EP3653931B1 - Led lighting apparatus - Google Patents
Led lighting apparatus Download PDFInfo
- Publication number
- EP3653931B1 EP3653931B1 EP19207559.6A EP19207559A EP3653931B1 EP 3653931 B1 EP3653931 B1 EP 3653931B1 EP 19207559 A EP19207559 A EP 19207559A EP 3653931 B1 EP3653931 B1 EP 3653931B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- board
- sub
- radio frequency
- circuitry
- antenna
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002131 composite material Substances 0.000 claims description 40
- 238000004891 communication Methods 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 39
- 238000000034 method Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
- F21V23/045—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor receiving a signal from a remote controller
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
- F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
Definitions
- the present disclosure is related to an LED lighting apparatus, and more particularly related to a smart LED lighting apparatus with wireless communication capabilities.
- LED lighting has gradually become the one of the favorite choices for environment-friendly lighting apparatuses. It is appreciated that LED lighting products are superior to traditional lighting products in terms of lighting principle, energy saving and environmental protection. Nevertheless, most of the traditional lamps mainly focus on illumination, with no or only very few additional functions. In particular, the operational mode of the traditional lamps cannot be easily switched by users. Therefore, it is desired to provide a better integrated smart LED lighting apparatus.
- US2015327349A1 discloses a lighting device; and JP3216685U discloses an assembly of a light and a method for using the light.
- one embodiment of the present disclosure has the communication module and the LED module arranged on a single board, and thus the components required are simplified.
- the LED module is configured to provide light, without being blocked by other metal structure or electronic components. Such configuration also contributes to the performance of transmitting and receiving signals by the communication module.
- the LED lighting apparatus is provided with additional functions, such as dimming, RGBW color mixing, human body sensing and music playing. Compared with the traditional lighting apparatus, the LED lighting apparatus of the embodiment has been integrally designed, and may be easily automatically manufactured so as to reduce the production cost.
- the lighting apparatus includes a main body, a bulb body, a head body, a light emitting diode (LED) module for emitting light, and a communication module for providing wireless communication.
- the bulb body is connected to a first end of the main body.
- the head body is connected to a second end of the main body and configured to be connected to an electrical socket for receiving power.
- the lighting apparatus further includes a composite printed circuit board having a first sub-board and a second sub-board physically coupled to the first sub-board.
- the communication module is located on the first sub-board and the LED module is located on the second sub-board.
- the second sub-board physically surrounds the first sub-board, and the first sub-board and the second sub-board are physically arranged in a same plane.
- the communication module further includes an antenna, a radio frequency circuitry coupled to the antenna for receiving wireless signals, and a radio frequency power circuitry for providing power to the radio frequency circuitry.
- the radio frequency circuitry further includes a radio frequency integrated circuit and an antenna impedance matching circuitry electrically connected to the antenna.
- the radio frequency integrated circuit further includes a crystal oscillator and a flash memory.
- the radio frequency circuitry further includes a radio frequency integrated circuit, a crystal oscillator, a flash memory, and an antenna impedance matching circuitry electrically connected to the antenna.
- the LED module further includes one or a plurality of light emitting diodes, and also a driver circuitry electrically connected to the light emitting diodes to enable the light emitting diodes to emit light.
- the main body further includes a plastic coated aluminum structure.
- the first sub-board and the second sub-board includes different substrates.
- the first sub-board includes an insulating substrate
- the second sub-board includes a metal substrate
- the first sub-board includes a first layer and a second layer physically arranged above the first layer, and the first layer of the first sub-board and the second sub-board are physically arranged in a same plane.
- the communication module includes an antenna, a radio frequency circuitry coupled to the antenna for receiving wireless signals, and a radio frequency power circuitry for providing power to the radio frequency circuitry.
- the radio frequency power circuitry is arranged on the first layer of the first sub-board, and the antenna and the radio frequency circuitry are arranged on the second layer of the first sub-board.
- the first sub-board includes a first layer, a second layer physically arranged above the first layer, and a third layer physically arranged above the second layer.
- the first layer of the first sub-board and the second sub-board are physically arranged in a same plane.
- the communication module includes an antenna, a radio frequency circuitry coupled to the antenna for receiving wireless signals, and a radio frequency power circuitry for providing power to the radio frequency circuitry.
- the antenna and the radio frequency circuitry are arranged in a first plane, and the radio frequency power circuitry is arranged in a second plane different from the first plane.
- the communication module includes an antenna, a radio frequency circuitry coupled to the antenna for receiving wireless signals, and a radio frequency power circuitry for providing power to the radio frequency circuitry.
- the radio frequency power circuitry is arranged on the first layer of the first sub-board
- the radio frequency circuitry is arranged on the second layer of the first sub-board
- the antenna is arranged on the third layer of the first sub-board.
- the lighting apparatus includes a main body 1, a bulb body 3, a head body 2, a light emitting diode (LED) module 5 for emitting light, and a communication module 6 for providing wireless communication.
- a main body 1 a bulb body 3, a head body 2, a light emitting diode (LED) module 5 for emitting light, and a communication module 6 for providing wireless communication.
