EP3458902A2 - Method for producing security elements having a lenticular flip - Google Patents

Abstract

Described is a method for producing a security element (1) in the form of a lenticular flip, comprising a micro-optical layer (11), a carrier substrate (13) and an image layer (14), the image layer (14) comprising n images (14l, 14r) for n = 1 to i which are visible from an n-th observation angle associated with the n-th image (14l, 14r), and n being at least 1. The images are imaged on a photoresist (16) with parallel light in contact print or by means of projection. After the photoresist (16) is developed, an image layer (14) which comprises the i images is present.

Description

 Method for producing security elements with a

Lenticular flip

The invention relates to a method according to the preamble of claim 1 for the production of security elements with a lenticular flip.

As a lenticular flip, an optical element for reproducing images is called by tilting about one or more tilt axes

Image change generated.

US Pat. No. 6,016,225 describes a lenticular flip

Security element in which an array of microlenses is arranged over strip-shaped printed image information, whereby the exact positioning of the image information to the optical elements is problematic.

The object of the present invention is to provide an improved method for producing a security element. According to the invention, this object is achieved with the subject matter of claim 1. The invention relates to a method for producing a security element, comprising a microoptical layer, wherein the microoptical layer comprises an array formed by microoptical systems, a carrier substrate and an image layer or multiple image layers, wherein the one or more image layers comprise n partial images for n = 1 to i, which comprise an nth assigned to the nth field

Viewing angles are visible, and where n is at least 1, wherein it is proposed that the following method steps are provided:

a) providing the carrier substrate, on the upper side of which the microoptical layer is formed;

b) applying a photoresist to the underside of the carrier substrate;

c) forming a latent n-th sub-image in the photoresist, wherein an nth master image is placed on the micro-optical layer and exposed to incident at an n-th angle of incidence and n-th incidence azimuth parallel light beams, or

 wherein an n-th master image with parallel light rays incident at an n-th incidence angle and an n-th incidence azimuth on the

 micro-optical layer is projected, or

 wherein the photoresist is applied in step b) in the form of an n-th master image on the underside of the carrier substrate, and wherein the photoresist through the micro-optical layer with below an n-th

 Incident angle and an n-th incidence azimuth incident parallel light beams is exposed;

d) repetition of process step c) until the formation of the i-th

 latent partial image;

e) developing the photoresist to the image layer. The proposed method has the advantage that by the optical transmission of the i master images on the photoresist a variety of

Design variants can be formed, wherein the photoresist in terms of its type (positive or negative), its color, its sensitivity and its

Development process is selectable.

Another advantage is that with the proposed method, a very large variety of variants can be formed, with relatively few process steps are required. The layer structure produced forms a "self-referencing system" which is very tolerant to distortions, dilations and errors of the micro-optical systems.

A micro-optical system is understood in particular to mean an imaging optical system in which at least one dimension lies below the resolution capability of an unarmed human eye. The resolution is dependent on the respective viewing distance. A typical example would be for security applications

Viewing distance of about 250 mm. For this viewing distance, the dimension is less than about 300 μιτι.

The exposure takes place in an angle of incidence range with nearly parallel rays. It can also be a larger angle of incidence range. This leads to the fact that the corresponding partial image is recognizable within a larger viewing angle range.

The terms angle of incidence and viewing angle should each also include a corresponding area around an exact angle,

in particular a range ± 10 ° around the respective angle of incidence or Viewing angle. The position of the observer can vary accordingly within the viewing angle range.

The proposed method is further characterized by the fact that no insets are necessary, i. the image layer does not have to be inserted and / or applied in a positionally exact manner to the micro-optical system.

The security element produced by the method has good intercoat adhesion especially due to its simple structure with few required layers. It is therefore easy with others

Security elements can be integrated in foils.

The process is also characterized by high productivity. The angles of incidence and the incident azimuth describe the spatial

Orientation of an incident on the micro-optical layer

Projection beam. The angle of incidence is the vertical angle of the

Projection beam, relative to the normal to the micro-optical layer. The incident azimuth is the horizontal angle formed by projecting the projection beam onto the x-y plane.

The carrier substrate provided in process step a), on the

Top side, the micro-optical layer is formed, as described below, be formed as a carrier film. The microoptical layer may also be a film, which is designed, for example, as a self-supporting film. The micro-optical layer can under the influence of pressure and temperature and possibly after application of

Interlayers are laminated or glued to the carrier film. The Microoptical layer may also be formed as a transfer layer of a transfer film, which is withdrawn during or after the application of the micro-optical layer on the carrier film. The carrier film may also temporarily serve as a protective film for the micro-optical systems, for example, damage to the micro-optical systems in subsequent

 Prevent procedural steps. The carrier film may also have an optical function. Examples would be carrier films of high refractive index

Materials or carrier films with polarizing or in particular

Wavelength ranges of absorbing properties.

The method steps a) and b) can also be carried out in a changed order or simultaneously. In the simplest case, the side opposite the micro-optical layer is coated with the photoresist. The coating can take place over the entire surface or over part of the area. For example, the photoresist may be applied in the form of a pattern or in the form of one or more motifs. Methods are coating, especially printing from solution

(solvent-containing, aqueous systems); Solvent-free (liquid, semi-liquid) or else applying so-called dry resists by rolling, sticking, laminating or by transfer of a transfer layer from a carrier by hot stamping or cold stamping.

The wavelength of the light used in method step c) can be in the UV range or in the UV range in accordance with the preferred use of a UV-sensitive photoresist. Photoresists for the visual wavelength range are also available, for example in the

Spectral range of the spectral colors blue to green. These photoresists also have the advantage that no UV radiation is needed. The photoresist may be on different substrates during the exposure process, for example, they may be dark (black, gray) or bright (white) or transparent or translucent and / or metallic. They can be scattering or non-scattering. An exposure without a base is also possible.

Since the method step c) is repeated (i-1) times until the formation of the ith sub-image, it is possible to form two or more sub-images in the image layer that are at different tilt angles of the security element or from different viewing directions, ie different

 Viewing angles are visible. For example, the image layer may be formed with array subimages that create the illusion of movement as the security element is tilted. Another example is the

Conversion of a first image, possibly via intermediates, into a second image (morphing).

Method step e) may include an additional exposure, optionally also at a different wavelength than in method step c), in order to further harden the image layer. Post-curing can also be achieved by means of electron beam radiation (so-called e-beam) and / or via a chemical crosslinker,

especially in the material of the photoresist. It is also possible to apply another layer beforehand in order to cure them together or to achieve a better bond between the layers. In an advantageous embodiment, it is also possible that process step e) takes place before step d). In particular, if the photoresist is applied in step b) in the form of an n-th master image on the underside of the carrier substrate and if the photoresist through the micro-optical layer with It is possible to develop the respective photoresist after each step of application, under an n-th angle of incidence and an n-th incidence azimuth. Alternatively, all applied photoresist layers can be developed together.

For example, the method steps are carried out in the order c) or d), then e) or else c), then e), then c) or d) and again e). The order can also be b), then c) or d) and then e). The carrier substrate may be formed in preferred embodiments as a carrier film, wherein the carrier film of a plurality of layers or

Layered composites can be formed. The carrier film can be a film made of a thermoplastic, for example polyethylene (PE), polypropylene, polycarbonate or polyester (PET, PETG) with a thickness of about 20 μm. It can also be a composite of different

 Plastic layers are used, which are connected to each other, for example by means of an adhesive. The thickness of the carrier film moves

typically in the range from 6 μm to 200 μm, preferably from 12 μm to 50 μm, more preferably from 16 μm to 36 μm. Semi-rigid or rigid substrates made of plastic, for example, can also be used as the carrier substrate

 Be provided plastic sheets of PMMA, glass or glass-like materials.

It can be provided that the micro-optical systems in the array as a security feature and / or as a decorative feature of

Security elements form trained pattern. For example, it may be provided that the spacing of adjacent microoptical systems is changed continuously or discontinuously or alternately. It can also be provided a repetitive offset or delay of the micro-optical systems, for example, be provided for every thirtieth micro-optical system in a row an offset by half the length of the micro-optical system. Counterfeiting of the security element is complicated by the fact that when copying the micro-optical layer and the image layer both must be brought into exact position to the pattern of the array. Also possible are statistical variations of the micro-optical systems, eg with respect to distance, position to each other and / or their shape. Furthermore, it can be provided that the microoptical layer comprises differently designed arrays of microoptical systems. The arrays may differ, for example, in the dimensions and / or the arrangement of the micro-optical systems. The micro-optical system can be constructed of alternating transparent and opaque or partially opaque areas. In the simplest case, these can be line grids, which are printed, for example. However, they may also be more complex arrangements of transparent and opaque areas. Such line grid can also be lamellar

be arranged for a viewing angle-dependent effect similar to a blind.

It can be provided that the micro-optical layer comprises an aperture layer which has transparent and opaque areas. The diaphragm layer can, for example, have alternating transparent and opaque strips and / or an array formed by pinhole diaphragms. The strips and / or the pinhole diaphragms may be formed as through-holes or as transparent regions in the micro-optical layer. Because the transparency of a

Material is dependent on the frequency or the wavelength of a electromagnetic wave, for example, the micro-optic layer may be opaque to light but transparent to other wavelengths of the electromagnetic spectrum. By transparent is a transmissivity of more than 50%, preferably more than 70%, more preferably more than 90% in at least one

To understand part of the visible to the human eye wavelength range. Under opaque is a transmissivity of less than 20%,

preferably less than 5%, more preferably less than 1% in at least a portion of the visible to the human eye

Wavelength range to understand.

In a further advantageous embodiment it can be provided that the micro-optical layer comprises an array formed from microlenses. The microlenses may be formed as spherical lenses, as aspherical lenses, as astigmatic lenses or as cylindrical lenses with symmetrical or asymmetrical shape. As further lens shapes, oval lenses, S-shaped lenses, circular or other curved lenses may be provided. The lenses may be in different patterns, e.g. be arranged hexagonally. For arrays with relatively large raster periods, the microlenses can also be formed as Fresnel lenses. Although the

Image properties of Fresnel lenses may be worse than the aforementioned microlenses, the lower height of the Fresnel lenses can speak for their use. The microlenses may be on the surface of the

Micro-optical layer or in recesses of the micro-optical layer can be arranged. The micro-optical layer or areas of the

Micro-optical layer can also be arranged in recesses of a spacer layer. Between the microlenses can be substantially flat Intermediate areas may be arranged, which, however, should be low in areal proportion. By appropriate arrangement of the microlenses to each other or by trimming the edge regions of the microlenses, the

Intermediate areas are minimized or eliminated. It may be advantageous if the flat areas lying between the microlenses are opaque or partially opaque. This can be achieved for example by colors, imprints or metallization. The flat areas can also be optical structures such as e.g. Have microstructures. As an alternative to lenses, prisms and many other relief shapes, such as trapezoids, etc., can also be used in special cases. In trapezoids, the horizontal areas are preferably opaque. A combination of areas with different structures is also possible. These can be juxtaposed as well as interlaced or nested.

