CN204729987U

CN204729987U - Lamp socket, LED lamp and LED

Info

Publication number: CN204729987U
Application number: CN201520448514.3U
Authority: CN
Inventors: 唐水
Original assignee: Qi Jiangwen
Current assignee: Qi Jiangwen
Priority date: 2015-06-26
Filing date: 2015-06-26
Publication date: 2015-10-28
Anticipated expiration: 2025-06-26

Abstract

The utility model relates to lamp socket, LED lamp and LED, described LED seat comprises communication control circuit and power circuit and is positioned at the cavity of housing, the radiator being provided with LED-baseplate and LED chip is positioned at the outside of housing, what make residing for the space residing for communication control circuit and power circuit and radiator is spaced apart, thus reduce the temperature of environment residing for communication control circuit and power circuit, delay communication control circuit and power circuit Yin Gaowen and aging speed, especially the rate of ageing of electrochemical capacitor in power circuit is delayed, and then improve the service life of LED lamp, in addition, the communication module in communication control circuit has good service behaviour, also reduces light path design difficulty simultaneously.

Description

Lamp holder, LED lamp and LED lamp

Technical Field

The utility model belongs to the technical field of the illumination, especially, relate to lamp stand, LED (light emitting diode) lamps and lanterns and LED lamp.

Background

With the continuous development of the internet of things technology and the intelligent home technology, the novel intelligent LED lamp also enters the lighting field along with the development of the internet of things technology and the intelligent home technology, so that the LED lamp is controlled to be turned on/off, the brightness is adjusted, the color temperature or color is adjusted, the work abnormity is detected, the work temperature is detected, the power consumption is detected, and the like, remote or short-range control can be performed in a wireless mode, and the intelligent management of the LED lamp is greatly realized. Wireless networking has emerged in a wide variety of scenarios: the wireless networking scheme comprises an infrared scheme, a 315MHz radio frequency scheme, a 433MHz radio frequency scheme, a Z-Wave scheme (the European frequency band is 868.42MHz, the U.S. frequency band is 908.42MHz), a 2.4GHz and 5GHz Wi-Fi scheme, a 2.4GHz ZigBee scheme, a 2.4GHz Bluetooth scheme and the like, and the wireless networking scheme is widely applied to the field of intelligent lighting.

Fig. 1-1 is a sectional view of a conventional LED lamp, and fig. 1-2 is a sectional view of the LED lamp shown in fig. 1-1. The LED lamp mainly comprises a lamp holder 01 and an LED lamp 02, wherein the LED lamp 02 mainly comprises a radiator 021, a control communication board 022, a power board 023, a substrate 024 and an LED chip 025. Specifically, the method comprises the following steps: the substrate 024 is located at the bottom of the radiator 021, the LED chip 025 is welded on the substrate 024, and the control communication board 022 and the power supply board 023 are located inside the radiator 021.

However, the existing LED lamp has some defects: the control communication board 022 and the power board 023 are arranged inside the heat sink 021, the temperature inside the heat sink is high, and electronic components such as the electrolytic capacitor 026 on the control communication board 022 and the power board 023 are very sensitive to the ambient temperature, so when the LED chip 025 generates heat, the heat is transferred to the heat sink 021 along the direction shown by the arrow a, so that the temperature of the heat sink 021 is gradually increased, and the heat in the heat sink 021 is convected inwards or outwards along the direction shown by the arrow B, so that the electronic components on the control communication board 022 and the power board 023 sealed inside the heat sink 021 are accelerated to age and lose efficacy, and the service life is shortened. In addition, the control communication board 022 includes the antenna 0221, and in order to ensure the working performance of the antenna 0221, a space without a metal component is reserved for the antenna 0221, so that the antenna 0221 is far away from the heat sink 021 and protrudes out of the substrate 024, light emitted by the LED chip is reflected at the antenna 0221, and the light path design of the LED lamp 02 is more complicated.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at providing a lamp stand, LED lamps and lanterns and LED lamp reduce the temperature of the environment that circuit is located in the lamps and lanterns through carrying out the institutional advancement to increase of service life also can reduce the degree of difficulty of light path design simultaneously.

In order to achieve the above object, the utility model provides a following technical scheme:

in one aspect, the present invention discloses a lamp holder for mounting an LED lamp, the lamp holder comprising a housing, a communication control circuit, a power circuit, and a first interface;

the shell is provided with an insulating cavity;

the communication control circuit and the power supply circuit are arranged in the cavity; the communication control circuit comprises a communication module and a control module, wherein the positive input end of the power circuit is electrically connected with a live wire, the negative input end of the power circuit is electrically connected with a zero wire, the control end of the power circuit is electrically connected with the communication control circuit, and the power circuit is provided with N positive output ends and can output N driving currents simultaneously;

the first interface is positioned at the bottom of the shell and provided with a first negative electrode and N first positive electrodes which are insulated from each other, the negative output end of the power supply circuit is electrically connected with the first negative electrode, the N positive output ends of the power supply circuit are electrically connected with the N first positive electrodes in a one-to-one correspondence manner, and the N first positive electrodes can be in contact with the second positive electrode at the top of the LED lamp;

wherein N is an integer greater than or equal to 1.

On the other hand, the utility model also discloses a LED lamp, which comprises the lamp holder and the LED lamp, wherein the LED lamp comprises a radiator, a third interface, an LED substrate and an LED chip; wherein,

the third interface is arranged at the top of the radiator and comprises a third negative electrode and N third positive electrodes which are insulated from each other, the LED lamp can be installed on the lamp holder through the matching of the third interface and the first interface in the lamp holder, and after the LED lamp is installed on the lamp holder, the N third positive electrodes can be electrically connected with the N first positive electrodes in the lamp holder in a one-to-one correspondence manner;

the LED substrate is arranged at the bottom of the heat radiator, the LED substrate is provided with N input ends, one input end of the LED substrate is electrically connected with one third positive electrode in the third interface, when the LED substrate is provided with a plurality of input ends, different input ends of the LED substrate are electrically connected with different third positive electrodes in the third interface, and the output end of the LED substrate is grounded;

the LED chip is arranged on the LED substrate, the LED lamp comprises N LED chip groups, one LED chip group comprises at least one LED chip, the input end of one LED chip group is electrically connected with one input end of the LED substrate, and the output ends of the N LED chip groups are electrically connected with the output end of the LED substrate;

wherein N is an integer greater than or equal to 1.

On the other hand, the utility model also discloses an LED lamp, which comprises a lamp holder and an LED lamp fixed on the lamp holder, wherein the lamp holder comprises a shell, a communication control circuit and a power circuit, and the LED lamp comprises a radiator, an LED substrate and an LED chip;

the radiator is connected with the shell; the shell is provided with an insulating cavity; the communication control circuit and the power supply circuit are arranged in the cavity; the communication control circuit comprises a communication module and a control module, wherein the positive input end of the power circuit is electrically connected with a live wire, the negative input end of the power circuit is electrically connected with a zero wire, the control end of the power circuit is electrically connected with the communication control circuit, and the power circuit is provided with N positive output ends and can output N driving currents simultaneously;

the LED substrate is arranged at the bottom of the radiator and provided with N input ends, one input end of the LED substrate is electrically connected with one positive output end of the power circuit, when the LED substrate is provided with a plurality of input ends, different input ends of the LED substrate are electrically connected with different positive output ends of the power circuit, and the output end of the LED substrate is grounded;

wherein N is an integer greater than or equal to 1.

On the other hand, the utility model also discloses a LED lamp, which comprises a shell, a fourth interface, a radiator, a communication control circuit, a power circuit, an LED substrate and an LED chip;

the fourth interface is positioned at the upper part of the shell and comprises a positive electrode electrically connected with the live wire and a negative electrode electrically connected with the zero wire;

the radiator is positioned at the bottom of the shell; the shell is provided with an insulating cavity;

the communication control circuit and the power supply circuit are arranged in the cavity; the communication control circuit comprises a communication module and a control module, wherein the positive input end of the power supply circuit is electrically connected with the positive electrode of the fourth interface, the negative input end of the power supply circuit is electrically connected with the negative electrode of the fourth interface, the control end of the power supply circuit is electrically connected with the communication control circuit, and the power supply circuit is provided with N positive output ends and can output N driving currents simultaneously;

wherein N is an integer greater than or equal to 1.

On the other hand, the utility model also discloses a LED lamp, which comprises a lamp holder and an LED lamp; the LED lamp comprises a sixth interface, a radiator, N second power supply circuits, an LED substrate and an LED chip, wherein N is an integer greater than or equal to 1;

the shell is provided with an insulating cavity;

the fifth interface is positioned at the bottom of the shell and comprises a fifth positive electrode and a fifth negative electrode which are insulated from each other;

the communication control circuit and the first power supply circuit are positioned in the cavity, the communication control circuit comprises a communication module and a control module, the first power supply circuit at least comprises an electrolytic capacitor and a rectifying circuit, the positive input end of the first power supply circuit is electrically connected with a live wire, the negative input end of the first power supply circuit is electrically connected with a zero line, the positive output end of the first power supply circuit is electrically connected with the fifth positive electrode, and the negative output end of the first power supply circuit is electrically connected with the fifth negative electrode;

the sixth interface is positioned at the top of the radiator and comprises a sixth positive electrode and a sixth negative electrode which are insulated from each other, the LED lamp can be installed on the lamp holder through the cooperation of the sixth interface and the fifth interface, after the LED lamp is installed on the lamp holder, the sixth positive electrode is electrically connected with the fifth positive electrode, and the sixth negative electrode is electrically connected with the fifth negative electrode;

the N second power supply circuits are located inside the heat sink, positive input ends of the N second power supply circuits are electrically connected with the sixth positive electrode, negative input ends of the N second power supply circuits are electrically connected with the sixth negative electrode, and the first power supply circuit and/or the N second power supply circuits are electrically connected with the communication control circuit;

the LED substrate is arranged outside the radiator, the LED substrate is provided with N input ends, one input end of the LED substrate is electrically connected with the positive output end of one second power supply circuit, when the LED substrate is provided with a plurality of input ends, different input ends of the LED substrate are electrically connected with the positive output ends of different second power supply circuits, and the output end of the LED substrate is grounded;

the LED chip is arranged on the LED substrate, the LED lamp comprises N LED chip groups, and one LED chip group comprises at least one LED chip; the input end of one LED chip group is electrically connected with one input end of the LED substrate, and the output ends of the N LED chip groups are electrically connected with the output end of the LED substrate.

On the other hand, the utility model also discloses a LED lamp, including the lamp stand and fix the LED lamp on the lamp stand, the lamp stand includes casing, communication control circuit and first power supply circuit, the LED lamp includes radiator, LED base plate, LED chip and N second power supply circuit;

the communication control circuit and the first power supply circuit are arranged in the cavity, the communication control circuit comprises a communication module and a control module, the first power supply circuit at least comprises an electrolytic capacitor and a rectifying circuit, the positive input end of the first power supply circuit is electrically connected with a live wire, and the negative input end of the first power supply circuit is electrically connected with a zero wire;

the N second power supply circuits are positioned inside the heat radiator, positive input ends of the N second power supply circuits are electrically connected with positive output ends of the first power supply circuit, negative input ends of the N second power supply circuits are electrically connected with negative output ends of the first power supply circuit, and the first power supply circuit and/or the N second power supply circuits are electrically connected with the communication control circuit;

the LED substrate is arranged at the bottom of the radiator and provided with N input ends, one input end of the LED substrate is electrically connected with the positive output end of one second power supply circuit, when the LED substrate is provided with a plurality of input ends, different input ends of the LED substrate are electrically connected with the positive output ends of different second power supply circuits, and the output end of the LED substrate is grounded;

the LED chip is arranged on the LED substrate, the LED lamp comprises N LED chip groups, and one LED chip group comprises at least one LED chip; the input end of one LED chip group is electrically connected with one input end of the LED substrate, and the output ends of the N LED chip groups are electrically connected with the output end of the LED substrate;

wherein N is an integer greater than or equal to 1.

On the other hand, the utility model also discloses a LED lamp, including casing, seventh interface, radiator, communication control circuit, first power supply circuit, N second power supply circuit, LED base plate and LED chip;

the seventh interface is positioned at the upper part of the shell and comprises a positive electrode electrically connected with the live wire and a negative electrode electrically connected with the zero wire;

the communication control circuit and the first power supply circuit are arranged in the cavity, the communication control circuit comprises a communication module and a control module, the first power supply circuit at least comprises an electrolytic capacitor and a rectifying circuit, the positive input end of the first power supply circuit is electrically connected with the positive electrode of the seventh interface, and the negative input end of the first power supply circuit is electrically connected with the negative electrode of the seventh interface;

wherein N is an integer greater than or equal to 1.

Therefore, the utility model has the advantages that:

the utility model discloses an above-mentioned lamp stand, which comprises a housin, communication control circuit, power supply circuit and first interface, wherein, first interface is located the bottom of casing, the LED lamp is installed on the lamp stand through the cooperation of self interface and first interface, and first interface can form the electricity with the LED lamp and be connected, and communication control circuit and power supply circuit are located the cavity of casing, this makes communication control circuit and power supply circuit and the radiator in the LED lamp separate, and kept away from the source of generating heat (LED chip and radiator in the LED lamp), thereby the temperature of the environment that communication control circuit and power supply circuit locate has been reduced, the rate that communication control circuit and power supply circuit are ageing because of high temperature has been delayed, especially the ageing rate of electrolytic capacitor in the power supply circuit has been delayed, and then the life of lamp stand is improved; in addition, the working performance of the communication module in the communication control circuit can be improved, and the communication module in the communication control circuit does not influence the light path of the LED chip, so that the difficulty in designing the light path of the LED lamp used in cooperation is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1-1 is a cross-sectional view of a prior art LED lamp;

FIG. 1-2 is a split cross-sectional view of the LED light fixture shown in FIG. 1-1;

fig. 2-1 is a cross-sectional view of a lamp socket according to an embodiment of the present invention;

fig. 2-2 are cross-sectional views of another disclosed lamp socket according to an embodiment of the present invention;

fig. 2-3 are cross-sectional views of another disclosed lamp socket according to an embodiment of the present invention;

fig. 2-4 are cross-sectional views of another disclosed lamp socket according to an embodiment of the present invention;

fig. 2-5 are cross-sectional views of another disclosed lamp socket according to an embodiment of the present invention;

fig. 2-6 are cross-sectional views of another disclosed lamp socket according to an embodiment of the present invention;

fig. 2-7 are cross-sectional views of another disclosed lamp socket according to an embodiment of the present invention;

fig. 2-8 to fig. 2-12 are schematic structural diagrams of a PCB according to an embodiment of the present invention;

fig. 2-13 are schematic views illustrating the installation of a PCB board in a lamp socket according to an embodiment of the present invention;

fig. 3-1 is a split sectional view of an LED lamp disclosed in the second embodiment of the present invention;

fig. 3-2 is a split sectional view of another LED lamp disclosed in the second embodiment of the present invention;

fig. 3-3 are sectional views of another LED lamp disclosed in the second embodiment of the present invention;

fig. 3-4 are sectional views of another LED lamp disclosed in the second embodiment of the present invention;

fig. 3 to 5 are sectional views of partial structures of the heat sink and the LED substrate disclosed in the second embodiment of the present invention;

fig. 3-6 are top views of an LED lamp disclosed in the second embodiment of the present invention;

fig. 3-7 are cross-sectional views of a split type street lamp disclosed in the second embodiment of the present invention;

fig. 3-8 are cross-sectional views of another split type street lamp disclosed in the second embodiment of the present invention;

fig. 3 to 9 are sectional views of a split type desk lamp disclosed in the second embodiment of the present invention;

fig. 4-1 is a cross-sectional view of an LED lamp disclosed in the third embodiment of the present invention;

fig. 4-2 is a cross-sectional view of another LED lamp disclosed in the third embodiment of the present invention;

FIG. 4-3 is an enlarged view of a portion of FIG. 4-2;

fig. 4-4 are cross-sectional views of another LED lamp disclosed in the third embodiment of the present invention;

fig. 4-5 are cross-sectional views of another LED lamp disclosed in the third embodiment of the present invention;

fig. 4-6 are cross-sectional views of an integrated street lamp disclosed in the third embodiment of the present invention;

fig. 4-7 are cross-sectional views of another integrated street light fixture disclosed in the third embodiment of the present invention;

fig. 4-8 are cross-sectional views of an integrated ceiling lamp disclosed in the third embodiment of the present invention;

FIGS. 4-9 are top views of FIGS. 4-8;

fig. 4-10 are cross-sectional views of another integrated ceiling lamp disclosed in the third embodiment of the present invention;

FIGS. 4-11 are top views of FIGS. 4-10;

fig. 4-12 are cross-sectional views of an integrated desk lamp disclosed in a third embodiment of the present invention;

fig. 4-13 are cross-sectional views of an integrated down lamp disclosed in a third embodiment of the present invention;

fig. 5-1 is a cross-sectional view of an LED lamp according to a fourth embodiment of the present invention;

fig. 5-2 is a cross-sectional view of another LED lamp disclosed in the fourth embodiment of the present invention;

5-3 are cross-sectional views of another LED lamp disclosed in the fourth embodiment of the present invention;

fig. 6-1 is a cross-sectional view of an LED lamp disclosed in the fifth embodiment of the present invention;

fig. 6-2 is a schematic structural diagram of a fifth interface disclosed in the fifth embodiment;

fig. 7 is a sectional view of a LED lamp according to a sixth embodiment of the present invention;

fig. 8 is a cross-sectional view of a LED lamp disclosed by the seventh embodiment of the present invention.

