EP3667182A1 - Installation de pompe à chaleur - Google Patents

Installation de pompe à chaleur Download PDF

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Publication number
EP3667182A1
EP3667182A1 EP19213760.2A EP19213760A EP3667182A1 EP 3667182 A1 EP3667182 A1 EP 3667182A1 EP 19213760 A EP19213760 A EP 19213760A EP 3667182 A1 EP3667182 A1 EP 3667182A1
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EP
European Patent Office
Prior art keywords
heating
cooling
heat pump
heat
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19213760.2A
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German (de)
English (en)
Other versions
EP3667182B1 (fr
Inventor
Jens Rammensee
Tino Bär
Daniela TEMPEL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Glen Dimplex Deutschland GmbH
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Glen Dimplex Deutschland GmbH
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Publication of EP3667182A1 publication Critical patent/EP3667182A1/fr
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0096Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater combined with domestic apparatus
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D11/00Central heating systems using heat accumulated in storage masses
    • F24D11/02Central heating systems using heat accumulated in storage masses using heat pumps
    • F24D11/0214Central heating systems using heat accumulated in storage masses using heat pumps water heating system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D17/00Domestic hot-water supply systems
    • F24D17/02Domestic hot-water supply systems using heat pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/89Arrangement or mounting of control or safety devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D11/00Central heating systems using heat accumulated in storage masses
    • F24D11/02Central heating systems using heat accumulated in storage masses using heat pumps
    • F24D11/0214Central heating systems using heat accumulated in storage masses using heat pumps water heating system
    • F24D11/0221Central heating systems using heat accumulated in storage masses using heat pumps water heating system combined with solar energy

Definitions

  • the invention relates to a heat pump system which is designed for simultaneous heating and cooling.
  • a heat pump is integrated in such a way that both its heat source side and its heat sink side are used for heating and cooling at the same time.
  • the heat pump has an evaporator on the heat source side and a condenser on the heat sink side.
  • the evaporator is cooled by a heat transfer medium, e.g. B. cooling water flows through.
  • the condenser is simultaneously from a heat transfer medium to be heated, for. B. flows through heating water. Since heat is shifted from the heat source side to the heat sink side, this type of integration and supply is also referred to below as heat shift.
  • the heating and cooling power requirements do not have the same, constant relationship to one another in most applications, especially in building supply, and fluctuates over the year in particular.
  • the cooling capacity requirement will typically predominate in the warm summer months and the heating capacity requirement in the colder winter months.
  • the present invention is based on the object of specifying a heat pump system which is designed for simultaneous heating and cooling and which has a high efficiency, in particular the highest possible TER (total efficiency ratio).
  • the object is achieved according to the invention by a heat pump system with the features of claim 1.
  • the heat pump system is designed for simultaneous heating and cooling and has a first heat pump which is designed as a liquid-liquid heat pump.
  • the heat pump is connected to a heat source on a source side and to a heat sink on a sink side, each via a liquid / liquid heat exchanger.
  • the heat pump generally has a refrigerant circuit with an evaporator and a condenser and with an electrically driven compressor.
  • a liquid-liquid heat pump is referred to in the present case, this means that a liquid is used as the heat carrier both on the source side and on the lower side, so that the heat is emitted from the liquid to a cooling circuit of the heat pump on the source side or heat from the lower side Refrigeration cycle is released into the liquid.
  • the liquid can be water, brine or a water-glycol mixture.
  • Different heat transfer media for example water on one side and brine on the other side, can be used on the source and lower side.
  • Brine and water-glycol mixtures often have a freezing point below 0 ° C and are therefore suitable for cooling circuits with particularly low temperatures.
  • the term "brine" is used jointly for the actual brine (solution of technical salts in water) as well as for a glycol-water mixture.
  • the heat source generally has a cooling circuit, in which a liquid (water or brine) circulates during operation and which has a cooling flow, a cooling return, a cooling buffer storage for cold water and - in a connected state - at least one Has cooling consumers.
  • a liquid water or brine
  • This is used to cool its surroundings, absorbing heat from the surroundings and releasing them to the liquid in the cooling circuit.
  • Environment is understood here to mean that, for example, the ambient air of the cooling consumer is cooled directly, or also another heat transfer medium.
  • the cooling consumer also referred to as a cooler, is preferably used for room cooling. Depending on the application, the cooler can also be used for other cooling purposes, e.g. B. can be used for cooling refrigerators or freezers.
