EP4033548A4 - SUBMINIATURE OPTICAL TRANSMISSION MODULE AND METHOD FOR PRODUCING THEREOF USING A SEMICONDUCTOR ENCAPSULATION SCHEME - Google Patents
SUBMINIATURE OPTICAL TRANSMISSION MODULE AND METHOD FOR PRODUCING THEREOF USING A SEMICONDUCTOR ENCAPSULATION SCHEME Download PDFInfo
- Publication number
- EP4033548A4 EP4033548A4 EP20866797.2A EP20866797A EP4033548A4 EP 4033548 A4 EP4033548 A4 EP 4033548A4 EP 20866797 A EP20866797 A EP 20866797A EP 4033548 A4 EP4033548 A4 EP 4033548A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- optical transmission
- transmission module
- manufacturing same
- semiconductor packaging
- packaging scheme
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/506—Multiwavelength transmitters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04J—MULTIPLEX COMMUNICATION
- H04J14/00—Optical multiplex systems
- H04J14/02—Wavelength-division multiplex systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12164—Multiplexing; Demultiplexing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12019—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q11/00—Selecting arrangements for multiplex systems
- H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
- H04Q11/0005—Switch and router aspects
- H04Q2011/0007—Construction
- H04Q2011/0032—Construction using static wavelength routers (e.g. arrayed waveguide grating router [AWGR] )
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20190115860 | 2019-09-20 | ||
PCT/KR2020/012713 WO2021054803A1 (ko) | 2019-09-20 | 2020-09-21 | 초소형 광송신 모듈 및 반도체 패키징 방식을 이용한 그의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP4033548A1 EP4033548A1 (en) | 2022-07-27 |
EP4033548A4 true EP4033548A4 (en) | 2023-10-25 |
Family
ID=74884094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20866797.2A Pending EP4033548A4 (en) | 2019-09-20 | 2020-09-21 | SUBMINIATURE OPTICAL TRANSMISSION MODULE AND METHOD FOR PRODUCING THEREOF USING A SEMICONDUCTOR ENCAPSULATION SCHEME |
Country Status (5)
Country | Link |
---|---|
US (1) | US11990940B2 (ko) |
EP (1) | EP4033548A4 (ko) |
KR (3) | KR102423085B1 (ko) |
CN (1) | CN114402243A (ko) |
WO (1) | WO2021054803A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021054803A1 (ko) * | 2019-09-20 | 2021-03-25 | 주식회사 라이팩 | 초소형 광송신 모듈 및 반도체 패키징 방식을 이용한 그의 제조방법 |
CN117192703B (zh) * | 2023-09-21 | 2024-02-06 | 深圳市速腾聚创科技有限公司 | 光芯片、激光雷达及可移动设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050014300A1 (en) * | 2001-10-09 | 2005-01-20 | Infinera Corporation | Optical probe and method of testing employing an interrogation beam or optical pickup |
US20140241726A1 (en) * | 2013-02-22 | 2014-08-28 | Applied Optoelectronics, Inc. | Temperature controlled multi-channel transmitter optical subassembly and optical transceiver module including same |
KR20170051140A (ko) * | 2015-10-29 | 2017-05-11 | 삼성전자주식회사 | 광 집적 회로 패키지 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3865460A (en) * | 1973-04-30 | 1975-02-11 | Minnesota Mining & Mfg | Component connector |
KR100327106B1 (ko) | 1997-11-28 | 2002-05-10 | 이계철 | 반도체 레이저 모듈 |
AU2002334906A1 (en) * | 2001-10-09 | 2003-04-22 | Infinera Corporation | Transmitter photonic integrated circuits (txpic) and optical transport networks employing txpics |
