EP3602578A1

EP3602578A1 - Inductive component and method for producing an inductive component

Info

Publication number: EP3602578A1
Application number: EP18708353.0A
Authority: EP
Inventors: Martin Grübl
Original assignee: Sumida Components and Modules GmbH
Current assignee: Sumida Components and Modules GmbH
Priority date: 2017-03-23
Filing date: 2018-02-21
Publication date: 2020-02-05
Also published as: US11955265B2; JP2020515075A; DE102017204949A1; US20210280350A1; WO2018172004A1; CN110603615A; JP6911141B2

Abstract

The invention relates, in several clear embodiments, to an inductive component (1a) and a method for producing such an inductive component. The inductive component (1a) comprises a busbar (4a) and at least one magnetic core (6a), which is formed along one portion of the busbar (4a) and surrounds the busbar (4a) in the portion at least in part, wherein the at least one magnetic core (6a) is formed as a plastic-bound magnetic core or a core made of magnetic cement.

Description

Inductive component and Verfohien for producing an inductive component

The present invention relates to an inductive component with a busbar and a method for producing an inductive component with a busbar. Particular applications of the invention relate to a high-current filter with such an inductive component.

Electromagnetic compatibility (EMC) is now an indispensable quality feature of electronic equipment. This is particularly evident in the fact that EMC in national member states of the European Union is reflected in national EMC legislation and regulations in accordance with an EMC directive issued by the European legislator back in 1996 new electronic devices introduced into the European market have to comply with these directives and laws regarding EMC.

Here, an electronic device is not only meant for a ready-to-use device intended for the end user, but also electronic components with their own function, which are manufactured in series and not exclusively for installation in a certain fixed installation or a specific one intended for the end user ready-made device are provided, ^* covered by the term .The apparatus. Although elementary components such as capacitors, coils and EMC filters are excluded from the current EMC directive, this does not apply to assemblies made up of elementary components.

In one approach to EMC compliance, noise is filtered using appropriate filters. In electrical engineering, a distinction is made in terms of so-called line-related interference between differential mode noise and common mode noise. Under differential mode noise interference voltages and currents are understood on the connecting lines between electrical components or electrical components, which propagate in opposite directions on the connecting lines and superimpose actual payloads that propagate in the same direction with the payload signals on the connecting lines. In contrast, common-mode noise interference voltages and currents on the connecting lines between electrical components or electrical components understood that with the same phase and current direction, both on the outgoing line, as well as on the Spread backlash between these components. Within the framework of electromagnetic compatibility, the analysis and avoidance of these disturbances takes place.

In general, the coupling of differential mode interference in circuits by inductive couplings (time-varying magnetic flux or adjacent alternating current lines) can be caused. In cases where the interference occupy different frequency ranges than the useful signals, sufficient interference suppression can be achieved by using appropriate filters, in particular push-pull filters or D-mode chokes. Line filters include, for example, filter elements against high-frequency differential mode noise. Especially in high-current applications so-called high-current filters are used which are specially designed for suppression in high-current applications. Examples are high-current filters for suppression of frequency converters, power electronics and collective interference at high power in wind turbines and industrial plants.

Known solutions for D-mode filters are limited to large installation spaces and allow only simple busbar geometries, with a fixation of the busbar has to be made by additional components. Since a great deal has to be done by hand in known production processes, industrial production is relatively expensive. Furthermore, the design of the busbars strongly depends on the ability to install D-mode filters, so that specific applications in the design of busbars must be taken into account and often lead to design conflicts.

From the document DE 10 2015 110142 A1 a busbar filter for use as an EMC filter is shown in which a plurality of interconnected inductances and capacitors are provided on a plurality of busbars for filtering differential mode noise. Here are one-piece or composite of I-cores cores, each with air gap, mounted on busbars. The cores are formed of a soft magnetic ferrite material.

From the document DE 19721610 A1 a throttle assembly for a power converter device is known, in which a bus bar and a core wound by disc coils core arrangement is embedded in a housing in a Isolierverguss

The document DE 10 2007 007117 A1 discloses an inductive component, in which two coils are formed each formed by a winding and a respective core, which in one Housing are shed with a magnetic filling material, such as a Plastoferritmaterial.

In view of the above-mentioned disadvantages, there is a demand for simplification of industrial manufacturing and greater flexibility in the design of known D-mode filters, as well as a reduction in manufacturing costs.

The above-mentioned problems and objects are achieved by an inductive component according to independent claim 1 and a method for producing an inductive component according to independent claim 8. Advantageous embodiments thereof are defined in the dependent claims 2 to 7 and 9 to 10.

The invention proposes e.g. as a solution before, used in known D-mode filter discrete Kemelemente, for example, designed as hinged cores (especially Klappferrite) or Ring- / Rahmenkeme metal powder, by plastic-bonded cores, the injection molding or casting of a Plastoferritmaterial or a plastic embedded therein magnetic particles are provided, or replaced by Magmentkerne, which are formed by so-called magnetic cement or "magmatic", wherein magnetically conductive particles are embedded in a cement matrix.

This allows greater freedom in the design of busbars, since it eliminates restrictions caused by a forced consideration of the buildability of the cores of D-mode filters and a mounting of busbars with plastic-bonded cores can be easily integrated. This makes it possible, in addition to complex busbar geometries or complex geometries for busbar forms, to also provide D-mode filters for compact installation spaces in automated processes. In addition to the good industrial manufacturability, manufacturing costs are therefore also reduced.

