EP3815479A1 - Procédés de fabrication d'un support en rouleau pour composants électroniques, d'un module de carte à puce et d'une carte à puce, ainsi que support pour composants électroniques - Google Patents

Procédés de fabrication d'un support en rouleau pour composants électroniques, d'un module de carte à puce et d'une carte à puce, ainsi que support pour composants électroniques

Info

Publication number
EP3815479A1
EP3815479A1 EP19745194.1A EP19745194A EP3815479A1 EP 3815479 A1 EP3815479 A1 EP 3815479A1 EP 19745194 A EP19745194 A EP 19745194A EP 3815479 A1 EP3815479 A1 EP 3815479A1
Authority
EP
European Patent Office
Prior art keywords
adhesive material
electronic components
flexible support
electronic component
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19745194.1A
Other languages
German (de)
English (en)
French (fr)
Inventor
Christophe Mathieu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding SAS
Original Assignee
Linxens Holding SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding SAS filed Critical Linxens Holding SAS
Publication of EP3815479A1 publication Critical patent/EP3815479A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive

Definitions

  • the invention relates to the field of manufacturing electronic components to be integrated and connected in smart cards.
  • the electronic components concerned by the invention can be modules for smart cards (bank cards, transport subscription cards, identity cards, cards with subscriber identification module also called “SIM cards”. "From the acronym of Subscriber Identification Module, etc.).
  • These smart card modules can be:
  • contact modules for reading or writing information contained in one or more chips or memories integrated in the module itself or the card in which the module is integrated, such modules can for example correspond to ISO 7810,
  • biometric control devices fingerprint reader for example
  • Bluetooth type for example
  • These electronic components or modules must be reliably fixed in a cavity in the card which receives them, and possibly connected to an antenna and / or a flexible printed circuit connecting electronic components and integrated into the body of the card. , for example between constituent layers thereof.
  • These components can be transferred from one support to another using chip transfer techniques. An example of a technique of this kind is described for example in the document FR2613175A1.
  • the invention aims to improve the methods of manufacturing electronic components of this type and, possibly their integration, in cards and in particular smart cards. This object is at least partially achieved using a method of manufacturing a roll support for electronic components, in which
  • At least one electronic component is placed on an unwound part of the flexible support
  • the flexible support comprises an adhesive material suitable for receiving and fixing an electronic component before transferring this electronic component to a smart card.
  • the electronic components can be manufactured, finalized and regularly arranged on a strip support.
  • This strip support is in fact used as a temporary support for receiving electronic components and at the same time as an adhesive material, certain areas or portions of which can possibly be transferred, transferred, to each electronic component.
  • the flexible support can have a double function:
  • the electronic components can be transferred directly from the strip support into a cavity in the body of the card.
  • adheresive material denotes both a material having adhesive properties at room temperature, such as in particular a material called “tacky adhesive”, as a material made adhesive by heating, such as '' a hot-melt material.
  • tacky adhesive a material made adhesive by heating, such as '' a hot-melt material. The conditions of use will be adapted to its properties.
  • the strip support may include in its width several electronic components.
  • the strip supports used for the manufacture of electronic components for example for the manufacture of modules meeting the ISO 7810 standard, comprise drive holes on each of the longitudinal edges of the strip. Therefore, these strip supports have two rows of drive holes, but may include a variable number of rows of components.
  • the density of electronic components per unit area of a strip support can be increased and correspondingly the manufacturing costs per electronic component are reduced.
  • the electronic components can be produced on flexible strips of greater or lesser width in order to optimize the number of electronic components produced per unit of area, then the electronic components are transferred to a strip support of smaller width and comprising a adhesive material, for example for reasons of compatibility with existing materials.
  • the method according to the invention allows economies of scale by promoting mass production of electronic components.
  • the method according to the invention further comprises one of the following characteristics, considered in isolation and independently of one another, or in combination with one or more others:
