EP3583623A1 - Solder preform for diffusion soldering, method for the production thereof and method for the assembly thereof - Google Patents

Solder preform for diffusion soldering, method for the production thereof and method for the assembly thereof

Info

Publication number
EP3583623A1
EP3583623A1 EP18722915.8A EP18722915A EP3583623A1 EP 3583623 A1 EP3583623 A1 EP 3583623A1 EP 18722915 A EP18722915 A EP 18722915A EP 3583623 A1 EP3583623 A1 EP 3583623A1
Authority
EP
European Patent Office
Prior art keywords
solder
layers
solder preform
diffusion
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18722915.8A
Other languages
German (de)
French (fr)
Inventor
Christian Schellenberg
Jörg Strogies
Klaus Wilke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP3583623A1 publication Critical patent/EP3583623A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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    • B23K35/3033—Ni as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/16—Layered products comprising a layer of metal next to a particulate layer
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83399—Material
    • H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/83447—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/8382—Diffusion bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/8382—Diffusion bonding
    • H01L2224/83825—Solid-liquid interdiffusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the invention relates to a solder preform for diffusion soldering, comprising a sandwich structure (hereinafter referred to as sandwich) comprising first layers of a first material and second layers of a second material, the first layers and the second layers alternating in the sandwich.
  • sandwich a sandwich structure
  • the invention relates to a method for producing a solder preform, are layered in the first layers of a first Materi ⁇ than and second layers of a second material to a sand ⁇ wich, wherein the first layers and the second layers in the sandwich alternate with each other.
  • the invention also relates to a method for joining a
  • the joining partners can provide contact materials made of copper, for example.
  • the diffusion solder may be a tin-containing solder material. Due to the diffusion of copper into the solder material during the formation of the soldered connections ⁇ bond then a diffusion zone which is formed by an intermetallic compound between copper and tin is formed becomes. This has a melting point of about 420 °, which is thus clearly above the melting temperature of the tin-based solder material. Due to the necessary Diffu ⁇ sion processes, the diffusion zone can not extend arbitrarily deep into the solder material. Therefore, the soldering connection to be formed is limited to a certain thickness.
  • the solder material at Verflüs ⁇ s In the space between the flexible molding from ⁇ fills.
  • the molding provides the material available, which can diffuse into the solder material. Characterized in that the diffusing material not only by the boundary ⁇ surfaces of the joining partners, but also inside the
  • Solder connection is available, can form a continuous diffusion zone between the joining partners even at a larger joint gap.
  • Feil also describes another way of forming DiffusionslötMISen, in which instead of the flexible molding, a metallic powder is used, for.
  • a metallic powder is used, for.
  • ferpulver This material is added to the solder material and, dispersedly distributed in the solder material, makes available the material which can diffuse into the solder connection while forming the diffusion zone. This also makes it possible to produce a diffusion zone in the solder joint which bridges the gap between the two joining partners.
  • Diffusionslöteducationen between two joining partners can be produced by diffusion of Bestteil turnover from a liquid phase into a solid phase during soldering.
  • a brazing material containing two components is used between the joining partners.
  • a Lotformteil between the joining partners is placed, which consists of a sandwich of layers of the first
  • the use of solder preforms requires a high Rezisi ⁇ on in the production of the solder joints, as these have to touch to form a reliable contact both joined and the diffusion paths in which auslagen- not have been too large to solder joint. This precision is associated with a certain manufacturing effort (such as a high degree of parallelism of the surfaces to be joined) and the resulting costs.
  • the object of the invention is to provide a solder preform for diffusion soldering, a method for its production and a method for its assembly between two joining partners, wherein with the solder preform solder joints adopted güns ⁇ term and can be produced with improved process capability.
  • the first material as metal- is formed from which the first layers Best ⁇ hen.
  • the second material consists of metallic particles which form a paste with a binder, wherein the two ⁇ th layers consist of the paste. From the first material and the second material, a diffusion zone can thus be produced in the solder joint forming during soldering, which preferably consists of intermetallic compounds.
  • the paste can serve as a tolerance compensation, since this is deformable before soldering and therefore the solder preform can be compressed as a whole in the joining direction. The paste is partially displaced from the gap between two adjacent foils.
  • the paste undergoes a certain volume shrinkage during the soldering process, since the binder escapes from the solder joint during the soldering process.
  • the volume shrinkage supports the bridging of manufacturing and Montageto ⁇ leranzen, as this can vary within certain limits.
  • the first material is a solder material and the second material has a higher melting point than the first material.
  • the first material may, for example, a zinnbasierter solder material (in particular a tin-silver-copper solder such as SAC305, with Alloy ⁇ composition Sn96, 5Ag3Cu0, 5, or a tin-copper solder, for example, with the alloy composition Sn99, 3Cu0 7), while the second material is a metal which dissolves in and diffuses into the tin material, preferably copper.
  • the copper material is then fixed by means of the binder, for example by a stencil printing process, between the sheets of the first material, the diffusion paths of the particulate material being determined by the thickness of the sheet of solder material.
  • the second material is a solder material and the first material has a higher melting point. points as the second material.
  • the films of the first material can advantageously be made very thin, wherein the second material is applied in the form of a solder material on the films.
  • a stencil printing method known per se can be used.
  • the object stated at the outset is also achieved by a method for producing a solder preform by forming the first material as a metallic foil, from which the first layers are produced and the second material consists of metallic particles which are added with a binder a paste are processed, wherein the second layers are made from the paste.
  • a method for producing a solder preform by forming the first material as a metallic foil, from which the first layers are produced and the second material consists of metallic particles which are added with a binder a paste are processed, wherein the second layers are made from the paste.
  • Sandwich structure in relation to the gap to be bridged must be increased.
  • solder preforms are produced at the same time by producing the sandwich structure with an area larger than that of the solder preforms and separating the solder preforms from this.
  • a large-area semifinished product is produced, which can be made particularly simple to ⁇ particular with a stencil printing process. This is then separated into the solder preforms. This can be done for example by punching or laser cutting.
  • the solder preforms can be produced in large numbers and, for example, on tapes for the electronics assembly for placement on Heidelbergungsträ ⁇ like to be made available.
