EP3469256B1 - Light emitting module and method for producing same - Google Patents

Light emitting module and method for producing same Download PDF

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Publication number
EP3469256B1
EP3469256B1 EP17722761.8A EP17722761A EP3469256B1 EP 3469256 B1 EP3469256 B1 EP 3469256B1 EP 17722761 A EP17722761 A EP 17722761A EP 3469256 B1 EP3469256 B1 EP 3469256B1
Authority
EP
European Patent Office
Prior art keywords
light emitting
lens assembly
emitting module
circuit board
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP17722761.8A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3469256A1 (en
Inventor
Jie Tan
Chengcheng FENG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP3469256A1 publication Critical patent/EP3469256A1/en
Application granted granted Critical
Publication of EP3469256B1 publication Critical patent/EP3469256B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F21V5/048—Refractors for light sources of lens shape the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present disclosure generally relates to the technical field of lighting, and in particular to a light emitting module, and more specifically to a light emitting module which can firmly retain a lens assembly by a housing made of a molding material. Moreover, the present disclosure also relates to a method for producing the light emitting module.
  • Light emitting modules have been used widely in applications such as light boxes, billboards, scene lights, backlight lighting and the like.
  • the light emitting module generally comprises a housing, a circuit board and a lens assembly, wherein a light emitting element such as a light emitting diode (LED) is arranged on the circuit board, the lens assembly for protecting the light emitting element and setting a lighting pattern of the light emitting element covers the light emitting element, and the housing at least partially surrounds the circuit board and the lens assembly.
  • a light emitting element such as a light emitting diode (LED)
  • a light emitting diode lighting assembly for mounting to a curved mounting surface, such as a vehicle surface, includes a plurality of light emitting diodes, a circuit board, and a molded polymer section for surrounding and insulating the LEDs against the circuit board.
  • the lighting assembly also includes a lens and a flexible molded housing surrounding a perimeter of the lens and the circuit board for sealing the lens to the circuit board
  • an object of the present disclosure is to provide a light emitting module which firmly retains a lens assembly by a housing made of a molding material and a method for producing the light emitting module.
  • the present invention relates to light emitting modules, and more particularly to light emitting modules comprising a housing made of a molding material as described in independent claim 1.
  • a light emitting module comprising: a circuit board on which a light emitting element is arranged; a lens assembly arranged on the circuit board to cover the light emitting element; and a housing made of a molding material and at least partially surrounding the circuit board and the lens assembly to form the light emitting module, wherein a fastener for firmly retaining the lens assembly to the housing is formed by the molding material while forming the housing using the molding material.
  • a method for producing a light emitting module comprising a circuit board and a lens assembly, comprising the steps of: arranging the lens assembly on the circuit board in an overlapped manner; and forming a housing at least partially surrounding the circuit board and the lens assembly by a molding process.
  • a fastener for firmly retaining the lens assembly to the housing is formed by the molding material while forming the housing using the molding material.
  • the light emitting module according to the present disclosure can firmly retain a lens assembly by a housing made of a molding material.
  • the light emitting module has advantages such as a simple production process, a compact structure, a low cost and so on.
  • FIG. 1 illustrates a schematic view of a light emitting module according to the prior art.
  • FIG. 2 illustrates a sectional view in a lateral direction of the light emitting module as shown in FIG. 1 .
  • a length direction of the light emitting module is referred to as a longitudinal direction
  • a width direction of the light emitting module is referred to as a lateral direction
  • a thickness direction of the light emitting module is referred to as a vertical direction.
  • the light emitting module comprises a circuit board, a lens assembly and a housing, wherein a light emitting element is arranged on the circuit board, the lens assembly covers the light emitting element, and the housing at least partially surrounds the circuit board and the lens assembly.
  • the lens assembly generally would be produced using polycarbonate (PC).
  • the housing generally would be produced using e.g. polyvinyl chloride (PVC) and thermoplastic polyurethane elastomer rubber (TPU), by a molding process such as injection molding and so on. Due to differences in material characteristics such as thermal expansion ratio and so on between the material for producing the lens assembly and the molding material for producing the housing, however, it would be difficult for the lens assembly to be firmly attached to the housing. Thus, a phenomenon that the housing easily peels off the lens assembly occurs such that the lens assembly falls off, thereby damaging the light emitting element and other elements on the circuit board. For example, the housing peels off the lens assembly at the edge of the lens assembly, as shown in FIG. 1 .
  • FIG. 3 illustrates a schematic view of a light emitting module produced by a method of covering the lens assembly with a potting material.
  • the light emitting module as shown in FIG. 3 differs from the light emitting module as shown in FIG. 1 in that the housing in FIG. 1 only surrounds the edge of the lens assembly while the housing in FIG. 3 covers all regions other than a region of emission light of the lens assembly.
  • the light emitting module as depicted in FIG. 3 enables the housing to firmly retain the lens assembly, this method needs greater spacing between the respective lens units of the respective light emitting elements to accommodate the potting material, so a large-area lens assembly is required to be used, thus causing an increase in the overall size of the light emitting module.
  • the present disclosure proposes a light emitting module, which can firmly retain the lens assembly by a housing made of a molding material, and which meanwhile has advantages such as a simple production process, a compact structure, a low cost and so on.
  • the light emitting module according to the present disclosure will be described with reference to FIGS. 4-8 below.
  • FIG. 4 illustrates an exploded perspective view of a light emitting module 1 according to an embodiment of the present disclosure.
  • the light emitting module 1 according to the present disclosure comprises a circuit board 20, a lens assembly 10 and a housing 30.
