Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/12—Supports; Mounting means
  • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
  • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/12—Supports; Mounting means
  • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
  • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/12—Supports; Mounting means
  • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
  • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
  • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched

Definitions

• the invention relates to an electronic module comprising an integrated circuit chip connected to a radiofrequency antenna and to a CMS surface component, for example a capacitor.
• the invention may relate in particular to the field of electronic media such as contactless and / or contactless smart cards or hybrid cards, tickets or radio frequency tags (RFID), radio frequency transponders, inserts (or inlay) integrating or constituting such a module.
• electronic media such as contactless and / or contactless smart cards or hybrid cards, tickets or radio frequency tags (RFID), radio frequency transponders, inserts (or inlay) integrating or constituting such a module.
• RFID radio frequency tags
• inserts or inlay
• Such electronic supports may in particular comply with the ISO / IEC 14443 or ISO 78016 standard.
• the invention is preferably used by being inserted in particular in portable electronic devices such as bracelet, watch, keychain, clothing, etc., to perform radio frequency transactions, payment, identification, authentication.
• a smart card module It is known to manufacture a smart card module by the steps corresponding to the preamble of claim 1.
• Such antenna modules are described in patent FR 2743649 B1.
• the chip may be placed astride the turns of an antenna and at the periphery so as to allow a connection to the chip by soldered wire.
• the chip is placed in the center of the module, the antenna has a connection end located at the periphery of the turns and the connection of the chip to this end is made by soldered wire spanning the turns.
• the module comprises a conductive bridge formed on the face opposite to that carrying the turns and conductive vias through the support to connect the conductive bridge to the antenna.
• Patent Application EP2669852 describes a single-sided integrated circuit module with a deflection of peripheral antenna turns towards the center to allow a chip to be mounted astride the turns and to directly connect an external terminal of the antenna by soldered wire.
• US 2012 0050130 discloses a radio frequency communication device comprising an insulating substrate carrying an antenna connected to a chip and a capacitor.
• the capacitor is obtained by two conductive plates disposed on either side of the substrate.
• the object of the invention is to solve the above problems and in particular to have a high-performance radiofrequency module simpler and economical to manufacture.
• the invention consists firstly in adopting a single-sided antenna module substrate, secondly in providing a capacitor in the form of a passive component or integrated circuit, thirdly in configuring this single-sided substrate so as to allow surface mounting (CMS ) a component (resistor capacitor, coil or other ...) in the form of passive component or integrated circuit chip and its connection to the antenna. Finally, fourth, the invention consists in retaining a smart card type manufacturing for mechanical reliability and amortize the manufacturing price.
• CMS surface mounting
• the configuration of the module must allow easy manufacturing on an industrial scale and with conventional technologies of the smart card world.
• the subject of the invention is therefore a radiofrequency integrated circuit chip module, comprising:
• metallizations comprising conductive tracks, made on the same side of the substrate and forming an antenna with two connection terminals, at least one zone on the support film for coating or the location of the radiofrequency integrated circuit chip and of a capacitance in the form of a surface-mounted component, the radiofrequency integrated circuit chip and the component being arranged on a same face of the substrate and connected to the antenna,
• the conductive tracks are on one and the same side of the support film, the connection being made through perforations through the insulating film or directly onto surface tracks of the insulating substrate.
• the module comprises a spiral having antenna turns at the periphery of the substrate, the chip and the component being disposed inside (or above) the spiral;
