EP3713704A1 - Bonding tool and method for producing a bonding tool - Google Patents
Bonding tool and method for producing a bonding toolInfo
- Publication number
- EP3713704A1 EP3713704A1 EP18815934.7A EP18815934A EP3713704A1 EP 3713704 A1 EP3713704 A1 EP 3713704A1 EP 18815934 A EP18815934 A EP 18815934A EP 3713704 A1 EP3713704 A1 EP 3713704A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- tool
- bonding tool
- bonding
- hole
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/035—Aligning the laser beam
- B23K26/037—Aligning the laser beam by pressing on the workpiece, e.g. pressing roller foot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
- B23K28/02—Combined welding or cutting procedures or apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78261—Laser
- H01L2224/78263—Laser in the upper part of the bonding apparatus, e.g. in the capillary or wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78303—Shape of the pressing surface, e.g. tip or head
- H01L2224/78304—Shape of the pressing surface, e.g. tip or head comprising protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78305—Shape of other portions
- H01L2224/78306—Shape of other portions inside the capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78315—Shape of the pressing surface, e.g. tip or head
- H01L2224/78316—Shape of the pressing surface, e.g. tip or head comprising protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
Definitions
- the invention relates to a bonding tool, in particular a bonding tool for an ultrasonic laser bonding apparatus, comprising a main body extending in a longitudinal direction of the bonding tool with a tool shank and a tool tip adjoining the tool shank, a contact surface being provided on the tool tip on an end face facing away from the tool shank and wherein on the bonding tool a formed in the manner of a blind hole longitudinal recess is provided which in the region of
- Tool shaft is elongated and which is guided into the area of the tool tip.
- the invention relates to a manufacturing method for a bonding tool.
- Bonding tool with a partially integrated wire feed for a bonding wire (first contact partner) and separately provides a waveguide for guiding a laser beam.
- the waveguide is externally assigned to the bonding tool so that the second contact partner to be connected to the bonding wire is heated by means of the laser beam prior to placement of the bonding tool.
- a bonding device is known with a bonding tool, which in the region of a tool tip has a through hole oriented obliquely to a longitudinal direction of the bonding tool.
- a laser beam is directed directly to a contact zone, in which the electrically conductive contact partners, namely a guided in the bonding tool bonding wire and a bonding pad as a second contact partner are materially connected.
- the laser beam is directed directly to the bonding wire and heats it.
- a tool tip of the bonding tool is designed nose-shaped and provided in the nose of a through-hole for the laser beam.
- EP 0 367 705 A2 discloses a multi-part bonding tool having a blind hole-like longitudinal recess which extends in a longitudinal direction of the bonding tool through a tool shank into the region of a tool tip. In the area of the tool tip, the longitudinal recess is conically closed.
- the conical closure geometry for the longitudinal recess is provided in a closing body of the bonding tool, which is attached to the end face of an elongated main body of the bonding tool. The bonding tool is so far formed in several parts or the
- Tool tip of the bonding tool made separately from the tool shank.
- the main body of the bonding tool has a through-hole having a constant diameter extending in the longitudinal direction of the bonding tool.
- an absorption layer for the laser beam is provided on the inside of the blind hole.
- the object of the present invention is to provide a structurally simple bonding tool which is suitable for laser-assisted bonding, and to specify a production method for such a bonding tool.
- a manufacturing method for a bonding tool with a blind hole provided in the region of an elongated tool shank of the bonding tool and guided into the area of a tool tip comprises the following production steps:
- a through-hole is made which extends through the tool shank to the tool tip.
- the bonding tool according to the invention cost can be provided.
- a through-hole which, for example, always has the same cross-sectional geometry.
- the through-hole extends in a longitudinal direction of the bonding tool in the region of the tool shaft and in the region of the tool tip.
- the through-passage has a first opening, which is located on a contact surface formed on the tool tip, and a second opening, which is preferably located on a second end face of the bonding tool opposite the contact surface.
- the second end face of the bonding tool is part of the tool shank.
- the through-hole is closed in the region of the tool tip by using a closure for the
- the tool tip comprises the part of the bonding tool which, when it is used as intended, comes into contact with at least one of the two contact partners to be connected.
- the tool tip is the part of the bonding tool where it tapers with respect to its outer geometry.
- ultrasonic bonding tools which have a wedge shape in the area of the tool tip.
- Tool tip defined by a projecting contact foot of the
- Bonding tool the nose-shaped shape of the bonding tool and / or provided in the bonding tool guide for a bonding wire. If a geometric determination of the tool tip of the bonding tool is not or not clearly possible, within the scope of the invention, a front third of the bonding tool, on which the contact surface is provided, as a tool tip.
- the core of the invention is insofar as to produce a blind hole on a bonding tool by first producing a through-hole and this
- Closing body is closed.