In a first aspect of the present invention, there is provided an inductive device having a bus bar and at least one magnetic core formed along a portion of the bus bar and at least partially surrounding the bus bar in the portion, the at least one magnetic core being a plastic bonded magnetic core or a core made of magnetic cement. In this case, the inductance of the inductive component by the at least one magnetic core regardless of a shape of the Busbar determined by the magnetic core and the busbar. This is very beneficial for chokes.

The term "magnetic core" is to be understood as meaning a component of the inductive component which, together with the busbar as an electrical conductor, forms an inductance.

In an advantageous embodiment of the inductive component according to the first aspect, exposed end portions of the bus bar in the inductive component according to a first embodiment herein are formed as terminal contacts and at least one between the magnetic core and a terminal exposed busbar section is further formed for electrical connection to a capacitor.

In a further advantageous embodiment of the inductive component according to the first aspect, the inductive component according to a second embodiment further comprises a housing, in which the busbar is at least partially received, wherein the at least one magnetic core is formed in the housing as a plastic-bonded magnetic core in plastic injection molding or plastic molding technique.

In a further advantageous embodiment of the inductive component according to the first aspect, in a third embodiment, the inductive component further comprises at least one second magnetic core, which is formed as a plastic-bonded magnetic core or a core of magnetic cement and which at least partially surrounds the busbar two magnetic cores are arranged along the busbar in series and a busbar section is formed between each two magnetic cores for electrical connection to a capacitor.

In a more illustrative embodiment of the third embodiment, the inductive component further comprises a housing, in which the bus bar is at least partially received, wherein the at least two magnetic cores are formed in the housing in separate housing sections.

In a further advantageous embodiment of the inductive component according to the first aspect, in the inductive component according to a fifth embodiment, the magnetic core is formed as a plastic-bonded magnetic core of a Plastoferritmaterial or of a plastic material having embedded therein magnetically conductive particles. In a second aspect of the present invention, there is provided a high current filter having at least one capacitor and the inductor according to the first aspect, wherein the at least one capacitor is electrically connected to the bus bar

In a third aspect of the present invention, a method of manufacturing an inductive component is provided. According to illustrative embodiments herein, the method includes providing a bus bar and forming at least one magnetic core formed along a portion of the bus bar and at least partially surrounding the bus bar in the portion, wherein the at least one magnetic core is a plastic bonded magnetic core Core is formed of magnetic cement.

In a first embodiment of the third aspect, forming the at least one magnetic core comprises overmolding the bus bar with a plastoferritm valve or a plastic material having magnetically-conductive particles embedded therein, forming at least one plastic-bonded magnetic core.

In one embodiment of the third aspect, the bus bar is at least partially disposed in a housing and forming the at least one magnetic core comprises at least partially potting the bus bar in the housing with a plastic oxide or plastic material having magnetically conductive particles embedded therein or a cement having magnetically embedded therein conductive particles.

The above-described first to third aspects of the invention provide an inductive device and a method of manufacturing an inductive device, respectively, wherein plastic-bonded magnetic cores or magnetic cores of magnetic cement can make better use of construction spaces than known discrete cores.

Further advantages and features of the present invention will become apparent from the following more detailed description of the accompanying drawings, in which:

FIG. 1 schematically illustrates a circuit diagram of a high current filter according to some illustrative embodiments of the present invention; FIG. Figures 2a and 2b illustrate schematically in perspective views inductive components according to some alternative illustrative embodiments of the present invention;

FIG. 3 is a schematic plan view of an inductive component according to further illustrative embodiments of the present invention; FIG. and

4 illustrates a soot diagram of a method of manufacturing an inductive device according to illustrative embodiments of the present invention.

Referring now to FIG. 1, a circuit diagram of a high current filter T according to some illustrative embodiments of the present invention will now be explained. The high-current filter T comprises an input terminal E and an output terminal A, as well as terminals n1 and n2, which are electrically connected to a ground terminal M. This is not a limitation of the invention and instead of the ground terminal M, a connection to a fixed reference potential other than ground can be provided.

Between the input terminal and the output terminal three inductors L1, L2 and L3 are connected in series. Between the input terminal E and the inductance L1, a capacitor C1 is interposed with one electrode of the capacitor C1 connected between the input terminal E and the inductor L1, while the other electrode of the capacitor C1 is connected to ground M. Between the inductance L1 and the inductance L2, a capacitor C2 is interposed, wherein one electrode of the capacitor C2 is connected between the inductors L1 and L2 and the other electrode of the capacitor C2 is connected to ground M. Between the inductance L2 and the inductance L3, a capacitance C3 is interposed, wherein one electrode of the capacitance C3 is connected between the inductors 12 and L3 and the other electrode of the capacitance C3 is connected to ground M. Between the inductance L3 and the output terminal A, a capacitor C4 is interposed with one electrode of the capacitor C4 connected between the inductor L4 and the output terminal A, while the other electrode of the capacitor C4 is connected to ground M.

