EP3909406A1

EP3909406A1 - Control unit and modular control system of an industrial automation system

Info

Publication number: EP3909406A1
Application number: EP20700260.1A
Authority: EP
Inventors: Ingo Gurlt; Tobias Klug; Michael Schnatwinkel; Ralf Schumacher; Michael Kroner; Klaus Püschner; Marc STRÜNKMANN
Original assignee: Weidmueller Interface GmbH and Co KG
Current assignee: Weidmueller Interface GmbH and Co KG
Priority date: 2019-01-09
Filing date: 2020-01-08
Publication date: 2021-11-17
Also published as: DE202019100078U1; US20220256731A1; CN113316976A; WO2020144209A1; US11991861B2

Abstract

The invention relates to a control unit for an industrial automation system, having a main module (1) with a housing that can, together with a base (10), be placed on a top-hat rail, and with at least two circuit boards (20) arranged in the housing, of which one is a backplane bus circuit board (21 ) and one is a main circuit board (23), wherein a cooling body (50) is associated with the main circuit board (23) for cooling components and wherein the backplane bus circuit board (21) provides a backplane bus, and the cooling body (50) is arranged in the housing, is mounted to the base (10) and carries at least one of the circuit boards (20).

Description

Control and modular control system of an industrial

Automation system

The invention relates to a controller for an industrial automation system, comprising a main module with a housing that can be placed on a top-hat rail with a base, and with at least two in the housing on ordered circuit boards, one of which is a backplane bus circuit board and a main circuit board , wherein the main circuit board is assigned a heat sink for cooling components and wherein the backplane bus board provides a backplane bus. The invention further relates to a modular control system with such a main module.

In industrial automation systems, controllers, also called PLC (Programmable Logic Controller), PLC (Programmable Logic Controller) or PAC (Programmable Automation Controller), are used to control actuators and read measurement data via sensors. As a rule, he actuates the actuators or reads out the sensors via field devices that are connected to the controller via one or more fieldbuses. The field devices include Input and output modules, also called I / O (input / output) modules that provide analog and / or digital input or output channels. Often, not every single field device is connected directly to the fieldbus, but rather via a so-called fieldbus coupler (remote I / O), which is an interface between the fieldbus on the one hand and a subbus, via which a plurality of field devices can be connected. Sensors and actuators can also each be provided with their own fieldbus connection for connection to the fieldbus.

As an alternative or in addition to the transmission via the fieldbus, provision can also be made to connect field devices directly to the controller in a manner comparable to that of a fieldbus coupler, in that the controller provides a subbus which is comparable to that of a fieldbus coupler.

In general, it is provided to arrange controls in a control cabinet assigned to the industrial plant. For this purpose, controls have typical assembly elements such as a top-hat rail mount. The arrangement in a control cabinet sets boundary conditions for the geometric, mechanical, thermal and electrical design of the control.

The for components of the controller and especially for connections of the Control available space is severely limited. The thermal load can also be high, so that a good cooling of the components must be achieved with a compact design. In addition, performance requirements and / or the available interfaces of the controller often change over time, so that the controller can be flexibly expanded.

From document DE 10 2014 1 18 389 A1, an expandable automation device, which can be designed as a control, is known, in which a main module that provides the main functionality can be expanded by one or more connection modules to include the main module with different ones Field bus system. A disadvantage in terms of cost is that in each case a combination of main module and connection module must be used in order to set up a functional control.

It is an object of the present invention to provide a controller and a modular control system which, with a compact structure, enable good cooling of electronic components, which are flexible with regard to the available circuit board area and connection options, and which have a compact structure.

This object is achieved by a control and a control system with the features of the respective independent claim.

A control according to the invention for an industrial automation system of the type mentioned at the outset is characterized in that the heat sink is arranged in the housing, is fastened to the base and carries at least one of the printed circuit boards. The heat sink is thus used as a central element of the control, which carries at least one, preferably also more, of the circuit boards of the main module, i.e. that these circuit boards are attached to the heat sink. In this way, the available space in the housing is optimally used, so that a compact main module with a high component density can be realized. In addition, the assembly of the main module is simplified since a central assembly with printed circuit boards that are attached to the heat sink can be preassembled, which is then inserted as a whole into the base and connected to it.

In an advantageous embodiment of the control, the heat sink has an essentially cuboidal outline and stands with two mutually perpendicular right outer surfaces parallel to the main circuit board and the backplane bus circuit board. In this way, a backplane bus circuit board located in the base and a main circuit board perpendicular to it can be compactly connected to one another via the heat sink. Both the main circuit board and the backplane bus circuit board are preferably fastened to the heat sink.

More preferably, at least one outer surface of the heat sink is designed as a cooling surface with which the components of the main circuit board are in thermal contact. The cooling surface can be stepped and have plateaus at different heights, in order to make good contact between components of the main circuit board of equal height.

In a further advantageous embodiment of the control, the heat sink has at least one mounting foot which projects into the base and is fastened there. The volume available in the base can be used to attach the heat sink and as much usable volume as possible remains in the area for printed circuit boards above the base. In addition, the vertical main circuit board can also be guided parallel to the cooling surface of the heat sink into the base. In this way, additional assembly space is created on the main circuit board without the height of the main module, i. H. to increase the height above the top-hat rail. A protruding into the base portion of the main circuit board can also serve for earth contact to the DIN rail via a contact spring arranged in the base.

In order to enable a quick and uncomplicated assembly of the main module, an assembly comprising heat sinks and printed circuit boards is only attached to the base with the at least one mounting foot.

In a further advantageous embodiment of the control, the heat sink has internal cooling fins through which cooling channels are formed. The heat sink has large outer surfaces that can be used as cooling surfaces and are in thermal contact with components to be cooled, and a high cooling capacity of the heat sink is achieved. The inner cooling fins preferably run perpendicular to the main circuit board in order to dissipate any heat carried from there as best as possible.

In a further advantageous embodiment of the control, the heat sink has external cooling fins next to which at least one additional printed circuit board is arranged. With the at least one additional printed circuit board, the space between the outer cooling fins can be optimally used to create additional installation space for components. The outer cooling fins are preferably parallel to the main circuit board. Preferably, at least one of the outer cooling fins is shorter in a longitudinal direction than other sections of the heat sink in order to make room for electrical connections between the main circuit board and the additional circuit board (s).

