EP3593412B1 - Inner conductor element and method of producing a system - Google Patents

Inner conductor element and method of producing a system Download PDF

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Publication number
EP3593412B1
EP3593412B1 EP17800508.8A EP17800508A EP3593412B1 EP 3593412 B1 EP3593412 B1 EP 3593412B1 EP 17800508 A EP17800508 A EP 17800508A EP 3593412 B1 EP3593412 B1 EP 3593412B1
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EP
European Patent Office
Prior art keywords
conductor element
inner conductor
electronic subassembly
bore
electronic
Prior art date
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Application number
EP17800508.8A
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German (de)
French (fr)
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EP3593412A1 (en
Inventor
Rudolf WEIDENSPOINTNER
Werner Wild
Franz SCHMIDHAMMER
Erich Schwangler
Johannes HEUBECK
Michael Wollitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
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Publication of EP3593412A1 publication Critical patent/EP3593412A1/en
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Publication of EP3593412B1 publication Critical patent/EP3593412B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2103/00—Two poles

Definitions

  • the present invention relates to an inner conductor element for a coaxial connector for the electrical and mechanical connection between two electronic assemblies.
  • High-frequency signals are to be exchanged between individual electronic assemblies for high-frequency applications.
  • the electronic assembly can be a printed circuit board equipped with high-frequency components, a single high-frequency component such as a high-frequency filter, or a substrate with an integrated RF circuit.
  • the transmission of the individual RF signals between the individual electronic assemblies takes place via coaxial connectors, so-called board-to-board connectors (German: assembly-to-assembly connector).
  • the EP 0 584 902 A1 discloses high frequency connectors between multiple circuit boards.
  • the individual circuit boards are each connected on the ground side via a metal housing arranged between them.
  • a dielectric sleeve and an inner conductor contact element guided therein are inserted into individual bores in the metal housing in order to implement a high-frequency connection.
  • such a board-to-board connector has a first coaxial connector connected to the first electronic assembly, a second coaxial connector connected to the second electronic assembly and a first coaxial connector and the coaxial adapter part movably connected to the second coaxial connector.
  • the signal is transmitted between the two electronic assemblies via an inner conductor element that is electrically and mechanically connected to the two electronic assemblies and an outer conductor element that is arranged coaxially with it is mechanically and electrically connected to the two electronic assemblies.
  • a secure mechanical connection between the inner conductor element and the first and second electronic assemblies is typically made in each case by a press fit between the inner conductor element and a hole provided for this purpose in the first or second electronic assembly.
  • the inner conductor element and the outer conductor element are first connected to the first electronic assembly and then to the second electronic assembly.
  • the present invention is based on the object of specifying a system of two electronic assemblies with at least one coaxial connector electrically and mechanically connected to the two electronic assemblies, in which the inner conductor element belonging to the respective coaxial connector is inserted in the last assembly step can be.
  • this object is achieved by an inner conductor element with the features of claim 1, by a system of a first electronic assembly and a second electronic assembly with the features of claim 8 and by a method for producing a system from a first electronic assembly and a second electronic assembly with the features of claim 14 solved.
  • the knowledge / idea on which the present invention is based is to compare the inner diameter of the bore in that electronic assembly through which the inner conductor element is first inserted, which is hereinafter referred to as the second electronic assembly, compared to the inner diameter of the bore in that assembly, in which the inner conductor element is inserted last, which is referred to below as the first electronic assembly, to be carried out enlarged.
  • the outer diameter of the contact area of the inner conductor element, which is connected to the first electronic assembly and is referred to below as the first contact area is compared to the outer diameter of the contact area of the inner conductor element, which is connected to the second electronic assembly and is referred to below as second contact area designated is executed downsized.
  • the first contact area of the inner conductor element is connected directly to the first electronic assembly and the second contact area of the inner conductor element is connected directly to the second electronic assembly.
  • This direct connection between the inner conductor element and the first and second electronic assembly implies that no additional components are required for the electrical and mechanical connection between the inner conductor element and the first or second electronic assembly and thus advantageously an inexpensive and wear-minimized technical Solution is realized.
  • the direct connection between the first and second contact area of the inner conductor element and the first or second electronic assembly is in particular an interference fit in each case.
  • a connection implemented as a press fit ensures, on the one hand, a secure mechanical fixation of the inner conductor element to the first and second electronic assembly.
  • the press fit enables contact to be made over the entire first and second contact area of the inner conductor element, ie along the entire axial extent and the entire circumference of the first and second contact area, and the entire opposite inner wall of the bore of the first and second electronic assembly, which means an optimal electrical contact between the inner conductor element and the first and second electronic assembly is realized.
  • the press fit between the first and second contact area of the inner conductor element and the first or second electronic assembly is realized by means of a radially directed elasticity of the first and second contact area.
  • This radially directed elasticity of the first and second contact area can be implemented, for example, via at least one axially extending slot-shaped bore, preferably a single axially extending slot-shaped bore, in combination with an ellipsoidal external geometry.
  • this radially directed elasticity in the first and second contact area can also be realized via a hollow cylindrical and slotted first and second contact area, which thus each has spring tabs distributed around the circumference.
  • the press fit between the first and second contact area of the inner conductor element and the first or second electronic assembly is realized by means of a knurled surface of the first and second contact area.
  • a knurled surface leads to a significantly improved mechanical fixation of the inner conductor element to the first and second electronic assembly.
  • the first contact area is adjoined by an area which runs conically in the axial direction.
  • This region which has a point in particular, is advantageously used to center the inner conductor element in the hole belonging to the first electronic assembly.
  • the fitter who inserts the respective inner conductor element into the bores of the first and second electronic assembly, has no view of the bore associated with the first electronic assembly after the inner conductor element has been passed through the bore associated with the second electronic assembly. In this way, misjudging the inner conductor element with the outer conductor element and / or with the surface of the first electronic assembly located within the bore of the outer conductor element and thus undesired damage to the relevant components is avoided.
  • an insulator element which, in the respective coaxial connector, is coaxial with the outer conductor element and with the inner conductor element to be inserted in a bore in the outer conductor element is arranged.
  • the bore diameter is reduced from the larger bore diameter of the outer conductor element to the smaller bore diameter of the insulator element. In this way, the possibility of tilting the inner conductor element and consequent damage to the relevant components are advantageously additionally reduced.
  • transition between the end face of the insulator element, which is directed towards the second electronic assembly, and the bore of the insulator element preferably has a bevel, which enables easier centering of the inner conductor element and thus easier insertion of the inner conductor element in allows the bore of the isolator element advantageous.
  • connection area which extends between the first contact area and the second contact area of the inner conductor element.
  • spring tabs distributed over the circumference of the connection area and directed radially outward are attached to the surface of the connection area, which extends between the first contact area and the second contact area of the inner conductor element. These are preferably arranged immediately adjacent to the first contact area in the connection area. In this way, in the inserted end state of the inner conductor element, these spring tabs come to lie in the immediate transition area between the first electronic assembly and the outer conductor element. This is an area in which the spring tabs have the least possible negative influence on the high-frequency signal transmission behavior of the coaxial board-to-board connector.
  • spring tabs are particularly preferably made of plastic, i.e. made of a dielectric material, in order to make the area between the electrically conductive inner conductor element and the electrically conductive outer conductor element only dielectric and thus insulating. In this way, the high-frequency signal transmission behavior of the coaxial connector is worsened as little as possible by the fastening of the spring tabs in the connection area of the inner conductor element.
  • the inner conductor element is manufactured as a stamped and bent component.
  • a bore for receiving a joining tool is advantageously provided on the end face of the second contact area of the inner conductor element.
  • Another preferred measure for centering and thus for optimized guidance of the inner conductor element during the joining process is a funnel-shaped component in the case of the absence of an insulator part element, ie an air-filled space between the inner conductor element and the outer conductor element
  • the funnel-shaped component is fastened between an inner wall of the bore belonging to the outer conductor element and a surface of the first electronic assembly facing the bore of the outer conductor element.
  • This funnel-shaped element enables in particular an easy and secure insertion of the Inner conductor element into the hole belonging to the first electronic assembly when the fitter's view of the hole belonging to the first electronic assembly is blocked due to the inner conductor element already inserted into the hole of the second electronic assembly.
  • the system 1 according to the invention is composed of a first electronic assembly and a second electronic assembly using FIG Fig. 1 explained in detail:
  • the system 1 according to the invention has a first electronic assembly 2.
  • An electronic assembly, in particular the first electronic assembly 2 can be a printed circuit board that is equipped with electronic components, in particular with electronic high-frequency components.
  • the electronic assembly can also be a substrate with integrated electronic circuits, in particular with integrated high-frequency circuits, or an electronic component, in particular an electronic high-frequency component such as a high-frequency filter.
  • This first electronic assembly 2 is, as in FIG Fig. 1 is indicated, attached to a housing 3 or to a carrier 3.
  • the geometric arrangement of the housing or of the carrier 3 relative to the first electronic assembly 2 can be derived from the in Fig. 1 shown arrangement differ.
  • an outer conductor element 4 is attached for each coaxial connector.
  • the outer conductor element 4 is preferably a rotationally symmetrical component, in particular a cylindrical component, with an associated and axial component extending bore 5.
  • the outer conductor element 4 can also have a different cross-sectional profile on the outside. With regard to a good high-frequency transmission characteristic of the individual coaxial plug connector, the outer conductor element 4 is connected over its entire end face directly to the first electronic assembly 3 without the inclusion of air.
  • a second electronic assembly 6 is also connected directly to the at least one outer conductor element 4 of at least one coaxial connector without the inclusion of air.
  • Each outer conductor element 4 of the respective coaxial connector is made of a suitable electrically conductive material.
  • the direct contact between the outer conductor elements 4 of the individual coaxial connectors and the first and second electronic assemblies 2 and 6 creates a secure electrical connection between the respective outer conductor element 4 and an associated electrical contact surface on the first and second electronic assembly 2 and 6 guaranteed.
  • a secure mechanical connection between the first electronic assembly 2 and the second electronic assembly 2 via the outer conductor element 4 of the at least one coaxial plug connector located between them is preferably implemented by screwing by means of several screws 7 1 and 7 2 .
  • suitable connection techniques such as a soldered connection, are also possible.
  • a bore 8 is provided in the first electronic assembly 2 and a bore 9 is provided in the second electronic assembly 6, the inner diameter of which is typically smaller than the inner diameter of the individual outer conductor element 4 Corresponding bore 5 is carried out.
  • the inside diameter of the bore 8 belonging to the first electronic assembly 2 is designed to be smaller than the inside diameter of the bore 9 belonging to the second electronic assembly 6.
  • an inner conductor element 10 belonging to the respective outer conductor element 4 is arranged coaxially in each coaxial connector between the first and second electronic assemblies 2 and 6.
  • Each of these inner conductor elements 10 has a first contact area 11, a second contact area 12 and a connection area 13 located between the first contact area 11 and the second contact area 12.
  • the first contact area 11 of the inner conductor element 10 is inserted into the bore 8 belonging to the first electronic assembly 2 and is directly connected electrically and mechanically to the first electronic assembly 2.
  • the second contact area 12 of the inner conductor element 10 in the finally assembled state is inserted into the bore 9 belonging to the second electronic assembly 6 and is directly connected electrically and mechanically to the second electronic assembly 6.
  • the connection area 13 of the individual inner conductor element 13 is located in the area the bore 5 belonging to the respective outer conductor element 4.
  • An insulator element arranged coaxially in a bore 5 of the outer conductor element 4 for the outer conductor element 4 and the inner conductor element 10 is in the case of the in Fig. 1
  • the illustrated variant of a system 1 according to the invention is not provided, so that the air located in the space between the outer conductor element 4 and the inner conductor element 10 serves as an insulator.
  • the individual inner conductor element 10 can be made as a solid, cylindrical or pin-shaped component produced using machining technology or, as will be explained further below, as a hollow cylindrical punched and bent component made of a suitable electrically conductive material.
  • the first contact area 11 of the individual inner conductor element 10 is part of the first electronic assembly 2 Bore 8 and the second contact area 12 of the individual inner conductor element 10 are each inserted into the bore 9 belonging to the second electronic assembly 6 by means of a press fit.
  • each of these two interference fits is in Fig. 1
  • the illustrated first embodiment of a press fit is realized in each case by an elastic first and second contact area 11 and 12.
  • the individual elastic contact area 11 and 12 of the inner conductor element 10 each has at least one axially extending slot-shaped bore, preferably precisely one axially extending slot-shaped bore.
  • the elastic contact area 11 and 12 have an ellipsoidal outer geometry due to the at least one axially extending slot-shaped bore.
  • the outer diameter of the two elastic contact areas 11 and 12 of the inner conductor element 10 in the non-joined state is larger than the inner diameter of the bore 8 and 9 belonging to the first and second electronic assemblies 2 and 6, respectively.
  • the elastic first and second contact areas 11 and 12 of the inner conductor element 10 can, as further below for an inner conductor element 10 implemented as a stamped and bent part, according to FIG Fig. 5 is executed, can also be implemented by means of circumferentially distributed spring tabs.
  • the elastic first and second contact areas 11 and 12 of the inner conductor element 10 are each made hollow-cylindrical and slotted.
  • the inner conductor element 10 has in connection with the first contact area 11 has a region 14 which runs conically in the axial direction.
  • This region 14 of the inner conductor element 10, which runs conically in the axial direction, can preferably also run in the shape of a point or have a point.
  • the carrier or the housing 3 has in the area of the individual bores 8 of the first electronic assembly 2 each have a recess 15 in which the conical area 14 of the inner conductor element 10 in the final assembled state of the inner conductor element 10 without contact with the carrier or is mounted to the housing 3.
  • the surface of the first and second contact areas 11 and 12 of the inner conductor element 10 is knurled.
  • the outer diameter of the knurled first and second contact areas 11 and 12, ie the greatest distance between two opposing elevations of the knurled first and second contact areas 11 and 12, is greater than the inner diameter of the inner conductor element 10 with regard to a press fit when the inner conductor element 10 is not inserted associated bores 8 and 9 of the first and second electronic assembly 2 and 6, respectively.
  • the knurled first and second contact areas 11 and 12 of the inner conductor element 10 are solid, in contrast to the elastic first and second contact areas 11 and 12. It is thus possible, starting from the end face of the second contact area 12 of the inner conductor element 10, to provide a bore 16 with a specific polygonal cross-sectional profile in the second contact area 12.
  • This hole 16 can, as in Fig. 3 is indicated to accommodate a joining tool 17 with an identical polygonal cross-sectional profile. With this joining tool 17, the joining process of the respective inner conductor element 10 into the bores 8 and 9 respectively belonging to the first and second electronic assembly 2 and 6 and into the bore 5 belonging to the respective outer conductor element 4 is facilitated.
  • spring tabs 18 which are directed radially outward and are distributed over the circumference of the connecting area 13 of the inner conductor element 10 can be seen, which are in a directly adjacent to the first contact area 11 Section of the connection area 13 of the inner conductor element 10 are arranged.
  • These spring tabs 18 are preferably connected in one or more parts to a sleeve 19 which is fastened to the connection area 13 in a shoulder in this section of the connection area 13.
  • Spring tabs 18 and sleeve 19 are preferably made of a plastic. Instead of a sleeve 19, other fastening techniques for the individual spring tabs 18 are also possible.
  • the individual spring tabs 18 can be inserted into associated slots in the mentioned section of the connecting area 13 of the inner conductor element 10 by means of a press fit.
  • a funnel-shaped component 24 emerges, which is arranged in the transition area between the outer conductor element 4 and the surface of the first electronic assembly 2 adjoining it.
  • This funnel-shaped component 24 is fastened in the corresponding surface areas of the outer conductor element 4 and / or the first electronic assembly 2 with a suitable connection technique, for example by means of a press fit or gluing.
  • the funnel-shaped component 24 is preferably made from a plastic. In the case of a non-integrated insulator element, the funnel-shaped component 24 serves for better centering or better guidance of the inner conductor element 10 when it is inserted into the bore 8 belonging to the first electronic assembly 2.
  • an improved centering and an associated better guidance of the inner conductor element 10 during the joining process is achieved by inserting an insulator element 20 belonging to the respective coaxial connector.
  • This insulator element 20 is arranged in the respective coaxial plug connector coaxially to the associated inner conductor element 10 and to the associated outer conductor element 4 in the bore 5 belonging to the outer conductor element 4.
  • the integration of the insulator element 20 in the respective coaxial connector reduces the remaining bore diameter from the larger inside diameter of the bore 5 belonging to the outer conductor element 4 to the smaller inside diameter of the bore 21 belonging to the insulator element 20 Bore 21 is typically slightly larger than the outer diameter of the connection area 13 of the inner conductor element 10.
  • the end face of the insulator element 20 directed towards the second electronic assembly 6 and the inner wall of the insulator element 20 is located in the transition between the end face of the insulator element 20 Bore 21 a chamfer 22 is provided.
  • the insulator element 20 has, as in FIG Fig. 4 is indicated, a chamfer 22 on each of the two end-face transitions into the bore 21.
  • the inner conductor element 10 in the previous Figures 1 to 4 at least in the connection area 13 is made solid as a machining component Fig. 5
  • the inner conductor element 10 is a punched and bent component.
  • the surface geometry of the inner conductor element 10 is first punched from a suitable metal sheet metal part.
  • the punched metal part is then turned and additionally suitably bent in the two contact areas 11 and 12.
  • the rotated or bent metal part is latched to one another at the two seams in the connection area 13 of the inner conductor element 10 via one or more lugs or lugs 23 provided at the seams.
  • a mechanically stable inner conductor element 10 with good electrical high-frequency transmission properties is realized using punching and bending technology.