  • the heat pump system is used in particular for air conditioning in buildings and, if necessary, in addition to supplying heated service water.
  • the heat pump system is used, for example, in the food and beverage industry and / or in industrial processes in which a cooling requirement, for. B. for cooling food, resources etc. and a heating requirement z. B. for building heating, water heating, for heating equipment, etc. is required.
  • the heat sink comprises a heating circuit in which, when operating as a heat carrier, a liquid (in particular water) circulates with a heating flow, a heating return, a heating buffer storage for heating water and - in a connected state - with at least one heating - Consumer who is trained to heat his environment.
  • the heating consumer is in turn preferably used for direct heating, for example of the air in a room, but can also be used to heat another heat transfer medium.
  • the heat source and / or the heat sink is preferably finally formed by the cooling circuit or heating circuit connected to it.
  • the heating circuit has a hot water storage in which domestic water is heated.
  • the first heat pump causes heat to shift between the cooling circuit and the heating circuit, so that cooling power is provided on the cooling circuit side and heating power is provided on the heating circuit side.
  • heat / cold is shifted between the two circuits and in particular between the cooling buffer storage and the heating buffer storage or hot water storage.
  • heat is shifted from the cooling buffer storage into the heating circuit, especially into the heating buffer storage / into the hot water storage.
  • cold is shifted from the heating buffer storage / hot water storage to the cooling circuit, especially to the cooling buffer storage.
  • Normal operation is understood to mean an operating situation in which the first heat pump is in operation.
  • the first heat pump is only operated under specified boundary conditions, in particular temperature conditions in the heating circuit or in the cooling circuit.
  • At least one additional unit is also integrated in the heat pump system, which is hydraulically connected to both the cooling circuit and the heating circuit and, if required, for example via flow control using appropriate valves either with the cooling circuit or with the heating circuit is connected, so that either additional heat is fed into the heating circuit or additional cooling is hydraulically fed into the cooling circuit.
  • the transfer of heat or cold into the heating circuit or into the cooling circuit takes place by means of a heat exchanger. This applies in particular to the case when different liquids are used in the cooling circuit (or in the heating circuit) and the connected additional unit (e.g. brine / water) and a separation of the liquids is required.
  • Hydraulically connected is generally understood to mean a pipe connection for the liquid, which may be closable via a valve.
  • the at least one additional unit is designed both to provide additional heat for the heating circuit and to provide additional cooling for the cooling circuit and provides either heat or cold as required.
  • the heat pump system as a whole has a control unit which is designed to control the operation of the heat pump system.
  • Heat compensation is therefore provided hydraulically via the additional unit. It is therefore not necessary for the first heat pump to release heat to the surroundings unused, for example if there is an increased cooling requirement.
  • the first heat pump can therefore be operated highly efficiently overall. Efficient operation is also supported by the integrated buffer memory. In this way, on the one hand, a desired temperature level can be maintained even with fluctuating load requirements and - at least temporary - shifts between the required cooling capacity and heating capacity can z.
  • B. can be intercepted by overheating or supercooling without having to switch on the at least one additional unit. Overheating or supercooling is generally understood to mean an additional heat or cold input into the buffer storage beyond a target temperature and up to a maximum / minimum temperature.
  • This additional unit is specifically a second heat pump, which is preferably designed as a reversible air / liquid heat pump.
  • This has a refrigerant circuit with an air-refrigerant heat exchanger and with a refrigerant / liquid heat exchanger.
  • the second heat pump can still be operated reversibly, so that depending on the operating mode, the heat exchangers are used once as evaporators and once as condensers.
  • the air / refrigerant heat exchanger absorbs heat from the ambient air in a heating mode and releases heat to the ambient air in a cooling mode.
  • heat is given off in the heating mode or cold is provided in the cooling mode via the refrigerant / liquid heat exchanger.
  • Both the heat displacement and the heat compensation are therefore provided by heat pumps and preferably exclusively by heat pumps, in particular by exactly two heat pumps, namely the first heat pump and the second heat pump. While the first heat pump in particular cannot be operated reversibly, a particular advantage of the second heat pump can be seen in its reversible operating mode, so that both heat and cold can be provided with just one additional unit.
  • this can be connected to the heating circuit or to the cooling circuit in terms of flow technology via a first reusable valve, which is designed in particular as a changeover valve.