According to illustrative examples herein, C1 = C2 = C3 = CA. Alternatively, at least one capacitance of the capacitances C1 to C4 may be different. According to one illustrative example, the following may apply: C1 * C2 »C3 ■ C4, where" = "means a deviation of at most 30%, for example at most 20%, preferably at most 15%, more preferably at most 10%, at most 5%

The circuit T shown schematically in FIG. 1 forms, for example, an LC low-pass filter of higher order, wherein a plurality of LC filters are connected in series between the input terminal E and the output terminal A. For example, for a second-order LC filter, at a certain attenuation / decade ("attenuation per decade" or "attenuation edge") per LC filter in a series connection of two LC filters, a potentiation of a damping / decade with power "2 "is achieved. For example, assuming an attenuation slope of, for example, X dB / decade per order, in an illustrative example, the result is generally an nth-order filter (a series of n LC feeders) for the entire attenuation slope (X dB / decade) with others Words a potentiation with power "n".

The circuit diagram shown in Fig. 1 represents, for example, a 3rd order LC low-pass filter, wherein the capacitance C1 represents an input capacitance and the first order by the inductance L1 with the capacitance C2 between the inductor L1 and ground M, the second order the inductance L2 with the capacitance C3 between the inductance L2 and ground M and the third order through the inductance L3 with the capacitance 04 between the inductance L3 and ground M is formed. By means of the input capacitance (here the capacitance C1) it can be ensured, for example, that the series connection of the LC filters (L1, C2), (L2, C3) and (L3, C4) from the input terminal E and the output terminal A has a low impedance to Mass M gets, whereby the filtering effect on the part of the input terminal E is increased (since in addition there is also the capacity C1 to the other capacitors C2 to C4 to ground M). Furthermore, the capacitor C1 can provide a short circuit for possible inductances (not shown), which can be connected on the input side to the input terminal and connected upstream of it (this avoids unwanted series impedance of inductors, which are connected to the input terminal, and the inductance L1 ).

The circuit diagram shown in Fig. 1 is not a limitation of the present invention and a general circuit topology may be provided wherein a number n1 (n1 a1) of inductors L1, L2 Ln1 and n2 (n2 a1) on capacitances C1 ,... Cn2 is provided. For example, instead of the circuit in FIG. First order Riter can be provided by (n1, n2) = (1, 1) or (n1, n2) = (1, 2). For illustrative examples of general circuits, we can say: (n1, n2) = (n1, n1), where n1 = n2, or (n1, n2) ^» (n1, n1 + 1), where n2 = n1 + 1.

With reference to Figures 2a, 2b and 3, various illustrative embodiments of the invention will be described in more detail below.

FIG. 2a illustrates an inductor 1a according to some illustrative embodiments of the present invention. The inductor 1a includes a bus bar 4a and a plastic-bonded magnet core 6a formed along a portion of the bus bar 4a and at least partially surrounding the bus bar 4a in the portion

According to illustrative examples herein, the plastic bonded magnetic core 6a is formed of a plastic ferrite or comprises a plastic matrix in which magnetically conductive particles are embedded. An example of a plastic matrix is thermoplastic. According to specific illustrative examples of the invention, polyamides, PPS or thermosets, such as epoxy resins, can be used as the matrix material for plastic-bonded magnetic cores. The magnetically conductive particles may be made of a ferrite powder and / or a powder of rare earth magnetic materials, e.g. NdFeB, are formed.

The expression "busbar ¹ 'in this specification is to be understood as follows: The term" busbar "designates an electrical conductor which is designed for operation with a current intensity of at least 5 A (depending on the application, busbars for applications of more than 10 A, preferably more than 15 A, for example in a range of 20 A to 1000 A) and / or is formed as a solid body, which can only deform irreversibly (this is compared to a normal wire or power cable to understand in one illustrative embodiment, the cross-section of a bus bar may be based on the maximum allowable current density established by the cooling connection and adjacent components, and more than, in some illustrative examples 1 A / mm ² , preferably more than 3 A / mm ² , for example in a range of 4 A / mm ² to 20 A / mm ² . The busbar 4a has at its ends contact areas 8a and 10a, wherein the plastic-bonded magnetic core 6a is disposed above the busbar 4a and along the busbar 4a between the contact areas 8a and 10a.

According to illustrative embodiments, as shown schematically in FIG. 2 a, the bus bar 4 a may be arranged on a carrier 2 a, for example a plastic carrier or directly on a printed circuit board. For this purpose, holding elements 12a, 14a may be provided in order to mount the busbar 4a on the carrier 2a. The holding members 12a and 14a are provided at portions of the bus bar 4a which are not covered by the plastic-bonded magnetic core 6a, respectively, and thus constitute exposed bus bar portions. Preferably, the holding elements 12a, 14a are arranged between the plastic-bonded magnetic core 6a and the contact regions 8a, 10a along the busbar 4a.

According to illustrative examples, the holding members 12a and 14a may further function as contact members configured to provide an electrical connection between the bus bar 4a and a printed circuit board (corresponding to the carrier 2a or in addition to the carrier 2a). Additionally or alternatively, the holding elements 12a and 14a may act as contact elements electrically connecting the bus bar 4a with discrete electrical components, for example with capacitors and / or additional inductances. For example, by means of the holding elements 12a and 14a acting as contact elements, a parallel connection of further components to the plastic-bonded magnetic core 6a can take place.

