 06, auf welcher die integrierten Schaltungen 04 im ersten Verfahrensschritt registerhaltig angeordnet werden, als eine doppellagige Folie ausgebildet, wobei mit dem Ausführen des zweiten Verfahrensschrittes oder unmittelbar nach dem Ausführen des zweiten Verfahrensschrittes eine erste Lage 16 der bandförmigen Folie 06 mit dem Substrat 18 der Banknoten 02 des betreffenden Druckbogens 01 oder der betreffenden Materialbahn verbunden wird. Das Verbinden der bandförmigen Folie 06 oder ihre erste Lage 16 jeweils mit dem Substrat 18 der Banknoten 02 des betreffenden Druckbogens 01 oder der betreffenden Materialbahn erfolgt z. B. stoffschlüssig, insbesondere durch eine Klebung. Die bandförmige Folie 06 oder die erste Lage 16 der doppellagig ausgebildeten bandförmigen Folie 06 ist vorzugsweise jeweils als eine ein Hologramm und/oder ein Kinegramm aufweisende Folie ausgebildet, wobei eine zweite Lage 17 der doppellagig ausgebildeten bandförmigen Folie 06 z. B. aus Papier oder aus einem Kunststoff ausgebildet ist. Ein Kinegramm ist ein Sicherheitselement mit einem Kippeffekt, was bedeutet, dass je nach dem Winkel der Betrachtung des Kinegramms ein fest definierter filmähnlicher Ablauf stattfindet. Anders als beim Hologramm, das dreidimensionale Elemente besitzt, stellt ein meist silbrig glänzendes Kinegramm einen zweidimensionalen Bewegungsablauf dar. Als bandförmige Folie 06 oder als erste Lage 16 der doppellagig ausgebildeten bandförmigen Folie 06 wird jeweils insbesondere eine metallische Folie oder eine metallisierte Folie oder eine auf dem Substrat 18 der Banknoten 02 anzuordnende Sicherheitsfolie verwendet. Die zweite Lage 17 bildet z. B. aus Gründen der Reißfestigkeit und/oder Stabilität und/oder Verarbeitbarkeit einen Träger für die erste Lage 16. Wenn die bandförmige Folie 06 oder ihre erste Lage 16 als eine metallische Folie oder als eine metallisierte Folie ausgebildet ist, besteht diese Folie z. B. aus Aluminium oder aus einem anderen metallischen Werkstoff oder diese Folie weist einen Träger z. B. aus einem Kunststoff auf, dessen Oberfläche z. B. durch Aufdampfen eines Metalls metallisiert worden ist. Bei jeder dieser Ausführungsformen haften die zu applizierenden integrierten Schaltungen 04 an der bandförmigen Folie 06 oder an der ersten Lage 16 der doppellagig ausgebildeten bandförmigen Folie 06. Es besteht jedoch keine elektrisch leitende Verbindung zwischen der jeweiligen integrierten Schaltung 04 und der metallischen Folie 06 oder der metallisierten Oberfläche dieser Folie 06. Die Verbindung der bandförmigen Folie 06 oder ihrer ersten Lage 16 jeweils mit dem Substrat 18 der Banknoten 02 des betreffenden Druckbogens 01 oder der betreffenden Materialbahn wird z. B. durch ein Aufwalzen oder durch Heißprägen hergestellt. Beim Heißprägen wird die bandförmige Folie 06 oder ihre erste Lage 16 unter Einwirkung von Druck und Hitze auf das Substrat 18 des betreffenden Druckbogens 01 oder der betreffenden Materialbahn aufgebracht. Die beiden Lagen 16; 17 der doppellagig ausgebildeten bandförmigen Folie 06 werden vorzugsweise an der Übertragungsstelle 11 oder unmittelbar danach voneinander getrennt, wobei die zweite Lage 17 wieder z. B. auf einer weiteren Spule 14 aufgewickelt wird.When the second method step is carried out or immediately after the second method step is carried out, the band-shaped
In einem dritten Verfahrensschritt werden die in den jeweiligen Durchbrüchen 03 applizierten bzw. angeordneten integrierten Schaltungen 04 dort fixiert. Diese Fixierung erfolgt z. B. unter Verwendung eines Druckverfahrens, insbesondere eines Tintenstrahldruckverfahrens oder eines Siebdruckverfahrens, und/oder durch Aufwalzen oder durch Heißprägen einer Deckfolie auf das Substrat 18 der betreffenden Banknoten 02.