  • One or more light emitting elements 21 are arranged on the circuit board 20.
  • the light emitting element 21 may be a light emitting diode (LED) and the like.
  • the circuit board 20 may be a printed circuit board, a thick film circuit board and the like.
  • the lens assembly 10 is arranged on the circuit board 10 to cover the light emitting elements 21.
  • the lens assembly 10 comprises one or more lens units for corresponding to the one or more light emitting elements 21 respectively.
  • the lens assembly 10 may be made of polycarbonate (PC).
  • the lens assembly 10 may be vertically aligned with the circuit board 20 by various methods. For example, positioning holes may be provided on the circuit board 20, and positioning pins may be arranged in the lens assembly 10, so as to realize alignment between the circuit board 20 and the lens assembly 10.
  • the housing 30 is made of a molding material, and at least partially surrounds the circuit board 20 and the lens assembly 10 to form the light emitting module 1. As shown in FIG. 4 , the housing 30 surrounds the lens assembly only 10 at the edge of the lens assembly 10 such that the respective lens units of the lens assembly 10 can have a small spacing.
  • the molding material for producing the housing 30 may be polyvinyl chloride (PVC), thermoplastic polyurethane elastomer rubber (TPU) and the like.
  • the molding process for producing the housing 30 may be an injection molding process, a potting process and the like.
  • a fastener 31 for firmly retaining the lens assembly 10 to the housing 30 is formed by the molding material while forming the housing 30 using the molding material, thus making it possible to simultaneously form the housing 30 and the fastener 31 for firmly retaining the lens assembly 10 in a same molding process.
  • FIG. 5 illustrates a schematic view of a lens assembly 10 and a circuit board 20 of the light emitting module 1 according to an embodiment of the present disclosure.
  • the circuit board 20 and the lens assembly 10 one or more holes 12, 22 are arranged at vertically aligned coupling positions respectively.
  • the one or more holes 12, 22 in the circuit board 20 and the lens assembly 10 may be arranged at coupling positions at edges of the lens assembly 10 and the circuit board 20 respectively.
  • the one or more holes 22 in the circuit board 20 may have opening(s) facing outwards in a peripheral direction. In this manner, a process for drilling holes in the circuit board 20 can be simplified, thereby further reducing the production cost of the light emitting module 1.
  • FIG. 6 illustrates a perspective view of a housing 30 of the light emitting module 1 according to an embodiment of the present disclosure
  • FIG. 7 illustrates a partially-enraged sectional view in a longitudinal direction at the circle of the housing 30 of the light emitting module 1 as shown in FIG. 6 .
  • the molding process fills the molding material in the one or more holes 12, 22 in the circuit board 20 and the lens assembly 10 while forming the housing 30 using the molding material, such that the molding material forms a structure similar to a rivet, and this structure serves as a fastener 31 to firmly retain the lens assembly 10 in the housing 30.
  • the molding material forms a columnar fastener 31 similar to a rivet.
  • the columnar fastener 31 formed by the molding material passes through the circuit board 20 and the lens assembly 10, so as to firmly retain the lens assembly 10 in the housing 30 according to the physical principle of thermal expansion and contraction.
  • the one or more holes 22 in the circuit board 20 may have a cross-sectional area greater than or equal to the cross-sectional area of the one or more holes 12 in the lens assembly 10, thereby increasing the strength of the columnar fastener 31 formed by the molding material.
  • FIG. 8 illustrates a sectional view in a lateral direction of the light emitting module 1 according to the present disclosure.
  • a cross section in a vertical direction of the holes 12, 22 formed at edge positions of the lens assembly 10 and the circuit board 20 is shown.
  • the housing 30 would not easily peel off the lens assembly 10 even if it surrounds the lens assembly 10 only at the edge of the lens assembly 10.
  • the fastener 31 and the housing 30 are integrally formed by the same molding material in a same molding process, thereby simplifying the process.
  • the light emitting module 1 according to the present disclosure has advantages such as a simple production process, a compact structure, a low cost and so on.
  • FIG. 9 illustrates a flowchart of the flow 700 of a method for producing the light emitting module 1 according to the present disclosure.
  • step S702 the circuit board 20 is arranged in a mold, and the lens assembly 10 is aligned with the circuit board and is arranged on the circuit board 20 in an overlapped manner.
  • one or more holes 12, 22 are opened at vertically aligned coupling positions in the circuit board 20 provided with the light emitting elements 21 and the lens assembly 10.
  • a housing 30 at least partially surrounding the circuit board 20 and the lens assembly 10 is formed by a molding process, wherein the molding material forms a fastener 31 for firmly retaining the lens assembly 10 to the housing 30 while forming the housing 30 using the molding material.
  • the flow 700 ends at step S704.
  • the light emitting module according to the present disclosure can firmly retain the lens assembly by a housing made of a molding material.
  • the light emitting module has advantages such as a simple production process, a compact structure, a low cost and so on.
  • the one or more holes 12, 22 formed in the circuit board 20 and the lens assembly 10 have a circular cross section(s), the holes may also have cross section(s) in other shapes such as an ellipse, a square or the like.
  • center line of the one or more holes 22 formed in the circuit board 20 coincides with a center line of the one or more holes 12 formed in the lens assembly 10
  • the center line of the one or more holes 22 formed in the circuit board 20 may also deviate from the center line of the one or more holes 12 formed in the lens assembly 10 as long as projections of the one or more holes 12 formed in the lens assembly 10 on the circuit board 20 are surrounded in the one or more holes 22 formed in the circuit board 20 respectively.
  • the terms “include”, “comprise” and any other variations mean non-exclusive inclusion, so that the process, method, article or device that includes a series of elements includes not only those elements but also other elements that are not explicitly listed, or further includes inherent elements of the process, method, article or device. Moreover, when there is no further limitation, the element defined by the wording "include(s) a " does not exclude the case that the process, method, article or device that includes the element includes other same elements.
  • Light emitting module 1 Lens assembly 10 Hole 12 Circuit board 20 Light emitting element 21 Hole 22 Housing 30 Fastener 31

