EP4061643B1 - Method for producing banknotes having at least one integrated circuit - Google Patents

Description

The invention relates to a method for producing banknotes, each with at least one integrated circuit according to claim 1.

Through the DE 697 22 403 T2 a standard paper banknote is known, comprising a paper-based substrate having at least one integrated circuit attached to or embedded in the paper-based substrate as an active identification and / or authentication element of the banknote, the integrated circuit carrying out the storage and the exchanging information regarding the banknote in a secure manner, wherein the integrated circuit is inserted into an opening of the paper-based substrate, the thickness of the integrated circuit corresponding to the thickness of the paper-based substrate and being less than 100 µm.

• bei dem eine Trägerfolie mit mehreren darauf angeordneten und einander zugeordneten elektronischen Bauelementen einer Bilderfassungseinrichtung zugeführt wird, durch welche zumindest die Position von einem elektronischen Bauelement als Nutzen erfasst wird,
• bei dem eine auf der Trägerfolie aufzubringende lasersensitive Ausgleichsfolie zunächst einer Laserschneideinrichtung zugeführt wird,
• bei dem die durch die Bilderfassungseinrichtung erfassten Daten über die Position des jeweiligen elektronischen Bauelementes auf der Trägerfolie an die Laserschneideinrichtung übermittelt werden und die Laserschneideinrichtung zur Herstellung von Aussparungen, die an die jeweilige Position der elektronischen Bauelemente angepasst sind, angesteuert wird,
• bei dem die Ausgleichsfolie mit den daran eingebrachten Aussparungen und das Trägermaterial in einer Zusammenführstation zusammengeführt und passergenau zueinander ausgerichtet zu einem Inlay fixiert werden,
• bei dem mit der Laserschneideinrichtung zur Herstellung der Aussparungen, mit einer weiteren Laserschneideinrichtung oder mit einer Markierungseinrichtung für jeden Nutzen oder eine Gruppe von Nutzen eine Steuermarke auf die Ausgleichsfolie in Abhängigkeit von der jeweiligen erfassten Position des elektronischen Bauelementes auf der Trägerfolie aufgebracht wird.

Through the WO 2011/003518 A1 a method for producing an inlay for a film composite is known, in particular for an inlay for further processing into a valuable or security document,

• in which a carrier film with several electronic components arranged thereon and assigned to one another is fed to an image capture device, through which at least the position of one electronic component is recorded as a benefit,
• in which a laser-sensitive compensation film to be applied to the carrier film is first fed to a laser cutting device,
• in which the data recorded by the image capture device about the position of the respective electronic component on the carrier film is transmitted to the laser cutting device and the laser cutting device is used Production of recesses that are adapted to the respective position of the electronic components is controlled,
• in which the compensation film with the recesses made on it and the carrier material are brought together in a merging station and aligned with each other to form an inlay,
• in which a control mark is applied to the compensation film for each benefit or a group of benefits using the laser cutting device for producing the recesses, with a further laser cutting device or with a marking device, depending on the respective detected position of the electronic component on the carrier film.

• Transportieren einzelner Blätter nacheinander entlang eines Blatttransportweges,
• Aufbringen mindestens eines durchgehenden Bandes aus Folienmaterial auf die einzelnen Blätter entlang einer Richtung, die im Wesentlichen parallel zu einer Bewegungsrichtung der einzelnen Blätter ist, wodurch ein kontinuierlicher Strom von Blättern gebildet wird, die miteinander durch das mindestens eine kontinuierliche Band aus Folienmaterial verbunden sind,
• Schneiden des mindestens einen kontinuierlichen Bandes aus Folienmaterial, so dass der kontinuierliche Strom von Bögen in einzelne Bögen getrennt wird, wobei Teile des Folienmaterials auf den Bögen verbleiben, wobei das Schneiden an Positionen durchgeführt wird, die sich auf den Bögen befinden, so dass sich die auf den Bögen verbleibenden Abschnitte des Folienmaterials nicht über die vordere und hintere Kante der Bögen erstrecken.

Through the EP 1 961 578 A1 a method for applying film material to successive sheets, in particular to sheets of securities, is known, comprising the steps:

• Transporting individual sheets one after the other along a sheet transport path,
• applying at least one continuous band of film material to the individual sheets along a direction that is substantially parallel to a direction of movement of the individual sheets, thereby forming a continuous stream of sheets connected together by the at least one continuous band of film material,
• Cutting the at least one continuous band of film material so that the continuous stream of sheets is separated into individual sheets, with portions of the film material remaining on the sheets, the cutting being performed at positions located on the sheets so that the portions of film material remaining on the sheets do not extend beyond the leading and trailing edges of the sheets.