The main module can be designed so that it can be operated autonomously as a so-called monolithic controller. It can be connected via a field bus to field devices and in particular also to an output station (remote I / O) which has a field bus coupler and input and / or output modules (I / O modules). It can also be provided that the main module itself acts in addition to the control functionality as a fieldbus coupler and has a direct connection option for I / O modules. Finally, I / O modules can also be included directly in the main module or slots for I / O modules can also be provided in the main module.

In addition, an option for connecting expansion modules to the main module can be provided, so that the control can be operated as a modular control system. The functional scope of the control system can e.g. through a safety control module, servo drive modules, fast and highly precise I / O and camera modules for production measurement and testing technology, memory modules / data loggers, multipli

er / switches, media converters, repeaters, gateways and routers with sniffer and analysis functions (predictive analytics) can be added.

In one embodiment, the main module can have a plug connector coupled to the backplane bus circuit board for connection to an expansion module that can be arranged on the side.

A control system according to the invention comprises a control of the type described above with a main module and is expanded by at least one add-on module, the main module being connected to the at least one expansion module via a backplane bus circuit board.

The results described in connection with the control result in an also flexibly expandable system. The control according to the invention and the control system according to the invention are explained in more detail below on the basis of exemplary embodiments with the aid of FIGS. The figures show:

1 shows a schematic isometric view of a control system;

FIGS. 2-2c show different views of a further exemplary embodiment of a control system;

3a, 3b two different isometric views of an embodiment example of a main module of a controller;

4a-4c show different views of the main module according to FIGS. 3a, b with the housing cover attached;

Fig. 5a - 5d different views of another embodiment of a main module of a controller, shown without housing cover and partially without a base;

Fig. 6a - 6c, the main module of Figures 5a to 5d with the housing sedeckel.

Fig. 7a - 7e different views of a further embodiment of a main module of a controller, shown without housing cover and without a base;

8a, 8b the main module of FIGS. 7a to 7e with base or base and attached housing cover;

9a is an isometric view of a further exemplary embodiment of a main module of a control, shown without a housing cover and without a base;

9b, 9c are each an isometric view of a further embodiment example of a main module of a controller, shown without a housing cover; 10a, 10b show two different isometric views of a first exemplary embodiment of an expansion module for a control system;

Fig. 1 1 a, 11 b two different isometric views of a second exemplary embodiment from an expansion module for a control system;

12a, 12b two different isometric views of a third off

example of an expansion module for a control system; and

13a-13c are schematic top views of a main module of a control

in various connection configurations.

Fig. 1 shows a schematic isometric view of a first embodiment of a control system. The control system comprises a main module 1 and, in this example, an expansion module 2.

In the context of this application, the same reference symbols denote the same or equivalent elements in all the figures. In the expansion module 2, reference symbols of the components are provided with an apostrophe for better differentiation.

The control system of Fig. 1 is easily seen for assembly in a cabinet. The usual assembly orientation is such that the lower, not visible, side in FIG. 1 is fixed vertically in the control cabinet. This page is also referred to below as the assembly page. The side at the top in FIG. 1 is thus aligned parallel to the “mounting side” and also runs vertically when the switch cabinet is installed. It refers to the operator or user and is referred to below as the "front". The side that is visible in FIG. 1 and faces the viewer is oriented horizontally in a typical control cabinet installation and is referred to below as the “underside”. The side that is not visible in FIG. 1 and faces away from the viewer, and which is also aligned horizontally when the switch cabinet is installed, is referred to as the “top side”.

To the left in Fig. 1 of the main module 1, the expansion module 2 follows, which for the sake of better illustration in Fig. 1 separated from Main module 1 is shown. This left side of the main module 1 or the expansion module 2 is the left side even when installed in the control cabinet and is referred to below as such. On the right side of the main module 1, which is the right side of the main module 1 even when installed in a control cabinet and is referred to as such below, input / output modules 3 (not shown) can be connected here.

The main module 1 has a base 10 on which a housing cover 60 is placed. The base 10 is, as shown in this exemplary embodiment, preferably be constructed from a plurality of components, in the present case from three locking supports 11 aligned parallel to one another, which are spaced apart by spacer elements 16. The locking bracket 1 1 are used to attach the main module 1 to a top-hat rail of the control cabinet, on which they can be snapped on.

At the top of the main module 1 1 1 release lever 13 are arranged on each locking bracket, which unlock the locking bracket 1 1 when actuated, so that the main module 1 can be removed from the DIN rail. The arranged on the right side of the main module 1 locking bracket 1 1 has protruding locking hooks 14, with which the input / output modules 3 can be snapped onto the main module 1. The input / output modules 3 are in turn equipped with comparable latching supports 11 so that they can be placed on the top hat rail and snapped onto the main module 1.

The right locking bracket 1 1 of the main module 1 also carries various bus contacts 15, via which a power supply and also data can be transmitted to the attached input / output modules 3. The mechanical configuration of the right side of the main module 1 and the electrical and mechanical configuration of the bus contacts 15 corresponds to that of a fieldbus coupler of the same system, so that the input / output modules 3 designed for this system of the same fieldbus coupler can connect directly to the main module 1 of the control system . This enables the input / output modules 3 to be used directly without an interposed fieldbus and fieldbus coupler.

In the same form factor, which the input / output modules 3 have, the right side of the main module 1 is designed. It has a section in which power supply connections 31 are positioned. The power supply connections se 31 are formed as plug-in elements with a circuit board edge connector, which are plugged onto a circuit board arranged below (see, for example, FIGS. 2a or 3a). The plug-in elements can provide 31 different desired contact types as power supply connections, for example push-in contacts, screw contacts or plug connectors. In order to be able to exchange the Einsteckele elements of the power supply connections 31, the Ge housing cover 60 is formed in this area as a foldable folding bar 62. This system and this form factor is preferably implemented in a comparable manner in the attachable input / output modules 3.