EP1321791A2 (en) * | 2001-12-04 | 2003-06-25 | Matsushita Electric Industrial Co., Ltd. | Optical package substrate, optical device, optical module, and method for molding optical package substrate |
WO2004084317A2 (en) * | 2003-03-20 | 2004-09-30 | Firecomms Limited | An optical sub-assembly for a transceiver |
WO2005106546A2 (en) * | 2004-04-15 | 2005-11-10 | Infinera Corporation | COOLERLESS AND FLOATING WAVELENGTH GRID PHOTONIC INTEGRATED CIRCUITS (PICs) FOR WDM TRANSMISSION NETWORKS |
KR101610885B1 (ko) * | 2007-01-17 | 2016-04-08 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 프린팅기반 어셈블리에 의해 제조되는 광학 시스템 |
US8247895B2 (en) * | 2010-01-08 | 2012-08-21 | International Business Machines Corporation | 4D device process and structure |
DE102015109876A1 (de) * | 2015-06-19 | 2016-12-22 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
CN106546327B (zh) * | 2015-09-17 | 2021-04-20 | 日月光半导体制造股份有限公司 | 光学装置、电装置及无源光学组件 |
CN116598301A (zh) * | 2016-02-19 | 2023-08-15 | 赫普塔冈微光有限公司 | 具有带有用于接纳光学组件的开口的双重包封的光电模块 |
US10042116B2 (en) * | 2016-04-25 | 2018-08-07 | Applied Optoelectronics, Inc. | Techniques for direct optical coupling of photodetectors to optical demultiplexer outputs and an optical transceiver using the same |
US10436991B2 (en) * | 2017-05-19 | 2019-10-08 | Adolite Inc. | Optical interconnect modules based on glass substrate with polymer waveguide |
KR101961812B1 (ko) * | 2017-06-27 | 2019-03-25 | (주)파이버피아 | Ftth 오버레이를 위한 광모듈 |
KR102126238B1 (ko) | 2017-07-12 | 2020-06-24 | 한국전자통신연구원 | 광통신 시스템에서 광신호를 송신하기 위한 송신기 및 그의 동작 방법 |
US10522968B2 (en) * | 2017-12-22 | 2019-12-31 | Futurewei Technologies, Inc. | Narrow linewidth multi-wavelength light sources |
KR102559098B1 (ko) | 2018-07-11 | 2023-07-25 | 한국전자통신연구원 | 광송신 모듈 |
KR101949899B1 (ko) | 2018-11-05 | 2019-05-21 | 주식회사 지파랑 | 광소자 모듈 및 그의 제조방법 |
WO2020181938A1 (zh) * | 2019-03-14 | 2020-09-17 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
WO2020231171A1 (ko) * | 2019-05-13 | 2020-11-19 | 주식회사 라이팩 | 커넥터 플러그 및 이를 이용한 액티브 광 케이블 조립체 |
WO2021054803A1 (ko) * | 2019-09-20 | 2021-03-25 | 주식회사 라이팩 | 초소형 광송신 모듈 및 반도체 패키징 방식을 이용한 그의 제조방법 |
JP6675701B1 (ja) * | 2019-11-13 | 2020-04-01 | 先端フォトニクス株式会社 | 光学部品及びアイソレータ |
CN115135980A (zh) * | 2019-12-24 | 2022-09-30 | 麻省理工学院 | 全向软质电容触觉传感器及其使用方法 |
KR20210148743A (ko) * | 2020-06-01 | 2021-12-08 | 삼성전자주식회사 | 반도체 패키지 |
DE102020125813A1 (de) * | 2020-10-02 | 2022-04-07 | Infineon Technologies Ag | Verfahren zum herstellen eines chipgehäuses und chipgehäuse |
US20230383188A1 (en) * | 2020-10-29 | 2023-11-30 | Otsuka Chemical Co., Ltd. | Liquid crystal polymer composition, liquid crystal polymer molded body, and electrical and electronic equipment |
KR20240000525A (ko) * | 2021-04-26 | 2024-01-02 | 어드밴스드 마이크로 디바이시즈, 인코포레이티드 | 광자 집적 회로를 통합한 팬아웃 모듈 |
-
2020
- 2020-09-21 WO PCT/KR2020/012713 patent/WO2021054803A1/ko unknown
- 2020-09-21 KR KR1020200121520A patent/KR102423085B1/ko active IP Right Grant
- 2020-09-21 EP EP20866797.2A patent/EP4033548A4/en active Pending
- 2020-09-21 US US17/641,725 patent/US11990940B2/en active Active
- 2020-09-21 CN CN202080065156.1A patent/CN114402243A/zh active Pending
-
2022
- 2022-07-14 KR KR1020220087150A patent/KR102619650B1/ko active IP Right Grant
-
