EP3662199B1 - Stromstoss geschützte leuchte - Google Patents

Stromstoss geschützte leuchte Download PDF

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Publication number
EP3662199B1
EP3662199B1 EP18740611.1A EP18740611A EP3662199B1 EP 3662199 B1 EP3662199 B1 EP 3662199B1 EP 18740611 A EP18740611 A EP 18740611A EP 3662199 B1 EP3662199 B1 EP 3662199B1
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EP
European Patent Office
Prior art keywords
luminaire
component
electrically insulating
metal section
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP18740611.1A
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English (en)
French (fr)
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EP3662199A1 (de
Inventor
Maurice Lucien Eugene CASANOVA
Mark Johannes Antonius VERHOEVEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signify Holding BV
Original Assignee
Signify Holding BV
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Filing date
Publication date
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Publication of EP3662199A1 publication Critical patent/EP3662199A1/de
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/0005—Fastening of light sources or lamp holders of sources having contact pins, wires or blades, e.g. pinch sealed lamp
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/08—Lighting devices intended for fixed installation with a standard
    • F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads

Definitions

  • the present invention relates to a luminaire such as a Class II luminaire comprising a housing having a metal section and incorporating an electrical component arrangement including a printed circuit board having a first major surface carrying at least one light engine and a heatsink for thermal management of the at least one light engine.
  • luminaires such as outdoor luminaires, e.g. street lighting, traffic lights, and so on, is typically mandated by standards to ensure that such luminaires comply with the applicable health and safety regulations.
  • Such luminaires may be subdivided into the following classes.
  • Class I luminaires which are electrically insulated and provided with a connection to earth in order to protect exposed metal parts that become live, e.g. in case of electrical insulation failure.
  • Class II luminaires which are designed such that protection against electric shock does not rely on basic electrical insulation only.
  • connection to ground may not be feasible, such that Class II luminaires often are used in such circumstances, e.g. when replacing a traditional luminaire with a solid state lighting, e.g. LED-based, luminaire, for example to reduce maintenance needs for the luminaire owing to the excellent lifetime characteristics of solid state lighting-based luminaires as well as to reduce energy costs owing to the excellent energy consumption characteristics of such luminaires.
  • a solid state lighting e.g. LED-based
  • luminaires and in particular Class II luminaires
  • common mode surges e.g. caused by an unforeseen electrical discharge such as a lightning strike
  • the active circuit components e.g. one or more driver circuits and/or one or more light engines
  • Such common mode surges for example may occur due to the presence of parasitic capacitances in the luminaire.
  • parasitic capacitance may exist between copper tracks and the aluminium substrate of a metal core printed circuit board (MCPCB), which can provide an undesired electrical path in case of a surge event.
  • MCPCB metal core printed circuit board
  • KR 2012/0092843 A discloses a substrate for an LED lighting device having an electromagnetic shielding function to prevent the damage of an inner lead of LEDs by discharging and bypassing electromagnetic energy through a ground pattern. This however cannot be used in Class II luminaires due to the absent ground connection in such luminaires.
  • class I-II luminaire is shwon in EP-A-3 024 302 .
  • some shunting element are used for guiding the electrical discharge to the ground.
  • One possible solution for surge protection of the electrical components in luminaires such as Class II luminaires is to deploy an electrically insulating material around the electrical components separating these components from the metal housing of such a luminaire.
  • the thickness of such an electrically insulating envelope required to achieve the desired electrical insulation compromises the heat transfer from the heatsink coupled to the MCPCB to the outside world, thereby reducing the lifetime of the LEDs on the MCPCB due to thermal stress.
  • the present invention seeks to provide a luminaire, in particular a Class II luminaire, having a design that suppresses common mode surges without requiring an electrically insulating material enveloping the electrical components of such a luminaire.
  • a luminaire comprising a housing having a metal section and incorporating an electrical component arrangement including a printed circuit board having a first major surface carrying at least one light engine and a second major surface opposite the first major surface; a heatsink exposed within said metal section, the heatsink having a further major surface facing the second major surface; an electrically insulating layer in between the further major surface and the second major surface and having a margin extending beyond each of the second major surface and the further major surface by a minimum width, said margin being separated from the metal section by an air gap having a minimum height; and at least one electrically insulating fixing arrangement extending through the printed circuit board and the electrically insulating layer securing the printed circuit board to the metal section.
  • the present invention is based on the insight that the heatsink for the at least one light engine, e.g. at least one LED, on the PCB may be mounted within or be integral to a metal section of the housing such that part of the heatsink, e.g. at least part of one or more cooling fins of the heatsink, extend beyond the metal section of the housing to facilitate effective cooling of the at least one light engine.
  • an insulating layer is located in between the heatsink and the PCB. More specifically, the inventors have found that a conductive path, e.g.
  • a creepage current path can be prevented from forming between the PCB and the metal section during such electrical discharge events if the surface of the heatsink facing the PCB does not extend beyond the PCB surface and the insulating layer extends beyond the PCB surface by a margin having a defined minimum width in combination with an air gap of a defined minimum height in between the margin and the metal section of the housing to suppress an electrical field strengthening effect occurring across the major surfaces of the margin.
  • the minimum width (W) preferably at least matches a creepage distance for a RMS working voltage of the luminaire as defined in the IEC60598-1:2014 standard as published by the International Electrotechnical Commission based in Geneva, Switzerland; see Chapter 11 of this standard.
