EP3988228A1 - Procédé de production d'alliage d'aluminium à très haute teneur en silicium - Google Patents
Procédé de production d'alliage d'aluminium à très haute teneur en silicium Download PDFInfo
- Publication number
- EP3988228A1 EP3988228A1 EP21188931.6A EP21188931A EP3988228A1 EP 3988228 A1 EP3988228 A1 EP 3988228A1 EP 21188931 A EP21188931 A EP 21188931A EP 3988228 A1 EP3988228 A1 EP 3988228A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- silicon
- aluminum
- ultra
- aluminum alloy
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J1/00—Preparing metal stock or similar ancillary operations prior, during or post forging, e.g. heating or cooling
- B21J1/06—Heating or cooling methods or arrangements specially adapted for performing forging or pressing operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J13/00—Details of machines for forging, pressing, or hammering
- B21J13/02—Dies or mountings therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
- B21J5/002—Hybrid process, e.g. forging following casting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
- B21J5/004—Thixotropic process, i.e. forging at semi-solid state
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
- B21J5/02—Die forging; Trimming by making use of special dies ; Punching during forging
- B21J5/025—Closed die forging
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
- B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
- B21J5/12—Forming profiles on internal or external surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/007—Semi-solid pressure die casting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
- B22D21/002—Castings of light metals
- B22D21/007—Castings of light metals with low melting point, e.g. Al 659 degrees C, Mg 650 degrees C
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0408—Light metal alloys
- C22C1/0416—Aluminium-based alloys
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
Definitions
- the present invention belongs to the field of preparation technology of high-silicon aluminum alloy, and particularly relates to a method for producing ultra-high-silicon aluminum alloy.
- Ultra-high-silicon aluminum alloy (mass content of silicon ⁇ 50%) is an important raw material for the production of lightweight noise-free bearings due to its high abrasive resistance, noise reduction performance, and light weight. Moreover, with the increase of silicon content, its coefficient of linear expansion is reduced to (4-7) ⁇ 10 -6 /K. It is largely used as electronic packaging parts and plays a wide and important role in industrial fields.
- Powder metallurgy and spray forming are the most commonly used processes for producing ultra-high-silicon aluminum alloys.
- Spray forming directly atomizes the spray forming liquid and makes spray deposition into blanks with uniform structure and excellent primary silicon morphology, so the flow of production is short, having the advantage of higher cost efficiency.
- the silicon content is greater than or equal to 50%, the melting point of ultra-high-silicon aluminum alloys increases greatly, and the fluidity of the molten metal is drastically reduced.
- the spray forming process performance of ultra-high-silicon aluminum alloy is deteriorated, making it difficult to produce ultra-high-silicon aluminum alloy with a silicon content above 60% by spray forming. Therefore, how to produce ultra-high-silicon aluminum alloy with a silicon content above 60% is an urgent problem to be solved.
- the purpose of the present invention is to provide a method for producing ultra-high-silicon aluminum alloy to solve one or more technical problems existing in the available technology, or at least provide one beneficial choice or create conditions.
- a method for producing ultra-high-silicon aluminum alloy comprising the following steps:
- an electromagnetic inductor is used to heat the aluminum-silicon alloy ingot.
- the aluminum-silicon alloy ingot is made into an appropriate shape by cold and hot processing such as cutting and then heating to semi-solid temperature.
- the aluminum-silicon alloy ingot is heated to the semi-solid temperature and then held there for 1-60 minutes.
- the specific forming process of ultra-high-silicon aluminum alloy is as follows: the die used is a forging die, comprising an upper mold and a lower mold, and the upper mold and/or lower mold are/is provided with an overflow groove.
- the aluminum-silicon alloy ingot with a semi-solid temperature is placed between the upper mold and the lower mold, and then the die forging equipment closes the upper and lower molds.
- the bottom surface of said upper mold is provided with a projection, and several first overflow grooves are evenly arranged on the bottom surface of said projection.
- said lower mold is provided with a first groove matching said projection, and the bottom surface of said first groove is provided with a second overflow groove corresponding to the first overflow groove.
- the bottom surface of said upper mold is provided with a second groove.
- said lower mold is provided with a third groove corresponding to said second groove, and several third overflow grooves are evenly arranged on the bottom surface of the third groove.
- An ultra-high-silicon aluminum alloy prepared by the above-mentioned method, and the mass content of silicon in the ultra-high-silicon aluminum alloy is greater than or equal to 60%.
- Semi-solid forming technology is a new metal forming technology invented in the 1970s. Through various technological means, the dendrites generated during the process of solidification of metal are transformed into nodules with semi-solid thixotropic behavior and the rheological mold-filling capacity under pressure. Compared with traditional die-casting, semi-solid forming products have the advantages of high strength and great density, low shrinkage rate, thus enabling more precise sizes and shapes of parts. Moreover, the lower forming temperature helps to prolong the service life of mold.
