EP3457050B1 - Système de pompe à chaleur - Google Patents

Système de pompe à chaleur Download PDF

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Publication number
EP3457050B1
EP3457050B1 EP16901624.3A EP16901624A EP3457050B1 EP 3457050 B1 EP3457050 B1 EP 3457050B1 EP 16901624 A EP16901624 A EP 16901624A EP 3457050 B1 EP3457050 B1 EP 3457050B1
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EP
European Patent Office
Prior art keywords
temperature heating
heating side
high temperature
pipe
low temperature
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Active
Application number
EP16901624.3A
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German (de)
English (en)
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EP3457050A4 (fr
EP3457050A1 (fr
Inventor
Kimitaka KADOWAKI
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of EP3457050A1 publication Critical patent/EP3457050A1/fr
Publication of EP3457050A4 publication Critical patent/EP3457050A4/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B7/00—Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/02—Heat pumps of the compression type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B47/00—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass
    • F25B47/02—Defrosting cycles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/04—Details of condensers
    • F25B2339/047—Water-cooled condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/06—Several compression cycles arranged in parallel
    • F25B2400/061—Several compression cycles arranged in parallel the capacity of the first system being different from the second
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/19—Pressures
    • F25B2700/197—Pressures of the evaporator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2116—Temperatures of a condenser
    • F25B2700/21161—Temperatures of a condenser of the fluid heated by the condenser
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2117—Temperatures of an evaporator
    • F25B2700/21175—Temperatures of an evaporator of the refrigerant at the outlet of the evaporator

Definitions

  • the present invention relates to a heat pump system in which two refrigeration cycles are connected.
  • the heat pump cycle using the natural refrigerant described above has a serious problem in respect of techniques and costs since a pressure to compress refrigerant such as CO 2 is extremely high and combustible HC-based refrigerant is used.
  • the present invention has been attained to solve the above-described problems, and an object of the present invention is to provide a heat pump system that highly efficiently and stably generates high-temperature water without performing complicated control in a refrigerant circuit.
  • a heat pump system according to the present invention is as set forth in claim 1.
  • Fig. 1 is a circuit diagram of the heat pump system using the conventional cascade refrigeration cycle.
  • a heat pump system 200 includes a low order side refrigerant circuit C and a high order side refrigerant circuit D.
  • the low order side refrigerant circuit C is configured such that a compressor 108, a refrigerant heat exchanger 101, an expansion valve 102, and an evaporator 103 are successively connected by a pipe.
  • the high order side refrigerant circuit D is configured such that a compressor 104, a condenser 105, an expansion valve 106, and the refrigerant heat exchanger 101 are successively connected by a pipe.
  • Refrigerant of the low order side refrigerant circuit C and refrigerant of the high order side refrigerant circuit D exchange heat with each other in the refrigerant heat exchanger 101, and thus the heat pump system 200 using the cascade refrigeration cycle is configured.
  • R410A or other such refrigerants are suitable as the refrigerant of the low order side refrigerant circuit C in the heat pump system 200, and R134a or other such refrigerants are suitable as the refrigerant of the high order side refrigerant circuit D.
  • high-temperature and high-pressure gas refrigerant compressed in the compressor 108 is cooled by heat exchange with the refrigerant of the high order side refrigerant circuit D in the refrigerant heat exchanger 101, and is condensed and liquefied.
  • the condensed and liquefied high-pressure liquid refrigerant is, after being depressurized by the expansion valve 102, evaporated by heat exchange with outdoor air in the evaporator 103 to become low-temperature and low-pressure gas refrigerant, and then returns to the compressor 108 again.
  • the refrigerant cycle is thus configured.
  • high-temperature and high-pressure gas refrigerant compressed in the compressor 104 is cooled, condensed and liquefied by temperature-decreased water on a load side in the condenser 105.
  • the condensed and liquefied high-pressure liquid refrigerant is, after being depressurized by the expansion valve 106, evaporated by heat exchange with the refrigerant of the low order side refrigerant circuit C in the refrigerant heat exchanger 101, becomes low-temperature and low-pressure gas refrigerant, and then returns to the compressor 104 again.
  • the refrigerant cycle is thus configured.