The contact areas 8a and 10a are generally designed to produce an electrical contact between the busbar 4a and electrically connected upstream or downstream further busbars (not shown) and / or electrically upstream and downstream electrical and / or electronic components (not shown). In other words, the contact portions 8a and 10a are exposed end portions of the bus bar 4a, which are formed as terminal contacts and at least one between the plastic-bonded magnetic core 6a and a contact portion 8a or 10a at least partially exposed busbar section (described later), the further to electrical connection with eg a capacitor (not shown) may be formed. In specific illustrative examples, the contact areas 8a and 10a, as shown in FIG. 2a, include through-holes which at least partially pass through the busbar 4a and are adapted to receive a screw member to mechanically and electrically couple the screwing member (not shown) To allow contact areas 8a and 10a with further busbars and / or electrical and / or electronic components. Additionally or alternatively, the contact regions 8a and 10a may comprise further elements (not shown), which are designed to connect the busbar 4a to further busbars (not shown) and / or electrical and / or electronic components (not shown), for example by means of a plug connection, a crimp connection and the like.

The inductive component 1a shown schematically in FIG. 2a has a width dimension Ba, a length dimension La and a height dimension Ha. According to illustrative examples, the length dimension La may be 1 cm, preferably in a range between 3 and 6 cm, for example in a range between 3.5 and 5 cm, for example at 4 cm ± 0.5 cm. According to illustrative examples, the width dimension Ba a may be 1 cm, preferably in a range between 3 and 6 cm, for example in a range between 3.5 and 5 cm, approximately 4 cm ± 0.5 cm. The height dimension Ha is, according to illustrative examples, greater than or equal to 1 cm, and can satisfy the relation: Ha <La + Ba. Further, according to specific examples herein, Ha <max (La; Ba) ("Ha is smaller than the larger of La and Ba").

The inductive component 1a, which is shown schematically in FIG. 2a, can be formed as follows. Initially, the busbar 4a is provided. According to illustrative examples, the busbar 4a may be selected in correspondence with an installation space in which the inductance component 1a is to be installed. Additionally or alternatively, the bus bar 4 a can be selected according to the inductive properties that the inductive component 1 a has, for example, a length of the bus bar 4 a in an undeformed state (a length parallel to the length dimension La) and / or a width dimension of the bus bar 4 a (A width parallel to the width dimension Ba in Fig. 2a) are selected according to an available installation space and / or the inductive properties of the inductive component 1a to be set.

Thereafter, the selected bus bar 4 a is subjected to a deformation in order to determine a shape of the bus bar 4 a, which of an available space and / or inductive Properties may depend on the inductive component 1a has. (For example, the busbar can be bent so that the inductive component 1a can be fitted into an available installation space and / or specific connection geometries can be mapped.) For example, a form of the busbar determined by an installation situation in a terminal can cause it to correspond to the particular type Form a deformation of the non-deformed initial busbar has to be made and, for example, U-shaped bent sections are to be formed, that connection conditions or connection geometries must be met and / or that the busbar is to be fitted in a given space.Although parasitic capacitances usually not are desired and are to be suppressed in general, but it is also conceivable to deform the busbar additionally or alternatively, to set a desired capacitance value of the busbar, for example, by a section-wise reshaping of the busbar, so that eg U-förmi g bent portions of the busbar to adjust a parasitic capacitance can be adjusted.

In an illustrative example, as shown in Fig. 2a, a U-shaped section is formed by sections Aa, Ab, and Ac. The sections Aa and Ab are arranged substantially parallel to each other ("substantially" means a deviation from a parallel orientation of the sections Aa and Ab by at most 30 ° relative to each other), wherein the substantially parallel sections Aa and Ab by a transverse to The plastic-bonded magnetic core 6a is shown in sections over the connecting section Ac by a suitable choice of the sections Aa, Ab and Ac with respect to their surface dimensions and length dimensions (below -Längendimensionen "dimensions along the width dimension Ba and the length dimension La to understand) a desired connection geometry is realized and / or the bus bar 4a fitted in a predetermined space. Additionally or alternatively, a desired capacitance of the busbar 4a may be adjusted based on the shape of the busbar 4a. Depending on a specific installation situation or connection geometry, it is also possible to form a plurality of U-shaped sections, for example in serpentine form, between the contact areas 8a and 10a of the busbar 4a in further illustrative examples which are not shown. However, more complex shapes or geometries of the busbar 4a are also conceivable in order, depending on the application, to adapt the busbar to predetermined connections, for example to connect two terminals for a given length of the busbar, and / or to provide a process engineering manufacturability. Because of these factors, complex busbar shapes may result that can be easily populated with plastic bonded magnetic cores according to the present method, as discussed below.

Subsequently, the plastic-bonded magnetic core 6a is formed on the busbar 4a. For example, the plastic bonded magnetic core 6a may be formed by overmolding the bus bar 4a with a plastofoil or generally a material comprising a plastic matrix having magnetically conductive particles embedded therein. Alternatively, the plastic-bonded magnetic core 6a may be formed by casting the busbar 4a in sections with a potting material, the potting material comprising a plastic matrix with magnetic particles embedded therein.

Thereafter, the correspondingly obtained bus bar 4a with the plastic-bonded magnetic core 6a on a support 2a (for example, a plastic substrate or a printed circuit board) are attached.

Additionally or alternatively, the busbar 4a can be accommodated with the plastic-bonded magnetic core 6a in a housing, provided that the busbar 4a for the manufacture of the plastic-bonded magnetic core 6a has not already been arranged in a housing.

With reference to FIG. 2b, an inductor 1b according to some illustrative embodiments of the present invention, which are alternatives to the embodiments described above with respect to FIG. 2a, will be described.