  • Fluidically connectable is understood to mean that the liquid flowing through the refrigerant / liquid heat exchanger of the second heat pump is fed directly into the heating circuit or the cooling circuit in terms of flow technology, that is to say a liquid is exchanged.
  • the second heat pump is connected only in terms of flow in the heating mode to the heating circuit and in the cooling mode only to the cooling circuit.
  • a flow bypass line is formed for this purpose, which connects the cooling flow with the heating flow.
  • the second heat pump has a flow, which is typically connected to the refrigerant-liquid heat exchanger. This flow is fluidically connected via the first reusable valve in cooling mode to the cooling flow of the cooling circuit and in heating mode to the heating flow of the heating circuit.
  • a return bypass line is formed in a preferred embodiment, which connects the cooling return with the heating return.
  • the second heat pump also has a return, which in turn is connected to the refrigerant-liquid heat exchanger. This is connected to the cooling return and in heating mode to the heating return via a second reusable valve in cooling mode.
  • the two bypass lines and the two reusable valves which are designed in particular as simple changeover valves, result in an expedient hydraulic integration of the second heat pump into the heating circuit or the cooling circuit of the heat pump system.
  • the respective consumer is either connected in series to the respective buffer store assigned to it, or arranged in parallel to it.
  • the consumer is always in a consumer group integrated.
  • the flow for the consumer is connected to the buffer storage.
  • the return of the consumer is also connected to the buffer tank.
  • the consumer return is connected directly to the heating return or the cooling return.
  • Connected is also understood to mean a hydraulic connection.
  • the first heat pump is prioritized over the at least one additional unit, that is, specifically over the second heat pump.
  • the first heat pump is therefore always in operation (normal operation) as long as it is permissible to move heat from the cooling circuit to the heating circuit within the specified temperature limits.
  • the first heat pump is only blocked for operation when a maximum heating temperature in the heating buffer storage or a minimum cooling temperature in the cooling buffer storage has been reached.
  • This operating mode in which normal operation is prevented and in particular only the additional unit is active, is called Additional operating mode called. In this case, heat displacement between the heating circuit and the cooling circuit is no longer permissible, since this would result in the desired maximum heating temperature being exceeded or the desired minimum cooling temperature being undershot.
  • the control unit is also designed such that the at least one additional unit, that is to say specifically the second heat pump, is only switched on when a heating target temperature in the heating buffer store is undershot or a cooling target temperature in the cooling buffer store is exceeded.
  • additional heat is introduced into the heating circuit or additional cooling into the cooling circuit by means of the additional unit.
  • the additional unit operates in addition to the first heat pump. I.e. normal operation is supplemented by the heating mode or cooling mode of the additional unit.
  • This operating mode is referred to as the support operating mode and is therefore a combined operating mode which is composed of the normal operation and the heating or cooling mode.
  • the at least one additional unit is switched off when the heating target temperature in the heating buffer memory is exceeded or the cooling target temperature in the cooling buffer memory is undershot.
  • the additional unit is therefore used to regulate the temperature to the target temperature. In contrast to the first heat pump, there is no overheating or undercooling of the respective buffer storage.
  • the temperature values each define changeover points for the control and regulation of the heat pump system.
  • Switching for example switching the additional unit on or off, switching the first heat pump on or off, takes place when the setpoint temperature or the min and max temperatures (also referred to as switching temperatures) are exceeded or undershot, each of these temperature values also having a Hysteresis is provided, ie switching only takes place if the respective temperature (switching temperature) plus a hysteresis temperature value of e.g. B. 2 to 5K, especially 3K, is below or below.
  • the heating target temperature is expediently in a range from 30 ° to 60 ° C. and in particular in a range from 30 ° to 45 ° C.
  • the cooling target temperature is preferably in a range from 5 ° to 20 ° C. and in particular in a range from 8 ° to 18 ° C., for example preferably at 15 ° C.
  • water is used in particular as the heat carrier in the cooling circuit.
  • Such temperatures in the cooling circuit are used in particular for cooling rooms used by people.
  • the target cooling temperature is in a range from -15 ° C to 20 ° C, in particular in a range from -9 ° C to 10 ° C.
  • the heating target temperature is preferably around 35 ° C.
  • the cooling target temperature - for an application for building air conditioning - is 10 ° to 20 ° C or 10 ° to 25 ° C below the heating target temperature. In these temperature ranges, a good building supply is achieved both for room air conditioning and for the provision of process water, for example.