Description

GEBIET DER ERFINDUNGFIELD OF THE INVENTION

Die vorliegende Erfindung betrifft ein Innenleiter-Element für einen koaxialen Steckverbinder zur elektrischen und mechanischen Verbindung zwischen zwei elektronischen Baugruppen.The present invention relates to an inner conductor element for a coaxial connector for the electrical and mechanical connection between two electronic assemblies.

TECHNISCHER HINTERGRUNDTECHNICAL BACKGROUND

Zwischen einzelnen elektronischen Baugruppen für Hochfrequenzanwendungen sind Hochfrequenzsignale auszutauschen. Bei der elektronischen Baugruppe kann es sich hierbei um eine mit Hochfrequenz-Komponenten bestückte Leiterplatte, um eine einzelne Hochfrequenz-Komponente wie beispielsweise ein Hochfrequenz-Filter oder um ein Substrat mit einer integrierten HF-Schaltung handeln. Die Übertragung der einzelnen HF-Signale zwischen den einzelnen elektronischen Baugruppen erfolgt hierbei jeweils über koaxiale Steckverbinder, sogenannte board-to-board-Steckverbinder (deutsch: Baugruppe-zu Baugruppe-Steckverbinder).High-frequency signals are to be exchanged between individual electronic assemblies for high-frequency applications. The electronic assembly can be a printed circuit board equipped with high-frequency components, a single high-frequency component such as a high-frequency filter, or a substrate with an integrated RF circuit. The transmission of the individual RF signals between the individual electronic assemblies takes place via coaxial connectors, so-called board-to-board connectors (German: assembly-to-assembly connector).

Aus der US 6,079,986 A geht beispielsweise ein derartiger koaxialer board-to-board-Steckverbinder hervor.From the U.S. 6,079,986 A such a coaxial board-to-board connector emerges, for example.

Die EP 0 584 902 A1 offenbart Hochfrequenz-Steckverbindungen zwischen mehreren Leiterplatten. Hierzu sind die einzelnen Leiterplatten masseseitig jeweils über ein dazwischen angeordnetes Gehäuse aus Metall verbunden. In einzelnen Bohrungen des Metallgehäuses ist zur Realisierung einer Hochfrequenzverbindung jeweils eine dielektrische Hülse und ein darin geführtes Innenleiterkontaktelement eingefügt.The EP 0 584 902 A1 discloses high frequency connectors between multiple circuit boards. For this purpose, the individual circuit boards are each connected on the ground side via a metal housing arranged between them. A dielectric sleeve and an inner conductor contact element guided therein are inserted into individual bores in the metal housing in order to implement a high-frequency connection.

Ist ein axialer und radialer Versatz zwischen den beiden elektronischen Baugruppen zugelassen, so weist ein derartiger board-to-board-Steckverbinder einen mit der ersten elektronischen Baugruppe verbundenen ersten koaxialen Steckverbinder, einen mit der zweiten elektronischen Baugruppe verbundenen zweiten koaxialen Steckverbinder und ein mit dem ersten und den zweiten koaxialen Steckverbinder beweglich verbundenes koaxiales Adapterteil auf.If an axial and radial offset is permitted between the two electronic assemblies, such a board-to-board connector has a first coaxial connector connected to the first electronic assembly, a second coaxial connector connected to the second electronic assembly and a first coaxial connector and the coaxial adapter part movably connected to the second coaxial connector.