Nach der Applizierung bzw. Anordnung und Fixierung der integrierten Schaltungen 04 in den betreffenden Durchbrüchen 03 der Banknoten 02 werden i.d.R. mehrere der Druckbogen 01 oder die Materialbahn, die jeweils die im Fertigungsnutzen herzustellenden Exemplare der Banknoten 02 aufweisen, in mindestens einer Druckmaschine bzw. unter Verwendung von mindestens einem Druckverfahren bedruckt und danach mit einer Stanzeinrichtung oder mit einer Schneideeinrichtung, z. B. mit einem Planschneider, aus ihrem Verbund herausgetrennt und dadurch vereinzelt.After the
Bei der Herstellung von Banknoten 02 können mindestens zwei, vorzugsweise alle der vorgenannten Verfahrensschritte inline erfolgen, d. h. der erste Verfahrensschritt des positionsrichtigen bzw. registerhaltigen Anordnens der integrierten Schaltungen 04 auf der bandförmigen Folie 06 und/oder der zweite Verfahrensschritt des Applizierens bzw. Anordnens der integrierten Schaltungen 04 in den Durchbrüchen 03 der Banknoten 02 und/oder der dritte Verfahrensschritt des Fixierens der in den Durchbrüchen 03 angeordneten integrierten Schaltungen 04 und/oder das Bedrucken der die Banknoten 02 aufweisenden Druckbogen 01 oder das Bedrucken der die Banknoten 02 aufweisende Materialbahn und/oder das Vereinzeln der im Fertigungsnutzen hergestellten Exemplare der Banknoten 02 erfolgen vorzugsweise in derselben Produktionsmaschine, insbesondere in einer im Wertdruck verwendeten Rotationsdruckmaschine.When producing
- 0101
- DruckbogenPrint sheet
- 0202
- BanknoteBanknote
- 0303
- Durchbruchbreakthrough
- 0404
- integrierte Schaltungintegrated circuit
- 0505
- --
- 0606
- Foliefoil
- 0707
- MaterialrolleRoll of material
- 0808
- SpuleKitchen sink
- 0909
- SchneideeinrichtungCutting device
- 1010
- --
- 1111
- Übertragungsstelletransfer point
- 1212
- Vorrichtung zum Applizieren integrierter SchaltungenDevice for applying integrated circuits
- 1313
- Walzeroller
- 1414
- SpuleKitchen sink
- 1515
- --
- 1616
- Lage (erste)location (first)
- 1717
- Lage (zweite)location (second)
- 1818
- SubstratSubstrate
- 1919
- TintenstrahldruckeinrichtungInkjet printing device
- 2020
- --
- 2121
- DruckfluidPressurized fluid
- 2222
- SiebdruckeinrichtungScreen printing device
- 2323
- DeckfolieCover film
- 2424
- Stapel (erster)stack (first)
- 2525
- --
- 2626
- Stapel (zweiter)Stack (second)
- 2727
- WalzeinrichtungRolling device
- 2828
- StanzeinrichtungPunching device
- aa
- AbstandDistance
- l01l01
- Längelength
- l04l04
- KantenlängeEdge length
- RR
- ReiheRow
- SS
- SpalteSplit
- TT
- TransportrichtungTransport direction
- x; yx; y
- Koordinatencoordinates
Claims (15)
- Method for producing banknotes (02) including in each case at least one integrated circuit (04), the banknotes (02) being produced from a sheet (01) or from a material web in a production panel, at least in a plurality of or in each of these banknotes (02) an aperture (03) being created through their substrate (18), in each case an integrated circuit (04) being arranged in the relevant aperture (03), in a first method step each of the integrated circuits (04) to be arranged in one of the apertures (03) being arranged, with respect to the intended position in each of the banknotes (02) that includes an aperture (03), in the correct position on a band-shaped foil (06), and in a second method step each of these integrated circuits being transferred from this band-shaped foil (06) onto the relevant banknote (02), owing to this transfer that is carried out in the second method step one integrated circuit (04) in each case being arranged in the apertures (03) created in the banknotes (02) .