  • water passing through a water circuit 107 exchanges heat with the refrigerant of the high order side refrigerant circuit D circulated through the condenser 105, and thus a temperature of the water is raised from 10 degrees C to 90 degrees C, for example.
  • the high order side refrigerant circuit D and the low order side refrigerant circuit C are connected through the refrigerant heat exchanger 101. Then, in the high order side refrigerant circuit D, by allowing the water on the load side to pass through the condenser 105, the water at 10 degrees C is heated to hot water at 90 degrees C, for example.
  • an evaporating temperature of the refrigerant in the refrigerant heat exchanger 101 of the high order side refrigerant circuit D and a condensing temperature of the refrigerant in the refrigerant heat exchanger 101 of the low order side refrigerant circuit C need to be optimally balanced at all times, posing a serious technical problem.
  • Fig. 2 is a schematic block diagram of the heat pump system in the embodiment of the present invention.
  • a heat pump system 100 includes a high temperature heating side refrigerant circuit A and a low temperature heating side refrigerant circuit B.
  • the high temperature heating side refrigerant circuit A is configured such that a high temperature heating side compressor 8, a high temperature heating side condenser 1, a high temperature heating side expansion valve 11, and a high temperature heating side evaporator 2 are successively connected by a refrigerant pipe.
  • the low temperature heating side refrigerant circuit B is configured such that a low temperature heating side compressor 9, a low temperature heating side condenser 4, a low temperature heating side expansion valve 12, and a low temperature heating side evaporator 6 are successively connected by a refrigerant pipe.
  • high-temperature and high-pressure gas refrigerant compressed in the high temperature heating side compressor 8 is cooled by heat exchange with the water on the load side flowing from a pipe 22b to a pipe 22c, and is condensed and liquefied in the high temperature heating side condenser 1.
  • the condensed and liquefied high-pressure liquid refrigerant is, after being depressurized by the high temperature heating side expansion valve 11, evaporated by heat exchange with the water flowing from a pipe 20d to a pipe 20e in the high temperature heating side evaporator 2, becomes low-temperature and low-pressure gas refrigerant, and then returns to the high temperature heating side compressor 8 again.
  • the refrigeration cycle is thus configured.
  • the water corresponds to "liquid" in the present invention.
  • high-temperature and high-pressure gas refrigerant compressed in the low temperature heating side compressor 9 is cooled by heat exchange with the water on the load side flowing from a pipe 20a to a pipe 20b, and is condensed and liquefied in the low temperature heating side condenser 4.
  • the condensed and liquefied high-pressure liquid refrigerant is, after being depressurized by the low temperature heating side expansion valve 12, evaporated by heat exchange with air or other media in the low temperature heating side evaporator 6, becomes low-temperature and low-pressure gas refrigerant, and then returns to the low temperature heating side compressor 9 again.
  • the refrigeration cycle is thus configured.
  • the low temperature heating side refrigerant circuit B of the heat pump system 100 includes a low temperature side water supply port 30 configured to supply water heated by utilizing waste heat, and a low temperature side tank 32 configured to store the water that is supplied and heated in the low temperature heating side refrigerant circuit B.
  • the high temperature heating side refrigerant circuit A of the heat pump system 100 includes a high temperature side water supply port 31 configured to supply water, and a high temperature side tank 33 configured to store the water that is supplied and heated in the high temperature heating side refrigerant circuit A.
  • the low temperature side water supply port 30 corresponds to a "low temperature side liquid supply port” in the present invention.
  • the high temperature side water supply port 31 corresponds to a "high temperature side liquid supply port” in the present invention.
  • the low temperature side water supply port 30 and the low temperature heating side condenser 4 are connected through the pipe 20a.
  • the low temperature heating side condenser 4 and a pipe 20c are connected through the pipe 20b.
  • the pipe 20b is provided with a pump 5 to feed the water from the low temperature heating side condenser 4 to the pipe 20c and the high temperature heating side evaporator 2.
  • One end of the pipe 20c is connected to a motor-operated valve 7, and the other end of the pipe 20c is connected to a three-way valve 3.
  • the three-way valve 3 is provided between the pipe 20d on the side of the high temperature heating side evaporator 2 and the pipe 20c on the side of the low temperature heating side condenser 4, and is connected to the high temperature heating side evaporator 2 through the pipe 20d.