Werden die beiden elektronischen Baugruppen ohne axialen und radialen Versatz miteinander über einen koaxialen Steckverbinder verbunden, so erfolgt die Signalübertragung zwischen den beiden elektronischen Baugruppen über ein mit den beiden elektronischen Baugruppen elektrisch und mechanisch verbundenes Innenleiter-Element und ein dazu koaxial angeordnetes Außenleiter-Element, das mit den beiden elektronischen Baugruppen mechanisch und elektrisch verbunden ist.If the two electronic assemblies are connected to one another via a coaxial connector without axial and radial offset, the signal is transmitted between the two electronic assemblies via an inner conductor element that is electrically and mechanically connected to the two electronic assemblies and an outer conductor element that is arranged coaxially with it is mechanically and electrically connected to the two electronic assemblies.

Eine sichere mechanische Verbindung zwischen dem Innenleiter-Element und der ersten und zweiten elektronischen Baugruppe erfolgt typischerweise jeweils durch eine Presspassung zwischen dem Innenleiter-Element und einer in der ersten bzw. zweiten elektronischen Baugruppe hierfür vorgesehenen Bohrung. Üblicherweise werden das Innenleiter-Element und das Außenleiter-Element zuerst mit der ersten elektronischen Baugruppe und anschließend mit der zweiten elektronischen Baugruppe verbunden.A secure mechanical connection between the inner conductor element and the first and second electronic assemblies is typically made in each case by a press fit between the inner conductor element and a hole provided for this purpose in the first or second electronic assembly. Usually, the inner conductor element and the outer conductor element are first connected to the first electronic assembly and then to the second electronic assembly.

Sind die beiden elektronischen Baugruppen jedoch bereits über das Außenleiter-Element mechanisch und elektrisch miteinander verbunden und ist das zugehörige Innenleiter-Element nachträglich einzufügen und mit den beiden elektronischen Baugruppen ebenfalls zu verbinden, so ist dies insbesondere im Fall einer Presspassung aufgrund des gegenüber dem Innendurchmesser des Außenleiter-Elements vergrößerten Außendurchmessers des Innenleiter-Elements nachteilig nicht möglich.However, if the two electronic assemblies are already mechanically and electrically connected to one another via the outer conductor element and the associated inner conductor element is to be inserted subsequently and with the two electronic ones To also connect assemblies, this is disadvantageously not possible, particularly in the case of a press fit, due to the larger outer diameter of the inner conductor element compared to the inner diameter of the outer conductor element.

Dies ist ein Zustand, den es zu verbessern gilt.This is a condition that needs to be improved.

ZUSAMMENFASSUNG DER ERFINDUNGSUMMARY OF THE INVENTION

Vor diesem Hintergrund liegt der vorliegenden Erfindung die Aufgabe zugrunde, ein System aus zwei elektronischen Baugruppen mit mindestens einem mit den beiden elektronischen Baugruppen jeweils elektrisch und mechanisch verbundenen koaxialen Steckverbinder anzugeben, bei dem das zum jeweiligen koaxialen Steckverbinder jeweils gehörige Innenleiter-Element im letzten Montageschritt eingefügt werden kann. Erfindungsgemäß wird diese Aufgabe durch ein Innenleiter-Element mit den Merkmalen des Patentanspruchs 1, durch ein System aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe mit den Merkmalen des Patentanspruchs 8 und durch ein Verfahren zum Herstellen eines Systems aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe mit den Merkmalen des Patentanspruches 14 gelöst.Against this background, the present invention is based on the object of specifying a system of two electronic assemblies with at least one coaxial connector electrically and mechanically connected to the two electronic assemblies, in which the inner conductor element belonging to the respective coaxial connector is inserted in the last assembly step can be. According to the invention, this object is achieved by an inner conductor element with the features of claim 1, by a system of a first electronic assembly and a second electronic assembly with the features of claim 8 and by a method for producing a system from a first electronic assembly and a second electronic assembly with the features of claim 14 solved.

Demgemäß ist vorgesehen:

  • Ein Innenleiterelement für einen koaxialen Steckverbinder zwischen einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe mit einem ersten Kontaktbereich zum Kontaktieren mit der ersten elektronischen Baugruppe, einem zweiten Kontaktbereich zum Kontaktieren mit der zweiten elektronischen Baugruppe und einem den ersten Kontaktbereich mit dem zweiten Kontaktbereich verbindenden Verbindungsbereich, wobei ein Außendurchmesser des ersten Kontaktbereichs gegenüber einem Außendurchmesser des zweiten Kontaktbereiches verkleinert ist, wobei an einer Oberfläche des Verbindungsbereiches mehrere über einen Umfang des Verbindungsbereiches verteilte und radial nach außen gerichtete Federlaschen befestigt sind.
  • Ein System aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe, wobei die erste elektronische Baugruppe und die zweite elektronische Baugruppe über mindestens einen koaxialen Steckverbinder aus jeweils mindestens einem Innenleiter-Element und einem Außenleiter-Element verbunden ist, wobei das jeweilige Außenleiter-Element jeweils mit der ersten und zweiten elektronischen Baugruppe mechanisch und elektrisch verbunden ist und jeweils eine Bohrung aufweist, in der koaxial zum jeweiligen Außenleiter-Element das zugehörige Innenleiter-Element angeordnet ist, wobei das jeweilige Innenleiter-Element in einer zugehörigen, in der ersten elektronischen Baugruppe befindlichen Bohrung mit der ersten elektronischen Baugruppe und in einer zugehörigen, in der zweiten elektronischen Baugruppe befindlichen Bohrung mit der zweiten elektronischen Baugruppe jeweils mechanisch und elektrisch verbunden ist, wobei ein Innendurchmesser der Bohrung in der ersten elektronischen Baugruppe jeweils gegenüber einem Innendurchmesser der Bohrung in der zweiten elektronischen Baugruppe verkleinert ist.
  • Ein Verfahren zum Herstellen eines Systems aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe, die über mindestens einen koaxialen Steckverbinder miteinander verbunden sind, mit folgenden Verfahrensschritten: Aneinanderfügen der ersten elektronischen Baugruppe, der zweiten elektronischen Baugruppe und jedes zum jeweiligen koaxialen Steckverbinder jeweils gehörigen und zwischen der ersten und der zweiten elektronischen Baugruppe befindlichen Außenleiter-Elements; Verbinden der ersten elektronischen Baugruppe, der zweiten elektronischen Baugruppe und jedes Außenleiter-Elements mittels mehrerer Schraubverbindungen und Einfügen jedes zum jeweiligen koaxialen Steckverbinder jeweils gehörigen Innenleiter-Elements in eine zugehörige, zur ersten elektronischen Baugruppe und zur zweiten elektronischen Baugruppe jeweils gehörige Bohrung mittels Presspassung.
Accordingly, it is provided:
  • An inner conductor element for a coaxial connector between a first electronic assembly and a second electronic assembly with a first contact area for making contact with the first electronic assembly Assembly, a second contact area for contacting the second electronic assembly and a connection area connecting the first contact area to the second contact area, wherein an outer diameter of the first contact area is reduced compared to an outer diameter of the second contact area, wherein on one surface of the connection area several over a circumference of the Connection area distributed and radially outwardly directed spring tabs are attached.
  • A system composed of a first electronic assembly and a second electronic assembly, the first electronic assembly and the second electronic assembly being connected via at least one coaxial connector made up of at least one inner conductor element and one outer conductor element, the respective outer conductor element is mechanically and electrically connected to the first and second electronic assembly and each has a bore in which the associated inner conductor element is arranged coaxially to the respective outer conductor element, the respective inner conductor element being located in an associated, in the first electronic assembly The bore is mechanically and electrically connected to the first electronic assembly and in an associated bore located in the second electronic assembly with the second electronic assembly, an inner diameter of the bore in the first electronic Assembly is reduced in each case compared to an inner diameter of the bore in the second electronic assembly.
  • A method for producing a system from a first electronic assembly and a second electronic assembly, which are connected to one another via at least one coaxial connector, with the following method steps: joining the first electronic assembly, the second electronic assembly and each belonging to the respective coaxial connector outer conductor element located between the first and the second electronic assembly; Connecting the first electronic assembly, the second electronic assembly and each outer conductor element by means of several screw connections and inserting each inner conductor element belonging to the respective coaxial connector into an associated hole belonging to the first electronic assembly and the second electronic assembly by means of a press fit.

Die der vorliegenden Erfindung zugrunde liegende Erkenntnis/Idee besteht darin, den Innendurchmesser der Bohrung in derjenigen elektronischen Baugruppe, durch die das Innenleiter-Element zuerst eingefügt wird, die im Folgenden als zweite elektronische Baugruppe bezeichnet wird, gegenüber dem Innendurchmesser der Bohrung in derjenigen Baugruppe, in die das Innenleiter-Element zuletzt eingefügt wird, die im Folgenden als erste elektronische Baugruppe bezeichnet wird, vergrößert auszuführen. Außerdem ist der Außendurchmesser des Kontaktbereiches des Innenleiter-Elements, der mit der ersten elektronischen Baugruppe verbunden wird und im Folgenden als erster Kontaktbereich bezeichnet wird, gegenüber dem Außendurchmesser des Kontaktbereichs des Innenleiter-Elements, der mit der zweiten elektronischen Baugruppe verbunden wird und im Folgenden als zweiter Kontaktbereich bezeichnet wird, verkleinert ausgeführt. Somit ist es vorteilhaft möglich, das Innenleiter-Element mit seinem ersten Kontaktbereich durch die Bohrung der zweiten elektronischen Baugruppe ohne Beschädigung des ersten Kontaktbereichs des Innenleiter-Elements und der zweiten elektronischen Baugruppe hindurchzuführen und damit eine korrekte mechanische und elektrische Verbindung zwischen dem Innenleiter-Element und der ersten und zweiten elektronischen Baugruppe im eingebauten Endzustand herzustellen.The knowledge / idea on which the present invention is based is to compare the inner diameter of the bore in that electronic assembly through which the inner conductor element is first inserted, which is hereinafter referred to as the second electronic assembly, compared to the inner diameter of the bore in that assembly, in which the inner conductor element is inserted last, which is referred to below as the first electronic assembly, to be carried out enlarged. In addition, the outer diameter of the contact area of the inner conductor element, which is connected to the first electronic assembly and is referred to below as the first contact area, is compared to the outer diameter of the contact area of the inner conductor element, which is connected to the second electronic assembly and is referred to below as second contact area designated is executed downsized. Thus, it is advantageously possible to pass the inner conductor element with its first contact area through the bore of the second electronic assembly without damaging the first contact area of the inner conductor element and the second electronic assembly and thus a correct mechanical and electrical connection between the inner conductor element and to produce the first and second electronic assembly in the final installed state.

Vorteilhafte Ausgestaltungen und Weiterbildungen ergeben sich aus den weiteren Unteransprüchen sowie aus der Beschreibung unter Bezugnahme auf die Figuren der Zeichnung.Advantageous refinements and developments emerge from the further subclaims and from the description with reference to the figures of the drawing.

