EP3610228A1 - Sensor zur erfassung mindestens einer eigenschaft eines fluiden mediums - Google Patents
Sensor zur erfassung mindestens einer eigenschaft eines fluiden mediumsInfo
- Publication number
- EP3610228A1 EP3610228A1 EP18716156.7A EP18716156A EP3610228A1 EP 3610228 A1 EP3610228 A1 EP 3610228A1 EP 18716156 A EP18716156 A EP 18716156A EP 3610228 A1 EP3610228 A1 EP 3610228A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensor
- circuit
- carrier
- temperature sensor
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
- G01F15/02—Compensating or correcting for variations in pressure, density or temperature
- G01F15/022—Compensating or correcting for variations in pressure, density or temperature using electrical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F5/00—Measuring a proportion of the volume flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
- G01K13/024—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow of moving gases
Definitions
- the fluid medium may in particular be a gas, for example air, and the sensors may be used in particular in an intake and / or exhaust tract of an internal combustion engine.
- the sensors may be used in particular in an intake and / or exhaust tract of an internal combustion engine.
- other applications are possible.
- DE 10 2013 224 831 A1 discloses a sensor arrangement for determining at least one flow property of a flowing fluid medium.
- the sensor arrangement has at least one sensor for determining the flow property.
- the sensor has at least one hot-wire measuring element, wherein the hot-wire measuring element has at least one carrier element.
- the sensor arrangement is designed such that the carrier element protrudes into the fluid medium.
- the carrier element has at least one recess. The recess is spanned by at least one hot wire.
- Hot film air mass meter as described for example from Robert Bosch GmbH: sensors in the motor vehicle, Konrad Reif (ed.), 2nd edition pages 146-148. In principle, however, other embodiments are possible.
- a sensor chip is glued into a sensor carrier in the rule, the sensor carrier forms a unit together with a bottom plate of a drive and evaluation circuit.
- control and evaluation circuit is glued to the bottom plate.
- On the circuit board is usually an evaluation IC
- ASIC application specific integrated circuit
- a technical challenge with known sensors of the type mentioned is basically that as a boundary condition usually, in addition to the actual measured value of the sensor element, a temperature must be detected, since in particular flow properties
- NTC temperature sensors ie temperature sensors based on semiconductors with a negative temperature coefficient, can be used.
- Temperature sensor to the drive and evaluation circuit electrically couple, without this a thermal coupling between the
- Temperature sensor and the control and evaluation circuit bring about which due to a waste heat of the drive and evaluation circuit the
- the property of a fluid medium proposed.
- the property may in principle be any physical and / or chemical
- the property may be a flow characteristic, for example a mass flow and / or a volumetric flow of the fluid medium.
- the sensor comprises at least one sensor element and at least one circuit carrier with at least one drive and evaluation circuit.
- a sensor element is generally an element, in particular a monolithic element to understand, which can detect at least one measured variable.
- the sensor element can be at least one Include sensor chip.
- a circuit carrier is generally understood in the context of the present invention, a device which can carry at least one electrical circuit.
- the circuit carrier may be designed plate-shaped, preferably as a printed circuit board. Accordingly, the circuit carrier may be configured, for example, as a planar printed circuit board, for example of a fiber-reinforced plastic and / or of a ceramic material.
- other embodiments are possible in principle.
- a drive and evaluation circuit is generally understood to mean an electronic circuit which has at least one electrical or electronic component and which is set up to control at least one sensor function of the sensor element and / or to receive at least one measurement signal of the sensor element and completely and / or partially evaluate or process.
- the drive and evaluation circuit may have at least one integrated circuit (IC), preferably at least one application-specific integrated circuit (ASIC).
- IC integrated circuit
- ASIC application-specific integrated circuit
- the circuit carrier has at least one projection, wherein at least one temperature sensor is applied to the projection.
- Temperature sensor may in particular at least one temperature-sensitive
- Comprise resistor preferably a resistor with negative
- NTC Temperature coefficient
- the circuit carrier may be substantially planar, wherein the projection extends in the plane of the circuit carrier.
- the protrusion may protrude, for example, by 2 mm to 20 mm, in particular by 2 mm to 10 mm, from the circuit substrate.
- the sensor may in particular have a sensor housing.
- a sensor housing is generally understood to mean an element or a device which substantially completes the sensor to the outside and / or gives the sensor mechanical stability.