The upper side of the micro-optical layer can have one or more additional layers, in whole or in part, for example

 a relatively thin layer of adhesive which provides better embedding of e.g. security element designed as a security thread, without the optical function of the micro-optical systems being disproportionately restricted;

 Partial metal layers produced by demetalization or

 Schrägbedampfung be formed;

 partially printed, possibly colored lacquers with an optical refractive index equal to or very similar to the microoptical layer, to microoptical

Optically cancel systems in certain areas; thin protective layers to increase the abrasion resistance of the

 Micro-optical systems, wherein the protective layers may be formed, for example, from paints with nanoparticles;

 - Micro-optical systems, as described below as lenses

 are formed, for example, have an optical refractive index of 2.0, can be coated with a protective or covering layer having an optical refractive index of, for example, 1, 5. Advantageously, such a coated micro-optical layer can not be copied in its optical function by molding, for example galvanic molding.

The micro-optical layer formed as a lens layer can

preferably be formed of a plastic. The plastics are usually thermoplastics or reactive systems. Examples of reactive systems are: radiation-curing systems, for example UV-curing systems, thermally reactive systems, for example epoxy resin hardener systems, catalytically curing systems, hybrid systems, etc. Die

Starting materials may be liquid, semi-solid, pasty or solid. It is also possible to use thermoplastic elastomers. However, inorganic materials such as glass and combinations are also usable. The lens layer may also be colored, for example by the addition of color pigments and / or dyes or may have an intrinsic color. The generation of the microlenses can be carried out according to the prior art by thermal molding (replication), UV replication, printing processes or lithographic processes. It can be provided that the microlenses with at least two

different focal lengths are formed. The image plane is in the aforementioned parallel beam path in the focal point or near the

Focus of the microlenses. Patterned areas may be formed in the array having locally different orientation, for example 0 ° and 45 °. The patterns of microlenses could be an additional

represent macroscopic form or an illustration. Depending on the exposure angle and the shape of the microlenses, the respective focal point may lie in different levels of the security element.

The microlenses can also have haptic properties.

It can be advantageous if micro-optical systems are used in which the alignment of e.g. Cylindrical lenses are arranged in two areas at 90 ° to each other. If the exposure takes place in the first and second regions with an azimuth of 0 ° to the axis of the respective cylindrical lenses, then in each case tilting about the tilt axes, which are aligned with the longitudinal axes of the respective cylindrical lens in the first and in the second region, only in each case in one area a picture change (picture flip) visible. In the other area, the picture would remain static.

It may be advantageous if in step c) "defocused" is exposed so that the exposed areas, for example strips, are enlarged, the exposure then takes place, for example, in a certain angle of incidence range

Viewing angle range can be realized according to the

Incidence angle range during imprinting. The security element is relatively tolerant to the position of the photoresist. Some tolerance to the position of the photoresist in relation to the microlens Focal points is essential in that it is certain

Production method for the microlens layer, such as the

Gravure printing process, may lead to variations in the microlens shape associated with a variation of the position of the focal point.

It can further be provided that the microoptical layer has two or more microoptical systems arranged next to one another. The

Micro-optical systems may be arranged in the form of a pattern and / or one or more motifs.

In a further advantageous embodiment it can be provided that the micro-optical layer has two or more micro-optical systems arranged in an xy grid, wherein the x-axis of the xy-grid is arranged under an x-azimuth (αι) to the longitudinal side of the carrier substrate and the y-axis is located below a y-azimuth (a _q ) to the lateral side of the carrier substrate.

It may further be provided that the micro-optical systems are arranged in a distorted grid. A distorted grid is understood to mean a grid whose longitudinal and transverse rows are not in the form of a straight line

are formed.

In an advantageous embodiment it can be provided that the

Micro-optical systems are designed as ball lenses. The height of the ball lenses can in a first example at a raster period of the array of about 35 μιτι, a thickness of the formed as a lens layer

Micro-optical layer in the range of 20 μιτι to 25 μιτι and a

Total thickness of the lens layer and the carrier substrate in the range of 35 μιτι to 40 μηη about 12 μηη amount. With retention of the mentioned in the first example grid period of about 35 μιτι, a thickness of the lens layer in the range of 50 μιτι to 60 μιτι and a total thickness of the lens layer and the carrier substrate of about 70 μιτι, the ball lenses have a height of about 7 μιτι so flatter trained.

It can be provided that the x-azimuth (αι) is equal to 90 °.

In an advantageous embodiment can be provided that in

Process step b) a negative photoresist is applied. To form a positive image in the image layer, the master image is to be formed as a negative image. The positive image and the negative image are characterized by the reversal of the brightness and / or the color of their pixels. By a positive photoresist is meant a resist in which the exposed areas are removed after development. Similarly, in a negative photoresist, the unexposed areas are removed. In the case of positive masks, the respective design elements are formed as transparent regions, in the case of negative masks the design elements are opaque. Depending on the subsequent process, the photoresist may be colorless or pigmented and / or colored and / or printed in multiple colors. As colors, dissolved dyes and / or pigments, including special pigments, as in the

Security area are used, for example, UV-fluorescent pigments used. Preference is given to pigments with small particle sizes below the layer thickness of the photoresist. Further preferred are so-called nanopigments, ie pigments with particle sizes below 1 μιτι, preferably below 0.5 μιτι. The pigments may be inorganic or organic in nature be or mixtures of both. In addition to insoluble pigments and soluble dyes can be used.

The photoresist layer can be transparent, semitransparent or opaque, possibly opaque only in certain wavelength ranges. So can the colored

 Photoresist, for example, in the near UV, in which the photoresist is sensitive, be largely transparent, but appear substantially black in the visible wavelength range. It is also possible to use liquid-crystalline materials as the photoresist in which, if appropriate, additional spatial orientations of the liquid-crystalline molecules take place during the exposure process and / or curing process. The orientation of the molecules can e.g. on physical structures such as microstructures and / or by exposure to polarized light.

Alternatively it can be provided that in process step b) a positive photoresist is applied. It can also be positive and negative

Photoresists are used, e.g. in juxtaposed

Surfaces. The exposure can be at the same time or one after the other, if necessary with

different radiation dose, done.

It can further be provided that in method step b) a microstructure is formed in the lower side of the photoresist facing away from the carrier substrate or in the underside of the image layer facing away from the carrier substrate. The microstructure may, for example, be a hologram, an optical lattice structure or the like. The spacer layer may also have an optical lattice structure. Further subclaims are directed to applying further layers to the image layer after process step e). It can be provided that, after method step e), a single-layer or multi-layer decorative layer is applied to the image layer.

It can also be provided that, after method step e), one or more color layers are applied or applied to the image layer.

It can further be provided that after method step e) a

Metal layer or an HRI layer is applied to the photoresist or on the image layer. As HRI layer is referred to a layer having a high optical refractive index (HRI = High Refractive Index).

For example, ZnS or ΤΊΟ2 can be used.

Further subclaims relate to the formation of the image layer. It can be provided that the image layer is formed as an etching mask and areas of the metal layer or the HRI layer not covered by image areas of the image layer are removed by etching.

In an advantageous embodiment it can be provided that the image layer is used as a lift-off layer. The term "lift-off" describes a method in which the image layer is designed as a mask for detachment of further layers lying above the image layer to be colored lacquer coatings, which are coated flat, and which are structured in a washing process. In particular, the image layer has a strongly pigmented and thus porous or slightly uneven lacquer layer which is soluble in a solvent. The image layer is dissolved with a suitable solvent so that the overlying

 Surface regions of the other layers are detached and thus openings are generated in the other layers.

It can further be provided that after the method step e) a multilayer structure is applied to the image layer, comprising

especially in the direction of the viewer a semitransparent

Metal layer as absorber layer, a spacer layer and a reflective metal layer. Such a multilayer structure may in particular be optical viewing angle and / or illumination angle dependent

Create color change effects. The order of semitransparent

 Metal layer and metal layer may also be present in a modified sequence. In this case, a color change effect is visible from the back.

In a further advantageous embodiment, it can be provided that, after method step e), the image layer is brought into contact with a transfer layer of a transfer film and the transfer layer is detached from the transfer film and onto the image layer, in particular only at the points where the image layer is located is transmitted. It can also be provided that a volume hologram layer is applied to the image layer after method step e). This can be done by a transfer film as described above or by

Laminating or gluing a volume hologram foil. In a further advantageous embodiment can be provided

in that the method steps b), c) and e) are carried out with an n-th photoresist formed with an n-th color, and that the

Procedural steps b), c) and e) (i-1) are repeated once, where i is at least 2.

It can also be provided that the method steps b), c) and e) are carried out with an n-th photoresist (16) formed with an n-th color and / or n-th sensitivity, and that the method steps b) , c) and e) (i-1) times, where i is at least 2.

The n photoresists can be applied to the underside of the carrier substrate as n layers arranged at least partially one above the other.

It can be provided that the n photoresists are applied to the underside of the carrier substrate as a pattern, in particular as a striped pattern, or else in the form of graphic motifs. During exposure, as described above, the use of an exposure mask can be dispensed with.

It can further be provided that in method step c) the exposure is carried out with an n-th exposure intensity. The exposure with

different exposure intensities can influence, for example, the contrast of the partial images formed in the image layer.

It may further be provided that the image layer is formed from two partial images, that in step c) the exposure is performed with a first incident azimuth, and that in process step d) the exposure with a second incident azimuth, which is different by 90 ° from the first incidence azimuth. The angle of incidence may also vary.

It can also be provided that before the method step b) a semitransparent metal layer is applied to the underside of the carrier substrate, that the photoresist is formed as an etch resist, and that after carrying out the method step e) the semitransparent

Metal layer is removed in the areas not covered by the image layer by etching.

The semitransparent metal layer may be formed with a transmittance in the range of 1% to 95%, preferably in the range of 5% to 70%. In a further advantageous embodiment it can be provided that before the method step b) a layer formed with a microstructure is applied to the underside of the carrier substrate or the underside of the carrier substrate is formed with a microstructure.

It can further be provided that the image layer is formed from a first and a second image layer, wherein the first image layer has a first partial image and the second image layer has a second partial image such that the process step b) is carried out with a first photoresist that after the process step c) the method step e) is carried out to form the first image layer, and that the following further method steps are carried out:

f) applying a semitransparent reflection layer to the first one

Image layer; g) applying a second photoresist to the semitransparent

 Reflective layer;

h) temporary embedding of the micro-optical layer as far as it is concerned

 optical structures such as lenses, prisms, trapezoids, etc., are in a compensation medium formed with the optical refractive index of the micro-optical systems;

i) exposure of the second photoresist, wherein the first image layer is a

 Exposure mask forms;

k) developing the second photoresist into a second image layer formed as an etch mask;

I) etching the semitransparent reflection layer;

m) removing the compensation medium.

