Classifications

• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
  • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
  • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02K—DYNAMO-ELECTRIC MACHINES
  • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
  • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
  • H02K11/25—Devices for sensing temperature, or actuated thereby
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02K—DYNAMO-ELECTRIC MACHINES
  • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
  • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
  • H02K11/27—Devices for sensing current, or actuated thereby
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02K—DYNAMO-ELECTRIC MACHINES
  • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
  • H02K11/30—Structural association with control circuits or drive circuits
  • H02K11/33—Drive circuits, e.g. power electronics
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
  • H02M1/00—Details of apparatus for conversion
  • H02M1/0003—Details of control, feedback or regulation circuits
  • H02M1/0009—Devices or circuits for detecting current in a converter
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
  • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
  • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
  • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
  • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
  • H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
  • H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/14—Mounting supporting structure in casing or on frame or rack
  • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
  • H05K7/1427—Housings
  • H05K7/1432—Housings specially adapted for power drive units or power converters
  • H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
  • H05K7/20945—Thermal management, e.g. inverter temperature control
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
  • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

• the invention relates to an electronic control system for an electric machine as well as to an electric assembly comprising such an electronic system and an electric machine.
• an electronic control system for an electric machine comprises:
• an electronic power module allowing the conversion of a direct current to an alternating current
• the electronic power module comprising:
• control pin receiving a control signal making it possible to control the electronic power module
• an electronic control module separate from the electronic power module and configured to generate the control signal.
• French patent application n ° 1855045 proposes to measure this temperature using a temperature sensor, for example a thermistor, carried by the electronic card of the electronic control module, the heat of the power electronic components being conducted towards the temperature sensor. by an electrical conductor connected to one of the bus bars or the control pin.
• a temperature sensor for example a thermistor
• the temperature sensor is remote from the power electronic component whose temperature is to be known. The accuracy of the temperature measurement is therefore reduced due to heat losses between the electronic power component and the temperature sensor.
• the power electronic module manufacturing process can make it difficult or even impossible to integrate the temperature sensor into the power electronic module. This is particularly the case when the power electronic module is made with TML type technology (Transfer Molded Leadframe in French) where an electrical insulator is overmolded on the bus bars, the pin of control and electronic power component.
• the electrical insulation is for example a thermosetting resin of the epoxy type.
• interconnector separate from the power electronic module to connect the third bus bar of the power electronic module to the phase winding of the rotating electrical machine.
• Such an interconnector is presented in patent application FR3068564 A1.
• the interconnector comprises a conductive part electrically connecting the third bus bar to the phase winding of the rotating electrical machine as well as a magnetic toroid.
• the magnetic toroid surrounds the conductive part.
• the torus has a notch in which a hall effect sensor can be placed.
• a voltage dependent on the magnetic field is generated by the current flowing through the conductive part.
• the interconnector may further include a housing molded onto the conductive part and the toroid. The use of such an interconnector makes it possible to simplify the power electronic module and the manufacture of the power electronic module.
• the present invention aims to eliminate all or part of these drawbacks.
• the invention relates to an electronic system comprising:
• an electronic power module allowing the conversion of a direct current to an alternating current
• the electronic power module comprising:
• a third bus bar capable of supplying a phase winding of a rotating electrical machine, - a control pin receiving a control signal making it possible to control the electronic power module,
• first electronic sub-assembly comprising at least a first trace and at least one electronic control component, at least one electronic control component being electrically connected to at least a first trace
• a second electronic sub-assembly distinct from the first electronic sub-assembly and comprising an electronic control device making it possible to generate the control signal and / or an electronic measuring device making it possible to measure an operating parameter of the electronic power module
• the second electronic sub-assembly being connected to the first electronic sub-assembly by a first control pin.
• an electronic control module comprising such a second electronic sub-assembly can make it possible to bring the electronic control device which generates the control signal of the electronic power module closer together. Thus it is possible to shorten the length of the electrical connections between the electronic control device and the electronic power module. This can help reduce
• An exemplary embodiment of a first electronic sub-assembly separate from a second electronic sub-assembly is obtained for example by providing for the first electronic sub-assembly, a first support and for the second electronic sub-assembly, a second support , the first support and the second support being at a distance from each other.
• the electronic measuring device is a current sensor.
• the electronic power module extends in a foreground and one end of the third bus bar is
• the current sensor comprises a magnetic toroid having an air gap and a Hall effect sensor arranged in the air gap to measure the current flowing through a conductor passing through the magnetic torus, the third bar omnibus passing through the magnetic torus or the magnetic torus being suitable for being traversed by the phase winding of the rotating electrical machine.