- the semi-solid temperature refers to the temperature in the solid-liquid temperature interval.
- the method of the present invention firstly uses metal spray forming to produce a silicon-aluminum alloy with a lower silicon content (e.g.: mass content of silicon is 50%), which is then heated to semi-solid temperature to go through die pressing with overflow.
- a silicon-aluminum alloy with a lower silicon content e.g.: mass content of silicon is 50%
- mass content of silicon is 50%
- the present invention can realize a gradient change or local enrichment of free silicon content through the asymmetric or partial arrangement of the overflow groove according to the functional requirements of material.
- orientation or location relationship indicated by words such as upper, lower, front, back, left and right is orientation or location relationship based on those shown in the attached figures, which are only for the sake of description of the present invention and simplification of description, and don't indicate or imply that the device or component referred to must have the specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.
- a method for producing ultra-high-silicon aluminum alloy comprising the following steps:
- an electromagnetic inductor is used to heat the aluminum-silicon alloy ingot.
- the entire aluminum-silicon alloy ingot can be heated simultaneously by adjusting the frequency and power to prevent the traditional outside heating method from heating or even melting the outside of the aluminum-silicon alloy ingot before the inside reaches the semi-solid temperature, which can effectively reduce the heating time and achieve better control of overall temperature.
- the aluminum-silicon alloy ingot is made into an appropriate shape by cold and hot processing methods such as cutting and heated to the semi-solid temperature.
- the processing methods can be used to make it into rods, cuboids or cubes, and the specific shapes are processed according to requirements.
- the aluminum-silicon alloy ingot is heated to a semi-solid temperature and then held there for 1-60 minutes.
- the specific holding time depends on the temperature, the type of alloy and the size of aluminum-silicon alloy ingot. In this way, the internal and external temperature of the aluminum-silicon alloy ingot can be consistent.
- the formation process of ultra-high-silicon aluminum alloy is as follows: the die used is a forging die, comprising an upper mold and a lower mold, and the bottom surface of the upper mold is provided with projection, on the bottom surface of which serval first overflow grooves are evenly arranged.
- the lower mold is provided with the first groove matching the projection, and the bottom surface of the first groove is provided with the second overflow groove corresponding to the first overflow groove. Preheat the mold to 250°C to 350°C, place the aluminum-silicon alloy ingot of semi-solid temperature in the first groove of the lower mold, and use the forging equipment to put the upper mold and the lower mold together to produce the ultra-high-silicon aluminum alloy.
- the present invention firstly uses metal spray forming to produce silicon-aluminum alloy with a silicon content of 50%, which is then heated to semi-solid temperature to go through die pressing with overflow.
- an appropriate amount of liquid eutectic aluminum-silicon liquid phase is extruded into the overflow grooves of upper and lower mold to reduce the overall volume compression and enrich the free silicon content, thus producing the ultra-high-silicon aluminum alloy with silicon content over 60%.
- a method for producing ultra-high-silicon aluminum alloy comprising the following steps:
- an electromagnetic inductor is used to heat the aluminum-silicon alloy ingot.
- the entire aluminum-silicon alloy ingot can be heated simultaneously by adjusting the frequency and power to prevent the traditional surface heating method from heating or even melting the outside of the aluminum-silicon alloy ingot before the inside reach the semi-solid temperature, which can effectively reduce heating time and achieve better control of overall temperature.
- the aluminum-silicon alloy ingot is made into an appropriate shape by cold and hot processing methods such as cutting and heated to semi-solid temperature.
- cold or hot machining cutting can be used to make it into rods, cuboids or cubes, and the specific shapes are processed according to processing requirements.
- the aluminum-silicon alloy ingot is heated to a semi-solid temperature and then held for 1-60 minutes.
- the specific holding time depends on the temperature, the type of alloy and the size of aluminum-silicon alloy ingot. In this way, the internal and external temperature of the aluminum-silicon alloy ingot can be consistent.
- the formation process of ultra-high-silicon aluminum alloy is as follows: the die used is a forging die, comprising an upper mold and a lower mold, and the bottom surface of the upper mold is provided with the second groove.
- the lower mold is provided with the third groove corresponding to the second groove.
- the bottom surface of the third groove is evenly placed with several third overflow grooves. Preheat the mold to 300°C to 400°C, place the aluminum-silicon alloy ingot of semi-solid temperature between the second groove of upper mold and the third groove of the lower groove, and then use the forging equipment to put the upper mold and the lower mold together to produce the ultra-high-silicon aluminum alloy.
- the present invention firstly uses metal spray forming to produce silicon-aluminum alloy with a silicon content of 50%, which is then heated to semi-solid temperature to go through die pressing with overflow. In this way, an appropriate amount of eutectic aluminum-silicon liquid phase is pressed into the overflow groove of the lower mold. It can realize a gradient change or local enrichment of free silicon content through the asymmetric or partial arrangement of the overflow groove. As shown in Fig.