2023
- 2023-12-26 KR KR1020230191682A patent/KR20240004186A/ko active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050014300A1 (en) * | 2001-10-09 | 2005-01-20 | Infinera Corporation | Optical probe and method of testing employing an interrogation beam or optical pickup |
US20140241726A1 (en) * | 2013-02-22 | 2014-08-28 | Applied Optoelectronics, Inc. | Temperature controlled multi-channel transmitter optical subassembly and optical transceiver module including same |
KR20170051140A (ko) * | 2015-10-29 | 2017-05-11 | 삼성전자주식회사 | 광 집적 회로 패키지 |
Non-Patent Citations (1)
Title |
---|
See also references of WO2021054803A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR20220106722A (ko) | 2022-07-29 |
KR102619650B1 (ko) | 2023-12-29 |
US11990940B2 (en) | 2024-05-21 |
KR102423085B1 (ko) | 2022-07-21 |
KR20210035058A (ko) | 2021-03-31 |
EP4033548A1 (en) | 2022-07-27 |
CN114402243A (zh) | 2022-04-26 |
US20220321226A1 (en) | 2022-10-06 |
WO2021054803A1 (ko) | 2021-03-25 |
KR20240004186A (ko) | 2024-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3651191A4 (en) | OPTICAL MODULE AND ITS MANUFACTURING PROCESS | |
EP4053617A4 (en) | OPTICAL MODULE | |
EP3712933A4 (en) | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THEREOF | |
EP4033548A4 (en) | SUBMINIATURE OPTICAL TRANSMISSION MODULE AND METHOD FOR PRODUCING THEREOF USING A SEMICONDUCTOR ENCAPSULATION SCHEME | |
EP4057055A4 (en) | METHOD FOR MAKING A LIGHT MODULATING DEVICE | |
EP3680943A4 (en) | METHOD FOR MANUFACTURING A SEALED OPTICAL SEMICONDUCTOR COMPONENT | |
EP3926388A4 (en) | OPTICAL BEAM SPLITTING MODULE AND METHOD OF MANUFACTURING THEREOF | |
EP4191302A4 (en) | OPTICAL MODULE | |
EP3911986A4 (en) | SEALED OPTICAL TRANSMITTER-RECEIVER | |
EP3770950A4 (en) | METHOD FOR MANUFACTURING MODULE MOUNTED ON ELECTRONIC COMPONENT | |
EP3902165A4 (en) | COMMUNICATION METHOD AND OPTICAL MODULE | |
EP3933473A4 (en) | OPTICAL LENS, CAMERA MODULE AND PROCESS THEREOF | |
EP3736924A4 (en) | SEMICONDUCTOR LASER MODULE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR LASER MODULE | |
EP4007255A4 (en) | OPTICAL MODULE | |
EP4261577A4 (en) | OPTICAL MODULE | |
EP4005986A4 (en) | PROCESS FOR MANUFACTURING AN OPTICAL FIBER | |
EP4068371A4 (en) | DISPLAY DEVICE WITH LIGHT-EMITTING SEMICONDUCTOR COMPONENTS AND METHOD FOR PRODUCING THE SAME | |
EP3786704A4 (en) | OPTICAL WAVELENGTH CONVERSION DEVICE AND METHOD OF MANUFACTURING AN OPTICAL WAVELENGTH CONVERSION DEVICE | |
EP3783632A4 (en) | PROCESS FOR MANUFACTURING A MAGNETIC MODULE | |
EP3667393A4 (en) | OPTICAL MODULE AND METHOD OF MANUFACTURING AN OPTICAL MODULE | |
EP3909768A4 (en) | PROCESS FOR MANUFACTURING AN OPTICAL FILM | |
EP3940438A4 (en) | OPTICAL MODULE | |
EP3904922A4 (en) | OPTICAL LENS AND METHOD OF MANUFACTURE THEREOF | |
EP4106118A4 (en) | SEMICONDUCTOR LASER DEVICE | |
EP3889680A4 (en) | OPTICAL MODULE |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20220316 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20230921 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H04B 10/50 20130101ALI20230915BHEP Ipc: H01L 31/12 20060101ALI20230915BHEP Ipc: H01L 33/52 20100101ALI20230915BHEP Ipc: H01L 33/36 20100101ALI20230915BHEP Ipc: H01L 33/62 20100101AFI20230915BHEP |