Wherein, 01 is a lamp holder, 02 is an LED lamp, 021 is a radiator, 022 is a control communication board, 023 is a power supply board, 024 is a substrate, 025 is an LED chip, 0221 is an antenna, 026 is an electrolytic capacitor;

11 is a shell, 12 is a communication control circuit, 13 is a power circuit, 141 is a female screw, 1411 is a wiring terminal, 142 is a female bayonet, 1421 and 1423 are wiring terminals, 1422 is a positioning hole, 15 is an insulating sheet, 1201 is a PCB antenna, 1202 is a metal wire antenna, 1203 is a ceramic antenna, 1204 is a metal spiral antenna, 131 is an electrolytic capacitor, 132 is a transformer, 133 is a wiring terminal, 134 is a ground copper foil, 1341 is a ground via hole, 135 is a fixing hole, 136 is a groove, 161 is a male screw, 1611 is a metal contact at the top of the male screw 161, 17 is a card slot, and 14 is a first interface;

21 is a radiator, 22 is an LED substrate, 221 is a metal sheet, 222 is a dielectric layer, 223 is a conductive layer, 23 is an LED chip, 241 is a male screw, 2411 is a metal contact at the top of the male screw 241, 242 is a male bayonet, 2421 and 2423 are metal contacts at the top of the male bayonet 242, 2422 is a metal rod, 25 is a screw, 26 is a lampshade, and 24 is a third interface;

31 is a shell, 32 is a communication control circuit, 321 is an antenna, 33 is a power circuit, 34 is a heat radiator, 35 is an LED substrate, 36 is an LED chip, 371 is an elastic sheet, 372 is a grounding bonding pad, 38 is a screw, 39 is a lampshade, 310 is an insulating sheet, 333 is a PCB (printed circuit board), 382 is a screw, 326 is an electrolytic capacitor, 327 is a pin header, 3221 is an infrared transmitting tube, 3222 is an infrared receiving tube, and 3223 is plastic which can penetrate infrared rays; 355 is a spring clip;

41 is a shell, 42 is a communication control circuit, 43 is a power circuit, 44 is a radiator, 45 is an LED substrate, 46 is an LED chip, 421 is an antenna, 471 is a male screw, 4711 is a metal contact at the top of the male screw 471, 472 is a male bayonet, 4721 is a metal contact at the top of the male bayonet 472, 4722 is a metal rod on the shell of the male bayonet 472, 48 is a screw, 491 is an external thread, 492 is an internal thread, 493 is a screw, 494 is a grounding pad, 495 is a conductive component, and 410 is a lampshade;

51 is a shell, 52 is a communication control circuit, 521 is an antenna, 53 is a first power circuit, 531 is an electrolytic capacitor, 54 is a fifth interface, 541 electrodes, 542 are positioning grooves, 55 is a sixth interface, 551 is electrodes, 552 is a positioning column, 553 is a foolproof buckle, 56 is a radiator, 57 is a second power circuit, 58 is an LED substrate, and 59 is an LED chip;

61 is a shell, 62 is a communication control circuit, 621 is an antenna, 63 is a first power supply circuit, 631 is an electrolytic capacitor, 64 is a heat sink, 65 is an LED substrate, 66 is an LED chip, 67 is a second power supply circuit, 68 is a screw, 69 is an insulating sheet, and 610 is a lampshade;

71 is a housing, 72 is a seventh interface, 721 is a metal rod, 722 is a metal contact, 73 is a heat sink, 74 is a communication control circuit, 741 is an antenna, 75 is a first power supply circuit, 751 is an electrolytic capacitor, 76 is a second power supply circuit, 77 is an LED substrate, 78 is an LED chip, 79 is a screw, 710 is a screw, and 711 is a lamp cover.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example one

Referring to fig. 2-1 and 2-2, fig. 2-1 is a cross-sectional view of a lamp socket disclosed in an embodiment of the present invention, and fig. 2-2 is a cross-sectional view of another lamp socket disclosed in an embodiment of the present invention. The lamp socket shown in fig. 2-1 and 2-2 is used for mounting an LED lamp, and includes a housing 11, a communication control circuit 12, a power supply circuit 13, and a first interface.

Wherein:

the housing 11 has an insulated cavity. In practice, the housing 11 may be a closed structure. In addition, the housing 11 may be provided with: the bottom of the housing 11 is closed at the position where the first port is combined. At this time, no gap can be left at the position where the power line (or screw) passes through the housing 11, a hole can be drilled in the housing 11, the hole diameter is matched with the diameter of the power line (or screw), and after the power line (or screw) passes through the housing 11, the gap between the hole wall and the power line (or screw) is filled, so that the position where the bottom of the housing 11 is combined with the first interface is ensured to be in a closed state. Of course, it is also possible that the gap between the hole wall and the power supply line (or screw) is not filled.

The communication control circuit 12 and the power supply circuit 13 are disposed in the cavity. Specifically, the communication control circuit 12 includes a communication module and a control module. The positive input end of the power circuit 13 is electrically connected with the live wire, the negative input end of the power circuit 13 is electrically connected with the zero line, the control end of the power circuit 13 is electrically connected with the communication control circuit 12, the power circuit 13 has N positive output ends and can simultaneously output N driving currents, wherein N is an integer greater than or equal to 1, and the negative output end of the power circuit 13 is grounded. The communication control circuit 12 receives the control signal and controls the operation of the power circuit 13 according to the control signal, and the power circuit 13 responds to the control of the communication control circuit 12 to convert the commercial power into a driving power supply matched with the LED lamp. The power supply circuit 13 includes an electrolytic capacitor 131.

The first interface is located the bottom of casing, and first interface has first negative electrode and the N first positive electrode of mutual insulation, and the negative output of power supply circuit 13 is connected with first negative electrode electricity, and the N positive output of power supply circuit 13 is connected with the one-to-one of the N first positive electrodes electricity to N first positive electrodes can contact with the second positive electrode at LED lamp top. That is, the number of the first positive electrodes in the first interface is the same as the number of the positive output terminals in the power circuit 13, one first positive electrode in the first interface is electrically connected to one positive output terminal in the power circuit 13, and different first positive electrodes in the first interface are electrically connected to different positive output terminals in the power circuit 13, which are in a one-to-one correspondence relationship.

In the lamp socket shown in fig. 2-1 and 2-2, the first interface is the female screw 141, the first positive electrode is the connection terminal 1411 located inside the female screw 141, and the first negative electrode is the metal shell of the female screw. The connecting terminal 1411 inside the female screw may be a thimble or a spring.

In an implementation, when the first interface is a female screw, the first negative electrode may also be a terminal located inside the female screw, that is, N +1 terminals are disposed inside the female screw, one of the terminals is electrically connected to the negative output terminal of the power circuit 13 and serves as a first negative electrode, and the other N terminals are electrically connected to the N positive output terminals of the power circuit 13 in a one-to-one correspondence manner and serve as N first positive electrodes. Of course, the first interface is not limited to the female screw in the implementation process, and various interface structures in the lighting field of all countries in the world can be adopted, and the following description will be given with reference to the accompanying drawings.

It should be noted here that the housing in the lamp socket may be configured as follows: the length of the housing 11 in the horizontal direction is greater than the length of the housing 11 in the vertical direction, as shown in fig. 2-1; alternatively, the length of the housing 11 in the horizontal direction is smaller than the length of the housing 11 in the vertical direction, as shown in fig. 2-2. When the housing 11 has the structure shown in fig. 2-1, the lamp holder can be directly fixed on a wall or a roof, and when the housing 11 has the structure shown in fig. 2-2, the lamp holder can be suspended in the middle of the air by connecting the lamp holder with a power line.

The utility model discloses an above-mentioned lamp stand, which comprises a housin, communication control circuit, power supply circuit and first interface, wherein, first interface is located the bottom of casing, the LED lamp is installed on the lamp stand through the cooperation of self interface and first interface, and first interface can form the electricity with the LED lamp and be connected, and communication control circuit and power supply circuit are located the cavity of casing, this makes communication control circuit and power supply circuit and the radiator in the LED lamp separate, and kept away from the source of generating heat (LED chip and radiator in the LED lamp), thereby the temperature of the environment that communication control circuit and power supply circuit locate has been reduced, the rate that communication control circuit and power supply circuit are ageing because of high temperature has been delayed, especially the ageing rate of electrolytic capacitor in the power supply circuit has been delayed, and then the life of lamp stand is improved; in addition, the working performance of the communication module in the communication control circuit can be improved, and the communication module in the communication control circuit cannot influence the light path of the LED chip, so that the difficulty in designing the light path of the LED lamp is reduced.

Preferably, the first negative electrode in the first interface is electrically connected with the heat sink in the LED lamp, so that the heat sink is grounded. After the radiator in the LED lamp is grounded, the radiator in the LED lamp and the LED substrate form a grounded shielding cavity, so that various radiation possibly generated on a power line and the LED substrate can be shielded, and the electromagnetic compatibility of the LED lamp is improved.

In implementation, the first interface of the lamp holder can also adopt various interface structures in the lighting field of all countries around the world. This is explained below with reference to fig. 2-3 and 2-4. Fig. 2-3 are schematic structural diagrams of another lamp socket disclosed in the first embodiment of the present invention, and fig. 2-4 are schematic structural diagrams of another lamp socket disclosed in the first embodiment of the present invention.

The first interface is a female bayonet 142, a metal shell of the female bayonet 142 is provided with a positioning hole 1422, the LED lamp is provided with a corresponding auxiliary component, and the LED lamp is mounted on the lamp holder through the matching of the auxiliary component and the positioning hole 1422. The first positive electrode is a connection terminal 1421 located inside the female socket 142, and the first negative electrode is a metal housing of the female socket 142.

In implementation, when the first interface is a female card port, the first negative electrode may also be a connection terminal located inside the female card port, that is, N +1 connection terminals are disposed inside the female card port, one of the connection terminals is electrically connected to the negative output terminal of the power circuit 13 and serves as the first negative electrode, and the other N connection terminals are electrically connected to the N positive output terminals of the power circuit 13 in a one-to-one correspondence and serve as the N first positive electrodes. The wiring terminal at the inner side of the female bayonet can be a thimble or a spring sheet. Of course, the metal shell of the female card port as the first interface is provided with a positioning hole.

In the above-described lamp socket shown in fig. 2-1 to 2-4, the power supply circuit 13 has 1 positive output terminal, and the first positive electrode in the first interface is one. Correspondingly, only one third positive electrode is arranged in the LED lamp matched with the lamp holder, after the LED lamp is installed on the lamp holder, the third positive electrode in the LED lamp is electrically connected with the first positive electrode in the lamp holder, so that all LED chips in the LED lamp are electrically connected with the same positive output end of the power circuit 13, and a user can perform on-off control and brightness adjustment on the LED lamp through the control device.

In an implementation, the number of the first positive electrodes in the first interface may be 2 or 3. The following description will be made by taking fig. 2 to 5 and fig. 2 to 6 as examples.

In the lamp holder shown in fig. 2-5, the power supply circuit 13 has 3 positive output terminals. The first interface in the lamp holder is a female screw 141, on the inside of which female screw 141 3 connection terminals (indicated with R, G and B in fig. 2-5) are provided, which 3 connection terminals are 3 first positive electrodes. The 3 wiring terminals located inside the female screw 141 are electrically connected with the 3 positive output terminals of the power circuit 13 in a one-to-one correspondence manner, and the negative output terminal of the power circuit 13 is electrically connected with the metal shell of the female screw 141.

The lamp holder shown in fig. 2-5 can be used with a tri-phosphor LED lamp. Specifically, the method comprises the following steps:

the three primary color LED lamp includes a red LED chip, a green LED chip, and a blue LED chip, and is provided with 3 third positive electrodes. After the three-primary-color LED lamp is mounted on the lamp holder shown in fig. 2-5, 3 third positive electrodes of the three-primary-color LED lamp are in one-to-one contact with 3 first positive electrodes (i.e., three connection terminals indicated by R, G and B) of the lamp holder, so that the red LED chip of the three-primary-color LED lamp is electrically connected to the first positive output terminal of the power circuit 13, the green LED chip of the three-primary-color LED lamp is electrically connected to the second positive output terminal of the power circuit 13, and the blue LED chip of the three-primary-color LED lamp is electrically connected to the third positive output terminal of the power circuit 13. A user can perform on-off control, brightness adjustment and color adjustment on the tricolor LED lamp through the control device.

In the lamp holder shown in fig. 2-6, the power supply circuit 13 has 2 positive output terminals. The first interface in the lamp holder is a female screw 141, inside which female screw 141 3 connection terminals (indicated with A, B and GND in fig. 2-6) are provided. Wherein, the wiring terminals marked with A and B are 2 first positive electrodes which are electrically connected with 2 positive output ends of the power circuit 13 in a one-to-one correspondence manner; the terminal marked by GND is a first negative electrode and is electrically connected with the negative output end of the power circuit 13.

The lamp holder shown in fig. 2-6 can be used with a cold-warm two-color LED lamp. Specifically, the method comprises the following steps:

the cold and warm two-color LED lamp comprises a cold color LED chip and a warm color LED chip, and is provided with 2 third positive electrodes and 1 third negative electrode. After the cold-warm two-color LED lamp is mounted on the lamp holder shown in fig. 2-6, the third negative electrode in the cold-warm two-color LED lamp contacts with the first negative electrode in the lamp holder (i.e. the connection terminal marked with GND), and the 2 third positive electrodes in the cold-warm two-color LED lamp contact with the 2 first positive electrodes in the lamp holder (i.e. the 2 connection terminals marked with a and B) in a one-to-one correspondence manner, so that the cold-color LED chip in the cold-warm two-color LED lamp is electrically connected with one positive output terminal of the power circuit 13, and the warm-color LED chip in the cold-warm two-color LED lamp is electrically connected with the other positive output terminal of the power circuit 13. A user can carry out on-off control, brightness adjustment and color temperature adjustment on the cold and warm two-color LED lamp through the control device.

The embodiment of the utility model provides an in the above-mentioned disclosed lamp stand, communication control circuit 12 and power supply circuit 13 can set up on same PCB board, and its advantage lies in: the workpiece beating and welding can be completed at one time, so that the workpiece beating and welding cost of the PCB can be saved, and meanwhile, the processing time can be shortened. In practice, the PCB may be horizontally disposed (as shown in fig. 2-1, 2-3, 2-5, and 2-6), vertically disposed (as shown in fig. 2-2 and 2-4), or, of course, obliquely disposed.

In addition, the communication control circuit 12 and the power supply circuit 13 may be disposed on different PCBs, as shown in fig. 2-2 and 2-4, specifically: the communication control circuit 12 is provided on a first PCB, and the power supply circuit 13 is provided on a second PCB. Since the circuit of the power circuit 13 is relatively simple, the power circuit 13 may be disposed on a single-sided PCB, and a CEM-1 board or a CEM-3 board may be used. Because the communication control circuit 12 has many devices and complicated routing, the communication control circuit 12 may be disposed on a double-sided PCB or a multi-layer PCB, and an FR4 board may be used. In practice, the electrical connection between the communication control circuit 12 and the power supply circuit 13 may be implemented using cables or pin headers.

Because the power circuit 13 contains a high-voltage device, strong pulse interference can be generated, and the communication control circuit 12 belongs to a sensitive weak circuit, in order to ensure stable operation of the communication control circuit 12, the interference on the communication control circuit 12 is reduced as much as possible. In the case where the communication control circuit 12 and the power supply circuit 13 are respectively disposed on different PCBs, as a preferred embodiment, the distance between the first PCB and the second PCB is set to be greater than a preset distance, and the interference received by the communication control circuit 12 is reduced by increasing the distance between the communication control circuit 12 and the power supply circuit 13. The reason for increasing the distance between the power supply circuit 13 and the communication control circuit 12 is to prevent a high voltage in the power supply circuit from breaking down the communication control circuit 12.

In addition, in the lamp socket disclosed in the first embodiment of the present invention, an insulating sheet may be further disposed, and the insulating sheet is located inside the housing 11 and located on the upper side of the communication control circuit 12 and the power circuit 13. The electrical apparatus isolation performance of the lamp holder can be improved by arranging the insulation sheet in the lamp holder. Especially, in the case of the lamp socket shown in fig. 2-1, 2-3, 2-5 and 2-6, which can be directly fixed to a wall or a roof, the insulating sheet can prevent electrical leakage or electrical breakdown between the electronic components and the wall or the roof, thereby preventing fire or electric shock. The insulating sheet 15 is shown in fig. 2-1, 2-3, 2-5 and 2-6. In practice, the insulating sheet can be made of plastic sheet or plastic sheet.

As a preferred implementation manner, on the basis of the lamp socket disclosed in the first embodiment of the present invention, a second interface may be further disposed at the top of the housing 11, and the second interface includes a second positive electrode and a second negative electrode, wherein the positive input end of the power circuit 13 is electrically connected to the second positive electrode, and the negative input end of the power circuit 13 is electrically connected to the second negative electrode. In addition, the second interface is adaptive to the existing lamp holder, a second positive electrode in the second interface can be electrically connected with the live wire through the lamp holder adaptive to the second interface, and a second negative electrode in the second interface can be electrically connected with the zero wire through the lamp holder adaptive to the second interface. That is to say, the utility model discloses a lamp stand with second interface can use with current lamp stand cooperation, and the user only need with the utility model discloses a lamp stand install on current lamp stand can, and need not improve current circuit.

One configuration of the second interface is described below in conjunction with fig. 2-7.

The second interface is a male screw 161, a metal contact 1611 is disposed at the top of the male screw 161, the metal contact 1611 serves as a second positive electrode of the second interface, and a metal shell of the male screw 161 serves as a second negative electrode of the second interface. The positive input of power circuit 13 is electrically connected to metal contact 1611, and the negative input of power circuit 13 is electrically connected to the metal shell of male luer 161.

The lamp holder matched with the second interface comprises a female screw, an elastic sheet or a thimble electrically connected with the live wire is arranged on the inner side of the female screw, and a metal shell of the female screw is electrically connected with the zero line. After the second interface of the lamp holder shown in fig. 2-7 is inserted into the female screw of the adapted lamp holder, the metal contact 1611 of the male screw 161 is electrically connected to the hot wire, and the metal shell of the male screw 161 is electrically connected to the neutral wire.

In practice, the second interface may also be other structures, such as various interface structures in the world lighting field.

