EP3467701B1 - Module d'empreinte digitale et dispositif électronique - Google Patents
Module d'empreinte digitale et dispositif électronique Download PDFInfo
- Publication number
- EP3467701B1 EP3467701B1 EP16902744.8A EP16902744A EP3467701B1 EP 3467701 B1 EP3467701 B1 EP 3467701B1 EP 16902744 A EP16902744 A EP 16902744A EP 3467701 B1 EP3467701 B1 EP 3467701B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- fingerprint
- component
- circuit board
- support
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002184 metal Substances 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000009413 insulation Methods 0.000 claims description 18
- 239000003566 sealing material Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 description 14
- 230000005611 electricity Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 4
- 239000005041 Mylar™ Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000013072 incoming material Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Artificial Intelligence (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Bioinformatics & Computational Biology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Data Mining & Analysis (AREA)
- Evolutionary Biology (AREA)
- Evolutionary Computation (AREA)
- Life Sciences & Earth Sciences (AREA)
- Casings For Electric Apparatus (AREA)
- Image Input (AREA)
Claims (6)
- Module à empreinte digitale (100), comprenant un composant empreinte digitale (10), un composant bouton (20), un support (30), et un élément de fixation résilient (40), dans lequelle composant bouton (20) est fixé à une surface inférieure (S) du composant empreinte digitale (10) ;l'élément de fixation résilient (40) est disposé sur la surface inférieure (S) du composant empreinte digitale (10) et est située entre le composant empreinte digitale (10) et le support (30), l'élément de fixation résilient (40) entoure le composant bouton (20), et l'élément de fixation résilient (40) relie de façon résiliente le composant empreinte digitale (10) et le support (30) ;il y a un espace entre le composant bouton (20) et le support (30) ; etlorsque l'on appuie sur le composant empreinte digitale (10), l'élément de fixation résilient (40) se déforme, l'espace devient plus petit, et le composant bouton (20) entre en contact avec le support (30),dans lequel le support (30) comprend un corps principal (32), un pourtour de fixation (36), et un bras de liaison (34), le bras de liaison (34) est relié entre le corps principal (32) et le pourtour de fixation (36), le pourtour de fixation (36) est configuré pour se relier à un dispositif électronique (200), et le corps principal (32) est disposé en face du composant bouton (20),dans lequel le bras de liaison (34) entoure le corps principal (32) et forme une enceinte conjointement avec le corps principal (32), et le composant bouton (20) et l'élément de fixation résilient (40) sont tous les deux logés dans l'enceinte,dans lequel le bras de liaison (34) se courbe à un bord du corps principal (32) dans une direction faisant face au composant empreinte digitale (10), le bras de liaison (34) étant perpendiculaire à une surface sur laquelle le corps principal (32) est situé, dans lequel le pourtour de fixation (36) se courbe à un bord qui est du bras de liaison (34) et qui est à l'opposé du corps principal (32), et le pourtour de fixation (36) et le corps principal (32) sont situés séparément sur deux extrémités du bras de liaison (34),dans lequel le support (30) est d'une structure de métal moulée de façon monobloc, et une couche d'isolation (37) est disposée sur une surface qui est du corps principal (32) et qui n'est pas en contact avec le composant bouton (20),dans lequel l'élément de fixation résilient (40) est du caoutchouc imperméable, le caoutchouc imperméable entoure le composant bouton (20), le caoutchouc imperméable et le composant empreinte digitale (10) sont fixés en utilisant un adhésif imperméable, et le caoutchouc imperméable et le support (30) sont fixés en utilisant un adhésif imperméable.
- Module à empreinte digitale (100) selon la revendication 1, dans lequel une rainure de trop-plein d'adhésif (362) est disposée sur le pourtour de fixation (36), et est configurée pour fixer le support (30) au dispositif électronique (200) d'une manière distribuant l'adhésif.
- Module à empreinte digitale (100) selon l'une quelconque des revendications 1 ou 2, dans lequel la surface inférieure (S) du composant empreinte digitale (10) est une carte de circuit imprimé (12) ; et une surface supérieure du composant empreinte digitale (10) est une puce de reconnaissance d'empreinte digitale (14), le module à empreinte digitale (10) comprend en outre une carte de circuit imprimé flexible (15), une extrémité de la carte de circuit imprimé flexible (15) est électriquement connectée à la carte de circuit imprimé (12), et le composant bouton (20) est électriquement connecté à une carte principale du dispositif électronique (200) en utilisant la carte de circuit imprimé (12) et la carte de circuit imprimé flexible (15).