  • the setpoint temperatures relate in particular to the hottest (heating buffer storage) or coldest (cooling buffer storage) temperature in the buffer storage, in particular at an output of the storage buffer in a flow path to the consumer.
  • the return temperatures from the consumer are correspondingly lower (in the heating circuit) or higher (in the cooling circuit), for example by 5-10K.
  • a temperature difference between the maximum heating temperature and the heating target temperature expediently lies in the range between 5 and 25K and in particular in the range between 10 and 15K. Furthermore or alternatively, a temperature difference between the minimum cooling temperature and the cooling target temperature lies in the range between 5 to 20K and in particular in the range between 8 and 12K.
  • the difference between the heating target temperature and the cooling target temperature also lies - in particular in one application for building air conditioning - in the range from 10 to 40K and in particular in the range from 15 to 35K.
  • the specified temperature values are preferably adjustable in each case, either on the production side when the heat pump system is configured, but preferably also during operation, for example by the user, or automatically, in particular depending on current requirements, e.g. B. a current ambient temperature.
  • control unit is also designed such that the additional unit is only switched on in an additional operating mode when the first heat pump is blocked for operation. In the additional operating mode, therefore, no simultaneous operation of the first heat pump and the at least one additional unit, that is to say specifically the second heat pump, is provided.
  • the first heat pump is preferably designed only for part of the maximum heating and / or cooling requirement, for example only up to a maximum of 75% or only up to a maximum of 50% of the maximum heating and / or cooling requirement. This is generally understood to mean that - on the basis of a maximum required heating output and maximum required cooling output determined for the respective object (e.g. building, process) - the first heat pump only for a part of this specific heating output and / or cooling capacity is designed. This ensures the longest possible operation in terms of a base load by the first heat pump.
  • the additional unit is activated for additional heating or cooling requirements. Depending on the current need, it is then in the support operating mode the required heat or cold is ensured both by a heat shift via the first heat pump and by an additional heat or cold input via the second heat pump.
  • the heating and cooling capacity of the first heat pump is also lower than the heating and cooling capacity of the at least one additional unit, especially the second heat pump. It is preferably only a maximum of 80% or even a maximum of 50% of the heating and cooling output of the additional unit, especially the second heat pump.
  • control unit is further configured such that the minimum cooling temperature and / or the maximum heating temperature is varied during the operation of the heat pump system.
  • the temperature difference to the respective target temperature that is to say to the heating target temperature or cooling target temperature, is automatically varied.
  • This measure makes it possible during operation to adapt the loading status of the buffer stores, i.e. the degree of overheating or undercooling, to current situations, for example to set a higher loading status of the heating buffer storage when a large amount of heat is currently available.
  • This is the case, for example, if the provision of heat is additionally supported by a solar energy input, for example by a solar thermal system, in which solar-heated water is used to load the heating buffer storage.
  • a regenerative heat or cold generator is therefore additionally connected to the heat pump system.
  • a regenerative heat or cold generator is understood to mean a generator that generates the heat / cold via regeneratively generated energies (solar, wind power ).
  • control unit is also designed such that the aforementioned variation takes place as a function of a currently excess energy supply or a current energy price.
  • the excess energy supply is, for example, the solar-generated heat mentioned above.
  • control unit preferably also takes into account currently valid energy prices. For example, during favorable electricity tariff times (night-time electricity), the maximum or minimum temperature is set higher or lower, so that the degree of loading of the buffer storage is increased and it is charged with low energy prices. At the same time, excessive loading, which goes beyond what is necessary, is avoided during peak periods with high energy prices.
  • the control unit is, for example, also integrated in an intelligent power distribution network, so that in the event of low network loads, energy is buffered in the buffer stores by increasing the maximum / minimum temperatures.
  • the in the 1 and 2 The heat pump system 2 shown each has a first heat pump 4, to which a cooling circuit 6 is connected as a heat source on a source side and a heating circuit 8 is connected as a heat sink on a sink side.
  • the first heat pump 4 has, in a manner not shown in detail, a customary design with a refrigerant circuit, in which an evaporator is connected in particular on the heat source side and a condenser is connected on the heat sink side.
  • the evaporator and the condenser are each designed as refrigerant / liquid heat exchangers to remove heat absorb a liquid heat transfer medium of the cooling circuit 6 and emit heat to a liquid heat transfer medium of the heating circuit 8.
  • the cooling circuit has a cooling flow 6A and a cooling return 6B.