For example: the second interface adopts a male screw, and two metal contacts are arranged at the top of the male screw, wherein one metal contact is used as a second positive electrode, and the other metal contact is used as a second negative electrode. The lamp holder matched with the second interface comprises a female screw, and the inner side of the female screw is respectively provided with an elastic sheet or an ejector pin electrically connected with the live wire and an elastic sheet or an ejector pin electrically connected with the zero wire.

For example: the second interface adopts a male bayonet, two metal contacts are arranged at the top of the male bayonet, one metal contact is used as a second positive electrode, and the other metal contact is used as a second negative electrode. The lamp holder matched with the second interface comprises a female bayonet, and the inner side of the female bayonet is respectively provided with an elastic sheet or an ejector pin electrically connected with the live wire and an elastic sheet or an ejector pin electrically connected with the zero wire.

The embodiment of the utility model provides an in above-mentioned each lamp stand of disclosing, communication module can be wireless radio frequency module, infrared ray receiving module or infrared ray transceiver module. When the communication module adopts the infrared receiving module, a user can control the LED lamp through the control device. When the communication module adopts the wireless radio frequency module or the infrared ray transceiving module, the communication module is also used for receiving the feedback information generated by the control module and sending the feedback information to the outside, namely, a user can control the operation of the LED lamp through the control device and can also know the operation state information of the LED lamp.

In an implementation, the antenna in the radio frequency module may be a PCB antenna, a metal wire antenna, a ceramic antenna, a metal spiral antenna, a PIFA (PIFA) antenna, an IFA (inverted F) antenna, a yagi antenna, a loop antenna, or a plated antenna. The antenna needs to be kept away from other components of the communication control circuit 12, including metal fasteners such as screws, and especially from the power supply circuit 13, to prevent the performance of the antenna from being affected.

Please refer to the PCB board structure shown in fig. 2-8 to fig. 2-12. The communication control circuit 12 and the power supply circuit 13 may be provided on one PCB or may be provided on two PCBs. The antenna in fig. 2-8 and 2-9 is a PCB antenna 1201, the antenna in fig. 2-10 is a metal wire antenna 1202, the antenna in fig. 2-11 is a ceramic antenna 1203, and the antenna in fig. 2-12 is 1204.

When the metal wire antenna is used, the length of the metal wire antenna needs to meet the wavelength requirement of the antenna (generally, 1/4 wavelength is met), and the occupied space is large, so the metal wire antenna needs to be installed in the open area between the PCB board and the housing 11. In order to prevent the metal wire antenna from short circuit caused by collision with other elements, a layer of insulating plastic can be arranged on the surface layer of the metal wire.

A ceramic antenna is a particularly compact antenna. The ceramic antenna may be classified into a block ceramic antenna and a multilayer ceramic antenna. The massive ceramic antenna is formed by printing a metal part of the antenna on the surface of a ceramic block after a monolithic ceramic body is sintered once; the multilayer ceramic antenna is formed by laminating, aligning and sintering the multilayer ceramic in a low temperature co-firing (LTTC) mode, so that a metal conductor of the antenna can be printed on each layer of ceramic dielectric layer according to design requirements, the size required by the antenna can be effectively reduced, and the purpose of hiding the design layout of the antenna can be achieved.

The ceramic antenna is characterized in that: a patch ceramic antenna is welded on the PCB, and the assembly and welding procedures are simple. Compared with a PCB antenna and a metal wire antenna, the ceramic antenna has smaller volume and occupies smaller space of the PCB. The design requirements of the ceramic antenna are as follows: the lower edge of the antenna feed point cannot be coated with copper; the distance between the grounding point around the antenna feed point and the antenna is more than 5 mm; it is preferable to make ground holes in the ground points around the ceramic antenna to ensure the integrity of the ground.

The metal spiral antenna is characterized in that: because the length of the metal wire is obviously shortened after the metal wire is processed by the spiral processing, the occupied space of the metal wire antenna is much smaller than that of the metal wire antenna. Metal helical antennas are relatively complex to assemble and weld. The metal spiral antenna may be installed above the PCB board or may be installed in a gap between the PCB board and the case 11. Preferably, the metal helical antenna is installed in a gap between the PCB board and the case 11.

In practice, one end of the metal spiral antenna may be soldered to the PCB board. In the installation process, if the installation direction of the metal spiral antenna is inconsistent, the direction and the gain of the metal spiral antenna can be changed, for example, the sensitivity of a received signal is inconsistent with that of a transmitted signal. In addition, since the metal spiral antenna is obtained by spirally processing the metal wire, it is similar to a spring and has a certain elasticity. In the use, metal spiral antenna can take place the swing, leads to the distribution parameter, the direction and the gain of antenna to change, still can lead to metal spiral antenna to appear becoming flexible, the phenomenon of droing even. Therefore, in implementation, it is preferable to fix both ends of the metal spiral antenna. Specifically, two ends of the metal spiral antenna are inserted into the PCB for welding and fixing. As long as install original design parameter and come the both ends of fixed metal spiral antenna, just can confirm that the parameter of metal spiral antenna keeps unanimous basically in production and use, also difficult emergence is become flexible moreover and the phenomenon that drops, reduction metal spiral antenna that can be very big breaks down probability.

The PIFA antenna is a planar antenna evolved from an inverted F antenna, the application frequency range of the PIFA antenna is 800 MHz-900 MHz, 1800MHz and 2.4GHz, and the PIFA antenna meets the requirements of Z-Wave (800MHz), Zigbee (2.4GHz), Wifi (2.4GHz) and Bluetooth (2.4GHz) on the frequency range. PIFA antennas are classified into a single-point feeding mode and a double-point feeding mode. The PIFA antenna may be made of copper sheet adhered to the inner wall of the housing 11, and electrically connected to the PCB through a metal pin or a metal spring. The PIFA antenna and the plastic shell may also be integrated into a single body and mounted in the gap between the housing 11 and the PCB, and the PIFA antenna is electrically connected to the PCB through a metal thimble or a metal spring.

The antenna (such as PIFA antenna) pattern is plated on the inner wall of the housing 11 by LDS (laser direct structuring) method to form a plated antenna. The method has the advantages of high processing speed and lower cost. In practice, the antenna needs to be plated on the inner wall of the housing 11, but cannot be plated on the outer wall of the housing 11, because: 1. electroplating the antenna on the outer wall of the shell 11 to influence the appearance of the product; 2. the antenna is plated on the outer wall of the shell 11 and is easy to damage; 3. the antenna plated on the inner wall of the shell 11 is convenient for electrical connection with the PCB; 4. the provision of an internal wall in the housing 11 facilitates safe isolation if the antenna is to be subjected to high voltage.

When the PCB layout is carried out, the circuit is ensured to be fully grounded, and the influence of parasitic capacitance is reduced. The PCB layout of the power circuit 13 follows the following rules: the transformer 132 is used as a center, the input capacitor 131 and the power chip are close to the primary winding of the transformer 132 as much as possible, copper-clad wiring is required, the wiring is as short and thick as possible, the loop area is reduced, and power supply noise and radiation increase caused by overlarge loop area are prevented.

In practice, the PCB board may be fixed in the following manner: at least one clamping groove is formed in the inner wall of the shell 11, and the PCB is fixed through the clamping groove. As shown in fig. 2 to 13, the inner wall of the housing 11 is provided with 4 slots 17, and the two PCBs are fixed by the two slots 17. The locking groove 17 may be formed in one step by an injection molding process during the process of manufacturing the housing 11.

Additionally, the embodiment of the utility model provides a lamp stand that discloses can be ceiling lamp stand, desk lamp stand, shot-light lamp stand and street lamp stand. The specific structures of the desk lamp holder and the street lamp holder can be referred to the related descriptions of fig. 3-7, 3-8 and 3-9 in the second embodiment. In the second embodiment, fig. 3 to 7 are sectional views of a split type street lamp, fig. 3 to 8 are sectional views of another split type street lamp, and fig. 3 to 9 are sectional views of a split type desk lamp.

Example two

Referring to fig. 3-1 and 3-2, fig. 3-1 is a sectional view of a LED lamp disclosed in embodiment two of the present invention, and fig. 3-2 is a sectional view of another LED lamp disclosed in embodiment two of the present invention. The LED lamp comprises a lamp holder and an LED lamp, wherein the lamp holder comprises a shell 11, a communication control circuit 12, a power supply circuit 13 and a first interface, and the LED lamp comprises a radiator 21, a third interface, an LED substrate 22 and an LED chip 23.

The communication control circuit 12 and the power supply circuit 13 are disposed in the cavity. Specifically, the communication control circuit 12 includes a communication module and a control module. The positive input end of the power circuit 13 is electrically connected with the live wire, the negative input end of the power circuit 13 is electrically connected with the zero line, the control end of the power circuit 13 is electrically connected with the communication control circuit 12, the power circuit 13 has N positive output ends and can simultaneously output N driving currents, wherein N is an integer greater than or equal to 1, and the negative output end of the power circuit 13 is grounded. The communication control circuit 12 receives the control signal and controls the operation of the power circuit 13 according to the control signal, and the power circuit 13 responds to the control of the communication control circuit 12 to convert the commercial power into a driving power supply matched with the LED lamp. In implementation, the positions of the communication control circuit 12 and the power supply circuit 13 in the cavity are adjusted so that the communication control circuit 12 and the power supply circuit 13 are as far away from the heat sink 21 as possible in the vertical direction. The power supply circuit 13 includes an electrolytic capacitor 131.

The third interface sets up in the top of radiator 21, and the third interface includes third negative electrode and the third positive electrode of N that mutual insulation, can install the LED lamp on the lamp stand through the cooperation of third interface and first interface in the lamp stand, and after installing the LED lamp on the lamp stand, N third positive electrode can be connected with N first positive electrode one-to-one in the lamp stand.

The LED substrate 22 is disposed at the bottom of the heat sink 21, the LED substrate 22 has N input terminals, one input terminal of the LED substrate 22 is electrically connected to one third positive electrode in the third interface, and when the LED substrate 22 has a plurality of input terminals, different input terminals of the LED substrate 22 are electrically connected to different third positive electrodes in the third interface, and an output terminal of the LED substrate is grounded.

The LED chip 23 is installed on the LED substrate 22, the LED lamp 23 comprises N LED chip groups, one LED chip group comprises at least one LED chip, the input end of one LED chip group is electrically connected with one input end of the LED substrate 22, and the output ends of the N LED chip groups are electrically connected with the output end of the LED substrate 22. Here, when the LED chip set includes a plurality of LED chips, the plurality of LED chips may be in a series relationship, a parallel relationship, or a mixed relationship of series and parallel.

The heat generated by the LED chip 23 is transferred to the heat sink 21 through the LED substrate 22, and then dissipated to the outside air by convection and radiation through the surface of the heat sink 21. Because the communication control circuit 12 and the power supply circuit 13 are disposed in the cavity of the housing 11, the space where the communication control circuit 12 and the power supply circuit 13 are located is separated from the space where the heat sink 21 is located, and the housing 11 is made of an insulating material and is not favorable for heat conduction, so that heat on the heat sink 21 is hardly conducted to the inside of the housing 11, and the temperature of the environment where the communication control circuit 12 and the power supply circuit 13 are located is reduced.

In the LED lamp shown in fig. 3-1, the first interface of the lamp holder is a female screw 141, the first positive electrode of the first interface is a connection terminal 1411 located inside the female screw 141, and the first negative electrode of the first interface is a metal shell of the female screw. The terminal inside the female screw 141 may be a thimble or a spring. The third interface of the LED lamp is a male screw 241 matched with the female screw 141, a third positive electrode of the third interface is a metal contact 2411 located at the top of the male screw 241, and a third negative electrode of the third interface is a metal shell of the male screw 241.

In an implementation, when the first interface is a female screw, the first negative electrode of the first interface may also be a terminal located inside the female screw, that is, N +1 terminals are disposed inside the female screw, one of the terminals is electrically connected to the negative output terminal of the power circuit 13 and serves as the first negative electrode, and the other N terminals are electrically connected to the N positive output terminals of the power circuit 13 in a one-to-one correspondence and serve as the N first positive electrodes. The wiring terminal on the inner side of the female screw can be a thimble or a spring sheet. Correspondingly, the third interface of the LED lamp is a male screw adapted to the female screw, the third positive electrode of the third interface is a metal contact located at the top of the male screw, and the third negative electrode of the third interface is a metal contact located at the top of the male screw, that is, N +1 metal contacts are disposed at the top of the male screw, one of the metal contacts is a third negative electrode, and the other N metal contacts are N third positive electrodes.

Of course, the first interface and the third interface are not limited to the female screw and the male screw in the implementation process, and various interface structures in the lighting field of all countries in the world can be adopted. Which will be described later with reference to the accompanying drawings.

The utility model discloses above-mentioned LED lamps and lanterns that disclose include lamp stand and LED lamp, and the lamp stand includes casing, communication control circuit, power supply circuit and first interface, and the LED lamp includes third interface, radiator, LED base plate and LED chip. The first interface is positioned at the bottom of the shell, the LED lamp is arranged on the lamp holder through the matching of the third interface and the first interface, the first interface can be electrically connected with the LED lamp, and the communication control circuit and the power circuit are positioned in the cavity of the shell, so that the communication control circuit and the power circuit are separated from the radiator and are far away from a heating source (an LED chip and the radiator in the LED lamp), the temperature of the environment where the communication control circuit and the power circuit are positioned is reduced, the aging rate of the communication control circuit and the power circuit due to high temperature is delayed, particularly the aging rate of an electrolytic capacitor in the power circuit is delayed, and the service life of the lamp holder is prolonged; in addition, the working performance of the communication module in the communication control circuit can be improved, and the communication module in the communication control circuit does not influence the light path of the LED chip, so that the difficulty in designing the light path of the LED lamp used in cooperation is reduced.

In implementation, the first interface of the lamp holder and the third interface of the LED lamp can also adopt various interface structures in the lighting field of all countries around the world.

Fig. 3-3 are sectional views of another LED lamp according to the second embodiment of the present invention. The first interface is the female bayonet 142, a positioning hole 1422 is disposed on a metal housing of the female bayonet 142, a first positive electrode of the first interface is a connection terminal 1421 located inside the female bayonet 142, and a first negative electrode of the first interface is a metal housing of the female bayonet 142. The connecting terminal 1421 may be a thimble or a spring. The third interface is a male bayonet 242 matched with the female bayonet 142, a metal shell of the male bayonet 242 is provided with at least one metal rod 2422, the metal rod 2422 can enter the positioning hole 1422 to fix the male bayonet 242 in the female bayonet 142, a third positive electrode of the third interface is a metal contact 2421 located at the top of the male bayonet 242, and a third negative electrode of the third interface is a metal shell of the male bayonet 242.

It should be noted here that the metal bar 2422 may only function as a positioning element. In practice, the metal rod 2422 may also be electrically connected to the female bayonet 142.

In an implementation, when the first interface is a female card port, the first positive electrode is a connection terminal located inside the female card port, and the first negative electrode may also be a connection terminal located inside the female card port, that is, N +1 connection terminals are disposed inside the female card port, one of the connection terminals is electrically connected to the negative output terminal of the power circuit 13 to serve as the first negative electrode, and the other N connection terminals are electrically connected to the N positive output terminals of the power circuit 13 in a one-to-one correspondence manner to serve as the N first positive electrodes. The wiring terminal positioned on the inner side of the female bayonet can be a thimble or a spring sheet. Of course, the metal shell of the female bayonet is provided with a positioning hole. Correspondingly, the third interface is the public bayonet socket with the female bayonet socket adaptation as first interface, and the metal casing of public bayonet socket is provided with at least one metal rod to in the metal rod can get into the locating hole of female bayonet socket, fix public bayonet socket in female bayonet socket, the third positive electrode of third interface is for being located the metal contact at public bayonet socket top, the third negative electrode of third interface is for being located the metal contact at public bayonet socket top. As described herein in connection with fig. 3-4.

Fig. 3-4 are sectional views of another LED lamp according to the second embodiment of the present invention. The first interface is the female bayonet 142, and a metal shell of the female bayonet 142 is provided with a positioning hole 1422, a first positive electrode of the first interface is a connection terminal 1421 located inside the female bayonet 142, and a first negative electrode of the first interface is a connection terminal 1423 located inside the female bayonet 142. The third interface is a male bayonet 242 matched with female bayonet 142, a metal shell of male bayonet 242 is provided with at least one metal rod 2422, metal rod 2422 can enter positioning hole 1422 to fix male bayonet 242 in female bayonet 142, a third positive electrode of the third interface is a metal contact 2421 located at the top of male bayonet 242, and a third negative electrode of the third interface is a metal contact 2423 located at the top of male bayonet 242.

The embodiment of the utility model provides an in the above-mentioned LED lamps and lanterns that disclose of second, power supply circuit 13 has 1 positive output, first positive electrode in the first interface is one, also only set up a third positive electrode in the LED lamp that uses with this lamp stand cooperation, after installing the LED lamp on the lamp stand, third positive electrode in the LED lamp forms the electricity with the first positive electrode in the lamp stand to be connected, make whole LED chips in the LED lamp all be connected with power supply circuit 13's same positive output electricity, the user can carry out on-off control and adjustting of the lighteness to the LED lamp through controlling means.

In an implementation, the number of the first positive electrodes in the first interface may also be 2, as shown in fig. 2 to 6, and correspondingly, the number of the third positive electrodes in the third interface is also 2. The number of the first positive electrodes in the first interface may also be 3, as shown in fig. 2 to 5, and correspondingly, the number of the third positive electrodes in the third interface is also 3.

the tricolor LED lamp comprises a red LED chip, a green LED chip and a blue LED chip, wherein the red LED chip forms an LED chip group, the green LED chip forms an LED chip group, and the blue LED chip forms an LED chip group. In addition, the LED substrate in the three primary color LED lamp includes 3 input terminals, and the three primary color LED lamp is provided with 3 third positive electrodes and 1 third negative electrode. The input end of one LED chip group is electrically connected with one input end of the LED substrate, and one input end of the LED substrate is electrically connected with one third positive electrode in the third interface. That is, 3 LED chip groups, 3 input terminals of the LED substrate, and 3 third positive electrodes in the third interface are electrically connected in a one-to-one correspondence.