- LED light emitting diode
- the main body 1 may include a plastic coated aluminum structure.
- the bulb body 3 is connected to a first end of the main body 1.
- the head body 2 is connected to a second end of the main body 1 and configured to be connected to an electrical socket for receiving power.
- the lighting apparatus further includes a composite module 100.
- the composite module 100 includes a composite printed circuit board 4, an LED module 5, and a communication module 6.
- the LED module 5 and the communication module 6 are electrically connected via the composite printed circuit board 4.
- the composite printed circuit board 4 having a first sub-board 41 and a second sub-board 42 physically coupled to the first sub-board 41.
- the communication module 6 is located on the first sub-board 41 and the LED module 5 is located on the second sub-board 42.
- the LED module 5 includes one or a plurality of light emitting diodes (LEDs) 51, and also a driver circuitry 52 electrically connected to the light emitting diodes 51 to enable the light emitting diodes 51 to emit light.
- LEDs light emitting diodes
- the composite printed circuit board 4, the LED module 5, and the communication module 6 are arranged within the main body 1 and the bulb body 3.
- the main body 1 is made of plastic coated aluminum structure. That is, the main body 1 includes a plastic insulating portion 13 and a conductive portion 14 made of aluminum.
- the conductive portion 14 is capable of dissipating heat.
- the bulb body 3 is bulb-shaped to facilitate the LED module 5 emitting light efficiently.
- the bulb body 3 is transparent, and may be made of plastic materials, such as PVC (Polyvinyl chloride, polyvinyl chloride) or PET (Polyethylene terephthalate).
- the LED lighting apparatus also includes a metal piece 7 and an edge line 8.
- the metal piece 7 is pin-shaped and is configured to pass through the head body 2.
- the outer wall of the head body 2 is provided with external thread, thus the metal piece 7 may be electrically connected to an external power source so as to supply the current to the composite printed circuit board 4.
- the metal piece 7 may directly connect to terminals on the composite printed circuit board 4 (not shown) when the length of the metal piece 7 is long enough, such that the metal piece 7 is electrically connected to the composite printed circuit board 4.
- the edge line 8 is arranged on the surface of the composite printed circuit board 4 facing away from the bulb body 3.
- the edge line 8 electrically connects to the head body 2 via the main body 1.
- the bottom of the main body 1 is configured with a protrusion 11 extending from an edge of the bottom toward the edge line 8.
- the protrusion 11 is provided with a socket 12 for engaging with the edge line 8. That is, the composite printed circuit board 4 electrically connects to the head body 2 via the metal piece 7 and the edge line 8.
- a resistance line 9 may be configured on one surface of the composite printed circuit board 4 facing toward the metal piece 7, and the resistance line 9 electrically connects to the metal piece 7.
- a central area of the composite printed circuit board 4 is provided with a through hole 43 or an opening.
- the resistance line 9 operates as a fire wire to pass through the through hole 43 or the opening of the head body 2 so as to electrically connect to the metal piece 7.
- the composite printed circuit board 4 is subjected to wave soldering together with the edge line 8 and the resistance line 9. Afterward, the resistance line 9 and the edge line 8 are connected to the composite printed circuit board 4 by solder paste.
- the composite printed circuit board 4 is of single-layer.
- the communication module 6 and the LED module 5 are welded on the composite printed circuit board 4. That is, the communication module 6 and the LED module 5 are welded on the surface of the composite printed circuit board 4 facing toward the bulb body 3.
- An internal wall of the main body 1 is configured with a ring-shaped stage 131.
- the composite printed circuit board 4 engages with the ring-shaped stage 131.
- the composite printed circuit board 4 is a composite board made by a metal substrate and an insulating substrate.
- the composite printed circuit board 4 includes a first sub-board 41 and a second sub-board 42.
- the communication module 6 is arranged on the first sub-board 41
- the LED module 5 is arranged on the second sub-board 42.
- the first sub-board and the second sub-board are different substrates.
- the first sub-board 41 is an insulating substrate
- the second sub-board 42 is a metal substrate.
- At least one surface of the first sub-board 41 and the second sub-board 42 includes an insulating layer (not shown) and a conductive layer (not shown). That is, both of the first sub-board 41 and the second sub-board 42 includes the insulating layer and the conductive layer.
- the conductive layer electrically connects the first sub-board 41 with the second sub-board 42.
- the insulating layer is configured for insulating the composite printed circuit board 4 and the conductive layer.
- the first sub-board 41 is embedded within the second sub-board 42 so as to form the composite substrate.
- the communication module 6 and the LED module 5 are also on the same plane. As all components of the communication module 6 and the LED module 5 are on the same plane, such configuration may save space.
- the first sub-board 41 and the second sub-board 42 both include the conductive layer.
- the resistance line 9 is arranged in the central area of the composite printed circuit board 4, that is, the resistance line 9 is arranged on the first sub-board 41 for providing power supply to the communication module 6.
- the LED module 5 may operate in accordance with the signals from the communication module 6. With such configuration, the feedback route of the signals from the communication module 6 to the LED module 5 may be easily configured.