  • the high temperature heating side evaporator 2 is connected to a water return port 16 through the pipe 20e.
  • the water return port 16 communicates with a water return port 17 and the water return port 17 is connected to the pipe 20a so that the water that has passed through the high temperature heating side evaporator 2 and is having the waste heat joins the pipe 20a.
  • the three-way valve 3 and a three-way valve 10 are connected through a pipe 23.
  • the motor-operated valve 7 and the low temperature side tank 32 are connected through a pipe 21.
  • the pipe 20a, the pipe 20b, the pipe 20c, the pipe 20d, and the pipe 20e correspond to a "first pipe” in the present invention.
  • the three-way valve 3 corresponds to a "first three-way valve” in the present invention.
  • the pipe 23 corresponds to a "third pipe” in the present invention.
  • the three-way valve 10 corresponds to a "second three-way valve” in the present invention.
  • the high temperature side water supply port 31 and the three-way valve 10 are connected through a pipe 22a.
  • the three-way valve 10 and the high temperature heating side condenser 1 are connected through the pipe 22b.
  • the high temperature heating side condenser 1 and the high temperature side tank 33 are connected through the pipe 22c.
  • the pipe 22a, the pipe 22b and the pipe 22c correspond to a "second pipe" in the present invention.
  • the water circuit from the low temperature side water supply port 30 to the low temperature side tank 32 and the water circuit from the high temperature side water supply port 31 to the high temperature side tank 33 are formed.
  • the water circuit from the low temperature side water supply port 30 through the low temperature heating side condenser 4 and the three-way valve 3 to the high temperature heating side evaporator 2 is also formed.
  • the heat pump system 100 includes a temperature sensor 13, a pressure sensor 14, a temperature sensor 15 and a control unit 18 to be described later in Fig. 3 .
  • Fig. 3 is a state diagram illustrating control relationship of a control unit of the heat pump system in the embodiment of the present invention.
  • the control unit 18 comprises a microcomputer, for example, and controls drive of the three-way valve 3, the pump 5, the motor-operated valve 7 and the three-way valve 10.
  • the control unit 18 allows the pressure sensor 14 provided in the refrigerant pipe on a downstream side of the high temperature heating side evaporator 2 to detect an evaporating pressure of the refrigerant in the high temperature heating side evaporator 2.
  • control unit 18 allows the temperature sensor 13 provided in the refrigerant pipe on the downstream side of the high temperature heating side evaporator 2 to detect an evaporating temperature of the refrigerant in the high temperature heating side evaporator 2. Further, the control unit 18 detects a temperature of the hot water flowing out from the high temperature heating side condenser 1 by the temperature sensor 15 provided in the pipe 22c on the downstream side of the high temperature heating side condenser 1. Note that the temperature sensor 13 and the temperature sensor 15 are configured by a thermistor, for example.
  • control unit 18 is provided inside the high temperature heating side refrigerant circuit A is illustrated in the present embodiment, the present invention is not limited thereto and the control unit 18 may be provided in a place other than the high temperature heating side refrigerant circuit A.
  • the control unit 18 determines an optimum value of the evaporating temperature or the evaporating pressure of the refrigerant on the downstream of the high temperature heating side evaporator 2, from a target hot water temperature of the hot water generated in the high temperature heating side refrigerant circuit A and a utilization temperature of the waste heat of the hot water utilizing the waste heat supplied from the low temperature side water supply port 30.
  • the temperature of the water heated in the high temperature heating side refrigerant circuit A or the temperature of the water heated in the low temperature heating side refrigerant circuit B is detected, and the pump 5 is controlled to attain a heating quantity required in the low temperature heating side condenser 4 by predetermined calculation.
  • control unit 18 power consumption of the high temperature heating side refrigerant circuit A and the low temperature heating side refrigerant circuit B is measured, and the pump 5 is controlled to attain the heating quantity required in the low temperature heating side condenser 4 by predetermined calculation.
