EP3771311A4 - Component-mounting device - Google Patents

Component-mounting device Download PDF

Info

Publication number
EP3771311A4
EP3771311A4 EP18910893.9A EP18910893A EP3771311A4 EP 3771311 A4 EP3771311 A4 EP 3771311A4 EP 18910893 A EP18910893 A EP 18910893A EP 3771311 A4 EP3771311 A4 EP 3771311A4
Authority
EP
European Patent Office
Prior art keywords
component
mounting device
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP18910893.9A
Other languages
German (de)
French (fr)
Other versions
EP3771311A1 (en
EP3771311B1 (en
Inventor
Masashi Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of EP3771311A1 publication Critical patent/EP3771311A1/en
Publication of EP3771311A4 publication Critical patent/EP3771311A4/en
Application granted granted Critical
Publication of EP3771311B1 publication Critical patent/EP3771311B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
EP18910893.9A 2018-03-23 2018-03-23 Component-mounting device Active EP3771311B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/011855 WO2019180954A1 (en) 2018-03-23 2018-03-23 Component-mounting device

Publications (3)

Publication Number Publication Date
EP3771311A1 EP3771311A1 (en) 2021-01-27
EP3771311A4 true EP3771311A4 (en) 2021-03-31
EP3771311B1 EP3771311B1 (en) 2023-05-31

Family

ID=67986958

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18910893.9A Active EP3771311B1 (en) 2018-03-23 2018-03-23 Component-mounting device

Country Status (5)

Country Link
US (1) US11330749B2 (en)
EP (1) EP3771311B1 (en)
JP (1) JP6913231B2 (en)
CN (1) CN111869342B (en)
WO (1) WO2019180954A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12052826B2 (en) * 2020-02-20 2024-07-30 Fuji Corporation Component mounting machine and component mounting system
DE102021105594B3 (en) * 2021-03-09 2022-06-09 Asm Assembly Systems Gmbh & Co. Kg Method for correcting the position of components with a recording device, recording device, computer program product and computer-readable medium
DE102022135081A1 (en) 2022-12-31 2024-07-11 Besi Switzerland Ag Method and device for determining a positioning error of a pick-up component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017187527A1 (en) * 2016-04-26 2017-11-02 富士機械製造株式会社 Substrate work machine

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4322092B2 (en) * 2002-11-13 2009-08-26 富士機械製造株式会社 Calibration method and apparatus for electronic component mounting apparatus
JP4896757B2 (en) * 2007-02-09 2012-03-14 ヤマハ発動機株式会社 Surface mount machine
JP4992881B2 (en) * 2008-10-28 2012-08-08 パナソニック株式会社 Electronic component mounting equipment
JP5304469B2 (en) * 2009-06-19 2013-10-02 株式会社デンソーウェーブ Bin picking system
JP5721469B2 (en) * 2011-02-28 2015-05-20 富士機械製造株式会社 Component mounting method and component mounting apparatus
JP5674523B2 (en) * 2011-03-28 2015-02-25 富士機械製造株式会社 Mounting method of electronic parts
JP5986741B2 (en) * 2011-12-14 2016-09-06 アルファーデザイン株式会社 Component mounting method, apparatus, and program
JP6450923B2 (en) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 Electronic component mounting system, electronic component mounting method, and electronic component mounting apparatus
DE102014101901B4 (en) 2014-02-14 2015-10-15 Asm Assembly Systems Gmbh & Co. Kg Optical measurement of a component with structural features present on opposite sides
EP3171685B1 (en) * 2014-07-18 2023-03-15 FUJI Corporation Component mounting device
JP2016055581A (en) * 2014-09-12 2016-04-21 株式会社小森コーポレーション Method and device for adjusting position of imaging means for detecting misregister of printer
JP6673900B2 (en) * 2015-03-25 2020-03-25 株式会社Ｆｕｊｉ Mounting device and mounting method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017187527A1 (en) * 2016-04-26 2017-11-02 富士機械製造株式会社 Substrate work machine
US20190133010A1 (en) * 2016-04-26 2019-05-02 Fuji Corporation Contactless electric power supply device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019180954A1 *

Also Published As

Publication number Publication date
CN111869342A (en) 2020-10-30
JP6913231B2 (en) 2021-08-04
EP3771311A1 (en) 2021-01-27
JPWO2019180954A1 (en) 2021-03-11
EP3771311B1 (en) 2023-05-31
WO2019180954A1 (en) 2019-09-26
US11330749B2 (en) 2022-05-10
US20210007255A1 (en) 2021-01-07
CN111869342B (en) 2021-11-26

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