  • the minimum width of its margin may be a product of the creepage distance and a safety scaling factor having a value exceeding 1, preferably wherein said value is in the range of 2-4.
  • the safety scaling factor may be 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9 or 4.0.
  • the minimum width (W) may be at least 5 mm, preferably is at least 8 mm.
  • the minimum height (H) preferably is in a range of 1-2 mm.
  • this layer preferably has a thickness of less than 1 millimeter, such as a thickness in the range of 100-400 ⁇ m.
  • this layer may be made of any electrically insulating material comprising a suitable dielectric constant. Examples of such materials include a polyimide film or tape such as Kapton® manufactured by the DuPont Corporation and a polyethylene terephthalate film or tape such as Melinex® manufactured by the DuPont Corporation although other materials may of course be contemplated.
  • the luminaire further comprises a pair of electrical conductors connected to the electrical component arrangement for connecting the electrical component arrangement to an external power supply including a neutral (N) and live (L) terminal, wherein the metal section of the housing is shaped such that the metal section comprises a defined location having a minimal distance to the electrical conductor for connecting to the neutral terminal or the live terminal of the external power supply.
  • a defined location defines a pinch point in the housing such that when the luminaire is exposed to an electrical discharge event, the associated electrical discharge can be routed to the neutral or live terminal in a controlled manner, i.e. across this pinch point, thereby avoiding or at least reducing the risk of the electrical components of the luminaire becoming exposed to undesirable common mode surges.
  • the electrical component arrangement comprises a driver connected to the pair of electrical conductors.
  • the printed circuit board may comprise a metal core having an electrically conductive connection to the electrical conductor for connecting to the neutral or live terminal of the external power supply, said connection bypassing the driver such that any surges are immediately redirected from the metal core to the live terminal, thereby bypassing the driver and the light engine(s) on the PCB.
  • each fixing arrangement comprises a first component mounted in a recess within the metal section, e.g within the heatsink, and a second component secured in the first component and extending through the insulating layer and the printed circuit board, wherein at least one of the first component and the second component is made of an electrically insulating material to ensure that the fixing arrangement is electrically insulating to such an extent that the fixing arrangement does not provide a conductive path from the metal portion of the housing to the PCB during an aforementioned electrical discharge event.
  • the second component may have a threaded portion extending through the insulating layer and the printed circuit board, which engages with the first component in order to secure the PCB against the heatsink. Consequently, the PCB may be secured in a straightforward manner against the heatsink when assembling the luminaire.
  • the first component may be threaded such that the second component can be a screw, bolt or the like that can be screwed into the first component.
  • the second component may be a threaded pin and the first component may be a body molded over the threaded pin, wherein the fixing arrangement further comprising a locking nut engaging with the threaded pin.
  • the second component is made of a metal, in which case the first component must be made of an electrically insulating material such as a plastics material in order to ensure the electrical insulation of the fixing arrangement.
  • the second component may be made of an electrically insulating material, e.g. a plastic second component optionally reinforced with a rigid core of an electrically insulating material such as a glass core, in which case the first component may be made of an electrically insulating material or an electrically conductive material.
  • the first component may form an integral part of the metal section of the housing, e.g. of the heatsink.
  • the first component has an end surface facing the metal section of the housing, wherein a clearance is present between said end surface and the metal section.
  • a clearance introduces a weak spot in terms of electrical breakdown, such that when a surge event occurs this weak spot will break down before any of the other insulating materials, thereby protecting these materials from degradation.
  • the first component may further comprise a contact surface facing the insulating layer, said contact surface comprising a deformable portion contacting the insulating layer. This ensures that upon pressing the first component against the insulating layer, a gas-tight insulating junction is formed between the first component and the electrically insulating layer such that the first component and the electrically insulating layer act as a single electrically insulating structure, which further reduces the risk of an electrical discharge event to which the housing is exposed reaching the PCB and connected electrical components through the electrically insulating layer.
  • Each recess may comprise a ribbed surface and/or a T-shape for securing the first component in the recess to increase friction between the first component and the recess, thereby reducing the risk that the first component is accidentally released from the recess during normal use of the luminaire, e.g. when the first component shrinks during temperature fluctuations to which the luminaire may be exposed during such normal use.
  • the luminaire may further comprise a lens plate covering the at least one light engine on the first major surface of the printed circuit board, wherein the at least one electrically insulating fixing arrangement further extends through the lens plate.
  • a lens plate for instance may be present where the at least one light engine comprises one or more LEDs in order to shape the luminous output of such LEDs, as is well-known per se.
  • the housing of the luminaire may have any suitable shape.
  • the housing may comprise a metal section cooperating with a plastic or glass component defining a light exit window of the luminaire, which component may be fitted to the metal section in any suitable manner, e.g. hinged to allow access to the internals of the luminaire.
  • the metal section may envelop the electrical component arrangement and include a rim defining a light exit aperture facing the at least one light engine, said rim being spatially separated from the second major surface of the printed circuit board by a distance of at least 10 millimeters in order to prevent a current discharge path forming from the rim to the PCB during exposure of the metal section of the housing to an electrical discharge event such as a lightning strike.
  • an optically transmissive plate is mounted in said light exit aperture, such as a transparent glass plate, lens plate, diffuser plate, and so on to weatherproof the internals of the luminaire and optionally to further shape the luminous output of the luminaire.