  • control unit 18 controls the three-way valve 3, and controls a flow rate of the water to the high temperature heating side evaporator 2 so that the evaporating temperature or the evaporating pressure of the high temperature heating side evaporator 2 becomes the optimum value. Furthermore, the control unit 18 controls the three-way valve 10 to allow the hot water heated in the low temperature heating side condenser 4 to flow into the three-way valve 10, to allow the water to be mixed with the water flowing from the high temperature side water supply port 31 into the high temperature heating side condenser 1.
  • control unit 18 the temperature of the water heated by the high temperature heating side condenser 1 and detected by the temperature sensor 15 and the evaporating temperature of the refrigerant detected by the temperature sensor 13 or the evaporating pressure of the refrigerant detected by the pressure sensor 14 are detected, and the pump 5 and the three-way valve 3 are controlled on the basis of predetermined calculation.
  • control unit 18 a target temperature of the water generated in the high temperature heating side refrigerant circuit A is detected, and operation of the low temperature heating side refrigerant circuit B and the high temperature heating side refrigerant circuit A and the three-way valve 3 are controlled.
  • Fig. 4 is a schematic block diagram at the time of operating the low temperature heating side refrigerant circuit of the heat pump system in the embodiment of the present invention. Note that a thick solid line arrow in Fig. 4 indicates flow of the water.
  • the control unit 18 drives the pump 5, and makes the water flow from the low temperature side water supply port 30 through the pipe 20a into the low temperature heating side condenser 4. Then, the water flowing into the low temperature heating side condenser 4 exchanges heat with high-pressure and high-temperature refrigerant flowing into the low temperature heating side condenser 4 of the low temperature heating side refrigerant circuit B, and a liquid temperature rises from 30 degrees C to 40 degrees C, for example.
  • the water flowing out from the low temperature heating side condenser 4 passes through the pipe 20b and the pipe 21 and is stored in the low temperature side tank 32.
  • the target temperature of the water is set at about 40 degrees C for a heating use or other uses through contact input or other input from a remote controller or a central control panel, for example.
  • the control unit 18 stops the high temperature heating side compressor 8, closes the three-way valve 3, drives the low temperature heating side compressor 9, opens the motor-operated valve 7, operates the low temperature heating side refrigerant circuit B alone, and generates low-temperature hot water in the water circuit.
  • Fig. 5 is a schematic block diagram at the time of operating the high temperature heating side refrigerant circuit of the heat pump system in the embodiment of the present invention. Note that a thick solid line arrow in Fig. 5 indicates the flow of the water. As illustrated in Fig. 5 , the control unit 18 control the three-way valve 10 so that the water is circulated from the pipe 22a to the pipe 22b, and allows the water to be frown from the high temperature side water supply port 31 to the high temperature heating side condenser 1 through the pipe 22a and the pipe 22b.
  • the water flowing into the high temperature heating side condenser 1 exchanges the heat with the high-pressure and high-temperature refrigerant flowing into the high temperature heating side condenser 1 of the high temperature heating side refrigerant circuit A, and the liquid temperature rises to 90 degrees C that is higher than the liquid temperature of the hot water generated in the low temperature heating side refrigerant circuit B, for example.
  • the water flowing out from the high temperature heating side condenser 1 passes through the pipe 22c and is stored in the high temperature side tank 33.
  • the target temperature of the water is set at about 90 degrees C through contact input or other input from a remote controller or a central control panel or other devices, for example, and high-temperature waste water is stably obtained from the high temperature side water supply port 31.
  • the control unit 18 stops the low temperature heating side compressor 9, performs control so that the three-way valve 10 circulates the water only from the pipe 22a to the pipe 22b, drives the high temperature heating side compressor 8, operates the high temperature heating side refrigerant circuit A alone, and generates high-temperature hot water in the water circuit.
  • Fig. 6 is a schematic block diagram at the time of taking out two kinds of hot water from the heat pump system in the embodiment of the present invention. Note that a thick solid line arrow in Fig. 6 indicates the flow of the water.
  • the control unit 18 drives the pump 5, opens the motor-operated valve 7, adjusts an opening degree of the three-way valve 3, and makes the water flow from the low temperature side water supply port 30 through the pipe 20a into the low temperature heating side condenser 4.
  • the water flowing into the low temperature heating side condenser 4 exchanges the heat with the high-pressure and high-temperature refrigerant flowing into the low temperature heating side condenser 4 of the low temperature heating side refrigerant circuit B, and the liquid temperature rises from 30 degrees C to 40 degrees C, for example.