Es versteht sich, dass die voranstehend genannten und die nachstehend noch zu erläuternden Merkmale nicht nur in der jeweils angegebenen Kombination, sondern auch in anderen Kombinationen oder in Alleinstellung verwendbar sind, ohne den Rahmen der vorliegenden Erfindung zu verlassen.It goes without saying that the features mentioned above and those yet to be explained below can be used not only in the respectively specified combination, but also in other combinations or on their own, without departing from the scope of the present invention.

In einer bevorzugten Ausführung der Erfindung ist der erste Kontaktbereich des Innenleiter-Elements direkt mit der ersten elektronischen Baugruppe und der zweiten Kontaktbereich des Innenleiter-Elements direkt mit der zweiten elektronischen Baugruppe verbunden. Diese direkte Verbindung zwischen dem Innenleiter-Element und der ersten und zweiten elektronischen Baugruppe impliziert, dass keine zusätzlichen Bauteile für die elektrische und mechanische Verbindung zwischen dem Innenleiter-Element und der ersten bzw. zweiten elektronischen Baugruppe erforderlich sind und damit vorteilhaft eine kostengünstige und verschleißminimierte technische Lösung verwirklicht ist.In a preferred embodiment of the invention, the first contact area of the inner conductor element is connected directly to the first electronic assembly and the second contact area of the inner conductor element is connected directly to the second electronic assembly. This direct connection between the inner conductor element and the first and second electronic assembly implies that no additional components are required for the electrical and mechanical connection between the inner conductor element and the first or second electronic assembly and thus advantageously an inexpensive and wear-minimized technical Solution is realized.

Die direkte Verbindung zwischen dem ersten und zweiten Kontaktbereich des Innenleiter-Elements und der ersten bzw. zweiten elektronischen Baugruppe ist insbesondere jeweils eine Presspassung. Eine als Presspassung realisierte Verbindung gewährleistet einerseits eine sichere mechanische Fixierung des Innenleiter-Elements an die erste und zweite elektronische Baugruppe. Andererseits ermöglicht die Presspassung eine Kontaktierung über den gesamten ersten und zweiten Kontaktbereich des Innenleiter-Elements, d.h. entlang der gesamten axialen Erstreckung und des gesamten Umfangs des ersten und zweiten Kontaktbereichs, und der gesamten gegenüberliegenden Innenwandung der Bohrung der ersten bzw. zweiten elektronischen Baugruppe, womit ein optimaler elektrischer Kontakt zwischen dem Innenleiter-Element und der ersten und zweiten elektronischen Baugruppe realisiert ist.The direct connection between the first and second contact area of the inner conductor element and the first or second electronic assembly is in particular an interference fit in each case. A connection implemented as a press fit ensures, on the one hand, a secure mechanical fixation of the inner conductor element to the first and second electronic assembly. On the other hand, the press fit enables contact to be made over the entire first and second contact area of the inner conductor element, ie along the entire axial extent and the entire circumference of the first and second contact area, and the entire opposite inner wall of the bore of the first and second electronic assembly, which means an optimal electrical contact between the inner conductor element and the first and second electronic assembly is realized.

In einer ersten Ausführungsform wird die Presspassung zwischen dem ersten und zweiten Kontaktbereich des Innenleiter-Elements und der ersten bzw. zweiten elektronischen Baugruppe mittels einer radial gerichteten Elastizität des ersten und zweiten Kontaktbereichs realisiert. Diese radial gerichtete Elastizität des ersten und zweiten Kontaktbereichs kann beispielsweise über mindestens eine axial verlaufende schlitzförmige Bohrung, bevorzugt eine einzige axial verlaufende schlitzförmige Bohrung, in Kombination mit einer ellipsoid-förmigen Außengeometrie realisiert sein. Alternativ kann diese radial gerichtete Elastizität im ersten und zweiten Kontaktbereich auch über einen hohlzylindrischen und geschlitzten ersten und zweiten Kontaktbereich verwirklicht sein, der somit jeweils umfänglich verteilte Federlaschen aufweist.In a first embodiment, the press fit between the first and second contact area of the inner conductor element and the first or second electronic assembly is realized by means of a radially directed elasticity of the first and second contact area. This radially directed elasticity of the first and second contact area can be implemented, for example, via at least one axially extending slot-shaped bore, preferably a single axially extending slot-shaped bore, in combination with an ellipsoidal external geometry. Alternatively, this radially directed elasticity in the first and second contact area can also be realized via a hollow cylindrical and slotted first and second contact area, which thus each has spring tabs distributed around the circumference.

In einer zweiten Ausführungsform wird die Presspassung zwischen dem ersten und zweiten Kontaktbereich des Innenleiter-Elements und der ersten bzw. zweiten elektronischen Baugruppe mittels einer gerändelten Oberfläche des ersten und zweiten Kontaktbereichs verwirklicht. Gegenüber einer Presspassung, bei der der erste und zweite Kontaktbereich des Innenleiter-Elements jeweils eine glatte Oberfläche aufweist, führt eine gerändelte Oberfläche zur deutlich verbesserten mechanischen Fixierung des Innenleiter-Elements an die erste und zweite elektronische Baugruppe.In a second embodiment, the press fit between the first and second contact area of the inner conductor element and the first or second electronic assembly is realized by means of a knurled surface of the first and second contact area. Compared to a press fit, in which the first and second contact area of the inner conductor element each have a smooth surface, a knurled surface leads to a significantly improved mechanical fixation of the inner conductor element to the first and second electronic assembly.

In einer bevorzugten Erweiterung der Erfindung schließt sich an den ersten Kontaktbereich ein in axialer Richtung konisch verlaufender Bereich an. Dieser insbesondere eine Spitze aufweisende Bereich dient vorteilhaft zur Zentrierung des Innenleiter-Elements in die zur ersten elektronischen Baugruppe gehörige Bohrung. Der Monteur, der das jeweilige Innenleiter-Element in die Bohrungen der ersten und zweiten elektronischen Baugruppe einfügt, besitzt nach der Hindurchführung des Innenleiter-Elements durch die zur zweiten elektronischen Baugruppe gehörige Bohrung keine Sicht auf die zur ersten elektronischen Baugruppe gehörige Bohrung. Auf diese Weise wird ein Verkannten des Innenleiter-Elements mit dem Außenleiter-Element und/oder mit der innerhalb der Bohrung des Außenleiter-Elements befindlichen Fläche der ersten elektronischen Baugruppe und damit eine unerwünschte Beschädigung der betreffenden Komponenten vermieden.In a preferred extension of the invention, the first contact area is adjoined by an area which runs conically in the axial direction. This region, which has a point in particular, is advantageously used to center the inner conductor element in the hole belonging to the first electronic assembly. The fitter, who inserts the respective inner conductor element into the bores of the first and second electronic assembly, has no view of the bore associated with the first electronic assembly after the inner conductor element has been passed through the bore associated with the second electronic assembly. In this way, misjudging the inner conductor element with the outer conductor element and / or with the surface of the first electronic assembly located within the bore of the outer conductor element and thus undesired damage to the relevant components is avoided.

Eine bessere Zentrierung und damit eine bessere Führung des Innenleiter-Elements im Fügeprozess wird bevorzugt durch ein Isolator-Element erzielt, das im jeweiligen koaxialen Steckverbinder koaxial zum Außenleiter-Element und zum einzufügenden Innenleiter Element in einer Bohrung des Außenleiter-Elements angeordnet ist. Auf diese Weise reduziert sich der Bohrungsdurchmesser beim Fügeprozess des Innenleiter-Elements vom größeren Bohrungsdurchmesser des Außenleiter-Elements zum kleineren Bohrungsdurchmesser des Isolator-Elements. Auf diese Weise werden die Möglichkeit des Verkantens des Innenleiter-Elements und eine daraus folgende Beschädigung der betreffenden Komponenten vorteilhaft zusätzlich reduziert.Better centering and thus better guidance of the inner conductor element in the joining process is preferably achieved by an insulator element which, in the respective coaxial connector, is coaxial with the outer conductor element and with the inner conductor element to be inserted in a bore in the outer conductor element is arranged. In this way, during the joining process of the inner conductor element, the bore diameter is reduced from the larger bore diameter of the outer conductor element to the smaller bore diameter of the insulator element. In this way, the possibility of tilting the inner conductor element and consequent damage to the relevant components are advantageously additionally reduced.

Ergänzend weist der Übergang zwischen der Stirnfläche des Isolator-Elements, die zur zweiten elektronischen Baugruppe gerichtet ist, und der Bohrung des Isolator-Elements bevorzugt eine Fase auf, die ein leichteres Zentrieren des Innenleiter-Elements und damit ein leichteres Einfügen des Innenleiter-Elements in die Bohrung des Isolator-Elements vorteilhaft ermöglicht.In addition, the transition between the end face of the insulator element, which is directed towards the second electronic assembly, and the bore of the insulator element preferably has a bevel, which enables easier centering of the inner conductor element and thus easier insertion of the inner conductor element in allows the bore of the isolator element advantageous.

Im Hinblick auf eine zentrierte Führung des Innenleiter-Elements beim Fügeprozess sind auf der Oberfläche des Verbindungsbereiches, der sich zwischen dem ersten Kontaktbereich und dem zweiten Kontaktbereich des Innenleiter-Elements erstreckt, mehrere über den Umfang des Verbindungsbereiches verteilte und radial nach außen gerichtete Federlaschen befestigt. Diese sind bevorzugt unmittelbar angrenzend an den ersten Kontaktbereich im Verbindungsbereich angeordnet. Auf diese Weise kommen diese Federlaschen im gesteckten Endzustand des Innenleiter-Elements im unmittelbaren Übergangsbereich zwischen der ersten elektronischen Baugruppe und dem Außenleiter-Element zu liegen. Dies ist ein Bereich, in dem die Federlaschen einen geringstmöglich negativen Einfluss auf das Hochfrequenz-Signalübertragungsverhalten des koaxialen Board-to-Board-Steckverbinders ausüben.With regard to a centered guidance of the inner conductor element during the joining process, several spring tabs distributed over the circumference of the connection area and directed radially outward are attached to the surface of the connection area, which extends between the first contact area and the second contact area of the inner conductor element. These are preferably arranged immediately adjacent to the first contact area in the connection area. In this way, in the inserted end state of the inner conductor element, these spring tabs come to lie in the immediate transition area between the first electronic assembly and the outer conductor element. This is an area in which the spring tabs have the least possible negative influence on the high-frequency signal transmission behavior of the coaxial board-to-board connector.