  • the stated object is achieved with the initially stated method for joining a diffusion solder joint according to the invention in that a solder preform of the type already described is used. It is particularly advantageous if a solder preform with a used the shrinkage of the solder ⁇ material is considered excess. Outside which a diffusion soldering the tolerances of the end considered excessive may be provided which insbeson ⁇ particular the shrinkage of the solder material be considered excessive is superimposed. As a result, it is advantageously possible to produce diffusion-bonded diffusion joints having high reliability, wherein solder preforms which are cost-effective to manufacture and can be kept in large numbers in the assembly process can be used for this purpose. In particular, a joining is the
  • Figure 3 to 5 selected method steps of exporting approximately ⁇ example the procedure according to the invention Rens ge ⁇ cut for producing a solder preform
  • FIGS. 6 and 7 show selected method steps of exemplary embodiments of the method according to the invention for joining a diffusion solder joint, cut or as a side view.
  • a solder preform 11 according to Figure 1 consists of first layers 12 and second layers 13, which are arranged alternately ( ⁇ represent provided on the left side of a broken line 17).
  • the ers ⁇ th layers 12 are made of a metallic foil 14, which are manufactured in accordance with Figure 1 of a solder material, such as a tin-silver-copper alloy (or other Zinnbasisle- yaw).
  • the second layers 13 consist of a paste, wherein particles 15 are ver ⁇ shares in a binder 16.
  • the particles 15 are made of copper. Alternatively, these may also be formed by nickel.
  • FIG. 1 shows a diffusion solder joint on the right side of the fault line 17 even after the solder molding 11 has been soldered.
  • the reduction in the thickness of the second layers 13 has another reason.
  • Part of the copper is in fact diffused into the first layers 12, so that here Diffusi ⁇ onszonen arise.
  • the first layers 12 are made entirely of the intermetallic compound.
  • the first layers 12 are formed from film 14 made of copper, while the second layers 13 are formed from the paste consisting of particles 15 of a tin-containing solder material and a binder 16.
  • the uppermost layer and the lowermost layer which respectively form the upper joining surface 18 and the lower joining surface 19, made of the solder material, so that a connection to the on adjacent joining partners is possible ( see Figure 6).
  • a multiplicity of solder semi-finished products 11 can be produced from the sandwich construction according to FIG. 4 by separating them by a saw, a punching tool or a knife 22, for example.
  • the knife 22 (or the punch or the saw) cuts along the indicated Dash-dot lines the sandwich structure of Figure 4 in the semi-finished solder 11 with the required size.
  • DiffusionslötMISen 23 can be produced, which connect a first joining partner 24 with a second joining partner 25 and a third joining partner 26.
  • the first joining partner 24 according to FIG. 6 is power semiconductor components which are fastened on the second joining partner 25 of a printed circuit board via the diffusion solder joints 23.
  • the first joining partners 24 on the opposite top also be produced.
  • Diffusion solder joints 23 according to Figure 6 of different thickness, with a tolerance compensation in each case by the second layers (not shown in Figure 6) can take place, which can be compressed more or less strongly depending on tolerance when joining the joining partners.
  • Figure 7 is ones shown, situated in a higher level of detail as the first joining parts 24 in the form of a Bauele ⁇ ment can be connected in the form of a printed circuit board via the diffusion soldering with the second joining partner 25th
  • Both the first joint partner 24 and the second joint partner 25 have metallizations 27 made of copper, to which the solder preform 11 is adjacent.
  • soldering mate ⁇ rial diffuses the metallization 27 in the forming

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to a solder preform (11) for diffusion soldering. This consists of metal films (12), between which a paste (16) containing particles (15) is retained. The particles can consist of a soldering material, for example, while the films (12) consist of copper, for example. With the forming of the solder connection, intermetallic connections of the diffusion solder connection occur in a diffusion zone. The advantage of the use of a paste for producing the sandwich structure in the solder preform (11) lies in the fact that production is simplified and the paste (16) can guarantee a tolerance compensation to a certain extent. As well as the solder preform (11), the invention also relates to a method for producing a solder preform of this type, and a method for forming a diffusion solder connection with this solder preform.

Description

Beschreibung description
Lotformteil zum Diffusionslöten, Verfahren zu dessen Lotformteil for diffusion soldering, method for its
Herstellung und Verfahren zu dessen Montage Production and method for its assembly
Die Erfindung betrifft ein Lotformteil zum Diffusionslöten, aufweisend einen Sandwichaufbau (im Folgenden kurz Sandwich) , bestehend aus ersten Lagen eines ersten Materials und aus zweiten Lagen eines zweiten Materials, wobei die ersten Lagen und die zweiten Lagen in dem Sandwich einander abwechseln. Außerdem betrifft die Erfindung ein Verfahren zum Erzeugen eines Lotformteils, bei dem erste Lagen eines ersten Materi¬ als und zweite Lagen eines zweiten Materials zu einem Sand¬ wich geschichtet werden, wobei die ersten Lagen und die zwei- ten Lagen in dem Sandwich einander abwechseln. Zuletzt betrifft die Erfindung auch ein Verfahren zum Fügen einer The invention relates to a solder preform for diffusion soldering, comprising a sandwich structure (hereinafter referred to as sandwich) comprising first layers of a first material and second layers of a second material, the first layers and the second layers alternating in the sandwich. In addition, the invention relates to a method for producing a solder preform, are layered in the first layers of a first Materi ¬ than and second layers of a second material to a sand ¬ wich, wherein the first layers and the second layers in the sandwich alternate with each other. Finally, the invention also relates to a method for joining a
Diffusionslötverbindung, bei dem ein Lotformteil zwischen einem ersten Fügepartner und einem zweiten Fügepartner platziert wird und das Lotformteil unter Ausbildung der Diffusionslötverbindung in which a solder preform is placed between a first joining partner and a second joining partner and the solder preform to form the
Diffusionslötverbindung aufgeschmolzen wird. Diffusionslötverbindung is melted.
Die Verwendung von Diffusionslötverbindungen zum Montieren zweier Fügepartner ist beispielsweise aus der DE The use of Diffusionslötverbindungen for mounting two joining partners is for example from DE
10 2013 219 642 AI bekannt. Beim Ausbilden von Diffusionslöt- Verbindungen zwischen den Fügepartnern entsteht aufgrund von Diffusionsvorgängen eine Lötverbindung, welche eine intermetallische Phase aufweist, die einen höheren Schmelzpunkt hat als die restliche aus der Lotlegierung bestehenden  10 2013 219 642 AI known. When forming diffusion solder joints between the joining partners, a solder joint having an intermetallic phase having a higher melting point than the rest of the solder alloy is formed due to diffusion
Lötverbindung. Hierdurch ist es möglich, die Verbindung zwi- sehen den Fügepartnern thermisch und mechanisch zu stabilisieren . Solder joint. This makes it possible to thermally and mechanically stabilize the connection between the joining partners.