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
EP17722761.8A 2016-06-12 2017-05-10 Light emitting module and method for producing same Active EP3469256B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610407397.5A CN107489891A (zh) 2016-06-12 2016-06-12 发光模块及其制造方法
PCT/EP2017/061186 WO2017215848A1 (en) 2016-06-12 2017-05-10 Light emitting module and method for producing same

Publications (2)

Publication Number Publication Date
EP3469256A1 EP3469256A1 (en) 2019-04-17
EP3469256B1 true EP3469256B1 (en) 2020-11-25

Family

ID=58699131

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17722761.8A Active EP3469256B1 (en) 2016-06-12 2017-05-10 Light emitting module and method for producing same

Country Status (3)

Country Link
EP (1) EP3469256B1 (zh)
CN (1) CN107489891A (zh)
WO (1) WO2017215848A1 (zh)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102434813B (zh) * 2010-09-29 2015-08-12 欧司朗股份有限公司 发光模块以及具有该发光模块的背光照明灯串
US10024510B2 (en) * 2010-10-26 2018-07-17 Steven G. Hammond Flexible light emitting diode lighting process and assembly
CN202158397U (zh) * 2011-07-15 2012-03-07 深圳市日上光电有限公司 Led灯模组
CN103187504A (zh) * 2011-12-27 2013-07-03 展晶科技(深圳)有限公司 发光二极管封装结构
CN202580826U (zh) * 2012-05-10 2012-12-05 深圳市云傲照明有限公司 高出光效率的led模组
US9410665B2 (en) * 2012-07-16 2016-08-09 The Sloan Company, Inc. Flexible ribbon LED module
CN103791253A (zh) * 2012-10-30 2014-05-14 欧司朗股份有限公司 发光装置和制造该发光装置的方法
CN104124239A (zh) * 2013-04-29 2014-10-29 展晶科技(深圳)有限公司 发光二极管模组
CN104282830B (zh) * 2013-07-12 2018-01-30 展晶科技(深圳)有限公司 发光二极管模组
WO2015131139A1 (en) * 2014-02-27 2015-09-03 The Sloan Company, Inc. Dba Sloanled Flexible ribbon led module
CN104948949B (zh) * 2015-05-14 2018-03-09 达亮电子（苏州）有限公司 发光模块

Non-Patent Citations (1)

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Title
None *

Also Published As

Publication number Publication date
CN107489891A (zh) 2017-12-19
WO2017215848A1 (en) 2017-12-21
EP3469256A1 (en) 2019-04-17

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