Through the DE 10 2011 103 000 A1 a method for hot embossing at least part of at least one band-shaped embossing foil onto a band-shaped substrate is known, wherein the substrate to be embossed is brought together with an embossing film of the at least one embossing film, the substrate and the embossing film resting on it are guided along the circumference of a first heated embossing roller, wherein in a first embossing the substrate and the embossing film resting on it are guided through at least one on the circumference of the first pressure roller arranged on the first embossing roller are pressed against each other and against the heated surface of the first embossing roller and a first embossing layer is embossed on the substrate, the simply embossed substrate is moved away from the first embossing roller and, based on the running direction of the substrate after the first embossing roller, in turn with the same or a further embossing foil of at least one embossing foil is brought together, the simply embossed substrate and the embossing foil lying on it is guided along the circumference of a second heated embossing roller, wherein in a second embossing the substrate and the embossing film lying on it are pressed against each other and against the heated surface of the second embossing roller by at least one second pressure roller arranged on the circumference of the second embossing roller and a second embossing layer is placed on the Substrate is embossed, and the twice-embossed substrate is led away from the second embossing roller.

Through the DE 10 2004 018 081 A1 a method for producing a security paper is known, comprising the steps: a) forming a paper web on a paper screen, and b) embedding a plastic film with antenna structures in the paper web during sheet formation, the plastic film being a net-like structured plastic film network.

Through the US 2005/0150740 A1 a sheet material with a circuit and a device and a method for processing the same are known, which reduce the effort for processing the sheet material and / or facilitate and / or improve and / or make the processing more reliable. For this purpose, the sheet material has at least one circuit, energy and/or data being transmitted from the device to the circuit and/or from the circuit to the device, and at least some of the transmitted data being used for processing the sheet material.

The invention is based on the object of creating a method for producing banknotes, each with at least one integrated circuit, which can be carried out economically in an industrial process.

The object is achieved according to the invention by the features of claim 1. The dependent claims relate to advantageous developments and/or refinements of the solution found.

The advantages that can be achieved with the invention are, in particular, that banknotes, each with at least one integrated circuit, can be produced economically in an industrial process. A further advantage of the solution found is that banknotes with an integrated circuit inserted in a breakthrough are more durable and hard-wearing in use than banknotes with an integrated circuit applied to the surface, especially if the height of the integrated circuit is lower as the thickness or material thickness of the substrate of the banknote in question. Furthermore, it is advantageous that an integrated circuit designed as a capacitively coupled RFID tag does not require a separate antenna. Further advantages can be seen from the following description.

An exemplary embodiment of the invention is shown in the drawings and is described in more detail below.

Fig. 1

einen Druckbogen mit mehreren Banknoten;

Fig. 2

eine Banknote mit einer in einem Durchbruch angeordneten integrierten Schaltung;

Fig. 3

eine Anordnung zum positionsrichtigen Aufbringen von integrierten Schaltungen auf einer bandförmigen Folie;

Fig. 4

eine Vorrichtung zum Anordnen der integrierten Schaltungen in den betreffenden Durchbrüchen der Banknoten;

Fig. 5

eine Vorrichtung zum Fixieren der integrierten Schaltung in einem der Durchbrüche unter Verwendung eines Tintenstrahldruckverfahrens;

Fig. 6

eine Vorrichtung zum Fixieren der integrierten Schaltung in einem der Durchbrüche unter Verwendung eines Siebdruckverfahrens;

Fig. 7

eine Vorrichtung zum Fixieren der integrierten Schaltung in einem der Durchbrüche durch Aufwalzen einer Deckfolie.

Show it:

Fig. 1

a printed sheet with several banknotes;

Fig. 2

a banknote with an integrated circuit arranged in an aperture;

Fig. 3

an arrangement for applying integrated circuits in the correct position on a strip-shaped film;

Fig. 4

a device for arranging the integrated circuits in the relevant openings of the banknotes;

Fig. 5

a device for fixing the integrated circuit in one of the breakthroughs using an inkjet printing process;

Fig. 6

a device for fixing the integrated circuit in one of the openings using a screen printing process;

Fig. 7

a device for fixing the integrated circuit in one of the openings by rolling on a cover film.