  • an optically transmissive plate may be omitted, e.g. where a lens plate is present over the at least one light engine on the PCB, in which case the luminaire may further comprise a weatherproof seal such as a rubber seal extending from the rim to weatherproof the electrical component arrangement of the luminaire.
  • a metal this is to be understood as a material exhibiting metallic properties in terms of electrical conductance and as such is not limited to materials consisting of elemental metals, but may also include metal alloys such as steel, bronze, brass and so on, as well as metal composites such as metal matrix composite materials.
  • a luminaire for any suitable application, e.g. an indoor or outdoor application, although in preferred embodiments the luminaire is designed for outdoor use.
  • the disclosed luminaires may be any Class, e.g. Class I, Class II, Class III luminaires although in preferred embodiments the luminaire is a Class II luminaire, which as explained above tends not to be connected to ground and as such requires a regulated connection to the neutral terminal of a power supply for management of common mode surges to which the luminaire is exposed.
  • FIG. 1 schematically depicts a cross-sectional view of a luminaire 10 according to an exemplary embodiment of the present invention.
  • the luminaire 10 comprises a housing 20 that is at least partially made of a metal, i.e. comprises a metal section 21.
  • the housing 20 at least partially defines an inner chamber of the luminaire 10 in which an electrical component arrangement, i.e. an arrangement of active electrical components, is housed.
  • the electrical component arrangement typically at least comprises a printed circuit board (PCB) 40 (or equivalent carrier) having a first major surface 42 carrying at least one light engine 45 for the generation of light to be emitted by the luminaire 10.
  • PCB printed circuit board
  • the at least one light engine 45 in example embodiments comprises one or more LEDs spatially distributed across the first major surface 42 of the PCB 40, with each light engine 45 comprising one or more LEDs, e.g. a cluster of LEDs per individual light engine 45. Any suitable type of LEDs may be used for this purpose. It should furthermore be understood that the LEDs are not necessarily identical; it is for example equally feasible that the one or more light engines 45 comprise different types of LEDs, e.g. LEDs producing a luminous output having different spectral compositions such as different coloured luminous outputs or white light luminous outputs having different colour temperatures, in which case such a different LEDs may be individually controllable to control the spectral composition of the luminous output of the luminaire 10.
  • An optical structure such as a lens plate 70 may be mounted over the first major surface 42 of the PCB 40 to shape the luminous output of the at least one light engine 45 on this surface, as is well-known per se.
  • a lens plate 70 may be made of any suitable material, e.g. an optical grade polymer such as polycarbonate, polyethylene terephthalate, poly (methyl methacrylate) and so on, glass, etcetera, and may implement any suitable lens function.
  • Such a lens plate 70 in example embodiments may be used to convert a Lambertian luminous distribution produced by one or more LEDs into a different luminous distribution such as a Gaussian luminous distribution although it will be understood by the skilled person that such a lens plate may implement a virtually endless number of different optical functions including optical functions in which a non-symmetrical luminous distribution is produced to generate different luminous intensities in different regions illuminated by the luminaire 10, as for example may be required in outdoor applications such as street lighting where a road surface may be illuminated in a different manner than a pavement or other pedestrian region.
  • the electrical component arrangement typically further comprises a controller arrangement including a driver 60 arranged to control the at least one light engine 45 on the PCB 40.
  • a controller arrangement may comprise multiple drivers as will be readily understood by the skilled person and may further comprise a wireless communication module or the like to receive wireless control instructions, e.g. from a remote controller, for controlling the luminous output of the luminaire 10, in which case the driver 60 (or multiple drivers) are typically responsive to the wireless communication module.
  • the electrical component arrangement e.g. the driver 60
  • the electrical component arrangement is typically connected to a set of electrical conductors 81, 83, 85 for connecting the electrical component arrangement to an external (mains) power supply including a first electrical conductor 81 for connecting the electrical component arrangement to the live terminal L of a mains power supply and a second electrical conductor 83 for connecting the electrical component arrangement to the neutral terminal N of a mains power supply.
  • a third electrical conductor 85 may be present for connecting the electrical component arrangement to ground, although as previously explained such a connection may not be present or completed in case of Class II luminaires.
  • the electrical conductors 81, 83, 85 may take any suitable shape, e.g. pins, sockets, clips, solder pads, conductive tracks and so on, or any combination thereof.
  • the luminaire 10 may further comprise a shielding element 41, which typically is made of an electrically conductive material, e.g. a metal, metal alloy, a conductive coating or the like, and which is arranged to shield the PCB 40 and the at the least one light engine 45 mounted thereon from being exposed to a common mode surge phenomenon such as a lightning strike hitting the luminaire 10.
  • the shielding element 41 may be the metal core, e.g. an aluminium core, of the PCB 40 in case of the PCB 40 being a metal core PCB (MCPCB) or alternatively may be arranged on the PCB 40, e.g. as a layer substantially or entirely covering a major surface of the carrier 11.
  • the shielding element 41 is connected to the second electrical conductor 83 through an electrically conductive connection 47 that bypasses the active circuit components, e.g. the driver 60, of the electrical component arrangement. In this manner, the shielding element 41 is connected to the neutral terminal N of the mains supply when the luminaire 10 is connected to mains.
  • the bypass connection 47 ensures that the electrical charge collected by the shielding element 13 substantially bypasses the active circuit components such as the driver 60, thereby protecting the active circuit components from breakdown or damage.