The inductive component 1b shown in FIG. 2b comprises a busbar 4b and three plastic-bonded magnetic cores 5b, 6b and 7b, which are each formed along a section of the busbar 4b and at least partially surround the busbar 4b in the respective section.

According to illustrative examples herein, each of the plastic-bonded magnetic cores 5b, 6b and 7b is formed from a plastic furnace or comprises a plastic matrix in which magnetically conductive particles are embedded. An example of a plastic matrix is thermoplastic. According to specific illustrative examples of the invention For example, polyamides, PPS or thermosets, such as epoxy resins, can be used as the matrix material for plastic-bonded magnetic cores. The magnetically conductive particles may be formed of an iron powder, a powder of an iron alloy (eg, FeSi, NiFe, FeSiAl, etc.), a ferrite powder, and / or a powder of rare earth magnet materials, eg, NdFeB.

The bus bar 4b has at its ends contact areas 8b and 10b, wherein the plastic-bonded magnetic cores 5b, 6b and 7b are arranged above the bus bar 4b and along the bus bar 4b between the contact areas 8b and 10b.

According to illustrative embodiments, as shown schematically in FIG. 2b, the busbar 4b may be arranged on a carrier 2b, for example a plastic carrier or directly on a printed circuit board. For this purpose, at least holding elements 12b, 14b may be provided to mount the bus bar 4b on the carrier 2b. The holding elements 12b and 14b can be arranged between in each case two plastic-bonded magnetic cores of the plastic-bonded magnetic cores 5b, 6b and 7b.

In illustrative examples, the holding members 12b and 14b are provided at portions of the bus bar 4b, which are not covered by any of the plastic-bonded magnetic cores 5b, 6b, and 7b, respectively, and thus constitute exposed bus bar sections. The holding member 12b is disposed between the plastic-bonded magnetic cores 5b and 6b, while the holding member is disposed between the plastic-bonded magnetic cores 6b and 7b. It can be provided further holding elements (not shown). For example, another holding member (not shown) may be disposed between the plastic-bonded magnetic core 5b and the contact portion 8b, and another holding member (not shown) may be disposed between the plastic-bonded magnetic core 7b and the contact portion 10b.

According to illustrative examples, the holding elements 12b and 14b (as well as the (optional) further holding elements (not shown in FIG. 2b) can also function as contact elements, which are designed to establish an electrical connection between the busbar 4b and a printed circuit board (corresponding to the carrier 2b or 2b) in addition to the carrier 2b). Additionally or alternatively, the holding elements 12b and 14b may act as contact elements electrically connecting the bus bar 4b with discrete electrical components, for example with capacitors and / or additional inductances. examples For example, by means of acting as contact elements holding elements 12b and 14b, a parallel connection of other components to the plastic-bonded magnetic cores 5b, 6b and 7b take place.

In a specific example, the bus bar 4b may be almost completely surrounded by a material for the plastic-bonded magnetic cores 5b, 6b, 7b and only the contact areas 8b, 10b and portions on the bus bar exposed to the holding elements 12b and 14b in mechanical (FIG. and optionally electrical) contact. In this example, if the holding members 12b and 14b also function as electrical contact members through which the bus bar 4b is connected to e.g. discrete electrical components can be connected in parallel (e.g., a capacitor), only the surface portions of the bus bar 4b between the contact portions 8b, 10b to be mechanically and electrically connected to the holding members 12b, 14b can not be covered with the plastic-bonded magnetic cores 5b, 6b, 7b. Although in this case the plastic-bonded magnetic cores 5b, 6b, 7b represent a contiguous amount of material, effective inductances along the busbar between the contact areas 8b, 10b are provided by the holding elements 12b and 14b functioning as contact elements, so that in this case too effectively three plastic-bonded ones Magnet cores can be spoken.

The contact areas 8b and 10b are generally designed to produce an electrical contact between the busbar 4b and electrically connected upstream or downstream further busbars (not shown) and / or electrically upstream and downstream electrical and / or electronic components (not shown). In other words, the contact portions 8b and 10b are exposed end portions of the bus bar 4b formed as terminal contacts and having at least one bus bar portion (to be described later) exposed at least partially between the plastic-bonded magnetic core 5b or 7b and a contact portion 8b or 10b also for electrical connection with eg a capacitor (not shown) may be formed.

In a specific example, as shown in FIG. 2b, the contact areas 8b and 10b include through-holes which at least partially pass through the bus bar 4b and are adapted to receive a screw member for mechanical and electrical coupling of the screw means (not shown) Contact areas 8b and 10b to allow further busbars and / or electrical and / or electronic components. Additionally or alternatively, the contact regions 8b and 10b may comprise further elements (not shown) which are configured to connect the busbar 4b to further busbars (not shown) and / or electrical and / or electronic components (not shown), for example by means of a plug connection, a crimp connection and the like.

The inductive component 1b shown schematically in FIG. 2b has a width dimension Bb, a length dimension Lb and a height dimension Hb. According to illustrative examples, the length dimension Lb 2 may be 1 cm, preferably in a range between 3 and 6 cm, for example in a range between 3.5 and 5 cm, approximately 4 cm ± 0.5 cm. According to illustrative examples, the width dimension Bb a may be 1 cm, preferably in a range between 3 and 6 cm, for example in a range between 3.5 and 5 cm, approximately at 4 cm ± 0.5 cm. The height dimension Hb is, according to illustrative examples, greater than or equal to 1 cm, and can satisfy the relationship: Hb <Lb + Bb. According to specific examples herein, Hb <max (Lb; Bb) (.Hb is less than the larger of Lb and Bb ").