Die Fügepartner können beispielsweise Kontaktmaterialien aus Kupfer zur Verfügung stellen. Das Diffusionslot kann ein Zinn enthaltender Lotwerkstoff sein. Durch die Diffusion von Kupfer in das Lotmaterial während des Ausbildens der Lötver¬ bindung entsteht dann eine Diffusionszone, welche durch eine intermetallische Verbindung zwischen Kupfer und Zinn gebildet wird. Diese weist einen Schmelzpunkt von ungefähr 420° auf, der damit eindeutig über der Schmelztemperatur des zinnbasierten Lotwerkstoffs liegt. Aufgrund der notwendigen Diffu¬ sionsvorgänge kann die Diffusionszone nicht beliebig tief in den Lotwerkstoff hineinreichen. Daher ist die auszubildende Lötverbindung auf eine bestimmte Dicke beschränkt. Gemäß der DE 10 2013 219 642 AI wird daher vorgeschlagen, zumindest einen der Fügepartner so zu gestalten, dass Hohlräume im Bereich des Fügespalts zwischen den Fügepartnern entstehen. Diese können beispielsweise durch Vorsehen von Vertiefungen in der Montagefläche eines der Fügepartner ausgebildet wer¬ den. Sie dienen beim Fügen dann als Pufferräume, in die überschüssiges Lotmaterial entweichen kann, damit auch bei Auf¬ treten von Mengentoleranzen eine Spaltbreite zwischen den Fü- gepartnern gewährleistet werden kann, die die zuverlässige Ausbildung einer Diffusionszone über die gesamte Breite des Fügespalts sicherstellt. The joining partners can provide contact materials made of copper, for example. The diffusion solder may be a tin-containing solder material. Due to the diffusion of copper into the solder material during the formation of the soldered connections ¬ bond then a diffusion zone which is formed by an intermetallic compound between copper and tin is formed becomes. This has a melting point of about 420 °, which is thus clearly above the melting temperature of the tin-based solder material. Due to the necessary Diffu ¬ sion processes, the diffusion zone can not extend arbitrarily deep into the solder material. Therefore, the soldering connection to be formed is limited to a certain thickness. According to DE 10 2013 219 642 A1 it is therefore proposed to design at least one of the joining partners in such a way that cavities arise in the region of the joint gap between the joining partners. These can ¬ the example, by providing recesses in the mounting surface of one of the joining partners is formed. They thus also in In ¬ come from quantity tolerances can escape into the excess solder material, a gap width between the R & D can be ensured gepartnern that ensures the reliable formation of a diffusion zone across the entire width of the joint gap are used when joining as a buffer spaces.
Gemäß D. Feil: „Fügekonzepte für Leistungsmodule an Kühlkör- pern", Elektronische Baugruppen und Leiterplatten, Seiten 60 - 64, Berlin, Offenbach, 2016 ist es außerdem bekannt, dass bei der Ausbildung von Diffusionslötverbindungen auch größere Fügespalte zwischen den Fügepartnern überbrückt werden können, wenn ein flexibles Formteil, wie z. B. ein Kupfernetz, in den Fügespalt eingelegt wird. Auf diesem kann eine According to D. Feil: "Joining Concepts for Power Modules on Heat Sinks", Electronic Assemblies and Printed Circuit Boards, pages 60 - 64, Berlin, Offenbach, 2016, it is also known that larger diffusion gaps between the joining partners can be bridged when forming diffusion solder joints , if a flexible molding, such as a copper net, in the joint gap is inserted
Lotfolie platziert werden, wobei das Lotmaterial bei Verflüs¬ sigung die Zwischenräume zwischen dem flexiblen Formteil aus¬ füllt. Das Formteil stellt dabei das Material zur Verfügung, welches in den Lotwerkstoff eindiffundieren kann. Dadurch, dass das diffundierende Material nicht nur durch die Grenz¬ flächen der Fügepartner, sondern auch im Inneren der Lotfolie be placed, the solder material at Verflüs ¬ sigung the spaces between the flexible molding from ¬ fills. The molding provides the material available, which can diffuse into the solder material. Characterized in that the diffusing material not only by the boundary ¬ surfaces of the joining partners, but also inside the
Lötverbindung zur Verfügung steht, kann sich eine durchgehende Diffusionszone zwischen den Fügepartnern auch bei einem größeren Fügespalt ausbilden. Solder connection is available, can form a continuous diffusion zone between the joining partners even at a larger joint gap.
Feil beschreibt auch eine andere Möglichkeit des Ausbildens von Diffusionslötverbindungen, bei der statt des flexiblen Formteils ein metallisches Pulver verwendet wird, z. B. Kup- ferpulver. Dieses wird dem Lotmaterial beigemengt und stellt dispers verteilt im Lotwerkstoff das Material zur Verfügung, welches unter Ausbilden der Diffusionszone in die Lötverbindung eindiffundieren kann. Auch hierdurch lässt sich in der Lötverbindung eine Diffusionszone erzeugen, die den Spalt zwischen den beiden Fügepartnern überbrückt. Feil also describes another way of forming Diffusionslötverbindungen, in which instead of the flexible molding, a metallic powder is used, for. For example ferpulver. This material is added to the solder material and, dispersedly distributed in the solder material, makes available the material which can diffuse into the solder connection while forming the diffusion zone. This also makes it possible to produce a diffusion zone in the solder joint which bridges the gap between the two joining partners.
Gemäß der US 2009/004500 AI ist es bekannt, dass According to US 2009/004500 AI it is known that
Diffusionslötverbindungen zwischen zwei Fügepartnern durch Diffusion von Bestanteilen aus einer flüssigen Phase in eine feste Phase während des Lötens erzeugt werden können. Dabei wird ein zwei Komponenten enthaltender Lotwerkstoff zwischen den Fügepartnern verwendet. Um die Lötverbindung herstellen zu können, wird ein Lotformteil zwischen den Fügepartnern platziert, welches aus einem Sandwich von Lagen der erstenDiffusionslötverbindungen between two joining partners can be produced by diffusion of Bestteilteilen from a liquid phase into a solid phase during soldering. In this case, a brazing material containing two components is used between the joining partners. To make the solder joint, a Lotformteil between the joining partners is placed, which consists of a sandwich of layers of the first
Komponente und der zweiten Komponente besteht. Hierdurch ist es möglich, die Diffusionswege für das diffundierende Element möglichst kurz zu halten, so dass sich eine mechanisch stabi¬ le Verbindung zwischen den Fügepartnern ergibt. Component and the second component. This makes it possible to keep the diffusion paths for the diffusing element as short as possible, so that there is a mechanically stabi ¬ le connection between the joining partners.