  • the shielding element 41 provides equipotential bonding between the metal section 21 of the housing 20 and the mains supply, thus shielding the active circuit components within the housing 20 from surge events.
  • this principle may be applied to any type of luminaire 10 comprising one or more active circuit components, this principle is particularly advantageous in luminaires 10 comprising one or more solid state lighting elements, e.g. LEDs, as their light engines 45, as such light engines are particularly vulnerable to exposure to the short high-energy impulses associated with surge phenomena.
  • a bypass connection 47 to the neutral terminal of the mains power supply applies particularly to Class II luminaires 10.
  • the shielding element 41 and/or the bypass connection 47 may be omitted or connected to the third electrical conductor 85, thereby connecting the shielding element 41 to ground.
  • the luminaire 10 may further comprise a defined location 22 within the metal section 21 of the housing 20 at which point the metal section 21 of the housing 20 has the smallest distance between the metal section 21 of the housing 20 and a point 84 on the second electrical conductor 83 or between the shielding element 41 and the defined location 22, with all other points or locations of the metal section 21 exhibiting a greater distance to this point 84 or to the shielding element 41.
  • this refers to any distance through the luminaire 10 in which air is the dielectric medium between such a location on the metal section 21 of the housing 20 and the point 84 or the shielding element 41.
  • This minimal distance defines a pinch point P that creates an arc discharge path between the metal section 21 of the housing 20 and the point 84 (or shielding element 41) such that upon the metal section 21 or the shielding element 41 being subjected to a sudden electrical surge, e.g. due to a nearby lighting strike or the like, the associated electrical charge is transferred from the metal section 21 to the shielding element 41 (or vice versa) across the pinch point P.
  • the shielding element 41 including the pinch point P acts as a lightning rod for collecting the electrical charge from the metal section 21 of the housing 20.
  • the arc discharge path defined by the pinch point P may have any suitable length. In example embodiments, this arc discharge path has a length of at least 6 mm. Alternatively, the arc discharge path may have a length of at least 1.6 mm in order to make the luminaire 10 compliant with the luminaire standard IEC 60598-1 for RMS mains voltages up to 150V, or the arc discharge path may have a length of at least 3 mm in order to make the luminaire 10 compliant with the luminaire standard IEC 60598-1 for RMS mains voltages up to 250V. It should be understood that other clearance dimensions for the pinch point P may be applied without departing from the teachings of the present invention, e.g. a clearance dimension as mandated by the aforementioned standard.
  • the pinch point P may have any dimension that corresponds to a minimum clearance dimension as mandated by a relevant luminaire standard.
  • the pinch point P preferably is located within a part of the housing in which the pinch point P does not interfere with active components, optical components and/or plastics components of the luminaire 10 such that any plasma, e.g. metal vapor, that is generated during an arc discharge event across the pinch point P does not significantly contaminate such components.
  • the luminaire 10 further comprises a heatsink 30 within the metal section 21 of the housing 20 thermally coupled to the PCB 40 in order to provide thermal management (cooling) of the at least one light engine 45 mounted on the first major surface 42 of the PCB 40.
  • the heatsink 30 forms an integral part of the metal section 21 of the housing 20 although in alternative embodiments the heatsink 30 is a discrete component mounted in the metal section 21 of the housing 20, in which case the metal section 21 of the housing 20 may comprise a recess or the like in which the heatsink 30 is mounted in any suitable manner.
  • At least a portion 31 of the heatsink 30, e.g. the cooling fins of the heatsink 30 extend beyond the metal section 21 of the housing 20 in a direction away from the PCB 40, i.e. stands proud of the metal section 21 to provide effective cooling of the at least one light engine 45 on the PCB 40.
  • the heatsink 30 is typically made of a metal in order to ensure good thermal conductivity of the heatsink 30. Consequently, the PCB 40 needs to be protected from common mode surge events to which the metal section 21 including the heatsink 30 are exposed. For this reason, an insulating layer 50 is located in between the heatsink 30 and the PCB 40. This arrangement will be explained in more detail below with the aid of FIG. 3 .
  • the PCB 40 and, if present, the lens plate 70 are affixed to the heatsink 30 or an adjacent region of the metal section 21 of the housing 20 by at least one electrically insulating fixing arrangement extending through the PCB 40 (and the lens plate 70 if present) as well as through the electrically insulating layer 50.
  • the at least one electrically insulating fixing arrangement ensures that when the metal section 21 of the housing 20 such as the heatsink 30 is exposed to a common mode surge event, this surge cannot travel through the fixing arrangement and reach the PCB 40 in this manner.
  • the at least one electrically insulating fixing arrangement is not shown in FIG. 1 for the sake of clarity only but example embodiments thereof will be explained in further detail with the aid of FIG. 4-6 .
  • the metal section 21 of the housing 20 may substantially envelop the electrical component arrangement within the housing 20, i.e. the housing 20 may be substantially formed by the metal section 21.
  • the metal section 21 may comprise a rim 23 delimiting the light exit aperture 24 in the housing 20 opposite the first major surface 42 of the PCB 40 such that the light generated by the at least one light engine 45 on the PCB 40 can exit the luminaire 10 through the aperture 24.
  • the rim 23 preferably is spaced apart by at least 10 mm and more preferably by at least 13 mm from the interface between the PCB 40 and the electrically insulating layer 50, i.e. from the second major surface 44 of the PCB 40, which will be described in further detail below with the aid of FIG. 3 .