In an advantageous embodiment can be provided that in

Process step c) the master image is designed as an electronically controllable display. It can be provided, for example, a transmitted light display, wherein it is possible in a simple manner, in addition to static information to write personalized information in the image layer. The

personalized information may be embodied as human-readable information and / or as machine-readable information. to

electronic control can be provided a computer in which the personalized information is stored or can be entered via an input device. It can further be provided that, in method step c), the parallel light beams projected onto the microoptical layer are passed through filters and / or diaphragms before striking the microoptical layer. Filters may be provided, for example, to spectral components for which the Photoresist is not sensitive to filter out. Filters or diaphragms can be used in particular before and / or after the parallelization of the light. However, it does not necessarily have to be parallel light. Thus, a certain angle of incidence range is allowed or even desired. In the case of cylindrical lenses, this is also dependent on the orientation of the angle of incidence range with respect to the lens axis. It can be provided that in method step a) a carrier substrate is provided in which the microoptical layer is formed in a first region on the upper side of the carrier substrate, and in which the microoptical layer is formed in a second region on the lower side of the carrier substrate, and that the method steps b) to e) are carried out in the second area as in the first area, with the difference that in the second area the upper side of the carrier substrate forms the underside of the carrier substrate and vice versa. A security element is formed, which can be arranged, for example, in a window of a security document, wherein different optical effects can be formed when viewing the front side and the rear side of the security element. It can also be provided, the window in the

Form safety document so that it only gives the view of the second area. The first and / or the second area can not

have interconnected portions. For example, the subregions may be formed as elements of a grid.

It may further be provided that the first region and the second region of the carrier substrate overlap one another in an overlapping region. In the overlap region can be formed in this way, for example, a third security feature.

In a final method step, it can be provided that a single-layer or multi-layer adhesive layer is applied to the underside and / or top side of the security element. Optionally, the bottom and / or top of the security element may also include one or more additional layers, such as e.g. have an adhesive layer and / or a primer layer.

The trained according to the method described above security elements can form a variety of optical effects.

It is possible to form stereoscopic effects when the two partial images of the image layer form a stereoscopic image pair.

It is further possible to generate quasi-continuous movements of the images, with the movement, i. the position change of the images may occur with continuous change of the viewing position.

Similarly, a morphing effect can be achieved, with a first image being converted to a second image through various stages.

The consideration of the security elements 1 can be provided in reflection and / or in transmission.

The image layer or image layers can represent a static image on the side remote from the microoptical elements. Subsequent to the production of the image layer, further layers can be completely or partially, for example by printing or by transfer of a

Transfer layer of a carrier, in particular by hot stamping and / or cold stamping applied. A partial removal after the

 Application, e.g. a so-called demetallization is also possible. The layers may be metals such as aluminum, HRI layers, colorless or colored (e.g., complementary to the color of the

Image layer colored) one or more layers of plastic,

Primer layers of inorganic or organic nature, adhesive layers, etc. act. The order is largely arbitrary. Layers can also occur several times. It is interesting to apply further layers to the image layer on the back, because different effects from the front and back can be realized.

By using several differently colored photoresists, e.g. Color images, in particular true color images are generated.

It is also possible to introduce optical structures into the image layer or into additional layers, e.g. by replication (thermal replication or UV replication). However, optical structures can also be in a

Spacer layer are introduced before the image layer is applied.

The spacer layer may be a volume hologram layer.

There may be a variety of additional materials between the micro-optic layer and the image layer, for example

(a) colored layers (full area) pigmented layers (security pigments, for example UV fluorescent pigments);

 Print layers (full area or areawise);

 Layers that can be laser-marked;

- layers with polarizing properties;

 HRI layers, for example from ZnS.

The security elements can be formed with further elements which can serve as movement, in particular as static optical reference points, lines, etc. Other elements could be additional moiré elements, other printed or optically variable or metallic representations that complement or complement the image flip. The illustrated image flip can also be represented by one or more other technologies, for example by an optically variable element. Here, the image flip can be synchronous, asynchronous or inverse.

Elements of the image layer can also be used as markers, in particular as register marks and / or control marks for controlling further process steps, in particular for applying further layers and / or elements

Find use.

Furthermore, combinations with other security elements or

decorative elements may be provided, for example, as a hologram, a Kinegram®, a lens effect, a volume hologram, security printing, a decorative print, a UV fluorescent pressure, a pressure of Upconverter (IR upconverter), an OVI pressure (OVI = Optically Variable Ink) and can be designed as machine detectable pigments (3rd line features). The

Combinations can be arranged side by side. You can also be nested or overlapping. Pixels, data, etc. may be complementary, complementary or repeated in different technologies. The partial images contained in the image layer can be supplemented with further images or information of the security element. Thus, the subpictures of the image layer can deal with printed information outside the

Security elements represent an overall picture or overall pictures. In this case, part of the overall picture would be variable in particular by the lenticular flip.

By combining with an optically variable element could

different partial images are generated by partial information from lenticular flip and optically variable elements that would be visible at different viewing angles.

Another example would be the combination with an optically variable one

Ink. Thus, the colors of the optically variable color occurring at different viewing angles could be visible synchronously with the colors of the lenticular flips.

The security elements can provide additional functions besides the optical effects, such as machine readability. A lenticular flip or moire magnifier may be machine-readable, with different ones

Barcodes or positive / negative barcodes can be displayed. These codes can be used for authentication / verification.

The image layer may contain a moire coding, ie one or more images of the image flip may additionally be processed with a moiré analyzer or via an image capture and editing are analyzed. The detection of a moiré effect can also take place from the side facing away from the lenses.

A lenticular flip may include moire magnifier information that is analyzed by a second analyzer, with the moiré analyzer positioned over the lens layer.

If relatively many different partial images or different n partial images are formed in the projection or in the exposure, then

Photoresist micro images with a slightly different pitch (distance of the image repetition) relative to the pitch of the array formed by micro-optical systems, preferably the array formed of microlenses, particularly preferably of the microlens grid formed array are generated. When viewing the security element from different directions, in particular by turning and tilting the security element, this can in particular be a continuous or quasi-continuous

Image sequence of the generated fields are generated. In particular, enlarged images of the exposed n-th partial images or microimages are thereby produced when the security element is viewed, with preferably moving and / or enlarging and / or reducing and / or opposing and / or rotating design elements being shown when the security element is tilted or rotated , This is advantageously a 1D or 2D Moire Magnifier effect. Preferably, the exposure or the projection is carried out such that when viewing the security element of different

Viewing directions, in particular by tilting and / or turning, a continuous or quasi-continuous image sequence of the nth fields is visible.

It is also conceivable that the micro-optical layer comprises an array formed by microlenses or an array formed by microlens raster and the exposure or the projection is carried out in such a way that the n-th sub-images are distorted as microimages, as in 1 or 2 dimensions Micro images or as parts of micro images are generated, which in particular when viewing the security element from different

Viewing directions, in particular by tilting and / or rotating, a continuous or quasi-continuous image sequence of the n-th sub-images is visible.

Security elements produced according to the method described above can be used, for example, in the following security documents or other security products or commercial products:

 - State or non-governmental personal documents (passport, ID card, visa, driver's license, birth certificate, license plate, licenses, etc.).

- Banknotes, checks, certificates

 - credit cards; Valuables; tickets; eNTRY

In particular, the security elements are suitable for so-called

Window technology documents with transparent areas for transmitted light viewing and / or front and back viewing. So-called window banknotes can be banknotes with physical openings in the substrate or, for example, polymer banknotes with transparent polymer areas. The security elements 1 can the Cover window area partially or completely, with a viewing in the window area from both the front and the back of the bill in reflection and / or in transmission is possible. For polymer banknotes, the security element can also be constructed directly on the substrate, ie the polymer substrate would represent the carrier substrate.

The security element may also be part of a plastic card, wherein the security element is applied to a plastic card or is produced as an embedded and / or integral part of the plastic card.

However, the above-described elements can also be used outside the field of security documents or outside the security area for decorative objects and advertising materials or as functional elements, for example as components of displays, light pipe and

Lighting systems and glasses.

The security elements are particularly suitable for products with so-called see-through elements such. Window bills, security thread applications for banknotes and / or documents with transparent areas etc.

The security elements can be applied to objects or incorporated (embedded) in objects. The invention will now be explained in more detail with reference to exemplary embodiments. Show it Fig. 1 is a Pnnzipdarstellung of the structure and the function of a method according to the first method of the invention

 manufactured security element;

Fig. 2.1 to 2.3 embodiments of a lens layer in Fig. 1 in

 schematic plan views;

Fig. 3.1 to 3.5 steps of an embodiment of the

 Providing a carrier film whose upper side is formed as the lens layer in Figure 1, in schematic sectional views. 4.1 to 4.8 process steps of a first embodiment of the first method according to the invention in schematic sectional views;

Fig. 5.1 shows the process step in Fig. 4.4 in a schematic

 Top view; Fig. 5.2 shows the process step in Fig. 4.6 in a schematic

 Top view;

6.1 to 6.6 process steps of a second embodiment of the first method according to the invention in schematic sectional views; Fig. 7.1 shows a first embodiment of an embodiment of the in

 Fig. 4.4 and 4.6 illustrated method steps

 used exposure device in one

 schematic sectional view;

Fig. 7.2 shows a second embodiment of an embodiment of the method steps shown in Fig. 6.3 and 6.4 used exposure device in one

 schematic sectional view;

Fig. 7.3 shows a third embodiment of an embodiment of the in

 Fig. 6.3 and 6.4 process steps used exposure device in one

 schematic sectional view;

8.1 to 8.12 process steps of a third embodiment of the method according to the invention in schematic

 Sectional views; 9.1 to 9.15 exemplary embodiments of a security element produced according to the first or the second method in schematic sectional views;

10.1 to 10.8 process steps of a fourth embodiment of the method according to the invention in schematic

 Sectional views;

Fig. 1 1 .1 to 1 1 .7 process steps of a fifth embodiment of the method according to the invention in schematic

 Sectional views;

Fig. 12 is a positive mask in a schematic representation; 13 shows a negative mask in a schematic representation;

14a to 14c a first embodiment of a mask;

FIGS. 15a and 15b show a second embodiment of a mask;

16a to 16c, a third embodiment of a mask;

17a to 17c, a fourth embodiment of a mask; 18a to 18c, a first embodiment of an aperture layer; 19 shows a second embodiment of an aperture layer; FIG. 20 shows a third embodiment of a diaphragm layer; FIG. 21 shows a fourth embodiment of an aperture layer; FIG. 22 shows a fifth embodiment of an aperture layer; FIG. FIG. 23 shows a sixth embodiment of a diaphragm layer; FIG. Fig. 24 shows a seventh embodiment of an aperture layer; Fig. 25 shows a sixteenth embodiment of a

 Security element;

Fig. 26 shows a seventeenth embodiment of a

 Security element;

Fig. 27 shows a first embodiment of a

 Security document;

28a and 28b, a second embodiment of a

 Security document; Fig. 29 shows a third embodiment of a

 Security document;

30a and 30b, a fourth embodiment of a

 Security document; 31 a and 31 b, a fifth embodiment of a

 Security document; 32a and 32b, a sixth embodiment of a

 Security document;

Fig. 33 shows a seventh embodiment of a

Security document; Fig. 34 shows an eighth embodiment

 Security document;

Fig. 35 shows a ninth embodiment of a

 Security document in a schematic

 Section;

Fig. 36 shows a tenth embodiment of a

 Security document.