After the three-primary-color LED lamp is mounted on the lamp holder shown in fig. 2-5, 3 third positive electrodes of the three-primary-color LED lamp are in one-to-one contact with 3 first positive electrodes (i.e., three connection terminals indicated by R, G and B) of the lamp holder, so that the red LED chip of the three-primary-color LED lamp is electrically connected to the first positive output terminal of the power circuit 13, the green LED chip of the three-primary-color LED lamp is electrically connected to the second positive output terminal of the power circuit 13, and the blue LED chip of the three-primary-color LED lamp is electrically connected to the third positive output terminal of the power circuit 13. A user can perform on-off control, brightness adjustment and color adjustment on the tricolor LED lamp through the control device.

the cold-warm two-color LED lamp comprises a cold-color LED chip and a warm-color LED chip, wherein the cold-color LED chip forms an LED chip group, and the warm-color LED chip forms an LED chip group. In addition, the LED substrate of the cold-warm two-color LED lamp comprises 2 input ends, and the cold-warm two-color LED lamp is provided with 2 third positive electrodes and 1 third negative electrode. The input end of one LED chip group is electrically connected with one input end of the LED substrate, and one input end of the LED substrate is electrically connected with one third positive electrode in the third interface. That is to say, 2 LED chip groups, 2 input terminals of the LED substrate, and 2 third positive electrodes in the third interface are electrically connected in a one-to-one correspondence.

After the cold-warm two-color LED lamp is mounted on the lamp holder shown in fig. 2-6, the third negative electrode in the cold-warm two-color LED lamp contacts with the first negative electrode in the lamp holder (i.e. the connection terminal marked with GND), and the 2 third positive electrodes in the cold-warm two-color LED lamp contact with the 2 first positive electrodes in the lamp holder (i.e. the 2 connection terminals marked with a and B) in a one-to-one correspondence manner, so that the cold-color LED chip in the cold-warm two-color LED lamp is electrically connected with one positive output terminal of the power circuit 13, and the warm-color LED chip in the cold-warm two-color LED lamp is electrically connected with the other positive output terminal of the power circuit 13. A user can carry out on-off control, brightness adjustment and color temperature adjustment on the cold and warm two-color LED lamp through the control device.

As a preferred embodiment, in the LED lamp disclosed in the second embodiment of the present invention, the heat sink 21 is grounded. After the heat sink 21 is grounded, the heat sink 21 and the LED substrate 22 form a grounded shielding cavity, which can shield various radiation possibly generated on the power line and the LED substrate 22, and improve electromagnetic compatibility (EMC) performance of the LED lamp. In practice, grounding of the heat sink 21 can be achieved in a variety of ways.

Firstly, the method comprises the following steps: the input end of the LED substrate 22 is electrically connected to the first positive electrode through the power line and the third positive electrode in sequence, and the output end of the LED substrate 22 is electrically connected to the first negative electrode through the power line and the third negative electrode in sequence. The heat sink 21 is electrically connected to the first negative electrode.

Secondly, the method comprises the following steps: the input end of the LED substrate 22 is electrically connected to the first positive electrode through the power line and the third positive electrode in sequence, and the output end of the LED substrate 22 is electrically connected to the first negative electrode through the power line and the third negative electrode in sequence. The heat sink 21 is electrically connected to an output terminal of the LED substrate 22.

Thirdly, the method comprises the following steps: the input end of the LED substrate 22 is electrically connected to the first positive electrode through the power line and the third positive electrode in sequence, and the output end of the LED substrate 22 is electrically connected to the first negative electrode through the power line and the third negative electrode in sequence. The heat sink 21 is electrically connected to the first negative electrode and the output terminal of the LED substrate 22, respectively.

Fourthly: the input end of the LED substrate 22 is electrically connected to the first positive electrode through the power line and the third positive electrode in sequence, and the output end of the LED substrate is electrically connected to the heat sink. The heat sink 21 is electrically connected to the first negative electrode.

Under the condition that the heat sink 21 is electrically connected with the first negative electrode and the output end of the LED substrate 22 at the same time, various possible radiations generated on the power line and the LED substrate 22 can be shielded to the maximum extent, and the EMC performance of the LED lamp is improved.

It should be noted that, for the specific structures of the first interface and the third interface, and the specific structures of the first positive electrode, the first negative electrode, the third positive electrode and the third negative electrode, please refer to the foregoing description, and the description focuses on the electrical connection manner of the LED substrate 22 and the grounding manner of the LED substrate 22.

In the first to third modes, the input and output terminals of the LED substrate 22 are electrically connected to the third interface through power lines. As described with reference to fig. 3-1 and 3-4, an input terminal of the LED substrate 22 is connected to a positive output terminal of the power circuit 13 through a power line, a third positive electrode, and a first positive electrode, and an output terminal of the LED substrate 22 is connected to a negative output terminal of the power circuit 13 through a power line, a third negative electrode, and a first negative electrode, so as to achieve grounding.

In the fourth mode, the input terminal of the LED substrate 22 is electrically connected to the third interface through a power line, but the output terminal of the LED substrate 22 is not electrically connected to the third interface through a power line, and the output terminal of the LED substrate 22 is electrically connected to the heat sink 21, and the heat sink 21 is electrically connected to the first negative electrode in the first interface, so as to achieve grounding of the LED substrate 22. Thus, one power supply wire can be reduced, and the workload of device installation and welding is correspondingly reduced. As shown in fig. 3-2 and 3-3, an input terminal of the LED substrate 22 is electrically connected to a positive output terminal of the power circuit 13 through a power line, a third positive electrode, and a first positive electrode, while an output terminal of the LED substrate 22 is electrically connected to the heat sink 21, and the heat sink 21 is electrically connected to a third negative electrode in the third interface, so as to achieve electrical connection (i.e., grounding) with the first negative electrode in the first interface.

Here, it should be noted that: the heat sink 21 may make electrical connection with the first negative electrode in the first interface by directly contacting the third negative electrode in the third interface. In this case, the heat sink 21 and the third interface may be integrally formed, or may be a split structure, and then fixed by welding or the like at a later stage. In addition, the heat sink 21 is also electrically connected to the first negative electrode in the first interface by indirectly contacting the third negative electrode in the third interface, for example, when the heat sink 21 is made of a plastic material doped with metal particles or a resin material doped with metal particles, a metal conductor (such as a wire or a metal sheet) may be disposed between the heat sink 21 and the third negative electrode in the third interface, or metallic paint may be sprayed on the inner wall and the bottom of the heat sink, so as to establish the electrical connection between the heat sink 21 and the third negative electrode in the third interface. In addition, a metal conductor may be provided between the heat sink 21 and the output end of the LED substrate 22 to electrically connect the two.

The utility model provides a LED base plate 22 can be glass cloth base plate, composite substrate, paper substrate, metal substrate or ceramic substrate. The metal substrate comprises a metal sheet, a dielectric layer and a conductive layer, the dielectric layer is located between the metal sheet and the conductive layer, the metal sheet is in contact with the bottom of the radiator 21, and the LED chip 23 is mounted on the conductive layer. The ceramic substrate includes a ceramic layer in contact with the bottom of the heat sink 21 and a conductive layer to which the LED chip 23 is mounted.

In the case of using a metal substrate or a ceramic substrate as the LED substrate 22, the output end of the LED substrate 22 and the heat sink 21 may be electrically connected by: the LED substrate 22 is fixed to the bottom of the heat sink 21 with a fastener made of a metal material, the fastener is inserted into the heat sink 21 through the LED substrate, and the metal of the conductive layer at the position where it contacts the fastener. As described herein in connection with fig. 3-5.

Fig. 3-5 are sectional views of partial structures of the heat sink and the LED substrate disclosed in the second embodiment of the present invention. The LED substrate 22 is a metal substrate, and includes a metal sheet 221, a dielectric layer 222, and a conductive layer 223 in sequence from top to bottom, the LED chip 23 is mounted on the conductive layer 223, and the screw 25 penetrates through the LED substrate 22 and is inserted into the heat sink 21, so as to fix the LED substrate 22 at the bottom of the heat sink 21. In addition, the ink on the contact position of the conductive layer 223 with the screw 25 is erased, and the metal on the contact position of the conductive layer 223 with the screw 25 is ensured to be in contact with the screw 25, so that the LED substrate 22 is electrically connected with the heat sink 21.

In addition, in the above-mentioned disclosed LED lamp of the second embodiment of the present invention, the surface of the heat sink 21 in the lamp holder may be exposed, or the heat sink 21 is processed by surface process, or the heat sink 21 is covered with an insulating housing. When the power circuit 13 in the lamp holder adopts an isolated power supply, the heat sink 21 can be exposed on the surface or the heat sink 21 is subjected to surface process treatment, and when the power circuit 13 adopts a non-isolated power supply, an insulating shell is preferably arranged on the surface of the heat sink 21 so as to prevent a user from being accidentally touched to cause personal injury in a power-on state.

Wherein, the surface process treatment comprises the following steps: frosted surface treatment, multi-tone surface treatment, electrophoretic painting surface treatment, oxidation blackening surface treatment, powder electrostatic spraying surface treatment and plasma enhanced electrochemical surface treatment. The oxidation blackening surface treatment can increase the capacity of the radiator for external heat radiation, and further reduce the temperature of the LED chip.

The embodiment of the utility model provides in the LED lamp of the LED lamps and lanterns that two are disclosed, the metal contact in the public screw thread of third interface or public bayonet socket is preferred to be adopted the metal ring contact, can reduce cost. Fig. 3-6 are top views of a screw LED lamp suitable for RGB three-primary colors, in which D is a screw metal shell, 3 metal ring contacts are respectively represented by A, B, C, and an insulating material is disposed between two adjacent metal ring contacts.

In addition, as a preferred embodiment, an ESD (electrostatic discharge) protection device may be further provided in the LED lamp. The ESD protection device is connected between the input and output of the LED substrate 22, or the ESD protection device is connected in parallel with one LED chip 23, or the ESD protection device is connected in parallel with a plurality of LED chips 23 connected in series. By providing the ESD protection device in the LED lamp, the LED chip 23 can be prevented from being damaged by static electricity and surge impact of a power supply.

In implementation, the ESD protection device may be a TVS transistor transient voltage suppressor, a voltage dependent resistor, or a zener diode.

Further, lamp cover 26 may be provided in the LED lamp.

Additionally, in the above-mentioned each disclosed LED lamp of the second embodiment of the present invention, the LED chip 23 can be mounted on the LED substrate 22 through COB (integrated package), and the LED chip 23 can also be welded on the LED substrate 22. The utility model provides a LED chip 23 is organic light emitting diode or inorganic light emitting diode. The LED chips 23 may be of the same color or of a plurality of colors.

The embodiment of the utility model provides an in two above-mentioned each LED lamps and lanterns that disclose, communication module can be wireless radio frequency module, infrared ray receiving module or infrared ray transceiver module. When the communication module adopts the infrared receiving module, a user can control the LED lamp through the control device. When the communication module adopts the wireless radio frequency module or the infrared ray transceiving module, the communication module is also used for receiving the feedback information generated by the control module and sending the feedback information to the outside, namely, a user can control the operation of the LED lamp through the control device and can also know the operation state information of the LED lamp.

In an implementation, the antenna in the radio frequency module may be a PCB antenna, a metal wire antenna, a ceramic antenna, a metal spiral antenna, a PIFA (PIFA) antenna, an IFA (inverted F) antenna, a yagi antenna, a loop antenna, or a plated antenna. The antenna needs to be kept away from other components of the communication control circuit 12, including metal fasteners such as screws, and especially from the power supply circuit 13, to prevent the performance of the antenna from being affected. For details, reference may be made to the related description in the first embodiment, and details are not described here.

In addition, the second embodiment of the present invention discloses a lamp holder in an LED lamp, that is, the first embodiment of the present invention discloses a lamp holder, the second embodiment of the present invention focuses on the structure of an LED lamp, and the first embodiment of the present invention is referred to for the undescribed part of the structure of the lamp holder.

The embodiment of the utility model provides a LED lamps and lanterns disclosed in the second can be ceiling lamp lamps and lanterns, desk lamp lamps and lanterns, shot-light lamps and lanterns and street lamp lamps and lanterns.

Fig. 3-7 are sectional views of a split-type street lamp disclosed in the second embodiment of the present invention, and fig. 3-8 are sectional views of another split-type street lamp disclosed in the second embodiment of the present invention. The street lamp shown in fig. 3-7 and 3-8 comprises a lamp holder and an LED lamp, wherein the communication control circuit 12 and the power supply circuit 13 are both located inside the lamp holder, the lamp holder is further provided with a first interface 14, and the LED lamp with a third interface 24 is mounted outside the lamp holder through the first interface 14. In the street lamps shown in fig. 3-7 and fig. 3-8, the communication control circuit 12 and the power circuit 13 are separated from the heat sink in the LED lamp and are away from the heat source, so that the temperature of the environment where the communication control circuit 12 and the power circuit 13 are located is reduced, and the service life of the lamp holder is prolonged; the communication control circuit 12 is disposed inside the socket (the inside of the socket is made of an insulating material) and is away from the heat sink 21 in the LED bulb, so that the operation performance of the communication module (e.g., an antenna in the communication module) is not affected. It should be noted here that one or more LED lamps may be installed in the street lamp. Preferably, a lamp shade 26 may be provided in the street lamp.

In specific application, the split type street lamp can be remotely controlled or closely controlled. The intelligent management system realizes on/off control, brightness adjustment, color temperature or color adjustment, abnormal work detection, working temperature detection, power consumption detection and the like of the street lamp, and realizes intelligent management of the street lamp.

In addition, fig. 3-9 are cross-sectional views of a split type desk lamp disclosed in the second embodiment of the present invention. The communication control circuit 12 and the power circuit 13 in the desk lamp are both located inside a shell 11, wherein the shell 11 is a lamp holder of the desk lamp. The LED lamp is mounted on top of the housing 11. In addition, the desk lamp is provided with a lamp shade 26. Since the communication control circuit 12 and the power supply circuit 13 in the desk lamp are both arranged inside the housing 11, and the LED lamp is mounted on the top of the housing 11, the communication control circuit 12 and the power supply circuit 13 are separated from the heat sink 21 in the LED lamp, so that the temperature of the environment where the communication control circuit 12 and the power supply circuit 13 are located can be reduced, and the service life of the desk lamp can be prolonged. The communication control circuit 12 is disposed inside the housing 11 (the housing 11 is made of an insulating material), and is away from the heat sink 21 in the LED bulb, so that the operation performance of the communication module (e.g., an antenna in the communication module) is not affected.

In specific application, the split type desk lamp can be remotely controlled or short-range controlled, the on/off control, brightness adjustment, color temperature or color adjustment, abnormal work detection, working temperature detection, power consumption detection and the like of the desk lamp can be realized, the remote or short-range control can be realized in a wireless mode, and the intelligent management of the desk lamp is greatly realized.

EXAMPLE III

Referring to fig. 4-1, 4-2 and 4-4, fig. 4-1 is a cross-sectional view of a LED lamp disclosed in the third embodiment of the present invention, fig. 4-2 is a cross-sectional view of another LED lamp disclosed in the third embodiment of the present invention, and fig. 4-4 is a cross-sectional view of another LED lamp disclosed in the third embodiment of the present invention. The LED lamp comprises a lamp holder and an LED lamp fixed on the lamp holder.

The lamp socket comprises a shell 31, a communication control circuit 32 and a power supply circuit 33, and the LED lamp comprises a heat sink 34, an LED substrate 35 and an LED chip 36. Wherein:

the heat sink 34 is connected to the housing 31. In practice, the heat sink 34 may be located at the bottom of the housing 31. Of course, the heat sink 34 may be located elsewhere on the housing 31, as shown in FIGS. 4-6, 4-8, 4-9, 4-10, 4-11, and 4-12.

The housing 31 has an insulated cavity.

In practice, the housing 31 may be a closed structure. In addition, the housing 31 may be provided with: the bottom of the case 31 is closed at the position where it is joined to the heat sink 34. At this time, no gap can be left at the position where the power line (or the flexible PCB board, the pin header) passes through the housing 31, a hole can be punched on the housing 31, the aperture of the hole is matched with the diameter of the power line (or the flexible PCB board, the pin header), after the power line (or the flexible PCB board, the pin header) passes through the housing 31, the gap between the hole wall and the power line (or the flexible PCB board, the pin header) is filled, and the position where the bottom of the housing 31 is combined with the heat sink 34 is ensured to be in a closed state. Of course, it is also possible not to fill the gap between the hole wall and the power supply line (or flexible PCB, pin header).

The communication control circuit 32 and the power supply circuit 33 are disposed within the cavity. Communication control circuit 32 includes communication module and control module, the positive input end and the live wire electricity of power supply circuit 33 are connected, the negative input end and the zero line electricity of power supply circuit 33 are connected, the control end and the communication control circuit 32 electricity of power supply circuit 33 are connected, the negative output end ground connection of power supply circuit 33, power supply circuit 33 has N positive output ends, can export N kinds of drive current simultaneously, communication control circuit 32 receives control signal, according to the operation of control signal control power supply circuit 33, power supply circuit 33 responds to the control of communication control circuit 32 and converts the commercial power into the drive power supply with the LED lamp adaptation. In practice, the communication control circuit 32 and the power supply circuit 33 are positioned in the cavity so that the communication control circuit 32 and the power supply circuit 33 are as far away from the heat sink 34 as possible in the vertical direction. The power supply circuit 33 includes an electrolytic capacitor 326.

The LED substrate 35 is disposed at the bottom of the heat sink 34, the LED substrate 35 has N input terminals, one input terminal of the LED substrate 35 is electrically connected to one positive output terminal of the power circuit 33, and when the LED substrate 35 has a plurality of input terminals, different input terminals of the LED substrate 35 are electrically connected to different positive output terminals of the power circuit 33, and an output terminal of the LED substrate 35 is grounded.