  • an optically transmissive plate 25 may be mounted in the aperture 24 in order to prevent access to the internals of the luminaire 10 through the aperture 24.
  • Such an optically transmissive plate 25 may be a transparent plate made of any suitable optically transparent material such as an optically transparent polymer or glass, or alternatively may implement an optical function such as a lens function, a diffuser function, and so on. Where the optically transmissive plate 25 implements a lens function, such a lens function may be combined with the lens plate 70 or alternatively the lens plate 70 may be omitted from the luminaire 10.
  • the optically transmissive plate 25 may be mounted to the rim 23 of the metal section 21 in any suitable manner, e.g. using a rubber seal or the like to weatherproof the aperture 24.
  • the optically transmissive plate 24 may be omitted from the luminaire 10 in which case the luminaire 10 may further comprise a weatherproof seal 29 extending from the rim 23 to weatherproof the internals of the luminaire 10, e.g. by extending between the rim 23 and the lens plate 70.
  • the presence of the lens plate 70 ensures that direct contact of live parts, e.g. the one or more light engines 45 on the PCB 40, is prevented.
  • the housing 20 may have any suitable shape and may for example comprise a metal section 21 as well as one or more further sections at least some of which are interfacing with the metal section 21, such as for example an optically transmissive further section that may be optically transparent or may be diffusive and/or may comprise one or more optical elements, e.g. lenses, collimators or the like, in order to shape the luminous output produced by the light engine(s) 45 within the housing 20 of the luminaire 10.
  • Such a further section may be secured against the metal section 21 in any suitable manner, e.g. using fasteners such as screws, clips, or the like.
  • the further section may be partially attached to the metal section 21, e.g.
  • a watertight seal such as a rubber seal may be present between the metal section 21 and the further section to prevent water ingress into the luminaire 10, which is particularly desirable in case of the luminaire 10 being intended for outdoor use.
  • Many other design variations of the housing 20 will be immediately apparent to the skilled person and it should be understood that the housing 20 is not limited to any of the examples explicitly described in the present application.
  • FIG. 3 schematically depicts a perspective exploded view of the stack including the heatsink 30, the electrically insulating layer 50 and the PCB 40 according to embodiments of the present invention.
  • the heatsink 30 has a major surface 32 contacting a major surface of the electrically insulating layer 50 in a contact region 52 as indicated by the dashed arrows from the corners of the major surface 32 towards the contact region 52.
  • the second major surface 44 of the PCB 40 i.e. the major surface opposite the first major surface 42 carrying the at least one light engine 45
  • the major surface 32 of the heatsink 30 and the second major surface 44 of the PCB 40 in a preferred embodiment have the same size and shape and are mounted on opposite sides of the electrically insulating layer 50 in an aligned manner such that no portion of the major surface 32 of the heatsink 30 extends beyond the perimeter of the second major surface 44 of the PCB 40 when viewed in a projection normal to the major surfaces of the electrically insulating layer 50. This ensures that there is a sufficient large portion of the electrically insulating layer 50 extending beyond these major surfaces to suppress the occurrence of creepage currents across these major surfaces during a surge event.
  • the major surface 32 of the heatsink 30 may have any shape such that this major surface of the heatsink 30 can be mounted on the electrically insulating layer 50 such that no portion of the major surface 32 of the heatsink 30 extends beyond the perimeter of the second major surface 44 of the PCB 40 when viewed in a projection normal to the major surfaces of the electrically insulating layer 50.
  • the electrically insulating layer 50 is dimensioned such that a margin 51 having a width W extends beyond the contact region 52 with the second major surface 44 of the PCB 40.
  • This width W may be a constant width or may be a variable width.
  • the margin 51 has a minimum width W of at least a creepage distance for a RMS working voltage of the luminaire as defined in the IEC60598-1:2014 standard as published by the International Electrotechnical Commission based in Geneva, Switzerland; see Chapter 11 of this standard, in particular Tables 11.1 and 11.2.
  • the minimum width of its margin may be a product of the creepage distance and a safety scaling factor having a value exceeding 1. This value preferably lieis in the range of 2-4 to provide a substantial safety tolerance in excess of the recommended creepage distance.
  • the safety scaling factor may be 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9 or 4.0 although other values of course may be contemplated.
  • the RMS operating voltage of the luminaire is in a range of 200-250V, e.g. is 220V, 230V or 240V
  • the minimum width (W) may be at least 5 mm, preferably is at least 8 mm.
  • the shielding element e.g. the metal core 41, of the PCB 40
  • a touch current from the PCB 40 to the metal section 21 of the housing 20 formed by electrons gliding over the insulating layer 50 does not exceed 700 ⁇ A, thereby preventing a person touching the metal section 21 of the housing 20 in such a scenario from being exposed to a particularly noticeable shock.
  • the margin W is defined from the larger of the two surfaces.
  • the electrically insulating layer 50 can act as a thermal barrier between the PCB 40 and the heatsink 30, the electrically insulating layer 50 preferably has a thickness of less than 1 mm in order to limit its thermal resistance.
  • the electrically insulating layer 50 preferably is made of a material that is substantially gas-tight in order to prevent an arc discharge path forming through air within imperfections or the like throughout the electrically insulating layer 50. Instead, such an arc discharge path may form across the pinch point P as previously explained, thereby protecting the PCB 40 and the components thereon from exposure to such a surge event.
  • any suitable electrically insulating material may be contemplated for the electrically insulating layer 50.