- the communication module 6 and the LED module 5 may not be on the same plane- -
- the communication module 6 further includes an antenna 61, a radio frequency circuitry 62 coupled to the antenna 61 for receiving wireless signals, and a radio frequency power circuitry 63 for providing power to the radio frequency circuitry 62.
- the radio frequency circuitry 62 and the antenna 61 may be integrated as a module to be welded on the composite printed circuit board 4.
- the first sub-board 41 includes a first layer 411 and a second layer 412 stacked together.
- the first layer 411 and the second layer 412 are on the same plane.
- the radio frequency power circuitry 63 is arranged on the first layer 411, and the antenna 61 and the radio frequency circuitry 62 are arranged on the second layer 412. That is, the radio frequency power circuitry 63 and the LED module 5 are on the same plane.
- the second layer 412 is disposed away from the radio frequency power circuitry 63.
- the antenna 61 may be configured externally, and the radio frequency circuitry 62 and the radio frequency power circuitry 63 may be separately arranged.
- the first sub-board 41 includes the first layer 411, the second layer 412, and a third layer 413.
- the first layer 411 and the second sub-board 42 are on the same plane, and the radio frequency power circuitry 63 is arranged on the first layer 411.
- the radio frequency circuitry 62 is arranged on the second layer 412, and the antenna 61 is arranged on the third layer 413.
- the second layer 412 is disposed away from the radio frequency power circuitry 63
- the third layer 413 is disposed away from the radio frequency circuitry 62 and the radio frequency power circuitry 63 so as to avoid the signals interference.
- the radio frequency circuitry 62 further includes a radio frequency integrated circuit 621 and an antenna impedance matching circuitry 6214 electrically connected to the antenna 61.
- the radio frequency integrated circuit 621 further includes a filter circuitry 6211, a crystal oscillator 6212 and a flash memory 6213.
- the filter circuitry 6211, the crystal oscillator 6212 and the flash memory 6213 may be located outside the radio frequency integrated circuit 621.
- the antenna 61 is a unipolar antenna disposed on the first sub-board 41.
- the unipolar antenna may be a single wire only occupying very small space.
- the antenna 61 may be configured to be strip-shaped or at least one of a zigzag shape, a spiral shape, a stage shape or a ring shape according to the shape of the first sub-substrate 41. As such, the length of the antenna 61 can be flexibly adjusted to match different operating frequencies.
- the material of the antenna 61 may be at least one of gold, silver, copper, palladium, platinum, nickel, and stainless steel. In a specific application, different materials and different shapes of the antenna 61 may be configured according to different scenarios.
- the LED module 5 includes at least one first LED 51 and a driver circuitry 52.
- the driver circuitry 52 electrically connects to the LED 51 so as to drive the LED 51.
- the driver circuitry 52 is arranged on the composite printed circuit board 4, that is, the driver circuitry 52 and the LED 51 are circuit-fused together.
- Such configuration is feasible for Driver on Board (DOB) lamp, which is usually referred to as "de-energizing,” that is, the conventional AC/DC (AC to DC) rectifier is removed.
- DOB Driver on Board
- de-energizing that is, the conventional AC/DC (AC to DC) rectifier is removed.
- the LED driving circuit and the LED string circuit are combined.
- the DOB uses high-voltage LEDs plus a streamlined high-voltage driving circuit, which can be directly driven by the main voltage, without the need of additional components such as inductors, electrolytic capacitors, and transformers. As such, the size and cost of the lamp may be reduced.
- the LEDs 51 may be configured to surround the second sub-board 42 so as to provide uniform light.
- the power may be supplied to the LED 51 by the path described below.
- the alternating current of the external power source reaches the first sub-board 41 through the metal piece 7 and the resistance line 9 of the head body 2.
- the alternating current is then transmitted to the second sub-board 42 through the wires on the first sub-board 41, and then supplied to the LED 51 through the driver circuitry 52.
- the alternating current is transmitted to the main body 1 through the edge line 8, and back to the head body 2 to form a complete circuit.
- the power may be supplied to the antenna 61 by the path described below.
- the alternating current of the external power source is transmitted to the first sub-board 41 via the metal piece 7 and the resistance line 9 of the head body 2 so as to provide the power to the radio frequency power circuitry 63.
- the alternating current is then supplied to the radio frequency circuitry 62 through the radio frequency power circuitry 63.
- the radio frequency circuit 62 then supplies the power to the antenna 61.
- the signals may be provided to the radio frequency circuitry 62 by the path described below.
- the antenna 61 receives the signals and transforms the signals into electronic signals.
- the electronic signals are then transmitted to the radio frequency circuitry 62 via the wires on the first sub-board 41.
- the LED module 5 may be driven by the communication module 6.
- the radio frequency circuitry 62 controls the driver circuitry 52 in accordance with the control signals so as to drive the LED 51.
- the assembly process of the lamp will be described in detail below.
- the assembled composite printed circuit board 4, the resistance line 9, and the edge line 8 are applied with the wave soldering process. After the wave soldering process, the resistance line 9, the edge line 8, and the composite printed circuit board 4 are fixed together with solder paste.