- the sensor housing can in particular wholly or partly of plastic and / or of one
- the sensor housing may in particular have at least one flow channel. Under a flow channel is generally a within the
- the senor may be designed as a plug-in sensor which can be inserted into a fluid medium, for example into a flow tube of the fluid medium. In this constellation, the fluid medium can then penetrate from the flow tube into the flow channel and flow through it.
- the sensor can be designed such that the sensor element is applied to a sensor carrier projecting into the flow channel.
- the circuit carrier may be arranged in particular outside the flow channel in an electronics compartment of the housing.
- the circuit carrier as stated above, on a base, such as a bottom plate, be applied, which is arranged in the electronics compartment.
- the circuit carrier may for example be firmly connected to the base.
- the sensor element may be connected to the sensor carrier on the sensor carrier, for example via wire bonding or other electrical connection techniques with the circuit carrier.
- the temperature sensor can be configured in particular as an SMD component.
- the temperature sensor can be designed as a resistor with a negative temperature coefficient (NTC), for example as an NTC in SMD design.
- NTC negative temperature coefficient
- the sensor element may comprise at least one sensor chip and / or may be wholly or partially configured as a sensor chip.
- the sensor element may have at least one measuring surface with at least one heating element arranged on the measuring surface and at least two temperature sensors arranged on the measuring surface.
- the sensor chip can in particular
- Hot film air mass sensor chip in which one through the Air mass flow asymmetry detected in a temperature profile generated by means of the heating element by means of the two temperature sensors is detected.
- the sensor can be designed in particular as a plug-in sensor.
- the sensor may be formed as a hot-film air mass meter.
- the temperature sensor can in particular with the drive and
- Evaluation circuit may be arranged in particular to take into account at least one temperature signal of the temperature sensor in an evaluation of at least one signal of the sensor element.
- the control and evaluation circuit can be set up to at least one
- the circuit carrier may be configured in particular as a printed circuit board.
- the projection may be formed in particular as a printed circuit board web, which protrudes from the circuit board.
- the printed circuit board can be used in particular
- Substantially rectangular be configured, wherein the projection protrudes at a corner of the circuit board from the circuit board.
- Temperature sensor is applied, the temperature sensor, as will be described in more detail below, thermally completely or partially decoupled from the at least one drive and evaluation circuit.
- the circuit carrier may furthermore have at least one cooling element.
- the cooling element may be arranged in the region of the temperature sensor, for example at a distance of not more than 20 mm, preferably not more than 10 mm, to the temperature sensor.
- the cooling element may have at least one cooling fin.
- the drive and evaluation circuit may in particular comprise at least one integrated circuit, in particular at least one ASIC.
- the temperature sensor can between the temperature sensor and the integrated circuit more be provided thermal decoupling measures.
- the circuit carrier between the temperature sensor and the integrated circuit at least one milling for thermal decoupling of
- Temperature sensor may be introduced from the integrated circuit.
- At least one slot and / or at least one groove can be milled into an upper side and / or a lower side of the printed circuit board, so that in particular at least one milling saddle can arise.
- the sensor according to the invention has a number of advantages over known sensors of the type mentioned.
- Hot-film air mass meter electronics can be minimized in this way.
- a temperature sensor in particular an NTC
- SMD design is generally less expensive than the use of a wired NTC.
- NTC in particular an NTC
- Temperature sensor to the control and evaluation circuit for example by a complex welding process, must be done.
- a Ladder comb for connecting the temperature sensor to the control and
- the printed circuit board can be up to 15K, for example.
- the temperature sensor for example the NTC
- the temperature sensor can be easily mounted on a narrow printed circuit board web. This web can for example be connected only over a small area with the rest of the circuit board and thereby be largely thermally decoupled from the rest of the circuit board.
- additional heat for example one or more cooling fins, in the region of the temperature sensor.
- Figure 1 is an exploded view of a possible
- FIGS. 2A and 2B show two possible embodiments of FIG
- FIG. 1 shows an exemplary embodiment of a sensor 110 according to the invention for detecting at least one property of a fluid medium 110.
- circuit carriers 112 are shown with a drive and evaluation circuit 114, which can be used, for example, in the sensor 110 according to FIG. In the following, these figures will be described together.
- the senor 110 comprises a sensor housing 116 with a flow channel 118.
- an inflow opening 120 also referred to as an inlet, fluid medium can penetrate into the flow channel 118, flow through it and then flow through it
- Outflow opening 122 also referred to as outlet, leave again.