  • At least one bonding pad is produced, on a bonding zone of each electronic component supplied, from the adhesive material;
  • At least one electronic component having an upper face and a lower face, and at least two distinct thicknesses measured between the upper face and the lower face, at least one bonding zone being located on the lower face at the level of the first of these thicknesses, and at least one zone in excess thickness being situated on the lower face at the level of the second of these thicknesses, this second thickness being greater than the first thickness; - We place each electronic component supplied at an opening, by placing the area in excess in an opening;
  • the flexible support is covered with a layer of sticky material on a main face receiving at least one electronic component
  • the adhesive material is arranged on a base strip to form the flexible support, before the bonding area of the electronic component is placed on it, directly in contact with the adhesive material;
  • the flexible support comprises a base strip, this base strip being cut so as to leave exposed at least one area of adhesive material, under an electronic component, then the adhesive material is cut at this area so detaching the electronic component with a portion of adhesive material located on a bonding area before transferring it to a smart card;
  • the adhesive material is laminated on a base strip, before openings are made through the flexible support formed by the base strip and the adhesive material;
  • the adhesive material is a hot melt film
  • the adhesive material is an anisotropic conductive film, electrically conductive depending on its thickness
  • the flexible support comprises paper.
  • the invention relates to a method of manufacturing a smart card module in which a flexible support is manufactured in a roll supporting electronic components in accordance with the method described above, each electronic component supported by this flexible support and provided with a portion of adhesive material on a bonding zone, essentially constituting a smart card module.
  • the invention relates to a method of manufacturing a smart card in which a flexible support is manufactured in a roll supporting electronic components in accordance with the method described above, and at least some are taken electronic components supported by the flexible support to place them in a cavity provided in a smart card.
  • this method of manufacturing a smart card it is possible to connect each electronic component placed in a smart card to a flexible printed circuit integrated in this smart card.
  • the invention relates to a flexible roll support supporting electronic components, comprising:
  • the roll support according to the invention further comprises one of the following characteristics, considered in isolation and independently of one another, or in combination with one or more others:
  • the adhesive material is a hot melt film
  • the adhesive material is an anisotropic conductive film, electrically conductive depending on its thickness.
  • the invention relates to a smart card module manufactured with a method for manufacturing a smart card module as set out above, comprising a portion of adhesive material on a bonding zone. (17).
  • the invention relates to a smart card comprising at least one cavity in which a module as mentioned above is fixed thanks to the portion of adhesive material present on a bonding zone.
  • FIG.1 schematically represents different stages of a first example of implementation of the method according to the invention
  • FIG. 2 schematically represents different stages of a second example of implementation of the method according to the invention
  • FIG. 3 schematically represents different stages of a third example of implementation of the method according to the invention.
  • FIG. 4 schematically represents different stages of a fourth example of implementation of the method according to the invention.
  • the invention is exemplified below with the aid of several examples of implementation of the process for manufacturing a roll support for electronic components.
  • the base strip 1 1 is for example a paper-based veil ("paper liner" in English) 90 to 100 micrometers thick and 35 mm wide to be compatible with the format of industrial equipment of card manufacturing chip. It is for example glassine (also called crystal paper, polyester (PET, PEN) or polyimide.
  • paper liner in English
  • glassine also called crystal paper, polyester (PET, PEN) or polyimide.
  • the adhesive film 12 is for example an anisotropic conductive film, providing electrical conduction according to its thickness. It has for example a thickness of between 40 to 50 ⁇ m and covers, for example completely, the paper.
  • the flexible support 10 with the adhesive film 12 is for example a product having the reference HAF® 8414 from the company Tesa® or EH8030-50 from the company Dexerials.
  • Cut-out B by flushing can be carried out using a laser or a rotary punching machine.
  • the electronic components 14 are arranged on the flexible support 10, for example, by transfer arm (pick & place) from a tray.