1 shows a security element 1, comprising a micro-optical layer 1 1 formed as a lens layer 11, a carrier film 13 and an image layer

14th

The lens layer 1 11 is arranged on the upper side of the carrier film 13. The lens layer 1 11 has a plurality of microlenses 12, which in a

Grid are arranged adjacent to each other. The microlenses 12 are not individually recognizable with an unaided eye from a viewing distance of about 250 mm, when the grid period is less than about 300 μιτι. In the embodiment shown in Fig. 1, the grid period is about 35 μιτι. The microlenses 12 are formed in the embodiment shown in FIG. 1 as cylindrical lenses or as spherical lenses or as ball lenses, which are arranged on the surface of the lens layer 11 1. The microlenses 12 may also be designed as aspherical lenses. The image layer 14 is arranged on the lower side of the carrier film 13 and lies in the image plane of the microlenses 12. The image plane lies at the focal point or near the focal point of the microlenses 12. The image layer 14 comprises two partial images 141 and 14r in the embodiment shown in FIG for the case of cylindrical lenses are rastered into strip-shaped image sections 141a and 14lr, wherein the image sections 141a and 14lr are arranged alternately and register-accurately under the microlenses 12. In the case of spherical lenses, "points" are created under the lens, which line up

Image sections 141a and 14lr have a width of typically less than 17.5 μιτι, in particular a width of 3 μιτι to 10 μιτι at said screen period of 35 μιτι. When tilting the security element 1 about a tilt axis 1 a, which is aligned with the longitudinal axes of the image sections 141 a and 14 a, there is a picture change, d. H. Depending on the viewing direction, either the partial image 141 or the partial image 14r is visible. Between

 Image areas may also have positions where none of the images are visible. The tilting axis does not have to be exactly aligned with the image sections in order to recognize a picture change. Thus, even with significant deviations, for example, with an angular deviation of 30 °, a picture change visible.

In the exemplary embodiment shown in FIG. 1, the partial image 141 shows star-shaped symbols, the partial image 14r a portrait. such

Security elements are referred to as a lenticular flip or image flip. The sub-images 141 and 14r are macro images, i. H. the

 Fields 141 and 14r are the same or nearly the same size as the fields visible in the observation.

The dimensions of the layer structure are dependent on the optical design of the lenses and the optical properties of the spacer layer.

Here, the optical refractive indices of the materials used are an essential parameter. In the above-mentioned raster period of about 35 μητι, a thickness of the lens layer 1 11 in the range of 20 μιτι to 25 μιτι and a total thickness of the lens layer 11 and the carrier film 14 in the range of 35 μιτι to 40 μιτι have the microlenses 12 a height from about 12 μιτι on.

In the above-mentioned raster period of about 35 μιτι, a thickness of the lens layer 11 1 in the range of 50 μιτι to 60 μιτι and a total thickness of the lens layer 11 and the carrier film 14 of about 70 μιτι have the

Microlenses 12 a height of about 7 μιτι on.

Fig. 2.1 shows a first embodiment of the lens layer 1 11. The

Lens layer 11 has cylindrical lenses 12z formed as microlenses whose longitudinal axes are aligned with the tilt axis 1 a. Fig. 2.2 shows a second embodiment of the lens layer 1 11. Die

Lens layer 1 11 has 12k formed as spherical lenses microlenses, which are arranged in adjacent longitudinal rows and transverse rows, the longitudinal axes of the transverse rows with the tilt axis 1 a are aligned. Fig. 2.3 shows a third embodiment of the lens layer 1 11. Die

Lens layer 1 11 is like the lens layer described in Fig. 1 11 11, with the difference that the longitudinal axes of the adjacent transverse rows 12r with the tilt axis 1 a an azimuth a _q include, and that the longitudinal axes of the adjacent longitudinal rows 121 with the Tilting axis 1 a include an azimuth αι. The azimuth denotes one

Horizontal angle in the xy plane of the lens layer 1 11. In the embodiment shown in Figure 2.3, the azimuth a _q = 45 °, the azimuth αι = 135 °. Combinations of microlenses 12 with different orientation can thus also be used for design purposes. The

Variation width of the azimuth is of importance in cases where more complex lens shapes or lens arrays are used.

FIGS. 3.1 to 3.5 show, in one exemplary embodiment, a method for forming the lens layer 1 11 arranged on the carrier film 13. The method is described below as a roll-to-roll method. Alternative methods are, for example, roll-to-sheet processes or sheet-to-sheet processes. Also possible is a one-off production of the security elements.

Fig. 3.1 shows a first process step in which the carrier film 13 is provided. The carrier film 13 can be a film made of a thermoplastic, for example polyethylene,

Polypropylene, polycarbonate or polyester (PET) with a thickness of about 20 μιτι, which is wound on a supply roll. It can also be used a composite of different plastic layers, which are connected to each other, for example by means of an adhesive. The thickness of the carrier film typically ranges from 6 μιτι to 200 μιτι, preferably from 12 μιτι to 50 μιτι, more preferably from 16 μιτι to 36 μιτι.

Fig. 3.2 shows a second process step in which the top of the

Carrier film 13 is coated with a replication layer 15 made of a UV-curing lacquer. The coating can be carried out in a coating station, at which the carrier film 13 is guided past. The coating can be made from a solution or solvent-free, possibly at elevated temperatures. Between layers 1 1 and 13 it is also possible to provide further optional single-layer or multi-layer layers, for example a primer layer or a barrier layer or barrier layer. FIG. 3.3 shows a third method step in which an embossing stamp 15s is pressed onto the replication layer 15. The underside of the stamping die 15s facing the replication layer 15 has a surface structure which corresponds to the negative of the surface structure of the lens layer 11. Of the

Embossing stamp 15s is designed as a stamping roller, wherein the with the

Replizierschicht 15 coated carrier film 13 is pressed with a pressure roller to the embossing roller.

FIG. 3.4 shows a fourth method step, in which the embossed replication layer 15 arranged on the carrier film 13 is guided past a UV radiation source, so that the replication layer cures to the lens layer 11.

Alternatively, the UV exposure can also from the support side through the

Carrier film 13 done. Another variant is a UV exposure during the embossing process, i. while the dies 15s and the

 Replicating layer 15 are in contact so that the structure of the stamping die 15s is molded into the replication layer 15. The embossing die 15s may be flat, half-round or round, depending on the method used. The UV exposure can also be carried out under a protective gas atmosphere. Here, e.g. a nitrogen atmosphere or an argon gas atmosphere over the

Replication layer 15 is generated to largely exclude oxygen during exposure. In the exposure process also certain effects can be precompensated. For example, the final product could be used on a curved surface. For this purpose, for example, the replication layer 15 would be guided on a curved surface during the exposure process.

Alternatively, the precompensation can be done by adjusting the local

Exposure direction. Here, the local exposure angle is modified. This can also be done by interposing an optical lens system with one or more optical lenses, through which the local exposure is different. Alternatively or additionally, the precompensation can also take place by modification of the exposure masks. The precompensation can also be done according to a mathematical function. FIG. 3.5 shows a fifth method step in which the carrier film 13 coated with the lens layer 11 is present as a semi-finished product which is wound on a take-up drum in accordance with the above-described roll-to-roll method. It may also be provided that the replication layer 15 as a

Form plastic layer and the lens structure directly into the

Embossing replication layer 15. This eliminates the fourth method step shown in FIG. 3.4. The replication layer is preferably thermoplastic plastics or paints. Thermoplastic elastomers can also be used.

It can also be provided, instead of the process steps illustrated in FIGS. 3.2 to 3.4, to print the lens layer 11 onto the carrier film 13. It can further be provided that the lens layer 1 11 is integrally formed with the carrier film 13 and that the lens layer 11 is embossed into the carrier film 13. Alternatively, a separately prepared lens layer with already configured lenses can be applied to the carrier film, for example by means of gluing.

FIGS. 4.1 to 4.8 show a first embodiment of the first embodiment

inventive method in which the image layer 14 in a

Contact method with a first image 141 and a second image 14r is formed, as described above in Fig. 1. FIGS. 4.1 to 4.8 are schematic sectional views, with layers being shown in each case as a rectangular area for a better overview. FIG. 4.1 shows a first method step in which the carrier foil 13, on the upper side of which the lens layer 11 is formed, is provided. The structure of the lens layer 11 is described above.

FIG. 4.2 shows a second method step in which a photoresist 16 is applied to the underside of the carrier film 13. Typical starting materials for photoresists 16 are, for example, polymethyl methacrylate, novolak,

Polymethylglutarimide and epoxy resins. Common solvents are

For example, cyclopentanone or gamma-butyrolactone in addition, photoresists 16 typically contain a photosensitive component. Water-soluble photoresists 16 can also be used.

The process steps of applying the photoresist 16 and the introduction or introduction of the microlenses can also in a changed order or also take place simultaneously. The coating with the photoresist 16 can take place over the whole area or part of the area. For example, the photoresist may be applied in the form of a pattern or in the form of one or more motifs. Processes are coating or printing from solution (solvent-containing, aqueous

Systems); solvent-free (liquid, semi-liquid) or even applying so-called dry resists by rolling on, sticking on.

Positive photoresists 16 and / or negative can be used

Photoresists 16.

Depending on the subsequent process, the photoresist 16 can be colorless or pigmented and / or colored and / or printed in multiple colors. As colors are dissolved dyes and / or pigments, and special pigments, such as those used in the security field, for example, UV-fluorescent pigments used. Preference is given to pigments with small particle sizes below the layer thickness of the photoresist 16. Further preferred are so-called nanopigments, i. Pigments with particle sizes below 1 μιτι preferably below 0.5 μιτι. The pigments may be inorganic or organic in nature or mixtures of both. In addition to pigments and soluble dyes can be used.

The photoresist 16 may be transparent, semitransparent or opaque, possibly opaque only in certain wavelength ranges. For example, the colored photoresist may be substantially transparent in the near UV, where the photoresist is sensitive, but appear substantially black in the visible wavelength range. It is also possible to use liquid-crystalline materials as photoresists in which, if appropriate, additional spatial orientations of the liquid-crystalline molecules take place during the exposure process or hardening process. The orientation of the molecules can be formed, for example, on physical structures such as microstructures and / or by exposure by means of polarized light.

The photoresists 16 may be applied colorless or monochrome or multicolor. They can also be applied in the form of one or more patches. The patch shape may also represent a motif and / or a pattern, for example, a country contour and / or be interrupted, for example, be formed strip-shaped. Photoresists 16 can also be applied in multiple layers. The layers may have different shapes and / or properties.

Figs. 4.3 and 4.4 show a third process step, in which the

Lens layer 1 11 a first formed as a picture mask master image 141m is placed (Figure 4.3) and the photoresist 16 with parallel light rays at a first angle of incidence ßi, which is equal to a first

Viewing angle is exposed through the lens layer 1 1 through (Fig. 4.4). By the exposure, a first latent field is formed in the photoresist 16. Fig. 5.1 shows the third process step in plan view. The master image 141m may be formed as a positive mask (see FIG. 12) or as a negative mask (see FIG. 13).