• It comprises a metallized interconnection terminal inside the spiral, said metallized interconnection terminal being connected to the antenna by an electrical connection in the sectioned or unsheathed state;
• sectioned state or short circuit results from an operation among a mechanical or laser ablation, a punctual perforation of the substrate (or support film) and said connection, mechanical abrasion, punching (or chemical etching);
• connection of the chip to the antenna is made through perforations through the insulating film
• the chip and the component are connected to the same pair of interconnection terminals disposed inside the antenna in the form of a spiral;
• the module can optimally include a deviation
• the component (14) can be a capacitance
• the chip and the component are coated with an insulating protective or coating material.
• the invention also relates to a device such as a smart card comprising the module above. It may comprise a body with a cavity emerging on the surface and said module encircled and fixed in the cavity.
• the invention makes it possible to economically manufacture a contactless smart card with the technology for manufacturing mini SIM cards by having good radiofrequency performance.
• the components and their connections are mechanically protected since they are encapsulated with insulating resin and the module is encased in a card body cavity such as a smart card module but preferably with antenna dimensions covering approximately twice the size of the card. dimensions of an ISO 7816 chip card module.
• the contactless card in mini SIM format can then be detached from its support thanks to a precut around it. Then the contactless card can be slipped into a bracelet or a watch (or any portable object) to perform transactions including banking, identification payment, authentication.
• FIG. 3 illustrates a current module of the prior art of the double-sided type with a radiofrequency chip and a capacitance on the same face;
• FIGS. 4A, 4B, 4C, 4D, 4E, 4F illustrate a radiofrequency chip module according to a first embodiment of the invention
• FIGS. 5A, 5B, 5C illustrate a radiofrequency chip module according to a second embodiment of the invention
• FIGS. 6 and 7 respectively illustrate a radiofrequency chip module embedded in a device body and a section along AA of FIG. 6.
• FIGS. 1 and 2 show an integrated circuit module 1C of the prior art (patent application EP2669852). It comprises an insulating substrate 3, conductive tracks 2, made on the same side of the substrate 12, forming an antenna
• the radiofrequency integrated circuit chip is disposed on the same face 12 of the substrate
• the chip 4 is mounted astride in part on a deflection (D) of the peripheral turns 25 towards a central region of the module.
• FIG 3 is shown an existing embodiment; It comprises a double-face support film (or substrate) 3 comprising etched metallizations on each face of the insulating support film. On a first face 12, are formed the spiral antenna 2 and electrically conductive pads or terminals 8, 9. And on a second face 13 opposite to the first face, there are second engraved metallizations comprising interconnection pads 11a, 11b to connect the integrated circuit chip 4 and a component 14 SMD (surface mounted component) or SMD (Surface Mounted Device).
• the SMD component can for example be a capacitance in the form of a passive component, the capacitor being formed of a multilayer of dielectric ceramics.
• EL capacitor targeted by the invention has the advantage to be compact. It can have a high capacity in a volume or space significantly smaller or of the same order of magnitude as that of the radiofrequency chip.
• the chip and the component are mounted on the same side of a second face 13 of the insulating substrate and connect terminals 8, 9 of the antenna 2 via conductive vias 10 in blind perforations of the support film.
• the vias 10 connect terminals 8, 9 of the antenna made on the first face 12.
• an integrated circuit chip module 1A 4 according to a first embodiment of the invention comprises, as previously, an insulating substrate 3, conductive tracks 25, made on the same side of the substrate (12). ; These tracks form an antenna 2 with turns 25 and have two ends or terminals 8, 9.
• This mode provides a zone 16 for embedding or locating the radiofrequency integrated circuit chip and the component 14, in the form of a component (of the SMD type), in particular a capacitance;
• the assembly 4, 14, 5 is substantially centered on a longitudinal bisector ML of the module (to allow a resin coating and embedding in a card body);
• the coating zone 16 is covered with a coating material 6 protecting these two components 4, 14 as well as their electrical connections. These connections can be of any known type.