In its wider left part, the installation space of the main module 1 is larger and, in accordance with the housing cover 60, is formed by a main cover 61 which rises in height from the folding bar 62. Ventilation openings 63 are preferably formed on the top and bottom, through which a convection air flow leads from bottom to top through the main module 1. In more extreme thermal environmental conditions, a fan can be placed on the bottom or the top of the main cover 61, which causes a forced air flow through the main module 1 for better cooling. In harsher environmental conditions, filter elements can also be provided which minimize the ingress of dirt through the ventilation openings 63.

In the illustrated embodiment of the main module 1, connections 30 are provided on the underside, whereas the front of the main module 1 has switching and signaling elements 40, for example status indicators, switches or buttons. An antenna connection 33 is also arranged on the front. In addition, a memory card connector 34 with an insertion slot for e.g. (micro) SD memory card arranged. Details of the inner structure of the main module 1 are explained in the following figures.

The expansion module 2, which can be plugged into the left side of the main module 1, has a fundamentally comparable structure. The extension module 2 also comprises a base 10 ″ which has latching supports 1 T which are spaced apart from one another by spacing elements 16 ″. Latching hooks 14 ″ the latching connection with the main module 1.

In Fig. 1, a housing cover 60 'of the expansion module 2 is indicated only by ge dashed outlines and is otherwise transparent Darge, so that an internal structure is visible. In the expansion module 2, a printed circuit board 20 'is arranged vertically, which has an upper end in FIG. Conclusions 30 'carries. These are correspondingly accessible from the front of the expansion module 2 forth. On the right side of the expansion module 2 there are bus contacts 15 ', in the embodiment shown in the form of a circuit board edge connector. The main module 1 and the expansion module 2 are coupled to one another via the bus contacts 15 '. Optionally, several, in particular two, printed circuit boards 20 can also be arranged parallel to one another in a supplementary module 2, in order to inexpensively enlarge the assembly area and / or by means of assembly variants of the connections on the two printed circuit boards 20, the article variety of the expansion modules 2. The structure of the expansion module 2 is shown in more detail in the following figures.

2a to 2c, another embodiment of a control system is shown in different views. 2a and 2b each show a schematic isometric view from two different viewing directions and FIG. 2c shows a top view of one side of the control system. 2a to 2c, housing covers 60, 60 'are removed in order to provide an insight into the internal structure of the control system.

In the control system shown in FIGS. 2a to 2c, a main module 1 is connected to two expansion modules 2. Both extension modules 2 are inserted one behind the other on the left side of the main module 1, a first extension module 2 is therefore directly connected to the main module 1 and a second extension module 2 is inserted into the first extension module 2. This is possible because the bus contacts 15 'of the expansion module 2 are looped through, so that a number of expansion modules 2 can be strung together. For this purpose, the left side of each expansion module 2 is configured analogously to the left side of the main module 1.

The basic structure of the main module 1 and the expansion modules 2 shown are constructed in a manner comparable to that of the first exemplary embodiment according to FIG. 1. Small differences relate to the design of the heat sink 50, which in the exemplary embodiment of FIGS. 2a to 2c occupies the overall height of the main module 1 , whereas in the embodiment of FIG. 1 there is a free space above the heat sink 50 which can be used for other purposes if necessary.

A further difference relates to the configuration of the bus contacts 15 ', which in the exemplary embodiment in FIGS. 2a to 2c do not function as circuit board edge connectors. are formed. Instead, connectors 26 and 26 'are provided, which are plugged into one another and have bus contacts 15'. In order to make it possible to connect a number of extension modules 2 to one another, the extension modules of FIGS. 2a to 2c also have a printed circuit board 20 'which is aligned parallel to the mounting side or front side and which receives the plug connectors for the bus contacts 15' and which is electrically connected via a further one Plug connector with main (PCB) 20 'aligned perpendicular to it.

The function of the various printed circuit boards 20 and 20 'of the main module 1 and the expansion modules 2 are also described in more detail below.

3a, 3b and 4a - 4c, an embodiment of a main module 1 of a controller is shown in more detail. 3a and 3b show the Hauptmo module 1 without the housing cover 60 attached to get an insight into the internal structure. 4a to 4c show different views of the main module 1 with the housing cover 60 attached. FIGS. 3a, 4b and 4a, 4b are each isometric views from different viewing directions and FIG. 4c is a plan view of the front of the main module 1.

The design of the base 10 of the main module 1 corresponds to that of the main module 1 according to FIGS. 1 and 2a to 2c. Reference is hereby made to the associated description.

The present main module 1 has a plurality of printed circuit boards 20, the arrangement and function of which will be explained in more detail below.

On the base frame 18 of the base 10, a backplane bus plate 21 is first arranged, which he stretches over the entire surface of the base frame 18. To the right, the backplane bus circuit board 21 extends slightly beyond the base frame 18 to the circuit board support 17. The circuit board carrier 17 carries vertically a connecting circuit board 22, which is inserted into the circuit board carrier 17 and extends to the bus contacts 15 on the right side of the main module 1.

The bus contacts 15, via which a power supply and data connection of the input / output modules 3 takes place, are correspondingly contacted directly via the connection circuit board 22. The connection circuit board 22 is perpendicular to the rear wall bus circuit board 21 and is with this via an angled connector 26th connected. The connection circuit board 22 has at its upper end printed circuit board edge connectors, onto which the power supply connections 31, which are arranged in the folding strip 62 (cf. FIGS. 4a to 4c), are attached.

The main module 1 is supplied with supply voltage, generally a direct voltage in the range of 24 V, via these power supply connections 31. On the connection circuit board 22, electronic components for the provision of the power supply to the main module 1 and the input / output modules 3 and plugged-in expansion modules 2 are arranged. Basically, components arranged on printed circuit boards 20 are only shown as examples in the context of this application. It goes without saying that the space not occupied by components in the figures is available on all printed circuit boards 20 for electrical or electronic components. All printed circuit boards 20 can be equipped on one or (preferably) on both sides.

The backplane bus circuit board 21 accommodates a backplane bus for the main module 1 and any expansion modules 2. The backplane bus provides power supply and data lines. The data lines form at least one standardized and / or proprietary data bus. The lines of the rear wall bus are e.g. passed on via the bus contacts 15 'to an inserted expansion module 2.