- By heating the tool tip is when pressing the bonding tool to the at least one contact partner thermal Energy introduced into the joining zone.
- the contact partners warm up and the cohesive connection of the contact partners is favored. Direct, direct heating of at least one contact partner by the laser beam is thereby avoided. It may therefore be at risk of damaging the
- the main body of the bonding tool is produced in one piece.
- Part of the body are here the tool shank and the tool tip.
- the production is primitive or machined.
- the one-piece production process results in high strength for the bonding tool and assembly of the base body is avoided.
- defects are avoided, which result from a faulty joining of the tool shaft and the tool tip. This is particularly advantageous if - as for example in the case of ultrasonic wire bonding - the bonding tool too
- the closing body closes so far the through-hole so that after closing the
- Tool tip lies.
- the insertion of the end body into the through-hole results in a particularly simple structural design for the bonding tool.
- the strength of the bonding tool in the area of the tool tip is not affected or only to a very limited extent.
- a side recess which intersects the through-passage recess manufactured at the bonding tool in the region of the tool tip a side recess which intersects the through-passage recess manufactured.
- the closing body is inserted into the side recess for closing the passage recess.
- the passage recess can be optimized in particular to the requirements of the bonding process, namely the guiding or guiding of the laser beam.
- the side recess can be optimized in particular to the requirements of the bonding process, namely the guiding or guiding of the laser beam.
- the closing body is manufactured with respect to a cross-section of the through-hole or the side-recess to excess.
- the closing body is then inserted into the passage recess or the side recess in such a way that a press fit is formed after the joining, with the result that the closing body is held captive in the passage or side recess.
- the bonding tool and / or the closure body are thermally pretreated, that is to say heated or cooled, prior to insertion of the closure body into the bonding tool.
- Closing body done and secure fixing of the end body can be achieved in the bonding tool.
- a thread is at least partially produced at the passage recess or the side recess.
- a grub screw is screwed as a closing body in the thread and closed the through hole.
- a threaded pin as the closing body, a particularly cost-effective solution can be provided.
- a defined joining and exact positioning of the end body in the through-hole or the side recess is possible with the result that the tool tip of the
- Bonding tool is geometrically defined exactly and can be appropriately heated. According to a development of the invention, a contact geometry having the contact surface is produced on the bonding tool in the region of the tool tip. To produce the contact geometry, on the one hand, the tool tip and, on the other, the end body are shaped. For example, the
- the contact geometry made on the tool tip after the end body is inserted into the bonding tool.
- a process-technically necessary or advantageous guidance of a contact partner by the bonding tool results.
- the contact surface which is provided in the region of the contact geometry, is in this case in any case partially closed and, for example, not recessed or interrupted in the region of the end body. It reduces the extent of the closure of the
- the invention in conjunction with the preamble of claim 8, characterized in that the formation of the blind hole on the bonding tool a through-passage through a in the region of
- Tool tip provided closing body is closed.
- the particular advantage of the invention is that a bonding tool with a blind hole is provided in a particularly simple manner, which leads into the region of the tool tip.
- a laser beam can be introduced into the bonding tool.
- the laser beam heats the bonding tool in the area of the tool tip, with the result that the process of materially joining two contact partners is favored.
- an error rate during the production of the bond connection can be reduced, a process duration for the bonding can be reduced and / or a material pairing can be bonded, which is conventional
- the closing body is introduced directly into the through hole.
- the closing body is used, for example, via an opening of the through-hole provided in the area of the contact surface of the bonding tool.
- a through-hole intersecting Side recess are provided. The closing body can then to
- Closure of the passage recess can be inserted into the side recess.
- the side recess may be formed by passing or blind hole. Always the position of the closing body after insertion is chosen so that a
- the blind hole is provided in the region of the tool tip or the blind hole is guided into the area of the tool tip.
- Tool tip has a contact surface having contact geometry
- the closing body provides a part of the contact geometry.
- the tool tip can be located directly in the area in which the
- the closure body is rotationally symmetrical with respect to a closure body longitudinal axis thereof.
- the closing body can be produced inexpensively by the rotationally symmetrical design.
- the assembly simplifies, as is not to pay attention to a preferred orientation of the end body during assembly.
- the end body longitudinal axis of the end body crosses a longitudinal axis of the passage recess or is provided coaxially to the same.
- the preferred orientation of the closing body advantageously achieves a secure closure of the passage recess and / or the production outlay for the bonding tool is particularly low.
- a threaded pin is provided as the closing body.
- the grub screw is in a through-hole
- the cost of the bonding tool is reduced by the
- the setscrews can be provided inexpensively as standard parts.
- the Mounting the grub screw easily and the closing body is safe in the
- a contact edge for the closing body is provided at the passage recess or the side recess.
- the mounting bevel can serve as a beam trap or redirect the laser beam in the direction of the inner circumferential surface.