Fig. 1 illustrates by way of example that security documents required in large quantities, in particular banknotes 02, are usually produced in an industrial process for production use. The use of the benefit technology means that in the manufacturing process on a printed sheet 01 or on a material web several banknotes 02 are arranged in a composite consisting of rows R and columns S and these banknotes 02 are only removed from this composite and thereby separated at the end of their production . Each of these banknotes 02 produced in production form an independent product at the end of the manufacturing process after separation, but a large number of these mostly identical products are manufactured together on the printed sheet 01 or on the material web in order to optimally use the area of the printed sheet 01 or the material web and thereby enable cost-effective mass production.

The banknotes 02 generally have a substrate 18 ( Fig. 4 ) e.g. B. made of paper or plastic, in particular made of a polymer material, this substrate 18 preferably being printed using several different printing methods in one or more printing machines. The printing process used is e.g. B. an offset printing process and / or a gravure printing process, in particular the intaglio printing process, and / or a screen printing process and / or an inkjet printing process is used. The banknotes 02 arranged in columns S on the printed sheet 01 or on the material web are usually longitudinal to the transport direction of the respective banknotes through the respective banknotes Printing machine guided printing sheet 01 or the material web is arranged, whereas the banknotes 02 arranged in rows R are usually arranged transversely to this transport direction.

To produce banknotes 02, each with at least one integrated electronic circuit 04, a breakthrough 03 is first formed in at least several or preferably in each of these banknotes 02, breaking through the substrate 18 of the relevant printed sheet 01 or the relevant material web, with such a breakthrough 03 often also called a window or opening. The breakthrough 03 is formed z. B. by punching or cutting, in particular by laser cutting, whereby the contour of the relevant opening 03 can be of any design, but is usually in the form of a circle or a rectangle. Fig. 2 shows an example of a single copy of such a banknote 02.

Each of the integrated circuits 04 to be embedded in one of the banknotes 02 is each encapsulated in its own housing and is therefore designed as an independent component. Thus, each of the integrated circuits 04 to be embedded in one of the banknotes 02 is designed as a microchip. In the embodiment preferred here, the integrated circuit 04 to be embedded in the relevant banknote 02 is as an RFID tag (English: "radio-frequency identification" and English: "tag" = label; German: radio label), in particular as a capacitively coupled RFID -tag is formed, with data exchange between the relevant integrated circuit 04 and an external transmitting and / or receiving device, not shown, taking place without contact. Each of these integrated circuits 04 has a generally rectangular format, in particular a square area with an edge length l04 of a maximum of 1 mm × 1 mm, preferably 0.5 mm × 0.5 mm, with the overall height or thickness of these integrated circuits to be embedded Circuits 04 is a maximum of 90 µm and is preferably in a range between 25 µm and 50 µm and is therefore less than that Material thickness from the substrate 18 of the relevant banknote 02. The breakthrough 03 to be formed in the relevant banknote 02 is adapted to the format of the relevant integrated circuit 04 to be embedded and its respective extent is z. B. between 10% and 100% larger than the respective edge length l04 of the integrated circuit to be embedded. In the respective integrated circuit 04 there is or is information e.g. B. about the currency and / or the value of the relevant banknote 02 and / or information about the issuing bank of this banknote 02 z. B. stored by appropriate programming, which can be read out elsewhere without contact using the external transmitting and / or receiving device, not shown. Information about whether this banknote 02 has already been put into circulation or when this took place can also be stored in the integrated circuit 04.

In the following, for the sake of simplicity and without restricting the invention, it is assumed that similar banknotes 02 are produced in the production unit, so that the respective opening 03 in each of these banknotes 02 is formed at the same position with respect to the relevant banknote 02 . A center of the relevant opening 03 and thus its position in the relevant banknote 02 is with reference z. B. on at least one boundary line, e.g. B. an edge or a side edge of the relevant printed sheet 01 or the material web z. B. each by corresponding coordinates x; y set. These coordinates x; y are z. B. stored in a control computer, this control computer having the relevant coordinates x; y for each of the banknotes 02 produced in the relevant production panel at least z. B. on the one hand, a cutting device 09 or punching device 28 which forms the respective opening 03 ( Fig. 4 ) and on the other hand a device providing the respective integrated circuits 04.

In order to have an integrated circuit 04 in each industrial process To arrange the relevant openings 03 of the banknotes 02 to be produced together, in a first method step the required amount of integrated circuits 04 is arranged in register on a band-shaped film 06 by the device providing the respective integrated circuits 04. A register-containing arrangement means that one of the integrated circuits 04 is arranged at exactly those positions on the band-shaped film 06 that correspond to the corresponding coordinates x; y correspond to defined positions for the arrangement of the respective integrated circuit 04. The arrangement of the integrated circuits 04 on the band-shaped film 06 in the side register and in the circumferential register corresponds exactly to the arrangement that is intended on the relevant printed sheet 01 or the material web.