The LED chip 36 is installed on the LED substrate 35, the LED lamp comprises N LED chip groups, one LED chip group comprises at least one LED chip, the input end of one LED chip group is electrically connected with one input end of the LED substrate 35, and the output ends of the N LED chip groups are electrically connected with the output end of the LED substrate. Wherein N is an integer greater than or equal to 1. Here, when the LED chip set includes a plurality of LED chips, the plurality of LED chips may be in a series relationship, a parallel relationship, or a mixed relationship of series and parallel.

The heat generated from the LED chip 36 is transferred to the heat sink 34 through the LED substrate 35, and then dissipated to the outside air by convection and radiation through the surface of the heat sink 34. Because the communication control circuit 32 and the power supply circuit 33 are disposed in the cavity of the housing 31, the space where the communication control circuit 32 and the power supply circuit 33 are located is separated from the space where the heat sink 34 is located, and the housing 31 is made of an insulating material to be unfavorable for heat conduction, so that heat on the heat sink 34 is hardly conducted to the inside of the housing 31, and the temperature of the environment where the communication control circuit 32 and the power supply circuit 33 are located is reduced.

The utility model discloses above-mentioned LED lamps and lanterns that disclose include lamp stand and LED lamp, and the lamp stand includes casing, communication control circuit and power supply circuit, and the LED lamp includes radiator, LED base plate and LED chip. The heat radiator is positioned at the bottom of the shell, the communication control circuit and the power circuit are positioned in the cavity of the shell, and the bottom of the cavity is in a closed state, so that the communication control circuit and the power circuit are separated from the heat radiator and far away from a heating source (an LED chip and the heat radiator in an LED lamp), the temperature of the environment where the communication control circuit and the power circuit are positioned is reduced, the aging rate of the communication control circuit and the power circuit due to high temperature is delayed, particularly the aging rate of an electrolytic capacitor in the power circuit is delayed, and the service life of the LED lamp is prolonged; in addition, the working performance of the communication module in the communication control circuit can be improved, and the communication module in the communication control circuit does not influence the light path of the LED chip, so that the difficulty in designing the light path of the LED lamp used in cooperation is reduced.

In the LED lamp shown in fig. 4-1, 4-2 and 4-4, the power circuit 33 has a positive output terminal, all the LED chips 36 in the LED lamp are electrically connected to the same positive output terminal of the power circuit 33, and a user can perform on-off control and brightness adjustment on the LED lamp through the control device.

In an implementation, the power circuit 33 may also have two positive output terminals, that is, the power circuit 33 can output two driving power sources at the same time. The LED lamp comprises a cold color LED chip and a warm color LED chip, wherein the cold color LED chip forms an LED chip group, and the warm color LED chip forms an LED chip group. In addition, the LED substrate 35 in the LED lamp includes 2 input terminals. An input terminal of one LED chip group is electrically connected to one input terminal of the LED substrate 35, and one input terminal of the LED substrate 35 is electrically connected to one positive output terminal of the power supply circuit 33. That is, 2 LED chip groups, 2 input terminals of the LED substrate 35, and 2 positive output terminals of the power supply circuit 33 are electrically connected in one-to-one correspondence. A user can carry out on-off control, brightness adjustment and color temperature adjustment on the cold and warm two-color LED lamp through the control device.

In an implementation, the power circuit 33 may further have 3 positive output terminals, that is, the power circuit 33 can output three driving power sources simultaneously. The LED lamp comprises a red LED chip, a green LED chip and a blue LED chip, wherein the red LED chip forms an LED chip group, the green LED chip forms an LED chip group, and the blue LED chip forms an LED chip group. In addition, the LED substrate 35 in the LED lamp includes 3 input terminals. An input terminal of one LED chip group is electrically connected to one input terminal of the LED substrate 35, and one input terminal of the LED substrate 35 is electrically connected to one positive output terminal of the power supply circuit 33. That is, 3 LED chip groups, 3 input terminals of the LED substrate 35, and 3 positive output terminals of the power supply circuit 33 are electrically connected in one-to-one correspondence. A user can perform on-off control, brightness adjustment and color adjustment on the tricolor LED lamp through the control device.

As a preferred embodiment, in the LED lamp disclosed in the third embodiment of the present invention, the heat sink 34 is grounded. After the heat sink 34 is grounded, the heat sink 34 and the LED substrate 35 form a grounded shielding cavity, which can shield various radiation generated on the power line (or flexible PCB, pin header) and the LED substrate 35, and improve EMC performance of the LED lamp.

In practice, grounding of the heat sink 34 may be achieved in a variety of ways.

Firstly, the method comprises the following steps: the input end of the LED substrate 35 is electrically connected to the positive output end of the power circuit 33 through a power line, and the output end of the LED substrate 35 is electrically connected to the negative input end of the power circuit 33 through a power line. The heat sink 34 is electrically connected to the negative output terminal of the power supply circuit 33.

Secondly, the method comprises the following steps: the input end of the LED substrate 35 is electrically connected to the positive output end of the power circuit 33 through a power line, and the output end of the LED substrate 35 is electrically connected to the negative input end of the power circuit 33 through a power line. The heat sink 34 is electrically connected to an output terminal of the LED substrate 35.

Thirdly, the method comprises the following steps: the input end of the LED substrate 35 is electrically connected to the positive output end of the power circuit 33 through a power line, and the output end of the LED substrate 35 is electrically connected to the negative input end of the power circuit 33 through a power line. The heat sink 34 is electrically connected to the negative output terminal of the power supply circuit 33 and the output terminal of the LED substrate 35, respectively.

Fourthly: the input terminal of the LED substrate 35 is electrically connected to the positive output terminal of the power supply circuit 33 via a power supply line, and the output terminal of the LED substrate 35 is electrically connected to the heat sink 34. The heat sink 34 is electrically connected to the negative output terminal of the power supply circuit 33.

When the heat sink 34 is electrically connected to both the negative input terminal of the power circuit 33 and the output terminal of the LED substrate 35, various radiations generated from the power line and the LED substrate 35 can be shielded to the maximum extent, and the EMC performance of the LED lamp can be improved.

In the first to third modes, the input terminal and the output terminal of the LED substrate 35 are electrically connected to the power supply circuit 33 through the power supply line. As described with reference to fig. 4-1 and 4-4, the LED substrate 35 includes an input terminal and an output terminal, the input terminal of the LED substrate 35 is electrically connected to the positive output terminal of the power circuit 33 through a power line, and the output terminal of the LED substrate 35 is electrically connected to the negative output terminal of the power circuit 33 through a power line, so as to achieve grounding.

In the fourth embodiment, the input terminal of the LED substrate 35 is electrically connected to the positive output terminal of the power supply circuit 33 via a power supply line, but the output terminal of the LED substrate 35 is not electrically connected to the negative output terminal of the power supply circuit 33 via a power supply line, and the output terminal of the LED substrate 35 is electrically connected to the heat sink 34 and the heat sink 34 is electrically connected to the negative output terminal of the power supply circuit 33, thereby achieving grounding of the LED substrate 35. This can reduce one power supply line, and accordingly can reduce the workload of device mounting and soldering. As shown in fig. 4-2, the LED substrate 35 includes an input terminal and an output terminal, the input terminal of the LED substrate is electrically connected to the positive output terminal of the power circuit 33 through a power line, and the output terminal of the LED substrate 35 is electrically connected to the heat sink 34, while the heat sink 34 is electrically connected to the negative output terminal of the power circuit 33 (i.e., grounded).

In practice, the heat sink 34 may be fixed to the bottom of the housing 11 by gluing or taping. In the first, third, or fourth aspect, a metal conductor may be provided between the heat sink 34 and the negative output terminal of the power circuit 33 to electrically connect the two. The third embodiment of the present invention further discloses another structure for realizing the electrical connection between the negative output terminal of the heat sink 34 and the power circuit 33.

Referring to fig. 4-1, the LED lamp is fixed to the socket by a first fastener (here, specifically, a screw 382) inserted through the PCB 333 and the bottom of the socket into the interior of the heat sink 34, the heat sink 34 being electrically connected to the ground pad 372 of the power circuit 33 by the first fastener, the ground pad of the power circuit being disposed on the PCB.

Referring to fig. 4-3, the LED lamp is fixed to the socket by a first fastener (here, specifically, a screw 382) inserted through the bottom of the socket into the interior of the heat sink 34, and further electrically connected to a ground pad 372 of the power circuit 33 through a conductive member 371, wherein the ground pad 372 is electrically connected to the negative output terminal of the power circuit 33. In fig. 4-3, the conductive member 371 is embodied as a spring plate, one end of which is fixed to the first fastener and the other end of which is in contact with the ground pad 372 of the power circuit 33, thereby achieving electrical connection between the heat sink 34 and the negative output terminal of the power circuit 33. In an implementation, the conductive member may be a thimble, and specifically, one end of the thimble is fixed to the first fastening member, and the other end of the thimble contacts with the ground pad of the power circuit 33.

When the heat sink 34 is made of a plastic material doped with metal particles or a resin material doped with metal particles, a metal conductor (such as a wire or a metal sheet) may be disposed between the heat sink 34 and the power circuit 33, or a metallic paint may be sprayed on the inner wall and the bottom of the heat sink, so as to establish electrical connection between the heat sink 34 and the third negative electrode in the third interface.

In addition, a metal conductor may be provided between the heat sink 34 and the output end of the LED substrate 35 to electrically connect the two.

The utility model provides a LED base plate 35 can be glass cloth base plate, composite substrate, paper substrate, metal substrate or ceramic substrate. The metal substrate includes a metal sheet, a dielectric layer and a conductive layer, the dielectric layer is located between the metal sheet and the conductive layer, the metal sheet contacts with the bottom of the heat sink 34, and the LED chip 36 is mounted on the conductive layer. The ceramic substrate includes a ceramic layer in contact with the bottom of the heat sink 34 and a conductive layer to which the LED chip 36 is mounted.

In the case of using a metal substrate or a ceramic substrate for the LED substrate 35, the output end of the LED substrate 35 and the heat sink 34 may be electrically connected by: the LED substrate 35 is fixed to the bottom of the heat sink 34 with a fastener made of a metal material, the fastener is inserted into the heat sink 34 through the LED substrate 35, and the metal of the conductive layer at the position where it contacts the fastener. Wherein, the fastener can be a screw, a stud and a matched nut. The above-described electrical connection is substantially identical to the structure shown in fig. 3-5, as can be seen in fig. 3-5.

In addition, in the LED lamp disclosed in the third embodiment of the present invention, the surface of the heat sink 34 in the lamp holder may be exposed, or the heat sink 34 is processed by surface process, or the heat sink 34 is covered with an insulating housing. When the power circuit 33 in the lamp holder adopts an isolated power supply, the heat sink 34 may be exposed on the surface or the heat sink 34 may be subjected to surface processing, and when the power circuit 33 adopts a non-isolated power supply, an insulating shell is preferably disposed on the surface of the heat sink 34 to prevent a user from being accidentally touched in a power-on state to cause personal injury.

In addition, as a preferred embodiment, an ESD (electrostatic discharge) protection device may be further provided in the LED lamp. The ESD protection device is electrically connected between the input and output terminals of the LED substrate 35, or the ESD protection device is connected in parallel with one LED chip 36, or the ESD protection device is connected in parallel with a plurality of LED chips 36 connected in series. By providing an ESD protection device in the LED lamp, the LED chip 36 can be prevented from being damaged by static electricity and surge impact of a power supply. In implementation, the ESD protection device may be a TVS transistor transient voltage suppressor, a voltage dependent resistor, or a zener diode.

Further, a lamp cover 39 may be provided in the LED lamp. An insulating sheet 310 may be further provided in the case 31, the insulating sheet 310 being positioned on the upper side of the communication control circuit 32 and the power supply circuit 33.

Additionally, in each LED lamp disclosed in the third embodiment of the present invention, the LED chip 36 can be mounted on the LED substrate 35 through COB (integrated package), and the LED chip 36 can also be soldered on the LED substrate 35. The LED chip 36 of the present invention is an organic light emitting diode or an inorganic light emitting diode. The LED chips 36 may be of the same color or of a plurality of colors.

The embodiment of the utility model provides an in three above-mentioned each LED lamps and lanterns that disclose, communication module among the communication control circuit 32 can be wireless radio frequency module, infrared ray receiving module or infrared ray transceiver module. When the communication module adopts the infrared receiving module, a user can control the LED lamp through the control device. When the communication module adopts the wireless radio frequency module or the infrared ray transceiving module, the communication module is also used for receiving the feedback information generated by the control module and sending the feedback information to the outside, namely, a user can control the operation of the LED lamp through the control device and can also know the operation state information of the LED lamp. It should be noted here that, in each LED lamp disclosed in the third embodiment, the layout of the communication control circuit 32 and the power supply circuit 33 on the PCB board can be referred to in the description of the first embodiment.

An LED light fixture is shown in FIGS. 4-5. Wherein, the communication module in the communication control circuit 32 includes an infrared ray transmitting tube 3221 and an infrared ray receiving tube 3222, and holes are opened in the housing 31 at positions opposite to the infrared ray transmitting tube 3221 and the infrared ray receiving tube 3222 in order to ensure smooth transmission of infrared rays. In practice, to improve the aesthetics of the LED fixture, the hole may be covered with an infrared transparent plastic 3223.

In an implementation, the antenna in the radio frequency module may be a PCB antenna, a metal wire antenna, a ceramic antenna, a metal spiral antenna, a PIFA (PIFA) antenna, an IFA (inverted F) antenna, a yagi antenna, a loop antenna, or a plated antenna. The antenna needs to be kept away from other components of the communication control circuit 32, including metal fasteners such as screws, and especially from the power circuit 33, to prevent the performance of the antenna from being affected. When the antenna in the wireless radio frequency module adopts the metal spiral antenna, the two ends of the metal spiral antenna are preferably fixed. For the specific structure of the antenna, reference may be made to the related description in the first embodiment, and details are not repeated here.

Additionally, the utility model discloses LED lamps and lanterns that embodiment three disclose are street lamp lamps and lanterns, desk lamp lamps and lanterns, down lamp lamps and lanterns, ceiling lamp lamps and lanterns or ceiling lamp lamps and lanterns.

Fig. 4-6 are cross-sectional views of an integrated street lamp disclosed in the third embodiment of the present invention; fig. 4-7 are cross-sectional views of another integrated street lamp disclosed in the third embodiment of the present invention.

The housing 31 of the street lamp has an insulating cavity, and the communication control circuit 32 and the power circuit 33 are both located in the cavity of the housing 31. The heat sink 34 is connected to the housing 31. Fig. 4-6 show the housing 31 to the left of the heat sink 34 in the current perspective, and fig. 4-7 show the housing 31 to the upper left of the heat sink 34 in the current perspective. The LED substrate 35 is located at the bottom of the heat sink 34, the input end of the LED substrate 35 is connected with the positive output end of the power circuit 33, the output end of the LED substrate 35 is grounded, the negative output end of the power circuit 33 is grounded, and the heat sink 34 is grounded. The LED chip 36 is mounted on the LED substrate 35. In addition, the street light is provided with a lamp shade 39.

Because the communication control circuit 32 and the power circuit 33 of the street lamp are both arranged inside the housing 31, and the heat sink 34 is arranged outside the housing 31, the communication control circuit 32 and the power circuit 33 are not greatly influenced by the temperature of the environment, especially the temperature of the electrolytic capacitor in the power circuit 33 is slightly influenced, and thus the service life of the street lamp can be prolonged. The communication control circuit 32 is disposed inside the case 31 (the case 31 is made of an insulating material) and is separated from the heat sink 34, so that the operation performance of the communication module (for example, an antenna in the communication module 32) is not affected.

In specific application, the integrated street lamp can be remotely controlled or closely controlled. The intelligent management system realizes on/off control, brightness adjustment, color temperature or color adjustment, abnormal work detection, working temperature detection, power consumption detection and the like of the street lamp, and realizes intelligent management of the street lamp.

Fig. 4-8 are sectional views of an integrated ceiling lamp according to a third embodiment of the present invention, and fig. 4-9 are top views of fig. 4-8; fig. 4-10 are cross-sectional views of another integrated ceiling lamp disclosed in the third embodiment of the present invention, and fig. 4-11 are top views of fig. 4-10.

Wherein, the casing 31 of ceiling lamp lamps and lanterns has insulating cavity, and communication control circuit 32 and power supply circuit 33 all are located the cavity of casing 31, and radiator 34 is connected with casing 31. The top seat (specifically, the radiator 34) of the ceiling lamp is a flat metal sheet, and the top seat of the ceiling lamp can be in any shape, such as a round shape and a square shape. The top base in fig. 4-8, 4-9, 4-10, 4-11 appears circular.

In fig. 4-8 and 4-9, at the current viewing angle, the LED substrate 35 is mounted at the bottom of the ceiling lamp top seat, and the LED substrate 35 is annular; casing 31 is installed in the bottom of the footstock of ceiling lamp, and casing 31 is located the central hollowed area of ring shape LED base plate 35. In fig. 4-10 and 4-11, at the current viewing angle, the LED substrate 35 is installed at the center of the bottom of the ceiling lamp top seat, and the LED substrate 35 is circular; the casing 31 is installed in the bottom of the footstock of the ceiling lamp, and the casing 31 is located at the side position of the circular LED substrate 35. The input end of the LED substrate 35 is connected to the positive output end of the power circuit 33, the output end of the LED substrate 35 is grounded, the negative output end of the power circuit 33 is grounded, and the heat sink 34 is grounded. The LED chip 36 is mounted on the LED substrate 35. In addition, the ceiling lamp is also provided with a lampshade 39.

The heat in the LED chip 36 is conducted to the heat sink 34 on the upper surface by the LED substrate 35 below, and since the communication control circuit 32 and the power circuit 33 of the ceiling lamp are both disposed inside the housing 31 (preferably, the housing 31 is set in a sealed state), and the heat sink 34 is located on the top of the housing 31, the communication control circuit 32 and the power circuit 33 are not greatly affected by the temperature of the environment, especially, the electrolytic capacitor temperature in the power circuit 33 is less affected, so that the service life of the ceiling lamp can be prolonged. The communication control circuit 32 is disposed inside the case 31 (the case 31 is made of an insulating material) and is separated from the heat sink 34, so that the performance of the communication module (for example, an antenna in the communication module) is not affected.