As shown in FIGS. 3a and 3b in particular, on the backplane bus board 21 there is a main board 23 vertically approximately centrally in the main module 1, which contains the essential functional elements of the main module 1, in particular one or more CPUs (central processing units), one or more FPGA (Field Programmable Gate Array), memory modules such as RAM (Random Access Memory), NVRAM (Non Volatile RAM), an RTC (Real Time Clock), as well as interface drivers for interface connections 32, for an antenna connection 33 and switching and signal elements 40 .

These interface connections 32 and switching and signaling elements 40 are arranged in the front (in FIGS. 3a and 3b upper) area of the main circuit board 23. The switching and signal elements 40 and an antenna connection 33 can be arranged on the edge of the main circuit board 23 (see, for example, FIG. 3a), whereas the various interface connections 32 are positioned on the side of the main circuit board 23 facing away from the connection circuit board 22. In particular, 32 RJ-45 connections are provided as interface connections or D-SUB connections, which are also used as fieldbus connections. be set. Furthermore, interface connections 32 can be designed as SFP (Small Form Factor Plugable) network connections, as USB connections, as display connections or also as BL / SL connections. The antenna connection 33 can be designed, for example, as an SMA floch frequency connection.

A cooling body 50 is positioned between the connection circuit board 22 and the main circuit board 23. A cooling surface 51 facing the main printed circuit board 23 is in thermal contact with heat-generating components of the main printed circuit board 23, which are preferably arranged on the side of the printed circuit board facing the cooling body 50. All heat-generating components such as the CPU, the FPGAs etc. can thus be cooled via the heat sink 50.

The heat sink 50 is fixed in the example shown (see FIGS. 2a to 2c) on mounting domes 19 which are formed in the base 10. The assembly domes 19 can be guided through an opening in the backplane bus circuit board 21, so that the heat sink is connected directly to the base 10. Alternatively, the assembly dome 19 can end below the backplane bus circuit board 21 and it can lead a screw through the backplane bus circuit board 21 and a dance piece into the heat sink 50, so that the heat sink 50 is fastened together with the backplane bus circuit board 21 to the base 10.

In the illustrated embodiment of FIGS. 3a and 3b, the upper cooling channel 52 facing the front in the FIGS. Is not formed over the entire width of the heat sink 50, so that a space is created on the rear side of the main circuit board 23 in which a small Additional circuit board 25 aligned parallel to main circuit board 23 is positioned. This can be connected to the main circuit board 23 via solder pins and / or plug connectors and can accommodate additional switching and signal elements 40 or connections 30.

In the example shown (see FIG. 3a), the additional circuit board 25 provides a memory card connection 34 for receiving a micro SD memory card and a battery connection 35 for receiving and contacting a buffer battery for supplying z. B. the real-time clock (RTC).

As can be seen in FIGS. 4a to 4c, the area in which the memory card connector 34 and also the battery is arranged can be covered by an access flap 64 in order to protect an inserted memory card or battery from inadvertent removal. In the main cover 61, a display can also be arranged, or an opening through which a display is accessible. The Display can be equipped with a touch function and form a switching and signal element 40.

The in this embodiment of FIGS. 3a, 3b and 4a to 4c (and also the examples of FIGS. 5a-5d, 6a-6c, 7a-7e, 8a and 8b) positioned in the front interface ports 32 can also be used in alternative configurations be wholly or partly accessible from the underside of the main module 1, as is implemented in the embodiment of FIGS. 1 and 2a to 2c.

On the left side of the main module 1, an optional supplementary circuit board 24 can be arranged parallel to the main circuit board 23 (see, for example, Figs. 2a to 2c, 3a, 3b or also 9a to 9c). This supplementary circuit board 24 can, for example, also have interface drivers and further interface connections 32, which are then accessible on the front or underside of the main module 1. In this way, a greater variety of interfaces can be provided. The individual interface connections 32 are positioned on the main circuit board 23 and the supplementary circuit board 24 in such a way that they take advantage of the space between these circuit boards without being disturbed. Components protruding into the installation space and in particular the interface connections 32 on the main circuit board 23 and the supplementary circuit board 24 are preferably arranged in a toothed and interlocking manner. The installation space can be used as best as possible in a wide variety of configurations.

The supplementary circuit board 24 can also be used to provide particularly fast input / output channels via FPGA or GPIO (General Purpose Input Output) modules with direct access to the backplane bus, if necessary. In this way, special input / output channels with switching times in the nanosecond range can be implemented.

In a recess of the supplementary circuit board 24, the plug contact is mounted on the backplane bus board 21 in order to connect expansion modules 2 to the main module 1 via the bus contacts 15 ′ thereof. In addition to the function of forwarding and distributing the backplane bus, the backplane bus plate 21 can alternatively also be used to accommodate support capacitors for smoothing and supporting the power supply line of the backplane bus. It is also conceivable to arrange the buffer battery of the real-time clock (RTC), which is located on the additional circuit board 25 in the exemplary embodiment shown on the top or bottom of the backplane bus circuit board 21 (cf. FIG. 7e). In the housing cover 60 or the base 10 there is then a corresponding place Flap or cover provided through which the backup battery is accessible and can be replaced. There may also be a drawer into which the backup battery is inserted in order to be able to easily replace the backup battery.

5a to 5d and 6a to 6c show a further exemplary embodiment of a main module 1 of a control system. FIGS. 5a to 5d show the main module 1 without the housing cover 60 attached, whereas FIGS. 6a to 6c show the main module 1 with the housing cover 60 attached.

In this exemplary embodiment, too, the base 10 of the main module 1 is designed as in the previous exemplary embodiments, to which reference is hereby made. The following essentially deals with the differences from the exemplary embodiments described above.

In the embodiment shown here is next to the connection circuit board

22 and the backplane bus circuit board 21 and any additional circuit boards 25 used, only one main circuit board 23 and no supplementary circuit board 24 are provided.