  • the electronic components 14 are fixed to the flexible support 10, for example by applying a pressure of 2 bars, at a temperature of 130 ° C., for 1 second.
  • the electronic components 14 can be modules of the ISO 7810 type or functional modules (“feature modules” in English) of the biometric control device type, visual cryptogram displays, etc.
  • the electronic components 14 essentially have an upper face 15 and a lower face 16, and at least two distinct thicknesses E and E ’measured between the upper face 15 and the lower face16. At least one bonding zone 17 is located on the lower face 16 at the level of the first E of these thicknesses. An extra thickness zone 18 is located on the lower face 16 at the level of the second E ′ of these thicknesses. The second thickness E ’is greater than the first thickness E.
  • the electronic components 14 have a thickened area 18 may come, for example, from the fact that an electronic chip and its electrical connections are encapsulated in a protective dome of resin ("glob-top" in English) .
  • a protective dome of resin "glob-top" in English) .
  • the presence of openings 13 makes it possible to better position and accommodate the electronic components 14 when the base strip 1 1 is in the form of a roll, the thickness of the base strip 1 1 then making it possible to compensate at least partly the thickness E 'of the electronic components 14.
  • the electronic components 14 can be removed (for example by arm of transfer - step D) of the flexible support 11, with their adhesive film 12 disposed at the level of the bonding pads 17, to be integrated, in known manner, into a cavity formed in a card body.
  • the electronic components 14, such as ISO 7810 modules, can be produced on the very wide strips (for example 70 or 150 millimeters wide) for greater densification of the production of the electronic components 14.
  • the electronic components 14 are transferred to flexible supports 10 of smaller width (for example 35 millimeters wide) before being integrated into card bodies.
  • Cutting D of the adhesive film in order to essentially preserve areas of adhesive film 12 under the bonding zones 17 of the electronic components 14.
  • This cutting D can be carried out practically concomitantly or just before a step E consisting in removing (for example by arm components) electronics 14, with their adhesive film 12 arranged at the bonding pads 17, to integrate them, in known manner, into a cavity formed in a card body.
  • a flexible support 20 comprising a base strip 21, flexible in a roll with two main faces, one of these main faces being at least partially covered with a layer of sticky material 22 ("tacky adhesive" in English); alternatively, according to a variant, the base strip 1 1 is supplied in a roll, then unrolled and covered with a layer of sticky material 22, to form the flexible support 20 which is directly or not used in the following step of perforation;
  • the perforation has flexible support 20 from the previous step, so as to create openings 25 through both the base strip 21 and the layer of sticky material 22;
  • this preparation is carried out continuously by laminating the hot-melt material 23 in a strip, on a strip of flexible material comprising components 14, as may be the case in particular if the electronic components 14 are continuously manufactured on these same strips of flexible material.
  • the electronic components 14 can be removed (for example by transfer arm - step d) from the flexible support 20, with their adhesive film 23 disposed at the bonding pads 17, to be integrated, in a known manner, into a cavity housed in a card body.
  • the flexible support 20 comprising the base strip 21 with its layer of sticky material 22 is for example a polymer substrate with an adhesive layer having a controlled tack.
  • the flexible support 20 corresponds for example to a product having the reference PET8030F from the company Dexerials (or a similar product).
  • the electronic components 14 are arranged, in step y, on the flexible support 20, by transfer arm for example.
  • the electronic components 14 are positioned (and thus attached) on the flexible support 20 at room temperature.
  • the electronic components 14 can be modules of the ISO 7810 type or functional modules (“feature modules” in English) of the biometric control device type, visual cryptogram displays. , etc.
  • a flexible strip 31 of dielectric material for example 150 mm wide; the material constituting this flexible strip is for example glass-epoxy;
  • a flexible adhesive support 10 for example a support comprising a hot-melt material or consisting of a hot-melt material
  • this flexible support has for example a width of 35mm for reasons of compatibility with machines and tools for inserting modules into a smart card
  • the flexible adhesive support 10 is also conductive according to at least its thickness; openings 13 have been made (for example by cutting by flush, in a manner similar to step b described above) prior to the transfer of the electronic components 14 into the flexible support 10 adhesive, and optionally conductive, to keep at least one adhesive pad under each electronic component 14;