- the resistance line 9 of the composite printed circuit board 4 is aligned with the middle of the main body 1, and the edge line 8 is aligned with the socket 12 at the bottom of the main body 1.
- the composite printed circuit board 4 is placed on the ring-shaped stage 131 inside the main body 1, and the composite printed circuit board 4 is riveted and connected together via the jig.
- the interference fit between the two is between 0 and 0.1 mm. In a specific application, the interference gap may be 0, 0.05 mm or 0.1 mm.
- the head body 2 is riveted to meet the requirements of the torsion and bending moment. In this way, the head body 2 is prevented from falling off.
- a ring of silicone adhesive or the like is applied to the other end of the main body 1, and the bulb body 3 is assembled. After the silicone glue dries, the bulb body 3 may be fixed on the main body 1.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Optical Communication System (AREA)
Description
- The present disclosure is related to an LED lighting apparatus, and more particularly related to a smart LED lighting apparatus with wireless communication capabilities.
- With the rapid development of LED technology, LED lighting has gradually become the one of the favorite choices for environment-friendly lighting apparatuses. It is appreciated that LED lighting products are superior to traditional lighting products in terms of lighting principle, energy saving and environmental protection. Nevertheless, most of the traditional lamps mainly focus on illumination, with no or only very few additional functions. In particular, the operational mode of the traditional lamps cannot be easily switched by users. Therefore, it is desired to provide a better integrated smart LED lighting apparatus.
-
US2015327349A1 discloses a lighting device; andJP3216685U - Compared with the conventional technology, one embodiment of the present disclosure has the communication module and the LED module arranged on a single board, and thus the components required are simplified. The LED module is configured to provide light, without being blocked by other metal structure or electronic components. Such configuration also contributes to the performance of transmitting and receiving signals by the communication module. Further, the LED lighting apparatus is provided with additional functions, such as dimming, RGBW color mixing, human body sensing and music playing. Compared with the traditional lighting apparatus, the LED lighting apparatus of the embodiment has been integrally designed, and may be easily automatically manufactured so as to reduce the production cost.
- In an embodiment, the lighting apparatus includes a main body, a bulb body, a head body, a light emitting diode (LED) module for emitting light, and a communication module for providing wireless communication. The bulb body is connected to a first end of the main body. The head body is connected to a second end of the main body and configured to be connected to an electrical socket for receiving power. The lighting apparatus further includes a composite printed circuit board having a first sub-board and a second sub-board physically coupled to the first sub-board. The communication module is located on the first sub-board and the LED module is located on the second sub-board. The second sub-board physically surrounds the first sub-board, and the first sub-board and the second sub-board are physically arranged in a same plane.
- In some embodiments, the communication module further includes an antenna, a radio frequency circuitry coupled to the antenna for receiving wireless signals, and a radio frequency power circuitry for providing power to the radio frequency circuitry.
- In some embodiments, the radio frequency circuitry further includes a radio frequency integrated circuit and an antenna impedance matching circuitry electrically connected to the antenna.
- In some embodiments, the radio frequency integrated circuit further includes a crystal oscillator and a flash memory.
- In some embodiments, the radio frequency circuitry further includes a radio frequency integrated circuit, a crystal oscillator, a flash memory, and an antenna impedance matching circuitry electrically connected to the antenna.
- In some embodiments, the LED module further includes one or a plurality of light emitting diodes, and also a driver circuitry electrically connected to the light emitting diodes to enable the light emitting diodes to emit light.
- In some embodiments, the main body further includes a plastic coated aluminum structure.
- In some embodiments, the first sub-board and the second sub-board includes different substrates.
- In some embodiments, the first sub-board includes an insulating substrate, and the second sub-board includes a metal substrate.
- In some embodiments, the first sub-board includes a first layer and a second layer physically arranged above the first layer, and the first layer of the first sub-board and the second sub-board are physically arranged in a same plane.
- In some embodiments, the communication module includes an antenna, a radio frequency circuitry coupled to the antenna for receiving wireless signals, and a radio frequency power circuitry for providing power to the radio frequency circuitry. Particularly, the radio frequency power circuitry is arranged on the first layer of the first sub-board, and the antenna and the radio frequency circuitry are arranged on the second layer of the first sub-board.
- In some embodiments, the first sub-board includes a first layer, a second layer physically arranged above the first layer, and a third layer physically arranged above the second layer. Particularly, the first layer of the first sub-board and the second sub-board are physically arranged in a same plane.
- In some embodiments, the communication module includes an antenna, a radio frequency circuitry coupled to the antenna for receiving wireless signals, and a radio frequency power circuitry for providing power to the radio frequency circuitry. Particularly, the antenna and the radio frequency circuitry are arranged in a first plane, and the radio frequency power circuitry is arranged in a second plane different from the first plane.
- In some embodiments, the communication module includes an antenna, a radio frequency circuitry coupled to the antenna for receiving wireless signals, and a radio frequency power circuitry for providing power to the radio frequency circuitry. Particularly, the radio frequency power circuitry is arranged on the first layer of the first sub-board, the radio frequency circuitry is arranged on the second layer of the first sub-board, and the antenna is arranged on the third layer of the first sub-board.