In order to make the best possible use of the available space, the main circuit board 23 is arranged in the area of the left side of the main module 1. The switching and signaling elements 40 are in turn along a section of the upper (based on the illustration in the figures) edge of the main circuit board

23 positioned. Due to the arrangement of the main circuit board 23 laterally in the main module 1, the side connections 32 (again in particular RJ-45 and USB connections) which clearly protrude from the main circuit board 23 are arranged to the right in the main module 1 on the main circuit board 23. In an area below (again based on the representation of the Figu ren), the heat sink 50 is brought close to the main circuit board 23 in order to be able to thermally connect heat-emitting components of the main circuit board to the cooling body 50 and to be able to cool via the heat sink 50. In the upper area of the heat sink 50, this is released to make room for the

To be able to provide interface connections 32 and the additional circuit board 25. With a lower cooling requirement, the section of the heat sink 50 located next to the interface connections 32 may be dispensed with, so that again more space is available for the additional printed circuit board 25 shown or space for an additional printed circuit board 25 aligned parallel to the front. Another difference from the previous exemplary embodiments relates to the configuration of the printed circuit boards 20 in the region of the connection between the backplane bus printed circuit board 21 and the main printed circuit board 23.

As can be clearly seen from FIG. 5b, on the left side of the main module 1 the backplane bus circuit board 21 in turn leads to a plug contact via which the backplane bus can be transferred to plug-in expansion modules 2. The backplane bus circuit board 21 is, however, only in the area of this plug contact up to the edge of the base frame 18 of the main module 1. In the upper and lower section (based on the mounting orientation of the main module 1 in the control cabinet), the backplane bus circuit board 21 ends in front of the main circuit board 23. This allows the main circuit board 23 to be extended downwards into the base 10, as a result of which more assembly area is available. The area of the connector to the expansion modules 2 is left out. 5c, the main module 1 is shown from the same viewing direction as in FIG. 5b, but the base 10 is removed in order to be able to display the main circuit board 23 in its entire size. This figure further shows that the heat sink 50, with a section which forms a mounting foot 57, also protrudes into the base 10, which serves to secure it.

In addition to the connector carried out for forwarding the rear wall bus to the expansion modules 2, a Winkelver connector, not shown here, is arranged, which transmits the backplane bus from the main circuit board 23 to the backplane bus circuit board 21. In an alternative embodiment, both connectors can be combined, in such a way that the main circuit board 23 has a connector on the front and rear side, which on the one hand interacts with a corresponding mating connector on the backplane bus board 21 and forwards the backplane bus to the expansion module 2. Such an arrangement of connectors is also referred to as a 180 ° connector.

The larger area of the main circuit board 23, which can be achieved in this way, makes it possible to accommodate the essential functions on a circuit board, as a result of which the supplementary circuit board 24 can be omitted. Sufficient circuit board space with compact housing dimensions is provided for most required applications. The variant shown in these figures thus represents an inexpensive version of the control system. The formation of all essential components on the main circuit board 23 also offers the advantage that high-frequency clocked signals are routed via a few plug connectors. which results in a good signal flow and thus the use of high clock frequencies. Saving the supplementary circuit board 24 also has a cost-reducing effect on the system if only a small number of connections and a small article variance is required.

Another small difference from the previously shown exemplary embodiments lies in the assignment of the connections 30 and switching and signal elements 40 to the different printed circuit boards 20. In the present example, the antenna connection 33 is arranged on the additional printed circuit board 25. This is advantageous if the antenna connection 33 and / or further interface connections 32 are not tough on the basic equipment of the main module 1, but can be added subsequently by retrofitting the additional circuit board 25.

On this circuit board 23, the memory card connector 34 is also formed on the main circuit board 23. All of the connections and function blocks required to operate the main module can be implemented on the main circuit board 23 or the backplane bus circuit board 21 and the connection circuit board 22. Optional features such as the antenna connection 33 can then be retrofitted via the additional circuit board. As already mentioned in connection with the previous exemplary embodiment, a buffer battery for a real-time clock of the system can be accommodated on the backplane bus circuit board 21, for example.

7a to e and 8a and 8b, a further embodiment of a main module 1 of a controller is shown in different views. 7a to e show the main module 1 without a housing. 8a, the arrangement shown in FIGS. 7a to e is inserted into a base 10. Finally, FIG. 8b shows the complete main module 1 with a base 10 and an attached upper housing part 60. 7a and 7b are isometric oblique views of the main module 1, which is shown here without a base 10 and without a housing cover 60, FIG. 7c shows a plan view of the main module 1, FIG. 7d shows a side view and FIG. 7e shows a plan view of the underside of the main module 1, that is to say a view from the direction of the base 10 (not shown here).

With regard to the basic structure, the main module 1 shown in FIGS. 7a to e and 8a, b is constructed in the same way as the main module 1 described in connection with the previous figures. In particular, there is again a number of printed circuit boards 20, specifically a backplane bus board 21, egg ne connection circuit board 22, a main circuit board 23 and an additional circuit board 25. The backplane bus circuit board 21, as in the previous embodiments, is parallel to a top-hat rail onto which the main module 1 can be snapped on. The backplane bus circuit board 21 therefore also rests on the base 10, as shown in FIG. 8a, which in turn has 3 latching supports 11 which are spaced apart from one another by spacing elements 16. Opposite the backplane bus circuit board 21, the main circuit board 23, the connection circuit board 22 and the circuit board 25 are arranged vertically.

As in the previously shown exemplary embodiments, the heat sink 50 is arranged centrally in the main module 1 and, in addition to its function for cooling components of the main module 1, also serves to hold several of the circuit boards 20. The heat sink 50 thus represents the central and load-bearing element of the main module 1. It extends over the entire extent of the main module 1 in a direction perpendicular to the top-hat rail, i. H. in the direction in which the locking carriers 1 1 extend.

In this direction, the cooling channels 52 are also formed by inner fins 53. When mounting the main module 1 on a top-hat rail, the cooling channels 52 run vertically, so that a convection of cooling air through the cooling channels 52 sets in by convection. If necessary, as described in connection with the exemplary embodiment of FIG. 1, a fan can be placed on the outside of the housing 60, for example, which increases a draft through the ventilation openings 63 and the cooling channels 52.

