EP3373719A4 - Mounting device - Google Patents

Mounting device Download PDF

Info

Publication number
EP3373719A4
EP3373719A4 EP15907831.0A EP15907831A EP3373719A4 EP 3373719 A4 EP3373719 A4 EP 3373719A4 EP 15907831 A EP15907831 A EP 15907831A EP 3373719 A4 EP3373719 A4 EP 3373719A4
Authority
EP
European Patent Office
Prior art keywords
mounting device
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15907831.0A
Other languages
German (de)
French (fr)
Other versions
EP3373719A1 (en
EP3373719B1 (en
Inventor
Koji Kawaguchi
Kohei Sugihara
Yoji Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of EP3373719A1 publication Critical patent/EP3373719A1/en
Publication of EP3373719A4 publication Critical patent/EP3373719A4/en
Application granted granted Critical
Publication of EP3373719B1 publication Critical patent/EP3373719B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/087—Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
EP15907831.0A 2015-11-06 2015-11-06 Mounting device Active EP3373719B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/081344 WO2017077645A1 (en) 2015-11-06 2015-11-06 Mounting device

Publications (3)

Publication Number Publication Date
EP3373719A1 EP3373719A1 (en) 2018-09-12
EP3373719A4 true EP3373719A4 (en) 2018-11-14
EP3373719B1 EP3373719B1 (en) 2021-05-05

Family

ID=58663010

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15907831.0A Active EP3373719B1 (en) 2015-11-06 2015-11-06 Mounting device

Country Status (5)

Country Link
US (1) US10798861B2 (en)
EP (1) EP3373719B1 (en)
JP (1) JP6735768B2 (en)
CN (1) CN108353532B (en)
WO (1) WO2017077645A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6915067B2 (en) * 2017-09-07 2021-08-04 株式会社Ｆｕｊｉ Parts mounting machine
JP7262300B2 (en) * 2019-05-17 2023-04-21 Juki株式会社 Electronic component mounting apparatus and electronic component mounting method
CN113892309B (en) * 2019-05-31 2023-09-19 株式会社富士 Suction nozzle replacing table unit
WO2021009846A1 (en) * 2019-07-16 2021-01-21 株式会社Ｆｕｊｉ Work machine
US11924977B2 (en) 2019-07-25 2024-03-05 Fuji Corporation Device and method for inspecting adsorption nozzle
JP7295966B2 (en) * 2019-09-24 2023-06-21 株式会社Fuji Holder management device and display method
CN112118724B (en) * 2020-09-17 2021-07-06 大唐长春热力有限责任公司 Press mounting equipment for power semiconductor production and use method thereof
CN113784538B (en) * 2021-02-26 2023-12-05 北京京东乾石科技有限公司 Chip mounter, tray replacing device and tray replacing method thereof
CN114161108B (en) * 2021-12-03 2023-04-25 深圳国人科技股份有限公司 Automatic array loading device and method
CN116981244B (en) * 2023-09-22 2023-12-15 苏州猎奇智能设备有限公司 Double-pressure-control mounting head

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311599A (en) * 2003-04-03 2004-11-04 Fuji Mach Mfg Co Ltd Nozzle stocker and electronic circuit component mounting machine
US20060085973A1 (en) * 2002-11-21 2006-04-27 Fuji Machine Mfg. Co., Ltd. Substrate-related-operation performing apparatus, operation performing head for substrate-related-operation performing apparatus, substrate-related-operation performing system, and operation-performing-head-use preparing program
JP2009272651A (en) * 2009-08-18 2009-11-19 Panasonic Corp Rotary type component mounting apparatus
JP2009283952A (en) * 2009-07-06 2009-12-03 Fuji Mach Mfg Co Ltd Electronic circuit component mounting machine

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3374838B2 (en) * 1996-02-15 2003-02-10 松下電器産業株式会社 Electronic component mounting method
JP3371776B2 (en) * 1997-11-06 2003-01-27 松下電器産業株式会社 Nozzle stocker position and height teaching method in electronic component mounting apparatus
JP4421795B2 (en) 2001-08-24 2010-02-24 パナソニック株式会社 Component mounting apparatus and method
JP2004172500A (en) * 2002-11-21 2004-06-17 Fuji Mach Mfg Co Ltd Mounting system for electronic circuit component
JP4564235B2 (en) * 2003-02-24 2010-10-20 パナソニック株式会社 Component mounting apparatus and component mounting method
JP4604127B2 (en) * 2009-09-30 2010-12-22 富士機械製造株式会社 Electronic circuit component mounting machine and electronic circuit assembly method
JP5675013B2 (en) * 2010-06-10 2015-02-25 富士機械製造株式会社 Electronic circuit assembly method and electronic circuit assembly system
JP2012044018A (en) * 2010-08-20 2012-03-01 Fuji Mach Mfg Co Ltd Component mounting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060085973A1 (en) * 2002-11-21 2006-04-27 Fuji Machine Mfg. Co., Ltd. Substrate-related-operation performing apparatus, operation performing head for substrate-related-operation performing apparatus, substrate-related-operation performing system, and operation-performing-head-use preparing program
JP2004311599A (en) * 2003-04-03 2004-11-04 Fuji Mach Mfg Co Ltd Nozzle stocker and electronic circuit component mounting machine
JP2009283952A (en) * 2009-07-06 2009-12-03 Fuji Mach Mfg Co Ltd Electronic circuit component mounting machine
JP2009272651A (en) * 2009-08-18 2009-11-19 Panasonic Corp Rotary type component mounting apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017077645A1 *

Also Published As

Publication number Publication date
JP6735768B2 (en) 2020-08-05
EP3373719A1 (en) 2018-09-12
JPWO2017077645A1 (en) 2018-08-23
EP3373719B1 (en) 2021-05-05
US10798861B2 (en) 2020-10-06
US20190159373A1 (en) 2019-05-23
WO2017077645A1 (en) 2017-05-11
CN108353532A (en) 2018-07-31
CN108353532B (en) 2020-06-16

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