- The main body may include an annular holder structure configured to hold the composite printed circuit board.
-
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FIG. 1 is an exploded view of the LED lighting apparatus in accordance with one embodiment of the present disclosure. -
FIG. 2 is a sectional view of the LED lighting apparatus in accordance with one embodiment of the present disclosure. -
FIG. 3 is a three-dimensional view of the composite module in accordance with a first embodiment of the present disclosure. -
FIG. 4 is a three-dimensional view of the composite module in accordance with a second embodiment of the present disclosure. -
FIG. 5 is a three-dimensional view of the composite module in accordance with a third embodiment of the present disclosure. -
FIG. 6 is a circuit diagram of one conventional radio frequency chip. -
FIG. 7 is a circuit diagram of the radio frequency chip in accordance with one embodiment of the present disclosure. -
FIG. 8 is a block diagram of the LED lighting apparatus in accordance with one embodiment of the present disclosure. - The present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the claimed invention and are not intended to limit the claimed invention.
- Refer to
FIG. 1 andFIG. 2 . In one embodiment, the lighting apparatus includes amain body 1, a bulb body 3, ahead body 2, a light emitting diode (LED)module 5 for emitting light, and acommunication module 6 for providing wireless communication. - The
main body 1 may include a plastic coated aluminum structure. The bulb body 3 is connected to a first end of themain body 1. Thehead body 2 is connected to a second end of themain body 1 and configured to be connected to an electrical socket for receiving power. The lighting apparatus further includes acomposite module 100. Thecomposite module 100 includes a composite printedcircuit board 4, anLED module 5, and acommunication module 6. TheLED module 5 and thecommunication module 6 are electrically connected via the compositeprinted circuit board 4. The composite printedcircuit board 4 having afirst sub-board 41 and asecond sub-board 42 physically coupled to thefirst sub-board 41. Thecommunication module 6 is located on thefirst sub-board 41 and theLED module 5 is located on thesecond sub-board 42. - The
LED module 5 includes one or a plurality of light emitting diodes (LEDs) 51, and also adriver circuitry 52 electrically connected to thelight emitting diodes 51 to enable thelight emitting diodes 51 to emit light. - Referring to
FIGS. 1-3 , the composite printedcircuit board 4, theLED module 5, and thecommunication module 6 are arranged within themain body 1 and the bulb body 3. Themain body 1 is made of plastic coated aluminum structure. That is, themain body 1 includes a plastic insulatingportion 13 and aconductive portion 14 made of aluminum. Theconductive portion 14 is capable of dissipating heat. The bulb body 3 is bulb-shaped to facilitate theLED module 5 emitting light efficiently. In one embodiment, the bulb body 3 is transparent, and may be made of plastic materials, such as PVC (Polyvinyl chloride, polyvinyl chloride) or PET (Polyethylene terephthalate). - The LED lighting apparatus also includes a
metal piece 7 and anedge line 8. Themetal piece 7 is pin-shaped and is configured to pass through thehead body 2. The outer wall of thehead body 2 is provided with external thread, thus themetal piece 7 may be electrically connected to an external power source so as to supply the current to the composite printedcircuit board 4. Themetal piece 7 may directly connect to terminals on the composite printed circuit board 4 (not shown) when the length of themetal piece 7 is long enough, such that themetal piece 7 is electrically connected to the composite printedcircuit board 4. - In one embodiment, the
edge line 8 is arranged on the surface of the composite printedcircuit board 4 facing away from the bulb body 3. Theedge line 8 electrically connects to thehead body 2 via themain body 1. - In one embodiment, the bottom of the
main body 1 is configured with aprotrusion 11 extending from an edge of the bottom toward theedge line 8. Theprotrusion 11 is provided with asocket 12 for engaging with theedge line 8. That is, the composite printedcircuit board 4 electrically connects to thehead body 2 via themetal piece 7 and theedge line 8. - In one embodiment, when the length of the
metal piece 7 is not long enough for themetal piece 7 to reach the composite printedcircuit board 4, aresistance line 9 may be configured on one surface of the composite printedcircuit board 4 facing toward themetal piece 7, and theresistance line 9 electrically connects to themetal piece 7. In one embodiment, a central area of the composite printedcircuit board 4 is provided with a throughhole 43 or an opening. Theresistance line 9 operates as a fire wire to pass through the throughhole 43 or the opening of thehead body 2 so as to electrically connect to themetal piece 7. The composite printedcircuit board 4 is subjected to wave soldering together with theedge line 8 and theresistance line 9. Afterward, theresistance line 9 and theedge line 8 are connected to the composite printedcircuit board 4 by solder paste. - Referring to
FIGS. 1 ,3 ,4 and5 , the composite printedcircuit board 4 is of single-layer. Thecommunication module 6 and theLED module 5 are welded on the composite printedcircuit board 4. That is, thecommunication module 6 and theLED module 5 are welded on the surface of the composite printedcircuit board 4 facing toward the bulb body 3. - An internal wall of the