The inner cooling fins 53 are formed parallel to the rear wall of the printed circuit board 21 in a lower region of the heat sink 50, which takes up approximately half or slightly more than half the overall height. They thus dissipate heat from the cooling surface 51, which runs parallel to the main circuit board 23. In this example, the inner fins 53 do not extend to the opposite wall of the heat sink 50 in order to simplify its production in a continuous die-casting process.

With this cooling surface 51 are electronic components, which are arranged on the side facing the heat sink 50 of the main circuit board 23, in thermal contact. The cooling surface 51 can be of stepped design and have plateaus at different heights in order to make good contact with components of the main circuit board of equal height.

In an upper region of the heat sink 50 in the figures, the otherwise rectangular outline of the heat sink 50 is left out in order to make room for the cutting Position connections 32 and / or switching and signal elements 40, which are arranged on the main circuit board 23, ready to provide. In the remaining section of the heat sink 50, outer cooling fins 54 are aligned parallel to the main circuit board 23. They are thus also parallel to the additional printed circuit board 25, which for example accommodates modules for wireless communication and carries an antenna connection 33. Elements to be cooled on the additional printed circuit board 25 can be coupled to the adjacent cooling fin 54. In the area of the recess, a mounting groove 55 is provided in the heat sink 50, which serves to fasten the printed circuit board 25.

As in the previously described exemplary embodiments, the main circuit board 23 is also mounted on the heat sink 50 in this case. For example, in Fig. 7b mounting screws 232 can be seen, which lead through the main printed circuit board 23 and are screwed into corresponding threaded bores of the heat sink 50. In addition, the backplane bus circuit board 21 is also screwed to the heat sink 50, which for this purpose has fastening bores 56, which can be seen, for example, in FIG. 7a. The backplane bus circuit board 21 and the main circuit board 23, as well as the additional circuit board 25 together with the heat sink 50 form a preassembled module which is electrically functional and which as a whole is inserted into the base 10 for assembly.

To mount the unit mentioned in the base 10, the heat sink 50 is comparable to the embodiment of FIGS. 5a-d and 6a-c mounting feet 57, with which it through a recess at the edge of the backplane bus 21 te into the area of the base 10 protrudes. In the base 10, guides for the mounting feet 57 are preferably formed, which receive an inserted heat sink by 50 laterally in a form-fitting manner. As can be seen particularly well in FIG. 7 b, in the exemplary embodiment shown, the main circuit board 23 is also continued downward beyond the level of the backplane bus circuit board 21 in the direction of the base 10 and protrudes like the mounting feet 57 into the base 10. In this way, additional assembly space on the main circuit board 23 is created without the height of the main module 1, d. H. to increase the height above the top-hat rail.

A recess 231 is provided in the area of the top-hat rail itself or the top-hat rail receptacle 12 of the base 10. The view of the underside of the rear wall bus circuit board 21 in FIG. 7e shows the mounting feet 57 carried downward, each with a mounting hole 58, by means of which the cooling element used body 50 can be screwed to the base from below. In this Figil extension components 21 1 of the backplane bus board 21 can also be seen, which also protrude down into the base 10 and thus use its volume. In the figure, fastening screws 212 are also to be seen, with which the backplane bus board 21 is screwed to the heat sink 50.

In Fig. 9a, another embodiment of a main module 1 of a control is shown. Comparable to Fig. 8a is an isometric oblique view of the main module 1 is shown, wherein a base 10 and an attached Ge housing cover 60 are not shown in this figure.

The basic structure of the embodiment shown in Fig. 9a corresponds to that of Figs. 7a-7e and 8a, b, in particular what the assembly of the heat sink 50 be. In this exemplary embodiment, too, this has mounting feet 57 projecting downward into the base 10. With the heat sink 50, the main circuit board 23 and also the backplane bus circuit board 21 are connected, for example via the fastening screws 212 visible in FIG. 9a.

Just as in the previously described embodiment, in the cooling body 50 in a lower, adjacent to the backplane bus board 21, inner cooling fins 53 are formed parallel to the backplane bus board 21 and in the upper, away from the backplane bus board 21 part of the heat sink 50 outer cooling fins 54 perpendicular to the backplane bus board 21 aligned.

In contrast to the exemplary embodiment described above, the heat sink 50 is designed to be wider in the direction of the top-hat rail. A total of four outer cooling fins 54 are present parallel to the main circuit board 23 and are distributed over the entire width of the heat sink 50. There are three spaces between the cooling fins 54, in each of which there is an additional printed circuit board 25. For fastening at least a part of these additional circuit boards 25, there is again a fastening groove 55 in the heat sink 50, into which fastening screws which can be flexibly positioned can be screwed.

In order to be able to make electrical connections between the main circuit board 23 and the additional circuit boards 25 or between different ones of the additional circuit boards 25, three of the four outer fins 54 mentioned, between which the additional circuit boards 25 are positioned, are not over the entire extent of the heat sink 50 is formed. Specifically, the first and third of the aforementioned cooling fins 54 in FIG. 9 a end in front of the rear, invisible end of the cooling body. The second of the cooling fins 54 (again seen from the left) does not reach the other outline of the cooling body 50 on both sides . The connections made between the main circuit board 23 and the additional circuit boards 25 or between the circuit boards 25 to each other can be fasteners of various types. In addition to printed circuit board connectors, cable connectors can also be provided, in particular for the transmission of high-frequency signals. For example, the additional printed circuit board 25 on the right in FIG. 9a carries a number of antenna connections 33 which are designed in accordance with the SMA (Sub-Miniature-A) standard. These antenna connections 33 serving electronic components can, for example, also be arranged on the adjacent additional printed circuit board, which also carries antenna connections 33, high-frequency signals being exchanged between the two printed circuit boards via miniature high-frequency connectors and coaxial cables. Suitable miniature high-frequency connectors are, for example, UMTC (Ultra-Miniature-Telecommunications-Connector) connectors. For the coaxial cables are used before those with a diameter in the range of one millimeter. Positioning of the antenna connections 33 serving electronic components on the supplementary circuit board 24 or the backplane bus circuit board 21 is also possible.