• the radiofrequency integrated circuit chip 4 and the component 14 are disposed on the same first face 12 of the substrate and connected to the antenna 2.
• the metallizations 8, 9 are made on one and the same side of the support film.
• the connection 5 connecting the components is carried out here through the perforations 17 (non-metallized) of the insulating substrate 3.
• the antenna is here produced by etching of metal previously bonded to a substrate presented in ribbon and having perforations or connection wells.
• the antenna 2 comprises current supply tracks 19A to achieve electrical continuity of the metallizations during etching.
• These tracks 19A can be sectioned later at the same time as the extraction of the substrate module by punching along their periphery 33 in dashed lines.
• these tracks 19A may be sectioned at the same time as the other tracks to be disconnected 19B, located outside the module (conventional circuit-breaker chip card films).
• the antenna comprises a metallized terminal 20 of redirection inside the turns 25.
• This metallized redirect terminal is connected to the antenna initially by an electrical connection 19B to allow a current supply.
• These feeds 19A, 19B may subsequently be eliminated, in particular by punching 18 or laser, in particular during the extraction of the module 1A from its transport ribbon R.
• the module is provided in a final version with the current supply electrical connections 19 in the sectioned or short-circuited state.
• the sectioned or unsheathed state of the electrical connection 19 can result from one of a mechanical or laser ablation, a point perforation of the support film and the bond, a mechanical abrasion, a punching.
• the antenna turns extend here at the periphery of the support film 3 and the chip 4 and the component (in particular capacitive) 14 are arranged inside the spiral formed by the turns 25.
• the module 1A (FIG 4A) is intended to perform authentications and financial transactions, banking, payment and must be small as the format of a mini SIM card.
• the turns 25 preferably extend around the periphery of the module to have a larger coupling area on a minimum surface area.
• the components 4, 14 are placed substantially on a longitudinal ML median and substantially centered on the module to allow a coating of the components and embedding of the module in a smart card body substantially like mini SIM cards in 2FF format.
• the chip 4 and. The component 14 is connected to the same pair of interconnection terminals 8, 9 disposed within the antenna spiral 2.
• the antenna may be of any shape such as a UHF type antenna.
• the module comprises an external terminal 9 of the antenna brought close to the interconnect metallization 21 (or redirection terminal) via a deviation D of the turns;
• the deflection D makes a loop which extends from the periphery of the support film to a median position within the spiral (in fact towards the coating zone or location of the components 16);
• the deflection "D" also extends towards the metallized interconnection terminal 21 (or redirection terminal).
• FIG. 4B illustrates an enlargement of a portion of FIG. 4A centered around the connections of the chip 4 and the capacitor 14.
• the capacitor 14 and the radiofrequency chip 4 are disposed on a face 13 of the insulating substrate 3 and connected to the terminals (8, 9 via 21) of the antenna located on the face 12 of the support 3, opposite to the face 13.
• the chip 4 is connected by soldered wire 5 through wells 17 and the capacitor is connected by conductive adhesive 28 through other wells 17.
• Figure 4C is an approximate section on C-C of Figure 4B.
• the capacitor rests on the substrate 3 and the connection ends of the capacitor are in line with the perforations 17 or recesses filled with conductive glue to electrically connect the capacitance to the antenna.
• the capacity overhangs wells 17 corresponding to it.
• FIG. 4D illustrates a connection variant of the capacitor 14. It can be connected to the antenna terminals 8, 9 by being placed in a window or cavity 17 formed in the insulating substrate 3 according to a configuration of the embodiment of the FIG. 4A.
• the advantage is to reduce the overall thickness of the module.
• the capacitor is connected with conducting glue 28. Rather than being straddling the substrate between two wells 17, the capacitor is at the bottom of a well 17.
• FIG. 4F illustrates an alternative connection of the components according to a configuration of the first embodiment.
• This variant differs from the mode of FIG. 4A in that the chip 4 and the capacitor 14 are directly connected on the one hand to the stud 9 and on the other hand to the stud 8.