Figs. 4.5 and 4.6 show a fourth process step, in which the

Lens layer 1 1 is a second formed as a picture mask master image 14rm is placed (Figure 4.5) and the photoresist 16 with parallel light rays under a second angle of incidence β _r , which is equal to a second viewing angle, through which the lens layer 11 is exposed (FIG. 4.6). By the exposure, a second latent field is formed in the photoresist 16. Fig. 5.2 shows the fourth process step in plan view. The angle ß _r can also be 0 °.

The parallel used in the third and fourth process steps

Light beams are shown in a schematic manner in FIG. 7.1

Exposure device 17 is generated. The exposure device 17 comprises a radiation source 171 and a projection objective 17o. The radiation source 171 is a lamp which emits light in the UV-near range or in the UV range. The wavelength of the light is tuned to the properties of the photoresist 16. The radiation source 171 is arranged at the focal point of the projection objective 17o, so that parallel light beams exit from the projection objective 17o.

In principle, all suitable methods for generating parallel light or nearly parallel light can be used. This also includes the use of lasers or laser diodes, possibly in combination with suitable optics.

Figs. 4.7 and 4.8 show a fifth process step in which the exposed photoresist 16 is developed to the image layer 14. Figs. During development, for example, the unexposed areas of the photoresist 16 are removed, for example by washing with a solvent. The exposed areas of the photoresist 16 are chemically altered by the action of the light rays so that their solubility is lower than the solubility of the exposed areas. Typical developer solutions are, for example, alkali-containing solutions. Thereafter, residues of the developer solution in corresponding aftertreatment processes, eg washing with

deionized water, removed. Removal of the photoresist may be assisted by sponges, brushes, high pressure nozzles, etc. When

Developer solutions can also be used organic solutions or solvents. There are also photoresists which essentially use water as developer solutions. Aggregates in the developer solution, such as isopropanol, serve to better wetting the photoresist. In Fig. 4.8, the image layer 14 comprising the sub-images 141 and 14r is shown. After the development process, an additional UV exposure, possibly also at a different wavelength, can take place in order to further harden the image layer 14. Post-curing may also be effected by means of electron beam radiation (e-beam) and / or via a chemical crosslinker and / or by aftertreatment at elevated temperatures. It is also possible to apply another layer beforehand in order to cure them together or to achieve a better bond between the layers.

It is also possible to provide more than two exposure directions, for example three exposure directions.

FIGS. 14a to 14c show suitable master images which are designed as positive masks. 14a shows a first master image 141m, FIG. 14b shows a second master image 14mnn, and FIG. 14c shows a third master image 14rm. The master images 141m, 14mm and 14rm are each exposed from different angles. When viewing a security element formed in this way, three subpictures appear in succession whose motifs are symbolized by the letters A, B, C, which are visible only at the associated tilt angle.

Figs. 15a and 15b show another embodiment of master images 141m, 14rm. When viewing a security element formed in this way, when tilting two partial images appear whose motifs are symbolized by the letters A, B, C and D, E, F, which are only visible under the associated tilt angle.

Figs. 16a to 16c show an embodiment which is like the embodiment described in Figs. 14a to 14c is formed, with the difference that when viewing a thus formed security element

successively three partial images appear whose motifs are symbolized by the letters A, B, C - D, E, F - G, H, I. Figs. 17a to 17c show an embodiment which is like the embodiment described in Figs. 14a to 14c is formed, with the difference that when viewing a thus formed security element

successively three partial images appear whose motifs are symbolized by the letter A, which changes its rotational position.

Figs. 6.1 to 6.6 show a second embodiment of the first method according to the invention, in which the image layer 14 in a

Projection method with a first field 141 and a second field 14r is formed, as described above in Fig. 1. FIGS. 6.1 to 6.6 are schematic sectional views, with layers being shown in each case as a rectangular area for a better overview. FIG. 6.1 shows a first method step in which the carrier foil 13, on the upper side of which the lens layer 11 is formed, is provided. The structure of the lens layer 11 is described above.

FIG. 6.2 shows a second method step in which a photoresist 16 is applied to the underside of the carrier film 13.

FIG. 6.3 shows a third method step, in which a first master image 141m is transmitted to the lens layer 11 by a parallel projection and focused onto the photoresist 16 by the microlenses 12 of the lens layer 11. The projection beams strike the lens layer 11 at a first angle of incidence βi, which is equal to a first viewing angle. The exposure forms a first latent field in the photoresist 16.

FIG. 6.4 show a fourth method step in which a second master image 14rm is transmitted to the lens layer 11 by a parallel projection. The projection beams pass through the lens layer 11 at a second angle of incidence β _r which is equal to a second viewing angle. By the exposure, a second latent field is formed in the photoresist 16.

The parallel used in the third and fourth process steps

Light rays are shown in a schematically shown in Fig. 7.2

Exposure device 17 is generated. The exposure device 17 comprises a Radiation source 171, a condenser 17k, a receptacle 17a for the

Master image 141m, 14rm and a projection lens 17o. In the

Radiation source 171 is, for example, a lamp which emits light in the UV-near range or in the UV range. The wavelength of the light is tuned to the properties of the photoresist 16.

In the projection, the master image 141m, 14rm, which may include one or more images, patterns, etc., is projected out of the position of the projection lens 17o from a defined position relative to the lens layer 11, the projection lens 17o and the microlenses 12 forming an optical system in which a parallel beam path is formed between the projection objective 17 o and the microlenses 12. Both a 1: 1 image and an enlargement and / or reduction of the master image 141m, 14rm can take place.

If relatively many different partial images or different n partial images 141, 14r are formed during the projection or the exposure, 16 microimages with a slightly different pitch (distance of the image repetition) relative to the pitch of the array formed by microoptical systems can be formed in the photoresist, Preferably, the pitch of the array formed from microlenses 12, more preferably to the pitch of the array formed by a microlens grid can be generated. When viewing the security element 1 from different directions, in particular by turning and tilting the security element 1, in particular a continuous or quasi-continuous image sequence of the generated partial images 141, 14r can be produced. In particular, this will be when viewing the

Security elements 1 enlarged images of the exposed n-th partial images 141, 14r or micro images generated, wherein when tilting or rotating the Security elements 1 are preferably moving and / or enlarging and / or reducing and / or opposing and / or rotating

Show design elements. This is advantageously a 1D or 2D Moire Magnifier effect.

Preferably, the exposure or the projection is performed such that when looking at the security element 1 from different

Viewing directions, in particular by tilting and / or rotating, a continuous or quasi-continuous image sequence of the n-th fields 141, 14r visible.

As a method for generating the master image 141m, 14rm, both analog and digital methods can be provided. For example, the master image 141m, 14rm may be formed as a mask. The mask may for example consist of a metallic aperture with recesses or of a film material which has been blackened accordingly. Interesting is the use of masks with partial images in which the respective

Partial images (openings) have a selective permeability to certain

Wavelengths, for example, a permeability to UV-A and UV-B. In this way, by using two UV exposure units with different wavelengths or wavelength ranges (example: UV-A and UV-B), a selective exposure can take place from different angles. The advantages are the use of only one exposure mask or the registration of the two images.

Register or register or register accuracy or registration accuracy is to be understood as a positional accuracy of two or more elements and / or layers relative to one another. Here is the register accuracy move within a given tolerance and be as small as possible. At the same time, register accuracy of multiple elements and / or layers to each other is an important feature in order to increase process reliability. The positionally accurate positioning can in particular by means of sensory, preferably optically detectable registration marks or

 Register marks take place. These register marks or register marks can either represent special separate elements or regions or layers or themselves be part of the elements or regions or layers to be positioned.

As master images 141m, 14rm can be black and white representations,

Grayscale images, color images, images with regions of different UV absorption ("color image" in the UV region), halftone images, etc. It is also possible to produce three-dimensional images that convey, for example, a depth effect of a displayed object.

Fig. 7.3 shows an exposure device 17, which like the in Fig. 7.2

is formed, with the difference that the master image is formed as an electronically controllable display 17d, which is controllable via a computer 17c. The display 17d can be designed, for example, like a display known from laser projectors. The display 17d enables the introduction of individualized information into the photoresist or into the image layer. Examples of individualized

Information is serial numbers, the date of birth of one

Document holder or the image of a person. Advantageously, the radiation source 171 may be formed as a laser, so that the laser beam can be deflected suitable and can be modulated in intensity, for example, on and off can be modulated.

In addition, a polarizer can be located in the beam path, by means of which linearly or circularly polarized light can be generated.

The condenser 17k uniformly illuminates the master image 141m, 14rm arranged in the receptacle 17a. The master image 141m, 14rm is arranged with respect to the projection lens 17o so that the master image 141m, 14rm is projected onto the lens array in a limited angular range.

FIGS. 6.5 and 6.6 show a fifth method step which corresponds to the method step described above in FIGS. 4.7 and 4.8. In Fig. 6.6, the image layer 14 comprising the sub-images 141 and 14r is shown. It is also possible to use a line exposure or a

 Line arrays as exposure unit. A line exposure is understood to mean an exposure unit in which the exposure is over a very narrow area

Exposure line is done. This can be done by exposure by means of a gap. The gap is in this case carried out over the surface to be exposed and / or the surface to be exposed below the line gap. As a row gap, e.g. a metallic aperture can be used. As a line imagesetter can also be an array of juxtaposed UV diodes, a so-called array, are used. Thus, the line array, preferably with high resolution, can be moved during the exposure over the area to be exposed. For example, the arrangement of the

Single exposure elements in the line array correspond to a resolution of 600 dpi to 3600 dpi. Alternatively, the area to be exposed moves below the line array. The latter is particularly advantageous in roll-to-roll processes.

Figs. 8.1 to 8.12 show a third embodiment of the

inventive method. FIGS. 8.1 to 8.12 are schematic sectional views, with layers being shown in each case as a rectangular area for a better overview.

FIG. 8.1 shows a first method step in which the carrier foil 13, on whose upper side the lens layer 11 is formed, is provided. The structure of the lens layer 11 is described above.

FIG. 8.2 shows a second method step in which a semitransparent metal layer 18 ms is applied to the underside of the carrier film 13, for example by vapor deposition.

Fig. 8.3 shows a third process step in which a photoresist 16 is applied to the semitransparent metal layer 18ms. Fig. 8.4. FIG. 4 shows a fourth method step in which a first master image 141m is transmitted to the lens layer 11 by a parallel projection and focused onto a first photoresist 16 by the microlenses 12 of the lens layer 11. The projection beams strike the lens layer 11 at a first angle of incidence βi which is equal to a first viewing angle. The exposure forms a first latent field in the first photoresist 16. Figures 8.5 and 8.6 show a fifth process step in which the exposed first photoresist 16 is developed into a first image layer 141 formed as an etching mask, as described above. In Fig. 8.6, the first image layer 141 formed of image portions 141a is shown.

FIG. 8.7 shows a sixth method step, in which the semitransparent metal layer 18 ms is patterned by means of etching, as a result of which the non-

Pixels of the first image layer 141 covered areas of

Metal layer to be removed 18ms. As the etching medium, e.g. an aqueous lye are used.