  • suitable materials include a polyimide film or tape such as Kapton® manufactured by the DuPont Corporation and a polyethylene terephthalate film or tape such as Melinex® manufactured by the DuPont Corporation, which have the advantage that sufficient electrical insulation against common mode surge events up to about 12 kV can be achieved with the layer thickness of the electrically insulating layer 50 made of such materials in the range of 100-400 ⁇ m although other materials may of course be contemplated.
  • the electrically insulating layer 50 preferably is made of a rigid material, such that the margin 51 substantially retains its shape. However, some warping or sagging of the electrically insulating layer 50 may occur, especially where the margin 51 includes a safety tolerance as previously explained.
  • the margin 51 of the electrically insulating layer 50 is in physical contact with the metal section 21 of the housing 20, this metal section 21 when electrically charged can cause an electrical field strengthening effect along the margin 51, which can cause a substantial electrical current to form along this path, which clearly is undesirable.
  • the margin 51 of the electrically insulating layer 50 is spatially separated from the metal section 21 of the housing 20 by an air hap having a height H of at least 1 mm, e.g. an air gap having a height H in the range of 1-2 mm. This effectively suppresses such electrical field strengthening effects.
  • the air gap may be combined with other electrically insulating materials in order to from a dielectric stack for suppressing such electrical field strengthening effects, although in such a dielectric stack it is still preferred to dimension the air gap as explained above.
  • a particular advantage of affixing the PCB 40 against the heatsink 30 by separating the PCB 40 from the heatsink 30 by such a relatively thin electrically insulating layer 50 is that particularly effective thermal management of the at least one light engine 45 on the PCB 40 is achieved due to the fact that the heatsink 30 is not enveloped by an electrically insulating material and is at least partially exposed to the outside world, e.g. through its portion 31 extending beyond the metal section 21 of the housing 20.
  • the PCB 40 including the lens plate 70 when present needs to be affixed to the heatsink 30 and/or to the metal section 21 surrounding the heatsink 30 in case of the major surface 32 of the heatsink 30 having a smaller area than the second major surface 44 of the PCB 40 using a fixing arrangement that is electrically insulating.
  • At least one fixing arrangement and typically a plurality of fixing arrangements having a first component forming part of or being secured in a region of the heatsink 30 or a region of the metal section 21 of the housing 20 surrounding the heatsink 30 and a second component that is secured in the first component and that extends through the electrically insulating layer 50, the PCB 40 and if present the lens plate 70, with at least one of the first component and the second component being made of an electrically insulating material such as a plastics material and being dimensioned such that upon the metal section 21 being exposed to a previously described common mode surge event, the electrically insulating material prevents such a common mode surge to travel through the fixing arrangement and reaching the active components such as the at least one light engine 45 on the PCB 40 or any components electrically connected to the PCB 40.
  • the second component may be shaped such that the second component comprises a head portion at a terminal end distal to the first component, e.g. the head of a screw or the like, which head portion engages with the first major surface 42 of the PCB 40 or with the lens plate 70 such that the PCB 40 and the lens plate 70 if present are secured against the metal section 21 of the housing 20 including the heatsink 30 or alternatively a third component such as a locking nut or the like engages with the second component in order to secure the PCB 40 and the lens plate 70 if present against the metal section 21 of the housing 20 including the heatsink 30.
  • a third component such as a locking nut or the like engages with the second component in order to secure the PCB 40 and the lens plate 70 if present against the metal section 21 of the housing 20 including the heatsink 30.
  • FIG. 4 schematically depicts a first example embodiment of such an electrically insulating fixing arrangement including a first component 90 made of an electrically insulating material such as a plastics material within a recess 33 of the heatsink 30 in this example embodiment although as previously explained the recess 33 equally may be formed in a part of the metal section 21 of the housing 20 surrounding the heatsink 30.
  • the second component 100 in this embodiment is a metal screw that extends through the PCB 40 and the electrically insulating layer 50 and comprises a thread 102 on its outer surface that engages with a thread 92 on the inner surface of the first component 90.
  • the first component 90 is a mounting component that may be deformable in order to achieve a one-way fit in the recess 33.
  • the recess 33 and the first component 90 may generally have a T-shape or any other suitable shape that allows the first component 90 to be forcibly deformed such that the first component 90 can be inserted into the recess 33, whereas the shape of the recess 33 and the first component 90 is such that release of the first component 90 from the recess 33 is prevented as long as no considerable force is exerted on the first component 90. In this manner, it is ensured that a mechanically stable and durable fixing arrangement is provided during the lifetime of the luminaire 10.
  • the second component 100 here a screw by way of non-limiting example, preferably is made of metal as a plastics screw tends to have inferior mechanical stability, especially where the luminaire 10 during use is exposed to a large temperature range which can cause excessive contraction or expansion of such a plastics screw which can cause the PCB 40 to be released from the heatsink 30 upon failure of such a fixing arrangement.
  • electrically insulating fixing members such as screws with good mechanical stability can be provided, e.g. plastic screws having a reinforced core such as a glass core, and such mechanically stable electrically insulating fixing members are equally feasible, although metal fixing members are likely to be cheaper to use.
  • the first component 90 may be electrically conductive and integral to the heatsink 30 or a surrounding portion of the metal section 21 of the housing 20.
  • the recess 33 in such a scenario may comprise a thread on its inner surface to secure the second component 100 in the recess 33.