Die Verwendung von Lotformteilen erfordert eine hohe Präzisi¬ on bei der Herstellung der Lötverbindungen, da diese zum Ausbilden einer zuverlässigen Kontaktierung beide Fügepartner berühren müssen und die Diffusionswege in der sich ausbilden- den Lötverbindung nicht zu groß werden dürfen. Diese Präzision ist mit einem gewissen Fertigungsaufwand (wie zum Beispiel einer hohen Parallelität der zu fügenden Oberflächen) und dadurch entstehenden Kosten verbunden. Die Aufgabe der Erfindung besteht darin, ein Lotformteil zum Diffusionslöten, ein Verfahren zu dessen Herstellung und ein Verfahren zu dessen Montage zwischen zwei Fügepartnern anzugeben, wobei mit dem Lotformteil Lötverbindungen kostengüns¬ tig und mit einer verbesserten Prozessfähigkeit hergestellt werden können. The use of solder preforms requires a high Präzisi ¬ on in the production of the solder joints, as these have to touch to form a reliable contact both joined and the diffusion paths in which ausbilden- not have been too large to solder joint. This precision is associated with a certain manufacturing effort (such as a high degree of parallelism of the surfaces to be joined) and the resulting costs. The object of the invention is to provide a solder preform for diffusion soldering, a method for its production and a method for its assembly between two joining partners, wherein with the solder preform solder joints kostengüns ¬ term and can be produced with improved process capability.
Diese Aufgabe wird mit dem eingangs angegeben Formteil erfin¬ dungsgemäß dadurch gelöst, dass das erste Material als metal- lische Folie ausgebildet ist, aus der die ersten Lagen beste¬ hen. Das zweite Material besteht aus metallischen Partikeln, die mit einem Bindemittel eine Paste bilden, wobei die zwei¬ ten Lagen aus der Paste bestehen. Aus dem ersten Material und dem zweiten Material lässt sich so eine Diffusionszone in der sich beim Löten ausbildenden Lötverbindung erzeugen, die vorzugsweise aus intermetallischen Verbindungen besteht. Vorteilhafterweise kann die Paste hierbei als Toleranzausgleich dienen, da diese vor dem Löten verformbar ist und daher das Lotformteil als Ganzes in Fügerichtung komprimiert werden kann. Dabei wird die Paste teilweise aus dem zwischen zwei benachbarten Folien liegenden Zwischenraum verdrängt. Außerdem erfährt die Paste während des Lötvorgangs einen gewissen Volumenschrumpf, da das Bindemittel während des Lötvorgangs aus der Lötverbindung entweicht. Der Volumenschrumpf unterstützt jedoch die Überbrückung von Fertigungs- und Montageto¬ leranzen, da dieser in gewissen Grenzen variabel ausfallen kann . Gemäß einer vorteilhaften Ausgestaltung der Erfindung ist vorgesehen, dass das erste Material ein Lotwerkstoff ist und das zweite Material einen höheren Schmelzpunkt aufweist als das erste Material. Das erste Material kann beispielsweise ein zinnbasierter Lotwerkstoff sein (insbesondere ein Zinn- Silber-Kuper-Lot wie zum Beispiel SAC305 mit der Legierungs¬ zusammensetzung SN96, 5Ag3Cu0 , 5 oder ein Zinn-Kupfer-Lot, zum Beispiel mit der Legierungszusammensetzung Sn99, 3Cu0 , 7 ) , während das zweite Material ein Metall ist, welches sich im Zinnmaterial löst und in dieses eindiffundieren kann, vor- zugsweise Kupfer. Das Kupfermaterial wird dann mit Hilfe des Bindemittels zum Beispiel durch ein Schablonendruckverfahren zwischen den Folien aus dem ersten Material fixiert, wobei die Diffusionswege des Partikelmaterials durch die Dicke der Folie aus Lotmaterial bestimmt werden. This object is specified with the outset molding OF INVENTION ¬ dung according achieved in that the first material as metal- is formed from which the first layers Best ¬ hen. The second material consists of metallic particles which form a paste with a binder, wherein the two ¬ th layers consist of the paste. From the first material and the second material, a diffusion zone can thus be produced in the solder joint forming during soldering, which preferably consists of intermetallic compounds. Advantageously, the paste can serve as a tolerance compensation, since this is deformable before soldering and therefore the solder preform can be compressed as a whole in the joining direction. The paste is partially displaced from the gap between two adjacent foils. In addition, the paste undergoes a certain volume shrinkage during the soldering process, since the binder escapes from the solder joint during the soldering process. However, the volume shrinkage supports the bridging of manufacturing and Montageto ¬ leranzen, as this can vary within certain limits. According to an advantageous embodiment of the invention, it is provided that the first material is a solder material and the second material has a higher melting point than the first material. The first material may, for example, a zinnbasierter solder material (in particular a tin-silver-copper solder such as SAC305, with Alloy ¬ composition Sn96, 5Ag3Cu0, 5, or a tin-copper solder, for example, with the alloy composition Sn99, 3Cu0 7), while the second material is a metal which dissolves in and diffuses into the tin material, preferably copper. The copper material is then fixed by means of the binder, for example by a stencil printing process, between the sheets of the first material, the diffusion paths of the particulate material being determined by the thickness of the sheet of solder material.
Gemäß einer anderen Ausgestaltung der Erfindung kann auch vorgesehen werden, dass das zweite Material ein Lotwerkstoff ist und das erste Material einen höheren Schmelzpunkt auf- weist als das zweite Material. Hierbei können die Folien aus dem ersten Material vorteilhaft sehr dünn ausgeführt werden, wobei das zweite Material in Form eines Lotwerkstoffs auf die Folien aufgebracht wird. Es kann insbesondere ein an sich be- kanntes Schablonendruckverfahren verwendet werden. According to another embodiment of the invention, it can also be provided that the second material is a solder material and the first material has a higher melting point. points as the second material. In this case, the films of the first material can advantageously be made very thin, wherein the second material is applied in the form of a solder material on the films. In particular, a stencil printing method known per se can be used.