Diese Federlaschen sind besonders bevorzugt aus Kunststoff, d.h. aus einem dielektrischen Material, hergestellt, um den Bereich zwischen dem elektrisch leitenden Innenleiter-Element und dem elektrisch leitenden Außenleiter-Element einzig dielektrisch und damit isolierend zu gestalten. Auf diese Weise wird durch die Befestigung der Federlaschen im Verbindungsbereich des Innenleiter-Elements das Hochfrequenz-Signalübertragungsverhalten des koaxialen Steckverbinders geringstmöglich verschlechtert.These spring tabs are particularly preferably made of plastic, i.e. made of a dielectric material, in order to make the area between the electrically conductive inner conductor element and the electrically conductive outer conductor element only dielectric and thus insulating. In this way, the high-frequency signal transmission behavior of the coaxial connector is worsened as little as possible by the fastening of the spring tabs in the connection area of the inner conductor element.

Im Hinblick auf geringe Herstellungskosten ohne Verschlechterung der mechanischen und elektrischen Eigenschaften ist das Innenleiter-Element als Stanz-Biege-Bauteil hergestellt.With regard to low manufacturing costs without deterioration of the mechanical and electrical properties, the inner conductor element is manufactured as a stamped and bent component.

Im Hinblick auf ein einfaches Einfügen des Innenleiter-Elements in die Bohrungen der ersten und zweiten elektronischen Baugruppe und des zugehörigen Außenleiter-Elements ist an der Stirnfläche des zweiten Kontaktbereiches des Innenleiter-Elements vorteilhaft eine Bohrung zur Aufnahme eines Fügungswerkzeuges vorgesehen.With regard to simple insertion of the inner conductor element into the bores of the first and second electronic assembly and the associated outer conductor element, a bore for receiving a joining tool is advantageously provided on the end face of the second contact area of the inner conductor element.

Eine weitere bevorzugte Maßnahme zur Zentrierung und damit zur optimierten Führung des Innenleiter-Elements beim Fügeprozess stellt im Fall des Fehlens eines Isolatorteil-Elements, d.h. eines mit Luft gefüllten Zwischenraums zwischen dem Innenleiter-Element und dem Außenleiter-Element, ein trichterförmiges Bauteil dar: Diese trichterförmige Bauteil ist zwischen einer Innenwand der zum Außenleiter-Element gehörigen Bohrung und einer zur Bohrung des Außenleiter-Elements gerichteten Fläche der ersten elektronischen Baugruppe befestigt. Dieses trichterförmige Element ermöglicht insbesondere ein leichtes und sicheres Einfügen des Innenleiter-Elements in die zur ersten elektronischen Baugruppe gehörige Bohrung, wenn dem Monteur die Sicht auf die zur ersten elektronischen Baugruppe gehörige Bohrung aufgrund des in die Bohrung der zweiten elektronischen Baugruppe bereits eingeführten Innenleiter-Elements versperrt ist.Another preferred measure for centering and thus for optimized guidance of the inner conductor element during the joining process is a funnel-shaped component in the case of the absence of an insulator part element, ie an air-filled space between the inner conductor element and the outer conductor element The funnel-shaped component is fastened between an inner wall of the bore belonging to the outer conductor element and a surface of the first electronic assembly facing the bore of the outer conductor element. This funnel-shaped element enables in particular an easy and secure insertion of the Inner conductor element into the hole belonging to the first electronic assembly when the fitter's view of the hole belonging to the first electronic assembly is blocked due to the inner conductor element already inserted into the hole of the second electronic assembly.

Die obigen Ausgestaltungen und Weiterbildungen lassen sich, sofern sinnvoll, beliebig miteinander kombinieren. Weitere mögliche Ausgestaltungen, Weiterbildungen und Implementierungen der Erfindung umfassen auch nicht explizit genannte Kombinationen von zuvor oder im Folgenden bezüglich der Ausführungsbeispiele beschriebenen Merkmale der Erfindung. Insbesondere wird dabei der Fachmann auch Einzelaspekte als Verbesserungen oder Ergänzungen zu der jeweiligen Grundform der vorliegenden Erfindung hinzufügen.The above configurations and developments can be combined with one another as desired, provided that it makes sense. Further possible configurations, developments and implementations of the invention also include combinations of features of the invention that are not explicitly mentioned above or below with regard to the exemplary embodiments. In particular, the person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the present invention.

INHALTSANGABE DER ZEICHNUNGCONTENTS OF THE DRAWING

Die vorliegende Erfindung wird nachfolgend anhand der in den schematischen Figuren der Zeichnung angegebenen Ausführungsbeispiele näher erläutert. Es zeigen dabei:

Fig. 1
eine Querschnittsdarstellung eines erfindungsgemäßen Systems aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe mit elastischen Kontaktbereichen des InnenleiterElements,
Fig. 2
eine Querschnittsdarstellung eines erfindungsgemäßen Systems aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe mit gerändelten Kontaktbereichen des Innenleiter-Elements,
Fig. 3
eine Querschnittsdarstellung eines erfindungsgemäßen Systems aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe mit gerändelten Kontaktbereichen des Innenleiter-Elements und integrierten Fügewerkzeug,
Fig. 4
eine Querschnittsdarstellung eines erfindungsgemäßen Systems aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe mit gerändelten Kontaktbereichen des Innenleiter-Elements mit integrierten Isolator-Element und
Fig. 5
eine Querschnittsdarstellung eines erfindungsgemäßen Systems aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe mit elastischen Kontaktbereichen des als Stanz-Biege-Teil realisierten Innenleiter-Elements.
The present invention is explained in more detail below with reference to the exemplary embodiments specified in the schematic figures of the drawing. It shows:
Fig. 1
a cross-sectional view of a system according to the invention composed of a first electronic assembly and a second electronic assembly with elastic contact areas of the inner conductor element,
Fig. 2
a cross-sectional view of a system according to the invention composed of a first electronic assembly and a second electronic assembly with knurled contact areas of the inner conductor element,
Fig. 3
a cross-sectional view of a system according to the invention comprising a first electronic assembly and a second electronic assembly with knurled contact areas of the inner conductor element and an integrated joining tool,
Fig. 4
a cross-sectional view of a system according to the invention composed of a first electronic assembly and a second electronic assembly with knurled contact areas of the inner conductor element with integrated insulator element and
Fig. 5
a cross-sectional representation of a system according to the invention composed of a first electronic assembly and a second electronic assembly with elastic contact areas of the inner conductor element implemented as a stamped and bent part.

Die beiliegenden Figuren der Zeichnung sollen ein weiteres Verständnis der Ausführungsformen der Erfindung vermitteln. Sie veranschaulichen Ausführungsformen und dienen im Zusammenhang mit der Beschreibung der Erklärung von Prinzipien und Konzepten der Erfindung. Andere Ausführungsformen und viele der genannten Vorteile ergeben sich im Hinblick auf die Zeichnungen. Die Elemente der Zeichnungen sind nicht notwendigerweise maßstabsgetreu zueinander gezeigt.The accompanying figures of the drawing are intended to provide a further understanding of the embodiments of the invention. They illustrate embodiments and, in conjunction with the description, serve to explain principles and concepts of the invention. Other embodiments and many of the advantages mentioned emerge with a view to the drawings. The elements of the drawings are not necessarily shown to scale with one another.

In den Figuren der Zeichnung sind gleiche, funktionsgleiche und gleich wirkende Elemente, Merkmale und Komponenten - sofern nichts anderes ausgeführt ist - jeweils mit denselben Bezugszeichen versehen.In the figures of the drawing, identical, functionally identical and identically acting elements, features and components - unless stated otherwise - are each provided with the same reference symbols.

Im Folgenden werden die Figuren zusammenhängend und übergreifend beschrieben.The figures are described in a coherent and comprehensive manner below.

BESCHREIBUNG VON AUSFÜHRUNGSBEISPIELENDESCRIPTION OF EXEMPLARY EMBODIMENTS

Zuerst wird das erfindungsgemäße System 1 aus einer ersten elektronischen Baugruppe und einer zweiten elektronischen Baugruppe anhand der Fig. 1 im Detail erläutert:
Das erfindungsgemäße System 1 weist eine erste elektronische Baugruppe 2 auf. Bei einer elektronischen Baugruppe, insbesondere bei der ersten elektronischen Baugruppe 2, kann es sich um eine Leiterplatte, die mit elektronischen Komponenten, insbesondere mit elektronischen Hochfrequenz-Komponenten, bestückt ist, handeln. Daneben kann die elektronische Baugruppe auch ein Substrat mit integrierten elektronischen Schaltungen, insbesondere mit integrierten Hochfrequenz-Schaltungen, oder ein elektronisches Bauteil, insbesondere ein elektronisches Hochfrequenz-Bauteil wie beispielsweise ein Hochfrequenz-Filter, sein.First, the system 1 according to the invention is composed of a first electronic assembly and a second electronic assembly using FIG Fig. 1 explained in detail:
The system 1 according to the invention has a first electronic assembly 2. An electronic assembly, in particular the first electronic assembly 2, can be a printed circuit board that is equipped with electronic components, in particular with electronic high-frequency components. In addition, the electronic assembly can also be a substrate with integrated electronic circuits, in particular with integrated high-frequency circuits, or an electronic component, in particular an electronic high-frequency component such as a high-frequency filter.

Diese erste elektronische Baugruppe 2 ist, wie in Fig. 1 angedeutet ist, an ein Gehäuse 3 oder an einen Träger 3 befestigt. Die geometrische Anordnung des Gehäuses bzw. des Trägers 3 relativ zur ersten elektronischen Baugruppe 2 kann von der in Fig. 1 dargestellten Anordnung abweichen.This first electronic assembly 2 is, as in FIG Fig. 1 is indicated, attached to a housing 3 or to a carrier 3. The geometric arrangement of the housing or of the carrier 3 relative to the first electronic assembly 2 can be derived from the in Fig. 1 shown arrangement differ.

An der zum Gehäuse oder Träger 3 gegenüberliegenden Oberflächenseite der elektronischen Baugruppe 2 ist für jeden koaxialen Steckverbinder jeweils ein Außenleiter-Element 4 angebracht. Beim Außenleiter-Element 4 handelt es sich bevorzugt um ein rotationssymmetrisches Bauteil, insbesondere um ein zylinderförmiges Bauteil, mit einer zugehörigen und axial verlaufenden Bohrung 5. Alternativ kann das Außenleiter-Element 4 außenseitig auch ein anderes Querschnittsprofil aufweisen. Im Hinblick auf eine gute Hochfrequenz-Übertragungscharakteristik des einzelnen koaxialen Steckverbinders ist das Außenleiter-Element 4 über seine gesamte Stirnfläche direkt ohne Einschluss von Luft mit der ersten elektronischen Baugruppe 3 verbunden.On the surface side of the electronic assembly 2 opposite to the housing or carrier 3, an outer conductor element 4 is attached for each coaxial connector. The outer conductor element 4 is preferably a rotationally symmetrical component, in particular a cylindrical component, with an associated and axial component extending bore 5. Alternatively, the outer conductor element 4 can also have a different cross-sectional profile on the outside. With regard to a good high-frequency transmission characteristic of the individual coaxial plug connector, the outer conductor element 4 is connected over its entire end face directly to the first electronic assembly 3 without the inclusion of air.