In specific application, the integrated ceiling lamp can be remotely or closely controlled, so that the on/off control, brightness adjustment, color temperature or color adjustment, work abnormity detection, work temperature detection, power consumption detection and the like of the ceiling lamp can be realized, and the intelligent management of the ceiling lamp can be realized.

Fig. 4-12 are cross-sectional views of an integrated desk lamp according to a third embodiment of the present invention. The shell 31 of the desk lamp is provided with an insulating cavity, the communication control circuit 32 and the power circuit 33 are both located in the cavity of the shell 31, wherein the shell 31 is a lamp holder of the desk lamp, and the heat sink 34 is connected with the shell 31. In addition, the desk lamp is also provided with a lampshade 39.

The housing 31 is located below the heat sink 34. The LED substrate 35 is located at the bottom of the heat sink 34, the input end of the LED substrate 35 is connected with the positive output end of the power circuit 33, the output end of the LED substrate 35 is grounded, the negative output end of the power circuit 33 is grounded, and the heat sink 34 is grounded. The LED chip 36 is mounted on the LED substrate 35.

Because the communication control circuit 32 and the power supply circuit 33 of the desk lamp are both arranged inside the shell 31, and the heat sink 34 is arranged outside the shell 31, the communication control circuit 32 and the power supply circuit 33 are not greatly influenced by the temperature of the environment, especially the temperature of an electrolytic capacitor in the power supply circuit 33 is slightly influenced, and the service life of the desk lamp can be prolonged. The communication control circuit 32 is disposed inside the case 31 (the case 31 is made of an insulating material) and is separated from the heat sink 34, so that the performance of the communication module (e.g., an antenna in the communication module) is not affected.

In specific application, the integrated desk lamp can be remotely or closely controlled, the on/off control, brightness adjustment, color temperature or color adjustment, abnormal work detection, working temperature detection, power consumption detection and the like of the desk lamp can be realized, remote or close control can be performed in a wireless mode, and intelligent management of the desk lamp is greatly realized.

Fig. 4-13 are cross-sectional views of an integrated down lamp fixture disclosed in the third embodiment of the present invention. The shell 31 of the down lamp has an insulating cavity, the communication control circuit 32 and the power circuit 33 are both located in the cavity of the shell 31, and the heat sink 34 is connected with the shell 31. The radiator 34 is a bottom shell of the down lamp and is made of a metal material. In addition, the downlight fixture is also provided with a spring clip 355.

The heat sink 34 is located at the bottom of the housing 31. The LED substrate 35 is located at the bottom of the heat sink 34, the input end of the LED substrate 35 is connected with the positive output end of the power circuit 33, the output end of the LED substrate 35 is grounded, the negative output end of the power circuit 33 is grounded, and the heat sink 34 is grounded. The LED chip 36 is mounted on the LED substrate 35. Because the communication control circuit 32 and the power circuit 33 of the downlight are both arranged in the shell 31, and the heat sink 34 is arranged at the bottom of the shell 31 (preferably, the joint position of the shell 31 and the heat sink 34 is in a sealing state), the communication control circuit 32 and the power circuit 33 are not greatly influenced by the temperature of the environment, especially, the influence on the temperature of the electrolytic capacitor in the power circuit 33 is small, and the service life of the downlight can be prolonged. The communication control circuit 32 is disposed inside the case 31 (the case 31 is made of an insulating material) and is separated from the heat sink 34, so that the performance of the communication module (e.g., an antenna in the communication module) is not affected.

In specific application, the integrated down lamp can be remotely or proximately controlled, so that the down lamp can be controlled to be turned on/off, brightness adjustment, color temperature or color adjustment, abnormal work detection, work temperature detection, power consumption detection and the like, and the down lamp can be intelligently managed.

Example four

Referring to fig. 5-1, 5-2 and 5-3, fig. 5-1 is a cross-sectional view of a LED lamp according to a fourth embodiment of the present invention, fig. 5-2 is a cross-sectional view of another LED lamp according to a fourth embodiment of the present invention, and fig. 5-3 is a cross-sectional view of another LED lamp according to a fourth embodiment of the present invention. The LED lamp includes a housing 41, a communication control circuit 42, a power supply circuit 43, a heat sink 44, an LED substrate 45, an LED chip 46, and a fourth interface.

Wherein:

the fourth interface is located at the upper part of the housing 41, and includes a positive electrode electrically connected to the live wire and a negative electrode electrically connected to the neutral wire.

The heat sink 44 is located at the bottom of the housing 41. The housing 41 has an insulated cavity.

In practice, the housing 41 may be a closed structure. In addition, the housing 41 may be provided with: the bottom of the case 41 is closed at the position where the heat sink is joined. At this time, no gap is left at the position where the power cord passes through the housing 41, a hole can be punched in the housing 41, the hole diameter is matched with the diameter of the power cord, and after the power cord passes through the housing 41, the gap between the hole wall and the power cord is filled, so that the position where the bottom of the housing 41 is combined with the heat sink is ensured to be in a closed state. Of course, it is also possible that the gap between the hole wall and the power supply line is not filled.

A communication control circuit 42 and a power supply circuit 43 are disposed within the cavity. The communication control circuit 42 comprises a communication module and a control module, a positive input end of the power circuit 43 is electrically connected with a positive electrode of the fourth interface, a negative input end of the power circuit 43 is electrically connected with a negative electrode of the fourth interface, a control end of the power circuit 43 is electrically connected with the communication control circuit 42, a negative output end of the power circuit 43 is grounded, the power circuit 43 has N positive output ends and can output N driving currents simultaneously, the communication control circuit 42 receives a control signal and controls the operation of the power circuit 43 according to the control signal, and the power circuit 43 responds to the control of the communication control circuit 42 to convert commercial power into a driving power supply matched with the LED lamp. The power supply circuit 43 includes an electrolytic capacitor.

The LED substrate 45 is disposed at the bottom of the heat sink 44, the LED substrate 45 has N input terminals, one input terminal of the LED substrate 45 is electrically connected to one positive output terminal of the power circuit 43, and when the LED substrate 45 has a plurality of input terminals, different input terminals of the LED substrate 45 are electrically connected to different positive output terminals of the power circuit 43, and the output terminal of the LED substrate 45 is grounded.

The LED chip 46 is installed on the LED substrate 45, the LED lamp comprises N LED chip groups, one LED chip group comprises at least one LED chip, the input end of one LED chip group is electrically connected with one input end of the LED substrate 45, and the output ends of the N LED chip groups are electrically connected with the output end of the LED substrate 45. Wherein N is an integer greater than or equal to 1. Here, when the LED chip set includes a plurality of LED chips, the plurality of LED chips may be in a series relationship, a parallel relationship, or a mixed relationship of series and parallel.

The heat generated by the LED chip 46 is transferred to the heat sink 44 through the LED substrate 45, and then dissipated to the outside air by convection and radiation through the surface of the heat sink 44. Because the communication control circuit 42 and the power circuit 43 are disposed in the cavity of the housing 41, the space where the communication control circuit 42 and the power circuit 43 are located is separated from the space where the heat sink 44 is located, and the housing 41 is made of an insulating material to be unfavorable for heat conduction, so that heat on the heat sink 44 is hardly conducted to the inside of the housing 41, and the temperature of the environment where the communication control circuit 42 and the power circuit 43 are located is reduced.

In the above-mentioned disclosed LED lamp of the present invention, the heat sink is located at the bottom of the housing, and the communication control circuit and the power circuit are located in the cavity of the housing, so that the communication control circuit and the power circuit are separated from the heat sink, and are far away from the heat source (LED chip and heat sink), thereby reducing the temperature of the environment where the communication control circuit and the power circuit are located, delaying the aging rate of the communication control circuit and the power circuit due to high temperature, especially delaying the aging rate of the electrolytic capacitor in the power circuit, and further improving the service life of the LED lamp; in addition, the working performance of the communication module in the communication control circuit can be improved, and the communication module in the communication control circuit does not influence the light path of the LED chip, so that the difficulty in designing the light path of the LED lamp used in cooperation is reduced.

In the LED lamp disclosed in the fourth embodiment of the present invention, the fourth interface may be a male screw 471, as shown in fig. 5-1 and 5-2. A metal contact 4711 is disposed on the top of the male screw 471, the metal contact 4711 serves as a positive electrode of the fourth interface, and the metal casing of the male screw 471 serves as a negative electrode of the fourth interface. The positive input of the power circuit 43 is electrically connected to the metal contact 4711, and the negative input of the power circuit 43 is electrically connected to the metal housing of the male screw 471.

The lamp holder matched with the fourth interface comprises a female screw, an elastic sheet or a thimble electrically connected with the live wire is arranged on the inner side of the female screw, and a metal shell of the female screw is electrically connected with the zero line. After the fourth interface of the LED lamp shown in fig. 5-1 and 5-2 is inserted into the female screw of the adapted lamp holder, the metal contact 4711 of the male screw 471 is electrically connected to the live wire, and the metal shell of the male screw 471 is electrically connected to the neutral wire.

In implementation, the fourth interface may also be various interface structures in the lighting field of all countries in the world. For example: the fourth interface is a male screw, and two metal contacts are arranged at the top of the male screw, wherein one metal contact is used as a positive electrode of the fourth interface, and the other metal contact is used as a negative electrode of the fourth interface. The lamp holder matched with the fourth interface comprises a female screw, and the inner side of the female screw is respectively provided with an elastic sheet or an ejector pin electrically connected with the live wire and an elastic sheet or an ejector pin electrically connected with the zero wire.

Fig. 5-3 show another form of the fourth interface. Specifically, the method comprises the following steps: the fourth interface is a male bayonet 472, two metal contacts 4721 are arranged on the top of the male bayonet 472, and at least one metal rod 4722 is arranged on the shell of the male bayonet 472. The lamp holder adapted to the fourth interface comprises a female bayonet, a thimble or a spring plate electrically connected with the live wire and a thimble or a spring plate electrically connected with the zero wire are arranged on the inner side of the female bayonet, in addition, a positioning hole is arranged on the shell of the female bayonet, and the metal rod 4722 on the shell of the male bayonet 472 can be inserted into the positioning hole, so that the male bayonet 472 is fixed in the female bayonet.

In implementations, the positive outputs of the power circuit 43 may be 1, 2, or 3.

In the case that the power circuit 43 has 1 positive output terminal, the power circuit 43 outputs one driving power at the same time, all the LED chips 46 in the LED lamp are electrically connected to the same positive output terminal of the power circuit 43, and the user can perform on-off control and brightness adjustment of the LED lamp through the control device.

In the case where the power supply circuit 43 has 2 positive output terminals, the power supply circuit 43 can simultaneously output two kinds of driving power at the same time. The LED lamp comprises a cold color LED chip and a warm color LED chip, wherein the cold color LED chip forms an LED chip group, and the warm color LED chip forms an LED chip group. In addition, the LED substrate 45 in the LED lamp includes 2 input terminals. An input terminal of one LED chip group is electrically connected to one input terminal of the LED substrate 45, and one input terminal of the LED substrate 45 is electrically connected to one positive output terminal of the power supply circuit 43. That is, 2 LED chip groups, 2 input terminals of the LED substrate 45, and 2 positive output terminals of the power supply circuit 43 are electrically connected in one-to-one correspondence. A user can carry out on-off control, brightness adjustment and color temperature adjustment on the cold and warm two-color LED lamp through the control device.

In the case where the power supply circuit 43 has 3 positive output terminals, the power supply circuit 43 can simultaneously output three kinds of driving power at the same time. The LED lamp comprises a red LED chip, a green LED chip and a blue LED chip, wherein the red LED chip forms an LED chip group, the green LED chip forms an LED chip group, and the blue LED chip forms an LED chip group. In addition, the LED substrate 45 in the LED lamp includes 3 input terminals. An input terminal of one LED chip group is electrically connected to one input terminal of the LED substrate 45, and one input terminal of the LED substrate 45 is electrically connected to one positive output terminal of the power supply circuit 43. That is, 3 LED chip groups, 3 input terminals of the LED substrate 45, and 3 positive output terminals of the power supply circuit 43 are electrically connected in one-to-one correspondence. A user can perform on-off control, brightness adjustment and color adjustment on the tricolor LED lamp through the control device.

As a preferred embodiment, in the LED lamp disclosed in the fourth embodiment of the present invention, the heat sink 44 is grounded. After the heat sink 44 is grounded, the heat sink 44 and the LED substrate 45 form a grounded shielding cavity, which can shield various radiation generated by the power line and the LED substrate 45, and improve EMC performance of the LED lamp.

In practice, grounding of the heat sink 44 may be achieved in a variety of ways.

Firstly, the method comprises the following steps: the input end of the LED substrate 45 is electrically connected to the positive output end of the power supply circuit 43 through a power supply line, and the output end of the LED substrate 45 is electrically connected to the negative input end of the power supply circuit 43 through a power supply line. The heat sink 44 is electrically connected to the negative output terminal of the power supply circuit 43.

Secondly, the method comprises the following steps: the input end of the LED substrate 45 is electrically connected to the positive output end of the power supply circuit 43 through a power supply line, and the output end of the LED substrate 45 is electrically connected to the negative input end of the power supply circuit 43 through a power supply line. The heat sink 44 is electrically connected to an output terminal of the LED substrate 45.

Thirdly, the method comprises the following steps: the input end of the LED substrate 45 is electrically connected to the positive output end of the power supply circuit 43 through a power supply line, and the output end of the LED substrate 45 is electrically connected to the negative input end of the power supply circuit 43 through a power supply line. The heat sink 44 is electrically connected to the negative output terminal of the power supply circuit 43 and the output terminal of the LED substrate 45, respectively.

Fourthly: the input terminal of the LED substrate 45 is electrically connected to the positive output terminal of the power supply circuit 43 via a power supply line, and the output terminal of the LED substrate 45 is electrically connected to the heat sink 44. The heat sink 44 is electrically connected to the negative output terminal of the power supply circuit 43.

When the heat sink 44 is electrically connected to both the negative output terminal of the power circuit 43 and the output terminal of the LED substrate 45, various radiation generated from the power line and the LED substrate 45 can be shielded to the maximum extent, and the EMC performance of the LED lamp can be improved.

In the first to third modes, the input terminal and the output terminal of the LED substrate 45 are electrically connected to the power supply circuit 43 through the power supply line. As described with reference to fig. 5-1 and 5-2, the LED substrate 45 includes three input terminals and one output terminal, the three input terminals of the LED substrate 45 are electrically connected to three positive output terminals (labeled R, G and B, respectively) of the power circuit 43 through three power lines in a one-to-one correspondence, and the output terminal of the LED substrate 45 is electrically connected to a negative output terminal (labeled GND) of the power circuit 43 through one power line to achieve grounding.

In the fourth embodiment, the input terminal of the LED substrate 45 is electrically connected to the positive output terminal of the power supply circuit 43 via a power supply line, but the output terminal of the LED substrate 45 is not electrically connected to the negative output terminal of the power supply circuit 43 via a power supply line, and the output terminal of the LED substrate 45 is electrically connected to the heat sink 44 and the heat sink 44 is electrically connected to the negative output terminal of the power supply circuit 43, thereby achieving grounding of the LED substrate 45. This can reduce one power supply line, and accordingly can reduce the workload of device mounting and soldering. As shown in fig. 5-3, the LED substrate 35 includes three input terminals and one output terminal, the three input terminals of the LED substrate are electrically connected to three positive output terminals (respectively identified as R, G and B) of the power circuit 43 through three power lines in a one-to-one correspondence, while the output terminal of the LED substrate 45 is electrically connected to the heat sink 44, and the heat sink 44 is electrically connected to the negative output terminal of the power circuit 43 (i.e., grounded).

In implementation, the power line may also be a flexible PCB board or a pin header.

In practice, the heat sink 44 may be fixed to the bottom of the housing 41 by gluing or taping. In the first, third, or fourth embodiment, a metal conductor may be provided between the heat sink 44 and the negative output terminal of the power circuit 43 to electrically connect the two. The fourth embodiment of the present invention further discloses another structure for realizing the electrical connection between the negative output terminal of the heat sink 44 and the power circuit 43.

Referring to fig. 5-3, the heat sink 44 is fixed to the bottom of the housing 41 by a second fastener (here, specifically, a screw 493) inserted through the bottom of the housing 41 into the interior of the heat sink 44, the second fastener being electrically connected to a ground pad 494 of the power circuit 43 through a conductive member 495, the ground pad 494 being electrically connected to the negative output terminal of the power circuit 493. In fig. 5-3, the conductive member 495 is embodied as a spring plate, one end of which is fixed to the second fastening member and the other end of which is in contact with the ground pad 494 of the power circuit 43, thereby achieving electrical connection between the heat sink 44 and the negative output terminal of the power circuit 43. In practice, the heat sink 44 may also be fixed to the bottom of the housing 41 in the manner shown in fig. 5-1. Specifically, the method comprises the following steps: the bottom of the case 41 is provided with male screws 492, and the inside of the heat sink 44 is provided with female screws 491 fitted thereto, and the heat sink 44 is fixed to the bottom of the case 41 by screwing. In an embodiment, the conductive member 495 may be a thimble, and specifically, one end of the thimble is fixed to the first fastening member, and the other end of the thimble contacts with the ground pad of the power circuit 43.

In addition, when the heat sink 44 is made of a plastic material doped with metal particles or a resin material doped with metal particles, a metal conductor (such as a wire or a metal sheet) may be disposed between the heat sink 44 and the fourth negative electrode of the fourth interface, or metallic paint may be sprayed on the inner wall and the bottom of the heat sink, so as to establish electrical connection between the heat sink 44 and the third negative electrode of the third interface.

The utility model provides a LED base plate 45 can be glass cloth base plate, composite substrate, paper substrate, metal substrate or ceramic substrate. The metal substrate includes a metal sheet, a dielectric layer and a conductive layer, the dielectric layer is located between the metal sheet and the conductive layer, the metal sheet is in contact with the bottom of the heat sink 44, and the LED chip 46 is mounted on the conductive layer. The ceramic substrate includes a ceramic layer in contact with the bottom of the heat sink 44 and a conductive layer to which the LED chip 46 is mounted.