- the sensor 110 may be configured overall as a plug-in sensor 124 and may be plugged, for example, into a flow tube through which the fluid medium flows.
- the plug-in sensor 124 may be plugged, for example, into a flow tube through which the fluid medium flows.
- Flow channel 118 can be closed for example by a flow channel cover 126.
- an electronics compartment 128 is formed in the sensor housing 116, in which a circuit carrier 112 is accommodated with a drive and evaluation circuit 114 applied thereon.
- the circuit carrier 112 is formed, for example, as a printed circuit board 130, which is glued to a base, such as a bottom plate 132.
- a sensor carrier 134 Connected to the bottom plate 132 is a sensor carrier 134, for example made of plastic, which, for example in the form of a small wing, from the electronics compartment 128 in the Flow channel 118 protrudes.
- a sensor element 136 is applied, which, for example in the form of a
- Hot-film air mass sensor sensor chips can be configured. This may, for example, comprise a measuring surface which can be overflowed by the fluid medium in the flow channel 118, with at least one heating element and at least two temperature sensors arranged symmetrically with respect to the heating element, for example.
- the sensor element 136 may be connected to the printed circuit board 130 by wire bonding, for example.
- the circuit carrier 112 may be connected, for example via a conductor comb 138 with a plug 140, via which an electrical contacting of the sensor 110 can take place.
- the electronics compartment 128 may still be closed by an electronics compartment lid 142.
- FIG. 2A shows a perspective view of a first possible one
- Evaluation circuit 114 shown. It can be seen that the circuit carrier 112, which in this case may be formed, for example, as a substantially rectangular printed circuit board 130, for example, may be equipped with a plurality of electronic components 144. In particular, at least one integrated circuit 146 may be provided, preferably at least one application-specific integrated circuit (ASIC).
- ASIC application-specific integrated circuit
- Electronic components 144, and particularly integrated circuit 146, may generate waste heat.
- the sensor 110 also has at least one temperature sensor 148, which may be designed, for example, as an SMD-NTC. However, this is not integrated at any point in the sensor housing 116 and connected in a complex and complex manner with the drive and evaluation circuit 114, but is applied directly to the circuit substrate 112. Nevertheless, a thermal decoupling between the temperature sensor 148 and the other control and evaluation circuit 114, with which the
- Temperature sensor 148 may be electrically connected to ensure, the circuit substrate 112 has a projection 150.
- This projection 150 may protrude from the printed circuit board 130, for example, at an edge 152.
- Temperature sensor 148 may, for example, in SMD technology on this Projection 150 may be applied, wherein the projection 150 may be configured, for example, as a narrow printed circuit board web. This narrow one
- PCB web is preferably only over a small area with the
- Circuit board 130 connected and thereby thermally largely decoupled from the same.
- FIG. 2B shows a further exemplary embodiment of the circuit carrier 112, which represents a further development of the exemplary embodiment according to FIG. 2A.
- This example shows that additional features and measures for thermal decoupling of the temperature sensor 148 can be taken by the drive and evaluation circuit 114.
- the circuit substrate 112 with the projection 150 for example in the form of the printed circuit board web and / or in the form of printed circuit board tongue can be designed.
- cooling fins may be provided.