- Bonding tool in the area of the tool tip is favored in this respect.
- a recess is formed on the closing body with an opening which is associated with the longitudinal recess of the base body so that the laser beam enters the recess.
- the recess may be formed, for example, in the manner of a radiation trap and on the
- End body be provided on the shell side and / or front side.
- the provision of the recess can in this respect favor the heating of the bonding tool in the area of the tool tip.
- FIG. 1 shows a first manufacturing step for a bonding tool according to the invention in a sectional view
- FIG. 2 shows the finished manufactured bonding tool according to FIG. 1 in a sectional representation
- FIG. 3 shows a second embodiment of a bonding tool according to the invention in a sectional representation
- Fig. 4 is a sectional view of a main body of the invention
- Fig. 5 shows the finished manufactured bonding tool according to Fig. 4 with a in the
- FIG. 6 shows a fourth embodiment of a bonding tool according to the invention in a sectional view
- FIG. 7 shows a fifth embodiment of a bonding tool according to the invention in a sectional view
- Fig. 8 shows a sixth embodiment of a bonding tool according to the invention in a sectional view
- FIG. 9 shows a seventh embodiment of a bonding tool according to the invention with a side recess provided in the region of a tool tip and the end body inserted in the side recess in a sectional illustration.
- a bonding tool according to FIGS. 1 and 2 comprises a body made in one piece with an elongate tool shank 1 and a tool tip 2 which adjoins the tool shank 1 at the end and a tool tip 2
- the blind hole 3.2 is made by firstly providing a through-passage 3.1 on the main body, which is then closed by the closing body 4. For this purpose, the
- Closing body 4 used in the region of the tool tip 2 in the through-hole 3.1 is designed to be rotationally symmetrical with respect to a closing body longitudinal axis 7 and the closing body longitudinal axis 7 of the closing body 4 is oriented coaxially to a longitudinal axis 8 of the through-passage 3.1 or the blind hole 3.2 in the assembled state.
- the tool tip 2 of the bonding tool is geometrically determined by a wedge-shaped tapering outer geometry of the bonding tool.
- geometry of the bonding tool is often used for ultrasonic bonding tools.
- the end body 4 In order to join the end body 4 with the main body of the bonding tool, for example, the end body 4 can be cooled down to a low temperature and then inserted into the through-hole 3.1 to form the blind hole 3.2. It forms so far after joining, that is, after the onset of the end body 4 and the matching of the temperature of the end body 4 and the base body of the bonding tool from a press fit or interference fit.
- the closing body 4 is held in this way non-positively in the area of the tool tip 2.
- a contact surface 5 of the bonding tool is provided in the region of the tool tip 2 at the end. In the area of the contact surface 5 closes the
- Termination body 4 forms a part of the contact surface 5 of the
- a contact geometry 9, which has the contact surface 5, is provided on the bonding tool at an end face provided in the region of the tool tip 2.
- the contact geometry 9 is wedge-shaped. It serves to guide a bonding wire to be connected in a materially connected manner to an electrically conductive contact partner in the region of the tool tip 2 during the bonding process or to ensure an exact position of the bonding wire during bonding.
- Contact geometry 9 is realized in such a way that part of it is formed by the main body and another part thereof by the end body 4.
- the contact surface 5 is partially formed on the base body and partially on the end body 4 of the bonding tool.
- the closing body 4 can according to the second embodiment of the invention as set out above flush with an end face of the base body in the
- End body 4 can then be made the termination geometry on the bonding tool.
- the closing body 4 can be inserted back into the through-hole 3. 1 for the end face of the bonding tool for producing the blind hole 3.2.
- a mounting dimension for the end body 4 is determined so that after the production of the contact geometry 9, a continuous contact surface 5 results.
- a contact geometry 9 with a discontinuous or discontinuous contact surface 5 can be produced by inserting the end body 4 so deeply into the through-passage 3.1 that the end body 4 is only locally machined at the end when the contact geometry 9 is produced.
- the contact geometry 9 may have the through-passage 3.1
- Base body of the bonding tool are prepared before the end body 4 is inserted into the through-hole 3.1 for the production of the blind hole 3.2.
- the closing body 4 becomes so far after the production of the contact geometry 9 in inserted through the through hole 3.1 and positioned there so that one of the tool tip side end face facing end of the end body 4 - based on the illustrated orientation of the bonding tool - above the
- Contact geometry 9 is located.
- the contact surface 5 of the bonding tool is so far interrupted or notched formed with the result that the bonding wire when pressing the same against the other contact safely on the
- a mounting bevel 11 is provided on the end body 4.
- the closing body 4 can be inserted into the through-passage 3.1 in a particularly simple manner to form the blind hole 3.2 of the bonding tool.