main body 1 is configured with a ring-shapedstage 131. The composite printedcircuit board 4 engages with the ring-shapedstage 131. The composite printedcircuit board 4 is a composite board made by a metal substrate and an insulating substrate. - The composite printed
circuit board 4 includes afirst sub-board 41 and asecond sub-board 42. Thecommunication module 6 is arranged on thefirst sub-board 41, and theLED module 5 is arranged on thesecond sub-board 42. The first sub-board and the second sub-board are different substrates. For instance, thefirst sub-board 41 is an insulating substrate, and thesecond sub-board 42 is a metal substrate. - At least one surface of the
first sub-board 41 and thesecond sub-board 42 includes an insulating layer (not shown) and a conductive layer (not shown). That is, both of thefirst sub-board 41 and thesecond sub-board 42 includes the insulating layer and the conductive layer. The conductive layer electrically connects the first sub-board 41 with thesecond sub-board 42. The insulating layer is configured for insulating the composite printedcircuit board 4 and the conductive layer. - Referring to
FIG. 3 , thefirst sub-board 41 is embedded within the second sub-board 42 so as to form the composite substrate. As thefirst sub-board 41 and the second sub-board 42 are on the same plane, thecommunication module 6 and theLED module 5 are also on the same plane. As all components of thecommunication module 6 and theLED module 5 are on the same plane, such configuration may save space. - The
first sub-board 41 and the second sub-board 42 both include the conductive layer. Theresistance line 9 is arranged in the central area of the composite printedcircuit board 4, that is, theresistance line 9 is arranged on the first sub-board 41 for providing power supply to thecommunication module 6. On the other hand, theLED module 5 may operate in accordance with the signals from thecommunication module 6. With such configuration, the feedback route of the signals from thecommunication module 6 to theLED module 5 may be easily configured. - Referring to
FIGS. 4 and5 , in an example arrangement not forming part of the claimed invention, thecommunication module 6 and theLED module 5 may not be on the same plane- -Thecommunication module 6 further includes anantenna 61, aradio frequency circuitry 62 coupled to theantenna 61 for receiving wireless signals, and a radiofrequency power circuitry 63 for providing power to theradio frequency circuitry 62. - Referring to
FIG. 4 , theradio frequency circuitry 62 and theantenna 61 may be integrated as a module to be welded on the composite printedcircuit board 4. Specifically, thefirst sub-board 41 includes afirst layer 411 and asecond layer 412 stacked together. Thefirst layer 411 and thesecond layer 412 are on the same plane. The radiofrequency power circuitry 63 is arranged on thefirst layer 411, and theantenna 61 and theradio frequency circuitry 62 are arranged on thesecond layer 412. That is, the radiofrequency power circuitry 63 and theLED module 5 are on the same plane. To avoid signal interference, thesecond layer 412 is disposed away from the radiofrequency power circuitry 63. - Referring to
FIG. 5 , - theantenna 61 may be configured externally, and theradio frequency circuitry 62 and the radiofrequency power circuitry 63 may be separately arranged. Specifically, thefirst sub-board 41 includes thefirst layer 411, thesecond layer 412, and athird layer 413. Thefirst layer 411 and the second sub-board 42 are on the same plane, and the radiofrequency power circuitry 63 is arranged on thefirst layer 411. Theradio frequency circuitry 62 is arranged on thesecond layer 412, and theantenna 61 is arranged on thethird layer 413. Thesecond layer 412 is disposed away from the radiofrequency power circuitry 63, and thethird layer 413 is disposed away from theradio frequency circuitry 62 and the radiofrequency power circuitry 63 so as to avoid the signals interference. - Referring to
FIG. 7 , in some embodiments, theradio frequency circuitry 62 further includes a radio frequency integratedcircuit 621 and an antennaimpedance matching circuitry 6214 electrically connected to theantenna 61. The radio frequency integratedcircuit 621 further includes afilter circuitry 6211, acrystal oscillator 6212 and aflash memory 6213. - Referring to
FIG. 6 , in one embodiment, thefilter circuitry 6211, thecrystal oscillator 6212 and theflash memory 6213 may be located outside the radio frequency integratedcircuit 621. - In some embodiments, the
antenna 61 is a unipolar antenna disposed on thefirst sub-board 41. The unipolar antenna may be a single wire only occupying very small space. In another example, theantenna 61 may be configured to be strip-shaped or at least one of a zigzag shape, a spiral shape, a stage shape or a ring shape according to the shape of thefirst sub-substrate 41. As such, the length of theantenna 61 can be flexibly adjusted to match different operating frequencies. The material of theantenna 61 may be at least one of gold, silver, copper, palladium, platinum, nickel, and stainless steel. In a specific application, different materials and different shapes of theantenna 61 may be configured according to different scenarios. - Referring to
FIGS. 1-5 , theLED module 5 includes at least onefirst LED 51 and adriver circuitry 52. Thedriver circuitry 52 electrically connects to theLED 51 so as to drive theLED 51. Thedriver circuitry 52 is arranged on the composite printedcircuit board 4, that is, thedriver circuitry 52 and theLED 51 are circuit-fused together. Such configuration is feasible for Driver on Board (DOB) lamp, which is usually referred to as "de-energizing," that is, the conventional AC/DC (AC to DC) rectifier is removed. The LED driving circuit and the LED string circuit are combined. The DOB uses high-voltage LEDs plus a streamlined high-voltage driving circuit, which can be directly driven by the main voltage, without the need of additional components such as inductors, electrolytic capacitors, and transformers. As such, the size and cost of the lamp may be reduced. In one embodiment, when there aremany LEDs 51, theLEDs 51 may be configured to surround the second sub-board 42 so as to provide uniform light. - Referring to