• the height of the current sensor in the direction of the axis of the magnetic toroid is less than its width and length in the plane perpendicular to the axis of the magnetic toroid.
• the electronic measuring device is a temperature sensor.
• the installation of the temperature sensor on the second electronic sub-assembly allows the temperature sensor to be brought closer to the power electronic module. It is thus possible to improve the precision of the temperature measurement. This improvement is obtained in particular when the temperature sensor is thermally connected to an electrical conductor electrically connecting the electronic power module to the second electronic subassembly.
• the length of the electrical conductor can be reduced in order to limit heat loss to the environment.
• the second electronic sub-assembly comprises a second trace electrically connected to the first control pin
• the first electronic sub-assembly comprises an electronic control circuit
• the first control pin is electrically connected to the electronic control circuit.
• At least a second control pin is electrically connected to one of the first bus bar, second bus bar, third bus bar and control pin,
• the second trace is electrically connected to the second control pin.
• the use of a second trace of the second electronic sub-assembly to electrically connect the first control pin to the second control pin allows the second electronic sub-assembly to perform an interconnection function between the power electronic module and the first electronic sub-assembly. It is thus possible to position the electrical connections to the first electronic sub-assembly in an improved manner. It is for example possible to position these electrical connections on a peripheral zone of the first electronic sub-assembly so as to increase the space available for the electronic components of the first electronic sub-assembly.
• the first control pin is distinct from the second trace and / or the second trace is distinct from the second control pin.
• the second electronic sub-assembly further comprises a thermal connection between the second trace and the temperature sensor.
• the thermal connection allows heat conduction between the second trace and the temperature sensor. We can thus assess the temperature of a component electrically connected to the second trace, for example the temperature of a component of the power electronic module.
• the second electronic sub-assembly further comprises a box joining the second track and the electronic control device and / or an electronic measuring device, in particular a box molded onto the second track and the device. control electronics and / or an electronic measuring device.
• the second electronic sub-assembly comprises an electronic card on which the second trace is arranged and carrying the control device and / or the measuring device.
• the invention also relates to an electrical assembly comprising:
• Figure 1 shows an electrical diagram of an electrical assembly comprising an electronic system according to the invention
• Figure 2 shows a schematic view in partial section of an electronic system according to a first embodiment of the invention
• Figure 3 shows a partial schematic view of the electronic system of Figure 2
• Figure 4 shows another partial schematic view of the electronic system of Figure 2
• Figure 5 shows a partial schematic sectional view of an electronic system according to a second embodiment
• Figure 6 shows a partial schematic view of the electronic system of Figure 5
• FIG. 7 represents another partial schematic view of the electronic system of FIG. 5.
• Figure 1 shows an electrical assembly 100 in which the invention can be implemented.
• the electrical assembly 100 is for example intended to be installed in a motor vehicle.
• the electrical assembly 100 first of all comprises an electrical power source 102 designed to supply a direct voltage U, for example between 20 V and 100 V, for example 48 V.
• the electrical power source 102 comprises for example a battery.
• the electrical assembly 100 further comprises a rotating electrical machine 130 comprising several phase windings (not shown) intended to present respective phase voltages.
• the electrical assembly 100 further includes an electronic system 104.
• the electronic system 104 is a voltage converter 104.
• the assembly can perform a different function.
• the voltage converter 104 is connected between the power source 102 and the electrical machine 130 to convert between the direct voltage U and the phase voltages.
• the voltage converter 104 firstly comprises a positive electric line 106 and a negative electric line 108 intended to be connected to the electric power source 102 to receive the direct voltage U, the positive electric line 106 receiving a high electric potential. and the negative electric line 108 receiving a low electric potential.
• the negative electric line receives for example a zero potential and is connected to a ground of the motor vehicle.
• the voltage converter 104 further comprises at least one electronic power module 110 comprising one or more phase electric lines 122 intended to be respectively connected to one or more phases of the electric machine 130, in order to supply their respective phase voltages.
• the voltage converter 104 comprises three electronic power modules 110 each comprising two phase electric lines 122 connected to two phases of the electric machine 130.
• the electric machine 130 comprises two three-phase systems each comprising three phases, and intended to be electrically out of phase by 120 ° with respect to each other.