  • the second component 100 alternatively may be a pin engaging with a spring, clip or the like for securing the PCB 40 and the electrically insulating layer 50 against the heatsink 30 in the metal section 21 of the housing 20.
  • the portion of the first component 90 facing the upper portion of the recess 33 i.e. the portion distal to the electrically insulating layer 50, has a minimum thickness D1 of at least 1.5 mm to prevent electrical breakdown of the first component 90 during the metal section 21, e.g. the heatsink 30, being exposed to a previously described common mode surge event or when the PCB 40 becomes electrically charged, e.g. during such a common mode surge event, to prevent an electrical path forming from the PCB 40 to the housing 20 through the metal second component 100.
  • the contact surface of the first component 90 with the electrically insulating layer 50 has a cross-sectional width D2 of at least 2 mm.
  • Such a fixing assembly may be assembled in any suitable manner.
  • the assembly process may begin by milling or otherwise forming the recess 33, after which the deformable mounting component 90 is pressed into the recess 33.
  • the stack comprising the electrically insulating layer 50 and the PCB 40 and optionally comprising the lens plate 70 is formed, which stack comprises one or more through holes aligned with one or more recesses 33.
  • This stack is subsequently secured against the metal section 21 of the housing 20 including the heatsink 30 by extending the second components 100 through these through holes and securing them in the deformable mounting components 90 within the recesses 33.
  • the interface between the deformable first component 90 and the electrically insulating layer 50 preferably is made substantially gas-tight.
  • this may be achieved by providing a deformable protrusion 94, e.g. a deformable ring or the like, which may have any suitable shape such as a tapered or pointed shape towards the electrically insulating layer 50, which deformable protrusion 94 is deformed, e.g.
  • a gas-tight arrangement between the deformable first component 90 and the electrically insulating layer 50 is not necessarily limited to this example embodiment and that such a gas-tight arrangement may be achieved in any suitable manner.
  • FIG. 6 schematically depicts another example embodiment of such an electrically insulating fixing arrangement including a first component 90 made of an electrically insulating material such as a plastics material within a recess 33 of the heatsink 30 in this example embodiment although as previously explained the recess 33 equally may be formed in a part of the metal section 21 of the housing 20 surrounding the heatsink 30.
  • the first component 90 is a plastics component molded over the second component 100, here a metal pin having a threaded outer surface 102, with the second component 100 extending through the aforementioned through holes in the electrically insulating layer 50, PCB 40 and lens plate 70 present in FIG.
  • a threaded third component 110 such as a locking nut engaging with a portion of the threaded second component 100 distal to the first component 90 to secure this stack against the heatsink 30.
  • the second component 100 does not have to be a threaded component and instead may be designed to interact with a third component 110 in the form of a spring, clip or the like. As such fixing arrangements are well-known per se, this is not explained in further detail for the sake of brevity only.
  • the inner side surface(s) of the recess 33 may comprise one or more ribs or embossings 35 that extend into the recess 33 such that upon inserting the overmolded first component 90 into the recess 33, these ribs or embossings 35 dig into the overmolded first component 90, thereby securing this component into the recess 33.
  • a clearance 37 may be present in between the upper surface 93 of the overmolded first component 90 and the roof of the recess 33 to allow for expansion of the overmolded first component 90, e.g. thermal expansion or expansion resulting from water absorption by the overmolded first component 90, thereby improving the mechanical stability of the fixing arrangement of the stack including the electrically insulating layer 50, PCB 40 and optionally the lens plate 70 against the heatsink 30.
  • Such a fixing assembly may be assembled in any suitable manner.
  • the assembly process may begin by milling or otherwise forming the recess 33, after which the deformable mounting component 90 is molded over the second component 100 and the resulting structure is pressed into the recess 33.
  • the stack comprising the electrically insulating layer 50 and the PCB 40 and optionally comprising the lens plate 70 is formed, which stack comprises one or more through holes aligned with one or more recesses 33.
  • This stack is subsequently secured against the metal section 21 of the housing 20 including the heatsink 30 by extending the second components 100 through these through holes and securing a third component 110 such as a locking nut by way of non-limiting example on each second component 100 as previously explained.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)

Claims (15)

  1. Leuchte (10), umfassend:
    ein Gehäuse (20), welches einen Metallabschnitt (21) aufweist und eine Anordnung elektrischer Bauteile enthält, welche eine Leiterplatte (40) mit einer ersten Hauptoberfläche, welche zumindest eine Light Engine trägt, und einer zweiten Hauptoberfläche gegenüber der ersten Hauptoberfläche beinhaltet;
    einen Kühlkörper (30), welcher innerhalb des Metallabschnitts freiliegt, wobei der Kühlkörper eine weitere Hauptoberfläche aufweist, welche der zweiten Hauptoberfläche zugewandt ist;
    eine elektrisch isolierende Schicht (50) zwischen der weiteren Hauptoberfläche und der zweiten Hauptoberfläche und welche einen Rand (51) aufweist, welcher sich über jede von der zweiten Hauptoberfläche und der weiteren Hauptoberfläche über eine Mindestbreite (W) erstreckt, wobei der Rand von dem Metallabschnitt durch einen Luftspalt mit einer Mindesthöhe (H) getrennt ist; und
    zumindest eine elektrisch isolierende Befestigungsanordnung (90, 100, 110), welche sich durch die Leiterplatte und die elektrisch isolierende Schicht erstreckt und die Leiterplatte an dem Metallabschnitt befestigt.