  • the heating circuit 8 also has a heating flow 8A and a heating return 8B.
  • a cooling buffer store 10 and a cooling consumer 12 are each integrated in the cooling circuit 6.
  • a heating buffer memory 14 and a heating consumer 16 are integrated in the heating circuit 8.
  • more than one consumer 12, 16 can also be integrated in the respective cooling or heating circuit 6, 8.
  • a hot water tank 18 for process water is still integrated.
  • a first temperature sensor R1 is assigned to the cooling buffer memory 10 and a second temperature sensor R2 is assigned to the heating buffer memory 14. These measure the temperature T_R1, T_R2 in the area of the respective buffer store 10, 14, preferably each at the outlet of the buffer store, alternatively a temperature at the inlet or also inside the buffer store.
  • the following temperature values for the target temperatures and the maximum / minimum values relate to temperatures when the temperature sensors R1, R2 are arranged at the buffer outlet.
  • the heat pump system 2 has pumps 20 both in the heating circuit 8 and in the cooling circuit 6.
  • a pump 20 is connected in each case to the cooling return 6B or to the heating return 8B, and a further pump in each case downstream of the respective buffer store 10, 14 in front of the respective consumer 12, 16 in a consumer circuit.
  • the respective flow 6A, 8A to the respective consumer 12, 16 is shown by a solid line and the return 6B, 8B by a dashed line.
  • a consumer flow is arranged at an outlet of the respective buffer memory 10, 14 and a return flow of the consumer 12, 16 is connected directly to the cooling return 6B or heating return 8B.
  • a parallel arrangement of the respective consumer 12, 16 is provided.
  • the consumer return is also connected to the buffer storage 10.14.
  • a valve 24 is arranged in the cooling circuit 6 or heating circuit 8, which is designed in particular as a mixing valve. Via this, at least a part of the heat transfer medium flowing back from the consumer 12, 16 can be admixed to the heat transfer medium flowing out of the buffer store 10, 14 in order to set a desired mixing temperature.
  • a compensating element in particular a so-called double manifold 25 without differential pressure, is also arranged.
  • the heat pump system 2 has a second heat pump 26 which is designed as a reversible air / liquid heat pump.
  • This has a refrigerant / liquid heat exchanger, not shown here, which is connected on the one hand to a flow 26A and to a return 26B.
  • a flow bypass line 28 is arranged, which connects the cooling flow 6A with the heating flow 8A bypassing the first heat pump 4.
  • a return bypass line 30 is arranged in a comparable manner, which connects the cooling return 6B to the heating return 8B bypassing the first heat pump 4.
  • the flow 26A of the second heat pump 26 is now connected to the flow bypass line 28 via a first multi-way valve 32, which is preferably designed as a pure changeover valve.
  • the return 26B is connected to the return bypass line 30 via a second multi-way valve 34, which in turn is also preferably designed as a simple switching valve.
  • a frame is shown, the quasi a system boundary between the actual heat pump system and the consumer circuits connected to it in the installed state.
  • interfaces for example connections, are provided at the system boundary, via which the consumer circuits are connected.
  • the illustrated heat pump system 2 serves to simultaneously provide heat on the heating circuit 8 side and cold on the cooling circuit 6 side.
  • the first heat pump 4 which is designed as an electrical compression heat pump, transfers heat from the cooling circuit 6 to the heating circuit 8.
  • the first heat pump 4 is prioritized over the second heat pump 26 and is designed so that the two buffer stores 10, 14 are kept at a specific temperature level and in particular do not fall below a heating target temperature T_Soll, Hz or a cooling target temperature T_Soll in the cooling buffer store 10 , K is not exceeded.
  • the respective buffer store 10, 14 is loaded with cold or heat in each case up to a maximum heating temperature T_max in the heating buffer store 14 or up to a minimum cooling temperature T_min in the cooling buffer store 10.
  • the target temperatures and the maximum / minimum temperatures are preferably adjustable and can also be varied during operation.
  • the heat pump system 2 is operated in such a way that the target temperatures T_Soll, Hz; T_Soll, K is regulated.
  • the first heat pump 4 is operated as a priority, for example continuously or clocked. If the heating requirement is excessive, heat is increasingly withdrawn from the cooling circuit 6, so that the cooling buffer store 10 is quasi “undercooled”. Conversely, if the cooling requirement exceeds, the heating buffer store 14 is “overheated”. If the preset maximum heating temperature T_max or the minimum cooling temperature T_min is reached, the further operation of the first heat pump 4 is blocked. Any additional heating or cooling requirement is then provided by the second heat pump 26.