• the first phase electric lines 122 of the power electronic modules 110 are respectively connected to the three phases of the first three-phase system, while the second phase electric lines 122 of the power electronic modules 110 are respectively connected to the three phases of the second. three-phase system.
• Each electronic power module 110 comprises, for each phase electric line 122, a first controllable switch 112 connected between the positive electric line 106 and the phase electric line 122 and a second controllable switch 114 connected between the phase electric line 122 and the negative electric line 108.
• the controllable switches 112, 114 are arranged so as to form a chopping arm, in which the phase electric line 122 forms a midpoint.
• Each controllable switch 112, 114 comprises first and second main terminals 116, 118 and a control terminal 120 intended to selectively open and close the controllable switch 112, 114 between its two main terminals 116, 118 as a function of a signal of command applied to it.
• the controllable switches 112, 114 are preferably transistors, for example field effect transistors with a metal-oxide-semiconductor structure (standing for “Metal Oxide Semiconductor Field Effect Transistor” or MOSFET) having a gate forming the terminal of control 120, and a drain and a source respectively forming the main terminals 116, 118.
• controllable switches 112, 114 each have the shape of a plate, for example substantially rectangular, having an upper face and a lower face.
• the first main terminal 116 extends on the underside, while the second main terminal 118 extends on the upper face. Further, the underside forms a heat dissipating face.
• the voltage converter 104 further comprises, for each electronic power module 110, a filtering capacitor 124 having a first terminal 126 and a second terminal 128 respectively connected to the positive electric line 106 and to the negative electric line 108.
• a filtering capacitor 124 having a first terminal 126 and a second terminal 128 respectively connected to the positive electric line 106 and to the negative electric line 108.
• the positive power line 106, the negative power line 108 and the phase power lines 122 are rigid elements designed to withstand electric currents of at least 1 A. They preferably have a thickness of at least 1. mm.
• the electric machine 130 has both a function
• the motor vehicle further comprises a heat engine (not shown) having an output axis to which the electric machine 130 is connected for example by a belt or by a chain or by a gear train (not shown).
• the heat engine is intended to drive the wheels of the motor vehicle through its output axis.
• the electrical machine supplies electrical energy to the power source 102 from the rotation of the output shaft.
• the voltage converter 104 then operates as a rectifier.
• the electric machine drives the output shaft (in addition to or instead of the heat engine).
• the voltage converter 104 then operates as an inverter.
• the electric machine 130 is for example located in a gearbox or in a clutch of the motor vehicle or in place of the alternator.
• FIG. 2, FIG. 3 and FIG. 4 represent an electronic system 104 according to a first embodiment.
• the electronic system 104 comprises:
• the 110 power electronic module allowing the conversion of a direct current to an alternating current
• the 110 power electronic module comprising:
• control pin 150 receiving a control signal making it possible to control the electronic power module 110.
• the first bus bar 206 is electrically connected to the positive power line 106.
• the second bus bar 208 is electrically connected to the negative power line 108.
• the third bus bar 522 is electrically connected to the phase power line 122.
• the control pin 150 is electrically connected to the control terminal 120.
• the electronic power module 110 may further include an overmolded box 550 on the first controllable switch 112, the second controllable switch 114, the first bus bar 206, the second bus bar 208, the third bus bar 522 and the control pin 150.
• the power electronic module is for example produced with a technology of the TML type.
• the electrical system 104 may further include a heat sink 502.
• the power electronic module 110 is fixed on the heat sink 502 using a fastening means, not shown.
• the power electronic module 110 includes a heat dissipation surface. This heat dissipation surface is in thermal contact with a heat exchange surface of the heat sink 502.
• the thermal contact is for example made by means of a thermal paste or a thermal adhesive.
• the heat sink 502 can comprise a pipe 530.
• the pipe 530 is for example connected to a circuit of
• a heat transfer fluid in which a heat transfer fluid can circulate, in particular an aqueous-based cooling liquid.
• the electrical system 104 further comprises:
• first electronic sub-assembly 700 comprising at least a first trace 710 and at least one electronic control component 720, the at least one electronic control component being electrically connected to at least a first trace 710,
• a second electronic sub-assembly 900 distinct from the first electronic sub-assembly 700 and comprising an electronic measuring device making it possible to measure an operating parameter of the electronic power module.
• the first electronic subassembly 700 includes a first support and the second electronic subassembly 900 includes a second support, the first support and the second support being spaced apart from each other.
• the second electronic sub-assembly 900 is connected to the first electronic sub-assembly by a first control pin 140.