FIG. 8 , in one embodiment, the power may be supplied to theLED 51 by the path described below. The alternating current of the external power source reaches the first sub-board 41 through themetal piece 7 and theresistance line 9 of thehead body 2. The alternating current is then transmitted to the second sub-board 42 through the wires on thefirst sub-board 41, and then supplied to theLED 51 through thedriver circuitry 52. Afterward, the alternating current is transmitted to themain body 1 through theedge line 8, and back to thehead body 2 to form a complete circuit. - The power may be supplied to the
antenna 61 by the path described below. The alternating current of the external power source is transmitted to thefirst sub-board 41 via themetal piece 7 and theresistance line 9 of thehead body 2 so as to provide the power to the radiofrequency power circuitry 63. The alternating current is then supplied to theradio frequency circuitry 62 through the radiofrequency power circuitry 63. Theradio frequency circuit 62 then supplies the power to theantenna 61. - The signals may be provided to the
radio frequency circuitry 62 by the path described below. Theantenna 61 receives the signals and transforms the signals into electronic signals. The electronic signals are then transmitted to theradio frequency circuitry 62 via the wires on thefirst sub-board 41. - The
LED module 5 may be driven by thecommunication module 6. In one example, theradio frequency circuitry 62 controls thedriver circuitry 52 in accordance with the control signals so as to drive theLED 51. - The assembly process of the lamp will be described in detail below. First, the assembled composite printed
circuit board 4, theresistance line 9, and theedge line 8 are applied with the wave soldering process. After the wave soldering process, theresistance line 9, theedge line 8, and the composite printedcircuit board 4 are fixed together with solder paste. - Next, the
resistance line 9 of the composite printedcircuit board 4 is aligned with the middle of themain body 1, and theedge line 8 is aligned with thesocket 12 at the bottom of themain body 1. The composite printedcircuit board 4 is placed on the ring-shapedstage 131 inside themain body 1, and the composite printedcircuit board 4 is riveted and connected together via the jig. The interference fit between the two is between 0 and 0.1 mm. In a specific application, the interference gap may be 0, 0.05 mm or 0.1 mm. After thehead body 2 and themetal piece 7 are assembled, thehead body 2 is riveted to meet the requirements of the torsion and bending moment. In this way, thehead body 2 is prevented from falling off. Lastly, a ring of silicone adhesive or the like is applied to the other end of themain body 1, and the bulb body 3 is assembled. After the silicone glue dries, the bulb body 3 may be fixed on themain body 1. - The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in view of the above teachings. The embodiments were chosen and described in order to best explain the principles of the techniques and their practical applications. Others skilled in the art are thereby enabled to best utilize the techniques and various embodiments with various modifications as are suited to the particular use contemplated.
- Although the disclosure and examples have been fully described with reference to the accompanying drawings, it is to be noted that various changes and modifications will become apparent to those skilled in the art. Such changes and modifications are to be understood as being included within the scope of the disclosure and examples as defined by the claims.
Claims (14)
- A lighting apparatus comprising:a main body (1);a bulb body (3) connected to a first end of the main body (1);a head body (2) connected to a second end of the main body (1), and is configured to be connected to an electrical socket for receiving power;a light emitting diode - hereafter abbreviated LED - module (5) configured for emitting light;a communication module (6) configured for providing wireless communication; anda composite printed circuit board (4) comprising a first sub-board (41) and a second sub-board (42) physically coupled to the first sub-board (41), wherein the communication module (6) is located on the first sub-board (41) and the LED module is located on the second sub-board (42),characterized in that the second sub-board (42) physically surrounds the first sub-board (41), and the first sub-board (41) and the second sub-board (42) are physically arranged in a same plane.
- The lighting apparatus of claim 1, wherein the communication module (6) comprises an antenna (61), a radio frequency circuitry (62) coupled to the antenna (61) configured for receiving wireless signals, and a radio frequency power circuitry (63) configured for providing power to the radio frequency circuitry (62).
- The lighting apparatus of claim 2, wherein the radio frequency circuitry (62) comprises a radio frequency integrated circuit (621) and an antenna impedance matching circuitry (6214) electrically connected to the antenna (61).
- The lighting apparatus of claim 3, wherein the radio frequency integrated circuit (621) further comprises a crystal oscillator (6212) and a flash memory (6213).
