EP3460081A3 - Titanium copper for electronic components - Google Patents

Titanium copper for electronic components Download PDF

Info

Publication number
EP3460081A3
EP3460081A3 EP18196022.0A EP18196022A EP3460081A3 EP 3460081 A3 EP3460081 A3 EP 3460081A3 EP 18196022 A EP18196022 A EP 18196022A EP 3460081 A3 EP3460081 A3 EP 3460081A3
Authority
EP
European Patent Office
Prior art keywords
titanium copper
electronic components
copper
mass
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP18196022.0A
Other languages
German (de)
French (fr)
Other versions
EP3460081B1 (en
EP3460081A2 (en
Inventor
Hiroyasu Horie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP3460081A2 publication Critical patent/EP3460081A2/en
Publication of EP3460081A3 publication Critical patent/EP3460081A3/en
Application granted granted Critical
Publication of EP3460081B1 publication Critical patent/EP3460081B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum

Abstract

The present invention is intended to improve bending workability of titanium copper for electronic components, and to provide a titanium copper for electronic components, which has excellent bending workability even when subjected to beating process, and to provide a method for manufacturing the same. One embodiment of the present invention is a titanium copper, comprising 2.0 to 4.5 mass% of Ti, and at least one element selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg, and Si in total of 0 to 0.5 mass% as a third element(s), and the rest consisting of copper and inevitable impurities, wherein in a crystal orientation analysis by EBSD measurement on the rolled surface, when an orientation difference of 5° or more is defined as a crystal grain boundary, a coefficient of variation of crystal grain size is 45% or less, and an area ratio of Cube orientation {001} <100> is 5% or less.
EP18196022.0A 2017-09-22 2018-09-21 Titanium copper for electronic components Active EP3460081B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017182738A JP6310130B1 (en) 2017-09-22 2017-09-22 Titanium copper for electronic parts

Publications (3)

Publication Number Publication Date
EP3460081A2 EP3460081A2 (en) 2019-03-27
EP3460081A3 true EP3460081A3 (en) 2019-05-15
EP3460081B1 EP3460081B1 (en) 2020-05-13

Family

ID=61902014

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18196022.0A Active EP3460081B1 (en) 2017-09-22 2018-09-21 Titanium copper for electronic components

Country Status (3)

Country Link
EP (1) EP3460081B1 (en)
JP (1) JP6310130B1 (en)
RU (1) RU2691007C1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566915A (en) * 1983-11-22 1986-01-28 Ngk Insulators, Ltd. Process for producing an age-hardening copper titanium alloy strip
US20100139822A1 (en) * 2008-12-08 2010-06-10 Weilin Gao Cu-Ti-based copper alloy sheet material and method of manufacturing same
EP2196548A1 (en) * 2008-12-02 2010-06-16 Dowa Metaltech Co., Ltd. Cu-Ti based copper alloy sheet material and method of manufacturing same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU165723B (en) * 1969-05-05 1974-10-28
RU2104139C1 (en) * 1996-09-20 1998-02-10 Товарищество с ограниченной ответственностью Научно-техническая фирма "Техма" Dispersion-hardness material for electrodes of resistance welding
JP3942505B2 (en) 2002-07-16 2007-07-11 ヤマハメタニクス株式会社 Titanium copper alloy material and manufacturing method thereof
JP4439003B2 (en) * 2005-03-28 2010-03-24 日鉱金属株式会社 Titanium copper alloy excellent in strength and bending workability and manufacturing method thereof
KR101503185B1 (en) * 2010-08-27 2015-03-16 후루카와 덴키 고교 가부시키가이샤 Copper alloy sheet and manufacturing method for same
CN103069026B (en) 2010-08-31 2016-03-23 古河电气工业株式会社 Copper alloy plate and manufacture method thereof
JP2013100586A (en) 2011-11-09 2013-05-23 Jx Nippon Mining & Metals Corp Copper-titanium alloy and method of manufacturing the same
JP6196435B2 (en) * 2012-10-02 2017-09-13 Ｊｘ金属株式会社 Titanium copper and method for producing the same
JP6263333B2 (en) * 2013-03-25 2018-01-17 Ｄｏｗａメタルテック株式会社 Cu-Ti copper alloy sheet, method for producing the same, and current-carrying component
JP5718443B1 (en) * 2013-12-27 2015-05-13 Jx日鉱日石金属株式会社 Titanium copper for electronic parts
JP6368518B2 (en) 2014-03-28 2018-08-01 Ｄｏｗａメタルテック株式会社 Cu-Ti copper alloy sheet, method for producing the same, and energized component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566915A (en) * 1983-11-22 1986-01-28 Ngk Insulators, Ltd. Process for producing an age-hardening copper titanium alloy strip
EP2196548A1 (en) * 2008-12-02 2010-06-16 Dowa Metaltech Co., Ltd. Cu-Ti based copper alloy sheet material and method of manufacturing same
US20100139822A1 (en) * 2008-12-08 2010-06-10 Weilin Gao Cu-Ti-based copper alloy sheet material and method of manufacturing same

Also Published As

Publication number Publication date
EP3460081B1 (en) 2020-05-13
RU2691007C1 (en) 2019-06-07
JP6310130B1 (en) 2018-04-11
EP3460081A2 (en) 2019-03-27
JP2019056166A (en) 2019-04-11

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