• the second electronic sub-assembly 900 includes a second trace 930.
• At least a second control pin 160 is electrically connected to one of the first bus bar 206, second bus bar 208, third bus bar 522, and control pin 150.
• a plurality of second control pins 160 are used.
• One of the second control pins 160 is the control pin 150.
• Another second control pin 160 is for example connected to the first bus bar 206.
• Another second control pin 160 is for example connected to the third bus bar 522.
• the second control pin 160 can be connected to the second trace 930.
• the second trace 930 is electrically connected to the first control pin 140.
• the first control pin 140 is distinct from the second trace 930 and the second trace 930 is distinct from the second control pin 160.
• the first electronic sub-assembly 700 can comprise a first electronic card 730 carrying the electronic control component 720.
• the first support of the first electronic sub-assembly 700 is for example the first electronic card 730.
• the first control pin 140 is electrically connected to the electronic control component 720.
• the second electronic sub-assembly 900 can comprise a second electronic card 410.
• the second trace 930 is for example a metallic trace formed on the second electronic card 410.
• the second support of the second electronic sub-assembly 900 is for example the second electronic card 410.
• the second sub-assembly 900 comprises a casing overmolded on the second trace 930.
• the overmolded casing is for example made from an epoxy resin.
• the second sub-assembly 900 is for example produced with a technology of the TML type.
• the first control pin 140 is produced in continuity of material with the second trace 930.
• the second control pin 160 is produced in continuity of material with the second trace 930.
• first control pin 140 and the second control pin 160 are made in continuity of material with the second trace 930.
• the electronic measuring device of the second electronic sub-assembly 900 is for example a current sensor 910.
• the current sensor 910 can include a magnetic toroid 430 and a Hall effect sensor 440.
• the magnetic toroid 430 has an air gap in which the Hall effect sensor 440 is arranged to measure the current flowing through an electrical conductor passing through the magnetic toroid 430. .
• the height of the current sensor 910 in the direction of the axis of the magnetic core 430 is less than its width and length in the plane perpendicular to the axis of the magnetic core 430.
• the height of the current sensor 910 is for example at least two times smaller than its width and its length.
• a magnetic toroid support 432 can be molded onto the magnetic toroid 430.
• the magnetic toroid support 432 is for example fixed to the second electronic card 410 by means of fixing means 433.
• the fixing means 433 are for example screws. or protuberances of the magnetic torus support 432 hot-crimped on the second electronic card 410.
• the current sensor 910 allows the measurement of the current flowing in the phase winding 810.
• the phase coil 810 passes through the magnetic toroid 430.
• the third bus bar 522 passes through the magnetic toroid.
• the power electronic module 110 extends in a foreground.
• the third bus bar 522 has an end perpendicular to the foreground.
• the perpendicular end of the third bus bar 522 is connected to the phase winding 810 which has the same orientation as the end of the third bus bar.
• the third bus bar 522 and the phase winding 810 are for example electrically and mechanically connected by brazing / soldering or by crimping (not shown).
• the second electronic sub-assembly 900 has an orientation parallel to the foreground.
• the axis of the current sensor 910 is perpendicular to the orientation of the second electronic subassembly 900.
• the height of the current sensor 910 is less than its length and width, it is possible to have a second electronic sub-assembly 900 whose thickness is reduced.
• the electronic measuring device of the second electronic sub-assembly 900 may also be a temperature sensor 450, for example a thermistor.
• the second electronic sub-assembly may further include a thermal connection between the second trace 930 and the temperature sensor 450.
• the thermal connection comprises for example a thermally conductive trace 940 in particular a metal trace in particular a copper trace.
• the temperature sensor 450 is in thermal contact with the thermally conductive trace 940.
• the thermal contact is for example made by direct contact or by means of a thermal paste or a thermal adhesive.
• the thermally conductive trace 940 is for example welded to the second trace 930 to allow conduction of heat between the second trace 930 and the thermally conductive trace 940.
• the second trace 930 and the trace thermally conductive 940 are formed in continuity of material.
• the second trace 930 and the thermally conductive trace 940 form one and the same trace.
• Such a temperature sensor 450 can make it possible to evaluate the temperature of the power electronic module 110.
• the heat generated by the power electronic module 110 is transmitted by thermal conduction by the second control pin 160 and the second trace 930 up to thermal connection and to the temperature sensor.
• the second electronic subassemblies of the embodiments shown in Figures 2 to 7 include both a temperature sensor 450 and a current sensor 910.