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Credit Cards Or The Like (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
EP19745194.1A 2018-06-15 2019-06-12 Procédés de fabrication d'un support en rouleau pour composants électroniques, d'un module de carte à puce et d'une carte à puce, ainsi que support pour composants électroniques Pending EP3815479A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1870711A FR3082696B1 (fr) 2018-06-15 2018-06-15 Procede de fabrication d'un support en rouleau pour composant electroniques, d'un module de carte a puce et d'une carte a puce, ainsi que support pour composants electroniques
PCT/FR2019/051413 WO2019239061A1 (fr) 2018-06-15 2019-06-12 Procédés de fabrication d'un support en rouleau pour composants électroniques, d'un module de carte à puce et d'une carte à puce, ainsi que support pour composants électroniques

Publications (1)

Publication Number Publication Date
EP3815479A1 true EP3815479A1 (fr) 2021-05-05

Family

ID=63491821

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19745194.1A Pending EP3815479A1 (fr) 2018-06-15 2019-06-12 Procédés de fabrication d'un support en rouleau pour composants électroniques, d'un module de carte à puce et d'une carte à puce, ainsi que support pour composants électroniques

Country Status (7)

Country Link
US (1) US11412620B2 (ko)
EP (1) EP3815479A1 (ko)
KR (1) KR20210020099A (ko)
CN (1) CN112335347B (ko)
FR (1) FR3082696B1 (ko)
SG (1) SG11202012537RA (ko)
WO (1) WO2019239061A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3063555B1 (fr) * 2017-03-03 2021-07-09 Linxens Holding Carte a puce et procede de fabrication d’une carte a puce
KR102565999B1 (ko) * 2022-08-04 2023-08-10 안승배 미소부품 운송장치 및 그 제조방법
FR3141833A1 (fr) 2022-11-03 2024-05-10 Linxens Holding Procédé de fabrication d’un support en rouleau pour composants électroniques

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787277B2 (ja) 1987-03-25 1995-09-20 ティーディーケイ株式会社 表面実装部品の基板搭載方法
FR2769110B1 (fr) * 1997-09-26 1999-12-03 Gemplus Card Int Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette
FR2785071B1 (fr) * 1998-10-26 2002-10-25 Gemplus Card Int Procede de fabrication d'une carte a puce et d'un module electronique destine a etre insere dans une telle carte
DE10110939B4 (de) * 2001-03-07 2004-07-08 Mühlbauer Ag Verfahren und Vorrichtung zum Heißpressverbinden eines Chipmoduls mit einem Trägersubstrat
DE10122416A1 (de) * 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Verfahren und Halbzeug zur Herstellung einer Chipkarte mit Spule
DE102010025774A1 (de) * 2010-07-01 2012-01-05 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Inlays für einen tragbaren Datenträger und Inlay
US10193211B2 (en) * 2014-08-10 2019-01-29 Féinics Amatech Teoranta Smartcards, RFID devices, wearables and methods
FR3049739B1 (fr) * 2016-03-30 2021-03-12 Linxens Holding Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce
FR3051063B1 (fr) * 2016-05-06 2021-02-12 Linxens Holding Procede de fabrication de cartes a puce et carte a puce obtenue par ce procede

Also Published As

Publication number Publication date
FR3082696B1 (fr) 2020-09-11
CN112335347B (zh) 2023-02-10
KR20210020099A (ko) 2021-02-23
SG11202012537RA (en) 2021-02-25
FR3082696A1 (fr) 2019-12-20
CN112335347A (zh) 2021-02-05
US11412620B2 (en) 2022-08-09
US20210251084A1 (en) 2021-08-12
WO2019239061A1 (fr) 2019-12-19

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