- The lighting apparatus of claim 2, wherein the radio frequency circuitry (621) comprises a radio frequency integrated circuit (621), a crystal oscillator (6212), a flash memory (6213), and an antenna impedance matching circuitry (6214) electrically connected to the antenna (61).
- The lighting apparatus of any one of claims 1-5, wherein the LED module (5) comprises at least one light emitting diode (51) and a driver circuitry (52) electrically connected to the at least one light emitting diode (51) to enable the at least one light emitting diode (51) to emit light.
- The lighting apparatus of any one of claims 1-6, wherein the main body (1) further comprises a plastic coated aluminum structure.
- The lighting apparatus of any one of claims 1-7, wherein the first sub-board (41) and the second sub-board (42) are different substrates,
preferably, the first sub-board (41) includes an insulating substrate, and the second sub-board (42) includes a metal substrate. - The lighting apparatus of any one of claims 1-8, wherein the first sub-board (41) includes a first layer (411) and a second layer (412) physically arranged above the first layer (411), and the first layer (411) of the first sub-board (41) and the second sub-board (42) are physically arranged in a same plane.
- The lighting apparatus of claim 9, wherein the communication module (6) includes an antenna (61), a radio frequency circuitry (62) coupled to the antenna (61) for receiving wireless signals, and a radio frequency power circuitry (63) configured for providing power to the radio frequency circuitry (62), wherein the radio frequency power circuitry (63) is arranged on the first layer (411) of the first sub-board (41), and the antenna (61) and the radio frequency circuitry (62) are arranged on the second layer (412) of the first sub-board (41).
- The lighting apparatus of claim 1, wherein the first sub-board (41) includes a first layer (411), a second layer (412) physically arranged above the first layer (411), and a third layer (413) physically arranged above the second layer (412), wherein the first layer (411) of the first sub-board (41) and the second sub-board (42) are physically arranged in a same plane.
- The lighting apparatus of claim 11, wherein the communication module (6) includes an antenna (61), a radio frequency circuitry (62) coupled to the antenna (61) for receiving wireless signals, and a radio frequency power circuitry (63) configured for providing power to the radio frequency circuitry (62), wherein the antenna (61) and the radio frequency circuitry (62) are arranged in a first plane, and the radio frequency power circuitry (63) is arranged in a second plane different from the first plane.
- The lighting apparatus of claim 11, wherein the communication module (6) includes an antenna (61), a radio frequency circuitry (62) coupled to the antenna (61) for receiving wireless signals, and a radio frequency power circuitry (63) configured for providing power to the radio frequency circuitry (61), wherein the radio frequency power circuitry (63) is arranged on the first layer (411) of the first sub-board (41), the radio frequency circuitry (62) is arranged on the second layer (412) of the first sub-board (41), and the antenna (61) is arranged on the third layer (413) of the first sub-board (41).
- The lighting apparatus of any one of claims 1-5, wherein the main body (1) includes an annular holder structure configured to hold the composite printed circuit board (4).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811346285.9A CN109519728B (en) | 2018-11-13 | 2018-11-13 | Intelligent lamp |
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EP3653931A1 EP3653931A1 (en) | 2020-05-20 |
EP3653931B1 true EP3653931B1 (en) | 2021-03-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP19207559.6A Active EP3653931B1 (en) | 2018-11-13 | 2019-11-06 | Led lighting apparatus |
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Families Citing this family (4)
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CN210637839U (en) * | 2019-08-26 | 2020-05-29 | 厦门赢科光电有限公司 | Ball bulb lamp |
CN211625172U (en) * | 2020-01-16 | 2020-10-02 | 漳州立达信光电子科技有限公司 | Light source intelligent component and radio frequency control lighting lamp with same |
CN212960971U (en) * | 2020-08-05 | 2021-04-13 | 漳州立达信光电子科技有限公司 | Intelligent lamp |
CN116502667B (en) * | 2023-06-21 | 2023-09-29 | 杭州海康威视数字技术股份有限公司 | Radio frequency wake-up circuit and camera system |
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TWI288883B (en) * | 2004-09-27 | 2007-10-21 | Murata Manufacturing Co | RF circuit module |
CN103104828A (en) * | 2011-11-11 | 2013-05-15 | 赵依军 | Light emitting diode (LED) lamp wick and lighting device with LED as light source |
US9538623B2 (en) * | 2014-05-12 | 2017-01-03 | Lg Electronics Inc. | Lighting device |
CN204554408U (en) * | 2015-02-03 | 2015-08-12 | 深圳市诺德光电科技有限公司 | Led |
JP2015181124A (en) * | 2015-06-01 | 2015-10-15 | シャープ株式会社 | Lighting device |
TWM557492U (en) * | 2017-11-22 | 2018-03-21 | 麗光科技股份有限公司 | Lamp assembly and lamp using the lamp assembly |
CN209130543U (en) * | 2018-11-13 | 2019-07-19 | 漳州立达信光电子科技有限公司 | A kind of intelligent lamp |
-
2018
- 2018-11-13 CN CN201811346285.9A patent/CN109519728B/en active Active
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CN109519728B (en) | 2024-09-27 |
CN109519728A (en) | 2019-03-26 |
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