In the case of using a metal substrate or a ceramic substrate for the LED substrate 45, the output end of the LED substrate 45 and the heat sink 44 may be electrically connected by: the LED substrate 45 is fixed to the bottom of the heat sink 44 with a fastener made of a metal material, the fastener is inserted into the heat sink 44 through the LED substrate 45, and the metal of the conductive layer at the position where it contacts the fastener. Wherein, the fastener can be a screw, a stud and a matched nut. The above-described electrical connection is substantially identical to the structure shown in fig. 3-5, as can be seen in fig. 3-5.

In addition, in the LED lamp disclosed in the fourth embodiment of the present invention, the surface of the heat sink 44 in the lamp holder may be exposed, or the heat sink 44 is processed by surface process, or the heat sink 44 is covered with an insulating housing. When the power circuit 43 in the lamp holder adopts an isolated power supply, the heat sink 44 may be exposed or surface-treated, and when the power circuit 43 adopts a non-isolated power supply, an insulating casing is preferably disposed on the surface of the heat sink 44 to prevent personal injury caused by accidental touch of a user in a power-on state.

In addition, as a preferred embodiment, an ESD (electrostatic discharge) protection device may be further provided in the LED lamp. The ESD protection device is electrically connected between the input terminal and the output terminal of the LED substrate 45, or the ESD protection device is connected in parallel to one LED chip 46, or the ESD protection device is connected in parallel to a plurality of LED chips 46 connected in series. By providing the ESD protection device in the LED lamp, the LED chip 46 can be prevented from being damaged by surge shock of static electricity and power. In implementation, the ESD protection device may be a TVS transistor transient voltage suppressor, a voltage dependent resistor, or a zener diode.

In addition, a lamp cover 410 may be provided in the LED lamp.

Additionally, in each of the LED lamps disclosed in the fourth embodiment of the present invention, the LED chip 46 can be mounted on the LED substrate 45 through COB (integrated package), and the LED chip 46 can also be soldered on the LED substrate 45. The LED chip 46 of the present invention is an organic light emitting diode or an inorganic light emitting diode. The LED chips 46 may be LED chips of the same color or LED chips of a plurality of colors.

The embodiment of the utility model provides an in each LED lamp of four above-mentioned disclosures, communication module in the communication control circuit 42 can be wireless radio frequency module, infrared ray receiving module or infrared ray transceiver module. When the communication module adopts the infrared receiving module, a user can control the LED lamp through the control device. When the communication module adopts the wireless radio frequency module or the infrared ray transceiving module, the communication module is also used for receiving the feedback information generated by the control module and sending the feedback information to the outside, namely, a user can control the operation of the LED lamp through the control device and can also know the operation state information of the LED lamp. It should be noted that, in each LED lamp disclosed in the fourth embodiment, the layout of the communication control circuit 42 and the power circuit 43 on the PCB board can be referred to the related description of the first embodiment.

In an implementation, the antenna in the radio frequency module may be a PCB antenna, a metal wire antenna, a ceramic antenna, a metal spiral antenna, a PIFA (PIFA) antenna, an IFA (inverted F) antenna, a yagi antenna, a loop antenna, or a plated antenna. The antenna needs to be kept away from other components of the communication control circuit 42, including metal fasteners such as screws, and in particular from the power supply circuit 43, to prevent the performance of the antenna from being affected. When the antenna in the wireless radio frequency module adopts the metal spiral antenna, the two ends of the metal spiral antenna are preferably fixed. For the specific structure of the antenna, reference may be made to the related description in the first embodiment, and details are not repeated here.

EXAMPLE five

The utility model discloses still disclose a LED lamps and lanterns, please refer to fig. 6-1. The LED lamp comprises a lamp holder and an LED lamp. The lamp holder comprises a shell 51, a communication control circuit 52, a first power supply circuit 53 and a fifth interface 54, the LED lamp comprises a sixth interface 55, a radiator 56, N second power supply circuits 57, an LED substrate 58 and an LED chip 59, wherein N is an integer greater than or equal to 1.

Specifically, the method comprises the following steps:

the housing 51 has an insulated cavity.

In practice, the housing 51 may be a closed structure. In addition, the housing 51 may be provided with: the bottom of the housing 51 is closed at a position where the fifth port is combined. At this time, no gap is left at the position where the power cord passes through the housing 51, a hole can be drilled in the housing 51, the hole diameter is matched with the diameter of the power cord, and after the power cord passes through the housing 51, the gap between the hole wall and the power cord is filled to ensure that the position where the bottom of the housing 51 is combined with the fifth interface is in a closed state. Of course, it is also possible that the gap between the hole wall and the power supply line is not filled.

The fifth interface 54 is located at the bottom of the housing 51, and the fifth interface 54 includes a fifth positive electrode and a fifth negative electrode insulated from each other. Two electrodes 541 in fig. 6-1, one of which serves as a fifth positive electrode and the other of which serves as a fifth negative electrode.

The communication control circuit 52 and the first power circuit 53 are located in the cavity, the communication control circuit 52 comprises a communication module and a control module, the first power circuit 53 at least comprises an electrolytic capacitor 531 and a rectifying circuit, a positive input end of the first power circuit 53 is electrically connected with a live wire, a negative input end of the first power circuit 53 is electrically connected with a zero wire, a positive output end of the first power circuit is electrically connected with a fifth positive electrode, and a negative output end of the first power circuit is electrically connected with a fifth negative electrode. The electrolytic capacitor 531 is a heat sensitive element, and when the temperature of the working environment is high, the drying of the electrolyte inside the electrolytic capacitor is accelerated, so that the electrolytic capacitor fails in advance.

The sixth interface 55 is located on the top of the heat sink 56, the sixth interface 55 includes a sixth positive electrode and a sixth negative electrode which are insulated from each other, the LED lamp can be mounted on the lamp holder through the cooperation of the sixth interface 55 and the fifth interface 54, after the LED lamp is mounted on the lamp holder, the sixth positive electrode is electrically connected with the fifth positive electrode, and the sixth negative electrode is electrically connected with the fifth negative electrode. The two electrodes 551 of fig. 6-1, one of which serves as a sixth positive electrode and the other of which serves as a sixth negative electrode. In implementation, the fifth interface 54 may be a female screw, the sixth interface 55 may be a male screw, and the specific structure may be referred to in the related description of the second embodiment, and in addition, the fifth interface 54 may also be a female bayonet, and the sixth interface 55 may be a male bayonet, and the specific structure may be referred to in the related description of the second embodiment. In implementation, the sixth interface 55 may also be various interface structures in the lighting field of all countries in the world.

The N second power circuits 57 are located inside the heat sink 56, positive input ends of the N second power circuits 57 are electrically connected to the sixth positive electrode, negative input ends of the N second power circuits 57 are electrically connected to the sixth negative electrode, and the first power circuit 53 and/or the N second power circuits 57 are electrically connected to the communication control circuit 52, and the communication control circuit 52 receives the control signal and controls the operation of the first power circuit 53 and/or the second power circuit 57 according to the control signal. It should be noted here that the first power circuit 53 and the N second power circuits 57 form a power circuit, and convert the commercial power into the driving power adapted to the LED chip 59, specifically, the first power circuit 53 rectifies and steps down the commercial power, and then each second power circuit 57 processes the electric energy output by the first power circuit 53 and outputs the driving power adapted to the LED chip 59. In an implementation, the first power circuit 53 includes a rectifying circuit and a voltage converting circuit, wherein the voltage converting circuit includes an electrolytic capacitor, and the voltage converting circuit may be a Buck circuit, a Boost circuit or a flyback switching circuit; or the first power supply circuit 53 includes a rectifying circuit and an electrolytic capacitor; alternatively, the first power supply circuit 53 includes a rectifier circuit and a PFC (power factor corrector) circuit including an electrolytic capacitor.

The LED substrate 58 is disposed outside the heat sink 56, the LED substrate 58 has N input terminals, one input terminal of the LED substrate 58 is electrically connected to a positive output terminal of one second power supply circuit 57, and when the LED substrate 58 has a plurality of input terminals, different input terminals of the LED substrate 58 are electrically connected to positive output terminals of different second power supply circuits 57, and output terminals of the LED substrate 58 are grounded. In practice, the LED substrate 58 may be disposed on the side of the heat sink 56 as shown in fig. 6-1, or may be disposed on the bottom of the heat sink 56.

The LED chip 59 is mounted on the LED substrate 58, and the LED lamp includes N LED chip groups, one LED chip group including at least one LED chip; the input end of one LED chip group is electrically connected with one input end of the LED substrate 58, and the output ends of the N LED chip groups are electrically connected with the output end of the LED substrate 58. Here, when the LED chip set includes a plurality of LED chips, the plurality of LED chips may be in a series relationship, a parallel relationship, or a mixed relationship of series and parallel.

The heat generated by the LED chip 59 is transferred to the heat sink through the LED substrate 58, and then dissipated to the outside air by convection and radiation through the surface of the heat sink 56. Because the communication control circuit 52 and the first power supply circuit 53 are disposed in the cavity of the housing 51, the space where the communication control circuit 52 and the first power supply circuit 53 are located is separated from the space where the heat sink 56 is located, and the housing 51 is made of an insulating material, which is not favorable for heat conduction, so that heat on the heat sink 56 is hardly conducted to the inside of the housing 51, and the temperature of the environment where the communication control circuit 52 and the first power supply circuit 53 are located is reduced.

The utility model discloses an above-mentioned LED lamps and lanterns, including lamp stand and LED lamp, the lamp stand includes casing, communication control circuit, first power supply circuit and fifth interface, and the LED lamp includes sixth interface, radiator, second power supply circuit, LED base plate and LED chip. The fifth interface is located at the bottom of the shell, the sixth interface is located at the top of the radiator, the LED lamp is installed on the lamp holder through the cooperation of the sixth interface and the fifth interface, in addition, the communication control circuit and the first power supply circuit are located in the cavity of the shell, and therefore the communication control circuit, the first power supply circuit and the radiator are separated, the temperature of the working environment of the communication control circuit and the working environment of the first power supply circuit are reduced, the aging rate of the communication control circuit and the aging rate of the first power supply circuit are delayed, and particularly the aging rate of an electrolytic capacitor in the power supply circuit is delayed. In addition, the working performance of the communication module in the communication control circuit can be improved, and the communication module in the communication control circuit does not influence the light path of the LED chip, so that the difficulty in designing the light path of the LED lamp used in cooperation is reduced.

In the LED lamp shown in fig. 6-1, the antenna 521 in the communication control circuit 52 is one of the communication module elements.

When the LED lamp of the LED lamp is a three-primary-color LED lamp, the fifth interface 54 may adopt a 5-electrode G24 interface, and the structure thereof is shown in fig. 6-2. Among them, terminals denoted by R, G and B are control terminals, a terminal denoted by P is electrically connected to the positive electrode of the electrolytic capacitor 531 in the first power supply circuit 53, and a terminal denoted by GND is grounded.

Preferably, the heat sink 56 may be grounded. After the heat sink 56 is grounded, the heat sink 56 and the LED substrate 58 form a grounded shielding cavity, which can shield radiation generated on the second power circuit 57 and the LED substrate 58, and improve the electromagnetic compatibility of the LED lamp. The LED substrate 58 is preferably a metal substrate having a metal sheet embedded therein, and the metal sheet and the heat sink 56 are grounded to provide a very significant shielding effect.

In practice, if the input terminal of the LED substrate 58 is electrically connected to the positive output terminal of the second power circuit 57 through the power line, and the output terminal of the LED substrate 58 is electrically connected to the negative output terminal of the second power circuit 57 through the power line (grounded), the heat sink 56 and the output terminal of the LED substrate 58 can be electrically connected, so that the grounding of the heat sink 56 is realized. Of course, it is also possible to establish an electrical connection directly between the heat sink 56 and the negative output terminal of the second power supply circuit 57.

When only the input terminal of the LED substrate 58 is electrically connected to the positive output terminal of the second power supply circuit 57 through the power supply line, an electrical connection is directly established between the heat sink 56 and the negative output terminal of the second power supply circuit 57, and an electrical connection is simultaneously established between the heat sink 56 and the output terminal of the LED substrate 58, thereby achieving grounding of the output terminal of the LED substrate 58.

EXAMPLE six

The utility model discloses still disclose a LED lamps and lanterns, please see figure 7. The LED lamp comprises a lamp holder and an LED lamp fixed on the lamp holder. The lamp holder comprises a shell 61, a communication control circuit 62 and a first power supply circuit 63, the LED lamp comprises a radiator 64, an LED substrate 65, an LED chip 66 and N second power supply circuits 67, and N is an integer greater than or equal to 1.

Specifically, the method comprises the following steps:

the heat sink 64 is located at the bottom of the housing 61. The housing 61 has an insulated cavity.

In practice, the housing 61 may be a closed structure. In addition, the housing 61 may be provided with: the bottom of the case 61 is closed at a position where the heat sink 64 is joined. At this time, no space is left at the position where the power cord passes through the case 61, a hole having a diameter matching the diameter of the power cord may be punched in the case 61, and after the power cord passes through the case 61, the space between the hole wall and the power cord is filled to ensure that the position where the bottom of the case 61 is combined with the heat sink 64 is closed. Of course, it is also possible that the gap between the hole wall and the power supply line is not filled.

The communication control circuit 62 and the first power circuit 63 are disposed in the cavity, the communication control circuit 62 includes a communication module and a control module, the first power circuit 63 at least includes an electrolytic capacitor 631 and a rectifying circuit, a positive input end of the first power circuit 63 is electrically connected to the live wire, and a negative input end of the first power circuit 63 is electrically connected to the neutral wire.

The N second power circuits 67 are located inside the heat sink, positive input terminals of the N second power circuits 67 are electrically connected to positive output terminals of the first power circuit 63, negative input terminals of the N second power circuits 67 are electrically connected to negative output terminals of the first power circuit 63, the first power circuit 63 and/or the N second power circuits 67 are electrically connected to the communication control circuit 62, and the communication control circuit 62 receives the control signal and controls the operation of the first power circuit 63 and/or the second power circuit 67 according to the control signal. It should be noted here that the first power circuit 63 and the N second power circuits 67 constitute a power circuit, and convert the commercial power into a driving power adapted to the LED chip 66, specifically, the first power circuit 63 rectifies and steps down the commercial power, and then each second power circuit 67 processes the electric energy output by the first power circuit 63 and outputs the driving power adapted to the LED chip 66. In an implementation, the first power circuit 63 includes a rectifying circuit and a voltage converting circuit, wherein the voltage converting circuit includes an electrolytic capacitor, and the voltage converting circuit may be a Buck circuit, a Boost circuit or a flyback switching circuit; or the first power supply circuit 63 includes a rectifying circuit and an electrolytic capacitor; or the first power supply circuit 63 includes a rectifier circuit and a PFC (power factor corrector) circuit including an electrolytic capacitor. In fig. 7, a1 indicates a position as a connection of a power supply line, and B1 indicates a position as a connection of a control line.

The LED substrate 65 is disposed at the bottom of the heat sink 64, the LED substrate 65 has N input terminals, one input terminal of the LED substrate 65 is electrically connected to the positive output terminal of one second power circuit 67, and when the LED substrate 65 has a plurality of input terminals, different input terminals of the LED substrate 65 are electrically connected to the positive output terminals of different second power circuits 67, and the output terminal of the LED substrate 65 is grounded.

The LED chip 66 is mounted on the LED substrate 65, the LED lamp includes N LED chip groups, and one LED chip group includes at least one LED chip; the input end of one LED chip group is electrically connected with one input end of the LED substrate 65, and the output ends of the N LED chip groups are electrically connected with the output end of the LED substrate 65. Here, when the LED chip set includes a plurality of LED chips, the plurality of LED chips may be in a series relationship, a parallel relationship, or a mixed relationship of series and parallel.

The utility model discloses above-mentioned LED lamps and lanterns, communication control circuit and first power supply circuit are located the cavity of casing, and the radiator is located the bottom of casing, and this makes communication control circuit and first power supply circuit and radiator be separated to reduced communication control circuit and first power supply circuit's operational environment temperature, delayed communication control circuit and first power supply circuit's ageing rate, especially delayed electrolytic capacitor's among the power supply circuit ageing rate. In addition, the working performance of the communication module in the communication control circuit can be improved, and the communication module in the communication control circuit does not influence the light path of the LED chip, so that the difficulty in designing the light path of the LED lamp used in cooperation is reduced.

In the LED lamp shown in fig. 7, the communication module in the communication control circuit 62 is a wireless rf module, and fig. 7 shows an antenna 621 in the wireless rf module. Of course, the communication module in the communication control circuit 62 may be an infrared receiving module or an infrared transmitting/receiving module.

Preferably, the heat sink 64 may be grounded. After the heat sink 64 is grounded, the heat sink 64 and the LED substrate 65 form a grounded shielding cavity, which can shield radiation generated by the second power circuit 67, and improve the electromagnetic compatibility of the LED lamp. The LED substrate 65 is preferably a metal substrate, and a metal sheet is embedded in the metal substrate, and the metal sheet and the heat sink 64 are grounded, so that the shielding effect is very significant.

In practice, if the input terminal of the LED substrate 65 is electrically connected to the positive output terminal of the second power circuit 67 through a power line, and the output terminal of the LED substrate 65 is electrically connected to the negative output terminal of the second power circuit 67 through a power line (grounded), the heat sink 64 and the output terminal of the LED substrate 65 may be electrically connected, thereby achieving the grounding of the heat sink 64. Of course, it is also possible to establish an electrical connection directly between the heat sink 64 and the negative output terminal of the second power supply circuit 67.

When only the input terminal of the LED substrate 65 is electrically connected to the positive output terminal of the second power supply circuit 67 through the power supply line, an electrical connection is directly established between the heat sink 64 and the negative output terminal of the second power supply circuit 67, and an electrical connection is simultaneously established between the heat sink 64 and the output terminal of the LED substrate 65, thereby achieving grounding of the output terminal of the LED substrate 65.