The inductive component 1b, which is shown schematically in FIG. 2b, can be formed as follows. Initially, the bus bar 4b is provided. According to illustrative examples, the busbar 4b can be selected according to a construction space in which the inductive component 1b is to be installed. Additionally or alternatively, the bus bar 4b may be selected according to the inductive characteristics that the inductor 1b has to have, for example, a length of the bus bar 4b in an undeformed state (a length parallel to the length dimension Lb) and / or a width dimension of the bus bar 4b (A width parallel to the width dimension Bb in Fig. 2b) are selected according to an available space and / or to be set inductive properties of the inductive component 1b.

Thereafter, the selected busbar 4b is subjected to a deformation in order to determine a shape of the busbar 4b, which depend on a available installation space and / or can depict special connection geometries. For example, a shape of the bus bar determined by an installation situation in a terminal may mean that, according to the particular shape, deformation of the undeformed initial bus bar has to be made and, for example, U-shaped bent portions are formed, connection conditions or connection geometries are to be met and / or the busbar is to be fitted in a predetermined space. It is also conceivable that a deformation of the selected busbar can depend on inductive properties that the inductive component 1b has to exhibit. For example, the busbar can be bent, so that the inductive component 1b can be fitted in an available installation space. For example, a plurality of U-shaped sections, for example in serpentine form, may be formed between the contact areas 8b and 10b in the busbar 4b (not shown in FIG. 2b). But there are also more complex shapes or geometries of the busbar 4b conceivable. Depending on a specific installation situation or connection geometry, it is also possible to form a plurality of U-shaped sections, for example in serpentine form, between the contact regions 8b and 10b of the busbar 4b in further illustrative examples which are not shown. However, more complex shapes or geometries of the busbar 4b are also conceivable in order, depending on the application, to adapt the busbar to predetermined connections, for example to connect two terminals for a given length of the busbar, and / or to provide a process engineering manufacturability. Because of these factors, complex busbar shapes may result that can be easily populated with plastic bonded magnetic cores according to the present method, as discussed below.

Subsequently, the plastic-bonded magnetic cores 5b, 6b and 7b are formed on the busbar 4b. For example, the plastic-bonded magnetic cores 5b, 6b and 7b may be formed by overmolding the bus bar 4b with a piastoferrit or generally a material comprising a plastic matrix with magnetically conductive particles embedded therein. Alternatively, the plastic-bonded magnetic cores 5b, 6b and 7b can be formed by casting the busbar 4b in sections with a potting material, the potting material generally comprising a plastic matrix with magnetically conductive particles embedded therein. This is not a limitation of the present invention, but some plastic-bonded magnetic cores may also be formed by overmolding, while other plastic-bonded magnetic cores are formed by potting.

Thereafter, the correspondingly obtained bus bar 4b with the plastic-bonded magnetic cores 5b, 6b and 7b may be mounted on a carrier 2b (for example, a plastic carrier or a printed circuit board). Additionally or alternatively, the busbar 4b may be accommodated with the plastic-bonded magnetic cores 5b, 6b and 7b in a housing, provided that the busbar 4b for producing the plastic-bonded magnetic cores 5b, 6b and 7b has not already been arranged in a housing.

With reference to FIG. 3, further illustrative embodiments of the present invention will now be described.

FIG. 3 schematically illustrates a plan view of an inductive component 100, which comprises a housing 101 and a bus bar 104 arranged at least partially in the housing. The bus bar may, as shown in Fig. 3, extend in the housing and contact ends 108 and 110 with suitably formed contact areas (not shown) protrude from the housing 101 to form terminals of the bus bar 104. This is not a limitation of the present invention, and the bus bar 104 may alternatively be completely housed in the housing 101 (not shown).

The housing 101 comprises housing sections A1, A2, A3, A4 and A5 which are separate from one another. The number of separate housing sections is arbitrary and can be suitably selected according to an intended application. In the example of the embodiment illustrated in FIG. 4, the five housing sections A1 to A5 are formed by partitions TW1, TW2, TW3 and TW4 formed in the housing. This is not a limitation and housing sections within the housing 101 may be provided in any manner by means of suitable partitions. Although the partitions TW1 to TW4 are shown as extending parallel to side walls of the housing 101, this is not a limitation of the invention and it may be provided instead of planar partitions and partitions of any shape, in particular curved partitions.

In the partitions TW1 to TW4 recesses (not shown) for receiving the bus bar 104 are provided which extends through these recesses (not shown), so that the bus bar 104, the various housing sections A1 to A5 passes. The recesses (not shown) in the partitions TW1 to TW4 may be formed in accordance with a shape of the bus bar 104 (obtained after a reforming process, as described above with respect to FIGS. 2a and 2b). be formed in the partitions TW1 to TW4. Preferably, the recesses and the busbar 104 may be matched to one another in such a way that adjacent housing sections, despite the recesses, are sealed against a potting material by means of the busbar 104 running in the recesses. This means that by filling a potting material in a housing portion preferably no exit of the potting material through the recess takes place when the busbar 104 is inserted into the recess. As a potting material, a polyamide, PPS or thermosetting resin, such as epoxy resin, may be used, which may be an iron powder, a powder of an iron alloy (eg FeSi, NiFe, FeSiAl, etc.), a ferrite powder and / or a powder of rare earth magnet materials, eg NdFeB , is mixed, which provides magnetic particles in the potting material.