An der gegenüberliegenden Stirnfläche des mindestens einen Außenleiter-Elements 4 von mindestens einen koaxialen Steckverbinder ist ebenfalls ohne Einschluss von Luft eine zweite elektronische Baugruppe 6 direkt mit dem mindestens einen Außenleiter-Element 4 von mindestens einem koaxialen Steckverbinder verbunden.On the opposite end face of the at least one outer conductor element 4 of at least one coaxial connector, a second electronic assembly 6 is also connected directly to the at least one outer conductor element 4 of at least one coaxial connector without the inclusion of air.

Jedes Außenleiter-Element 4 des jeweiligen koaxialen Steckverbinders ist aus einem geeigneten elektrisch leitenden Material hergestellt. Durch den direkten Kontakt zwischen den Außenleiter-Elementen 4 der einzelnen koaxialen Steckverbinder und der ersten und zweiten elektronischen Baugruppe 2 und 6 ist jeweils eine sichere elektrische Verbindung zwischen dem jeweiligen Außenleiter-Element 4 und einen zugehörigen elektrischen Kontaktfläche auf der ersten und zweiten elektronischen Baugruppe 2 und 6 gewährleistet.Each outer conductor element 4 of the respective coaxial connector is made of a suitable electrically conductive material. The direct contact between the outer conductor elements 4 of the individual coaxial connectors and the first and second electronic assemblies 2 and 6 creates a secure electrical connection between the respective outer conductor element 4 and an associated electrical contact surface on the first and second electronic assembly 2 and 6 guaranteed.

Eine sichere mechanische Verbindung zwischen der ersten elektronischen Baugruppe 2 und der zweiten elektronischen Baugruppe 2 über das dazwischen befindliche Außenleiter-Element 4 des mindestens einen koaxialen Steckverbinders ist bevorzugt durch Verschraubung mittels mehrerer Schrauben 71 und 72 realisiert. Neben einer Schraubverbindung sind aber auch andere geeignete Verbindungstechniken wie beispielsweise eine Lötverbindung möglich.A secure mechanical connection between the first electronic assembly 2 and the second electronic assembly 2 via the outer conductor element 4 of the at least one coaxial plug connector located between them is preferably implemented by screwing by means of several screws 7 1 and 7 2 . In addition to a screw connection, other suitable connection techniques, such as a soldered connection, are also possible.

Fluchtend zur axial verlaufenden Bohrung 5 des einzelnen Außenleiter-Elements 4 sind in der ersten elektronischen Baugruppe 2 eine Bohrung 8 und in der zweiten elektronischen Baugruppe 6 eine Bohrung 9 vorgesehen, deren Innendurchmesser jeweils typischerweise kleiner als der Innendurchmesser der zum einzelnen Außenleiter-Element 4 jeweils gehörigen Bohrung 5 ausgeführt ist. Erfindungsgemäß ist der Innendurchmesser der zur ersten elektronischen Baugruppe 2 gehörigen Bohrung 8 gegenüber dem Innendurchmesser der zur zweiten elektronischen Baugruppe 6 gehörigen Bohrung 9 verkleinert ausgelegt.Aligned with the axially extending bore 5 of the individual outer conductor element 4, a bore 8 is provided in the first electronic assembly 2 and a bore 9 is provided in the second electronic assembly 6, the inner diameter of which is typically smaller than the inner diameter of the individual outer conductor element 4 Corresponding bore 5 is carried out. According to the invention, the inside diameter of the bore 8 belonging to the first electronic assembly 2 is designed to be smaller than the inside diameter of the bore 9 belonging to the second electronic assembly 6.

Im endmontierten Zustand des erfindungsgemäßen Systems 1 ist in jedem koaxialen Steckverbinder zwischen der ersten und zweiten elektronischen Baugruppe 2 und 6 jeweils ein zum jeweiligen Außenleiter-Element 4 gehöriges Innenleiter-Element 10 koaxial angeordnet. Jedes dieser Innenleiter-Elemente 10 weist einen ersten Kontaktbereichs 11, einem zweiten Kontaktbereichs 12 und einen zwischen dem ersten Kontaktbereich 11 und dem zweiten Kontaktbereich 12 befindlichen Verbindungsbereich 13 auf. Der erste Kontaktbereich 11 des Innenleiter-Elements 10 ist im endmontierten Zustand in der zur ersten elektronischen Baugruppe 2 gehörigen Bohrung 8 eingefügt und direkt elektrisch und mechanisch mit der ersten elektronischen Baugruppe 2 verbunden.In the final assembled state of the system 1 according to the invention, an inner conductor element 10 belonging to the respective outer conductor element 4 is arranged coaxially in each coaxial connector between the first and second electronic assemblies 2 and 6. Each of these inner conductor elements 10 has a first contact area 11, a second contact area 12 and a connection area 13 located between the first contact area 11 and the second contact area 12. In the final assembled state, the first contact area 11 of the inner conductor element 10 is inserted into the bore 8 belonging to the first electronic assembly 2 and is directly connected electrically and mechanically to the first electronic assembly 2.

Äquivalent ist der zweiten Kontaktbereich 12 des Innenleiter-Elements 10 im endmontierten Zustand in der zur zweiten elektronischen Baugruppe 6 gehörigen Bohrung 9 eingefügt und direkt elektrisch und mechanisch mit der zweiten elektronischen Baugruppe 6 verbunden. Der Verbindungsbereich 13 des einzelnen Innenleiter-Elements 13 befindet sich im Bereich der zum jeweiligen Außenleiter-Element 4 gehörigen Bohrung 5. Ein zum Außenleiter-Element 4 und zum Innenleiter-Element 10 koaxial in einer Bohrung 5 des Außenleiter-Elements 4 angeordnetes Isolator-Element ist bei der in Fig. 1 dargestellten Variante eines erfindungsgemäßen Systems 1 nicht vorgesehen, so das als Isolator die im Zwischenraum zwischen dem Außenleiter-Element 4 und den Innenleiter-Element 10 befindliche Luft dient.Equivalently, the second contact area 12 of the inner conductor element 10 in the finally assembled state is inserted into the bore 9 belonging to the second electronic assembly 6 and is directly connected electrically and mechanically to the second electronic assembly 6. The connection area 13 of the individual inner conductor element 13 is located in the area the bore 5 belonging to the respective outer conductor element 4. An insulator element arranged coaxially in a bore 5 of the outer conductor element 4 for the outer conductor element 4 and the inner conductor element 10 is in the case of the in Fig. 1 The illustrated variant of a system 1 according to the invention is not provided, so that the air located in the space between the outer conductor element 4 and the inner conductor element 10 serves as an insulator.

Das einzelne Innenleiter-Element 10 kann als vollmassives, in Zerspanungstechnik hergestelltes zylinder- oder stiftförmiges Bauteil oder, wie noch weiter unten ausgeführt wird, als hohlzylindrisches Stanz-Biege-Bauteil aus einem geeigneten elektrisch leitenden Material hergestellt sein.The individual inner conductor element 10 can be made as a solid, cylindrical or pin-shaped component produced using machining technology or, as will be explained further below, as a hollow cylindrical punched and bent component made of a suitable electrically conductive material.

Im Hinblick auf eine sichere mechanische Verbindung und damit auch eine sichere elektrische Verbindung zwischen dem einzelnen Innenleiter-Element 10 und der ersten und zweiten elektronischen Baugruppe 2 und 6 sind der erste Kontaktbereich 11 des einzelnen Innenleiter-Elements 10 in der zur ersten elektronischen Baugruppe 2 gehörigen Bohrung 8 und der zweite Kontaktbereich 12 des einzelnen Innenleiter-Elements 10 in der zur zweiten elektronischen Baugruppe 6 gehörigen Bohrung 9 jeweils mittels Presspassung eingefügt.With regard to a secure mechanical connection and thus also a secure electrical connection between the individual inner conductor element 10 and the first and second electronic assembly 2 and 6, the first contact area 11 of the individual inner conductor element 10 is part of the first electronic assembly 2 Bore 8 and the second contact area 12 of the individual inner conductor element 10 are each inserted into the bore 9 belonging to the second electronic assembly 6 by means of a press fit.

Jeder dieser beiden Presspassungen ist in der in Fig. 1 dargestellten ersten Ausführungsform einer Presspassung jeweils durch einen elastischen ersten und zweitenKontaktbereich 11 und 12 realisiert. Hierzu weist der einzelne elastische Kontaktbereich 11 und 12 des Innenleiter-Elements 10 jeweils mindestens eine axial verlaufende schlitzförmige Bohrung, bevorzugt genau eine einzige axial verlaufende schlitzförmige Bohrung, auf. Zusätzlich weist der elastische Kontaktbereichs 11 und 12 aufgrund der mindestens einen axial verlaufenden schlitzförmigen Bohrung eine ellipsoid-förmige Außengeometrie auf. Zur Realisierung einer Presspassung ist der Außendurchmesser der beiden elastischen Kontaktbereichen 11 und 12 des Innenleiter-Elements 10 im nicht gefügten Zustand größer als der Innendurchmesser der zur ersten und zweiten elektronischen Baugruppe 2 und 6 jeweils gehörigen Bohrung 8 und 9 ausgelegt.Each of these two interference fits is in Fig. 1 The illustrated first embodiment of a press fit is realized in each case by an elastic first and second contact area 11 and 12. For this purpose, the individual elastic contact area 11 and 12 of the inner conductor element 10 each has at least one axially extending slot-shaped bore, preferably precisely one axially extending slot-shaped bore. In addition, the elastic contact area 11 and 12 have an ellipsoidal outer geometry due to the at least one axially extending slot-shaped bore. To achieve a press fit, the outer diameter of the two elastic contact areas 11 and 12 of the inner conductor element 10 in the non-joined state is larger than the inner diameter of the bore 8 and 9 belonging to the first and second electronic assemblies 2 and 6, respectively.

Alternativ kann der elastische erste und zweite Kontaktbereich 11 und 12 des Innenleiter-Elements 10, wie weiter unten für ein als Stanz-Biege-Teil realisiertes Innenleiter-Element 10 gemäß Fig. 5 ausgeführt ist, auch mittels umfänglich verteilte Federlaschen realisiert sein. Hierzu ist der elastische erste und zweite Kontaktbereich 11 und 12 des Innenleiter-Elements 10 jeweils hohlzylindrisch und geschlitzt ausgeführt.Alternatively, the elastic first and second contact areas 11 and 12 of the inner conductor element 10 can, as further below for an inner conductor element 10 implemented as a stamped and bent part, according to FIG Fig. 5 is executed, can also be implemented by means of circumferentially distributed spring tabs. For this purpose, the elastic first and second contact areas 11 and 12 of the inner conductor element 10 are each made hollow-cylindrical and slotted.

