EP3526303A4 - Matériaux d'interface thermique comprenant un agent colorant - Google Patents

Matériaux d'interface thermique comprenant un agent colorant Download PDF

Info

Publication number
EP3526303A4
EP3526303A4 EP16918509.7A EP16918509A EP3526303A4 EP 3526303 A4 EP3526303 A4 EP 3526303A4 EP 16918509 A EP16918509 A EP 16918509A EP 3526303 A4 EP3526303 A4 EP 3526303A4
Authority
EP
European Patent Office
Prior art keywords
coloring agent
materials including
thermal interface
interface materials
including coloring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16918509.7A
Other languages
German (de)
English (en)
Other versions
EP3526303A1 (fr
Inventor
Liqiang Zhang
Yaqin Mao
Huifeng DUAN
Haigang KANG
Yaqun Liu
Ling Shen
Kai Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority to EP20211073.0A priority Critical patent/EP3839005B1/fr
Priority to PT202110730T priority patent/PT3839005T/pt
Publication of EP3526303A1 publication Critical patent/EP3526303A1/fr
Publication of EP3526303A4 publication Critical patent/EP3526303A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/23—Azo-compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Coloring (AREA)
  • Cosmetics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP16918509.7A 2016-10-12 2016-10-12 Matériaux d'interface thermique comprenant un agent colorant Withdrawn EP3526303A4 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP20211073.0A EP3839005B1 (fr) 2016-10-12 2016-10-12 Matériaux d'interface thermique comprenant un agent colorant
PT202110730T PT3839005T (pt) 2016-10-12 2016-10-12 Materiais de interface térmica incluindo agente corante

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/101874 WO2018068222A1 (fr) 2016-10-12 2016-10-12 Matériaux d'interface thermique comprenant un agent colorant

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP20211073.0A Division EP3839005B1 (fr) 2016-10-12 2016-10-12 Matériaux d'interface thermique comprenant un agent colorant

Publications (2)

Publication Number Publication Date
EP3526303A1 EP3526303A1 (fr) 2019-08-21
EP3526303A4 true EP3526303A4 (fr) 2020-09-09

Family

ID=61905079

Family Applications (2)

Application Number Title Priority Date Filing Date
EP16918509.7A Withdrawn EP3526303A4 (fr) 2016-10-12 2016-10-12 Matériaux d'interface thermique comprenant un agent colorant
EP20211073.0A Active EP3839005B1 (fr) 2016-10-12 2016-10-12 Matériaux d'interface thermique comprenant un agent colorant

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP20211073.0A Active EP3839005B1 (fr) 2016-10-12 2016-10-12 Matériaux d'interface thermique comprenant un agent colorant

Country Status (9)

Country Link
EP (2) EP3526303A4 (fr)
JP (1) JP2020500225A (fr)
KR (1) KR102666004B1 (fr)
CN (1) CN109844056B (fr)
BR (1) BR112019007197A2 (fr)
MX (1) MX2019004236A (fr)
PL (1) PL3839005T3 (fr)
PT (1) PT3839005T (fr)
WO (1) WO2018068222A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016004565A1 (fr) 2014-07-07 2016-01-14 Honeywell International Inc. Matériau d'interface thermique avec agent piégeur d'ions
CN107250317A (zh) 2014-12-05 2017-10-13 霍尼韦尔国际公司 具有低热阻的高性能热界面材料
US10312177B2 (en) * 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
KR102554661B1 (ko) 2016-03-08 2023-07-13 허니웰 인터내셔널 인코포레이티드 상 변화 물질
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
WO2020261647A1 (fr) * 2019-06-24 2020-12-30 富士高分子工業株式会社 Composition thermoconductrice tolérante à la chaleur et feuille thermoconductrice tolérante à la chaleur

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150008361A1 (en) * 2012-03-02 2015-01-08 Fuji Polymer Industries Co., Ltd. Putty-like heat transfer material and method for producing the same
WO2016111139A1 (fr) * 2015-01-06 2016-07-14 富士高分子工業株式会社 Feuille thermoconductrice d'accumulation de chaleur

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3886801A (en) * 1999-09-21 2001-04-24 Saint-Gobain Ceramics And Plastics, Inc. Thermally conductive materials in a hydrophobic compound for thermal management
US9353304B2 (en) * 2009-03-02 2016-05-31 Honeywell International Inc. Thermal interface material and method of making and using the same
KR101725336B1 (ko) * 2009-03-16 2017-04-10 다우 코닝 코포레이션 열 전도성 그리스 및 상기 그리스를 사용하는 방법 및 디바이스
US9260645B2 (en) * 2010-02-23 2016-02-16 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US8552101B2 (en) * 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
US20140171567A1 (en) * 2012-12-14 2014-06-19 Sabic Innovative Plastics Ip B.V. Thermally conductive flame retardant polymer compositions and uses thereof
US20150125646A1 (en) * 2013-11-05 2015-05-07 Espci Innov Self-Healing Thermally Conductive Polymer Materials
US10068830B2 (en) * 2014-02-13 2018-09-04 Honeywell International Inc. Compressible thermal interface materials
CN104497574A (zh) * 2014-12-10 2015-04-08 深圳市博恩实业有限公司 多功能有机硅热界面材料
CN105349113A (zh) * 2015-10-14 2016-02-24 文雪烽 一种导热界面材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150008361A1 (en) * 2012-03-02 2015-01-08 Fuji Polymer Industries Co., Ltd. Putty-like heat transfer material and method for producing the same
WO2016111139A1 (fr) * 2015-01-06 2016-07-14 富士高分子工業株式会社 Feuille thermoconductrice d'accumulation de chaleur

Also Published As

Publication number Publication date
BR112019007197A2 (pt) 2019-07-02
MX2019004236A (es) 2019-07-04
CN109844056B (zh) 2021-11-09
PT3839005T (pt) 2023-09-07
KR102666004B1 (ko) 2024-05-14
CN109844056A (zh) 2019-06-04
EP3526303A1 (fr) 2019-08-21
EP3839005B1 (fr) 2023-07-19
WO2018068222A1 (fr) 2018-04-19
PL3839005T3 (pl) 2023-11-27
KR20190067176A (ko) 2019-06-14
JP2020500225A (ja) 2020-01-09
EP3839005A1 (fr) 2021-06-23

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