By casting individual housing sections, in the example in the illustration in FIG. 3, the housing sections A2 and A4 are potted, plastic-bonded magnetic cores can be provided in sections over the busbar 104, such as the plastic-bonded magnetic cores, by means of a potting material comprising a plastic matrix with magnetic particles embedded therein 106a and 106b in the illustration of FIG. 3. In order to provide a desired inductance of the plastic-bonded magnetic cores 106a and 106b, a suitable shape of the busbar 104 may be provided in the housing sections A2 and A4, for example by a certain length in the housing sections A2 and A4 to adjust the extending bus bar 104, which is an influence on the inductance of the plastic-bonded magnetic core 106a for the housing section A2 and the plastic-bonded magnetic core 106b for the housing section A4. It is also conceivable, additionally or alternatively, to set a desired capacitance value, for example according to a U-shaped section, such as e.g. is illustrated for the housing portion A4 in Fig. 3, and / or, depending on the application, to adapt the bus bar 104 to predetermined terminals, e.g. connect two terminals at a given length of bus bar 104, and / or provide process engineering manufacturability. Due to these factors, complex shapes can be created for bus bar 104 that can be easily populated with plastic-bonded magnetic cores, as discussed below.

According to some illustrative embodiments, the bus bar 104 in the housing section A1 is electrically connected between the contact end 108 and the plastic-bonded magnetic core 106a by means of a contact point 112a having a capacitance 113a. the one that can be accommodated in the housing section A1. The capacitor 113a accommodated in the housing section A1, for example a capacitor, can furthermore be connected to a ground line outside the housing 101 by means of a contact point Ma. This is not a limitation of the present invention, and the capacity 113a may instead be provided outside the housing 101.

According to some illustrative embodiments, the bus bar 104 in the housing section A3 is connected between the plastic-bonded magnetic core 106a and the plastic-bonded magnetic core 106b by means of a contact point 112b having a capacitance 113b, e.g. a capacitor, electrically connected, which may be accommodated in the housing section A3. The capacitance 113b accommodated in the housing section A3 can furthermore be connected to a ground line outside the housing 101 by means of a contact point Mb. This is not a limitation of the present invention, and the capacity 113b may instead be provided outside of the housing 101.

According to some illustrative embodiments, the bus bar 104 in the housing section A5 is electrically connected between the contact end 110 and the plastic-bonded magnetic core 106b by means of a contact point 112c having a capacitance 113c which can be accommodated in the housing section AS. The capacitance 113c accommodated in the housing section A5, e.g. a capacitor may be further connected by means of a contact point Mc with a ground line outside the housing 101. This is not a limitation of the present invention and the capacitance 113c may instead be provided outside of the housing 101.

According to illustrative embodiments, the capacitances 113a, 113b, and 113c may be provided as discrete electrical components received respectively in the housing sections A1, A3, and A5. Alternatively, the capacitances 113a, 113b, and 113c may be provided in a printed circuit board (not shown) or connected to a printed circuit board (not shown), the printed circuit board (not shown) being a bottom (not shown) of the housing 101 Bottom (not shown) of the housing 101 is arranged.

With reference to FIG. 4, an illustrative method of manufacturing an inductive component according to the present invention will now be described, in step S1 a bus bar is provided. The busbar can be provided in step S1, as shown in FIG. For example, in terms of Flg. 2a is explained above. The busbar provided in step S1 has preferably been subjected to a transformation prior to step S1, so that the busbar provided in step S1 has a desired shape or shape (eg for adaptation to a construction space in which the busbar is to be provided). and / or for setting desired electrical properties).

Subsequently, in a step S2, at least one plastic-bonded magnetic core can be formed which, according to illustrative embodiments, is formed along a section of the busbar and at least partially surrounds the busbar in the section.

According to specific illustrative examples herein, the at least one plastic bonded magnetic core may be formed in step S2 by overmolding the bus bar with a plastic oxide material, or generally by overmolding the bus bar with a plastic material having magnetically permeable particles embedded therein.

According to alternative examples herein, the bus bar may be at least partially disposed in a housing between step S1 and step S2. In step S2, the at least one plastic-bonded magnetic core can then be formed by at least partially casting the bus bar in the housing with a plastoferror material or generally a plastic material with magnetically conductive particles embedded therein. An example of a plastic matrix is thermoplastic. According to specific illustrative examples of the invention, polyamides, PPS or thermosets, such as epoxy resins, can be used as the matrix material for plastic-bonded magnetic cores. The magnetically conductive particles may be formed of an iron powder, a powder of an iron alloy (e.g., FeSi, NiFe, FeSiAl, etc.), a ferrite powder and / or a powder of rare earth magnetic materials, e.g. NdFeB, are formed.

Alternatively, a magnetic core may be formed of a magnetic cement in which housing portions are potted with the magnetic cement and the magnetic cement hardens. Subsequently, the busbar with the at least one plastic-bonded magnetic core on a support material, such as a plastic carrier or a printed circuit board, mounted and or electrically connected.

