EP3868924A4 - Method for suppressing increase in zinc concentration in plating solution, and method for producing zinc-based plating member - Google Patents
Method for suppressing increase in zinc concentration in plating solution, and method for producing zinc-based plating member Download PDFInfo
- Publication number
- EP3868924A4 EP3868924A4 EP20886179.9A EP20886179A EP3868924A4 EP 3868924 A4 EP3868924 A4 EP 3868924A4 EP 20886179 A EP20886179 A EP 20886179A EP 3868924 A4 EP3868924 A4 EP 3868924A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- zinc
- suppressing increase
- plating solution
- producing
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019214897A JP6750186B1 (en) | 2019-11-28 | 2019-11-28 | Method for suppressing increase in zinc concentration of plating solution and method for producing zinc-based plated member |
PCT/JP2020/031629 WO2021106291A1 (en) | 2019-11-28 | 2020-08-21 | Method for suppressing increase in zinc concentration in plating solution, and method for producing zinc-based plating member |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3868924A1 EP3868924A1 (en) | 2021-08-25 |
EP3868924A4 true EP3868924A4 (en) | 2022-03-09 |
Family
ID=72240854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20886179.9A Withdrawn EP3868924A4 (en) | 2019-11-28 | 2020-08-21 | Method for suppressing increase in zinc concentration in plating solution, and method for producing zinc-based plating member |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220298668A1 (en) |
EP (1) | EP3868924A4 (en) |
JP (1) | JP6750186B1 (en) |
CN (1) | CN113195798A (en) |
MX (1) | MX2021007195A (en) |
WO (1) | WO2021106291A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100155257A1 (en) * | 2006-06-21 | 2010-06-24 | Atotech Deutschland Gmbh | Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings |
US8282806B2 (en) * | 2008-11-11 | 2012-10-09 | Enthone Inc. | Galvanic bath and process for depositing zinc-based layers |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2084191A (en) * | 1980-09-23 | 1982-04-07 | Vandervell Products Ltd | Electro-deposition of alloys |
DE19834353C2 (en) | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkaline zinc-nickel bath |
US8377283B2 (en) * | 2002-11-25 | 2013-02-19 | Coventya, Inc. | Zinc and zinc-alloy electroplating |
US7135103B2 (en) * | 2003-10-20 | 2006-11-14 | Waseda University | Preparation of soft magnetic thin film |
JP4822268B2 (en) * | 2005-04-19 | 2011-11-24 | ユケン工業株式会社 | Recovery type electrogalvanizing method and apparatus |
JP4738910B2 (en) * | 2005-06-21 | 2011-08-03 | 日本表面化学株式会社 | Zinc-nickel alloy plating method |
CN105189831A (en) * | 2013-03-21 | 2015-12-23 | 安美特德国有限公司 | Apparatus and method for electrolytic deposition of metal layers on workpieces |
-
2019
- 2019-11-28 JP JP2019214897A patent/JP6750186B1/en active Active
-
2020
- 2020-08-21 WO PCT/JP2020/031629 patent/WO2021106291A1/en unknown
- 2020-08-21 US US17/297,470 patent/US20220298668A1/en not_active Abandoned
- 2020-08-21 EP EP20886179.9A patent/EP3868924A4/en not_active Withdrawn
- 2020-08-21 MX MX2021007195A patent/MX2021007195A/en unknown
- 2020-08-21 CN CN202080006376.7A patent/CN113195798A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100155257A1 (en) * | 2006-06-21 | 2010-06-24 | Atotech Deutschland Gmbh | Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings |
US8282806B2 (en) * | 2008-11-11 | 2012-10-09 | Enthone Inc. | Galvanic bath and process for depositing zinc-based layers |
Non-Patent Citations (2)
Title |
---|
See also references of WO2021106291A1 * |
WEI ET AL: "Selection of an anode for acid zinc-nickel electroplating", METAL FINISHING : DEVOTED EXCLUSIVELY TO METALLIC SURFACE TREATMENTS, ELSEVIER, NEW YORK, NY, US, vol. 97, no. 2, 1 February 1999 (1999-02-01), pages 84 - 86, XP005273900, ISSN: 0026-0576, DOI: 10.1016/S0026-0576(99)80250-5 * |
Also Published As
Publication number | Publication date |
---|---|
EP3868924A1 (en) | 2021-08-25 |
US20220298668A1 (en) | 2022-09-22 |
JP2021085068A (en) | 2021-06-03 |
JP6750186B1 (en) | 2020-09-02 |
CN113195798A (en) | 2021-07-30 |
MX2021007195A (en) | 2022-03-18 |
WO2021106291A1 (en) | 2021-06-03 |
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Effective date: 20210519 |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20220209 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: C25D 21/14 20060101ALI20220203BHEP Ipc: C25D 17/12 20060101ALI20220203BHEP Ipc: C25D 17/10 20060101ALI20220203BHEP Ipc: C25D 3/56 20060101ALI20220203BHEP Ipc: C25D 17/00 20060101AFI20220203BHEP |
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