A further difference between the exemplary embodiment in FIG. 9a and that described above lies in the presence of a supplementary printed circuit board 24 which supplements the functionality of the main printed circuit board 23. This is arranged parallel to the main circuit board 23 and is connected to this via a circuit board connector which is formed in the plane of the backplane bus circuit board 21. On the supplementary circuit board 24, for example, radio and / or memory modules 241 are arranged on the opposite side of the supplementary circuit board 24 from the main circuit board 23. The radio and / or memory modules 241 are thus accessible after removal of the housing cover 60 (not shown here) or opening a correspondingly arranged flap in the side wall of the housing cover 60 in order to be able to be supplemented or exchanged.

Fig. 9b shows in a similar way as Fig. 9a another embodiment of a main module 1 of a controller. The main module 1 is shown in an isometric oblique view, wherein in this illustration a set-on housing cover 60 is also not shown, but unlike in FIG. 9a a base 10 is shown. The basic structure of the exemplary embodiment shown in FIG. 9b corresponds to that of FIG. 9a, in particular in turn relating to the assembly of the heat sink 50. Here, too, the heat sink 50 has mounting feet 57 projecting downward into the base 10. The main board 23 and also the backplane bus board 21 are connected to the heat sink 50. Elements to be cooled of the fluff board 23 can thus be in direct contact with one of the cooling surfaces 51 of the heat sink 50. To optimize the available placement space on the floss board 23, this is also led into the base 10 in the area of the mounting feet 57. This is done in the form of two tab-like sections protruding into the base 10, which are separated from one another in the central region by a cutout, analogous to the cutout 231 of the example in FIG. 7b.

In contrast to the example of FIG. 9a, the dimensions of the heat sink 50 are otherwise cuboid without the outer cooling fins 54 protruding upwards in the example of FIG. 9a. The heat sink 50, like the example of FIG. 9a, does not extend over the entire fleas of the main circuit board 23, so that above (based on the illustration in FIG. 9b) the heat sink 50 there is space for three additional circuit boards 25 which, similarly to the example in FIG. 9a, connections 30, for example interface connections 32 and / or antenna connections 33 as well as switching and signaling elements 40. The cooling body has a fastening groove 55 for fixing at least one of the additional printed circuit boards 25.

Also as in the example of FIG. 9a, a supplementary circuit board 24 is arranged parallel to the main circuit board 23 on the side opposite the heat sink 50. The distance between the supplementary printed circuit board 24 and the main printed circuit board 23 is selected to be larger than in the example in FIG. 9a in order to provide further assembly space and in particular space for accommodating connections 30.

In the example, interface connections 32 are shown, specifically D-SUB connections 32 on the supplementary circuit board 24 and RJ-45 connections on the main circuit board 23. In order to make the best possible use of the installation space between the main circuit board 23 and the supplementary circuit board 24, components projecting into this installation space and in particular connections 30 such as the interface connections 32 shown here are arranged such that they interlock with one another. On the opposite side of the main circuit board, he supplementary circuit board 24, in turn, radio and / or memory modules 241 can be provided, which can be used, if necessary, for additional To provide functionalities or additional storage space. In the housing cover 60 shown here, closable openings can be provided at the corresponding points, for example flaps or removable covers, in order to provide access to the radio and / or memory modules 241.

FIG. 9c shows a further exemplary embodiment of a control in the same way as in FIG. 9b. With regard to the basic structure, reference is made to the description of the previous figures. The exemplary embodiment in FIG. 9 c represents a symbiosis of the examples in FIGS. 9 a and 9 b. As in the example in FIG. 9 a, the heat sink 50 is also provided with external cooling fins 54. As in the case of FIG. 9b, the distance between the main circuit board 23 and the supplementary circuit board 24 is widened compared to the example of FIG. 9a in order to offer a large installation space for equipping the circuit boards and in particular for receiving connections 30. A comparison with FIG. 9b shows that further interface connections 32 are used in FIG. 9c. The large space available for interface connections 32 enables the cost-effective generation of a high article variety desired by the customer with the possibility of flexibly arranging many interface connections 32.

10a and 10b, 1 1 a and 1 1 b and 12a, 12b each show isometric views from different directions of three examples of an expansion module 2 for a control system. The first example shown in FIGS. 10a and 10b is also shown in the control system of FIG. 1. The second, in FIGS. 1 1 a and 1 1 b shown example of the expansion module 2 is used in the example of FIGS. 2a to 2c.

In the first example of FIGS. 10a and 10b, a vertically arranged main circuit board 23 'is provided, which has connections 30' at its upper edge (in the figures), that is to say towards the front side, specifically interface connections 32 '.

In a section of the main circuit board 23 'adjacent to the base 10, a so-called 180 ° connector is arranged, which provides plug contacts to both sides of the main circuit board 23'. In this connector, a backplane bus circuit board 21 'is used on the right-hand side, which extends to a cut-out in the housing cover 60' shown in the figure. When the expansion module 2 is connected to a main module 1, the backplane bus board 21 ′ contacts a corresponding connector in the main module 1. At the same time, a similar Licher connector for contacting additional expansion modules 2 is provided.

The example shown in FIGS. 1 1 a and 1 1 b differs from the first in that, similar to the main module 1, a backplane bus circuit board 21 'is provided, which is aligned parallel to the mounting side or front side and which is on each side of the Expansion module 2 has a connector. The main circuit board 23 'is placed vertically on the backplane bus circuit board 21' and is electrically connected to it via a further plug connector. A section of the main circuit board 23 'protrudes into the base 10, whereby, for example, ground contact can be made to the top-hat rail via a contact spring arranged in the base 10.

The expansion module 2 shown in FIGS. 12a and 12b differs from the ones shown above in that, in addition to and parallel to the main circuit board 23 ', an additional circuit board 24' is provided in order to provide additional circuit board space for equipping components. In the example shown, the supplementary circuit board 24 '' is arranged above (based on the representation of FIGS. 12a, 12b) the connector 26 and is also formed less high than the main circuit board 23 '. In alternative configurations, the main circuit board 23 'and supplementary circuit board 24' can, however, also be designed with the same overall height. In this case, interface connections and / or switching and signal elements 40 'can also be arranged on the supplementary circuit board 24'. In the example shown, these are mounted exclusively on the main circuit board 23 '. Similar to the main circuit board 23 and the supplementary circuit board 24 of the main module 1 (see, for example, the description of FIGS. 9a to 9c), the provision of the supplementary circuit board 24 'in the expansion module 2 can also be accompanied by interlocking assemblies, which is cost-effective a high article variance desired by the customer can be provided with the same basic structure of the expansion modules 2.