Like in the Fig. 3 is illustrated by way of example and only schematically, the band-shaped film 06 is preferably provided in the form of a material roll 07 and unwound from the material roll 07, the supplied integrated circuits 04 then being in the correct position on the unwound part of the material roll 07, ie on the band-shaped film 06 and thus be arranged in register. The supply of the integrated circuits 04 to the band-shaped film 06 can z. B. supported by blown air. The integrated circuits 04 are fixed on the band-shaped film 06, for example. B. electrostatically and/or adhesively. After the integrated circuits 04 have been adhesively arranged on the band-shaped film 06, this can be used again, for example. B. be wound on a spool 08.

In a second process step, the band-shaped film 06 wound on the reel 08 according to the example mentioned is unwound again from the reel 08, the integrated circuits 04 arranged in register on the band-shaped film 06 being moved from the band-shaped film 06 to the respective ones on the relevant printed sheet 01 or banknotes 02 formed on the material web in question are transferred, one of the integrated circuits 04 being arranged in the openings 03 formed in the banknotes 02 through this transfer carried out in the second method step.

The application of the integrated circuits 04 in the banknotes 02 is illustrated Fig. 4 , where in the Fig. 4 By way of example, the application, in particular the arrangement of integrated circuits 04 in the respective openings 03 of printed sheets 01 conveyed in the transport direction T, is shown, each of these printed sheets 01 having a length l01 in the transport direction T. In the example shown, several of these printed sheets 01 are fed from a first stack 24 at a distance a sequentially in the transport direction T to a device 12 for applying the integrated circuits 04 and then stored again in a second stack 26 after application has been completed. In order to enable economical production, at least some processing steps are combined locally, ie carried out in the same machine arrangement, in order to avoid intermediate storage of the printed sheets 01. The printed sheets 01 or the material web are preferably fed continuously from the first stack 24 to a cutting device 09 or a punching device 28, with this cutting device 09 or punching device 28 being used to form the openings 03 in the relevant printed sheet 01 or the material web. Then the printed sheets 01 provided with the openings 03 or the material web are preferably in the same machine arrangement of the z. B. a device 12 having a pair of rollers for applying the integrated circuits 04, which transfers the integrated circuits 04 arranged on the band-shaped film 06 from the band-shaped film 06 to the relevant banknote 02 in a nip of the interacting rollers 13, with this transfer in each case one of the integrated circuits 04 is arranged in the openings 03 formed in the banknotes 02. This application is preferably carried out simultaneously for all integrated circuits 04 arranged in the same row R. Because the banknotes 02 are included in the manufacturing benefit several columns S arranged next to one another are produced and so that several banknotes 02 are arranged in each row R, which extends over several columns S, a very high mass throughput can be achieved here in comparison to serial processing of individual banknotes 02. At least at the transfer point 11 located in the nip, the transport speed of the z. B. band-shaped film 06 to be unwound from the reel 08 is synchronized with the transport speed of the printed sheets 01 or the material web.