- milling 154 may be introduced into the printed circuit board 130, which may serve for additional thermal decoupling of the temperature sensor 148 from the integrated circuit 146.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Nonlinear Science (AREA)
- Measuring Volume Flow (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017206226.6A DE102017206226A1 (de) | 2017-04-11 | 2017-04-11 | Sensor zur Erfassung mindestens einer Eigenschaft eines fluiden Mediums |
PCT/EP2018/057782 WO2018188944A1 (de) | 2017-04-11 | 2018-03-27 | Sensor zur erfassung mindestens einer eigenschaft eines fluiden mediums |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3610228A1 true EP3610228A1 (de) | 2020-02-19 |
Family
ID=61911549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18716156.7A Withdrawn EP3610228A1 (de) | 2017-04-11 | 2018-03-27 | Sensor zur erfassung mindestens einer eigenschaft eines fluiden mediums |
Country Status (5)
Country | Link |
---|---|
US (1) | US20200158546A1 (de) |
EP (1) | EP3610228A1 (de) |
CN (1) | CN110741232A (de) |
DE (1) | DE102017206226A1 (de) |
WO (1) | WO2018188944A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021063758A (ja) * | 2019-10-16 | 2021-04-22 | 株式会社デンソー | 流量測定装置 |
CN116391112A (zh) | 2020-11-20 | 2023-07-04 | 日立安斯泰莫株式会社 | 物理量检测装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3638137A1 (de) * | 1986-11-08 | 1988-05-11 | Bosch Gmbh Robert | Vorrichtung zur bestimmung der masse eines stroemenden mediums |
DE4115040A1 (de) * | 1991-05-08 | 1992-11-12 | Bosch Gmbh Robert | Messelement |
RU2506502C2 (ru) * | 2008-03-07 | 2014-02-10 | Белимо Холдинг Аг | Устройство для измерения и регулирования объемного потока в вентиляционной трубе |
JP5178261B2 (ja) * | 2008-03-19 | 2013-04-10 | アズビル株式会社 | 熱式流量計 |
DE102008042155A1 (de) * | 2008-09-17 | 2010-03-18 | Robert Bosch Gmbh | Sensoranordnung zur Bestimmung eines Parameters eines fluiden Mediums |
DE102010030438A1 (de) * | 2010-06-23 | 2011-12-29 | Robert Bosch Gmbh | Vorrichtung zur Erfassung einer Eigenschaft eines strömenden fluiden Mediums |
DE102011089480A1 (de) * | 2011-12-21 | 2013-06-27 | Robert Bosch Gmbh | Sensorvorrichtung zur Erfassung mindestens einer Eigenschaft eines strömenden fluiden Mediums |
DE102011089483A1 (de) * | 2011-12-21 | 2013-06-27 | Robert Bosch Gmbh | Sensoranordnung zur Bestimmung wenigstens eines Parameters eines durch einen Kanal strömenden fluiden Mediums |
JP5675707B2 (ja) * | 2012-06-15 | 2015-02-25 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
MX339283B (es) * | 2012-06-15 | 2016-05-10 | Hitachi Automotive Systems Ltd | Medidor de flujo térmico. |
JP5759942B2 (ja) * | 2012-06-15 | 2015-08-05 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
JP5676527B2 (ja) * | 2012-06-15 | 2015-02-25 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
JP5973371B2 (ja) * | 2013-03-21 | 2016-08-23 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
JP6099094B2 (ja) * | 2013-06-21 | 2017-03-22 | 日立オートモティブシステムズ株式会社 | ガスセンサ装置およびガスセンサ装置の取付け構造 |
JP6043248B2 (ja) * | 2013-07-24 | 2016-12-14 | 日立オートモティブシステムズ株式会社 | 熱式空気流量計 |
US20150082879A1 (en) * | 2013-09-26 | 2015-03-26 | Therm-O-Disc, Incorporated | Fluid flow sensor with reverse-installation detection |
CN105612409B (zh) * | 2013-11-14 | 2018-11-23 | 日立汽车系统株式会社 | 流量传感器 |
DE102013224831A1 (de) | 2013-12-04 | 2015-06-11 | Robert Bosch Gmbh | Sensoranordnung zur Bestimmung mindestes einer Strömungseigenschaft eines strömenden fluiden Mediums |
DE102014202105A1 (de) * | 2014-02-05 | 2015-08-06 | Continental Automotive Gmbh | Sensorvorrichtung zum Ermitteln einer Temperatur |
JP6237495B2 (ja) * | 2014-06-27 | 2017-11-29 | 株式会社デンソー | 空気流量測定装置 |
JP6352423B2 (ja) * | 2014-07-30 | 2018-07-04 | 日立オートモティブシステムズ株式会社 | 物理量検出装置 |
EP3546931B1 (de) * | 2018-03-28 | 2021-07-21 | Siemens Aktiengesellschaft | Thermoresistiver gassensor, strömungssensor und wärmeleitfähigkeitssensor |
-
2017
- 2017-04-11 DE DE102017206226.6A patent/DE102017206226A1/de not_active Withdrawn
-
2018
- 2018-03-27 EP EP18716156.7A patent/EP3610228A1/de not_active Withdrawn
- 2018-03-27 US US16/604,004 patent/US20200158546A1/en not_active Abandoned
- 2018-03-27 CN CN201880038690.6A patent/CN110741232A/zh active Pending
- 2018-03-27 WO PCT/EP2018/057782 patent/WO2018188944A1/de unknown
Also Published As
Publication number | Publication date |
---|---|
CN110741232A (zh) | 2020-01-31 |
US20200158546A1 (en) | 2020-05-21 |
DE102017206226A1 (de) | 2018-10-11 |
WO2018188944A1 (de) | 2018-10-18 |
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