FIG. 8.8 shows a seventh method step in which a second photoresist 16 is applied to the first image layer 141. FIG. 8.9 shows an eighth method step in which the lens layer 11 is covered by a compensation layer 11k. The compensation layer 1 1 k has the same or approximately the same optical refractive index, in particular with a refractive index difference of at most 0.2, as the microlenses 12 of the lens layer 1 1, so that the optical effect of the microlenses 12th

is canceled. The compensation layer 1 1 k may be, for example, a liquid.

Fig. 8.10 shows a ninth process step in which the first image layer 141 acts as an image mask. In the embodiment shown in Fig. 8.10, parallel projection beams are perpendicular to the first image layer 141, expose the second photoresist 16 under the first image layer 141, and form a latent field. It is also possible to deposit with a translucent colored layer, in particular followed by a

Metal layer to create the effect of a colored reflection layer.

In a tenth method step, the compensation layer 1 1 k is removed again from the lens layer 11.

Fig. 8.1 1 and 8.12 show an eleventh process step in which the latent image formed in the second photoresist 16 is made into a flat surface

Areas such as Image stripe 14a formed second image layer 14r is developed. The image strips 14ra are visible over a very large angle range (permanently).

FIGS. 10.1 to 10.8 show a fourth embodiment of the invention

inventive method.

The method steps illustrated in FIGS. 10.1 to 10.8 are designed like the method steps described in FIGS. 4.1 to 4.8, with the difference that the exposure of the photoresist 16 is effected by a micro-optical system designed as an aperture layer 11b. The diaphragm layer 1 1 b may be constructed of alternating transparent and opaque or partially opaque areas. In the simplest case, it may be line grids, e.g.

be printed, act. However, it can also be more complex

Arrangements of transparent and opaque areas act. The

Grid width is chosen so that, as described above for microlenses in Fig. 1, below the resolution of the human eye. Figs. 18a to 18c show embodiments for diaphragm layers 1 1 b with line grid, wherein the directional arrows shown in the figures, the

Specify the tilt direction of the security element. In Fig. 18a the line grid is arranged perpendicular to the tilting direction, in Fig. 18b obliquely to the tilting direction and in Fig. 18c parallel to the tilting direction.

Fig. 19 shows an embodiment of the diaphragm layer 1 1 b, in which the line grid is formed of two sections which enclose an obtuse angle with each other, as shown in Fig. 19.

Fig. 20 shows an embodiment of the diaphragm layer 1 1 b, wherein the line grid is formed of two sections, which are arranged at a right angle to each other.

Fig. 21 shows an embodiment of the diaphragm layer 1 1 b, in which the line grid is S-shaped.

Fig. 22 shows an embodiment of the diaphragm layer 1 1 b, in which the line grid is interrupted by oblique line-shaped sections.

Fig. 23 shows an embodiment of the diaphragm layer 1 1 b, in which the line grid is interrupted by oblique line-shaped sections and alternately lines of the line grid are interrupted.

Instead of the line grid shown in FIGS. 18a to 24, cylindrical lenses with an analog arrangement can also be used. Fig. 24 shows an embodiment of the diaphragm layer 1 1 b, in which the line grid has a star-shaped boundary, which is perceptible by a viewer as a star-shaped symbol. 1 1 .1 to 1 1 .7 show a fifth embodiment of the

inventive method.

FIG. 11 shows a first method step in which a carrier foil 13, on whose upper side a lens layer 11 is formed, is provided. The structure of the lens layer 11 is described above.

Fig. 11 shows a second process step in which a photoresist 15 is applied to the underside of the carrier film 13, e.g. is applied in the form of a field or a pattern in a defined area. The application may e.g. by means of a printing process or by transfer from a carrier by means of hot stamping or cold stamping.

The process steps of applying the photoresist 15 and the introduction or introduction of the microlenses of the lens layer 11 can also take place in a changed sequence or simultaneously. Positive photoresists and / or negative photoresists can be used.

Depending on the subsequent process, the photoresist 15 may be colorless or pigmented and / or colored and / or printed in multiple colors. As colors are dissolved dyes and / or pigments, and special pigments, such as those used in the security field, for example, UV-fluorescent pigments used. Preference is given to pigments with small particle sizes below the layer thickness of the photoresist 15. Further preferred so-called nanopigments, ie pigments with grain sizes below 1 μιτι preferably below 0.5 μιτι. The pigments may be inorganic or organic in nature or mixtures of both. In addition to pigments and soluble dyes can be used.

The photoresist 15 may be transparent, semitransparent or opaque, possibly opaque only in certain wavelength ranges. For example, a colored photoresist 15 may be substantially transparent in the near UV, where the photoresist 15 is sensitive, but appear substantially black in the visible wavelength range.

It is also possible to use liquid-crystalline materials as photoresists 15 in which additional spatial orientations of the liquid-crystalline molecules may additionally take place during the exposure process or hardening process. The orientation of the molecules can e.g. on physical structures such as e.g. Microstructures and / or also be formed by exposure by means of polarized light.

The photoresists 15 can be applied colorless or monochrome or multicolor.

FIG. 11 shows a third process step in which the photoresist 15 is exposed through the lens layer 11 with parallel light beams at a first angle of incidence βi equal to a first viewing angle. By the exposure, a first latent field is formed in the photoresist 15. In principle, all suitable methods for generating parallel light or nearly parallel light can be used. This also includes the use of lasers or laser diodes, possibly in combination with suitable optics.

1 1 .4 shows a fourth method step, in which the exposed photoresist 15 is developed into a first partial image 141 and optionally optionally a fifth method step in which a further photoresist 15 is applied. The further photoresist 15 is applied to the underside of the carrier sheet 13, e.g. applied in the form of another field or a pattern in a defined area. The further photoresist 15 can be applied in addition to the first partial image 141, partially overlapping or congruent. In the exemplary embodiment illustrated in FIG. 10.4, the further photoresist 15 is applied next to the first partial image 141.

FIG. 11 shows a sixth process step in which the further photoresist 15 is exposed through the lens layer 11 with parallel light beams at a second angle of incidence β _r which is equal to a second viewing angle. As a result of the exposure, a second latent partial image is formed in the further photoresist 15.

FIG. 11 shows a seventh process step in which the exposed further photoresist 15 is developed into a second partial image 14r.

The sixth and seventh process steps can be repeated several times.

FIG. 11 shows a variant in which the second partial image 14r partially covers the first partial image 141. FIGS. 9.1 to 9.15 show further exemplary embodiments of security elements 1 which can be produced by the above-described methods and / or by varying the above-described methods. FIGS. 9.1 to 9.15 are schematic sectional views, with layers being shown in each case as a rectangular area for a better overview.

Optionally, the security elements 1 may be formed on their underside with a single-layer or multi-layer adhesive layer (not shown in FIGS. 9.1 to 9.15). Optionally, the underside of the security element 1 shown in Figs. 9.1 to 9.13 may also include one or more additional layers such as e.g. a single or multi-layer adhesive layer and / or

Have primer layer. However, it may also be provided, the

To transfer security elements 1 on a substrate which is at least partially coated with an adhesive layer. Optionally, the security element on the underside of an additional single-layer or multi-layer protective layer, for example in the form of a PET film have. This can be glued or laminated. The protective layer may have an additional one- or multi-layer adhesive layer on the outside. The structure allows the embedding of the security element in a substrate,

for example in the form of a security thread in a document or banknote. Fig. 9.1 shows a security element 1, in which the image layer 14 is covered by a color layer 18f. The ink layer 18f may be printed, for example. By the color layer 18f, the color contrast is increased. The color layer 18f may be, for example, translucent or opaque and / or multicolored and / or be UV-active. Particularly preferred are opaque layers or opaque and scattering layers. The coloring layer 18f is among a plurality of when viewed through the lens layer

Viewing angles visible.

9.2 shows a security element 1, in which the image layer 14 is covered by a reflection layer 18r. As a reflection layer 18r, a metal layer and / or an HRI layer may be provided. Optionally, after the application of the reflection layer 18 r, a structuring of the

Reflection layer 18r be provided in register with the image layer 14, whereby the color effect is enhanced. The structuring can be done by known methods.

FIG. 9.3 shows a security element 1 in which a multilayer structure is applied to the image layer 14. In that shown in Fig. 9.3

 In the exemplary embodiment, the multilayer structure comprises a semitransparent metal layer 18mt as absorber layer, a spacer layer 18a and a reflective layer 18r. The semitransparent metal layer 18mt is disposed on the lower surface of the image layer 14. In the thus formed

Security element 1 is visible as a background color change effect.

Also possible is a structure in which the reflective layer 18r on the

In the latter structure, a color-changing effect is visible from the side facing away from the lens layer 11. Also, embodiments in which the color change from both sides of the image plane is visible Security element 1 is visible. Figure 9.4 shows a security element 1, which after the above

4.1 to 4. 8 or 6.1 to 6.6), with the difference that, instead of the image layer 14, a first image layer 141 is first formed, and then a further photoresist 16 is applied and after exposure and developing a second image layer 14r is formed. Advantageously, the two image layers 141 and 14r may have different colors. It is also possible to apply the two photoresists in a strip grid, to jointly expose and develop.

Fig. 9.5 shows a security element 1, which is formed like the security element shown in Fig. 9.4, with the difference that the two photoresists 16 are formed with different sensitivity.

For example, the first photoresist 16 may be formed with a higher sensitivity than the second photoresist 16.

By using differently colored photoresists, it is possible to form mixed colors, for example the mixed color magenta from the colors red and blue.

It may further be provided that the security element is mounted on a substrate or product, e.g. a security document, with a horizontal or

vertical tilt axis of the security element oblique arrangement of cylindrical lenses to arrange. By this arrangement it is achieved that both when tilting over the horizontal and vertical tilt axis results in a Bildflip. FIG. 9.6 shows a security element 1, in which a microstructure 13s is molded into the underside of the carrier foil 13. The microstructure 13s may also be incorporated in a further layer applied to the carrier film 13. The microstructure 13s can form different optical effects,

For example, form a KINEGRAM® or 2D / 3D or 3D structure-based effects. The image layer 14 is coated with a reflective layer 18r. The coating can optionally be provided.

It is also possible to combine a microstructure with a design analogous to Fig. 8.7.

Fig. 9.7 shows a security element 1, in which a semitransparent

Metal layer 18ms is arranged on the underside of the carrier film 13, wherein the metal layer 18ms has been partially demetallized after the formation of the image layer 14 formed as an etching mask. The security element 1 thus has a metallically coated image layer 14 from the viewing side. Optionally, on the back of the image layer an additional

Color layer may be applied to increase the contrast and / or to create colored areas. It is also possible to deposit with a second, e.g. differently colored with a translucent colored lacquer layer colored metal layer analogous to the embodiment described in Fig. 8.7.

Fig. 9.8 shows a security element 1, wherein the back of the

Security element 1 is formed by a structured metal layer 18m. The structured metal layer 18m has removed areas in the lift-off process which are congruent with the structured image layer 14. For this purpose, the image layer 14 was vapor-deposited with the metal layer 18m, and then the image layer 14 was removed in the exposed areas in the lift-off process, In this embodiment, a positive photoresist was used. Optionally, the structured metal layer 18m may be deposited with a color layer. It is also possible to deposit with a translucent colored layer, in particular followed by a metal layer, in order to produce the effect of a colored reflection layer.

