EP3464674A4 - High-precision shadow-mask-deposition system and method therefor - Google Patents

High-precision shadow-mask-deposition system and method therefor Download PDF

Info

Publication number
EP3464674A4
EP3464674A4 EP17803308.0A EP17803308A EP3464674A4 EP 3464674 A4 EP3464674 A4 EP 3464674A4 EP 17803308 A EP17803308 A EP 17803308A EP 3464674 A4 EP3464674 A4 EP 3464674A4
Authority
EP
European Patent Office
Prior art keywords
mask
method therefor
deposition system
precision shadow
shadow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17803308.0A
Other languages
German (de)
French (fr)
Other versions
EP3464674A1 (en
Inventor
Amalkumar P. Ghosh
Fridrich Vazan
Munisamy Anandan
Evan DONOGHUE
Ilyas I. Khayrullin
Tariq Ali
Kerry TICE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Emagin Corp
Original Assignee
Emagin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emagin Corp filed Critical Emagin Corp
Priority claimed from PCT/US2017/033161 external-priority patent/WO2017205147A1/en
Publication of EP3464674A1 publication Critical patent/EP3464674A1/en
Publication of EP3464674A4 publication Critical patent/EP3464674A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
EP17803308.0A 2016-05-24 2017-05-17 High-precision shadow-mask-deposition system and method therefor Pending EP3464674A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662340793P 2016-05-24 2016-05-24
PCT/US2017/033161 WO2017205147A1 (en) 2016-05-24 2017-05-17 High-precision shadow-mask-deposition system and method therefor

Publications (2)

Publication Number Publication Date
EP3464674A1 EP3464674A1 (en) 2019-04-10
EP3464674A4 true EP3464674A4 (en) 2020-01-29

Family

ID=65563028

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17803308.0A Pending EP3464674A4 (en) 2016-05-24 2017-05-17 High-precision shadow-mask-deposition system and method therefor

Country Status (2)

Country Link
EP (1) EP3464674A4 (en)
CN (1) CN109642313B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741943A (en) * 1993-07-27 1995-02-10 Nec Corp Sputtering device
JPH07150347A (en) * 1993-11-26 1995-06-13 Nec Corp Sputtering device having collimator
US20040115338A1 (en) * 2002-09-05 2004-06-17 Sanyo Electric Co., Ltd. Manufacturing method of organic electroluminescent display device
US20070024831A1 (en) * 2005-07-27 2007-02-01 International Business Machines Corporation A method and apparatus for correcting gravitational sag in photomasks used in the production of electronic devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012052155A (en) * 2010-08-31 2012-03-15 Canon Inc Mask unit for vacuum film deposition and vacuum film deposition apparatus with the same
US8658545B2 (en) * 2010-12-27 2014-02-25 Sharp Kabushiki Kaisha Vapor deposition device, vapor deposition method and organic EL display device
CN203159695U (en) * 2013-01-22 2013-08-28 昆山允升吉光电科技有限公司 Masking component used for evaporation
JP6068514B2 (en) * 2013-01-29 2017-01-25 シャープ株式会社 Vapor deposition unit and vapor deposition apparatus
CN105378139B (en) * 2013-07-08 2017-06-13 夏普株式会社 The manufacture method of evaporation coating device, evaporation coating method and organic electroluminescent device
CN104911548B (en) * 2015-06-30 2017-05-03 合肥鑫晟光电科技有限公司 Vacuum evaporation device and evaporation method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741943A (en) * 1993-07-27 1995-02-10 Nec Corp Sputtering device
JPH07150347A (en) * 1993-11-26 1995-06-13 Nec Corp Sputtering device having collimator
US20040115338A1 (en) * 2002-09-05 2004-06-17 Sanyo Electric Co., Ltd. Manufacturing method of organic electroluminescent display device
US20070024831A1 (en) * 2005-07-27 2007-02-01 International Business Machines Corporation A method and apparatus for correcting gravitational sag in photomasks used in the production of electronic devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017205147A1 *

Also Published As

Publication number Publication date
CN109642313A (en) 2019-04-16
CN109642313B (en) 2021-03-09
EP3464674A1 (en) 2019-04-10

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