- the mounting bevel 11 is so far in the assembled state of the bonding tool on one of the contact geometry 9 and the
- the closing body 4 is inserted via a provided in the region of the contact surface 5 and the contact geometry 9 opening of the through-hole 3.1 in the base body of the bonding tool.
- the mounting bevel 11 which forms the blind hole bottom or a part thereof, divert a guided in the blind hole 3.2 laser beam in the direction of an inner circumferential surface of the blind hole 3.2 and thus favor a targeted heating of the bonding tool in the tool tip 2.
- the through-passage 3.1 in the area of the tool tip 2 has a
- the closing body 4 has a maximum outer diameter, which, taking into account the joining dimensions of a press fit, exactly to the largest inner diameter of the
- the closing body 4 can be used so far exactly up to the contact edge 10 in the through-hole 3.1.
- the closing body 4 thus abuts against the abutment edge 10 in the mounted state and thus always has an exactly defined position in relation to the main body of the bonding tool.
- the abutment edge 10, which is made on the main body of the bonding tool is inclined
- Closing body 4 ensures in the through-hole 3.1.
- the abutment serves as a mounting bevel 11 for the closing body. 4
- Side recess 6 is provided, which intersects the extending in the longitudinal direction of the body through-passage 3.1. In the side recess 6 then the closing body 4 is provided. The closing body 4 is in the
- End body 4 provides, as explained above, a mounting bevel 11.
- a press fit or interference fit may be formed for non-positive fixing of the end body 4.
- the closing body 4 in the through-hole 3.1 or the side recess 6 glued or otherwise firmly bonded
- a thread is formed in the region of the side recess 6 or the through-passage 3.1 and that a threaded pin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017127251.8A DE102017127251A1 (en) | 2017-11-20 | 2017-11-20 | Bonding tool and manufacturing method for a bonding tool |
PCT/DE2018/100894 WO2019096346A1 (en) | 2017-11-20 | 2018-11-05 | Bonding tool and method for producing a bonding tool |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3713704A1 true EP3713704A1 (en) | 2020-09-30 |
Family
ID=64663990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18815934.7A Withdrawn EP3713704A1 (en) | 2017-11-20 | 2018-11-05 | Bonding tool and method for producing a bonding tool |
Country Status (5)
Country | Link |
---|---|
US (1) | US20200282488A1 (en) |
EP (1) | EP3713704A1 (en) |
CN (1) | CN111405958A (en) |
DE (1) | DE102017127251A1 (en) |
WO (1) | WO2019096346A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019124335A1 (en) | 2019-09-11 | 2021-03-11 | Hesse Gmbh | Bonding device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4534811A (en) | 1983-12-30 | 1985-08-13 | International Business Machines Corporation | Apparatus for thermo bonding surfaces |
EP0367705A3 (en) | 1988-10-31 | 1990-09-26 | International Business Machines Corporation | Laser assisted ultrasonic bonding |
US5814784A (en) | 1992-01-13 | 1998-09-29 | Powerlasers Ltd. | Laser-welding techniques using pre-heated tool and enlarged beam |
JPH05259220A (en) * | 1992-03-10 | 1993-10-08 | Toshiba Corp | Bonding tool |
DE19814118A1 (en) | 1998-03-30 | 1999-10-14 | F&K Delvotec Bondtechnik Gmbh | Device for thermocompression bonding, and thermocompression bonding |
US6501043B1 (en) | 1999-10-22 | 2002-12-31 | Medtronic, Inc. | Apparatus and method for laser welding of ribbons |
DE10205609A1 (en) | 2002-02-11 | 2003-08-28 | Infineon Technologies Ag | Arrangement for wire bonding and method for producing a bond connection |
JP2004142225A (en) * | 2002-10-23 | 2004-05-20 | Terumo Corp | Method for fusing sheet material, and molding |
US7872208B2 (en) | 2005-03-31 | 2011-01-18 | Medtronic, Inc. | Laser bonding tool with improved bonding accuracy |
WO2013007481A1 (en) * | 2011-06-22 | 2013-01-17 | Sapa Ab | Friction stir welding tool with shoulders having different areas; methods using such tool; product welded with such tool |
-
2017
- 2017-11-20 DE DE102017127251.8A patent/DE102017127251A1/en not_active Withdrawn
-
2018
- 2018-11-05 CN CN201880073101.8A patent/CN111405958A/en active Pending
- 2018-11-05 WO PCT/DE2018/100894 patent/WO2019096346A1/en unknown
- 2018-11-05 EP EP18815934.7A patent/EP3713704A1/en not_active Withdrawn
-
2020
- 2020-05-20 US US16/879,428 patent/US20200282488A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN111405958A (en) | 2020-07-10 |
US20200282488A1 (en) | 2020-09-10 |
DE102017127251A1 (en) | 2019-05-23 |
WO2019096346A1 (en) | 2019-05-23 |
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