Im Hinblick auf eine gute Zentrierung und damit eine gute Führung des Innenleiter-Elements 10 beim Fügeprozess, insbesondere beim Flügen des Innenleiter-Elements 10 in die zur ersten elektronischen Baugruppe 2 gehörige Bohrung 8, weist das Innenleiter-Element 10 im Anschluss an den ersten Kontaktbereich 11 einen in axialer Richtung konisch verlaufenden Bereich 14 auf. Dieser in axialer Richtung konisch verlaufende Bereich 14 des Innenleiter-Elements 10 kann bevorzugt auch spitzförmig verlaufen oder eine Spitze aufweisen. Der Träger bzw. das Gehäuse 3 weist im Bereich der einzelnen Bohrungen 8 der ersten elektronischen Baugruppe 2 jeweils eine Ausnehmung 15 auf, in der der konisch verlaufende Bereich 14 des Innenleiter-Elements 10 im endmontierten Zustand des Innenleiter-Elements 10 ohne Kontakt zum Träger bzw. zum Gehäuse 3 gelagert ist.With regard to good centering and thus good guidance of the inner conductor element 10 during the joining process, in particular when the inner conductor element 10 is inserted into the bore 8 belonging to the first electronic assembly 2, the inner conductor element 10 has in connection with the first contact area 11 has a region 14 which runs conically in the axial direction. This region 14 of the inner conductor element 10, which runs conically in the axial direction, can preferably also run in the shape of a point or have a point. The carrier or the housing 3 has in the area of the individual bores 8 of the first electronic assembly 2 each have a recess 15 in which the conical area 14 of the inner conductor element 10 in the final assembled state of the inner conductor element 10 without contact with the carrier or is mounted to the housing 3.

Bei einer zweiten Ausführungsform einer Presspassung gemäß Fig. 2 ist die Oberfläche des ersten und zweiten Kontaktbereichs 11 und 12 des Innenleiter-Elements 10 gerändelt. Der Außendurchmesser der gerändelten ersten und zweiten Kontaktbereiche 11 und 12, d.h. der größte Abstand zwischen zwei gegenüberliegenden Erhöhungen der gerändelten ersten und zweiten Kontaktbereiche 11 und 12, ist im nicht eingefügten Zustand des Innenleiter-Elements 10 im Hinblick auf eine Presspassung größer als der Innendurchmesser der zugehörigen Bohrungen 8 und 9 der ersten bzw. zweiten elektronischen Baugruppe 2 und 6 ausgelegt.In a second embodiment of a press fit according to Fig. 2 the surface of the first and second contact areas 11 and 12 of the inner conductor element 10 is knurled. The outer diameter of the knurled first and second contact areas 11 and 12, ie the greatest distance between two opposing elevations of the knurled first and second contact areas 11 and 12, is greater than the inner diameter of the inner conductor element 10 with regard to a press fit when the inner conductor element 10 is not inserted associated bores 8 and 9 of the first and second electronic assembly 2 and 6, respectively.

Die gerändelten ersten und zweiten Kontaktbereiche 11 und 12 des Innenleiter-Elements 10 sind im Gegensatz zu den elastischen ersten und zweiten Kontaktbereichen 11 und 12 massiv. Somit ist es möglich, ausgehend von der Stirnfläche des zweiten Kontaktbereichs 12 des Innenleiter-Elements 10 eine Bohrung 16 mit einem bestimmten mehrkantigen Querschnittsprofil im zweiten Kontaktbereich 12 vorzusehen. Diese Bohrung 16 kann, wie in Fig. 3 angedeutet ist, ein Fügungswerkzeug 17 mit einem identischen mehrkantigen Querschnittsprofil aufnehmen. Mit diesem Fügungswerkzeug 17 erleichtert sich der Fügeprozess des jeweiligen Innenleiter-Elements 10 in die zur ersten und zweiten elektronischen Baugruppe 2 und 6 jeweils gehörigen Bohrungen 8 bzw. 9 und in die zum jeweiligen Außenleiter-Element 4 gehörige Bohrung 5.The knurled first and second contact areas 11 and 12 of the inner conductor element 10 are solid, in contrast to the elastic first and second contact areas 11 and 12. It is thus possible, starting from the end face of the second contact area 12 of the inner conductor element 10, to provide a bore 16 with a specific polygonal cross-sectional profile in the second contact area 12. This hole 16 can, as in Fig. 3 is indicated to accommodate a joining tool 17 with an identical polygonal cross-sectional profile. With this joining tool 17, the joining process of the respective inner conductor element 10 into the bores 8 and 9 respectively belonging to the first and second electronic assembly 2 and 6 and into the bore 5 belonging to the respective outer conductor element 4 is facilitated.

Aus Fig. 2 sind mehrere radial nach außen gerichtete und über dem Umfang des Verbindungsbereiches 13 des Innenleiter-Elements 10 verteilte Federlaschen 18 ersichtlich, die sich in einem zum ersten Kontaktbereich 11 unmittelbar benachbarten Abschnitt des Verbindungsbereiches 13 des Innenleiter-Elements 10 angeordnet sind. Diese Federlaschen 18 sind bevorzugt mit einer Hülse 19 ein- oder mehrteilig verbunden, die in einer Schulter in diesem Abschnitt des Verbindungsbereiches 13 mit dem Verbindungsbereich 13 befestigt ist. Federlaschen 18 und Hülse 19 sind bevorzugt aus einem Kunststoff hergestellt. Anstelle einer Hülse 19 sind auch andere Befestigungstechniken für die einzelnen Federlaschen 18 möglich. Beispielsweise können die einzelnen Federlaschen 18 in zugehörigen Schlitzen im genannten Abschnitt des Verbindungsbereiches 13 des Innenleiter-Elements 10 mittels Presspassung gesteckt sein.Out Fig. 2 Several spring tabs 18 which are directed radially outward and are distributed over the circumference of the connecting area 13 of the inner conductor element 10 can be seen, which are in a directly adjacent to the first contact area 11 Section of the connection area 13 of the inner conductor element 10 are arranged. These spring tabs 18 are preferably connected in one or more parts to a sleeve 19 which is fastened to the connection area 13 in a shoulder in this section of the connection area 13. Spring tabs 18 and sleeve 19 are preferably made of a plastic. Instead of a sleeve 19, other fastening techniques for the individual spring tabs 18 are also possible. For example, the individual spring tabs 18 can be inserted into associated slots in the mentioned section of the connecting area 13 of the inner conductor element 10 by means of a press fit.

Aus Fig. 3 geht schließlich ein trichterförmiges Bauteil 24 hervor, das im Übergangsbereich zwischen dem Außenleiter-Element 4 und der daran angrenzenden Fläche der ersten elektronischen Baugruppe 2 angeordnet ist. Dieses trichterförmige Bauteil 24 ist in den entsprechenden Flächenbereichen des Außenleiter-Elements 4 und/oder der ersten elektronischen Baugruppe 2 mit einer geeigneten Verbindungstechnik, beispielsweise mittels Presspassung oder Klebung, befestigt. Bevorzugt ist das trichterförmige Bauteil 24 aus einem Kunststoff hergestellt. Das trichterförmige Bauteil 24 dient im Fall eines nicht integrierten Isolator-Elements zur besseren Zentrierung bzw. besseren Führung des Innenleiter-Elements 10 beim Einfügen in die zur ersten elektronischen Baugruppe 2 gehörige Bohrung 8.Out Fig. 3 Finally, a funnel-shaped component 24 emerges, which is arranged in the transition area between the outer conductor element 4 and the surface of the first electronic assembly 2 adjoining it. This funnel-shaped component 24 is fastened in the corresponding surface areas of the outer conductor element 4 and / or the first electronic assembly 2 with a suitable connection technique, for example by means of a press fit or gluing. The funnel-shaped component 24 is preferably made from a plastic. In the case of a non-integrated insulator element, the funnel-shaped component 24 serves for better centering or better guidance of the inner conductor element 10 when it is inserted into the bore 8 belonging to the first electronic assembly 2.

In einer weiteren Ausprägung des erfindungsgemäßen Systems 1 gemäß Fig. 4 wird eine verbesserte Zentrierung und eine damit verbundene bessere Führung des Innenleiter-Elements 10 beim Fügeprozess durch Einfügen eines zum jeweiligen koaxialen Steckverbinders gehörigen Isolator-Elements 20 erzielt. Dieses Isolator-Element 20 ist im jeweiligen koaxialen Steckverbinder koaxial zum zugehörigen Innenleiter-Element 10 und zum zugehörigen Außenleiter-Element 4 in der zur Außenleiter-Element 4 gehörigen Bohrung 5 angeordnet. Die Integration des Isolator-Elements 20 in den jeweiligen koaxialen Steckverbinder reduziert den verbleibenden Bohrungsdurchmesser vom größeren Innendurchmesser der zum Außenleiter-Element 4 gehörigen Bohrung 5 zum kleineren Innendurchmesser der zum Isolator-Element 20 gehörigen Bohrung 21. Diese Innendurchmesser der zum Isolator-Element 20 gehörigen Bohrung 21 ist typischerweise geringfügig größer als der Außendurchmesser des Verbindungsbereiches 13 des Innenleiter-Elements 10.In a further embodiment of the system 1 according to the invention according to Fig. 4 an improved centering and an associated better guidance of the inner conductor element 10 during the joining process is achieved by inserting an insulator element 20 belonging to the respective coaxial connector. This insulator element 20 is arranged in the respective coaxial plug connector coaxially to the associated inner conductor element 10 and to the associated outer conductor element 4 in the bore 5 belonging to the outer conductor element 4. The integration of the insulator element 20 in the respective coaxial connector reduces the remaining bore diameter from the larger inside diameter of the bore 5 belonging to the outer conductor element 4 to the smaller inside diameter of the bore 21 belonging to the insulator element 20 Bore 21 is typically slightly larger than the outer diameter of the connection area 13 of the inner conductor element 10.

