EP3453054A4 - Dispositifs et composants électroluminescents dotés d'une résistance chimique améliorée et procédés apparentés - Google Patents

Dispositifs et composants électroluminescents dotés d'une résistance chimique améliorée et procédés apparentés Download PDF

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Publication number
EP3453054A4
EP3453054A4 EP17793254.8A EP17793254A EP3453054A4 EP 3453054 A4 EP3453054 A4 EP 3453054A4 EP 17793254 A EP17793254 A EP 17793254A EP 3453054 A4 EP3453054 A4 EP 3453054A4
Authority
EP
European Patent Office
Prior art keywords
components
light emitter
chemical resistance
related methods
improved chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17793254.8A
Other languages
German (de)
English (en)
Other versions
EP3453054A1 (fr
Inventor
Ya Qun Liu
Wanchao Jiang
Gang Xu
Linlin DUAN
Siyuan Zhang
Zhe Ding
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority claimed from PCT/US2017/030843 external-priority patent/WO2017192725A1/fr
Publication of EP3453054A1 publication Critical patent/EP3453054A1/fr
Publication of EP3453054A4 publication Critical patent/EP3453054A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C08F214/186—Monomers containing fluorine with non-fluorinated comonomers
    • C08F214/188—Monomers containing fluorine with non-fluorinated comonomers with non-fluorinated vinyl ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C08F214/186—Monomers containing fluorine with non-fluorinated comonomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Led Device Packages (AREA)
  • Paints Or Removers (AREA)
EP17793254.8A 2016-05-03 2017-05-03 Dispositifs et composants électroluminescents dotés d'une résistance chimique améliorée et procédés apparentés Withdrawn EP3453054A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662331080P 2016-05-03 2016-05-03
PCT/US2017/030843 WO2017192725A1 (fr) 2016-05-03 2017-05-03 Dispositifs et composants électroluminescents dotés d'une résistance chimique améliorée et procédés apparentés

Publications (2)

Publication Number Publication Date
EP3453054A1 EP3453054A1 (fr) 2019-03-13
EP3453054A4 true EP3453054A4 (fr) 2020-01-01

Family

ID=65226078

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17793254.8A Withdrawn EP3453054A4 (fr) 2016-05-03 2017-05-03 Dispositifs et composants électroluminescents dotés d'une résistance chimique améliorée et procédés apparentés

Country Status (2)

Country Link
EP (1) EP3453054A4 (fr)
CN (1) CN109314168A (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0911347A2 (fr) * 1997-10-15 1999-04-28 E.I. Du Pont De Nemours And Company Copolymères à base d' anhydride maléique ou d' acide maléique et de fluoro-oléfines
US20080153977A1 (en) * 2006-12-20 2008-06-26 Samuels George J Fluorocopolymers blends
KR20090040097A (ko) * 2007-10-19 2009-04-23 삼성전기주식회사 발광다이오드 패키지
US20110260945A1 (en) * 2007-08-03 2011-10-27 Fumio Karasawa Coating Composition and Article Using the Same
US20120184697A1 (en) * 2006-12-20 2012-07-19 Honeywell International Inc. Copolymers for barriers
US20130345381A1 (en) * 2011-03-16 2013-12-26 Ramin Amin-Sanayei Synthesis of making 2,3,3,3-tetrafluoropropene containing fluoropolymers
WO2016040525A1 (fr) * 2014-09-09 2016-03-17 Honeywell International Inc. Polymères fluorés à faible teneur en cov et haute teneur en solides pour des applications de revêtement

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009051876A (ja) * 2007-08-23 2009-03-12 Three M Innovative Properties Co コーティング組成物及びそれを使用した物品
JP5737466B1 (ja) * 2013-08-02 2015-06-17 ダイキン工業株式会社 重合性官能基及び架橋性官能基からなる群より選択される少なくとも１種の基を含有する含フッ素重合体を含む組成物及び塗装物品
US9548429B2 (en) * 2014-05-10 2017-01-17 Sensor Electronic Technology, Inc. Packaging for ultraviolet optoelectronic device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0911347A2 (fr) * 1997-10-15 1999-04-28 E.I. Du Pont De Nemours And Company Copolymères à base d' anhydride maléique ou d' acide maléique et de fluoro-oléfines
US20080153977A1 (en) * 2006-12-20 2008-06-26 Samuels George J Fluorocopolymers blends
US20120184697A1 (en) * 2006-12-20 2012-07-19 Honeywell International Inc. Copolymers for barriers
US20110260945A1 (en) * 2007-08-03 2011-10-27 Fumio Karasawa Coating Composition and Article Using the Same
KR20090040097A (ko) * 2007-10-19 2009-04-23 삼성전기주식회사 발광다이오드 패키지
US20130345381A1 (en) * 2011-03-16 2013-12-26 Ramin Amin-Sanayei Synthesis of making 2,3,3,3-tetrafluoropropene containing fluoropolymers
WO2016040525A1 (fr) * 2014-09-09 2016-03-17 Honeywell International Inc. Polymères fluorés à faible teneur en cov et haute teneur en solides pour des applications de revêtement

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017192725A1 *

Also Published As

Publication number Publication date
EP3453054A1 (fr) 2019-03-13
CN109314168A (zh) 2019-02-05

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