  • the water flowing out from the low temperature heating side condenser 4 passes through the pipe 20b and the pipe 21 and is separated into the water to be stored in the low temperature side tank 32 and the water to be sent to the three-way valve 3.
  • the control unit 18 controls the three-way valve 3 such that the water is circulated from the pipe 20c to the pipe 20d. Then, the water sent to the three-way valve 3 is sent to the high temperature heating side evaporator 2, exchanges the heat with the refrigerant circulated in the high temperature heating side evaporator 2 of the high temperature heating side refrigerant circuit A, and evaporates the refrigerant.
  • the water sent to the high temperature heating side evaporator 2 is heated by the low temperature heating side condenser 4 and is at 40 degrees C stably, for example, the evaporating temperature and the evaporating pressure of the refrigerant in the high temperature heating side evaporator 2 can be stabilized.
  • the water sent to the high temperature heating side evaporator 2 flows out from the high temperature heating side evaporator 2, and is sent through the pipe 20e to the water return port 16.
  • the water sent to the water return port 16 is sent to the water return port 17, joins the water utilizing the waste heat supplied from the low temperature side water supply port 30, and is sent to the low temperature heating side condenser 4 again.
  • the control unit 18 adjusts the opening degree of the three-way valve 3 by predetermined calculation so that the evaporating temperature of the refrigerant detected in the temperature sensor 13 or the evaporating pressure detected in the pressure sensor 14 becomes a fixed value or greater, thereby to bring the liquid temperature of the water heated in the high temperature heating side condenser 1 detected in the temperature sensor 15 close to the target liquid temperature.
  • the hot water from the high temperature side tank 33 storing the high-temperature water heated in the high temperature heating side refrigerant circuit A is made to pass through in the order of the pipe 22c, the pipe 22b, the three-way valve 10, the pipe 23, the three-way valve 3, the pipe 20c and the pipe 20b, and is made to flow back to the low temperature heating side condenser 4.
  • the high-temperature water heated in the high temperature heating side refrigerant circuit A can be used as a heat source for defrosting the low temperature heating side refrigerant circuit B, and defrosting time can be shortened.
  • refrigerant used in the low temperature heating side refrigerant circuit B R32, R410A, or R407C is used, for example.
  • refrigerant used in the high temperature heating side refrigerant circuit A using ammonia R1234yf, R1234ze, R245fa, or HC-based refrigerant is used, for example.
  • the heat pump system 100 includes: the low temperature heating side refrigerant circuit B in which the low temperature heating side compressor 9, the low temperature heating side condenser 4, the low temperature heating side expansion valve 12 and the low temperature heating side evaporator 6 are successively connected by a refrigerant pipe; the high temperature heating side refrigerant circuit A in which the high temperature heating side compressor 8, the high temperature heating side condenser 1, the high temperature heating side expansion valve 11 and the high temperature heating side evaporator 2 are successively connected by a refrigerant pipe; the first pipe configured to connect a low temperature side liquid supply port, the low temperature heating side condenser 4, and the high temperature heating side evaporator 2 in this order, thereby to circulate the liquid; the second pipe configured to connect a high temperature side liquid supply port and the high temperature heating side condenser 1 in this order, thereby to circulate the liquid; the pump provided in the first pipe and configured to feed the liquid heated in the low temperature heating side condenser 4 to the high temperature heating side evaporator
  • control unit 18 controls the pump 5 and the control valve based on the temperature of the liquid heated by the high temperature heating side condenser 1, and the evaporating temperature of the refrigerant in the high temperature heating side evaporator 2 or the evaporating pressure of the refrigerant in the high temperature heating side evaporator 2.
  • control unit 18 detects the target temperature of the liquid generated in the high temperature heating side refrigerant circuit A, and controls the operation of the low temperature heating side refrigerant circuit B and the high temperature heating side refrigerant circuit A, and the control valve.
  • the temperature of the liquid circulated in the second pipe and heated in the high temperature heating side condenser 1 is higher than the temperature of the liquid circulated in the first pipe and heated in the low temperature heating side condenser 4.
  • the hot water at different temperatures can be obtained in one heat pump system 100.