When the second method step is carried out or immediately after the second method step is carried out, the band-shaped film 06 is connected to the substrate 18 of the banknotes 02 of the relevant printed sheet 01 or the relevant material web. In a preferred embodiment for producing banknotes 02, the band-shaped film 06, on which the integrated circuits 04 are arranged in register in the first process step, is designed as a double-layer film, with one being formed when the second process step is carried out or immediately after the second process step is carried out first layer 16 of the band-shaped film 06 is connected to the substrate 18 of the banknotes 02 of the relevant printed sheet 01 or the relevant material web. The band-shaped film 06 or its first layer 16 is connected to the substrate 18 of the banknotes 02 of the relevant printed sheet 01 or the relevant material web, for example. B. cohesively, especially by gluing. The band-shaped film 06 or the first layer 16 of the double-layered band-shaped film 06 is preferably each designed as a film having a hologram and / or a kinegram, with a second layer 17 of the double-layered band-shaped film 06 z. B. is made of paper or a plastic. A kinegram is a security element with a tilting effect, which means that a defined film-like sequence takes place depending on the angle at which the kinegram is viewed. Unlike the hologram, which has three-dimensional elements, a usually shiny silver kinegram represents a two-dimensional movement sequence. As a band-shaped film 06 or as the first layer 16 of the double-layered band-shaped film 06, in particular a metallic film or a metallized film or a security film to be arranged on the substrate 18 of the banknotes 02 is used. The second layer 17 forms z. B. for reasons of tear strength and / or stability and / or processability a carrier for the first layer 16. If the band-shaped film 06 or its first layer 16 is designed as a metallic film or as a metallized film, this film consists, for. B. made of aluminum or another metallic material or this film has a carrier z. B. made of a plastic, the surface of which z. B. has been metallized by vapor deposition of a metal. In each of these embodiments, the integrated circuits 04 to be applied adhere to the band-shaped film 06 or to the first layer 16 of the double-layered band-shaped film 06. However, there is no electrically conductive connection between the respective integrated circuit 04 and the metallic film 06 or the metallized one Surface of this film 06. The connection of the band-shaped film 06 or its first layer 16 with the substrate 18 of the banknotes 02 of the relevant printed sheet 01 or the relevant material web is z. B. produced by rolling or hot stamping. During hot stamping, the band-shaped film 06 or its first layer 16 is applied to the substrate 18 of the relevant printed sheet 01 or the relevant material web under the influence of pressure and heat. The two layers 16; 17 of the double-layered band-shaped film 06 are preferably separated from one another at the transfer point 11 or immediately afterwards, with the second layer 17 again z. B. is wound on another spool 14.

In a third method step, the integrated circuits 04 applied or arranged in the respective openings 03 are fixed there. This fixation takes place e.g. B. using a printing process, in particular an inkjet printing process or a screen printing process, and / or by rolling or hot stamping a cover film onto the substrate 18 of the banknotes 02 in question. Fig. 5 shows that with an inkjet printing device 19 there is no electrical conductive pressure fluid 21, e.g. B. an ink or a varnish, is applied to the integrated circuit 04 arranged in one of the openings 03, the integrated circuit 04 being fixed in the relevant opening 03 by drying and / or curing of the printing fluid 21. Fig. 6 illustrates by way of example that an electrically non-conductive printing fluid 21 is applied to the integrated circuit 04 arranged in one of the openings 03 and thus into these openings 03 using a screen printing device 22, whereby here too the integrated circuit is formed by drying and/or hardening of the printing fluid 21 04 is fixed in the relevant opening 03. Alternatively or in addition to the application of a pressure fluid 21, the integrated circuits 04 arranged in the openings 03 can be fixed by applying an electrically non-conductive cover film 23 to the relevant banknotes 02, in particular with a rolling device 27, optionally additionally rolled under the influence of heat, which in the Fig. 7 shown schematically and in a very simplified manner.

After the integrated circuits 04 have been applied or arranged and fixed in the relevant openings 03 of the banknotes 02, several of the printed sheets 01 or the material web, which each have the copies of the banknotes 02 to be produced in the production unit, are usually used in at least one printing press or using printed by at least one printing process and then with a punching device or with a cutting device, e.g. B. with a plan cutter, separated from their assembly and thereby isolated.

When producing banknotes 02, at least two, preferably all, of the aforementioned method steps can be carried out inline, ie the first method step of arranging the integrated circuits 04 in the correct position or in register on the band-shaped film 06 and/or the second method step of applying or arranging the integrated circuits Circuits 04 in the openings 03 of the banknotes 02 and/or the third method step of fixing the banknotes in the openings 03 arranged integrated circuits 04 and / or the printing of the printed sheets 01 containing the banknotes 02 or the printing of the material web containing the banknotes 02 and / or the separation of the copies of the banknotes 02 produced in the production panel are preferably carried out in the same production machine, in particular in one used in value printing Rotary printing machine.

Reference symbol list

01

Print sheet

02

Banknote

03

breakthrough

04

integrated circuit

05

-

06

foil

07

Roll of material

08

Kitchen sink

09

Cutting device

10

-

11

transfer point

12

Device for applying integrated circuits

13

roller

14

Kitchen sink

15

-

16

location (first)

17

location (second)

18

Substrate

19

Inkjet printing device

20

-

21

Pressurized fluid

22

Screen printing device

23

Cover film

24

stack (first)

25

-

26

Stack (second)

27

Rolling device

28

Punching device

a

Distance

l01

length

l04

Edge length

R

Row

S

Split

T

Transport direction

x; y

coordinates

Claims (15)