- Method according to claim 1, characterized in that the respective aperture (03) in each of the banknotes (02) is created in each case by die cutting or by laser cutting.
- Method according to claim 1 or 2, characterized in that each of the integrated circuits (04) to be arranged in one of the apertures (03) created in the relevant banknotes (02) is in each case configured as a microchip encapsulated in a dedicated housing, and/or in that in each case an RFID tag is used as the integrated circuit (04).
- Method according to claim 1 or 2 or 3, characterized in that each of the integrated circuits (04) to be arranged in one of the apertures (03) created in the relevant banknotes (02) in each case has a surface area having an edge length (104) of no more than 1 mm × 1 mm, and/or in that an integrated circuit (04) having a structural height of no more than 90 um is used, or in that an integrated circuit (04) having a structural height in the range between 25 um and 50 um is used.
- Method according to claim 1 or 2 or 3 or 4, characterized in that the aperture (03) in the relevant banknote (02) in its respective expansion is in each case configured to be between 10% and 100% greater than the respective edge length (104) of the relevant integrated circuit (04).
- Method according to claim 1 or 2 or 3 or 4 or 5, characterized in that, in the first method step, the integrated circuits (04) are arranged on the band-shaped foil (06) assisted by blower air, and/or in that, in the first method step, the integrated circuits (04) are fixed in their respective position on the band-shaped foil (06) electrostatically and/or by way of adhesion.
- Method according to claim 1 or 2 or 3 or 4 or 5 or 6, characterized in that, as the second method step is being carried out, or immediately after the second method step has been carried out, the band-shaped foil (06) is joined to the substrate (18) of the banknotes (02) of the relevant sheet (01) or of the relevant material web.
- Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7, characterized in that a two-layer foil is used as the band-shaped foil (06), as the second method step is being carried out, or immediately after the second method step has been carried out, a first layer (16) of the band-shaped foil (06) being joined to the substrate (18) of the banknotes (02) of the relevant sheet (01) or of the relevant material web, the integrated circuits (04) adhering to the first layer (16).
- Method according to claim 8, characterized in that a second layer (17) of the two-layer band-shaped foil (06) is made of paper or a plastic.
- Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9, characterized in that a foil including a hologram and/or a Kinegram is used as the band-shaped foil (06), and/or in that a metallic foil or a metallized foil is used as the band-shaped foil (06), and/or in that a security foil to be arranged on the substrate (18) of the banknotes (02) is used as the band-shaped foil (06).
- Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10, characterized in that, in a third method step, the integrated circuits (04) arranged in the respective apertures (03) are fixed therein, this fixation being carried out using a printing method.
- Method according to claim 11, characterized in that an electrically non-conducting printing fluid (21) is applied by way of the printing method, and/or in that an ink jet printing method or a screen printing method is used as the printing method.
- Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12, characterized in that, in the third method step, the integrated circuits (04) arranged in the respective apertures (03) are fixed therein, this fixation being carried out by rolling or hot stamping a cover foil (23) onto the substrate (18) of the relevant banknotes (02).
- Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13, characterized in that information about the currency and/or the value of the relevant banknote (02) and/or information about the issuing bank of this banknote (02) is stored in the integrated circuit (04), and/or in that information as to whether this banknote (02) was already brought into circulation, or when this took place, is stored in the integrated circuit (04).
- Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14, characterized in that at least two of the method steps to be carried out during the production of banknotes (02) including in each case at least one integrated circuit (04), namely the first method step of arranging the integrated circuits (04) in the correct position on the band-shaped foil (06) and/or the second method step of arranging the integrated circuits (04) in the apertures (03) of the banknotes (02) and/or the third method step of fixing the integrated circuits (04) arranged in the apertures (03) and/or printing the sheets (01) including the banknotes (02) or printing the material web including the banknotes (02) and/or singulating the copies of the banknotes (02) produced in the production panel, are in each case carried out inline in the same production machine.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019131654.5A DE102019131654B4 (en) | 2019-11-22 | 2019-11-22 | Process for producing banknotes each having at least one integrated circuit |
PCT/EP2020/079470 WO2021099049A1 (en) | 2019-11-22 | 2020-10-20 | Method for producing banknotes having at least one integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
EP4061643A1 EP4061643A1 (en) | 2022-09-28 |
EP4061643B1 true EP4061643B1 (en) | 2023-11-22 |
Family
ID=73014490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20797063.3A Active EP4061643B1 (en) | 2019-11-22 | 2020-10-20 | Method for producing banknotes having at least one integrated circuit |
Country Status (6)
Country | Link |
---|---|
US (1) | US11840111B2 (en) |
EP (1) | EP4061643B1 (en) |
JP (1) | JP7078806B1 (en) |
CN (1) | CN113840739B (en) |
DE (1) | DE102019131654B4 (en) |
WO (1) | WO2021099049A1 (en) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69722403T2 (en) * | 1997-09-23 | 2004-01-15 | St Microelectronics Srl | Banknote with an integrated circuit |
DE10032128A1 (en) * | 2000-07-05 | 2002-01-17 | Giesecke & Devrient Gmbh | Security paper and value document made from it |
FR2832354B1 (en) * | 2001-11-20 | 2004-02-20 | Arjo Wiggins Sa | PROCESS FOR MANUFACTURING AN ARTICLE COMPRISING A SHEET AND AT LEAST ONE ELEMENT REPORTED ON THIS SHEET |
DE10296058D2 (en) * | 2001-12-21 | 2004-12-09 | Giesecke & Devrient Gmbh | Sheet material and devices and methods for producing and processing the sheet material |
DE102004018081A1 (en) * | 2004-04-08 | 2005-10-27 | Giesecke & Devrient Gmbh | security paper |
JP2007011534A (en) * | 2005-06-29 | 2007-01-18 | Oji Paper Co Ltd | Sheet with built-in ic chip |
EP1961578A1 (en) * | 2007-02-26 | 2008-08-27 | Kba-Giori S.A. | Method and installation for applying foil material onto successive sheets |
DE102009032678A1 (en) * | 2009-07-09 | 2011-03-03 | Bundesdruckerei Gmbh | Method and device for producing an inlay for a film composite and film composite with inlay |
DE102011103000A1 (en) * | 2011-05-24 | 2012-11-29 | Leonhard Kurz Stiftung & Co. Kg | Method and apparatus for hot stamping |
DE102016015546A1 (en) * | 2016-12-27 | 2018-06-28 | Giesecke+Devrient Currency Technology Gmbh | Multilayer value document substrate |
-
2019
- 2019-11-22 DE DE102019131654.5A patent/DE102019131654B4/en active Active
-
2020
- 2020-10-20 WO PCT/EP2020/079470 patent/WO2021099049A1/en unknown
- 2020-10-20 EP EP20797063.3A patent/EP4061643B1/en active Active
- 2020-10-20 US US17/613,134 patent/US11840111B2/en active Active
- 2020-10-20 CN CN202080037093.9A patent/CN113840739B/en active Active
- 2020-10-20 JP JP2021569557A patent/JP7078806B1/en active Active
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CN113840739A (en) | 2021-12-24 |
CN113840739B (en) | 2022-08-02 |
JP2022530278A (en) | 2022-06-28 |
WO2021099049A1 (en) | 2021-05-27 |
US20220212492A1 (en) | 2022-07-07 |
DE102019131654B4 (en) | 2022-03-17 |
US11840111B2 (en) | 2023-12-12 |
EP4061643A1 (en) | 2022-09-28 |
JP7078806B1 (en) | 2022-05-31 |
DE102019131654A1 (en) | 2021-05-27 |
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