  2. Leuchte nach Anspruch 1, wobei die Mindestbreite (W) zumindest der Kriechstrecke für eine effektive Betriebsspannung der Leuchte wie in der Norm IEC60598-1:2014 definiert entspricht.
  3. Leuchte nach Anspruch 2, wobei die Mindestbreite (W) ein Produkt der Kriechstrecke und eines Sicherheitsnormalisierungsfaktors mit einem Wert größer 1 ist, bevorzugt wobei der Wert in dem Bereich von 2-4 ist.
  4. Leuchte nach Anspruch 2 oder 3, wobei die Mindestbreite (W) zumindest 5 mm ist, bevorzugt zumindest 8 mm ist, wenn die effektive Betriebsspannung in dem Bereich von 200-250 V ist.
  5. Leuchte nach einem der Ansprüche 1-4, wobei die Mindesthöhe (H) in einem Bereich von 1-2 mm ist.
  6. Leuchte (10) nach einem der Ansprüche 1-5, weiter ein Paar von elektrischen Leitern (81, 83) umfassend, welches mit der Anordnung elektrischer Bauteile verbunden ist, um die Anordnung elektrischer Bauteile mit einer externen Stromversorgung zu verbinden, welche einen Anschluss für Nullleiter (N) und Phase (L) beinhaltet, wobei der Metallabschnitt (21) des Gehäuses (20) so geformt ist, dass der Metallabschnitt einen definierten Ort (22) umfasst, welcher einen Mindestabstand zu einem der elektrischen Leiter(81, 83) aufweist.
  7. Leuchte (10) nach Anspruch 6, wobei die Anordnung elektrischer Bauteile einen Treiber (60) umfasst, welcher mit dem Paar von elektrischen Leitern (81, 83) verbunden ist, und wobei die Leiterplatte (40) einen Metallkern (41) umfasst, welcher eine elektrisch leitende Verbindung (47) mit einem der elektrischen Leiter (81, 83) aufweist, wobei die Verbindung den Treiber überbrückt.
  8. Leuchte (10) nach einem der Ansprüche 1-7, wobei jede Befestigungsanordnung ein erstes Bauteil (90), welches in einer Ausnehmung (33) innerhalb des Metallabschnitts (21) montiert ist, und ein zweites Bauteil (100), welches in dem ersten Bauteil befestigt ist und sich durch die elektrisch isolierende Schicht (50) und die Leiterplatte (40) erstreckt, umfasst, wobei zumindest eines von dem ersten Bauteil und dem zweiten Bauteil aus einem elektrisch isolierenden Material hergestellt ist.
  9. Leuchte (10) nach Anspruch 8, wobei das zweite Bauteil (100) einen Gewindeabschnitt (102) aufweist, welcher sich durch die elektrisch isolierende Schicht (50) und die Leiterplatte (40) erstreckt.
  10. Leuchte (10) nach Anspruch 9, wobei das zweite Bauteil (100) ein Gewindestift ist und das erste Bauteil (90) ein über den Gewindestift ausgeformter Körper ist, wobei jede Befestigungsanordnung weiter eine Sicherungsmutter (110) umfasst, welche in den Gewindestift eingreift.
  11. Leuchte (10) nach einem der Ansprüche 8-10, wobei zumindest das erste Bauteil (90) aus einem elektrisch isolierenden Material hergestellt ist.
  12. Leuchte (10) nach Anspruch 11, wobei das erste Bauteil (90) eine Endfläche (93) aufweist, welche dem Metallabschnitt (21) zugewandt ist, und wobei ein Abstand (37) zwischen der Endfläche und dem Metallabschnitt vorhanden ist.
  13. Leuchte (10) nach Anspruch 11 oder 12, wobei das erste Bauteil (90) eine Kontaktfläche umfasst, welche der elektrisch isolierenden Schicht (50) zugewandt ist, wobei die Kontaktfläche einen verformbaren Abschnitt (94) umfasst, welcher die elektrisch isolierende Schicht kontaktiert.
  14. Leuchte nach einem der Ansprüche 8-13, wobei jede Ausnehmung (33) einer gerippte Oberfläche (35) und/oder eine T-Form zum Befestigen des ersten Bauteils (90) in der Ausnehmung umfasst.
  15. Leuchte (10) nach einem der Ansprüche 1-14, weiter eine Linsenplatte (70) umfassend, welche die zumindest eine Light Engine (45) auf der ersten Hauptoberfläche der Leiterplatte (40) abdeckt, wobei die zumindest eine elektrisch isolierende Befestigungsanordnung sich weiter durch die Linsenplatte erstreckt.
EP18740611.1A 2017-07-31 2018-07-23 Stromstoss geschützte leuchte Active EP3662199B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP17184012 2017-07-31
PCT/EP2018/069864 WO2019025213A1 (en) 2017-07-31 2018-07-23 LUMINAIRE PROTECTED AGAINST OVERVOLTAGES

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EP3662199B1 true EP3662199B1 (de) 2021-01-27

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US10794573B2 (en) 2020-10-06
JP2020527282A (ja) 2020-09-03
WO2019025213A1 (en) 2019-02-07
CN111133247B (zh) 2022-03-29
CN111133247A (zh) 2020-05-08
EP3662199A1 (de) 2020-06-10
JP6766290B2 (ja) 2020-10-07
US20200182440A1 (en) 2020-06-11

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