The extension modules 2 extend the control system by additional interfaces or also by application modules. Application modules can contain functions or combinations of interfaces. Application modules combine functions for specific areas of application.

The direct connection of the expansion modules 2 to the backplane bus of the main module 1 makes it possible to exchange a high data rate via the expansion modules 2. The expansion modules 2 can also be regarded as "high-speed modules" or can be an output Form module for particularly short switching times. To expand the range of functions of the control system, the expansion modules 2 can also be used as memory modules, as repeaters, as camera modules, as gateways, as multipliers, switches or repeaters, as media converters, as data loggers, as routers for data analysis, possibly with sniffer and / or analysis function (for example predictive analytics) or to provide safety functions.

FIGS. 13a to 13c each show a schematic plan view of the front (only in the area of the fluff cover 61) of the fluff module 1.

Various possible constellations of the front with connections 30 and switching and signal elements 40 are shown schematically and not in the exact geometric position. The various configurations of FIG.

13a to 13c differ in the type of connections 30 or switching and signal elements 40 and in particular the density with which these connections 30 and switching and signal elements 40 are arranged on the front side.

The exemplary embodiments shown in FIGS. 13a and 13b can be achieved, for example, with the basic structure of all previously shown exemplary embodiments of a main module 1. The configuration shown in FIG. 13c with a very high density of connections 30 and switching and signal elements 40 can preferably be implemented with the exemplary embodiments from FIGS. 3a and 3b and 4a to 4c and 9a to 9c, since in these exemplary embodiments in addition to the main circuit board 23 the supplementary circuit board 24 is available, in particular to accommodate further interface connections 32.

Reference numerals

1 main module

2 expansion module

3 input / output module

10 bases

1 1 locking bracket

12 DIN rail mount

13 release lever

14 locking hooks

15 bus contacts

16 spacer

17 PCB carriers

18 base frame

19 assembly tower

20 circuit boards

21 backplane bus circuit board

21 1 component

212 fixing screw

22 Connection circuit board

221 PCB edge contacts

23 main circuit board

231 Cut-out for top hat rail

232 fastening screw

24 supplementary circuit board

241 radio and / or memory module

25 additional circuit board

26 connectors

30 connections

31 Power supply connection

32 interface connection

33 Antenna connection

34 memory card connector

35 Battery connection

36 audio connection 40 switching and signaling elements

50 heat sinks

51 cooling surface

52 cooling channel

53 inner cooling fin

54 outer cooling fin

55 mounting groove

56 mounting hole 57 mounting foot

58 mounting hole

60 housing cover

61 main cover

62 folding bar

63 Breakthrough in ventilation

64 access hatch

Claims

Expectations

1. Control for an industrial automation system, comprising a main module (1) with a housing, which can be placed on a DIN rail with a base (10), and with at least two circuit boards (20) arranged in the housing, one of which has a backplane bus circuit board (21) and a main circuit board (23), wherein the main circuit board (23) is assigned a heat sink (50) for cooling components and wherein the backplane bus circuit board (21) provides a backplane bus, characterized in that

the heat sink (50) is arranged in the housing, is attached to the base (10) and carries at least one of the printed circuit boards (20).

2. Control according to Claim 1, in which the main module (1) has a plug connector (60) coupled to the backplane bus circuit board (21) for connecting at least one expansion module (2) which can be arranged in a row.

3. Control according to claim 1 or 2, wherein the heat sink (50) has a substantially cuboidal shape and is parallel to the main circuit board (23) and the backplane bus circuit board (21) with two mutually perpendicular outer surfaces.

4. Control according to one of claims 1 to 3, wherein at least one outer surface of the heat sink (50) is designed as a cooling surface (51) with which the components of the main circuit board (23) are in thermal contact.

5. Control according to one of claims 1 to 4, wherein the rear wall bus circuit board (21) is arranged flat on or in the base, so that it is aligned parallel to a top-hat rail on which the main module (1) is placed.

6. Control according to one of claims 1 to 5, wherein the main circuit board (23) and the backplane bus circuit board (21) on the heat sink (50) are attached.

7. Control according to claim 5 and 6, wherein the heat sink (50) has at least one mounting foot (57) which projects into the base (10) and is fastened there.

8. Control according to claim 6, wherein the heat sink (50), the main circuit board (23) and the backplane bus circuit board (21) form a preassembled bare assembly which is attached as a whole to the base (10).

9. Control according to claim 8, wherein the assembly is attached to the base (10) only with the min least one mounting foot (57).

10. Control according to one of claims 1 to 9, wherein the main circuit board (23) has at least one section which projects into the base (10).

1 1. Control according to one of claims 1 to 10, in which the heat sink (50) has inner cooling fins (53) through which the cooling channels (52) are formed.

12. Control according to claim 11, wherein the inner cooling fins (53) perpendicular to the main circuit board (23).

13. Control according to one of claims 1 to 12, wherein the heat sink (50) has outer cooling fins (54), next to which at least one additional circuit board (25) is arranged.

14. Control according to claim 13, wherein the outer cooling fins (54) pa rallel to the main circuit board (23).

15. Control according to claim 13 or 14, wherein at least one of the outer cooling fins (54) is shorter in a longitudinal direction than other sections of the heat sink (50).

16. Control according to one of claims 1 to 12, in which a supplementary circuit board (24) is arranged in the main module (1) parallel to the main circuit board (23).

17. Control according to claim 16, in which components on mutually facing sides of the main circuit board (23) and the supplementary circuit board (24) are arranged in a toothed and interlocking manner.

18. Control system with a controller having a main module (1) according to one of claims 2 to 17, wherein the main module (1) via a backplane bus circuit board (21) with at least one extension module (2) in series.