Die eingangs angegebenen Aufgabe wird erfindungsgemäß auch durch ein Verfahren zum Erzeugen eines Lotformteils dadurch gelöst, dass das erste Material als metallische Folie ausge- bildet ist, aus der die ersten Lagen hergestellt werden und das zweite Material aus metallischen Partikeln besteht, die mit einem Bindemittel zu einer Paste verarbeitet sind, wobei die zweiten Lagen aus der Paste hergestellt werden. Die Vorteile bei der Durchführung dieses Verfahrens sind bereits an- gesprochen worden. Vorteilhaft lässt sich das zweite Material, welches aus der Paste besteht, leicht auf das erste Mate¬ rial in Form der metallischen Folie applizieren, wobei beispielsweise ein Schablonendruckverfahren angewendet werden kann. Die so beschichtete Folie kann dann vorteilhaft zu dem Sandwichaufbau geschichtet werden. Die Zahl der geschichteten Folien bestimmt die Dicke des Sandwichaufbaus , wobei diese unter Berücksichtigung des Spaltmaßes der auszubildenden Lötverbindung bestimmt werden kann. Hierbei ist, wie bereits beschrieben, das Maß der Schrumpfung beim Ausbilden der According to the invention, the object stated at the outset is also achieved by a method for producing a solder preform by forming the first material as a metallic foil, from which the first layers are produced and the second material consists of metallic particles which are added with a binder a paste are processed, wherein the second layers are made from the paste. The advantages in carrying out this method have already been mentioned. Advantageously, leaves the second material, which consists of the paste easily be applied to the first Mate ¬ rial in the form of the metallic foil, for example, a screen printing method can be applied. The thus coated film can then be advantageously laminated to the sandwich construction. The number of layered films determines the thickness of the sandwich construction, which can be determined taking into account the gap dimension of the solder joint to be formed. Here, as already described, the degree of shrinkage in forming the
Lötverbindung zu berücksichtigen, um welches die Höhe desTo consider the solder joint by which the height of the
Sandwichaufbaus im Verhältnis zum zu überbrückenden Spaltmaß vergrößert werden muss. Sandwich structure in relation to the gap to be bridged must be increased.
Besonders vorteilhaft ist, wenn mehrere Lotformteile gleich- zeitig hergestellt werden, indem der Sandwichaufbau mit einer Fläche größer als der der Lotformteile hergestellt wird und von diesem die Lotformteile abgetrennt werden. Mit anderen Worten wird ein großflächiges Halbzeug erzeugt, welches ins¬ besondere mit einem Schablonendruckverfahren besonders ein- fach hergestellt werden kann. Dieses wird anschließend zu den Lotformteilen vereinzelt. Dies kann beispielsweise durch Stanzen oder Laserschneiden erfolgen. Die Lotformteile können in großer Zahl hergestellt und beispielsweise auf Bändern für die Elektronikmontage für eine Bestückung auf Schaltungsträ¬ gern zur Verfügung gestellt werden. It is particularly advantageous if a plurality of solder preforms are produced at the same time by producing the sandwich structure with an area larger than that of the solder preforms and separating the solder preforms from this. In other words, a large-area semifinished product is produced, which can be made particularly simple to ¬ particular with a stencil printing process. This is then separated into the solder preforms. This can be done for example by punching or laser cutting. The solder preforms can be produced in large numbers and, for example, on tapes for the electronics assembly for placement on Schaltungsträ ¬ like to be made available.
Insofern wird die genannte Aufgabe mit dem eingangs angegebe- nen Verfahren zum Fügen einer Diffusionslötverbindung erfindungsgemäß dadurch gelöst, dass ein Lotformteil der bereits beschriebenen Art verwendet wird. Besonders vorteilhaft ist es, wenn ein Lotformteil mit einem die Schrumpfung des Lot¬ werkstoffs berücksichtigenden Übermaß verwendet wird. Außer- dem kann ein die Toleranzen der Diffusionslötverbindung berücksichtigendes Übermaß vorgesehen werden, welches insbeson¬ dere dem die Schrumpfung des Lotwerkstoffs berücksichtigenden Übermaß überlagert wird. Hierdurch lassen sich vorteilhaft toleranzbehaftete Diffusionslötverbindungen mit hoher Zuver- lässigkeit erzeugen, wobei zu diesem Zweck Lotformteile zum Einsatz kommen können, die kostengünstig in der Herstellung sind und in großer Zahl im Montageprozess vorgehalten werden können. Insbesondere ist ein Fügen der In this respect, the stated object is achieved with the initially stated method for joining a diffusion solder joint according to the invention in that a solder preform of the type already described is used. It is particularly advantageous if a solder preform with a used the shrinkage of the solder ¬ material is considered excess. Outside which a diffusion soldering the tolerances of the end considered excessive may be provided which insbeson ¬ particular the shrinkage of the solder material be considered excessive is superimposed. As a result, it is advantageously possible to produce diffusion-bonded diffusion joints having high reliability, wherein solder preforms which are cost-effective to manufacture and can be kept in large numbers in the assembly process can be used for this purpose. In particular, a joining is the
Diffusionslötverbindungen mit den für die Elektronikmontage allgemein geltenden Toleranzanforderungen zu erzeugen, so dass die Erzeugung der Diffusionslötverbindungen in den normalen Prozess der Elektronikmontage integriert werden kann. Hierdurch lassen sich vorteilhaft besonders wirtschaftliche technische Lösungen erzielen.  To produce diffusion solder joints with the tolerance requirements generally applicable to electronics assembly, so that the production of the diffusion solder joints can be integrated into the normal process of electronics assembly. As a result, particularly economical technical solutions can be advantageously achieved.
Weitere Einzelheiten der Erfindung werden im Folgenden anhand der Zeichnung beschrieben. Gleiche oder sich entsprechende Zeichnungselemente sind jeweils mit den gleichen Bezugszei¬ chen versehen und werden nur insoweit mehrfach erläutert, wie sich Unterschiede zwischen den einzelnen Figuren ergeben. Es zeigen Further details of the invention will be described below with reference to the drawing. Identical or corresponding drawing elements are each provided with the same Bezugszei ¬ chen and are only explained several times as far as differences arise between the individual figures. Show it
Figur 1 und 2 Ausführungsbeispiele des erfindungsgemäßen Figures 1 and 2 embodiments of the invention
Lotformteils schematisch als Querschnitt,  Lotformteils schematically as a cross section,
Figur 3 bis 5 ausgewählte Verfahrensschritte eines Ausfüh¬ rungsbeispiels des erfindungsgemäßen Verfah- rens zum Erzeugen eines Lotformteils, ge¬ schnitten, und Figure 3 to 5 selected method steps of exporting approximately ¬ example the procedure according to the invention Rens ge ¬ cut for producing a solder preform, and
Figur 6 und 7 ausgewählte Verfahrensschritte von Ausfüh- rungsbeispielen des erfindungsgemäßen Verfahrens zum Fügen einer Diffusionslötverbindung, geschnitten bzw. als Seitenansicht. FIGS. 6 and 7 show selected method steps of exemplary embodiments of the method according to the invention for joining a diffusion solder joint, cut or as a side view.