• the second electronic sub-assembly 900 also comprises an electronic control device 920 making it possible to generate the control signal.
• the control signal is sent to the control terminal 120 of a controllable switch of the power electronic module 110 to selectively open and close the controllable switch 112, 114.
• the second electronic sub-assembly 900 does not include an electronic measuring device making it possible to measure an operating parameter of the electronic power module 110 but comprises an electronic control device 920 making it possible to generate the control signal. ordered.
• the second electronic sub-assembly 900 comprises the electronic measuring device 910, 450 making it possible to measure an operating parameter of the electronic power module 110 but does not include an electronic control device making it possible to generate the control signal.
• the first electronics sub-assembly 700 has an orientation parallel to the orientation of the second electronics sub-assembly 900.
• the electronic system 104 may have a generally circular cylindrical shape whose axis is perpendicular to the foreground.
• the first electronic sub-assembly 700 and the second electronic sub-assembly 900 may be in the form of a disk.
• the second electronic sub-assembly 900, the first control pin 140, the second control pin 160 can form an interconnection module between the power electronic module 110 and the first electronic sub-assembly 700.
• the interconnection module allows to reduce the positioning constraints of the electrical connection of the first control pin 140 to the first electronic sub-assembly 700 with respect to the positioning of the second control pin 160. It is thus for example possible to position the electrical connection of the first control pin 140 to the first electronic sub-assembly 700 on the outside of the first electronic sub-assembly 700. This position makes it possible to reduce the routing constraints of the first sub-assembly. electronic assembly 700 and to increase the space available for the electronic components of the first electronic sub-assembly 700.
• the first electronic sub-assembly 700, the heat exchanger 502, the power electronic module 110 and the second electronic sub-assembly 900 are successively arranged in parallel planes.
• the position of the heat exchanger between the first electronic subassembly 700 and the electronic power module 110 allows, on the one hand, the cooling of the electronic power module 110 as seen above but also of the first electronic subassembly 700.
• the first electronic subassembly 700 includes a heat dissipation surface. This heat dissipation surface is in thermal contact with a heat exchange surface of the heat sink 502. The thermal contact is for example made by means of a thermal paste or a thermal adhesive.
• a first cover 300 can be attached to the heat sink 502 to protect the second electronic subassembly 900, in particular from splashing water and the intrusion of other pollutants.
• a second cover 600 may be attached to the heat sink on the heat sink 502 opposite to the first cover 300.
• the first cover 300, the heat sink 502 and the second cover 600 can form a composite housing to protect the second electronic sub-assembly 900, the power electronic module 110, the first electronic sub-assembly 700 as well as connection elements such as the first control pin 140 and the second control pin 160.
• Figure 5 shows an electronic system 104 according to a second embodiment.
• the heat sink 502 is cooled by heat exchange with the ambient air. Cooling fins 540 located on the surface of the heat sink 502 opposite to the heat exchange surface between the power electronic module 110 and the heat sink 502 can improve cooling by increasing the heat exchange surface with the heat sink. 'ambiant air.
• the heat exchanger 502, the power electronic module 110, the second electronic sub-assembly 900 and the first electronic sub-assembly 700 are successively arranged in parallel planes.
• a cover 300 fixed on the heat sink 502 makes it possible to protect the power electronic module 110, the second electronic sub-assembly 900, the first electronic sub-assembly 700 as well as the connection elements such as the first control pin 140 and the second. control pin 160.
• openings are made in the cover to allow an air flow to pass between the electronic power module 110 and the first electronic subassembly 700.
• the low height of the current sensor 910 described above limits the obstruction of the air passage by the current sensor 910.
• the first electronic sub-assembly 700 is supported by a support box, for example fixed to the heat sink 502.

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• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Inverter Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=68654560

Family Applications (1)

Country Status (6)

Family Cites Families (6)

• 2019
  • 2019-05-20 FR FR1905245A patent/FR3096549A1/fr active Pending
• 2020
  • 2020-05-11 KR KR1020217041406A patent/KR20220008905A/ko active Search and Examination
  • 2020-05-11 US US17/612,424 patent/US20220209678A1/en active Pending
  • 2020-05-11 CN CN202080045240.7A patent/CN113994583A/zh active Pending
  • 2020-05-11 WO PCT/EP2020/063085 patent/WO2020234029A1/fr unknown
  • 2020-05-11 EP EP20724835.2A patent/EP3973628A1/de active Pending

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