FIG. 9.9 shows a security element 1 in which a transfer layer 18u of a transfer film is arranged on the image layer 14. The image layer 14 is formed as a thermocouple, which after heating with the on the

Transfer film trained transfer layer 18u is brought into contact and after cooling, the transfer layer adheres to the image layer by means of the thermo-slider. Then, the security element 1 is peeled off from the transfer film, wherein the bonded to the image layer 14 areas of the transfer layer 18u are deducted. In this design of the security element 1 a large variety of designs is possible. Thus, for example, a continuous color gradient or a true color image can be formed, or optical structures can be transferred to the image layer 14.

FIG. 9.10 shows a security element 1 in which a volume hologram 18v is arranged on the image layer 14.

9.1 shows a security element 1 in which a partially metallized layer 18mp is arranged between the lower side of the carrier film 13 and the colored image layer 14. The security element 1 forms a flip color metal. The effect can be achieved by tilting the security element 1 or through

Rotation by 180 ° occur. It can be formed a continuous transition metal / color in an exposure. Optionally, a flip metal / color can be formed by two exposures and structuring. - Continuous transition: an exposure and use of the colored photoresist in one area as a color and in the other area for further structuring of the previously partially generated metal layer.

- Image flip metal / color: First structuring of a metal layer by means of first exposure, then structuring of a separately applied colored photoresist by means of second exposure.

FIG. 9.12 shows another security element 1, which was produced according to the method described above in FIGS. 8.1 to 8.12.

FIG. 9.13 shows a security element 1 in which a functional layer 18v is arranged below the carrier film 13, on the side facing away from the carrier film 13 a multilayer image layer comprising a first image layer 14, a reflection layer 18r and a second image layer 14 '.

Fig. 9.14 shows a security element 1, which is designed as the security element described in Fig. 1, with the difference that the

Security element 1 has a first region, as shown in FIG. 1

is described, and that the security element 1 has a second region which is formed in mirror image to the first region. In the second area, the lens layer 11 is on the underside of the

Security elements 1 arranged. The image layer 14 is arranged on the upper side of the security element 1. The security element 1 can be arranged, for example, in a window of a security document, wherein when viewing the front and the back of the security element 1 different optical effects can be formed. It may also be provided to configure the window in the security document 1 so that it only releases the view of the second area. The first and / or the second area may have unconnected portions. For example, the subregions may be formed as elements of a grid. Fig. 9.15 shows a security element 1, which was produced by combining two security elements according to Fig. 4.8 and Fig. 9.1. The preparation can be done, for example, by laminating the two

Security elements by means of an adhesive 19 done. FIGS. 25 and 26 show security elements 1, in which the microoptical layer is formed as a prism layer 1 1 p, wherein the prism layer in FIG. 26 is trapezoidal in cross section.

The security elements described in FIGS. 9.1 to 9.15, 25 and 26 can form a variety of optical effects, wherein it is also possible to form combinations of the security elements shown in FIGS. 9.1 to 9.15 and 25 and 26.

It is possible to form stereoscopic effects when the two sub-images 141 and 14r form a stereoscopic image pair.

It is further possible to generate quasi-continuous movements of the images, with the movement, i. the position change of the images may occur with continuous change of the viewing position.

Similarly, a morphing effect can be achieved wherein a first image is converted to a second image through various stages. The consideration of the security elements 1 can be provided in reflection and / or in transmission.

The image layer or image layers can represent a static image on the side remote from the microoptical elements.

Subsequent to the formation of the image layer 14, further layers may be wholly or partially, e.g. by printing or by transferring one

Transfer layer of a carrier, in particular by hot stamping and / or cold stamping applied. A partial removal after the

 Application, e.g. a so-called demetallization is also possible. The layers may be metals such as aluminum, HRI layers, colorless or colored (e.g., complementary to the color of the

Colored image layer 14) one or more layers of plastic layers,

Primer layers of inorganic or organic nature, adhesive layers, etc. act. The order is largely arbitrary. Layers can also occur several times. It is interesting to apply further layers on the image layer 14 on the back, because different effects of the front and back can be realized.

By using several differently colored photoresists, e.g. Color images, in particular true color images are generated.

It is also possible to introduce optical structures into the image layer or into additional layers, e.g. by replication (thermal replication or UV replication). However, optical structures can also be in a

 Spacer layer are introduced before the image layer is applied.

The spacer layer may be a volume hologram layer. Between the lens layer 1 1 and the image layer 14, a variety of additional materials may be present, for example

 - (a) colored layers (full area);

- pigmented layers (security pigments, for example UV fluorescent pigments);

 - Print layers (full area or areawise);

 - Layers that can be labeled by laser;

 - layers with polarizing properties;

- HRI layers, for example from ZnS.

The security elements can be formed with further elements which can serve as movement, in particular as static optical reference points, lines, etc. Other elements could be additional moiré elements, other printed or optically variable or metallic representations that complement or complement the image flip. The illustrated image flip can also be represented by one or more other technologies, for example by an optically variable element. Here, the image flip can be synchronous, asynchronous or inverse.

Elements of the image layer can also be used as markers, in particular as register marks and / or control marks for controlling further process steps, in particular for applying further layers and / or elements

Find use.

Furthermore, combinations with other security elements or

be provided decorative elements, for example, as a hologram, a Kinegrann®, a lens effect, a volume hologrman, security printing, a decorative print, a UV fluorescence print

Printing of Upconverter (IR Upconverter), an OVI (OVI = Optically Variable Ink) and as machine detectable pigments (3rd line features) can be formed. The combinations can be arranged next to each other. They can also be nested or overlapping. Picture elements as well as included data etc. can

be complementary to each other, complementary or different

Technologies are repeated.

The partial images contained in the image layer can be supplemented with further images or information of the security element 1. Thus, the sub-images of the image layer can be printed or printed with information outside the security element 1 an overall image or overall images. In this case, part of the overall picture would be variable in particular by the lenticular flip.

By combining with an optically variable element could

different partial images are generated by partial information from lenticular flip and optically variable elements that would be visible at different viewing angles.

Another example would be the combination with an optically variable one

Ink. Thus, the colors of the optically variable color occurring at different viewing angles could be visible synchronously with the colors of the lenticular flips. The security elements can provide additional functions besides the optical effects, such as machine readability. A lenticular flip or moire magnifier may be machine-readable, with different ones

Barcodes or positive / negative barcodes can be displayed. These codes can be used for authentication / verification.

The image layer 14 may include moire coding, i. One or more images of the image flip can additionally be analyzed with a moiré analyzer or via image acquisition and processing. The detection of a moiré effect can also take place from the side facing away from the lenses.

A lenticular flip may include moire magnifier information that is analyzed by a second analyzer, with the moiré analyzer positioned over the lens layer.

The above-described security elements can be used, for example, in the following security documents:

 - State or non-governmental personal documents (passport, ID card, visa, driver's license, birth certificate, license plate, licenses, etc.).

 - Banknotes, checks, certificates

 - credit cards; Valuables; tickets; eNTRY

In particular, the security elements are suitable for so-called

Window technology documents with transparent areas for transmitted light viewing and / or front and back viewing. The so-called window banknotes can be banknotes with physical openings in the substrate or, for example, polymer banknotes transparent polymer areas. The security elements 1 can partially or completely cover the window area, wherein viewing in the window area from both the front and the back of the banknote in reflection and / or in transmission is possible. For polymer banknotes, the security element can also be constructed directly on the substrate, ie the polymer substrate would represent the carrier substrate.

The security element may also be part of a plastic card, wherein the security element 1 is applied to a plastic card or card is generated as an embedded and / or integral part of the plastic.

However, the above-described elements can also be used outside the area of security documents or outside the security area for decorative objects and advertising materials or as functional elements, for example as components of displays and eyeglasses.

The security elements are particularly suitable for products with so-called see-through elements such. Window bills, security thread applications for banknotes and / or documents with transparent areas etc.

The security elements can be applied to objects or incorporated (embedded) in objects. Figs. 27 to 36 show embodiments of security documents associated with one or more of the above-described security elements

are formed. FIG. 27 shows a security document 2 embodied as a banknote, which has a strip-shaped security identifier 1.

FIGS. 28a and 28b show a banknote

Sicherheitsdokunnent 2, which has a strip-shaped security element 1, under different tilt angles. The symbolized by letters

Image motifs of security element 1 change from A, B, C to D, E, F.

FIG. 29 shows a security document 2 embodied as a banknote, which has a strip-shaped security element 1, which is formed in sections with different image effects:

A: Lenticular fip element based on microlenses

 B: 2D / 3D hologram

C: Kinegram®

 D: Lenticular fip element based on opaque stripes

 E: Imprint with optically variable ink (optical variable ink print)

The areas A to E may be adjacent to each other and / or overlapping each other.

FIG. 30 a shows a security document 2 embodied as a banknote, which has a window 2 f 1. Fig. 30b shows the security document shown in Fig. 30a, which is formed on its front side with a laminated strip-shaped security element 1, which covers the window 2f. The security element 1 has a first, symbolized by the letter X motif that above the Window 2f is arranged, and a second, by the letter Y

symbolized motif, which is located below the first subject outside the window 2f. FIGS. 31 a and 31 b show a security document 2, which, like the security document described in FIG. 30 b, is designed, with the difference that a first motif, symbolized by the letter A, is located above the

Window 2f is arranged, when tilting the security document 2 is visible about a vertical axis in a first tilt position and invisible in a second tilt position, and that a second symbolized by the letter B motif, which is located below the first subject outside the window 2f is invisible in the first tilted position and is visible in the second tilted position. FIGS. 32a and 32b show a security document 2 which, like the security document described in FIGS. 31 a and 31 b, is designed with the

Difference that when viewed from the back in both tilting placements arranged above the window 2f symbolized by the letter A motif is visible.

Figs. 33 and 34 show a card size ID1

Security document 2 with a window 2f.

Fig. 34 shows a security document 2, which is like the security document described in Fig. 33 is formed, with the difference that a

strip-shaped security element 1, which covers the window 2f, is laminated on the front side of the security document 2. The

Security element 1 has a heart-shaped lenticular flip-element which is disposed above the window 2f, and a star-shaped hologram disposed under the window 2f.

Fig. 35 shows a security document 2 with a window 21 in one

schematic cross section in which a lens layer 1 11 and a

Carrier substrate 13 of a security element 1 on the front of the

Security document 2 is disposed above the window 21, wherein a corresponding with the lens layer 1 11 image layer 14 is disposed on the back of the security document 2.

FIG. 36 shows a security document 2 which, like the security document described in FIG. 35, is formed, with the difference that the image layer 14 is arranged on the rear side of the carrier substrate 13.