In specific illustrative embodiments of the present invention, as previously explained with reference to FIGS. 2a, 2b, 3 and 4, a high current filter may be provided by coupling the inductive component to capacitances as illustrated in the circuit diagram of FIG. 1 above has been. A correspondingly formed high current filter may represent a first order or higher order filter as generally illustrated with respect to FIG.

The inductive component may for example be provided in a filter module to filter differential mode noise. In this case, complex busbar geometries can be used in accordance with a suitable transformation of the provided busbar, since the plastic-bonded magnetic cores no restriction of the busbar shape. Compared to known solutions with magnetic cores provided, for example, by hinged ferrites, which are pivoted around bus bars, a plastic-bonded magnetic core, as described above with respect to the illustrative embodiments, can better utilize a given space than discrete cores. This filter modules can also be manufactured for compact spaces. Manufacturing processes can be automated here or can include automated injection molding processes or casting processes. In processes in which plastic-bonded magnetic cores are produced by casting, eliminating an additional fixation of the busbar by additional components.

Due to the foregoing advantages and great freedom in the design of the bus bar, since there are no restrictions on the design of the bus bar due to requirements regarding the buildability of inductive components, the industrial production is improved in this regard.

In specific illustrative embodiments of the present invention, an almost complete overmolding of a bus bar for high-current filters with very large cross-sections can take place, whereby only areas can be recessed, to which further components, for example capacities, are connected. Alternatively, instead of the almost complete plastoferritic injection, an almost complete potting of the busbar can take place. due to the Vergessßens an additional mechanical protection of the assembly can be provided.

By means of the plastic-bonded magnetic cores, inductances of the plastic-bonded magnetic cores are easily adjustable in a large inductance range, for example in a range from 10 nH to 200 nH, preferably in the range from 40 nH to 90 nH or in a range from 150 nH to 300 nH.

Previously, with reference to Figures 1 to 3, plastic-bonded magnetic cores are described in which magnetically conductive particles are embedded in a plastic matrix. This is not a limitation of the present invention, and instead magnetically conductive particles embedded in a cement matrix (so-called magnetic cement or "magmas") may be provided instead, the term "plastic-bonded core" should therefore be understood in the description of FIGS 3 alternatively comprise a magnetic cement, wherein dimensions of magnetic cores are in a range greater than 0.5 m, in particular in the range of at least 1 m.

Claims

claims

An inductive component (1a, 1b, 100) comprising a busbar (4a, 4b, 104) and at least one magnetic core (6a; 6b; 106a) formed along a portion of the busbar (4a; 4b; 104) and the busbar (4a; 4b; 104) at least partially surrounds said portion, said at least one magnetic core (6a; 6b; 106a) being formed as a plastic-bonded magnetic core or core of magnetic cement.

2. The inductive component (1a, 1b, 100) according to claim 1, wherein exposed end portions of the bus bar (4a; 4b; 104) are formed as terminal contacts and at least one at least partially exposed between the magnetic core (6a; 6b; 106a) and a terminal Busbar section is further formed for electrical connection to a capacitor.

3. Inductive component (100) according to claim 1 or 2, further comprising a housing (101), in which the bus bar (104) is at least partially accommodated, wherein the magnetic core (106a) in the housing (101) as a plastic-bonded magnetic core (6a; 6b, 106a) is formed by plastic injection molding or plastic casting technology.

The inductive component (1b; 100) according to claim 1 or 2, further comprising at least one second magnetic core (5b; 106b) formed as a plastic-bonded magnetic core or a core of magnetic cement and supporting the bus bar (4b; 104) at least The at least two magnetic cores (5b, 6b; 106a, 106b) are arranged in series along the busbar (4b; 104) and a busbar section is formed between each pair of magnetic cores for electrical connection to a capacitor (113b).

5. Inductive component (100) according to claim 4, further comprising a housing (101), in which the bus bar (104) is at least partially accommodated, wherein the at least two magnetic cores (106a, 106b) in the housing (101) in separate housing sections (A2, A4) are formed.

6. The inductive component (1a, 1b, 100) according to one of claims 1 to 5, wherein the at least one magnetic core (6a, 6b, 106a) is a plastic-bonded magnetic core is formed from a Plastoferritmaterial or a plastic material with embedded therein magnetically conductive particles.

7. High-current filter having at least one capacitor (113b) and the inductive component (100) according to one of claims 1 to 6, wherein the at least one capacitor to the bus bar (104) is electrically connected.

A method of manufacturing an inductive component (1a; 1b; 100), comprising: providing a bus bar (4a; 4b; 104); and forming at least one magnetic core (6a; 6b; 106a) formed along a portion of the bus bar (4a; 4b; 104) and at least partially surrounding the bus bar (4a; 4b; 104) in the portion a magnetic core (6a; 6b; 106a) is formed as a plastic-bonded magnetic core or a core of magnetic cement.

The method of claim 8, wherein forming said at least one magnetic core (6a; 6b; 106a) comprises overmolding said bus bar (4a; 4b; 104) with a plastoferror material or a plastic material having magnetically-conductive particles embedded therein, wherein a plastic-bonded core is formed.

10. The method of claim 8, wherein the bus bar (104) is at least partially disposed in a housing (101) and forming the at least one magnetic core (106a) at least partially casting the bus bar (104) in the housing with a Plastoferritmaterial or a plastic material comprising magnetically conductive particles embedded therein or a cement having magnetically conductive particles embedded therein.