1. Method for producing banknotes (02) including in each case at least one integrated circuit (04), the banknotes (02) being produced from a sheet (01) or from a material web in a production panel, at least in a plurality of or in each of these banknotes (02) an aperture (03) being created through their substrate (18), in each case an integrated circuit (04) being arranged in the relevant aperture (03), in a first method step each of the integrated circuits (04) to be arranged in one of the apertures (03) being arranged, with respect to the intended position in each of the banknotes (02) that includes an aperture (03), in the correct position on a band-shaped foil (06), and in a second method step each of these integrated circuits being transferred from this band-shaped foil (06) onto the relevant banknote (02), owing to this transfer that is carried out in the second method step one integrated circuit (04) in each case being arranged in the apertures (03) created in the banknotes (02) .
2. Method according to claim 1, characterized in that the respective aperture (03) in each of the banknotes (02) is created in each case by die cutting or by laser cutting.
3. Method according to claim 1 or 2, characterized in that each of the integrated circuits (04) to be arranged in one of the apertures (03) created in the relevant banknotes (02) is in each case configured as a microchip encapsulated in a dedicated housing, and/or in that in each case an RFID tag is used as the integrated circuit (04).
4. Method according to claim 1 or 2 or 3, characterized in that each of the integrated circuits (04) to be arranged in one of the apertures (03) created in the relevant banknotes (02) in each case has a surface area having an edge length (104) of no more than 1 mm × 1 mm, and/or in that an integrated circuit (04) having a structural height of no more than 90 um is used, or in that an integrated circuit (04) having a structural height in the range between 25 um and 50 um is used.
5. Method according to claim 1 or 2 or 3 or 4, characterized in that the aperture (03) in the relevant banknote (02) in its respective expansion is in each case configured to be between 10% and 100% greater than the respective edge length (104) of the relevant integrated circuit (04).
6. Method according to claim 1 or 2 or 3 or 4 or 5, characterized in that, in the first method step, the integrated circuits (04) are arranged on the band-shaped foil (06) assisted by blower air, and/or in that, in the first method step, the integrated circuits (04) are fixed in their respective position on the band-shaped foil (06) electrostatically and/or by way of adhesion.
7. Method according to claim 1 or 2 or 3 or 4 or 5 or 6, characterized in that, as the second method step is being carried out, or immediately after the second method step has been carried out, the band-shaped foil (06) is joined to the substrate (18) of the banknotes (02) of the relevant sheet (01) or of the relevant material web.
8. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7, characterized in that a two-layer foil is used as the band-shaped foil (06), as the second method step is being carried out, or immediately after the second method step has been carried out, a first layer (16) of the band-shaped foil (06) being joined to the substrate (18) of the banknotes (02) of the relevant sheet (01) or of the relevant material web, the integrated circuits (04) adhering to the first layer (16).
9. Method according to claim 8, characterized in that a second layer (17) of the two-layer band-shaped foil (06) is made of paper or a plastic.
10. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9, characterized in that a foil including a hologram and/or a Kinegram is used as the band-shaped foil (06), and/or in that a metallic foil or a metallized foil is used as the band-shaped foil (06), and/or in that a security foil to be arranged on the substrate (18) of the banknotes (02) is used as the band-shaped foil (06).
11. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10, characterized in that, in a third method step, the integrated circuits (04) arranged in the respective apertures (03) are fixed therein, this fixation being carried out using a printing method.
12. Method according to claim 11, characterized in that an electrically non-conducting printing fluid (21) is applied by way of the printing method, and/or in that an ink jet printing method or a screen printing method is used as the printing method.
13. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12, characterized in that, in the third method step, the integrated circuits (04) arranged in the respective apertures (03) are fixed therein, this fixation being carried out by rolling or hot stamping a cover foil (23) onto the substrate (18) of the relevant banknotes (02).
14. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13, characterized in that information about the currency and/or the value of the relevant banknote (02) and/or information about the issuing bank of this banknote (02) is stored in the integrated circuit (04), and/or in that information as to whether this banknote (02) was already brought into circulation, or when this took place, is stored in the integrated circuit (04).
15. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14, characterized in that at least two of the method steps to be carried out during the production of banknotes (02) including in each case at least one integrated circuit (04), namely the first method step of arranging the integrated circuits (04) in the correct position on the band-shaped foil (06) and/or the second method step of arranging the integrated circuits (04) in the apertures (03) of the banknotes (02) and/or the third method step of fixing the integrated circuits (04) arranged in the apertures (03) and/or printing the sheets (01) including the banknotes (02) or printing the material web including the banknotes (02) and/or singulating the copies of the banknotes (02) produced in the production panel, are in each case carried out inline in the same production machine.

Images