  • control valve is a first three-way valve
  • heat pump system 100 further includes: the second three-way valve provided in the second pipe between the high temperature side liquid supply port and the high temperature heating side condenser 1; and the third pipe configured to connect the first three-way valve and the second three-way valve.
  • the stable high-temperature water can be supplied from the first three-way valve to the second pipe, and the temperature of the water circulated in the second pipe can be elevated.
  • liquid heated in the high temperature heating side refrigerant circuit A is circulated through the second pipe, the third pipe and the first pipe to the low temperature heating side condenser 4.
  • the high-temperature water heated in the high temperature heating side refrigerant circuit A can be turned to the heat source for defrosting the low temperature heating side refrigerant circuit B, and the defrosting time can be shortened.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)

Claims (5)

  1. Système de pompe à chaleur, comprenant :
    un circuit de réfrigérant côté chauffage à basse température (B) comprenant un compresseur côté chauffage à basse température (9), un condensateur côté chauffage à basse température (4), un détendeur côté chauffage à basse température (12) et un évaporateur côté chauffage à basse température (6) raccordés successivement par un tuyau de réfrigérant ;
    un circuit de réfrigérant côté chauffage à haute température (A) comprenant un compresseur côté chauffage à haute température (8), un condensateur côté chauffage à haute température (1), un détendeur côté chauffage à haute température (11) et un évaporateur côté chauffage à haute température (2) raccordés successivement par un tuyau de réfrigérant ;
    un premier tuyau (20a, 20b, 20c, 20d, 20e) raccordant un orifice d'alimentation en liquide côté basse température (30) configuré pour alimenter le système en liquide, le condensateur côté chauffage à basse température (4) et l'évaporateur côté chauffage à haute température (2) dans cet ordre, pour ainsi faire circuler le liquide ;
    un deuxième tuyau (22a, 22b, 22c) raccordant un orifice d'alimentation en liquide côté haute température (31) configuré pour alimenter le système en liquide, et le condensateur côté chauffage à haute température (1) dans cet ordre, pour ainsi faire circuler le liquide ;
    une pompe (5) prévue dans le premier tuyau (20a, 20b, 20c, 20d, 20e) et configurée pour alimenter le liquide chauffé dans le condensateur côté chauffage à basse température (4) vers l'évaporateur côté chauffage à haute température (2) ;
    une première vanne à trois voies (3) prévue dans le premier tuyau (20a, 20b, 20c, 20d, 20e) entre le condensateur côté chauffage à basse température (4) et l'évaporateur latéral de chauffage à haute température (2) et configurée pour réguler un débit d'écoulement du liquide mis en circulation à l'intérieur du premier tuyau (20a, 20b, 20c, 20d, 20e) ; et
    une unité de commande (18) configurée pour commander au moins l'une de la pompe (5) et de la première vanne à trois voies (3), et pour réguler un débit d'écoulement du liquide alimenté depuis le condensateur côté chauffage à basse température (4) vers l'évaporateur côté chauffage à haute température (2), caractérisé en ce que le système de pompe à chaleur comprend en outre :
    une seconde vanne à trois voies (10) prévue dans le deuxième tuyau entre l'orifice d'alimentation en liquide côté haute température (31) et le condensateur côté chauffage à haute température (1) ; et
    un troisième tuyau (23) configuré pour raccorder la première vanne à trois voies (3) et la seconde vanne à trois voies (10) ; dans lequel
    l'unité de commande (18) est configurée pour commander la seconde vanne à trois voies (10) afin de permettre à du liquide chauffé dans le condensateur côté chauffage à basse température (4) de s'écouler dans la seconde vanne à trois voies (10) et de se mélanger avec le liquide s'écoulant depuis l'orifice d'alimentation en eau côté haute température (31) vers le condensateur côté chauffage à haute température (1).
  2. Système de pompe à chaleur selon la revendication 1,
    dans lequel l'unité de commande (18) est configurée pour commander la pompe (5) et la première vanne à trois voies (3) sur la base d'une température du liquide chauffé par le condensateur côté chauffage à haute température (1), et d'une température d'évaporation du réfrigérant dans l'évaporateur côté chauffage à haute température (2) ou d'une pression d'évaporation du réfrigérant dans l'évaporateur côté chauffage à haute température (1).