- the overflow groove is only placed on the lower mold, in this way, the top of the silicon-aluminum alloy formed through extrusion still retains a free silicon content of 50%, while the free silicon content adjacent to the bottom of the overflow groove is up to over 60%, forming a functional structural material with a gradient change of free silicon content from top to bottom, as shown in Fig.7 and Fig. 8 .
- the top has greater strength and weldability, while the bottom has greater abrasive resistance and dimensional stability caused by dramatic reduction in thermal expansion coefficient at different temperatures.
- the size (a, h) and spacing (b) of the overflow groove of the present invention can be set according to actual needs.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Forging (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011123480.2A CN112475294B (zh) | 2020-10-20 | 2020-10-20 | 一种生产超高硅铝合金的方法 |
Publications (1)
Publication Number | Publication Date |
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EP3988228A1 true EP3988228A1 (fr) | 2022-04-27 |
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ID=74926561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP21188931.6A Pending EP3988228A1 (fr) | 2020-10-20 | 2021-07-30 | Procédé de production d'alliage d'aluminium à très haute teneur en silicium |
Country Status (2)
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EP (1) | EP3988228A1 (fr) |
CN (1) | CN112475294B (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114480891A (zh) * | 2020-11-13 | 2022-05-13 | 内蒙古君成科技有限公司 | 一种从铝硅铁合金中提取铝硅合金的方法 |
Citations (4)
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CN101713057B (zh) * | 2009-11-24 | 2011-06-15 | 北京有色金属研究总院 | 一种用于喷射成形Si-Al合金固液两相区热加工成型封装零件的工艺 |
CN106947893A (zh) * | 2017-04-14 | 2017-07-14 | 黄平县阳光科技发展有限公司 | 一种电子元件封装外壳及其制备方法 |
CN109371305A (zh) * | 2018-11-28 | 2019-02-22 | 天津百恩威新材料科技有限公司 | 用于制作法兰盘的过共晶硅铝合金及其制备方法与应用 |
WO2020052528A1 (fr) * | 2018-09-10 | 2020-03-19 | 佛山峰合精密喷射成形科技有限公司 | Procédé pour produire une pièce métallique à finition quasi-immédiate de haute résistance |
Family Cites Families (6)
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CN1218793C (zh) * | 2003-05-29 | 2005-09-14 | 上海交通大学 | 制备大规格精密异形管材的方法 |
CN1524650A (zh) * | 2003-09-18 | 2004-09-01 | 上海华元喷射成形有限公司 | 喷射成形半固态成型大型复杂零件的制备工艺 |
CN101537479A (zh) * | 2009-05-06 | 2009-09-23 | 北京科技大学 | 一种成形高硅铝合金封装壳体结构件半固态成形工艺方法 |
CN103831417A (zh) * | 2014-03-11 | 2014-06-04 | 扬州宏福铝业有限公司 | 一种高硅铝合金封装外壳半固态的连续成形方法 |
CN104630667A (zh) * | 2015-01-29 | 2015-05-20 | 天津百恩威新材料科技有限公司 | 一种提高喷射成形铝硅合金塑性的致密化方法 |
CN106475545A (zh) * | 2015-08-24 | 2017-03-08 | 北京科大科技园有限公司 | 一种利用液固相分离制备电子封装用高硅铝复合材料的方法 |
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2020
- 2020-10-20 CN CN202011123480.2A patent/CN112475294B/zh active Active
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2021
- 2021-07-30 EP EP21188931.6A patent/EP3988228A1/fr active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101713057B (zh) * | 2009-11-24 | 2011-06-15 | 北京有色金属研究总院 | 一种用于喷射成形Si-Al合金固液两相区热加工成型封装零件的工艺 |
CN106947893A (zh) * | 2017-04-14 | 2017-07-14 | 黄平县阳光科技发展有限公司 | 一种电子元件封装外壳及其制备方法 |
WO2020052528A1 (fr) * | 2018-09-10 | 2020-03-19 | 佛山峰合精密喷射成形科技有限公司 | Procédé pour produire une pièce métallique à finition quasi-immédiate de haute résistance |
CN109371305A (zh) * | 2018-11-28 | 2019-02-22 | 天津百恩威新材料科技有限公司 | 用于制作法兰盘的过共晶硅铝合金及其制备方法与应用 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114480891A (zh) * | 2020-11-13 | 2022-05-13 | 内蒙古君成科技有限公司 | 一种从铝硅铁合金中提取铝硅合金的方法 |
CN114480891B (zh) * | 2020-11-13 | 2024-02-06 | 内蒙古君成科技有限公司 | 一种从铝硅铁合金中提取铝硅合金的方法 |
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Publication number | Publication date |
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CN112475294B (zh) | 2023-09-19 |
CN112475294A (zh) | 2021-03-12 |
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