Ein Lotformteil 11 gemäß Figur 1 besteht aus ersten Lagen 12 und zweiten Lagen 13, welche im Wechsel angeordnet sind (dar¬ gestellt auf der linken Seite einer Bruchlinie 17) . Die ers¬ ten Lagen 12 bestehen aus einer metallischen Folie 14, welche gemäß Figur 1 aus einem Lotwerkstoff, beispielsweise einer Zinn-Silber-Kupfer-Legierung (oder einer anderen Zinnbasisle- gierung) hergestellt sind. Die zweiten Lagen 13 bestehen aus einer Paste, wobei Partikel 15 in einem Bindemittel 16 ver¬ teilt sind. Die Partikel 15 bestehen aus Kupfer. Alternativ können diese auch durch Nickel gebildet sein. In Figur 1 ist auf der rechten Seite der Bruchlinie 17 eine Diffusionslötverbindung auch nach erfolgtem Lötvorgang des Lotformteils 11 dargestellt. Die Fügepartner, welche sich an eine obere Fügefläche 18 und eine untere Fügefläche 19 an¬ schließen, sind in Figur 1 nicht dargestellt. Zu erkennen ist jedoch, dass die zweiten Lagen 13 nun durch metallisches Kup¬ fer gebildet sind und im Vergleich zu den zweiten Lagen 13 links der Bruchlinie 17 eine geringere Dicke aufweisen, da das Bindemittel 16 nicht mehr vorhanden ist. Insgesamt ergibt sich hierdurch ein Schrumpf Δζ, der die Höhe der ausgebilde- ten Diffusionslötverbindung bestimmt. Dieser Schrumpf Δζ muss bei der Bestimmung der erforderlichen Dicke des Lotformteils 11 berücksichtigt werden. A solder preform 11 according to Figure 1 consists of first layers 12 and second layers 13, which are arranged alternately (¬ represent provided on the left side of a broken line 17). The ers ¬ th layers 12 are made of a metallic foil 14, which are manufactured in accordance with Figure 1 of a solder material, such as a tin-silver-copper alloy (or other Zinnbasisle- yaw). The second layers 13 consist of a paste, wherein particles 15 are ver ¬ shares in a binder 16. The particles 15 are made of copper. Alternatively, these may also be formed by nickel. FIG. 1 shows a diffusion solder joint on the right side of the fault line 17 even after the solder molding 11 has been soldered. The joint partners, which in ¬ align themselves with an upper joining surface 18 and a lower joint face 19 are not shown in FIG. 1 To recognize, however, that the second layers 13 are then formed by metallic Kup ¬ fer and compared to the second sheets 13 to the left of the broken line 17 have a smaller thickness, because the binder 16 is no longer present. Overall, this results in a shrinkage .DELTA.ζ, which determines the height of the formed Diffusionslötverbindung. This shrinkage Δζ must be taken into account when determining the required thickness of the solder preform 11.
Die Verringerung der Dicke der zweiten Lagen 13 hat jedoch noch einen weiteren Grund. Ein Teil des Kupfers ist nämlich in die ersten Lagen 12 eindiffundiert, so dass hier Diffusi¬ onszonen entstehen. Diese bestehen zumindest teilweise aus intermetallischen Phasen, die einerseits das Material des Lotwerkstoffs und andererseits das Material der Partikel ent¬ halten und die Lötverbindung mechanisch und thermisch stabilisieren. In Figur 1 bestehen die ersten Lagen 12 vollständig aus der intermetallischen Verbindung. However, the reduction in the thickness of the second layers 13 has another reason. Part of the copper is in fact diffused into the first layers 12, so that here Diffusi ¬ onszonen arise. These consist at least partly of intermetallic phases, which on the one hand are the material of the Solder material and on the other hand, the material of the particles ent ¬ hold and mechanically and thermally stabilize the solder joint. In Figure 1, the first layers 12 are made entirely of the intermetallic compound.
Gemäß Figur 2 ist ein weiteres Ausführungsbeispiel für den Sandwichaufbau des Lotformteils 11 dargestellt. Die ersten Lagen 12 sind hier aus er Folie 14 aus Kupfer gebildet, während die zweiten Lagen 13 aus der Paste, bestehend aus Parti- kein 15 eines zinnhaltigen Lotwerkstoffs und em Bindemittel 16, ausgebildet sind. Für Figur 1 und Figur 2 gilt, dass je¬ weils die oberste Lage und die unterste Lage, die jeweils die obere Fügefläche 18 und die untere Fügefläche 19 bilden, aus dem Lotwerkstoff bestehen, damit eine Verbindung zu den an- grenzenden Fügepartnern möglich ist (vgl. Figur 6) . According to Figure 2, a further embodiment of the sandwich construction of the solder preform 11 is shown. Here, the first layers 12 are formed from film 14 made of copper, while the second layers 13 are formed from the paste consisting of particles 15 of a tin-containing solder material and a binder 16. For Figure 1 and Figure 2, applies that, depending ¬ weils the uppermost layer and the lowermost layer, which respectively form the upper joining surface 18 and the lower joining surface 19, made of the solder material, so that a connection to the on adjacent joining partners is possible ( see Figure 6).
In den Figuren 3 bis 5 sind ausgewählte Verfahrensschritte zur Herstellung des Lotformteils 11 gemäß Figur 1 darge¬ stellt. Genauso könnte aber auch das Lotformteil gemäß Figur 2 hergestellt werden. In the figures 3 to 5 selected process steps for manufacture of the solder preform 11 of Figure 1 are Darge ¬ represents. In the same way, however, the solder preform according to FIG. 2 could also be produced.