LIST OF REFERENCE NUMBERS

1 security element

 1 a tilt axis

 2 security document

 2f window

 1 1 micro-optical layer

 1 1 b diaphragm layer

 1 1 k compensation layer

 1 11 lens layer

 1 1 p prism layer

 12 microlens

 121 longitudinal row

 12k ball lens

 12r transverse row

 12z cylindrical lens

 13 carrier substrate; support film

 13s microstructure

 14, 14 'image layer

 141 first field

 141a image section of the first partial image

141m first master image

 14m master image

 14mm third master image

 14r second partial image

 14ra image section of the second partial image

14rm second master image 15 replication layer

 15s stamp

 16 photoresist

 17 exposure device

 17c computer

 17d display

 171 radiation source

 17k condenser

 17o projection lens

 18a spacer layer

 18f, 18fl, 18fr color layer

 18r reflection layer

 18m metal layer

 18mp partially metallized layer

18ms semitransparent metal layer

18mt transparent metal layer

18u transfer position

 18v functional layer

 19 adhesive layer

en Einfallsazimut

 C (| x-azimuth

a _qy -azimuth

ße angle of incidence

The first angle of incidence

the second angle of incidence

Claims

 claims Method for producing a security element (1) comprising a microoptical layer (11), wherein the microoptical layer comprises an array formed by microoptical systems, a carrier substrate (13) and an image layer (14) or several image layers, wherein the one image layer (14 ) or the plural image layers comprise n sub-images (141, 14r) for n = 1 to i, which are visible from an n-th viewing angle associated with the n-th sub-image (141, 14r), and where n is at least one .  characterized,  the following method steps are provided:  a) providing the carrier substrate (13), on the upper side of which the micro-optical layer (11) is formed;  b) applying a photoresist (16) to the underside of the  Carrier substrate (13); c) forming a latent n-th field in the photoresist (16), wherein an n-th master image (141m, 14rm) is placed on the micro-optic layer (11) and at an n-th angle of incidence (βi, ßr) and an n-th incidence azimuth (a _e ) incident parallel light beams is exposed, or wherein an n-th master image (141m, 14rm) with below an n-th angle of incidence (ßi, ß _r ) and an n-th incidence azimuth (a _e )  incident parallel light rays on the micro-optical layer (1 1) is projected, or  wherein the photoresist (16) in step b) in the form of an n-th  Master image (141m, 14rm) is applied to the underside of the carrier substrate (13) and wherein the photoresist (16) through the micro-optical layer (1 1) through with under a n-th Angle of incidence (ßi, ß _r ) and an nth incidence azimuth (a _e )  incident parallel light beams is exposed;  Repeating the process step c) until the formation of the ith latent image;  Developing the photoresist (16) into the image layer (14). Method according to claim 1, characterized, according to the third variant of method step c), in which the photoresist (16) in step b) is in the form of an n-th master image (141m, 14rm) is applied to the underside of the support substrate (13) and the photoresist (16) passes through the microoptical layer (1 1) at an angle n of incidence (βi, β _r ) and an nth incidence azimuth (a _e ) exposing incident parallel light rays, the Process step e) takes place before process step d). Method according to claim 1 or 2, characterized, that the micro-optical systems in the array as  Security feature and / or as a decorative feature of  Security elements (1) form a trained pattern. Method according to one of the preceding claims, characterized, the micro-optical layer (11) comprises differently formed arrays of micro-optical systems. Method according to one of the preceding claims, characterized, in that the micro-optical layer (11) comprises a diaphragm layer (11b) which has transparent and opaque regions. Method according to one of claims 1 to 4, characterized, in that the micro-optical layer (11) comprises an array formed by micromirrors. Method according to one of claims 1 to 4, characterized, in that the micro-optical layer comprises an array formed from microlenses (12). Method according to claim 7, characterized, that the microlenses (12) with at least two different Focal lengths are formed. Method according to one of the preceding claims, characterized, in that the microoptical layer (11) has two or more microoptical systems arranged next to one another with a longitudinal axis and a transverse axis, wherein the longitudinal axes of the microoptical systems are arranged under an x-azimuth (αι) to the longitudinal side of the carrier substrate (13). Method according to claim 9, characterized, the longitudinal axes of the micro-optical systems are formed as a curve. Method according to claim 9 or 10, characterized, in that the micro-optical systems are designed as cylindrical lenses (12z). Method according to one of claims 1 to 8, characterized, in that the micro-optical layer (11) has two or more micro-optical systems arranged in an xy grid, wherein the x-axis of the xy grid is arranged below an x-azimuth (αι) to the longitudinal side of the carrier substrate (13) and the y-axis is disposed at an y-azimuth (a _q) to the transverse side of the carrier substrate (13). Method according to claim 12,  characterized,  that the micro-optical systems are arranged in a warped grid. 14. The method according to claim 12 or 13,  characterized,  that the micro-optical systems are designed as ball lenses. 15. The method according to claim 9 or 12,  characterized,  that the x-azimuth (αι) is equal to 90 °. 16. The method according to any one of the preceding claims,  characterized,  that in process step b) a negative photoresist is applied. 17. The method according to any one of claims 1 to 15,  characterized,  that in process step b) a positive photoresist is applied. Method according to one of the preceding claims,  characterized,  in method step b), a microstructure (13s) in the Support substrate (13) facing away from the underside of the photoresist (16) or in the carrier substrate (13) facing away from bottom of the image layer (14) is formed. Method according to one of the preceding claims, characterized, that after the method step e) a decorative layer is applied to the image layer (14). Method according to one of claims 1 to 18, characterized, that after the process step e) a color layer (18f) or a plurality of color layers (18fl, 18fr) is applied or applied to the image layer (14). Method according to one of claims 1 to 18, characterized, in that, after method step e), a metal layer (18m) and / or an HRI layer is applied to the photoresist (16) or to the image layer (14). Method according to claim 21, characterized, the image layer (14) is formed as an etching mask and regions of the regions not covered by image areas of the image layer (14) Metal layer (18m) or the HRI layer are removed by etching A method according to claim 21 or 22, characterized, the image layer (14) is used as a lift-off layer. 24. The method according to any one of claims 1 to 18,  characterized,  in that, after method step e), a multilayer structure is applied to the image layer (14), comprising a semitransparent metal layer (18 ms), a spacer layer (18a) and a flexible layer Metal layer (18r). 25. The method according to any one of claims 1 to 18,  characterized,  that after the method step e) the image layer (14) is brought into contact with a transfer layer (18u) of a transfer film and the transfer layer (18u) is transferred from the transfer film to the transfer film (18u) only at the locations where the image layer (14) is located Image layer (14) is transmitted. 26. The method according to any one of claims 1 to 18,  characterized,  that after the method step e) a volume hologram layer is applied to the image layer (14). 27. The method according to any one of the preceding claims,  characterized,  in that the method steps b), c) and e) are carried out with an nth photoresist (16) formed with an nth color, and in that the method steps b), c) and e) are repeated (i-1) times, where i is at least 2. Method according to one of claims 1 to 26,  characterized,  that the method steps b), c) and e) are performed with an n-th photoresist (16) formed with an n-th color and / or an n-th sensitivity, and  in that the method steps b), c) and e) are repeated (i-1) times, where i is at least 2. Method according to claim 26,  characterized,  the n photoresists (16) are applied as n layers at least partially superimposed on the lower side of the carrier substrate (13). Method according to claim 29,  characterized,  in that the n photoresists are applied as a striped pattern to the underside of the carrier substrate (13). Method according to one of claims 28 to 30,  characterized,  that in method step c) the exposure with an n-th  Exposure level is performed. 32. The method according to any one of claims 1 to 26,  characterized, the image layer (14) is formed from two partial images (141, 14r) such that in process step c) the exposure is combined with a first image Incidence azimuth occurs, and  that in method step d) the exposure with a second  Incident azimuth, which is different by 90 ° from the first incidence azimuth. 33. The method according to any one of claims 1 to 18,  characterized,  in that a semi-transparent metal layer (18 ms) is applied to the underside of the carrier substrate (13) before the method step b), that the photoresist (16) is formed as an etch resist, and that after execution of the method step e), the metal layer into that of the image layer (14) uncovered areas is removed by etching. Method according to claim 33,  characterized,  that the semitransparent metal layer (18ms) with a  Transmittance is formed in the range of 5 to 70%. Method according to claim 33,  characterized,  that the semitransparent metal layer (18ms) with a  Transmittance formed in the range of 1% to 95% is preferably formed in the range of 5% to 70%. Method according to one of the preceding claims,  characterized, that before the method step b) one with a microstructure formed layer on the underside of the carrier substrate (13) is applied or the underside of the carrier substrate (13) is formed with a microstructure. Method according to one of claims 8 to 17, characterized, in that the image layer (14) is formed from a first and a second image layer, the first image layer having a first partial image (141) and the second image layer having a second partial image (14r), that method step b) is carried out with a first photoresist (16), that after process step c), the process step e) to Forming the first image layer is performed, and that the following further process steps are performed: f) applying a semi-transparent reflection layer to the first image layer; g) applying a second photoresist (16) to the  semitransparent reflection layer; h) temporary embedding of the micro-optical layer (1 1) in a compensating medium (1 1 k) formed with the optical refractive index of the micro-optical systems; i) exposure of the second photoresist (16), the first  Image layer forms an exposure mask; k) developing the second photoresist into a second image layer formed as an etch mask; I) etching the semitransparent reflection layer; m) removal of the compensation medium. Method according to one of the preceding claims, characterized  that in step c) the master image (141m, 14rm) is designed as an electronically controllable display. Method according to one of the preceding claims,  characterized,  in method step c), the parallel light beams projected onto the microoptical layer (11) are passed through filters and / or diaphragms before striking the microoptical layer (11). 40. The method according to any one of the preceding claims,  characterized,  a carrier substrate (13) is provided in method step a) in which the microoptical layer (11) is formed in a first region on the upper side of the carrier substrate (13) and in which a second region is formed on the lower side of the carrier substrate (13 ) the micro-optical layer (11) is formed, and  the method steps b) to e) are carried out in the second area as in the first area, with the difference that in the second area the upper side of the carrier substrate (13) forms the underside of the carrier substrate (13) and vice versa. 41. The method according to claim 40,  characterized, in that the first region and the second region of the carrier substrate (13) overlap one another in an overlapping region. Method according to one of the preceding claims, characterized, that in a final process step, an adhesive layer is applied to the underside and / or top of the security element (1). Method according to one of the preceding claims, characterized, in that the exposure or the projection is carried out in such a way that when the security element (1) is viewed from different viewing directions, in particular by tilting and / or rotating, a continuous or quasi-continuous image sequence of the nth partial images (141, 14r) becomes visible becomes. Method according to one of the preceding claims, characterized, in that the micro-optical layer (11) comprises an array formed by microlenses (12) or an array formed by micro-lens grids, and the exposure or projection is carried out such that the n-th sub-images (141, 14r) as microimages, as in 1- or 2-dimensions distorted micro images or as parts of micro images are generated, whereby in particular when viewing the security element (1) from different viewing directions, in particular by tilting and / or turning, a continuous or quasi-continuous Image sequence of the n-th fields (141, 14r) is visible. Security item (1), produced by a method according to one of the preceding claims. 46. Security document (2) comprising a security element or  several security elements according to claim 45.