EXAMPLE seven

The utility model discloses still disclose a LED lamp, refer to figure 8 and show. The LED lamp comprises a shell 71, a seventh interface 72, a heat sink 73, a communication control circuit 74, a first power supply circuit 75, N second power supply circuits 76, an LED substrate 77 and an LED chip 78, wherein N is an integer greater than or equal to 1.

Specifically, the method comprises the following steps:

the seventh interface 72 is located at the upper portion of the housing 71, and the seventh interface 72 includes a positive electrode electrically connected to the live wire and a negative electrode electrically connected to the neutral wire. The seventh interface 72 in fig. 8 is a male bayonet provided with a metal rod 721 and two metal contacts 722, the structure of which can be seen in the above description with respect to fig. 5-3. In addition, the seventh port 72 may also be a male screw, and the structure thereof can be seen in fig. 5-1 and 5-2 and the related description. In implementation, the seventh interface may also be various interface structures in the lighting field of all countries in the world.

The heat sink 73 is located at the bottom of the housing 71. The housing 71 has an insulated cavity.

In practice, the housing 71 may be a closed structure. In addition, the housing 71 may be provided with: the bottom of the housing 71 is closed at the position where the heat sink 73 is joined. At this time, no space is left at the position where the power cord passes through the housing 71, and a hole having a diameter matching the diameter of the power cord may be punched in the housing 71, and after the power cord passes through the housing 71, the space between the hole wall and the power cord is filled to secure a closed state at the position where the bottom of the housing 71 is joined to the heat sink 73. Of course, it is also possible that the gap between the hole wall and the power supply line is not filled.

The communication control circuit 74 and the first power circuit 75 are disposed in the cavity, the communication control circuit 74 includes a communication module and a control module, the first power circuit 75 at least includes an electrolytic capacitor 751 and a rectifying circuit, a positive input terminal of the first power circuit 75 is electrically connected to a positive electrode of the seventh interface 72, and a negative input terminal of the first power circuit 75 is electrically connected to a negative electrode of the seventh interface 72.

The N second power supply circuits 76 are located inside the heat sink 73, positive input terminals of the N second power supply circuits 76 are electrically connected to positive output terminals of the first power supply circuit 75, negative input terminals of the N second power supply circuits 76 are electrically connected to negative output terminals of the first power supply circuit 75, the first power supply circuit 75 and/or the N second power supply circuits 76 are electrically connected to the communication control circuit 74, and the communication control circuit 74 receives the control signal and controls the operation of the first power supply circuit 75 and/or the second power supply circuits 76 according to the control signal. It should be noted here that the first power circuit 75 and the N second power circuits 76 constitute a power circuit, and convert the commercial power into a driving power adapted to the LED chip, specifically, the first power circuit 75 rectifies and steps down the commercial power, and then each second power circuit 76 processes the electric energy output by the first power circuit 75 to output the driving power adapted to the LED chip 78. In an implementation, the first power circuit 75 includes a rectifying circuit and a voltage converting circuit, wherein the voltage converting circuit includes an electrolytic capacitor, and the voltage converting circuit may be a Buck circuit, a Boost circuit, or a flyback switching circuit; or the first power supply circuit 75 includes a rectifying circuit and an electrolytic capacitor; alternatively, the first power supply circuit 75 includes a rectifier circuit and a PFC (power factor corrector) circuit including an electrolytic capacitor.

The LED substrate 77 is disposed at the bottom of the heat sink 73, the LED substrate 77 has N input terminals, one input terminal of the LED substrate 77 is electrically connected to the positive output terminal of one second power supply circuit 76, and when the LED substrate 77 has a plurality of input terminals, different input terminals of the LED substrate 77 are electrically connected to the positive output terminals of different second power supply circuits 76, and the output terminal of the LED substrate 77 is grounded.

The LED chips 78 are mounted on the LED substrate 77, the LED lamp includes N LED chip groups, and one LED chip group includes at least one LED chip; the input end of one LED chip group is electrically connected with one input end of the LED substrate 77, and the output ends of the N LED chip groups are electrically connected with the output end of the LED substrate 77. Here, when the LED chip set includes a plurality of LED chips, the plurality of LED chips may be in a series relationship, a parallel relationship, or a mixed relationship of series and parallel.

In the LED lamp shown in fig. 8, the communication module in the communication control circuit 73 is a radio frequency module, and fig. 8 shows an antenna 731 in the radio frequency module. Of course, the communication module in the communication control circuit 73 may be an infrared ray receiving module or an infrared ray transmitting/receiving module.

Preferably, the heat sink 73 may be grounded. After the heat sink 73 is grounded, the heat sink 73 and the LED substrate 77 form a grounded shielding cavity, which can shield radiation generated on the second power circuit 76 and the LED substrate 77, and improve the electromagnetic compatibility of the LED lamp. The LED substrate 77 is preferably a metal substrate, and a metal sheet is embedded in the metal substrate, and the metal sheet and the heat sink 73 are grounded, so that the shielding effect is very remarkable.

In practice, if the input terminal of the LED substrate 77 is electrically connected to the positive output terminal of the second power circuit 76 through a power line, and the output terminal of the LED substrate 77 is electrically connected to the negative output terminal of the second power circuit 76 through a power line (grounded), the heat sink 73 and the output terminal of the LED substrate 77 may be electrically connected, thereby achieving the grounding of the heat sink 73. Of course, it is also possible to establish an electrical connection directly between the heat sink 73 and the negative output terminal of the second power supply circuit 76.

When only the input terminal of the LED substrate 77 is electrically connected to the positive output terminal of the second power supply circuit 76 through the power supply line, an electrical connection is directly established between the heat sink 73 and the negative output terminal of the second power supply circuit 76, while an electrical connection is established between the heat sink 73 and the output terminal of the LED substrate 77, thereby achieving grounding of the output terminal of the LED substrate 77.

It should be noted that, for the specific structure of the communication control circuit in the fifth to seventh embodiments of the present invention, reference may be made to the related description in the first embodiment, and details are not repeated here.

Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A lamp holder is characterized in that the lamp holder is used for mounting an LED lamp and comprises a shell, a communication control circuit, a power supply circuit and a first interface;

the shell is provided with an insulating cavity;

wherein N is an integer greater than or equal to 1.

2. The lamp holder of claim 1, wherein the first interface is a female screw;

the first positive electrode is a wiring terminal located on the inner side of the female screw, and the first negative electrode is a metal shell of the female screw or a wiring terminal located on the inner side of the female screw.

3. The lamp holder according to claim 1, wherein the first interface is a female bayonet, and a positioning hole is formed in a shell of the female bayonet;

the first positive electrode is a wiring terminal located on the inner side of the female bayonet, and the first negative electrode is a metal shell of the female bayonet or a wiring terminal located on the inner side of the female bayonet.

4. A lamp holder according to claim 1, 2 or 3, wherein the communication control circuit is provided on a first PCB board and the power supply circuit is provided on a second PCB board, the distance between the first PCB board and the second PCB board being greater than a preset distance;

or the communication control circuit and the power circuit are arranged on the same PCB.

5. The lamp holder of claim 1, wherein the top of the housing is provided with a second interface;

the second interface comprises a second positive electrode and a second negative electrode which are insulated from each other, the positive input end of the power circuit is electrically connected with the second positive electrode, and the negative input end of the power circuit is electrically connected with the second negative electrode.

6. A lampholder as claimed in claim 1, 2, 3 or 5, characterized in that the communication module comprises a radio frequency module or an infrared transceiver module.

7. The lamp holder according to claim 6, wherein the antenna in the wireless radio frequency module is a PCB antenna, a metal wire antenna, a ceramic antenna, a metal spiral antenna, a PIFA antenna, an IFA inverted F antenna, a yagi antenna, a loop antenna or a plating antenna.

8. A lampholder as claimed in claim 1, 2, 3 or 5, characterized in that the lampholder is a ceiling lamp holder, a table lamp holder, a spot lamp holder or a street lamp holder.

9. An LED lamp, characterized by comprising the lamp holder as claimed in any one of claims 1 to 8 and an LED lamp, wherein the LED lamp comprises a heat sink, a third interface, an LED substrate and an LED chip; wherein,

wherein N is an integer greater than or equal to 1.

10. The LED light fixture of claim 9 wherein the heat sink is grounded.

11. The LED light fixture of claim 10,

the first interface in the lamp holder is a female screw, the first positive electrode is a wiring terminal positioned on the inner side of the female screw, and the first negative electrode is a metal shell of the female screw; a third interface in the LED lamp is a male screw matched with the female screw, a third positive electrode of the third interface is a metal contact positioned at the top of the male screw, and a third negative electrode of the third interface is a metal shell of the male screw;

or,

the first interface in the lamp holder is a female screw, the first positive electrode is a wiring terminal positioned on the inner side of the female screw, and the first negative electrode is a wiring terminal positioned on the inner side of the female screw; the third interface in the LED lamp is a male screw matched with the female screw, a third positive electrode of the third interface is a metal contact positioned at the top of the male screw, and a third negative electrode of the third interface is a metal contact positioned at the top of the male screw.

12. The LED light fixture of claim 10,

the first interface is a female bayonet, a metal shell of the female bayonet is provided with a positioning hole, the first positive electrode is a wiring terminal positioned on the inner side of the female bayonet, and the first negative electrode is the metal shell of the female bayonet; a third interface in the LED lamp is a male bayonet matched with the female bayonet, at least one metal rod is arranged on a metal shell of the male bayonet and can enter the positioning hole, a third positive electrode in the third interface is a metal contact positioned at the top of the male bayonet, and a third negative electrode in the third interface is the metal shell of the male bayonet;

or,

the first interface is a female bayonet, a shell of the female bayonet is provided with a positioning hole, the first positive electrode is a wiring terminal positioned on the inner side of the female bayonet, and the first negative electrode is a wiring terminal positioned on the inner side of the female bayonet; the third interface in the LED lamp is a male bayonet matched with the female bayonet, the metal shell of the male bayonet is provided with at least one metal rod, the metal rod can enter the positioning hole, a third positive electrode in the third interface is a metal contact positioned at the top of the male bayonet, and a third negative electrode in the third interface is a metal contact positioned at the top of the male bayonet.

13. The LED lamp according to claim 9, 10, 11 or 12, wherein the input end of the LED substrate is electrically connected with the first positive electrode through a power line and the third positive electrode in sequence, and the output end of the LED substrate is electrically connected with the first negative electrode through the power line and the third negative electrode in sequence;

the radiator is electrically connected with the first negative electrode, or the radiator is electrically connected with the output end of the LED substrate, or the radiator is respectively electrically connected with the first negative electrode and the output end of the LED substrate.

14. The LED lamp according to claim 9, 10, 11 or 12, wherein the input end of the LED substrate is electrically connected with the first positive electrode sequentially through a power line and the third positive electrode, and the output end of the LED substrate is electrically connected with the heat sink;

the heat sink is electrically connected to the first negative electrode.

15. The LED light fixture of claim 14 wherein,

the LED substrate is a metal substrate, the metal substrate comprises a metal sheet, a dielectric layer and a conducting layer, the dielectric layer is located between the metal sheet and the conducting layer, the metal sheet is in contact with the bottom of the radiator, and the LED chip is mounted on the conducting layer;

or, the LED substrate is a ceramic substrate, the ceramic substrate comprises a ceramic layer and a conducting layer, the ceramic layer is in contact with the bottom of the radiator, and the LED chip is mounted on the conducting layer.

16. The LED lamp of claim 15, wherein the output end of the LED substrate is electrically connected to the heat sink by:

fixing the LED substrate on the bottom of the heat sink by using a fastener made of metal, wherein the fastener penetrates through the LED substrate and is inserted into the heat sink, and the metal in the position, which is contacted with the fastener, of the conductive layer is contacted with the fastener.

17. The LED light fixture of claim 9 further comprising an ESD protection device in the LED lamp;

the ESD protection device is connected between the input end and the output end of the LED substrate, or the ESD protection device is connected with one LED chip in parallel, or the ESD protection device is connected with a plurality of LED chips connected in series in parallel.

18. The LED lamp of claim 9, wherein the surface of the heat sink in the socket is exposed, or the heat sink is surface treated, or the heat sink is covered with an insulating housing.

19. The LED lamp of claim 9, wherein the LED chip is mounted on the LED substrate by COB integrated package, or the LED chip is soldered on the LED substrate;

the LED chip is an organic light-emitting diode or an inorganic light-emitting diode;

the LED chips are LED chips with the same color or LED chips with various colors.

20. The LED lamp is characterized by comprising a lamp holder and an LED lamp fixed on the lamp holder, wherein the lamp holder comprises a shell, a communication control circuit and a power circuit, and the LED lamp comprises a radiator, an LED substrate and an LED chip;

the radiator is connected with the shell; the shell is provided with an insulating cavity;

wherein N is an integer greater than or equal to 1.

21. The LED light fixture of claim 20 wherein the heat sink is grounded.

22. The LED lamp of claim 21, wherein the input terminal of the LED substrate is electrically connected to the positive output terminal of the power circuit via a power line, and the output terminal of the LED substrate is electrically connected to the negative input terminal of the power circuit via a power line;

the radiator is electrically connected with the negative output end of the power circuit, or the radiator is electrically connected with the output end of the LED substrate, or the radiator is respectively electrically connected with the negative output end of the power circuit and the output end of the LED substrate.

23. The LED lamp of claim 21, wherein the input terminal of the LED substrate is electrically connected to the positive output terminal of the power circuit via a power line, and the output terminal of the LED substrate is electrically connected to the heat sink;

the radiator is electrically connected with the negative output end of the power supply circuit.

24. The LED light fixture of claim 22 or 23 wherein the LED light is secured to the socket by a first fastener, the first fastener being inserted through the bottom of the socket into the interior of the heat sink, the first fastener being electrically connected to a ground pad of the power circuit, the ground pad being electrically connected to the negative output of the power circuit.

25. The LED lamp of claim 24 wherein the first fastener is connected to the ground pad of the power circuit through a conductive member, the conductive member being a spring or pin, one end of the spring or pin being fixed to the first fastener, the other end of the spring or pin being in contact with the ground pad of the power circuit.

26. The LED light fixture of claim 22 or 23 wherein,

27. The LED lamp of claim 26, wherein the output end of the LED substrate is electrically connected to the heat sink by:

28. The LED light fixture of claim 20 wherein the communication module comprises a radio frequency module or an infrared transceiver module.

29. The LED lamp of claim 28, wherein the antenna in the wireless rf module is a PCB antenna, a metal wire antenna, a ceramic antenna, a metal spiral antenna, a PIFA antenna, an IFA inverted F antenna, a yagi antenna, a loop antenna, or a plated antenna.

30. The LED light fixture of claim 20 wherein the LED light fixture is a street light fixture, a table light fixture, a downlight fixture, a pendant light fixture, a ceiling light fixture, or a ceiling light fixture.

31. The LED lamp of claim 20, wherein the LED chip is mounted on the LED substrate by COB integrated package or the LED chip is soldered on the LED substrate;

32. An LED lamp is characterized by comprising a shell, a fourth interface, a radiator, a communication control circuit, a power supply circuit, an LED substrate and an LED chip;

wherein N is an integer greater than or equal to 1.

33. The LED lamp of claim 32, wherein the heat sink is grounded.

34. The LED lamp of claim 33, wherein the input terminal of the LED substrate is electrically connected to the positive output terminal of the power circuit via a power line, and the output terminal of the LED substrate is electrically connected to the negative input terminal of the power circuit via a power line;

35. The LED lamp of claim 33, wherein the input terminal of the LED substrate is electrically connected to the positive output terminal of the power circuit via a power line, and the output terminal of the LED substrate is electrically connected to the heat sink;

36. The LED lamp of claim 34 or 35,

and fixing the heat radiator at the bottom of the shell through a second fastener, wherein the second fastener penetrates through the bottom of the shell and is inserted into the heat radiator, the second fastener is electrically connected with a grounding pad of the power circuit through a conductive component, and the grounding pad is electrically connected with a negative output end of the power circuit.

37. The LED lamp of claim 36, wherein the conductive member is a spring or pin, one end of the spring or pin is fixed to the second fastener, and the other end of the spring or pin is in contact with the ground pad.

38. The LED lamp of claim 34 or 35, wherein the LED substrate is a metal substrate, the metal substrate comprises a metal sheet, a dielectric layer and a conductive layer, the dielectric layer is located between the metal sheet and the conductive layer, the metal sheet is in contact with the bottom of the heat sink, and the LED chip is mounted on the conductive layer;

39. The LED lamp of claim 38, wherein the output terminals of the LED substrate are electrically connected to the heat sink by:

40. The LED lamp of claim 32, wherein the communication module comprises a wireless radio frequency module or an infrared transceiver module.

41. The LED lamp of claim 40, wherein the antenna in the wireless RF module is a PCB antenna, a metal wire antenna, a ceramic antenna, a metal spiral antenna, a PIFA antenna, an IFA inverted-F antenna, a yagi antenna, a loop antenna, or a plated antenna.

42. The LED lamp of claim 32, wherein the LED chip is mounted on the LED substrate by COB integrated package or soldered on the LED substrate;

43. The LED lamp is characterized by comprising a lamp holder and an LED lamp; the LED lamp comprises a sixth interface, a radiator, N second power supply circuits, an LED substrate and an LED chip, wherein N is an integer greater than or equal to 1;

the shell is provided with an insulating cavity;

44. An LED lamp is characterized by comprising a lamp holder and an LED lamp fixed on the lamp holder, wherein the lamp holder comprises a shell, a communication control circuit and a first power supply circuit, and the LED lamp comprises a radiator, an LED substrate, an LED chip and N second power supply circuits;

wherein N is an integer greater than or equal to 1.

45. An LED lamp is characterized by comprising a shell, a seventh interface, a radiator, a communication control circuit, a first power supply circuit, N second power supply circuits, an LED substrate and an LED chip;

wherein N is an integer greater than or equal to 1.