  • This is also designed as an electrical compression heat pump, but in contrast to the first heat pump 4 can be operated reversibly, ie the circuit can be operated in the reverse direction of flow by appropriate control.
  • the function of the heat exchanger of the second heat pump 26 can therefore be switched between the evaporator and the condenser by reversing the direction of flow.
  • the temperature values T_R1, T_R2 of the temperature sensors R1, R2 are first queried and evaluated. On the basis of these temperature values T_R1, T_R2 it is determined whether there is a heating or cooling requirement. If this is not the case, the first heat pump 4 and the second heat pump 26 are deactivated, that is to say switched off or not switched on. Ie the refrigerant circuit is not active, there is no heat shift.
  • the second heat pump 26 is switched on. If the first heat pump 4, on the other hand, is enabled, the first heat pump 4 is activated and switched on, so that heat is shifted from the cooling circuit 6 into the heating circuit 8. When the second heat pump 26 is activated, heat is equalized.
  • the temperature values T_R1, T_R2 are queried and evaluated continuously during operation, for example at discrete time intervals. If the second heat pump 26 is switched on, either only a heat input into the heating circuit 8 or a cooling input into the cooling circuit 6 takes place. If, in the further course due to the operation of the second heat pump 26, the first heat pump 4 is released again, for example, it is preferred the second heat pump 26 deactivated again.
  • the diagram according to the Figure 3A can be supplemented to the effect that subsequently to the check whether the first heat pump 4 is released, in the "yes" case it is still checked whether the second heat pump 26 is active. If this is the case, it is switched off.
  • the control and regulation of the heat pump system 2 takes place with the aid of a control unit, not shown here.
  • the diagram according to the Figure 3B shows the control algorithm for querying whether the demand is present. For this purpose, it is checked whether the temperature T_R1 of the first temperature sensor R1 is greater than the cooling target temperature T_Soll, K. It is also checked whether the temperature T_R2 of the second temperature sensor R2 is lower than the heating target temperature T_Soll, Hz. If one of these conditions is met, it is recognized if necessary.
  • Figure 3C shows the control algorithm for querying whether the first heat pump 4 can be released. It is checked here whether the temperature T_R1 of the first temperature sensor R1 is greater than the minimum cooling temperature T_min. In addition, it is checked whether the temperature T_R2 of the second temperature sensor R2 is less than the maximum heating temperature T_max. If one of these conditions is not met, ie if the temperature T_R1, T_R2 in the cooling buffer memory 10 or in the heating buffer memory 14 has reached the minimum cooling temperature T_min or the maximum heating temperature T_max, the first heat pump 4 is blocked and can therefore cannot be activated. Otherwise, if these conditions do not exist, the first heat pump 4 is released for operation.
  • the heating target temperature T_Soll, Hz is for example in the range between 30 ° and 60 ° and in particular in a range from 30 ° to 45 ° C and especially at 35 ° C. If this falls below, the first heat pump 4 is switched on or, if necessary, the second heat pump 26 is switched on in the heating mode.
  • the cooling target temperature T_Soll, K is for example in the range from 5 ° to 20 ° C, especially in the range from 8 ° to 18 ° and in particular for example at 12 ° C. If this is exceeded, the first heat pump is switched on again 4 or, if this is blocked, switching on the second heat pump 26.
  • the maximum heating temperature T_max is, for example, 10 ° to 30 ° C, preferably 10 ° to 20 ° C and, for example, 10 ° C above the heating target temperature T_Soll, Hz. Buffer memory 14 allows up to this maximum heating temperature T_max. Conversely, this also applies to subcooling of the cooling buffer memory 10.
  • the minimum cooling temperature T_min is preferably also, for example, 10 ° to 15K below the cooling target temperature T_Soll, K and, for example, 5K.
  • the target temperatures T_Soll, Hz; T_Soll, K are controlled during operation depending on requirements, for example depending on the outside temperature outside the building or depending on the requirements of an industrial process.
  • the desired difference to the maximum, minimum temperatures T_max, T_min is preferably determined, so that the absolute values for these maximum, minimum temperatures are traced.
  • the temperature difference between the target temperatures T_Soll, Hz; T_Soll, K and the maximum or minimum temperatures T_max; T_min varies or the absolute values of the maximum or minimum temperatures T_max; T_min varies.