In Figur 3 ist dargestellt, dass zur einfacheren Herstellung des Lotformteils 11 (vgl. auch Figur 5) die Folie 14 mit ei¬ ner Maske 20 und einer Rakel 21 in Schablonendrucktechnologie mit der Paste, bestehend aus den Partikeln 15 und dem Binde¬ mittel 16, beschichtet wird. Auf diese Weise entsteht ein Halbzeug 28, welches im nächsten Schritt gemäß Figur 4 ge¬ schichtet werden kann, bis die erforderliche Dicke d für das Halbzeug 28 erreicht ist (vgl. Figur 5) . Um den Aufbau von ersten Lagen 12 und zweiten Lagen 13 gemäß Figur 1 zu gewährleisten, muss abschließend noch eine Folie 14 ohne Paste auf das oberste Halbzeug 28 aufgelegt werden. In figure 3 it is shown that for ease of manufacture of the solder preform 11 (see also FIG. 5), the film 14 with egg ¬ ner mask 20 and a squeegee 21 in stencil printing technology with the paste consisting of the particles 15 and the binder ¬ medium 16 , is coated. In this way, a semifinished product 28 is produced, which can be coated in the next step according to FIG. 4 until the required thickness d for the semifinished product 28 has been reached (compare FIG. 5). In order to ensure the construction of first layers 12 and second layers 13 according to FIG. 1, finally a film 14 without paste has to be placed on topmost semi-finished product 28.
Aus dem Sandwichaufbau gemäß Figur 4 kann gemäß Figur 5 eine Vielzahl von Lothalbzeugen 11 hergestellt werden, indem diese beispielsweise durch eine Säge, ein Stanzwerkzeug oder ein Messer 22 vereinzelt werden. Das Messer 22 (oder das Stanzwerkzeug oder die Säge) schneidet entlang der angedeuteten Strichpunktlinien den Sandwichaufbau gemäß Figur 4 in die Lothalbzeuge 11 mit der geforderten Größe. According to FIG. 5, a multiplicity of solder semi-finished products 11 can be produced from the sandwich construction according to FIG. 4 by separating them by a saw, a punching tool or a knife 22, for example. The knife 22 (or the punch or the saw) cuts along the indicated Dash-dot lines the sandwich structure of Figure 4 in the semi-finished solder 11 with the required size.
In Figur 6 ist dargestellt, wie aus den Lotformteilen In Figure 6 is shown as from the Lotformteilen
Diffusionslötverbindungen 23 hergestellt werden können, die einen ersten Fügepartner 24 mit einem zweiten Fügepartner 25 sowie einem dritten Fügepartner 26 verbinden. Bei dem ersten Fügepartner 24 gemäß Figur 6 handelt es sich um Leistungs¬ halbleiterbauelemente, die auf dem zweiten Fügepartner 25, einer Leiterplatte über die Diffusionslötverbindungen 23 befestigt sind. Außerdem weisen die ersten Fügepartner 24 auf der gegenüberliegenden Oberseite ebenfalls Diffusionslötverbindungen 23 can be produced, which connect a first joining partner 24 with a second joining partner 25 and a third joining partner 26. The first joining partner 24 according to FIG. 6 is power semiconductor components which are fastened on the second joining partner 25 of a printed circuit board via the diffusion solder joints 23. In addition, the first joining partners 24 on the opposite top also
Diffusionslötverbindungen 23 auf, die mit dem dritten Fügepartner 26, einem keramischen Bauteil in Form einer Kappe, elektrisch verbunden sind. In Figur 6 wird außerdem deutlich, dass bedingt durch Toleranzen t die Höhe der ersten Fügepart¬ ner variieren kann. Deswegen sind die Diffusionslötverbindungen 23, which are electrically connected to the third joining partner 26, a ceramic component in the form of a cap. In figure 6 also the height of the first joining part ¬ ner it is clear that due to tolerances t can vary. That is why they are
Diffusionslötverbindungen 23 gemäß Figur 6 unterschiedlich dick, wobei ein Toleranzausgleich jeweils durch die zweiten Lagen (in Figur 6 nicht dargestellt) erfolgen kann, die beim Fügen der Fügepartner toleranzabhängig stärker oder weniger stark komprimiert werden können.  Diffusion solder joints 23 according to Figure 6 of different thickness, with a tolerance compensation in each case by the second layers (not shown in Figure 6) can take place, which can be compressed more or less strongly depending on tolerance when joining the joining partners.
In Figur 7 ist in einem höheren Detaillierungsgrad darge- stellt, wie der erste Fügepartner 24 in Form eines Bauele¬ ments mit dem zweiten Fügepartner 25 in Form einer Leiterplatte über die Diffusionslötverbindung verbunden werden kann. Sowohl der erste Fügepartner 24 als auch der zweite Fügepartner 25 weisen Metallisierungen 27 aus Kupfer auf, an die das Lotformteil 11 angrenzt. Beim Löten diffundiert Mate¬ rial der Metallisierungen 27 in die sich ausbildende In Figure 7 is ones shown, situated in a higher level of detail as the first joining parts 24 in the form of a Bauele ¬ ment can be connected in the form of a printed circuit board via the diffusion soldering with the second joining partner 25th Both the first joint partner 24 and the second joint partner 25 have metallizations 27 made of copper, to which the solder preform 11 is adjacent. When soldering mate ¬ rial diffuses the metallization 27 in the forming
Diffusionslötverbindung und ist dort an der Bildung der intermetallischen Phasen in einer Diffusionszone beteiligt (nicht dargestellt) . Diffusionslötverbindung and there is involved in the formation of intermetallic phases in a diffusion zone (not shown).
Während des Lötvorgangs schmilzt das Lotformteil 11 auf, wo¬ bei der Schrumpf Δζ auftritt. Hierbei sinkt der erste Füge¬ partner 24 um den Betrag Δζ ab. Die in Figur 7 nicht näher dargestellten zweiten Lagen erlauben jedoch ein maximales Absinken um smax, so dass zusätzlich ein Toleranzbereich t auf¬ grund von Fertigungs- und Montagetoleranzen bei der Herstel¬ lung der Diffusionslötverbindung kompensiert werden kann. Da- bei ist zu berücksichtigen, dass aufgrund der Toleranzen t auch ein Absinken des ersten Fügepartners 24 um einen geringeren Wert als Δζ möglich ist, wobei auch in diesem Fall noch eine Diffusionslötverbindung mit ausreichender Qualität entsteht . During the soldering process, the solder preform 11 melts where ¬ occurs in the shrink Δζ. Here, the first joining partner ¬ 24 decreases by the amount Δζ. The not closer in Figure 7 However, shown second layers allow a maximum decrease by s max , so that in addition a tolerance range t on ¬ basis of manufacturing and assembly tolerances in the manufacture ¬ ment of Diffusionslötverbindung can be compensated. In this case, it should be noted that, due to the tolerances t, it is also possible to lower the first joining partner 24 by a value smaller than Δζ, whereby in this case, too, a diffusion solder joint with sufficient quality is produced.