- Module à empreinte digitale (100) selon la revendication 3, dans lequel une sortie (38) est disposée sur le support (30), la sortie (38) est utilisée par la carte de circuit imprimé flexible (15) pour s'étendre depuis la carte de circuit imprimé (12) jusqu'à un côté externe du support (30), et la sortie est remplie avec un matériau d'étanchéité (17), pour qu'une structure imperméable soit formée entre la carte de circuit imprimé flexible (15) et le support (30).
- Module à empreinte digitale (100) selon la revendication 3 ou 4, dans lequel le composant empreinte digitale (10) comprend en outre une bague de métal (16), la bague de métal (16) est disposée sur une périphérie de la puce de reconnaissance d'empreinte digitale (14), une partie de la bague de métal (16) est fixée à la carte de circuit imprimé (12), et une partie de la bague de métal (16) enveloppe une zone de bord sur un côté qui est de la puce de reconnaissance d'empreinte digitale (14) et qui est à l'opposé de la carte de circuit imprimé (12) .
- Dispositif électronique (200), comprenant le module à empreinte digitale (100) selon l'une quelconque des revendications 1 à 5.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2016/083755 WO2017201755A1 (fr) | 2016-05-27 | 2016-05-27 | Module d'empreinte digitale et dispositif électronique |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3467701A1 EP3467701A1 (fr) | 2019-04-10 |
EP3467701A4 EP3467701A4 (fr) | 2019-05-22 |
EP3467701B1 true EP3467701B1 (fr) | 2022-12-28 |
Family
ID=60411099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16902744.8A Active EP3467701B1 (fr) | 2016-05-27 | 2016-05-27 | Module d'empreinte digitale et dispositif électronique |
Country Status (5)
Country | Link |
---|---|
US (1) | US11138403B2 (fr) |
EP (1) | EP3467701B1 (fr) |
CN (1) | CN107851177B (fr) |
HK (1) | HK1244089A1 (fr) |
WO (1) | WO2017201755A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108805110A (zh) * | 2018-09-04 | 2018-11-13 | 张平 | 一种指纹识别模块与实体按键的整体结构 |
CN111834149B (zh) | 2019-04-22 | 2022-09-20 | 讯芯电子科技(中山)有限公司 | 按键模块及电子装置 |
CN112003977B (zh) * | 2020-09-03 | 2021-10-19 | 惠州市米琦科技有限公司 | 指纹、压感、点胶一体测试设备 |
CN114211244A (zh) * | 2021-12-13 | 2022-03-22 | 深圳市云顶信息技术有限公司 | 一种电动牙刷的组装方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100838665B1 (ko) | 2007-01-09 | 2008-06-16 | (주)씨앤피하이텍 | 일체형 전계발광(el) 키패드와 그 제조방법 |
CN102369499B (zh) * | 2009-03-11 | 2015-02-18 | 英诺晶片科技股份有限公司 | 指向元件以及具有此指向元件的电子装置 |
TWI444861B (zh) * | 2011-12-06 | 2014-07-11 | Howay Corp | 觸控辨識方法及電容式指向裝置 |
US9030440B2 (en) * | 2012-05-18 | 2015-05-12 | Apple Inc. | Capacitive sensor packaging |
US9443126B2 (en) * | 2012-11-20 | 2016-09-13 | Crucialtec Co., Ltd. | Fingerprint sensor module, portable electronic device including same, and method for manufacturing same |
JP2014186847A (ja) | 2013-03-22 | 2014-10-02 | Fujitsu Ltd | 電子機器 |
KR20150099295A (ko) * | 2014-02-21 | 2015-08-31 | 삼성전자주식회사 | 물리적 키를 포함하는 포터블 전자 장치 |
CN104408434B (zh) * | 2014-12-03 | 2018-07-03 | 南昌欧菲生物识别技术有限公司 | 指纹感测装置以及电子设备 |
CN104767513B (zh) * | 2015-04-24 | 2018-06-05 | 努比亚技术有限公司 | 多功能按键及移动终端 |
CN204883484U (zh) * | 2015-07-07 | 2015-12-16 | 深圳市金立通信设备有限公司 | 终端 |
CN105373778B (zh) * | 2015-11-02 | 2019-05-24 | 魅族科技(中国)有限公司 | 一种指纹模组及终端 |
CN205356427U (zh) * | 2015-12-15 | 2016-06-29 | 华为技术有限公司 | 用于终端设备的按压模组及终端设备 |
KR102514733B1 (ko) * | 2016-02-19 | 2023-03-29 | 삼성전자주식회사 | 키를 포함하는 전자 장치 |
-
2016
- 2016-05-27 CN CN201680025129.5A patent/CN107851177B/zh active Active
- 2016-05-27 US US16/304,804 patent/US11138403B2/en active Active
- 2016-05-27 WO PCT/CN2016/083755 patent/WO2017201755A1/fr unknown
- 2016-05-27 EP EP16902744.8A patent/EP3467701B1/fr active Active
-
2018
- 2018-03-12 HK HK18103405.3A patent/HK1244089A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP3467701A4 (fr) | 2019-05-22 |
CN107851177B (zh) | 2021-02-02 |
WO2017201755A1 (fr) | 2017-11-30 |
US20200320268A1 (en) | 2020-10-08 |
EP3467701A1 (fr) | 2019-04-10 |
US11138403B2 (en) | 2021-10-05 |
CN107851177A (zh) | 2018-03-27 |