• This embodiment has the advantage of being compact for modules with little space.
• the antenna 25 is disposed on the same side of the substrate 3 as the chip.
• the chip (or component) can be mounted astride turns.
• Figure 4E illustrates a connection variant of Figure 4D. It differs in that the capacitor 14 is bonded to the bottom of a well 17 and connected to an antenna terminal 8 by conductive adhesive 28, the capacitor being housed at least in portion in the orifice or perforation or well 17.
• the capacitance here comprises connection zones at its opposite ends. The other end is directly connected by soldered wire 5 to the second antenna terminal 9.
• the advantage here is to compensate for the height of the capacity and to have a compact configuration of the components.
• the chip 4 can also be arranged in a cavity of corresponding dimensions.
• the module thus produced can be cut at its periphery 33 (dashed) for its extraction of a support film presented in particular in "R" coil strip.
• Figure 5A is illustrated a second embodiment of the invention. It differs mainly from that of FIG. 4A in that the antenna 2 is disposed on the same side 13 of the substrate as that carrying the components 4, 14. Thus, the connection wells 17 are avoided and the antenna of the antenna is protected. outside the module since it is found in the cavity C2.
• Figure 5B illustrates an enlargement of a portion of Figure 5A centered around the components and their connections.
• the chip 4 is connected to an antenna terminal 9 and a redirection terminal 21.
• the terminal 21 is connected to the antenna terminal 9 via an electrical connection 26a or printed on an insulating bridge 27 itself printed on turns 25 of the antenna deflection "D".
• the insulating bridge is not essential, the connection being made by welding wire and flying over the turns of the antenna especially at the deflection (if present).
• the capacitor 14 is connected to its terminals or pads 11, 12 respectively connected to terminals 8 and 21 as in FIG. 4A with conductive glue 28.
• the capacitor 14 may be connected by soldered wire 5 to these terminals 11, 12. This mode is advantageous in that it does not require any perforation with the exception of the uncoupling 18.
• FIG. 5C are illustrated an arrangement and an electrical connection of the capacitor 14 may be suitable for one of the modes described above.
• the antenna 2 and the components 4, 14 are on the same side of the substrate.
• the capacitor 14 is fixed astride the turns 25 of the antenna 2 with insulating adhesive 29.
• the capacitor is connected to the antenna terminals 8 and 9 by soldered wires spanning the turns 25.
• FIG 7 there is illustrated a main body device 30 comprising the module 1A, 1B.
• the device 30 is a radio frequency transponder in the form of a smart card.
• the module 1A, 1B can be inserted in various supports or bodies of any product such as clothing, bracelet, watch, belt ...
• the device 30 comprises a mini body 23 with a two-stage cavity C1, C2, opening on the surface and the module 1A is fixed and fixed in the cavity.
• the module 1A is in fact embedded in a mini-card body 23 mini SIM (2FF: 25 x 15 mm).
• This mini-body 22 is itself detachable in known manner by the breakable straps 31 to a main body 30 of the smart card 30.
• the other formats 3FF and 4FF smaller are covered by the invention.
• the invention makes it possible to use the mini-SIM smart card technology to economically manufacture, with good range, a radio frequency transponder equipped with an economical single-sided type film.
• the device or module can be in different formats including 4FF format of smart cards.
• the capacity of the radio frequency transponder may have a value greater than or equal to about 25 pF or 35 pF especially for a tuning frequency of 13.56 MHz.
• the capacity may alternatively be greater than 50 or 70 pico (p) farad in possible applications that may concern the invention.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Credit Cards Or The Like (AREA)
• Details Of Aerials (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=55024967

Family Applications (2)

Family Applications Before (1)

Country Status (5)

Families Citing this family (2)

Family Cites Families (22)

• 2015
  • 2015-12-15 EP EP15307015.6A patent/EP3182507A1/de not_active Withdrawn
• 2016
  • 2016-12-13 EP EP16819307.6A patent/EP3391460A1/de active Pending
  • 2016-12-13 US US15/780,465 patent/US10804594B2/en active Active
  • 2016-12-13 WO PCT/EP2016/080830 patent/WO2017102749A1/fr active Application Filing
  • 2016-12-13 CN CN201680073410.6A patent/CN108370087B/zh active Active
  • 2016-12-13 SG SG11201804394RA patent/SG11201804394RA/en unknown

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