Claims

Patentansprüche claims
1. Lotformteil zum Diffusionslöten, aufweisend einen Sand¬ wichaufbau, bestehend aus ersten Lagen (12) eines ersten Ma- terials und aus zweiten Lagen (13) eines zweiten Materials, wobei die ersten Lagen (12) und die zweiten Lagen (13) in dem Sandwichaufbau einander abwechseln, 1. solder preform for diffusion soldering, comprising a sand ¬ wichaufbau, consisting of first layers (12) of a first material and second layers (13) of a second material, wherein the first layers (12) and the second layers (13) in alternate the sandwich construction,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass das erste Material als metallische Folie (14) ausgebil- det ist, aus der die ersten Lagen (12) bestehen, und das zweite Material aus metallischen Partikeln (15) besteht, die mit einem Bindemittel (16) eine Paste bilden, wobei die zwei¬ ten Lagen aus der Paste bestehen. in that the first material is formed as a metallic foil (14) constituting the first layers (12) and the second material consists of metallic particles (15) which form a paste with a binder (16) Two ¬ th layers consist of the paste.
2. Lotformteil nach Anspruch 1, 2. solder preform according to claim 1,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass das erste Material ein Lotwerkstoff ist und das zweite Material einen höheren Schmelzpunkt aufweist, als das erste Material . the first material is a solder material and the second material has a higher melting point than the first material.
3. Lotformteil nach Anspruch 1, 3. solder preform according to claim 1,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass das zweite Material ein Lotwerkstoff ist und das erste Material einen höheren Schmelzpunkt aufweist, als das zweite Material. the second material is a solder material and the first material has a higher melting point than the second material.
4. Verfahren zum Erzeugen eines Lotformteils (11), bei dem erste Lagen (12) eines ersten Materials und zweite Lagen (13) eines zweiten Materials zu einem Sandwichaufbau geschichtet werden, wobei die ersten Lagen (12) und die zweiten Lagen (13) in dem Sandwichaufbau einander abwechseln, 4. A method for producing a solder preform (11) in which first layers (12) of a first material and second layers (13) of a second material are laminated to form a sandwich, wherein the first layers (12) and the second layers (13) alternate in the sandwich construction,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass das erste Material als metallische Folie (14) ausgebil¬ det ist, aus der die ersten Lagen hergestellt werden, und das zweite Material aus metallischen Partikeln (15) besteht, die mit einem Bindemittel (16) zu einer Paste verarbeitet sind, wobei die zweiten Lagen (13) aus der Paste hergestellt wer¬ den . that the first material is provided as a metallic foil (14) ausgebil ¬ det from which the first layers are made, and the second material of metallic particles (15), which are processed with a binder (16) to form a paste, wherein the second layers (13) made of the paste who ¬ the.
5. Verfahren nach Anspruch 4, 5. The method according to claim 4,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass die Folie (14) mit der Paste beschichtet wird, bevor die so beschichtete Folie (14) zu dem Sandwichaufbau geschichtet wird . the film (14) is coated with the paste before the thus coated film (14) is laminated to the sandwich construction.
6. Verfahren nach einem der Ansprüche 4 oder 5, 6. The method according to any one of claims 4 or 5,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass mehrere Lotformteile (11) gleichzeitig hergestellt wer¬ den, indem der Sandwichaufbau mit einer Fläche größer als der der Lotformteile (11) hergestellt wird und von diesem die Lotformteile (11) abgetrennt werden. that a plurality of solder preforms (11) are produced simultaneously ¬ that by the sandwich construction is made with an area larger than that of the solder preforms (11) and from that the solder preforms (11) are separated.
7. Verfahren zum Fügen einer Diffusionslötverbindung (23), bei dem ein Lotformteil (11) zwischen einem ersten Fügepart¬ ner (24) und einem zweiten Fügepartner (25) platziert wird und das Lotformteil (11) unter Ausbildung der 7. A method for joining a Diffusionslötverbindung (23), in which a Lotformteil (11) between a first joining part ¬ ner (24) and a second joining partner (25) is placed and the solder preform (11) to form the
Diffusionslötverbindung (23) aufgeschmolzen wird, Diffusionslötverbindung (23) is melted,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass ein Lotformteil (11) gemäß einem der Ansprüche 1 bis 3 verwendet wird. in that a solder preform (11) according to one of claims 1 to 3 is used.
8. Verfahren nach Anspruch 7, 8. The method according to claim 7,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass ein Lotformteil (11) mit einem die Schrumpfung (Δζ) des Lotwerkstoffes berücksichtigenden Übermaß verwendet wird. that a solder preform (11) is used with an excess that takes into account the shrinkage (Δζ) of the solder material.
9. Verfahren nach Anspruch 7, 9. The method according to claim 7,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass ein Lotformteil (11) mit einem die Toleranzen der that a solder preform (11) with a tolerance of the
Diffusionslötverbindung berücksichtigenden Übermaß (t) verwendet wird. Diffusion soldering taking into account oversize (t) is used.
EP18722915.8A 2017-04-25 2018-04-19 Solder preform for diffusion soldering, method for the production thereof and method for the assembly thereof Withdrawn EP3583623A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017206930.9A DE102017206930A1 (en) 2017-04-25 2017-04-25 Solder molding for diffusion soldering, process for its preparation and method for its assembly
PCT/EP2018/059971 WO2018197314A1 (en) 2017-04-25 2018-04-19 Solder preform for diffusion soldering, method for the production thereof and method for the assembly thereof

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Publication Number Publication Date
EP3583623A1 true EP3583623A1 (en) 2019-12-25

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EP (1) EP3583623A1 (en)
JP (1) JP6927638B2 (en)
KR (1) KR102226143B1 (en)
CN (1) CN110546759A (en)
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WO (1) WO2018197314A1 (en)

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DE102019217061A1 (en) * 2019-11-06 2021-05-06 Zf Friedrichshafen Ag Arrangement with a substrate for receiving at least one semiconductor component for a power converter and method for diffusion soldering of at least one semiconductor component with a substrate for a power converter

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DE102017206930A1 (en) 2018-10-25
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KR102226143B1 (en) 2021-03-09
JP6927638B2 (en) 2021-09-01
KR20190129940A (en) 2019-11-20
WO2018197314A1 (en) 2018-11-01
US20200139490A1 (en) 2020-05-07

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