  3. Système de pompe à chaleur selon la revendication 1 ou 2,
    dans lequel l'unité de commande (18) est configurée pour détecter une température cible du liquide généré dans le circuit de réfrigérant côté chauffage à haute température (A), et pour commander le fonctionnement du circuit de réfrigérant côté chauffage à basse température (B) et du circuit de réfrigérant côté chauffage à haute température (A), et de la première vanne à trois voies (3).
  4. Système de pompe à chaleur selon l'une quelconque des revendications 1 à 3,
    dans lequel le système de pompe à chaleur est configuré de telle sorte qu'une température du liquide mis en circulation dans le deuxième tuyau (22a, 22b, 22c) et chauffé dans le condensateur côté chauffage à haute température (1) soit rendue supérieure à une température du liquide mis en circulation dans le premier tuyau (20a, 20b, 20c, 20d, 20e) et chauffé dans le condensateur côté chauffage à basse température (4).
  5. Système de pompe à chaleur selon la revendication 1,
    dans lequel le système peut fonctionner pour faire circuler un liquide chauffé dans le circuit de réfrigérant côté chauffage à haute température (A) à travers le deuxième tuyau (22c, 22b), le troisième tuyau (23) et le premier tuyau (20c, 20b) vers le condensateur côté chauffage à basse température (4).
EP16901624.3A 2016-05-10 2016-05-10 Système de pompe à chaleur Active EP3457050B1 (fr)

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11839062B2 (en) 2016-08-02 2023-12-05 Munters Corporation Active/passive cooling system
CN108759142B (zh) * 2018-07-02 2023-04-25 江苏奥斯康新能源有限公司 一种特殊的复叠式空气源高温热泵冷暖系统
DE102019111173A1 (de) * 2019-02-26 2020-08-27 caldoa GmbH Kaltwärmenetz mit Booster-Wärmepumpe
DE102020201349A1 (de) * 2020-02-04 2021-08-05 Volkswagen Aktiengesellschaft Kältemittelkreislaufanordnung und Verfahren zum Betrieb einer Kältemittelkreislaufanordnung
CN213713606U (zh) * 2020-11-10 2021-07-16 云南道精制冷科技有限责任公司 一种冷热联供双效板换机组
CA3221677A1 (fr) * 2021-06-16 2022-12-22 Todd M. Bandhauer Systeme de pompe a chaleur a source d'air et procede d'utilisation pour la production industrielle de vapeur
CN114992896A (zh) * 2022-06-21 2022-09-02 同济大学 一种过冷增效型多级半复叠热泵循环系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038561A (ja) * 1983-08-11 1985-02-28 ダイキン工業株式会社 複合ヒ−トポンプ加熱装置
JPH01314864A (ja) * 1988-06-16 1989-12-20 Sanden Corp 住棟用空調装置
JPH0336467A (ja) * 1989-06-29 1991-02-18 Ebara Corp 高温ヒートポンプ
DE10240767B3 (de) * 2002-08-30 2004-10-21 KKW Kulmbacher Klimageräte-Werk GmbH Wärmepumpenanlage
JP4599910B2 (ja) * 2004-07-01 2010-12-15 ダイキン工業株式会社 給湯装置
JP2007232282A (ja) * 2006-03-01 2007-09-13 Sharp Corp ヒートポンプ式給湯機
WO2010013590A1 (fr) * 2008-07-28 2010-02-04 株式会社前川製作所 Système de pompe à chaleur
JP2011257036A (ja) * 2010-06-07 2011-12-22 Mitsubishi Heavy Ind Ltd 温度調整装置
JP2012042177A (ja) 2010-08-23 2012-03-01 Hitachi Appliances Inc ヒートポンプ式温水発生装置
EP2645005A1 (fr) * 2012-03-28 2013-10-02 VGE bvba Système de pompe à chaleur utilisant de la chaleur latente
ES2754074T3 (es) * 2013-07-19 2020-04-15 Bdr Thermea Group Bomba de calor en cascada

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WO2017195275A1 (fr) 2017-11-16
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EP3457050A1 (fr) 2019-03-20
JP6559339B2 (ja) 2019-08-14

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