Im Hinblick auf ein leichtes und sicheres Einfügen des Innenleiter-Elements 10 in die zum Isolator-Element 20 gehörige Bohrung 21 ist im Übergang zwischen der zur zweiten elektronischen Baugruppe 6 gerichteten Stirnfläche des Isolator-Elements 20 und der Innenwandung der zum Isolator-Element 20 gehörigen Bohrung 21 eine Fase 22 vorgesehen. Um das Isolator-Element 20 universell jeweils in seinen beiden Orientierungen in die Bohrung 5 des Außenleiter-Elements 4 einführen zu können, weist das Isolator-Element 20, wie in Fig. 4 angedeutet ist, an beiden stirnseitigen Übergängen in die Bohrung 21 jeweils eine Fase 22 auf.With a view to easy and safe insertion of the inner conductor element 10 into the bore 21 belonging to the insulator element 20, the end face of the insulator element 20 directed towards the second electronic assembly 6 and the inner wall of the insulator element 20 is located in the transition between the end face of the insulator element 20 Bore 21 a chamfer 22 is provided. In order to be able to universally introduce the insulator element 20 in each of its two orientations into the bore 5 of the outer conductor element 4, the insulator element 20 has, as in FIG Fig. 4 is indicated, a chamfer 22 on each of the two end-face transitions into the bore 21.

Während das Innenleiter-Element 10 in den bisherigen Figuren 1 bis 4 zumindest im Verbindungsbereich 13 jeweils vollmassiv als Zerspanungs-Bauteil ausgeführt ist, stellt Fig. 5 das Innenleiter-Element 10 als Stanz-Biege-Bauteil dar. Hierzu wird zuerst die Oberflächengeometrie des Innenleiter-Elements 10 aus einem geeigneten metallenen Blechteil gestanzt. Das gestanzte Metallteil wird anschließend gedreht und in den beiden Kontaktbereichen 11 und 12 zusätzlich geeignet gebogen. Schließlich wird das gedrehte bzw. gebogene Metallteil an den beiden Nahtstellen im Verbindungsbereich 13 des Innenleiter-Elements 10 über eine oder mehrere an den Nahtstellen jeweils vorgesehene Nase bzw. Nasen 23 miteinander verklinkt. Auf diese Weise wird in Stanz-Biege-Technologie ein mechanisch stabiles Innenleiter-Element 10 mit guten elektrischen Hochfrequenzübertragungseigenschaften verwirklicht.While the inner conductor element 10 in the previous Figures 1 to 4 at least in the connection area 13 is made solid as a machining component Fig. 5 the inner conductor element 10 is a punched and bent component. For this purpose, the surface geometry of the inner conductor element 10 is first punched from a suitable metal sheet metal part. The punched metal part is then turned and additionally suitably bent in the two contact areas 11 and 12. Finally, the rotated or bent metal part is latched to one another at the two seams in the connection area 13 of the inner conductor element 10 via one or more lugs or lugs 23 provided at the seams. In this way, a mechanically stable inner conductor element 10 with good electrical high-frequency transmission properties is realized using punching and bending technology.

Obwohl die vorliegende Erfindung anhand bevorzugter Ausführungsbeispiele vorstehend vollständig beschrieben wurde, ist sie darauf nicht beschränkt, sondern auf vielfältige Art und Weise modifizierbar.Although the present invention has been fully described above on the basis of preferred exemplary embodiments, it is not restricted thereto, but rather can be modified in many different ways.

BezugszeichenlisteList of reference symbols

11
System aus erster und zweiter elektronischer BaugruppeSystem made up of a first and a second electronic assembly
22
erste elektronische Baugruppefirst electronic assembly
33
Gehäuse bzw. TrägerHousing or carrier
44th
Außenleiter-ElementOuter conductor element
55
Bohrung des Außenleiter-ElementsHole in the outer conductor element
66th
zweite elektronische Baugruppesecond electronic assembly
71, 72 7 1 , 7 2
SchraubenScrews
88th
Bohrung der ersten elektronischen BaugruppeDrilling of the first electronic assembly
99
Bohrung der zweiten elektronischen BaugruppeDrilling of the second electronic assembly
1010
Innenleiter-ElementInner conductor element
1111
erster Kontaktbereichfirst contact area
1212th
zweiter Kontaktbereichsecond contact area
1313th
VerbindungsbereichConnection area
1414th
konisch geformter Bereichconical shaped area
1515th
Ausnehmung im Gehäuse bzw. TrägerRecess in the housing or carrier
1616
Bohrung im ersten KontaktbereichHole in the first contact area
1717th
FügungswerkzeugJoining tool
1818th
FederlaschenSpring tabs
1919th
HülseSleeve
2020th
Isolator-ElementIsolator element
2121
Bohrung im Isolator-ElementHole in the isolator element
2222nd
Fase im Isolator-ElementChamfer in the isolator element
2323
Nasenose
2424
trichterförmiges Bauteilfunnel-shaped component

Claims (15)

  1. An inner conductor element (10) for a coaxial plug connector between a first electronic subassembly (2) and a second electronic subassembly (6) having a first contact region (11) for making contact with the first electronic subassembly (2), a second contact region (12) for making contact with the second electronic subassembly (6) and a connection region (13) connecting the first contact region (11) to the second contact region (12), wherein the outer diameter of the first contact region (11) is reduced compared to an outer diameter of the second contact region (12),
    characterized in
    that a plurality spring tabs (18) distributed over a circumference of the connection region (13) and directed radially outwards are fastened to a surface of the connection region (13).
  2. The inner conductor element (10) according to patent claim 1,
    characterized in
    that the first contact region (11) and/or the second contact region (12) in each case has a radially directed elasticity.
  3. The inner conductor element (10) according to patent claim 1,
    characterized in
    that a surface of the first contact region (11) and/or the second contact region (12) is knurled.
  4. The inner conductor element (10) according to any one of patent claims 1 to 3,
    characterized in
    that a region (14), which extends conically in the axial direction, is connected to the first contact region (11).
  5. The inner conductor element (10) according to any one of patent claims 1 to 5
    characterized in
    that each spring tab (18) is made of plastic.
  6. The inner conductor element (10) according to any one of patent claims 1 to 5
    characterized in
    that the inner conductor element (10) is realized as a stamped and bent part.
  7. The inner conductor element (10) according to any one of patent claims 1 to 6
    characterized in
    that a bore (16) is provided on an end face of the second contact region (12) for receiving a joining tool (17).
  8. A system (1) consisting of a first electronic subassembly and a second electronic subsystem, wherein the first electronic subsystem (2) and the second electronic subsystem (6) is connected via at least one coaxial plug connector consisting in each case of at least one inner conductor element (10) according to any one of patent claims 1 to 7 and an outer conductor element (4), wherein the respective outer conductor element (4) in each case is connected mechanically and electrically to the first and second electronic subassembly (2, 6) and in each case has a bore (5), in which the associated inner conductor element (10) is arranged coaxially to the respective outer conductor element (4), wherein the respective inner conductor element (10) in an associated bore (8) located in the first electronic subassembly (2) is mechanically and electrically connected to the first electronic subassembly (2) and in an associated bore (9) located in the second electronic subassembly (6) is mechanically and electrically connected to the second electronic subassembly (6), wherein the inner diameter of the bore (8) in the first electronic subassembly (2) is in each case reduced compared to an inner diameter of the bore (9) in the second electronic subassembly (6).
  9. The system (1) according to patent claim 8,
    characterized in
    that the respective inner conductor element (10) is in each case directly connected to the first and second electronic subassembly (2, 6).
  10. The system (1) according to patent claim 8 or 9,
    characterized in
    that the respective inner conductor element (10) is fastened in each case by means of a press fit in the associated bore (8, 9) of the first and second electronic subassembly (2, 6).
  11. The system (1) according to any one of patent claims 8 to 10,
    characterized in
    that an insulator element (20) is arranged between the respective inner conductor element (10) and the respective outer conductor element (4) coaxially to the respective inner conductor element (10) and to the respective outer conductor element (4).
  12. The system (1) according to patent claim 11,
    characterized in
    that between an end face of the insulator element (20) directed towards the second electronic subassembly (6) and an inner wall of a bore (21) belonging to the insulator element (20) a chamfer (22) is provided for centering the inner conductor element (10).
  13. The system (1) according to any one patent claims 8 to 10,
    characterized in
    that a funnel-shaped component (24) for centering the inner conductor element (10) is fastened between an inner wall of the bore (5) belonging to the outer conductor element (4) and a surface of the first electronic subassembly (2) directed towards the bore (5) of the outer conductor element (4).
  14. A method for producing a system (1) consisting of a first electronic subassembly and a second electronic subassembly, which are connected with one another via at least one coaxial plug connector, having the following method steps:
    • Joining together the first electronic subassembly (2), the second electronic subassembly (6) and each outer conductor element (4) belonging in each case to the respective coaxial plug connector and located between the first and the second electronic subassembly (2, 6),
    • Connecting the first electronic subassembly (2), the second electronic subassembly (6) and each outer conductor element (4) by means of a plurality of screw connections and
    • Inserting each inner conductor element (10) belonging in each case to the respective coaxial plug connector into an associated bore (8, 9) belonging in each case to the first electronic subassembly (2) and to the second electronic subassembly (6) by means of a press fit.
  15. The method according to patent claim 14,
    characterized in
    that for each coaxial plug connector in each case an insulator element (20) is inserted into a bore (5) of the associated outer conductor element (4) between the first electronic subassembly (2) and the second electronic subassembly (6).
EP17800508.8A 2017-03-10 2017-11-16 Inner conductor element and method of producing a system Active EP3593412B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017002307.7A DE102017002307A1 (en) 2017-03-10 2017-03-10 INSIDE WIRE ELEMENT
PCT/EP2017/079366 WO2018162098A1 (en) 2017-03-10 2017-11-16 Inner conductor element

Publications (2)

Publication Number Publication Date
EP3593412A1 EP3593412A1 (en) 2020-01-15
EP3593412B1 true EP3593412B1 (en) 2021-03-10

Family

ID=60382210

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17800508.8A Active EP3593412B1 (en) 2017-03-10 2017-11-16 Inner conductor element and method of producing a system

Country Status (5)

Country Link
US (1) US10847907B2 (en)
EP (1) EP3593412B1 (en)
CN (1) CN110383585B (en)
DE (1) DE102017002307A1 (en)
WO (1) WO2018162098A1 (en)

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DE102018100557A1 (en) * 2017-12-21 2019-06-27 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Circuit board assembly, connecting element and method for assembling at least one connecting element
CN112913085B (en) 2018-11-12 2024-01-02 胡贝尔舒纳公司 Printed circuit board connector
CN112913084B (en) * 2018-11-12 2024-02-23 胡贝尔舒纳公司 Connector and board-to-board connector assembly
DE102022205764A1 (en) 2022-06-07 2023-12-07 Borgwarner Inc. SPACER ELEMENT FOR A CIRCUIT BOARD ARRANGEMENT

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Also Published As

Publication number Publication date
US10847907B2 (en) 2020-11-24
EP3593412A1 (en) 2020-01-15
US20200243991A1 (en) 2020-07-30
WO2018162098A1 (en) 2018-09-13
CN110383585B (en) 2021-02-23
CN110383585A (en) 2019-10-25
DE102017002307A1 (en) 2018-09-13

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