  • this variation takes place automatically by means of the control device, not shown here, in particular depending on a current energy price.
  • the control device not shown here, in particular depending on a current energy price.
  • the temperature difference and / or the maximum values are increased (decreased), so that the degree of loading of the buffer stores 10, 14, that is to say their overheating or subcooling, can be increased.
  • valves 24 are designed as mixing valves, so that a so-called Return admixture is implemented to set the respective consumer flow temperature to the required temperature level. These valves 24 (mixers) are also controlled by the control unit.
  • the consumers 12, 16 are preferably operated externally e.g. regulated by a building management system, i.e. the temperature level for consumers 12, 16 is set externally.
  • a building management system i.e. the temperature level for consumers 12, 16 is set externally.
  • more than one consumer (circuit) can be connected to a respective buffer memory 10, 14.
  • the entire system is designed for monoenergetic operation, so that preferably only an electrical energy supply is provided.
  • the two heat pumps 4.26 are operated with electrical energy.
  • additional heating elements can be arranged in the heating buffer memory 14, for example, in order to ensure an efficient heat supply even at low outside temperatures.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)
EP19213760.2A 2018-12-14 2019-12-05 Installation de pompe à chaleur Active EP3667182B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018221850.1A DE102018221850A1 (de) 2018-12-14 2018-12-14 Wärmepumpenanlage

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EP3667182A1 true EP3667182A1 (fr) 2020-06-17
EP3667182B1 EP3667182B1 (fr) 2023-06-07

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019135468A1 (de) * 2019-12-20 2021-06-24 Friedhelm Meyer Verfahren zum Betrieb eines integralen Heiz-/Klimatisierungs- und Kühlsystems sowie integrales Heiz-/Klimatisierungs- und Kühlsystem mit thermischem Speicher
WO2023170300A1 (fr) 2022-03-11 2023-09-14 Propellane Pompe a chaleur a deux systemes de stockage et restitution d'energie thermique
FR3133430B1 (fr) 2022-03-11 2024-05-03 Christophe Poncelet Pompe a chaleur a deux systemes de stockage et restitution d’energie thermique
DE102022211372A1 (de) 2022-10-26 2024-05-02 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Betrieb eines Kraftwärmemaschinensystems, Steuer- oder Regelvorrichtung und Kraftwärmemaschinensystem

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986000976A1 (fr) * 1984-07-27 1986-02-13 Uhr Corporation Systeme de chauffage, refroidissement et gestion energetique de batiments d'habitation
DE20203713U1 (de) * 2001-08-02 2002-12-19 Hinrichs, Günter, 22149 Hamburg Vorrichtung in einem Gebäude zur Gewinnung von Wärmeenergie für eine Wärmepumpe
EP1674802A2 (fr) * 2004-12-21 2006-06-28 Titano SA Dispositif multifonctionnel de chauffage et/ou refroidissement pour des bâtiments résidentiels
WO2016075045A1 (fr) * 2014-11-10 2016-05-19 Energy Machines S.A. Installation de chauffage

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19702416A1 (de) * 1997-01-24 1998-07-30 Heinz Dieter Hoose Wärmepumpenanlage
RU2012112655A (ru) * 2009-09-29 2013-11-10 Кэрие Корпорейшн Система и способ для поддержания температуры воздуха в системе отопления, вентиляции и кондиционирования воздуха в здании
CN107923655B (zh) * 2015-08-17 2021-01-22 三菱电机株式会社 热利用装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986000976A1 (fr) * 1984-07-27 1986-02-13 Uhr Corporation Systeme de chauffage, refroidissement et gestion energetique de batiments d'habitation
DE20203713U1 (de) * 2001-08-02 2002-12-19 Hinrichs, Günter, 22149 Hamburg Vorrichtung in einem Gebäude zur Gewinnung von Wärmeenergie für eine Wärmepumpe
EP1674802A2 (fr) * 2004-12-21 2006-06-28 Titano SA Dispositif multifonctionnel de chauffage et/ou refroidissement pour des bâtiments résidentiels
WO2016075045A1 (fr) * 2014-11-10 2016-05-19 Energy Machines S.A. Installation de chauffage

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EP3667182B1 (fr) 2023-06-07
PL3667182T3 (pl) 2023-11-06
DE102018221850A1 (de) 2020-06-18

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