HK1244089A1 (zh) | 2018-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3401753B1 (fr) | Dispositif d'affichage et terminal mobile | |
EP3467701B1 (fr) | Module d'empreinte digitale et dispositif électronique | |
KR101387731B1 (ko) | 포인팅 장치 및 그 제조방법 | |
US10264336B2 (en) | Electronic device and conductive structure | |
CN105518706A (zh) | 生物识别传感器叠堆结构 | |
EP3457315B1 (fr) | Module d'empreinte digitale et terminal mobile le comprenant | |
JP2010103240A (ja) | 接触センサユニット、電子装置及び接触センサユニットの製造方法 | |
CN108885694B (zh) | 指纹识别组件及终端 | |
US20160188058A1 (en) | Touch device utilizing metal mesh as touch sensor | |
KR20140123919A (ko) | 지문센서 모듈, 이를 구비한 휴대용 전자기기 및 그 제조방법 | |
EP2722860B1 (fr) | Dispositif électronique | |
CN108205650B (zh) | 指纹辨识模块 | |
CN108153026B (zh) | 显示屏组件及电子设备 | |
KR20140135478A (ko) | 모바일 장치용 지문 센서 모듈 및 이의 제조 방법 | |
WO2016202278A1 (fr) | Appareil de reconnaissance d'empreinte digitale, écran tactile et terminal mobile | |
CN106775118B (zh) | 一种压力感应装置及设备 | |
JP7215538B2 (ja) | アンテナ装置の製造方法および時計の製造方法 | |
US9698519B2 (en) | Water-proof connector for an electronic device | |
US11361916B2 (en) | Waterproof button module and electronic device | |
CN110192166A (zh) | 侧键装置及电子终端 | |
JP6624525B2 (ja) | アンテナ装置および時計 | |
KR20170130905A (ko) | 지문센서 모듈 | |
KR102285091B1 (ko) | 표시장치 | |
JP2007095577A (ja) | 操作部の取付構造 | |
KR20150020024A (ko) | 지문센서 모듈, 이를 구비한 휴대용 전자기기 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20181204 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20190426 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: G06K 9/00 20060101AFI20190418BHEP Ipc: G06F 1/16 20060101ALI20190418BHEP Ipc: G06F 3/041 20060101ALI20190418BHEP |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
17Q | First examination report despatched |
Effective date: 20210209 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: HONOR DEVICE CO., LTD. |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Ref document number: 602016077196 Country of ref document: DE Free format text: PREVIOUS MAIN CLASS: G06K0009000000 Ipc: G06V0040130000 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: GRANT OF PATENT IS INTENDED |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H04M 1/02 20060101ALI20220624BHEP Ipc: G06F 1/16 20060101ALI20220624BHEP Ipc: G06K 9/00 20060101ALI20220624BHEP Ipc: G06F 3/041 20060101ALI20220624BHEP Ipc: G06V 40/13 20220101AFI20220624BHEP |
|
INTG | Intention to grant announced |
Effective date: 20220802 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE PATENT HAS BEEN GRANTED |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602016077196 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 1540955 Country of ref document: AT Kind code of ref document: T Effective date: 20230115 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: FP |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG9D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230328 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 1540955 Country of ref document: AT Kind code of ref document: T Effective date: 20221228 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230329 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 20230417 Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230428 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20230404 Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230428 Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602016077196 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20230406 Year of fee payment: 8 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20230929 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20230531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20221228 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20230527 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20230531 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20230531 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20230527 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20230527 |